CN113046004A - Anisotropic conductive adhesive and bonding method - Google Patents
Anisotropic conductive adhesive and bonding method Download PDFInfo
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- CN113046004A CN113046004A CN202110308593.8A CN202110308593A CN113046004A CN 113046004 A CN113046004 A CN 113046004A CN 202110308593 A CN202110308593 A CN 202110308593A CN 113046004 A CN113046004 A CN 113046004A
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- adhesive
- anisotropic conductive
- circuit board
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
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- Combinations Of Printed Boards (AREA)
Abstract
The embodiment of the invention provides anisotropic conductive adhesive and a bonding method. The anisotropic conductive adhesive comprises liquid optical transparent adhesive and a plurality of conductive particles mixed in the liquid optical transparent adhesive, and each conductive particle comprises a conductive ball and an insulating layer wrapping the conductive ball.
Description
Technical Field
The invention relates to the technical field of laminating, in particular to anisotropic conductive adhesive and a laminating method.
Background
Anisotropic conductive adhesive is commonly used in a hot-press bonding process of a touch panel, and is used for bonding a to-be-bonded object (such as a touch panel) to a flexible printed circuit board and realizing the electrical connection between the to-be-bonded object and the flexible printed circuit board by utilizing the anisotropic conductive property of the to-be-bonded object.
However, the anisotropic conductive adhesive is a tape with uniform thickness, and when the anisotropic conductive adhesive is disposed on the flexible circuit board, since the gold finger on the flexible circuit board has a certain height difference with the surface of the substrate of the flexible circuit board, the surface of the anisotropic conductive adhesive covering the gold finger protrudes compared to the surface of the anisotropic conductive adhesive directly covering the substrate, so that the surface of the anisotropic conductive adhesive away from the substrate is uneven. In the hot pressing process, the substrate of the flexible circuit board is recessed towards the direction of the object to be attached relative to the region provided with the gold fingers in the region not provided with the gold fingers under the action of high pressure, so that the whole substrate is in a water wave shape, and the yield of the product in the later-stage process is influenced. In addition, if the attaching area of the object to be attached has an irregular edge (i.e., the attaching area has an edge distributed in a non-linear manner), the conventional anisotropic conductive adhesive is difficult to implement irregular attachment, or additional boundary cutting is required after attachment, which wastes cost.
Disclosure of Invention
The present invention provides in a first aspect an anisotropic conductive adhesive comprising:
the liquid optical transparent adhesive comprises a liquid optical transparent adhesive and a plurality of conductive particles mixed in the liquid optical transparent adhesive, wherein each conductive particle comprises a conductive ball and an insulating layer wrapping the conductive ball, the diameter of each conductive particle is less than 10 mu m, and the density of each conductive particle is 2 multiplied by 106～3×106one/mL.
The anisotropic conductive adhesive adopts the liquid optical transparent adhesive as the adhesive, so that the appearance of the anisotropic conductive adhesive is controllable, when the anisotropic conductive adhesive is applied to a panel hot-pressing laminating process, different glue dispensing amounts are set for an area of a golden finger of a flexible circuit board and an area of a gap between the golden fingers, so that the area with the golden finger has a smaller glue dispensing amount, the area of the gap between the golden fingers has a larger glue dispensing amount, the thickness of the colloid of the laminating area is effectively improved, and the risk of deformation of the flexible circuit board in the hot-pressing process is reduced. Moreover, if the attaching area of the object to be attached (such as a touch panel) has an edge with a special shape (that is, the attaching area has an edge distributed in a non-linear shape), the adhesive can be dispensed in any shape by controlling the adhesive dispensing shape and the adhesive dispensing amount of the anisotropic conductive adhesive, so that the special-shaped attachment of the object to be attached and the flexible circuit board can be realized, and meanwhile, the extra boundary cutting is not needed, and the cost is saved.
The second aspect of the present invention also provides a laminating method, including:
coating the anisotropic conductive adhesive on a flexible circuit board, wherein the flexible circuit board comprises a flexible substrate and a plurality of golden fingers arranged on the substrate at intervals, and the anisotropic conductive adhesive is coated on the surfaces of the golden fingers far away from the substrate and in gaps between two adjacent golden fingers;
pre-curing the anisotropic conductive adhesive;
and carrying out hot-pressing lamination on a to-be-laminated object and the flexible circuit board through the anisotropic conductive adhesive, wherein the to-be-laminated object is provided with connecting pads in one-to-one correspondence with the golden fingers on the flexible circuit board, the connecting pads are electrically connected with the golden fingers through the anisotropic conductive adhesive after hot-pressing lamination, and the surface of the substrate, which is far away from the golden fingers, is smooth.
According to the bonding method, the anisotropic conductive adhesive is adopted to carry out hot-pressing bonding on a to-be-bonded object and the flexible circuit board, the anisotropic conductive adhesive adopts the liquid optical transparent adhesive as the adhesive, so that the appearance of the anisotropic conductive adhesive is controllable, when the anisotropic conductive adhesive is applied to a panel bonding process, different glue dispensing amounts are set for a region of a golden finger of the flexible circuit board and a region of a gap between the golden fingers, the region with the golden finger has a smaller glue dispensing amount, and the region of the gap between the golden fingers has a larger glue dispensing amount, so that the glue thickness of the bonding region is effectively improved, and the risk of deformation of the flexible circuit board in the hot-pressing process is reduced. Moreover, if the attaching area of the object to be attached (such as a touch panel) is irregular (that is, the attaching area has the edge distributed in a non-linear manner), the adhesive can be dispensed in any shape by controlling the adhesive dispensing shape and the adhesive dispensing amount of the anisotropic conductive adhesive, so that the irregular attachment of the object to be attached and the flexible circuit board can be realized without additional boundary cutting, and the cost is saved.
Drawings
Fig. 1 is a schematic plan view of an anisotropic conductive film according to an embodiment of the invention.
Fig. 2 is a schematic flow chart illustrating a bonding method according to an embodiment of the invention.
Fig. 3 is a schematic structural diagram of the anisotropic conductive film coated in step S1 of fig. 2.
Fig. 4 is a schematic plan view illustrating a step of performing thermal pressing and bonding on a to-be-bonded object and the flexible circuit board in step S3 of fig. 2.
FIG. 5 is a schematic cross-sectional view taken along section line V-V in FIG. 4.
Description of the main elements
Anisotropic conductive adhesive 10
Liquid optical clear adhesive 12
Object to be bonded 30
Touch area 301
Non-touch area 302
Connecting pad 34
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
To further explain the technical means and effects of the present invention adopted to achieve the intended purpose, the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.
The embodiment of the invention provides an anisotropic conductive adhesive. FIG. 1 is a schematic view of an anisotropic conductive adhesive observed under a 50-fold microscope. As shown in fig. 1, the anisotropic conductive Adhesive 10 includes a Liquid Optical Clear Adhesive (LOCA) 12 and a plurality of conductive particles 14 mixed in the Liquid Optical Clear Adhesive 12. Each of the conductive particles 14 includes a conductive ball (not shown) and an insulating layer (not shown) covering the conductive ball. The conductive balls are made of copper, gold, silver and other metals. The material of the conductive ball can also be metal alloy or other conductive materials. The insulating layer may be made of insulating resin.
The anisotropic conductive adhesive 10 adopts the liquid optical transparent adhesive 12 as the adhesive, so that the shape of the anisotropic conductive adhesive 10 is controllable, when the anisotropic conductive adhesive is applied to a bonding process of a to-be-bonded object (such as a touch panel) and a flexible printed circuit board, different glue dispensing amounts can be set for an area of a golden finger of the flexible printed circuit board and an area of a gap between the golden fingers, so that the area with the golden finger has a smaller glue dispensing amount, and the area of the gap between the golden fingers has a larger glue dispensing amount, so that the thickness of glue in the bonding area is effectively improved, and the risk of deformation of the flexible printed circuit board in a hot pressing process is reduced. Moreover, if the attaching area of the object to be attached (such as a touch panel) is irregular (that is, the attaching area has the non-linear distributed edge), the adhesive can be dispensed in any shape by controlling the adhesive dispensing shape and the adhesive dispensing amount of the anisotropic conductive adhesive, so that the irregular attachment of the object to be attached (such as a touch panel) and the flexible circuit board can be realized without additional boundary cutting (Die-cut), the manufacturing process is simplified, and the cost is saved.
In one embodiment, the viscosity of the liquid optical transparent adhesive 12 is less than 50cps, and the liquid optical transparent adhesive 12 is an ultraviolet-thermal (UV/Heat) dual curing type adhesive. The liquid optical transparent adhesive 12 with lower viscosity (less than 50cps) is selected to facilitate the uniform dispersion of the conductive particles 14 in the adhesive, and is suitable for the water gel spraying process. In addition, the liquid optical transparent adhesive 12 is selected as an ultraviolet-thermal dual-curing adhesive, so that in the Bonding process, the anisotropic conductive adhesive 10 can be coated first, ultraviolet pre-curing is performed, and then the anisotropic conductive adhesive 10 is further cured by heating in a hot pressing process.
In one embodiment, the diameter of the conductive particles 14 is less than 10 μm, and the density of the conductive particles 14 is 2 × 106～3×106one/mL. The conductive particles 14 are uniformly dispersed in the liquid optically transparent adhesive 12 by mixing the conductive particles 14 with the liquid optically transparent adhesive 12 in a ratio adjusted by mass or volume ratio and sufficiently stirring. After the conductive particles 14 are mixed with the liquid optically clear adhesive 12, ultrasonic vibration can be used to uniformly disperse the conductive particles 14 inside the liquid optically clear adhesive 12. In FIG. 1, the diameter of the conductive particles 14 is 5 μm to 10 μm, and the viscosity of the liquid optically transparent adhesive 12 is about 30 cps. In other embodiments, the diameter and density of the conductive particles 14 are not limited thereto. For example, the diameter of the conductive particles 14 is less than 5 μm.
The embodiment of the invention also provides a fitting method. As shown in fig. 2, the attaching method includes:
step S1: and coating the anisotropic conductive adhesive on a flexible circuit board.
Step S2: and pre-curing the anisotropic conductive adhesive.
Step S3: and carrying out hot-pressing lamination on an object to be laminated and the flexible circuit board through the anisotropic conductive adhesive.
According to the bonding method, the anisotropic conductive adhesive is adopted to carry out hot-pressing bonding on a to-be-bonded object and the flexible circuit board, the anisotropic conductive adhesive adopts the liquid optical transparent adhesive as the adhesive, so that the appearance of the anisotropic conductive adhesive is controllable, when the anisotropic conductive adhesive is applied to a panel hot-pressing bonding process, different glue dispensing amounts are set aiming at the area of the golden fingers of the flexible circuit board and the area of the gaps between the golden fingers, the area with the golden fingers has a smaller glue dispensing amount, and the area of the gaps between the golden fingers has a larger glue dispensing amount, so that the thickness of glue in the bonding area is effectively improved, and the risk of deformation of the flexible circuit board in the hot-pressing process is reduced. Moreover, if the attaching area of the object to be attached (such as a touch panel) is irregular (that is, the attaching area has the edge distributed in a non-linear manner), the adhesive can be dispensed in any shape by controlling the dispensing shape and the dispensing amount of the anisotropic conductive adhesive, so that the irregular attachment of the object to be attached (such as a touch panel) and the flexible circuit board can be realized without additional boundary cutting, the manufacturing process is simplified, and the cost is saved.
The bonding method described above will be described with reference to fig. 3 to 5.
Step S1: and coating the anisotropic conductive adhesive on a flexible circuit board.
In step S1, the anisotropic conductive adhesive 10 is coated by a dispenser, and the dispensing shape and dispensing amount in a local area can be adjusted by controlling a nozzle of the dispenser through a program.
As shown in fig. 3, the flexible printed circuit 20 includes a flexible substrate 22 and a plurality of gold fingers 24 disposed on the substrate 22 at intervals. The anisotropic conductive paste 10 is coated on the surface of the gold finger 24 away from the substrate 22 and in the gap between two adjacent gold fingers 24. The area of the flexible printed circuit board 20 that needs to be coated with glue is divided into three areas according to the distribution of the gold fingers 24 on the flexible printed circuit board 20. The dispensing amount in the gap (the area marked as B in fig. 3) between two adjacent gold fingers 24 is greater than the dispensing amount on the surface (the area marked as a in fig. 3) of the gold finger 24 away from the base material 22. The dispensing amount at the position of the substrate 22 near the edge (the region marked as C in fig. 3) is smaller than that in the gap between two adjacent gold fingers 24 (the region marked as B in fig. 3).
In fig. 3, the anisotropic conductive paste 10 may be applied in different areas by different dispensing amounts, so that the dispensing amount of the area a having the gold fingers 24 is smaller than the dispensing amount of the area B, which is a gap between the gold fingers 24. For example, the dispensing amount corresponding to the area a is 70%, and the dispensing amount corresponding to the area B is 100%. Thus, the anisotropic conductive film 10 adopts the liquid optical transparent adhesive 12 as the adhesive, so that the anisotropic conductive film 10 is in a liquid state, and can be dispensed in different areas of the flexible printed circuit 20, and the different areas of the flexible printed circuit 20 have different dispensing amounts.
In one embodiment, the diameter of the conductive particles 14 is 5 μm to 10 μm, the aperture of the nozzle of the dispenser is 50 μm to 80 μm, and the anisotropic conductive adhesive 10 is fully stirred before entering the dispenser to ensure that the conductive particles 14 are uniformly dispersed in the liquid optically transparent adhesive 12.
In one embodiment, the substrate 22 is made of an organic material, such as Polyimide (PI) or Polyethylene terephthalate (PET). The material of the gold finger 24 is, for example, copper or copper alloy. The gold finger 24 has a height of approximately 10 to 20 μm in the thickness direction of the base material 22. The flexible circuit board 20 may further include traces and the like on the surface of the substrate 22 for connecting the gold fingers 24, and the thickness of the gold fingers 24 is not limited thereto.
Step S2: and pre-curing the anisotropic conductive adhesive.
In one embodiment, the liquid optically transparent adhesive 12 of the anisotropic conductive adhesive 10 is an ultraviolet-thermal (UV/Heat) dual curing adhesive. In step S2, the step of pre-curing is ultraviolet curing.
As shown in fig. 3, in step S1, the surface of the anisotropic conductive film 10 away from the substrate 22 after pre-curing is made flat by controlling the dispensing amount of different areas.
Step S3: and carrying out hot-pressing lamination on an object to be laminated and the flexible circuit board through the anisotropic conductive adhesive.
As shown in fig. 4, the object to be attached 30 is a touch panel. The touch panel has a touch area 301 and a non-touch area 302 surrounding the touch area 301. The touch area 301 is substantially rectangular. The flexible circuit board 20 and the touch panel are bonded in the non-touch area 302. In other embodiments, the object to be attached 30 is not limited to a touch panel, but may be another flexible circuit board, a rigid circuit board, a display panel, or the like.
The touch panel includes a plurality of touch electrodes (not shown) located in the touch area 301. The plurality of touch electrodes are, for example, single-layer self-capacitance touch electrodes. When touch occurs, capacitance sensing signals corresponding to the vicinity of the touch point are different, the capacitance sensing signals are received and processed, and then the relative position of the touch point can be obtained through conversion. When touch occurs, capacitive coupling between the driving electrodes and the sensing electrodes corresponding to the vicinity of the touch point is affected, so that a sensing signal (e.g., a voltage value) related to mutual capacitance changes, and thus, coordinates of each touch point can be calculated.
As shown in fig. 5, the touch panel further includes a substrate 32 and a plurality of connection pads 34 disposed on a surface of the substrate 32 at intervals. The connecting pad 34 is located in the non-touch area 302 and electrically connected to the touch electrode. The connecting pads 34 correspond to the gold fingers 24 on the flexible printed circuit board 20 one by one.
In step S3, after the hot press bonding, the anisotropic conductive adhesive 10 is further cured, and the connection pad 34 and the gold finger 24 are electrically connected through the anisotropic conductive adhesive 10. Specifically, the conductive particles 14 between the gold finger 24 and the connection pad 34 are pressed and deformed in a direction perpendicular to the substrate 22, so that the insulating layer in the conductive particles 14 is broken to expose the conductive ball therein, and the connection pad 34 and the gold finger 24 are electrically connected through the conductive ball in the direction perpendicular to the substrate 22, while the conductive particles 14 are not broken at other positions and are electrically insulated in a transverse direction.
In addition, since different dispensing amounts are provided for different regions in step S1, the region with the gold finger 24 has a smaller dispensing amount, and after pre-curing (ultraviolet curing), the surface of the obtained colloid far from the substrate 22 has better flatness; after the hot pressing process, the anisotropic conductive adhesive 10 is further cured (thermoset), which can effectively improve the thickness of the adhesive in the bonding region, thereby reducing the risk of deformation of the flexible circuit board during the hot pressing process.
In some embodiments, in the step of coating the anisotropic conductive film 10, the dispenser dispenses the conductive paste along a straight line. In the hot-press bonding step, the object 30 to be bonded and the flexible printed circuit 20 are bonded in a linear manner. As shown in fig. 4, the bonding area between the touch panel and the flexible printed circuit 20 is substantially rectangular, which is not irregular. In the dispensing step, the dispenser dispenses along the direction parallel to the long side of the rectangle. In the hot pressing step, the touch panel and the flexible circuit board 20 are bonded in a rectangular area.
In some embodiments, in the step of coating the anisotropic conductive film 10, the dispenser dispenses the conductive paste along a curve; in the hot-press bonding step, the object 30 to be bonded and the flexible printed circuit 20 are bonded in a curved manner. The curve is for example an arc or a broken line. For example, the object 30 to be attached is a touch panel having a shaped attachment area (i.e., an attachment area having edges that are not along a single straight line). Because the anisotropic conductive adhesive 10 uses the liquid optical transparent adhesive 12 as the adhesive, in the dispensing step, any shape of dispensing (such as straight line and curve) can be performed by controlling the dispensing machine through a program, and further in the hot-pressing attaching step, the special-shaped attaching of the touch panel and the flexible circuit board 20 is realized, and meanwhile, no extra boundary cutting is needed, the manufacturing process is simplified, the cost is saved, and the production efficiency is improved.
Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present invention.
Claims (10)
1. An anisotropic conductive adhesive, comprising:
liquid optical transparent adhesive and a plurality of conductive particles mixed in the liquid optical transparent adhesive, wherein each conductive particle comprises a conductive ball andan insulating layer wrapping the conductive balls, the diameter of the conductive particles is less than 10 μm, and the density of the conductive particles is 2 × 106～3×106one/mL.
2. The anisotropic conductive adhesive of claim 1, wherein the viscosity of the liquid optically clear adhesive is less than 50cps, and the liquid optically clear adhesive is an ultraviolet-thermal dual curing type adhesive.
3. A bonding method is characterized by comprising:
the anisotropic conductive film according to claim 1 or 2 is coated on a flexible circuit board, wherein the flexible circuit board comprises a flexible substrate and a plurality of gold fingers arranged on the substrate at intervals, and the anisotropic conductive film is coated on the surface of the gold finger away from the substrate and in the gap between two adjacent gold fingers;
pre-curing the anisotropic conductive adhesive;
and carrying out hot-pressing lamination on a to-be-laminated object and the flexible circuit board through the anisotropic conductive adhesive, wherein the to-be-laminated object is provided with connecting pads in one-to-one correspondence with the golden fingers on the flexible circuit board, the connecting pads are electrically connected with the golden fingers through the anisotropic conductive adhesive after hot-pressing lamination, and the surface of the substrate, which is far away from the golden fingers, is smooth.
4. The method of conforming according to claim 3 wherein the step of precuring is ultraviolet light curing.
5. The attaching method according to claim 3, wherein the object to be attached is a touch panel, and the touch panel includes touch electrodes and the connecting pads electrically connected to the touch electrodes.
6. The attaching method according to claim 3, wherein the anisotropic conductive adhesive is applied by a dispenser, and a nozzle of the dispenser is controlled by a program to adjust a dispensing shape and a dispensing amount in a local area.
7. The attaching method according to claim 6, wherein in the step of coating the anisotropic conductive adhesive, the dispenser dispenses the adhesive along a straight line;
in the hot-pressing and attaching step, the object to be attached and the flexible circuit board are attached in a linear type.
8. The attaching method according to claim 6, wherein in the step of coating the anisotropic conductive adhesive, the dispenser dispenses the adhesive along a curve;
in the hot-pressing and attaching step, the object to be attached and the flexible circuit board are attached in a curve shape.
9. The attaching method according to claim 6, wherein a dispensing amount in a gap between two adjacent gold fingers is greater than a dispensing amount on a surface of the gold finger away from the substrate.
10. The bonding method according to claim 3, wherein after the thermal pressing, the insulating layer of the conductive particles between the bonding pad and the gold finger is broken to expose the conductive ball therein, and the bonding pad and the gold finger are electrically connected by the conductive ball in a direction perpendicular to the substrate.
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| CN202110308593.8A CN113046004A (en) | 2021-03-23 | 2021-03-23 | Anisotropic conductive adhesive and bonding method |
| TW110111689A TWI799827B (en) | 2021-03-23 | 2021-03-30 | Anisotropic conductive adhesive and bonding method |
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| CN202110308593.8A CN113046004A (en) | 2021-03-23 | 2021-03-23 | Anisotropic conductive adhesive and bonding method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114635219A (en) * | 2022-03-31 | 2022-06-17 | 业成科技（成都）有限公司 | Buffer material layer, die pressing jig and pressing process method |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI799827B (en) | 2023-04-21 |
| TW202237781A (en) | 2022-10-01 |
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