CN114635219A - Buffer material layer, die pressing jig and pressing process method - Google Patents
Buffer material layer, die pressing jig and pressing process method Download PDFInfo
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- CN114635219A CN114635219A CN202210332631.8A CN202210332631A CN114635219A CN 114635219 A CN114635219 A CN 114635219A CN 202210332631 A CN202210332631 A CN 202210332631A CN 114635219 A CN114635219 A CN 114635219A
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
- D03D15/20—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
- D03D15/283—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads synthetic polymer-based, e.g. polyamide or polyester fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
- B29C65/64—Joining a non-plastics element to a plastics element, e.g. by force
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
- D03D15/20—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
- D03D15/242—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads inorganic, e.g. basalt
- D03D15/25—Metal
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
- D03D15/40—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the structure of the yarns or threads
- D03D15/47—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the structure of the yarns or threads multicomponent, e.g. blended yarns or threads
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
- D03D15/50—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the properties of the yarns or threads
- D03D15/533—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the properties of the yarns or threads antistatic; electrically conductive
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The application relates to a buffer material layer, a die pressing jig and a pressing process method. A buffer material layer for use in a lamination process, the buffer material layer comprising: the first fiber strips are arranged at intervals along a first direction; the plurality of second fiber strips are arranged at intervals along the second direction; the first fiber strips and the second fiber strips are woven in a staggered mode along the thickness direction of the buffer material layer to form a net-shaped structure; the first fiber strip comprises 70-100 parts of terylene, 0-30 parts of chinlon and 0-20 parts of metal wire fiber, and the second fiber strip comprises 70-100 parts of terylene and 0-30 parts of chinlon; the first direction and the second direction intersect each other. The gaps of the net-shaped structure of the buffer material layer can be utilized to compensate the height drop generated by the upper die and the lower die, so that the pressure applied to the binding surface of the first base material and the second base material can be distributed more uniformly, and the yield of products can be improved.
Description
Technical Field
The present disclosure relates to the field of lamination processes, and more particularly, to a buffer material layer, a mold pressing fixture and a press-fitting method.
Background
In the conventional bonding process, the first substrate and the second substrate are usually pressed together by the upper die and the lower die, however, the conventional bonding process has the problem of non-uniform bonding, which affects the yield of the product.
Disclosure of Invention
Therefore, it is necessary to provide a buffer material layer, a mold pressing jig and a pressing process method for solving the problem that the conventional bonding process has uneven bonding and affects the yield of products.
According to an aspect of the present application, there is provided a buffer material layer for a bonding process, the buffer material layer including:
the first fiber strips are arranged at intervals along a first direction;
the plurality of second fiber strips are arranged at intervals along the second direction;
the first fiber strips and the second fiber strips are woven in a staggered mode along the thickness direction of the buffer material layer to form a net-shaped structure;
the first fiber strips comprise 70-100 parts of terylene, 0-30 parts of chinlon and 0-20 parts of metal wire fiber, and the second fiber strips comprise 70-100 parts of terylene and 0-30 parts of chinlon;
the first direction and the second direction intersect each other.
In one embodiment, the distance between two adjacent first fiber strips is 50-500 μm.
In one embodiment, the distance between two adjacent second fiber strips is 50-500 μm.
In one embodiment, the thickness of the buffer material layer is 0.3-1 mm.
In one embodiment, the first direction and the second direction are perpendicular to each other.
According to another aspect of the application, a mold pressing jig is provided, which is used for pressing a first base material and a second base material, and comprises an upper mold and a lower mold;
at least one molding auxiliary material is arranged between the upper die and the lower die, and the molding auxiliary material comprises at least one layer of the buffer material layer.
In one embodiment, the first base material and the second base material are stacked on the lower mold;
the lower die and the second base material and one side of the first base material, which is deviated from the second base material, are provided with the die pressing auxiliary material.
In one embodiment, the molding jig further comprises a resistance tester, and the two molding auxiliary materials are respectively and electrically connected to the resistance tester; or
The mould pressing jig further comprises a capacitance tester, and the two mould pressing auxiliary materials are respectively and electrically connected to the capacitance tester.
In one embodiment, the two molding auxiliary materials are respectively provided with a connecting layer at one side which is far away from each other, the connecting layer comprises an insulating layer and a plurality of electric conduction terminals which are arranged on the insulating layer, and the electric conduction terminals are electrically connected with the resistance tester or the capacitance tester;
the plurality of electrically conductive terminals are located between the corresponding insulating layer and the adjacent molding auxiliary material, and are in contact connection with the plurality of first fiber strips in the adjacent molding auxiliary material in a one-to-one correspondence.
In one embodiment, a center line of the buffer material layer and a center line of the upper mold coincide with each other.
In one embodiment, three layers of the molding auxiliary materials are arranged between the upper die and the lower die.
According to another aspect of the application, a laminating process method is further provided, and the first substrate and the second substrate are laminated by using the mold pressing jig.
The buffer material layer, the die pressing jig and the pressing process method can be used for applying the buffer material layer to the attaching process, for example, the lower die is arranged towards one side of the upper die, so that the height difference generated by the upper die and the lower die can be made up by utilizing the gaps of the net-shaped structure of the buffer material layer, the phenomenon that pressure distribution is uneven or pressure difference is overlarge due to the fact that pressure is too concentrated in the attaching process is avoided, the pressure distribution applied to the attaching surface of the first base material and the second base material can be more uniform, and the improvement of the yield of products is facilitated.
Drawings
FIG. 1 is a top view of a layer of cushioning material in an embodiment of the present application;
FIG. 2 is a side view of a layer of cushioning material in an embodiment of the present application;
FIG. 3 is a schematic structural diagram of a molding jig according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a molding jig according to another embodiment of the present application;
FIG. 5 is a schematic structural diagram of a connecting layer and a molding material in an embodiment of the present application;
fig. 6 shows a pressure-sensitive image map corresponding to the force difference between the molding auxiliary materials having different layers between the upper and lower molds and in the same pressing area;
fig. 7 is a graph showing a comparison of force difference test data of molding aids having different numbers of layers between the upper and lower molds at the same pressing area.
In the figure:
10. a mould pressing jig; 310. A first substrate;
100. a layer of cushioning material; 320. A second substrate;
110. a first ribbon of fibers; 400. A resistance tester;
120. a second fiber strand; 410. A connecting layer;
130. a void; 411. An insulating layer;
210. an upper die; 412. The terminals are electrically conducted.
220. A lower die;
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.
In the conventional bonding process, the first substrate and the second substrate are usually pressed together by the upper die and the lower die, however, the conventional bonding process has the problem of non-uniform bonding, which affects the yield of the product.
The inventor of the present application finds, through research, that the conventional bonding process has a problem of non-uniform bonding: in a conventional bonding process, a height difference may exist on a surface of one side of the upper die facing each other, which causes uneven pressure applied to a bonding surface of the first substrate and the second substrate, and further causes uneven bonding, thereby affecting the yield of the product.
In order to solve the problem that the conventional bonding process has nonuniform bonding and affects the yield of products, the inventor of the application designs a buffer material layer for the bonding process through intensive research, the buffer material layer comprises a plurality of first fiber strips distributed at intervals along a first direction and a plurality of second fiber strips distributed at intervals along a second direction, and each of the first fiber strips and each of the second fiber strips are woven in a staggered manner along the thickness direction of the buffer material layer to form a net-shaped structure.
The buffer material layer, the molding jig and the pressing process method in the present application will be described in detail with specific embodiments.
Fig. 1 shows a schematic structural diagram of a buffer material layer in an embodiment of the present application.
In some embodiments, referring to fig. 1 in combination with fig. 2 and 3, a buffer material layer 100 according to an embodiment of the present disclosure includes a first material layer extending along a first direction F1A plurality of first fiber strips 110 arranged at intervals, and a second direction F2A plurality of second fiber strips 120 arranged at intervals.
Each of the first fiber strips 110 and each of the second fiber strips 120 are interlaced in the thickness direction D of the cushion material layer 100 to form a net structure. The cushioning material layer 100 can be applied to a bonding process, for example, the lower mold 220 is disposed toward one side of the upper mold 210, so that the gap 130 of the mesh structure can compensate for a height difference between the upper mold 210 and the lower mold 220, thereby avoiding uneven pressure distribution or excessive pressure difference caused by too concentrated pressure during the bonding process, making the pressure distribution applied to the bonding surface of the first substrate 310 and the second substrate 320 more uniform, and facilitating to improve the yield of the product.
The first fiber strip 110 comprises 70-100 parts of terylene, 0-30 parts of chinlon and 0-20 parts of metal wire fiber, and the second fiber strip 120 comprises 70-100 parts of terylene and 0-30 parts of chinlon, so that the tensile strength and Young modulus of the first fiber strip 110 can be improved on the premise of ensuring the elongation percentage, so as to improve the flexibility and strength of the buffer material layer 100, and further ensure that the pressure applied to the joint surface of the first base material 310 and the second base material 320 is more uniformly distributed.
First direction F1And a second direction F2Intersect each other such that each of the first fiber strips 110 and each of the second fiber strips 120 are staggered to improve the overall structural strength of the cushion material layer 100.
Optionally, a plurality of first fiber strands 110 are oriented in a first direction F1Arranged at equal intervals, and a plurality of second fiber strips 120 are arranged along a second direction F2The uniform spacing allows the pressure applied to the bonding surfaces of the first substrate 310 and the second substrate 320 to be more uniformly distributed.
In some examples, the tensile strength, young's modulus, and elongation of commercially available fibers were compared to the first fiber strands 110 of one example of the present application, as specified in table 1 below:
table 1 is a table comparing the tensile strength, Young's modulus, elongation and gauge of commercially available fibers with the first batt 110 of one example of the present application
As can be seen from table 1, compared to the commercially available fibers, the first fiber strands 110 can greatly increase the tensile strength and the young's modulus of the first fiber strands 110 without excessively decreasing the elongation rate under the condition of smaller wire diameter, so that the flexibility and the strength of the cushion material layer 100 can be effectively increased, and the pressure applied to the bonding surface of the first base material 310 and the second base material 320 can be more uniformly distributed.
In some embodiments, the spacing between two adjacent first fiber strands 110 is 50-500 μm. Too small a distance between two adjacent first fiber strips 110 may affect the size of the gaps 130 of the formed mesh structure, and thus the application of the cushion material layer 100 in the lamination process. Too large a distance between two adjacent first fiber strips 110 may affect the structural strength of the cushioning material layer 100 and also affect the application of the cushioning material layer 100 in the attaching process. Therefore, the distance between two adjacent first fiber strips 110 is controlled to be 50-500 μm, which not only ensures the structural strength of the buffer material layer 100, but also ensures that the buffer material layer 100 can be well applied to the bonding process, so that the pressure applied to the bonding surface of the first substrate 310 and the second substrate 320 is more uniformly distributed, and the yield of the product can be effectively improved.
In some embodiments, the spacing between two adjacent second fiber strips 120 is 50-500 μm. Too small a distance between two adjacent second fiber strips 120 may affect the size of the gaps 130 of the formed mesh structure, and thus the application of the cushion material layer 100 in the attaching process. The excessive distance between two adjacent second fiber strips 120 may affect the structural strength of the buffer material layer 100 and also affect the application of the buffer material layer 100 in the bonding process. Therefore, the distance between two adjacent second fiber strips 120 is controlled to be 50-500 μm, which not only ensures the structural strength of the buffer material layer 100, but also ensures that the buffer material layer 100 can be well applied to the bonding process, so that the pressure applied to the bonding surface of the first substrate 310 and the second substrate 320 is more uniformly distributed, and the yield of the product can be effectively improved.
In some embodiments, the thickness of the cushioning material layer 100 is 0.3-1 mm. The thickness of the buffer material layer 100 needs to be controlled within a reasonable range to ensure that the buffer material layer 100 is better applied in the bonding process.
In some embodiments, the first direction F1And a second direction F2Perpendicular to each other, such that each of the first fiber strips 110 and each of the second fiber strips 120 are arranged in a criss-cross manner, so as to improve the overall structural strength of the cushion material layer 100.
Fig. 3 shows a schematic structural diagram of a molding jig in an embodiment of the present application.
In some embodiments, referring to fig. 3, a mold pressing fixture 10 provided in an embodiment of the present application includes an upper mold 210 and a lower mold 220. At least one molding auxiliary material is arranged between the upper mold 210 and the lower mold 220, and the molding auxiliary material comprises at least one layer of the buffer material layer 100.
It can be understood that, in the process of pressing the first substrate 310 and the second substrate 320 by using the mold pressing fixture 10, the gap 130 of the mesh structure formed by the buffer material layer 100 can compensate for the height difference generated by the upper mold 210 and the lower mold 220, so as to avoid uneven pressure distribution or excessive pressure difference caused by too concentrated pressure in the bonding process, so that the pressure distribution applied to the bonding surface of the first substrate 310 and the second substrate 320 is more uniform, and the yield of the product is improved.
The material of the first substrate 310 and the second substrate 320 may be soft or hard plastic, or iron, copper, aluminum or alloy thereof, and is not limited herein.
In some embodiments, the first substrate 310 and the second substrate 320 are stacked on the lower mold 220, between the lower mold 220 and the second substrate 320, and a side of the first substrate 310 facing away from the second substrate 320 is provided with a molding auxiliary material.
So, first substrate 310 with second substrate layer 320 one side each other dorsad all is equipped with the mould pressing and assists the material, first substrate 310 with second substrate layer 320 one side each other dorsad homoenergetic utilizes buffer material layer 100's network structure's space 130 to compensate the height drop that goes up mould 210 and lower mould 220 and produce, can make apply in first substrate 310 with the pressure distribution of the laminating face of second substrate layer 320 is more even, more is favorable to improving the yields of product.
In some embodiments, referring to fig. 4, the molding jig 10 further includes a resistance tester 400, and both of the molding aids are electrically connected to the resistance tester 400.
In the embodiment shown in FIG. 4, two molding aids are electrically connected to the resistance tester 400, since the first ribbon 110 comprisesThe metal wire fiber makes the first fiber strip 110 have conductivity, so that the buffer material layers 100 of the two molding auxiliary materials can be electrically connected with the resistance tester 400 by means of the corresponding first fiber strip 110, the resistance value between the buffer material layers 100 of the two molding auxiliary materials can be tested by the resistance tester 400, the resistance value between the buffer material layers 100 of the two molding auxiliary materials can be tested before the laminating process, and R is obtainedFront sideThe resistance value between the buffer material layers 100 of the two molding auxiliary materials can be tested in real time in the laminating process to obtain RInIf R isFront sideAnd RInIf the difference value between the two steps exceeds the preset value, the situation that adverse conditions such as thermal interference, overlarge pressing deformation and the like exist in the attaching process possibly is indicated, the attaching operation needs to be stopped, and the product is controlled and adjusted in time, so that the attaching process is monitored, and the phenomenon that the defective products flow into the next link is avoided.
In other embodiments, the molding tool 10 further includes a capacitance tester, and the two molding auxiliary materials are respectively electrically connected to the capacitance tester. The two molding auxiliary materials are electrically connected to the capacitance tester, so that the capacitance between the buffer material layers 100 of the two molding auxiliary materials can be tested.
In some embodiments, referring to fig. 4 in combination with fig. 5, a connecting layer 410 is respectively disposed on a side of each of the two molding aids, the connecting layer 410 includes an insulating layer 411 and a plurality of electrically conductive terminals 412 disposed on the insulating layer 411, and the plurality of electrically conductive terminals 412 are electrically connected to the resistance tester 400 or the capacitance tester. A plurality of the electrically conductive terminals 412 are located between the corresponding insulating layer 411 and the adjacent molding aid, and are in contact connection with a plurality of the first fiber strands 110 in the adjacent molding aid in a one-to-one correspondence.
In the embodiment shown in fig. 4 and 5, a plurality of the electrically conductive terminals 412 are electrically connected to the resistance tester 400, so that the resistance tester 400 uses the electrically conductive terminals 412 and the buffer material layer 100 in the molding materialThe first fiber strands 110 are electrically connected in a one-to-one correspondence, and the resistance tester 400 can be used to test the gap between the buffer material layers 100 of the two molding aids and corresponding to the buffer material layers 100 along the first direction F1The resistance values at different positions enable the obtained resistance value data to be more comprehensive, and when R corresponds to a certain positionFront sideAnd RInIf the difference value between the two values exceeds a preset value, the conditions of thermal interference, overlarge pressing deformation and the like at the position can be correspondingly known, so that the position can be checked specifically, products can be controlled and adjusted timely according to the checked reasons in a targeted manner, and the function of monitoring the bonding process can be better played.
In some embodiments, a centerline of the cushioning material layer 100 and a centerline of the upper mold 210 coincide with each other.
It can be understood that the upper mold 210 and the lower mold 220 are generally arranged in a centered manner, and the first base 310 and the second base 320 are also arranged in the lower mold 220 in a centered manner, so that the center line of the buffer material layer 100 and the center line of the upper mold 210 coincide with each other, which is equivalent to arranging the buffer material layer 100 and the upper mold 210 in a centered manner, and thus, the distribution of the pressure applied to the joint surface of the first base 310 and the second base 320 can be more uniform, which is more beneficial to improving the yield of the product.
In some embodiments, three layers of the molding aids are disposed between the upper mold 210 and the lower mold 220.
Referring to fig. 6 and 7, fig. 6 shows pressure-sensitive images corresponding to force differences of molding aids with different layers disposed between the upper mold 210 and the lower mold 220 under the same pressing area (the pressing area may be equal to the area of the bonding surface), fig. 6 shows pressure-sensitive images corresponding to the layers of the molding aids of 0, 1, 2 and 3, and fig. 6 shows color chart images of the pressure-sensitive images under different force differences. A comparison graph of force difference test data for molding aids having different numbers of layers disposed between the upper mold 210 and the lower mold 220 at the same pressing area (which may be equal to the area of the faying surface) is shown in fig. 7. As can be seen from fig. 6 and 7, when one cushion material layer 100 is disposed between the upper die 210 and the lower die 220, the force difference is 28N, which is reduced by 71.2% compared to the force difference (97.3N) in the case where the cushion material layer 100 is not disposed (when the number of molding auxiliary materials is 0). When the two layers of the buffer material layer 100 are disposed between the upper mold 210 and the lower mold 220, the stress difference is 25.3N, which is reduced by 74.0% compared to the stress difference (97.3N) in the case where the buffer material layer 100 is not disposed. When three layers of the buffer material layer 100 are disposed between the upper mold 210 and the lower mold 220, the stress difference is 22.4N, and is reduced by 77.0% compared with the stress difference (97.3N) in the case where no buffer material layer 100 is disposed.
Therefore, the buffer material layer 100 can significantly reduce the stress difference, and further significantly improve the uniformity of the pressure distribution applied to the bonding surface of the first base material 310 and the second base material 320, wherein the uniformity of the pressure distribution is improved to more than 71%. And the molding auxiliary material comprises three buffer material layers 100, the stress difference is low, and the uniformity of the pressure distribution applied to the joint surface of the first base material 310 and the second base material 320 is high.
In some embodiments, the pressing process method provided in an embodiment of the present application utilizes the mold pressing fixture 10 to press the first substrate 310 and the second substrate 320.
All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is specific and detailed, but not to be understood as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (12)
1. A buffer material layer for use in a lamination process, the buffer material layer comprising:
the first fiber strips are arranged at intervals along a first direction;
the plurality of second fiber strips are arranged at intervals along the second direction;
the first fiber strips and the second fiber strips are woven in a staggered mode along the thickness direction of the buffer material layer to form a net-shaped structure;
the first fiber strips comprise 70-100 parts of terylene, 0-30 parts of chinlon and 0-20 parts of metal wire fiber, and the second fiber strips comprise 70-100 parts of terylene and 0-30 parts of chinlon;
the first direction and the second direction intersect each other.
2. The layer of cushioning material of claim 1, wherein the spacing between two adjacent first fiber strands is 50-500 μm.
3. A layer of cushioning material according to claim 1 or 2, wherein the spacing between two adjacent second fibre strips is 50-500 μm.
4. The layer of cushioning material of claim 1, wherein the layer of cushioning material has a thickness of 0.3-1 mm.
5. The layer of cushioning material of claim 1, wherein said first direction and said second direction are perpendicular to each other.
6. A mould pressing jig is used for pressing a first base material and a second base material and is characterized by comprising an upper mould and a lower mould;
at least one molding auxiliary material is arranged between the upper mold and the lower mold, and the molding auxiliary material comprises at least one buffer material layer as set forth in any one of claims 1-5.
7. The molding jig according to claim 6, wherein the first base material and the second base material are provided in the lower mold in a stacked manner;
the lower die and the second base material and one side of the first base material, which is deviated from the second base material, are provided with the die pressing auxiliary material.
8. The molding tool of claim 7, wherein the molding tool further comprises a resistance tester, and the two molding aids are electrically connected to the resistance tester respectively; or
The mould pressing jig further comprises a capacitance tester, and the two mould pressing auxiliary materials are respectively and electrically connected to the capacitance tester.
9. The mold pressing jig according to claim 8, wherein a connecting layer is respectively disposed on a side of each of the two mold pressing auxiliary materials, the connecting layer comprises an insulating layer and a plurality of electrically conductive terminals disposed on the insulating layer, and the plurality of electrically conductive terminals are electrically connected to the resistance tester or the capacitance tester;
the plurality of electrically conductive terminals are located between the corresponding insulating layer and the adjacent molding auxiliary material, and are in contact connection with the plurality of first fiber strips in the adjacent molding auxiliary material in a one-to-one correspondence.
10. The molding jig according to claim 6, wherein a center line of the buffer material layer and a center line of the upper mold coincide with each other.
11. The mold pressing jig according to claim 6, wherein three layers of the mold pressing auxiliary materials are arranged between the upper mold and the lower mold.
12. A pressing process method, characterized in that the pressing jig of any one of claims 6-11 is used to press the first substrate and the second substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210332631.8A CN114635219B (en) | 2022-03-31 | 2022-03-31 | Buffer material layer, mould pressing jig and pressing process method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210332631.8A CN114635219B (en) | 2022-03-31 | 2022-03-31 | Buffer material layer, mould pressing jig and pressing process method |
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| CN114635219A true CN114635219A (en) | 2022-06-17 |
| CN114635219B CN114635219B (en) | 2023-09-05 |
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| CN202210332631.8A Active CN114635219B (en) | 2022-03-31 | 2022-03-31 | Buffer material layer, mould pressing jig and pressing process method |
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| CN114635219B (en) | 2023-09-05 |
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