CN114635219B - Buffer material layer, mould pressing jig and pressing process method - Google Patents
Buffer material layer, mould pressing jig and pressing process method Download PDFInfo
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- CN114635219B CN114635219B CN202210332631.8A CN202210332631A CN114635219B CN 114635219 B CN114635219 B CN 114635219B CN 202210332631 A CN202210332631 A CN 202210332631A CN 114635219 B CN114635219 B CN 114635219B
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
- D03D15/20—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
- D03D15/283—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads synthetic polymer-based, e.g. polyamide or polyester fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
- B29C65/64—Joining a non-plastics element to a plastics element, e.g. by force
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
- D03D15/20—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
- D03D15/242—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads inorganic, e.g. basalt
- D03D15/25—Metal
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
- D03D15/40—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the structure of the yarns or threads
- D03D15/47—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the structure of the yarns or threads multicomponent, e.g. blended yarns or threads
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
- D03D15/50—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the properties of the yarns or threads
- D03D15/533—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the properties of the yarns or threads antistatic; electrically conductive
Abstract
The application relates to a buffer material layer, a mould pressing jig and a pressing process method. A buffer material layer for a bonding process, the buffer material layer comprising: a plurality of first fiber strips arranged at intervals along a first direction; a plurality of second fiber strips arranged at intervals along a second direction; wherein, each first fiber strip and each second fiber strip are interwoven along the thickness direction of the buffer material layer to form a net structure; the first fiber strip comprises 70-100 parts of terylene, 0-30 parts of chinlon and 0-20 parts of metal wire fiber, and the second fiber strip comprises 70-100 parts of terylene and 0-30 parts of chinlon; the first direction and the second direction intersect each other. The gap of the reticular structure of the buffer material layer can be utilized to compensate the height drop generated by the upper die and the lower die, so that the pressure distribution applied to the joint surface of the first base material and the second base material is more uniform, and the yield of products is improved.
Description
Technical Field
The application relates to the technical field of bonding processes, in particular to a buffer material layer, a die pressing jig and a pressing process method.
Background
In the conventional bonding process, the first substrate and the second substrate are pressed together through the upper die and the lower die, however, the conventional bonding process has the problem of uneven bonding, and the yield of the product is affected.
Disclosure of Invention
Based on this, it is necessary to provide a buffer material layer, a mold pressing jig and a pressing process method for solving the problem that the conventional lamination process has uneven lamination and affects the yield of the product.
According to one aspect of the present application, there is provided a buffer material layer for a bonding process, the buffer material layer comprising:
a plurality of first fiber strips arranged at intervals along a first direction;
a plurality of second fiber strips arranged at intervals along a second direction;
wherein each first fiber strip and each second fiber strip are interwoven along the thickness direction of the buffer material layer to form a net structure;
the first fiber strip comprises 70-100 parts of terylene, 0-30 parts of chinlon and 0-20 parts of metal wire fiber, and the second fiber strip comprises 70-100 parts of terylene and 0-30 parts of chinlon;
the first direction and the second direction intersect each other.
In one embodiment, the distance between two adjacent first fiber strips is 50-500 μm.
In one embodiment, the distance between two adjacent second fiber strips is 50-500 μm.
In one embodiment, the cushioning material layer has a thickness of 0.3-1mm.
In one embodiment, the first direction and the second direction are perpendicular to each other.
According to another aspect of the present application, there is provided a press jig for press-fitting a first substrate and a second substrate, including an upper die and a lower die;
at least one mould pressing auxiliary material is arranged between the upper mould and the lower mould, and the mould pressing auxiliary material comprises at least one buffer material layer.
In one embodiment, the first substrate and the second substrate are stacked on the lower die;
and the mould pressing auxiliary materials are arranged between the lower mould and the second base material and on one side of the first base material, which is away from the second base material.
In one embodiment, the molding jig further comprises a resistance tester, and the two molding auxiliary materials are respectively and electrically connected to the resistance tester; or (b)
The mould pressing jig further comprises a capacitance tester, and the two mould pressing auxiliary materials are respectively and electrically connected with the capacitance tester.
In one embodiment, two sides of the molding auxiliary materials, which are away from each other, are respectively provided with a connecting layer, wherein the connecting layer comprises an insulating layer and a plurality of electric conduction terminals arranged on the insulating layer, and the electric conduction terminals are electrically connected with the resistance tester or the capacitance tester;
the plurality of electric conduction terminals are positioned between the corresponding insulating layer and the adjacent molding auxiliary materials, and are in contact connection with the plurality of first fiber strips in the adjacent molding auxiliary materials in a one-to-one correspondence manner.
In one embodiment, the center line of the cushioning material layer and the center line of the upper die coincide with each other.
In one embodiment, three layers of the molding auxiliary materials are arranged between the upper die and the lower die.
According to another aspect of the present application, a pressing process is further provided, and the pressing tool is used to press the first substrate and the second substrate.
According to the buffer material layer, the mould pressing jig and the pressing process method, the buffer material layer can be applied to the laminating process, for example, the lower mould is arranged towards one side of the upper mould, so that the height fall generated by the upper mould and the lower mould can be complemented by the gaps of the net-shaped structure of the buffer material layer, uneven pressure distribution or overlarge pressure difference caused by overlarge pressure concentration in the laminating process is avoided, the pressure distribution applied to the laminating surface of the first substrate and the second substrate is more uniform, and the yield of products is improved.
Drawings
FIG. 1 is a top view of a buffer material layer according to an embodiment of the present application;
FIG. 2 is a side view of a cushioning material layer in an embodiment of the present application;
FIG. 3 is a schematic diagram of a mold pressing tool according to an embodiment of the application;
FIG. 4 is a schematic diagram of a molding jig according to another embodiment of the present application;
FIG. 5 is a schematic view of a structure of a connection layer and molding auxiliary material according to an embodiment of the present application;
FIG. 6 shows a pressure-sensitive image corresponding to the difference in the force of molding aids with different layers between the upper and lower molds under the same pressing area;
a comparison of the force differential test data for molding aids with different numbers of layers disposed between the upper and lower molds at the same pressing area is shown in fig. 7.
In the figure:
10. mould pressing jig; 310. A first substrate;
100. a buffer material layer; 320. A second substrate;
110. a first fiber strand; 400. A resistance tester;
120. a second fiber strand; 410. A connection layer;
130. a void; 411. An insulating layer;
210. an upper die; 412. And an electrically conductive terminal.
220. A lower die;
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
In the conventional bonding process, the first substrate and the second substrate are pressed together through the upper die and the lower die, however, the conventional bonding process has the problem of uneven bonding, and the yield of the product is affected.
The inventor of the present application has found through research that the conventional bonding process has the problem of uneven bonding: in the conventional bonding process, there may be a height difference between the surfaces of one side of the upper mold and the lower mold facing each other, which results in uneven pressure applied to the bonding surfaces of the first substrate and the second substrate, and thus, uneven bonding may occur, which affects the yield of the product.
In order to solve the problem that the bonding non-uniformity affects the yield of products in the traditional bonding process, the inventor of the application has conducted intensive research and designed a buffer material layer for the bonding process, wherein the buffer material layer comprises a plurality of first fiber strips distributed at intervals along a first direction and a plurality of second fiber strips distributed at intervals along a second direction, each first fiber strip and each second fiber strip are interwoven along the thickness direction of the buffer material layer to form a reticular structure, so that the height drop generated by an upper die and a lower die can be complemented by utilizing the gaps of the reticular structure, the uneven pressure distribution or the excessive pressure difference caused by the excessive concentration of the pressure in the bonding process can be avoided, the pressure distribution applied to the bonding surface of a first substrate and a second substrate can be more uniform, and the yield of products can be improved.
The buffer material layer, the molding jig and the lamination process method of the present application will be described in detail with specific examples.
Fig. 1 shows a schematic structural diagram of a buffer material layer in an embodiment of the present application.
In some embodiments, referring to fig. 1 in combination with fig. 2 and 3, a buffer material layer 100 according to an embodiment of the present application includes a layer formed along a first direction F 1 A plurality of first fiber strips 110 arranged at intervals and along a second direction F 2 A plurality of second fiber strips 120 arranged at intervals.
Each of the first and second fiber tapes 110 and 120 is interlaced in the thickness direction D of the cushioning material layer 100 to form a mesh structure. The buffer material layer 100 can be applied to a bonding process, for example, the lower mold 220 is disposed towards one side of the upper mold 210, so that the gap 130 with the mesh structure can be utilized to compensate the height difference generated by the upper mold 210 and the lower mold 220, thereby avoiding uneven pressure distribution or overlarge pressure difference caused by too concentrated pressure in the bonding process, ensuring more uniform pressure distribution applied to the bonding surface of the first substrate 310 and the second substrate 320, and being beneficial to improving the yield of products.
The first fiber strip 110 comprises 70-100 parts of terylene, 0-30 parts of chinlon and 0-20 parts of metal wire fiber, and the second fiber strip 120 comprises 70-100 parts of terylene and 0-30 parts of chinlon, so that the first fiber strip 110 comprises 70-100 parts of terylene, 0-30 parts of chinlon and 0-20 parts of metal wire fiber, the tensile strength and Young's modulus of the first fiber strip 110 can be improved on the premise of ensuring the elongation, the flexibility and strength of the buffer material layer 100 are improved, and the pressure distribution applied to the bonding surfaces of the first substrate 310 and the second substrate 320 is more uniform.
First direction F 1 And a second direction F 2 Intersecting each other such that each of the first fiber stripes 110 and each of the second fiber stripes 120 are staggered to enhance the structural strength of the entire cushioning material layer 100.
Optionally, a plurality of first fiber strips 110 are along a first direction F 1 The plurality of second fiber strips 120 are distributed at equal intervals along the second direction F 2 The equally spaced arrangement makes the pressure distribution applied to the bonding surfaces of the first substrate 310 and the second substrate 320 more uniform.
In some embodiments, the tensile strength, young's modulus, and elongation of a commercially available fiber are compared to the first fiber strand 110 of an embodiment of the present application, as shown in Table 1 below:
table 1 is a table comparing tensile strength, young's modulus, elongation and wire diameter of a commercially available fiber and a first fiber strand 110 according to an embodiment of the present application
As can be seen from table 1, the tensile strength and young's modulus of the first fiber strand 110 can be greatly improved while the elongation is excessively reduced under the condition of smaller wire diameter compared with the commercially available fibers, and thus the flexibility and strength of the buffer material layer 100 can be effectively improved, and the pressure distribution applied to the bonding surfaces of the first substrate 310 and the second substrate 320 can be more uniform.
In some embodiments, the spacing between adjacent ones of the first fiber strips 110 is 50-500 μm. Too small a spacing between two adjacent first fiber strips 110 may affect the size of the formed mesh-like voids 130, thereby affecting the application of the cushioning material layer 100 in the bonding process. Too large a distance between two adjacent first fiber strips 110 may affect the structural strength of the cushioning material layer 100, and may also affect the application of the cushioning material layer 100 in the bonding process. In this way, the distance between two adjacent first fiber strips 110 is controlled to be 50-500 μm, which not only ensures the structural strength of the buffer material layer 100, but also ensures that the buffer material layer 100 can be well applied in the bonding process, so that the pressure distribution applied to the bonding surfaces of the first substrate 310 and the second substrate 320 is more uniform, and the yield of the product can be effectively improved.
In some embodiments, the spacing between two adjacent second fiber strips 120 is 50-500 μm. Too small a spacing between two adjacent second fiber strips 120 may affect the size of the formed mesh-like voids 130, thereby affecting the application of the cushioning material layer 100 in the bonding process. Too large a distance between two adjacent second fiber strips 120 may affect the structural strength of the cushioning material layer 100, and may also affect the application of the cushioning material layer 100 in the bonding process. In this way, the distance between two adjacent second fiber strips 120 is controlled to be 50-500 μm, so that not only the structural strength of the buffer material layer 100 can be ensured, but also the buffer material layer 100 can be well applied to the bonding process, so that the pressure distribution applied to the bonding surfaces of the first substrate 310 and the second substrate 320 is more uniform, and the yield of the product can be effectively improved.
In some embodiments, the thickness of cushioning material layer 100 is 0.3-1mm. The thickness of the buffer material layer 100 needs to be controlled within a reasonable range to ensure that the buffer material layer 100 is better applied in the bonding process.
In some embodiments, a first direction F 1 And a second direction F 2 The first fiber strips 110 and the second fiber strips 120 are arranged vertically and horizontally, so as to improve the overall structural strength of the cushioning material layer 100.
Fig. 3 is a schematic structural diagram of a molding jig according to an embodiment of the application.
In some embodiments, referring to fig. 3, a mold pressing tool 10 according to an embodiment of the present application includes an upper mold 210 and a lower mold 220. At least one molding auxiliary material is disposed between the upper mold 210 and the lower mold 220, and the molding auxiliary material includes at least one cushioning material layer 100.
It can be appreciated that, in the process of pressing the first substrate 310 and the second substrate 320 by using the pressing jig 10, the gap 130 of the mesh structure formed by the buffer material layer 100 can be used to compensate the height drop generated by the upper die 210 and the lower die 220, so as to avoid uneven pressure distribution or overlarge pressure difference caused by too concentrated pressure in the lamination process, and make the pressure distribution applied to the lamination surface of the first substrate 310 and the second substrate 320 more uniform, which is beneficial to improving the yield of the product.
The materials of the first substrate 310 and the second substrate 320 may be soft or hard plastics, or may be iron, copper, aluminum or an alloy thereof, which is not particularly limited herein.
In some embodiments, the first substrate 310 and the second substrate 320 are stacked and disposed on the lower mold 220, between the lower mold 220 and the second substrate 320, and a side of the first substrate 310 facing away from the second substrate 320 is provided with a molding auxiliary material.
In this way, the side of the first substrate 310 and the side of the second substrate 320 facing away from each other are both provided with molding auxiliary materials, and the side of the first substrate 310 and the side of the second substrate 320 facing away from each other can utilize the gap 130 of the mesh structure of the buffer material layer 100 to compensate the height difference generated by the upper mold 210 and the lower mold 220, so that the pressure distribution applied to the bonding surface of the first substrate 310 and the second substrate 320 is more uniform, which is more beneficial to improving the yield of the product.
In some embodiments, referring to fig. 4, the molding tool 10 further includes a resistance tester 400, and both of the molding auxiliary materials are electrically connected to the resistance tester 400.
In particular, in the embodiment shown in fig. 4, two molding auxiliary materials are electrically connected to the resistance tester 400, and the first fiber strip 110 includes metal wire fibers, so that the first fiber strip 110 has conductivity, and thus, the buffer material layers 100 of the two molding auxiliary materials can be electrically connected to the resistance tester 400 by means of the corresponding first fiber strip 110, and the resistance between the buffer material layers 100 of the two molding auxiliary materials can be tested by the resistance tester 400, so that the two can be tested before the bonding processResistance between the buffer material layers 100 of the molding auxiliary material to obtain R Front part The resistance between the buffer material layers 100 of two molding auxiliary materials can be tested in real time in the bonding process to obtain R In (a) If R is Front part And R is In (a) If the difference value exceeds the preset value, it indicates that there is a high probability of defects such as thermal interference and excessive press-fit deformation in the lamination process, the lamination operation needs to be stopped, and the product is controlled and adjusted in time, so as to play a role in monitoring the lamination process, and avoid defective products from flowing into the next link.
In other embodiments, the molding fixture 10 further includes a capacitance tester, and the two molding auxiliary materials are electrically connected to the capacitance tester respectively. The two molding auxiliary materials are electrically connected to the capacitance tester, so that the capacitance value between the buffer material layers 100 of the two molding auxiliary materials can be tested, and the capacitance tester can be used for monitoring the process data in the laminating process, so that defective products can be prevented from flowing into the next link.
In some embodiments, referring to fig. 4 in combination with fig. 5, two sides of the molding auxiliary materials facing away from each other are respectively provided with a connection layer 410, the connection layer 410 includes an insulation layer 411 and a plurality of electrical conduction terminals 412 disposed on the insulation layer 411, and the plurality of electrical conduction terminals 412 are electrically connected to the resistance tester 400 or the capacitance tester. The plurality of electrically conductive terminals 412 are located between the corresponding insulating layer 411 and the adjacent molding auxiliary material, and are in contact connection with the plurality of first fiber strips 110 in the adjacent molding auxiliary material in a one-to-one correspondence manner.
In particular, in the embodiment shown in fig. 4 and 5, the plurality of electrically conductive terminals 412 are electrically connected to the resistance tester 400, so that the resistance tester 400 is electrically connected to the plurality of first fiber strips 110 of the buffer material layer 100 in the molding auxiliary material by means of the plurality of electrically conductive terminals 412 in a one-to-one correspondence, and the resistance tester 400 can be used to test the buffer material layer 100 between two molding auxiliary materials and corresponding to the buffer material layer 100 along the first direction F 1 Resistance values at different positions enable obtained resistance value data to be more comprehensive, and R corresponds to a certain position Front part And R is In (a) The difference value exceeds a preset value, so that the defects of thermal interference, excessive pressing deformation and the like at the position can be correspondingly known, the position can be checked in a targeted manner, the product can be controlled and adjusted in time according to the checked reasons in a targeted manner, and the effect of monitoring the laminating process is better achieved.
In some embodiments, the centerline of the cushioning material layer 100 and the centerline of the upper die 210 coincide with each other.
It will be appreciated that the upper die 210 and the lower die 220 are generally disposed in the middle, and the first substrate 310 and the second substrate 320 are also disposed in the middle of the lower die 220, so that the center line of the buffer material layer 100 and the center line of the upper die 210 are overlapped with each other, which is equivalent to disposing the buffer material layer 100 and the upper die 210 in the middle, so that the pressure distribution applied to the bonding surfaces of the first substrate 310 and the second substrate 320 is more uniform, which is more beneficial to improving the yield of the product.
In some embodiments, three layers of the molding aid are provided between the upper die 210 and the lower die 220.
Referring to fig. 6 and 7, fig. 6 shows pressure-sensitive image diagrams corresponding to the difference in the force of the molding auxiliary material disposed between the upper mold 210 and the lower mold 220 with different layers under the same pressing area (the pressing area may be equal to the area of the bonding surface), fig. 6 shows pressure-sensitive image diagrams corresponding to the layers of the molding auxiliary material being 0, 1, 2 and 3 respectively in fig. 6, and fig. 6 shows a chart diagram of the pressure-sensitive image diagrams under different force differences. A comparison of the stress difference test data for molding aids having different numbers of layers disposed between the upper die 210 and the lower die 220 for the same pressing area (the pressing area may be equal to the area of the bonding surface) is given in fig. 7. As can be seen from fig. 6 and 7, when the buffer material layer 100 is disposed between the upper die 210 and the lower die 220, the stress difference is 28N, and the stress difference is reduced by 71.2% compared to the stress difference (97.3N) in the case where the buffer material layer 100 is not disposed (when the number of molding auxiliary layers is 0). When the two buffer material layers 100 are disposed between the upper die 210 and the lower die 220, the stress difference is 25.3N, which is 74.0% lower than the stress difference (97.3N) when the buffer material layers 100 are not disposed. When the three buffer material layers 100 are disposed between the upper die 210 and the lower die 220, the stress difference is 22.4N, which is 77.0% lower than the stress difference (97.3N) in the case where the buffer material layers 100 are not disposed.
Therefore, the buffer material layer 100 can significantly reduce the stress difference, and further significantly improve the uniformity of the pressure distribution applied to the bonding surface of the first substrate 310 and the second substrate 320, and the uniformity of the pressure distribution is improved to more than 71%. And the molding auxiliary material comprises three buffer material layers 100, the stress difference is low, and the uniformity of pressure distribution applied to the joint surface of the first substrate 310 and the second substrate 320 is high.
In some embodiments, the pressing process provided in an embodiment of the present application uses the mold pressing tool 10 to press the first substrate 310 and the second substrate 320.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (8)
1. The utility model provides a mould pressing tool for to first substrate and second substrate pressfitting, its characterized in that, mould pressing tool includes:
an upper die and a lower die; the first base material and the second base material are stacked on the lower die; a mould pressing auxiliary material is arranged between the lower mould and the second base material and on one side of the first base material away from the second base material; the molding auxiliary material comprises a buffer material layer, wherein the buffer material layer is used in the lamination process of a first base material and a second base material, and comprises a plurality of first fiber strips distributed at intervals along a first direction and a plurality of second fiber strips distributed at intervals along a second direction;
each first fiber strip and each second fiber strip are interwoven along the thickness direction of the buffer material layer to form a net-shaped structure; the first fiber strip comprises 70-100 parts of terylene, 0-30 parts of chinlon and 0-20 parts of metal wire fiber, and the second fiber strip comprises 70-100 parts of terylene and 0-30 parts of chinlon;
the first direction and the second direction intersect each other;
the mould pressing jig further comprises a resistance tester, and the two mould pressing auxiliary materials are respectively and electrically connected to the resistance tester; or the mould pressing jig further comprises a capacitance tester, and the two mould pressing auxiliary materials are respectively and electrically connected with the capacitance tester;
the two mould pressing auxiliary materials are respectively provided with a connecting layer at one side deviating from each other, the connecting layer comprises an insulating layer and a plurality of electric conduction terminals arranged on the insulating layer, and the electric conduction terminals are electrically connected to the resistance tester or the capacitance tester;
the plurality of electric conduction terminals are positioned between the corresponding insulating layer and the adjacent molding auxiliary materials, and are in contact connection with the plurality of first fiber strips in the adjacent molding auxiliary materials in a one-to-one correspondence manner.
2. The embossing jig as set forth in claim 1, wherein a distance between two adjacent first fiber strips is 50-500 μm.
3. The embossing jig as set forth in claim 1 or 2, wherein a distance between two adjacent second fiber strips is 50-500 μm.
4. The molding jig of claim 1, wherein the thickness of the buffer material layer is 0.3-1mm.
5. The molding jig of claim 1, wherein the first direction and the second direction are perpendicular to each other.
6. The molding jig according to claim 1, wherein a center line of the cushioning material layer and a center line of the upper mold coincide with each other.
7. The molding jig according to claim 1, wherein three layers of the molding auxiliary material are provided between the upper die and the lower die.
8. A press-fit process method, characterized in that the press-fit of the first substrate and the second substrate is performed by using the press-fit jig according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210332631.8A CN114635219B (en) | 2022-03-31 | 2022-03-31 | Buffer material layer, mould pressing jig and pressing process method |
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| CN202210332631.8A CN114635219B (en) | 2022-03-31 | 2022-03-31 | Buffer material layer, mould pressing jig and pressing process method |
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| CN114635219A CN114635219A (en) | 2022-06-17 |
| CN114635219B true CN114635219B (en) | 2023-09-05 |
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| CN114635219A (en) | 2022-06-17 |
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