CN212873891U - Binding equipment for display panel and pressure head thereof - Google Patents
Binding equipment for display panel and pressure head thereof Download PDFInfo
- Publication number
- CN212873891U CN212873891U CN202021544128.1U CN202021544128U CN212873891U CN 212873891 U CN212873891 U CN 212873891U CN 202021544128 U CN202021544128 U CN 202021544128U CN 212873891 U CN212873891 U CN 212873891U
- Authority
- CN
- China
- Prior art keywords
- display panel
- pressing part
- pressing portion
- binding
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003825 pressing Methods 0.000 claims abstract description 117
- 238000007731 hot pressing Methods 0.000 claims abstract description 76
- 230000007704 transition Effects 0.000 claims description 19
- 230000000694 effects Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 239000012790 adhesive layer Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- 239000003063 flame retardant Substances 0.000 description 5
- 238000007373 indentation Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses bind equipment and pressure head for display panel binds display panel and flexible line way board, bind equipment and include: the pressing seat and the pressing head formed on the pressing seat; the pressure head comprises a first hot pressing part and a second hot pressing part, the second hot pressing part is arranged corresponding to the binding area, the first hot pressing part is adjacent to the second hot pressing part along a second direction, and the second hot pressing part is in contact with the binding area of the flexible circuit board during binding; the surface height of the second heat pressing part is lower than that of the first heat pressing part in the direction perpendicular to the plane of the display panel; the binding area is formed on at least one side edge of the display panel, the extending direction of the side edge forming the binding area is set to be a first direction, and the direction perpendicular to the first direction on the plane where the display panel is located is set to be a second direction, so that a better binding effect is achieved.
Description
Technical Field
The application relates to the technical field of display processing, in particular to binding equipment for a display panel and a pressure head of the binding equipment.
Background
In the current display panel industry, an OLB process (Outer lead Bonding) is generally used to bond a display panel and a flexible printed circuit board, and the OLB process applies a higher temperature and pressure to a Bonding area of the display panel and the flexible printed circuit board by using a pressure head and keeps a certain time to force conductive particles in an anisotropic conductive adhesive to break and deform, so that a conductive layer on the flexible printed circuit board is connected with pins on the display panel through the anisotropic conductive adhesive, and a signal path between the display panel and the flexible printed circuit board is formed.
The pressure head in the exemplary technology applies higher temperature and pressure to the binding area, and due to the fact that the anisotropic conductive adhesive and the conductive layer and the pins of the binding area have height difference, when the pressure head presses the binding area, the anisotropic conductive adhesive cannot be cured, and the binding is not firm.
SUMMERY OF THE UTILITY MODEL
An object of the present application is to provide a binding apparatus for a display panel and a pressing head thereof to improve reliability of binding.
The application discloses equipment of binding for display panel binds display panel and flexible line way board, it forms to bind the district display panel's at least one side, establishes the formation the extending direction of the side of binding the district is first direction on the plane at display panel place with first direction vertically direction is the second direction, bind equipment and include: the pressing seat and the pressing head formed on the pressing seat; the ram comprises a first hot pressing part and a second hot pressing part; the second hot pressing part is arranged corresponding to the binding area; the first hot-pressing part is adjacent to the second hot-pressing part along a second direction;
when the flexible circuit board is bound, the second hot pressing part is in contact with the binding area of the flexible circuit board; the surface height of the second heat pressing portion is lower than that of the first heat pressing portion in a direction perpendicular to the plane of the display panel.
Optionally, a maximum height difference between the surface of the first thermal pressing portion and the surface of the second thermal pressing portion is less than or equal to 200 micrometers.
Optionally, the flexible printed circuit board includes a protection region and a transition region along the second direction; the transition zone is positioned between the protection zone and the binding zone; the width of the surface of the second hot pressing part is greater than or equal to the width of the binding area and less than or equal to the sum of the widths of the binding area and the transition area.
Optionally, the press head further includes a third hot-pressing portion, and the second hot-pressing portion is located between the first hot-pressing portion and the third hot-pressing portion; the surface of the second heat pressing portion is lower than the surface height of the third heat pressing portion in a direction perpendicular to the plane of the display panel.
Optionally, a maximum height difference between the surface of the third thermal pressing portion and the surface of the second thermal pressing portion is less than or equal to 200 micrometers.
Optionally, the height difference between the first thermal pressing portion and the surface of the second thermal pressing portion increases linearly along a direction away from the second thermal pressing portion.
Optionally, the surfaces of the first thermal pressing portion and the second thermal pressing portion are planes parallel to each other.
Optionally, the first hot-pressing part is an arc surface; the heights of the two end regions of the surface of the first hot pressing part are lower than the height of the middle region.
Optionally, a maximum height difference between the surface of the third thermal pressing portion and the surface of the second thermal pressing portion is equal to a maximum height difference between the surface of the first thermal pressing portion and the surface of the second thermal pressing portion.
The application also discloses a pressure head of the binding equipment for the display panel, which binds the display panel with the flexible circuit board, wherein the flexible circuit board comprises a binding area fixed with the display panel, a transition area and a protection area, and the transition area is positioned between the binding area and the protection area; the pressing head is characterized by comprising a first hot pressing part, a second hot pressing part and a third hot pressing part; the second hot-pressing part is arranged corresponding to the binding area, and the first hot-pressing part is arranged corresponding to the protection area; the second hot pressing part is positioned between the first hot pressing part and the third hot pressing part; the surface height of the second heat pressing portion is lower than the surfaces of the first heat pressing portion and the third heat pressing portion in a direction perpendicular to the plane of the display panel.
This application, when tying up, first hot splenium does not with flexible line way board direct contact, can prevent to be pressed on the flexible line way board that first hot splenium corresponds and can not produce the indentation, can indirectly pass through the air transfer heat moreover to the pressure face on for the anisotropic conducting resin that corresponds first hot splenium position can be heated normally and breaks the deformation, gets up display panel and flexible line way board electric connection.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a schematic diagram of a binding device of an embodiment of the present application;
FIG. 2 is a schematic diagram of a binding device according to another embodiment of the present application;
FIG. 3 is a schematic diagram of a binding device according to another embodiment of the present application;
FIG. 4 is a schematic diagram of a binding device according to another embodiment of the present application;
FIG. 5 is a schematic diagram of a binding device according to another embodiment of the present application;
FIG. 6 is a schematic diagram of a binding device according to another embodiment of the present application;
FIG. 7 is a schematic view of a tool tip of a binding device according to an embodiment of the present application.
10, a display panel; 11. a pin; 20. a flexible circuit board; 21. a conductive layer; 22. a flame retardant layer; 23. a flexible substrate; 30. an anisotropic conductive adhesive layer; 40. a pressure head; 41. a first hot-pressing portion; 42 a second hot-pressing part; 43. a third hot-pressing portion; 50. pressing a base; a: a protection zone; b: a transition zone; c: a binding region.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.
Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The present application is described in detail below with reference to the figures and alternative embodiments.
As shown in fig. 1 and 2, a binding apparatus known to the inventor reduces poor binding effect caused by poor heating and pressing of anisotropic conductive paste by controlling the width of a tool bit, but the tool bit of fig. 1 easily causes that both sides of the anisotropic conductive paste cannot be heated, and the tool bit of fig. 2 does not sufficiently press the anisotropic conductive paste on both sides of the lead 11, so the inventor makes the following improvement.
As shown in fig. 3, the present application discloses a binding apparatus for a display panel 10, the binding apparatus binds the display panel 10 and a flexible printed circuit 20, a binding region C is formed on one side of the display panel 10, the binding region C is formed on at least one side edge of the display panel, the extending direction of the side edge forming the binding region is a first direction Y, and the direction perpendicular to the first direction on the plane of the display panel is a second direction X; the binding device includes: a pressing base 50 and a pressing head 40 formed on the pressing base 50; the ram 40 comprises a first hot pressing 41 and a second hot pressing 42; the second hot pressing part 42 is arranged corresponding to the binding area C; the first heat pressing portion 41 is adjacent to the second heat pressing portion 42 in the second direction X; wherein, when binding, the second hot pressing part 42 contacts with the binding area C of the flexible circuit board 20; in a direction Z perpendicular to the plane of the display panel 10, the surface height of the second heat pressing portion 42 is lower than the surface of the first heat pressing portion 41.
In this application, when binding, first hot splenium 41 does not with flexible line way board 20 direct contact, and the regional position of the flexible line way board 20 that first hot splenium 41 corresponds can not receive pressure, therefore is in flexible line way board 20 surpass the part of anisotropic conductive adhesive 30 in the second direction can not produce the indentation, can indirectly pass through the air transfer heat to the pressure face in addition for the anisotropic conductive adhesive that corresponds first hot splenium 41 position can the normal thermal fracture deformation, couples together display panel 10 and flexible line way board 20 electric connection.
As shown in fig. 4, the display panel 10 is provided with pins 11; the flexible wiring board 20 includes: an anisotropic conductive adhesive layer 30, a conductive layer 21, a flexible substrate 23, and a flame retardant layer 22; the anisotropic conductive adhesive layer 30 is fixed on the pins 11 in a matching manner; the conductive layer 21 is arranged on the anisotropic conductive adhesive layer 30; the flexible substrate 23 is disposed on the anisotropic conductive adhesive layer 30; the length of the pin 11 is less than that of the anisotropic conductive adhesive layer 30; the length of the anisotropic conductive adhesive layer 30 is less than that of the conductive layer 21; a part of the flame retardant layer 22 is positioned below the conductive layer 21 without the anisotropic conductive adhesive layer 30; the other part is positioned between the anisotropic conductive adhesive layer 30 and the conductive layer 21 and is not overlapped with the pin 11 under the projection from the conductive layer 21 to the pin 11; the area where the flame retardant layer 22 is located is a protection area A, the area of the pin 11 is a binding area C, and a transition area B is arranged between the protection area A and the binding area C.
The width of the surface of the second hot pressing part 42 is greater than or equal to the width of the binding area C and less than or equal to the sum of the widths of the binding area C and the transition area B; the width of the surface of the second hot pressing portion 42 is greater than or equal to the width of the bonding area C, so that pressure can be effectively applied to each position of the bonding area C, the width of the surface of the second hot pressing portion 42 is less than or equal to the sum of the widths of the bonding area C and the transition area B, and the situation that the pressure between the anisotropic conductive adhesive and the pins 11 is insufficient due to the fact that the flame retardant layer 22 is pressed due to the fact that the second hot pressing portion 42 is too wide and the anisotropic conductive adhesive cannot be pressed into indentations at the edge positions of the pins 11, and the anisotropic conductive adhesive cannot be broken due to the fact that the anisotropic conductive adhesive does not have indentations.
Of course, the length of the second thermal pressing portion 42 in the second direction is greater than the length of the lead 11 in the second direction, so that the second thermal pressing portion 42 can completely press the pressing surface corresponding to the lead 11, and the pressure between the anisotropic conductive adhesive layer 30 and the lead 11 is sufficient and completely covers the lead 11.
Specifically, the height difference between the first thermal pressing portion 41 and the surface of the second thermal pressing portion 42 increases linearly along the direction away from the second thermal pressing portion 42, and the surfaces of the first thermal pressing portion 41 and the second thermal pressing portion 42 are flat; the included angle between the surface of the first hot pressing portion 41 and the surface of the second hot pressing portion 42 is an acute angle, that is, the surface of the first hot pressing portion 41 is an inclined plane, and the included angle between the surface of the first hot pressing portion 41 and the surface of the second hot pressing portion 42 is an acute angle. The maximum distance from the pressing surface of the first heat pressing portion 41 (the pressing surface on the flexible wiring board 20) is less than 200um, and more specifically, the maximum distance D1 is set to 100um, and the width L1 (i.e., the length in the second direction) of the surface of the first heat pressing portion 41 projected onto the plane where the surface of the second heat pressing portion 42 is located is 400 um.
Referring to fig. 5, as another alternative structure, the surface of the first heat pressing portion 41 may be parallel to the surface of the second heat pressing portion 42, that is, the surfaces of the first heat pressing portion 41 and the second heat pressing portion 42 are planes parallel to each other, when the second heat pressing portion 42 is in contact with the pressing surface, the distance between the first heat pressing portion 41 and the pressing surface is 200um, the distance D2 is set to be 100um, and the surface width L2 (i.e., the length in the second direction) of the first heat pressing portion 41 is 400 um. Because the surface of the second thermal pressing portion 42 has equal distance with the pressing surface, the anisotropic conductive adhesive layer 30 under the pressing surface corresponding to the first thermal pressing portion 41 can be heated uniformly, and the conductive performance of the flexible circuit board is improved.
Referring to fig. 6, as another alternative structure, the first hot-pressing portion 41 may be provided with a cambered surface; the height of the two end regions of the surface of the first hot pressing part 41 is lower than that of the middle region, so that the surface of the first hot pressing part 41 is an inward concave arc surface, and the structure is favorable for gathering heat energy in the arc surface region and improving the heating effect of the first hot pressing part 41. The maximum distance from the pressing surface of the first heat pressing portion 41 is less than 200um, and more specifically, the maximum distance D3 is set to be 100um, and the width L3 (i.e., the length in the second direction) of the surface of the first heat pressing portion 41 projected to the plane where the surface of the second heat pressing portion 42 is located is 400 um.
The larger the maximum height difference between the surface of the first thermal pressing portion 41 and the surface of the second thermal pressing portion 42 is, the further the surface of the first thermal pressing portion 41 is from the anisotropic conductive adhesive, and if the first thermal pressing portion 41 is too far from the anisotropic conductive adhesive, the first thermal pressing portion 41 cannot effectively heat the anisotropic conductive adhesive.
As shown in fig. 4-6, the ram 40 further includes a third hot press 43, the second hot press 42 being located between the first hot press 41 and the third hot press 43; when the flexible printed circuit board is bonded, the surface height of the third thermal pressing portion 43 is higher than that of the second thermal pressing portion 42, and the third thermal pressing portion 43 is disposed on a side close to the display panel 10, so that the flexible printed circuit board 20 corresponding to the third thermal pressing portion 43 can be effectively prevented from being pressed, and can be indirectly heated by the third thermal pressing portion 43.
The shape and the maximum distance from the pressing surface of the third hot pressing portion 43 to the first hot pressing portion 41 may be the same, and are not described herein again. The width (M1 or M2 or M3) of the surface of the third heat pressing portion 43 projected onto the plane where the surface of the second heat pressing portion 42 is located (i.e. the length in the second direction) is 50um to 150um, specifically 100um is selected, and the maximum distance of the third heat pressing portion 43 from the pressing surface is less than 200um, more specifically the maximum distance N1 or N2 or N3 is 100 um.
The application also discloses a binding device for the display panel 10, which binds the display panel 10 with the flexible circuit board 20, wherein the flexible circuit board comprises a binding area C, a transition area B and a protection area A, which are fixed with the display panel 10, and the transition area B is positioned between the binding area C and the protection area A; the binding device includes: a pressing base 50 and a pressing head 40 formed on the pressing base 50; the ram 40 comprises a first hot pressing 41, a second hot pressing 42 and a third hot pressing 43; the second hot pressing part 42 is arranged corresponding to the binding area C, and the first hot pressing part 41 is arranged corresponding to the protection area a; the second hot press 42 is located between the first hot press 41 and the third hot press 43; the surface height of the second hot pressing portion 42 is lower than the surfaces of the first hot pressing portion 41 and the third hot pressing portion 43; wherein, when binding, the second heat pressing part 42 contacts with the flexible circuit board 20; the width of the surface of the second hot pressing portion 42 is greater than or equal to the width of the binding region C and less than or equal to the sum of the widths of the binding region C and the transition region B.
As shown in fig. 7, the present application further discloses a pressing head 40 of a bonding apparatus for a display panel 10, which bonds the display panel 10 with a flexible circuit board 20, wherein the flexible circuit board includes a bonding area C fixed with the display panel 10, a transition area B and a protection area a, and the transition area B is located between the bonding area C and the protection area a; characterized in that the ram 40 comprises a first hot pressing part 41, a second hot pressing part 42 and a third hot pressing part 43 of the ram 40; the second hot pressing part 42 is arranged corresponding to the binding area C, and the first hot pressing part 41 is arranged corresponding to the protection area a; the second hot press 42 is located between the first hot press 41 and the third hot press 43; the surface height of the second heat pressing portion 42 is lower than the surfaces of the first heat pressing portion 41 and the third heat pressing portion 43.
The technical solution of the present application can be widely applied to various display panels, such as TN (Twisted Nematic) display panel, IPS (In-Plane Switching) display panel, VA (Vertical Alignment) display panel, MVA (Multi-Domain Vertical Alignment) display panel, and of course, other types of display panels, such as OLED (Organic Light-Emitting Diode) display panel, and the above solution can be applied thereto.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.
Claims (10)
1. A binding apparatus for a display panel that binds the display panel with a flexible wiring board, the binding apparatus comprising:
pressing a base;
the pressure head is formed on the pressure seat;
the pressure head comprises a first hot pressing part and a second hot pressing part, the second hot pressing part is arranged corresponding to the binding area, the first hot pressing part is adjacent to the second hot pressing part along a second direction, and the second hot pressing part is in contact with the binding area of the flexible circuit board during binding;
the surface height of the second heat pressing part is lower than that of the first heat pressing part in the direction perpendicular to the plane of the display panel;
the display panel comprises a display panel, a binding area and a display panel, wherein the binding area is formed on at least one side edge of the display panel, the extending direction of the side edge forming the binding area is set as a first direction, and the direction perpendicular to the first direction on the plane where the display panel is located is set as a second direction.
2. The bonding apparatus for display panels as claimed in claim 1, wherein a maximum height difference between a surface of the first heat pressing portion and a surface of the second heat pressing portion is 200 μm or less.
3. The bonding apparatus for display panels according to claim 1, wherein the flexible wiring board further comprises a protection region and a transition region in the second direction; the transition zone is positioned between the protection zone and the binding zone; the width of the second hot pressing part surface is greater than or equal to the width of the binding area and less than or equal to the sum of the widths of the binding area and the transition area.
4. The bonding apparatus for a display panel according to claim 1, wherein the pressing head further comprises a third heat pressing part, the second heat pressing part is located between the first heat pressing part and the third heat pressing part, and a surface height of the second heat pressing part is lower than a surface of the third heat pressing part in a direction perpendicular to a plane of the display panel.
5. The bonding apparatus for display panels as claimed in claim 4, wherein a maximum height difference between a surface of the third thermal pressing portion and a surface of the second thermal pressing portion is 200 μm or less.
6. The binding apparatus for a display panel according to claim 1, wherein a height difference of the first heat-pressing portion from a surface of the second heat-pressing portion increases linearly in a direction away from the second heat-pressing portion.
7. The bonding apparatus for display panels as claimed in claim 1, wherein surfaces of the first and second heat-pressing portions are planes parallel to each other.
8. The bonding apparatus for display panels as claimed in claim 1, wherein the first thermocompression unit is a cambered surface, and the height of the two end regions of the surface of the first thermocompression unit is lower than the height of the middle region.
9. A binding apparatus for display panels according to claim 5, wherein the maximum difference in height of the surface of the third heat pressing portion and the surface of the second heat pressing portion is equal to the maximum difference in height of the surface of the first heat pressing portion and the surface of the second heat pressing portion.
10. The utility model provides a pressure head that is used for binding equipment of display panel, binds display panel and flexible line way board, flexible line way board includes the district of binding fixed with display panel, transition district and protection zone, the transition district is located bind between district and the protection zone, its characterized in that, the pressure head includes:
the first hot pressing part is arranged corresponding to the protection area;
the second hot pressing part is arranged corresponding to the binding area; and
a third hot-pressing portion;
the second hot pressing part is positioned between the first hot pressing part and the third hot pressing part;
the surface of the second heat pressing portion is lower than the surfaces of the first heat pressing portion and the third heat pressing portion in height in a direction perpendicular to the plane of the display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021544128.1U CN212873891U (en) | 2020-07-30 | 2020-07-30 | Binding equipment for display panel and pressure head thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021544128.1U CN212873891U (en) | 2020-07-30 | 2020-07-30 | Binding equipment for display panel and pressure head thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212873891U true CN212873891U (en) | 2021-04-02 |
Family
ID=75218397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021544128.1U Active CN212873891U (en) | 2020-07-30 | 2020-07-30 | Binding equipment for display panel and pressure head thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212873891U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113690163A (en) * | 2021-08-10 | 2021-11-23 | Tcl华星光电技术有限公司 | Binding method of heating device and flexible display panel |
-
2020
- 2020-07-30 CN CN202021544128.1U patent/CN212873891U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113690163A (en) * | 2021-08-10 | 2021-11-23 | Tcl华星光电技术有限公司 | Binding method of heating device and flexible display panel |
| CN113690163B (en) * | 2021-08-10 | 2023-06-27 | Tcl华星光电技术有限公司 | Heating device and binding method of flexible display panel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101287329B (en) | Display device | |
| TW200839350A (en) | Display deivice and flat display device | |
| TWI486106B (en) | Pin structure and pin connection structure | |
| CN104144576B (en) | Method, panel-FPCB components with reference to FPCB and include its display device | |
| KR20100114111A (en) | Method of connection of flexible printed circuit board and electronic device obtained thereby | |
| JP3491415B2 (en) | Manufacturing method of liquid crystal display device | |
| CN212873891U (en) | Binding equipment for display panel and pressure head thereof | |
| WO2014173144A1 (en) | Chip on film flexible circuit board and display device | |
| CN110299073A (en) | A kind of display panel, flexible connecting member and display device | |
| CN107613637B (en) | Binding structure and method of flexible display panel and FPC (flexible printed circuit) circuit board | |
| CN100397165C (en) | Liquid crystal display apparatus | |
| CN216901261U (en) | Display device | |
| JP2009069705A (en) | Manufacturing method of liquid crystal display device | |
| CN108777911B (en) | Electrical connection structure and forming method thereof | |
| CN201392897Y (en) | Conductivity bonding cushion structure and chip bonding cushion structure | |
| CN211180782U (en) | Touch screen and display device | |
| CN100461982C (en) | Circuit board | |
| JPH10112584A (en) | Connecting method for circuit board, connecting structure for circuit board, and liquid crystal device using the structure | |
| JP5218725B2 (en) | Connection method | |
| TW455958B (en) | Tape carrier package and liquid crystal module using the same | |
| CN207460582U (en) | FPC plates | |
| JPH06140554A (en) | Outgoing lead of electronic component and joining method therefor | |
| CN209517614U (en) | A kind of circuit board | |
| JP5556424B2 (en) | Wiring board and connection method | |
| CN219698061U (en) | Hot melt die block |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |