CN209517614U - A kind of circuit board - Google Patents
A kind of circuit board Download PDFInfo
- Publication number
- CN209517614U CN209517614U CN201821856889.3U CN201821856889U CN209517614U CN 209517614 U CN209517614 U CN 209517614U CN 201821856889 U CN201821856889 U CN 201821856889U CN 209517614 U CN209517614 U CN 209517614U
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- heat
- plate
- conducting
- conducting plate
- electrical component
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Abstract
The utility model relates to a kind of circuit boards, including substrate, electrical component and heat-conducting layer, electrical component is disposed on the substrate, heat-conducting layer is arranged above electrical component, circuit board includes the first heat-conducting plate and the second heat-conducting plate, first heat-conducting plate and the second heat-conducting plate are separately positioned on electrical component two sides, there is clearance portion between first heat-conducting plate and the second heat-conducting plate, first heat-conducting plate and the second heat-conducting plate are the identical heat-conducting plate of structure, heat-conducting plate is made of elastic material, heat-conducting plate includes pressing plate, connecting plate and segmental arc, one end of the connection board is connect with substrate, the other end is connect with segmental arc, segmental arc one end is connect with pressing plate, the pressing plate is connect with heat-conducting layer.A kind of circuit board of the utility model can make heat-conducting plate be suitable for the heat-conducting layer of different-thickness, enhance its versatility, reduce processing cost；Furthermore it is possible to provide protection to electrical component, electrical component damaged risk is reduced.
Description
Technical field
The utility model relates to electronic technology field, in particular to a kind of circuit board.
Background technique
Circuit board makes the electrical connection that electronic component can be realized, and the major advantage using circuit board is to greatly reduce
The mistake of wiring and assembly, improves the gentle productive labor rate of Automated water.Since electrical component can generate largely at work
Heat, therefore circuit board needs to use cooling measure to reduce circuit board temperature, avoids circuit board high temperature impaired.The prior art
In, as shown in Figure 1, usually on electrical component 100 be arranged heat-conducting layer 200 it is thermally conductive to enhance, meanwhile, using metal plate with it is thermally conductive
Layer contact, to enhance heat dissipation.But the heat-conducting layer thickness of different electrical components is different, therefore, it is necessary to different metal plates, increase
Difficulty of processing and cost are added.
Utility model content
In order to solve problems in the prior art, it is preferable to provide a kind of heat dissipation effect for the utility model, convenient for being applicable in difference
The circuit board of thickness heat-conducting layer.
Specific technical solution is as follows: a kind of circuit board, including substrate, electrical component and heat-conducting layer, and electrical component setting exists
On substrate, heat-conducting layer be arranged above electrical component, circuit board include the first heat-conducting plate and the second heat-conducting plate, the first heat-conducting plate and
Second heat-conducting plate is separately positioned on electrical component two sides, has clearance portion between the first heat-conducting plate and the second heat-conducting plate, first leads
Hot plate and the second heat-conducting plate are the identical heat-conducting plate of structure, and heat-conducting plate is made of elastic material, and heat-conducting plate includes pressing plate, connecting plate
And segmental arc, one end of the connection board are connect with substrate, the other end is connect with segmental arc, and segmental arc one end is connect with pressing plate, the pressure
Plate is connect with heat-conducting layer.
The following are the attached technical schemes of the utility model.
Preferably, the pressing plate has binding face, and binding face is connect with heat-conducting layer, and binding face has arc recessed
Slot, multiple arcs groove are disposed adjacent.
Preferably, the first connecting plate of the first heat-conducting plate and the second connecting plate of the second heat-conducting plate connect into one
Body.
Preferably, the connecting plate is arranged in electrical component side, and connecting plate section is L-shaped.
Preferably, the heat-conducting layer is formed by heat conductive silica gel.
The technical effect of the utility model: a kind of circuit board of the utility model can make heat-conducting plate be suitable for different-thickness
Heat-conducting layer, enhance its versatility, reduce processing cost；Furthermore it is possible to provide protection to electrical component, electrical member is reduced
Part damaged risk.
Detailed description of the invention
Fig. 1 is the schematic diagram of the circuit board of the prior art.
Fig. 2 is a kind of schematic diagram of circuit board of the embodiments of the present invention.
Fig. 3 is a kind of top view of circuit board of the embodiments of the present invention.
Fig. 4 is the schematic diagram of the heat-conducting plate of the embodiments of the present invention.
Specific embodiment
In the following, being further described in conjunction with substantive distinguishing features and advantage of the example to the utility model, but this is practical new
Type is not limited to listed embodiment.
As shown in Figures 2 to 4, a kind of circuit board of the present embodiment includes substrate 1, electrical component 2 and heat-conducting layer 3, electrically
Element 2 is arranged on substrate 1, and heat-conducting layer 3 is arranged above electrical component 2.Circuit board includes that the first heat-conducting plate 4 and second is thermally conductive
Plate 5, the first heat-conducting plate 4 and the second heat-conducting plate 5 are separately positioned on electrical component two sides, between the first heat-conducting plate and the second heat-conducting plate
With clearance portion 6.First heat-conducting plate and the second heat-conducting plate are the identical heat-conducting plate of structure, and heat-conducting plate is made of elastic material.It leads
Hot plate includes pressing plate 10, connecting plate 20 and segmental arc 30, and 20 one end of connecting plate is connect with substrate 1, and the other end and segmental arc 30 connect
It connects, 30 one end of segmental arc is connect with pressing plate 10, and the pressing plate is connect with heat-conducting layer.In above-mentioned technical proposal, heat-conducting layer first with
Heat-conducting layer, is then bonded by pressing plate pressing with electrical component, and the heat that electrical component generates is exported by heat-conducting layer, and by leading
Hot plate distributes heat, to enhance heat dissipation, and avoids.Due to being equipped with segmental arc between pressing plate and connecting plate, work as different-thickness
Heat-conducting layer be arranged between pressing plate and electrical component when, pressing plate can generate a degree of deformation, so as to be suitable for not
The heat-conducting layer of stack pile.In the present embodiment, connecting plate is connect by way of welding or being clamped with substrate, and copper can be used in heat-conducting plate
Piece, the electrical component can be the electronic components such as chip, and the heat-conducting layer is formed by heat conductive silica gel.
In the present embodiment, the pressing plate 10 has binding face 101, and binding face 101 is connect with heat-conducting layer 3, and binding face 101 has
There is arc groove 102, multiple arcs groove is disposed adjacent, i.e., arc groove arranges in the horizontal direction.By the way that arc groove is arranged,
It is capable of increasing the contact area of pressing plate and heat-conducting layer.
In the present embodiment, the first connecting plate 41 of the first heat-conducting plate 4 and the second connecting plate 51 of the second heat-conducting plate 5 are connected into
One, so that the first heat-conducting plate and the second heat-conducting plate be made to form one, enhancing structure intensity, the first connecting plate 41 and the second connection
Plate 51 constitutes connecting plate 20.
In the present embodiment, connecting plate 20 is arranged in electrical component side, and connecting plate section is L-shaped.In the present embodiment
Connecting plate 20, connecting plate 41,51 structure of connecting plate are identical.Through the above technical solutions, enabling connecting plate around electrical member
Part, to provide protection to electrical component.
A kind of circuit board of the present embodiment can make heat-conducting plate be suitable for the heat-conducting layer of different-thickness, and it is general to enhance its
Property, reduce processing cost；Furthermore it is possible to provide protection to electrical component, electrical component damaged risk is reduced.
It should be pointed out that above-mentioned preferred embodiment is only to illustrate the technical ideas and features of the present invention, purpose
It is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly, this reality can not be limited with this
With novel protection scope.All equivalent change or modifications according to made by the spirit of the present invention essence, should all cover in this reality
Within novel protection scope.
Claims (5)
1. a kind of circuit board, including substrate, electrical component and heat-conducting layer, electrical component are disposed on the substrate, heat-conducting layer setting exists
Above electrical component, which is characterized in that circuit board includes the first heat-conducting plate and the second heat-conducting plate, the first heat-conducting plate and second thermally conductive
Plate is separately positioned on electrical component two sides, has clearance portion, the first heat-conducting plate and the between the first heat-conducting plate and the second heat-conducting plate
Two heat-conducting plates are the identical heat-conducting plate of structure, and heat-conducting plate is made of elastic material, and heat-conducting plate includes pressing plate, connecting plate and arc
Section, one end of the connection board connect with substrate, and the other end is connect with segmental arc, and segmental arc one end is connect with pressing plate, the pressing plate with lead
Thermosphere connection.
2. circuit board according to claim 1, which is characterized in that the pressing plate has binding face, binding face and heat-conducting layer
Connection, binding face have arc groove, and multiple arcs groove is disposed adjacent.
3. circuit board according to claim 2, which is characterized in that the first connecting plate and the second heat-conducting plate of the first heat-conducting plate
The second connecting plate link into an integrated entity.
4. circuit board according to claim 3, which is characterized in that the connecting plate setting is in electrical component side, connection
Plate section is L-shaped.
5. circuit board according to claim 4, which is characterized in that the heat-conducting layer is formed by heat conductive silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821856889.3U CN209517614U (en) | 2018-11-12 | 2018-11-12 | A kind of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821856889.3U CN209517614U (en) | 2018-11-12 | 2018-11-12 | A kind of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209517614U true CN209517614U (en) | 2019-10-18 |
Family
ID=68189405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821856889.3U Active CN209517614U (en) | 2018-11-12 | 2018-11-12 | A kind of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209517614U (en) |
-
2018
- 2018-11-12 CN CN201821856889.3U patent/CN209517614U/en active Active
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| GR01 | Patent grant |