CN216162929U

CN216162929U - LED drive circuit structure for improving EMI

Info

Publication number: CN216162929U
Application number: CN202122237053.3U
Authority: CN
Inventors: 张凤; 刘文生
Original assignee: Xiamen Yankon Energetic Lighting Co Ltd
Current assignee: Xiamen Yankon Energetic Lighting Co Ltd
Priority date: 2021-09-15
Filing date: 2021-09-15
Publication date: 2022-04-01
Anticipated expiration: 2031-09-15

Abstract

The utility model provides an LED drive circuit structure for improving EMI (electro-magnetic interference), which comprises an aluminum substrate, a heat conducting adhesive and a copper foil, wherein the aluminum substrate, the heat conducting adhesive and the copper foil are sequentially arranged from bottom to top; the aluminum substrate is electrically connected with the bonding pad on the copper foil through the intermediate medium so as to realize the connection of the potential of the aluminum substrate and a potential stabilizing point in the circuit. The LED driving circuit structure for improving EM I has the shielding effect by connecting the aluminum substrate with the potential stabilizing point in the circuit. For the switching signal, since the potential of the aluminum substrate is already stable, the switching signal cannot be coupled to the input terminal through the aluminum substrate in a coupling manner.

Description

LED drive circuit structure for improving EMI

Technical Field

The utility model relates to the field of illumination, in particular to a DOB lamp product.

Background

At present, the degree of drive automation is higher and higher, and the DOB scheme can meet the requirement of high automation, but the problem of EMI standard exceeding can occur when the switch scheme is designed by adopting an aluminum substrate. The aluminum substrate is constructed by covering a layer of heat-conducting glue on aluminum, coating copper on the heat-conducting glue, and forming a coupling capacitor when the copper foil is close to the aluminum. Because the scheme is a switching scheme, a switching signal can be coupled to the aluminum substrate through the coupling capacitor and then directly coupled to the input end through the coupling capacitor, and therefore EMI exceeding is caused.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an LED driving circuit structure which can effectively improve EMI.

In order to solve the technical problem, the utility model provides an LED drive circuit structure for improving EMI, which comprises an aluminum substrate, a heat conducting adhesive and a copper foil, wherein the aluminum substrate, the heat conducting adhesive and the copper foil are sequentially arranged from bottom to top; the aluminum substrate is electrically connected with the bonding pad on the copper foil through the intermediate medium so as to realize the connection of the potential of the aluminum substrate and a potential stabilizing point in the circuit.

In a preferred embodiment: holes are formed in the corresponding positions of the bonding pad, the heat conducting glue and the aluminum substrate; the intermediate medium is a screw; one end of the screw is electrically connected with the aluminum substrate through the opening, and the other end of the screw is exposed on the upper surface of the copper foil and electrically connected with the bonding pad.

In a preferred embodiment: the intermediate medium is a clamping piece; the clamping piece is clamped between the lower surface of the aluminum substrate and the upper surface of the welding disc and electrically connects the upper surface of the welding disc with the lower surface of the aluminum substrate.

In a preferred embodiment: the clip comprises a first part, a second part and a connecting part connected between the first part and the second part; the first portion is electrically connected with the lower surface of the aluminum substrate, and the second portion protrudes outwards towards one side of the first portion towards the direction close to the pad to form a contact electrically connected with the pad.

In a preferred embodiment: the intermediate medium is solder paste; holes are formed in the corresponding positions of the bonding pad, the heat conducting glue and the aluminum substrate; and a part of the solder paste flows into the opening to electrically connect the bonding pad and the aluminum substrate.

Compared with the prior art, the technical scheme of the utility model has the following beneficial effects:

the utility model provides an LED drive circuit structure for improving EMI, which has a shielding effect by connecting an aluminum substrate with a potential stabilizing point in a circuit. For the switching signal, since the potential of the aluminum substrate is already stable, the switching signal cannot be coupled to the input terminal through the aluminum substrate in a coupling manner.

Drawings

FIG. 1 is a schematic view of a layered aluminum substrate;

fig. 2 is a schematic view of the preferred embodiment 1 of the present invention.

Fig. 3 is a schematic view of the preferred embodiment 2 of the present invention.

Fig. 4 is a schematic view of the preferred embodiment 3 of the present invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like, are used in a broad sense, and for example, "connected" may be a wall-mounted connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection through an intermediate medium, and a communication between two elements, and those skilled in the art will understand the specific meaning of the terms in the present invention specifically.

Referring to fig. 1, the present embodiment provides an LED driving circuit structure for improving EMI, which includes an aluminum substrate 1, a heat conducting adhesive 2, and a copper foil 3, which are sequentially disposed from bottom to top; the aluminum substrate 1 is electrically connected with a bonding pad 7 on the copper foil 3 through an intermediate medium, so that the potential of the aluminum substrate 1 is connected with a potential stabilizing point in a circuit. The aluminum substrate 1 is connected to the potential stabilizing point in the wiring, thereby achieving a shielding effect. For the switching signal, since the potential of the aluminum substrate 1 is already stabilized, the switching signal cannot be coupled to the input terminal through the aluminum substrate 1 in a coupling manner.

In order to achieve the above-described effects, 3 specific ways are provided in the present embodiment.

Example 1

Referring to fig. 2, in order to realize the potential stable point connection between the aluminum substrate 1 and the circuit in the present embodiment, the pad 7, the thermal conductive adhesive 2 and the aluminum substrate 1 are perforated at corresponding positions; the intermediate medium is a screw 4; one end of the screw 4 is electrically connected with the aluminum substrate 1 through the opening, and the other end is exposed on the upper surface of the copper foil 3 and is electrically connected with the bonding pad 7.

Example 2

Referring to fig. 3, in order to realize the potential stabilizing point connection between the aluminum substrate 1 and the circuit in the present embodiment, the intermediate medium is a clip 5; the clip 5 is sandwiched between the lower surface of the aluminum substrate 1 and the upper surface of the pad 7, and electrically connects the upper surface of the pad 7 and the lower surface of the aluminum substrate 1.

Specifically, the clip 5 includes a first portion, a second portion, and a connecting portion connected between the first portion and the second portion; the first portion is electrically connected to the lower surface of the aluminum substrate 1, and the second portion is convex toward the pad 7 to form a contact electrically connected to the pad 7.

Example 3

Referring to fig. 4, in order to realize the potential stabilizing point connection between the aluminum substrate 1 and the circuit in the present embodiment, the intermediate medium is solder paste 6; holes are formed in the corresponding positions of the bonding pad 7, the heat-conducting glue 2 and the aluminum substrate 1; a part of the solder paste 6 flows into the opening to electrically connect the bonding pad 7 and the aluminum substrate 1

The above description is only a preferred embodiment of the present invention, but the design concept of the present invention is not limited thereto, and any person skilled in the art can make insubstantial changes in the technical scope of the present invention within the technical scope of the present invention, and the actions infringe the protection scope of the present invention are included in the present invention.

Claims

1. The utility model provides a improve LED drive circuit structure of EMI which characterized in that: the aluminum-based heat-conducting adhesive comprises an aluminum substrate, a heat-conducting adhesive and a copper foil which are sequentially arranged from bottom to top; the aluminum substrate is electrically connected with the bonding pad on the copper foil through the intermediate medium so as to realize the connection of the potential of the aluminum substrate and a potential stabilizing point in the circuit.

2. The structure of claim 1, wherein the structure of the LED driving circuit for improving EMI comprises: holes are formed in the corresponding positions of the bonding pad, the heat conducting glue and the aluminum substrate; the intermediate medium is a screw; one end of the screw is electrically connected with the aluminum substrate through the opening, and the other end of the screw is exposed on the upper surface of the copper foil and electrically connected with the bonding pad.

3. The structure of claim 1, wherein the structure of the LED driving circuit for improving EMI comprises: the intermediate medium is a clamping piece; the clamping piece is clamped between the lower surface of the aluminum substrate and the upper surface of the welding disc and electrically connects the upper surface of the welding disc with the lower surface of the aluminum substrate.

4. The structure of claim 3, wherein the structure of the LED driving circuit for improving EMI comprises: the clip comprises a first part, a second part and a connecting part connected between the first part and the second part; the first portion is electrically connected with the lower surface of the aluminum substrate, and the second portion protrudes outwards towards one side of the first portion towards the direction close to the pad to form a contact electrically connected with the pad.

5. The structure of claim 3, wherein the structure of the LED driving circuit for improving EMI comprises: the intermediate medium is solder paste; holes are formed in the corresponding positions of the bonding pad, the heat conducting glue and the aluminum substrate; and a part of the solder paste flows into the opening to electrically connect the bonding pad and the aluminum substrate.