JPH0879895A - Convex ultrasonic probe and its manufacture - Google Patents

Abstract

PURPOSE: To prevent an FPC from being easily exfoliated even if a physical force is exerted to the FPC connected to an ultrasonic probe by specifying the structure of an electrode lead part. CONSTITUTION: An array arrangement face 4 curved in a projection way is formed to the surface of a backing material 2. Furthermore, plural wiring circuits 8 to be connected to electrodes of a piezoelectric element are formed to circuit arrangement faces 6,6 of both side faces of the backing material 2. One terminal of the circuit 8 reaches a lower ridge 10 and its upper end reaches the array arrangement face 4 in excess of an upper ridge 12. A prescribed pattern of the wiring circuit 8 is obtained by applying vapor-deposition of a conductive metal over the entire face of the backing material 2, for example, and applying selective etching. That is, the wiring circuit 8 whose one end connects electrically to the electrode of the piezoelectric element is provided to the circuit arrangement face 6 provided to the side face of the baking material 2 and an end of a jumper wire of a flexible printed circuit board (FPC) 30 is connected to the other end of the wiring circuit 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an ultrasonic probe, and more particularly to a structure of a lead-out portion of a convex ultrasonic probe having a transmitting / receiving surface formed on a curved surface and a method of manufacturing the same. .

[0002]

2. Description of the Related Art A convex type ultrasonic probe is used as a probe for an ultrasonic diagnostic apparatus for medical use. In the convex ultrasonic probe, piezoelectric elements formed in strips are arranged on the convex surface on the surface of a convex (convex) backing member, and electrodes are drawn out from each piezoelectric element to the outside. Have a structure.
In this ultrasonic probe, since each piezoelectric element is arranged in a convex shape, it is electronically linearly driven and the ultrasonic waves are sent out in a fan shape. It produces effects and effects.

A conventional convex type ultrasonic probe is
Electrodes are drawn out from the respective piezoelectric elements arranged on the backing member. In this electrode drawing method, a flexible printed circuit board (hereinafter, referred to as FPC) in which a conductor at a tip portion is exposed is usually prepared, and each of the exposed conductors is soldered to an electrode of a piezoelectric element. Be connected in the way.

[0004]

As described above, the conventional convex type ultrasonic probe has a structure in which the electrodes are pulled out from one side surface of each piezoelectric element by the FPC, so that the wiring density is inevitable. The width of each conductor of the FPC becomes at least within the width of the piezoelectric element and becomes extremely small. Then, one FPC is set as one unit, the width of the ultrasonic probe is divided into a plurality of units, and the electrode is drawn out by one FPC for each piezoelectric element group of each unit. When connecting the FPC for each unit to an external circuit or a connector, a mechanical load is applied to the piezoelectric element group of the unit, and the piezoelectric element is separated from the backing member. Further, a failure occurs in which the connecting portion between the FPC and each piezoelectric element is disconnected.

Therefore, the present invention is intended to eliminate the above-mentioned conventional inconvenience, and an object of the present invention is to provide a convex type ultrasonic probe with an F connected to it.
It is to obtain a novel structure and a manufacturing method thereof in which the FPC does not easily peel off even if physical force is applied to the PC.

[0006]

In order to solve the above-mentioned technical problems, the present invention arranges a plurality of strip-shaped piezoelectric elements arranged in parallel on the convexly curved array arranging surface of a backing member. In the installed convex type ultrasonic probe,
The circuit arrangement surface provided on the side surface of the backing member is provided with a wiring circuit having one end electrically connected to the electrode of the piezoelectric element, and the other end of the wiring circuit is a jumper wire of a flexible printed circuit board. While providing a convex type ultrasonic probe characterized by being electrically connected, a step of forming a corner of a side edge of the backing member into a curved surface, and a surface of the backing member including the curved surface. A convex ultrasonic probe comprising: a step of drawing a wiring pattern to be connected to an electrode of a piezoelectric element with a solidifying conductive resin; and a step of hardening the conductive resin after the drawing operation. A manufacturing method is provided.

[0007]

A wiring circuit having one end electrically connected to the electrode of the piezoelectric element is provided on the circuit arrangement surface provided on the side surface of the backing member, and a jumper of the flexible printed circuit board is provided at the other end of the wiring circuit. A convex type ultrasonic probe is manufactured by connecting the ends of the wires. Further, according to the present invention, a corner of a side edge of the backing member is a curved surface, and a wiring pattern for connecting to an electrode of a piezoelectric element is drawn on the surface of the backing member including the curved surface with a solidifying conductive resin, It also includes a method of manufacturing a convex type ultrasonic probe by solidifying a conductive resin.

[0008]

Next, one embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the present invention. In FIG. 1, 2 is a backing member. On the surface of the backing member 2, an array arrangement surface 4 which is curved in a convex shape is formed. Further, both side surfaces of the backing member 2 are circuit arrangement surfaces 6, 6. A plurality of wiring circuits 8 ... For connecting to the electrodes of the piezoelectric element described later are formed on the circuit arrangement surfaces 6, 6. These wiring circuits 8
One end reaches the lower edge 10 and the upper end reaches the array placement surface 4 beyond the upper edge 12. For the wiring circuit 8, for example, an ultraviolet curable conductive resin or an ultraviolet curable conductive adhesive is prepared, and the jet nozzle filled with the conductive resin is computer-controlled so as to be printed in a predetermined pattern and solidified, or the entire surface of the backing member 2 is electrically conductive. After depositing the functional metal, this is selectively etched to obtain a predetermined pattern.

Next, a method of forming a plurality of piezoelectric elements on the array arrangement surface 4 will be described. As shown in FIG. 2, an acoustic matching layer 20 made of a glass layer or the like is provided on a portion of the surface of the electrode plate 16 excluding the lead-out electrode connecting portion, in which electrode plates 16 and 18 are adhered to both surfaces of a flat piezoelectric element plate 14. , 22 are provided, the outermost acoustic matching layer 22 is releasably attached to a backing plate 24 made of a flexible synthetic resin plate material. 2 is shown thicker than the actual piezoelectric element plate 14 and the backing plate 24 is shown thinly for the sake of clarity.

As shown in FIG. 3, a piezoelectric element 28 is formed by making a notch 26 from the electrode plate 18 side to the backing plate 24 using the cutter formed as described above.
The cut 26 may be deeply cut in the backing plate 24. Then, as shown in FIG. 4, an adhesive 19 is applied to the electrode plate 18, and in particular, a conductive adhesive is applied to a portion connected to the wiring circuit 8 to attach the piezoelectric element to the array arrangement surface 4 of the backing member 2. A plurality of piezoelectric elements are attached. The piezoelectric elements separated and formed into strips by this attaching operation are attached to the array-arranged surface 4 which is curved in a convex shape. When each piezoelectric element is sufficiently fixed to the array arrangement surface 4 of the backing member, the backing plate 24 attached to the upper surface of each piezoelectric element is peeled off as shown in FIG. At this time, the electrode plates 18 of the odd-numbered piezoelectric elements counted from the ends are electrically connected to the ends of the wiring circuit 8 extending from the one circuit arrangement surface 6, and the electrode plates 18 of the even-numbered piezoelectric elements are the other. It is electrically connected to the end portion of the wiring circuit 8 extending from the circuit arrangement surface 6. As can be seen from this, the wiring circuits 8 extending from each circuit arrangement surface 6 are connected to every other piezoelectric element arranged on the array arrangement surface 4.

As shown in FIG. 5, a plurality of FPCs 30 are provided at the end portion of the wiring circuit 8 led out to the connection portion B provided in the lower portion of the ultrasonic probe head A thus formed.
The conductor portion 32 exposed at the tip of is electrically and mechanically connected by a method such as soldering. In addition, 31 is FPC3
It is a connector attached to the lower end of 0.

FIG. 6 is a side view showing another embodiment of the present invention. In this embodiment, the wiring circuit 8 drawn out from the electrode plate 18 of the piezoelectric element adhered to the array arrangement surface 4 is not drawn out to the connecting portion B, and the connecting end C arranged in a fan shape in the middle thereof. Have been withdrawn. Reference numeral 34 is an FPC, and 35 is a conductor connecting the connection end C and the jumper wire 38 of the FPC 34. The tip of the FPC 34 is firmly bonded to the connecting portion B of the backing member 2. The exposed conducting wire 35 electrically connects the wiring circuit 8 and the jumper wire 38.

Next, a method for forming the wiring circuit 8 using an ultraviolet curable conductive resin or an ultraviolet curable conductive adhesive will be described in detail. First, in order to prevent disconnection of wiring of the wiring circuit 8 printed on the surface of the backing member 2, as shown in FIG. 7, curved surfaces 40 are formed at both ends of the array placement surface 4 of the backing member. Next, prepare a copying type numerical control device, set a copying type of the same type as the backing member prepared in advance in the copying section, and a wiring circuit in which the tip of the stylus installed in the copying type numerical control device is drawn on the model The printed circuit pattern is taught by tracing over the pattern 41.

On the other hand, a UV-curable conductive resin or a UV-curable conductive adhesive is prepared, and a nozzle for injecting fine particles of the conductive adhesive or conductive synthetic resin is installed in the copying type numerical control device for processing. A backing member for printing is set on the table. Then, by a numerical control operation, the nozzle and the backing member are moved relative to each other in accordance with the taught pattern to print a predetermined pattern on the surface of the backing member, and after the printing operation is finished, the printed pattern is irradiated with ultraviolet rays. To solidify. Since the structure for ejecting bubbles, the method for fixing the structure to the backing member, and the like are the same as the principle and structure of a known fine particle jet printer, detailed description thereof will be omitted.

Although the present invention has been described with reference to the above embodiments, various modifications and applications are possible within the scope of the gist of the present invention, and these modifications and applications are not excluded from the scope of the present invention. Absent.

[0016]

As described in detail above, the present invention is
A wiring circuit having one end electrically connected to the electrode of the piezoelectric element is provided on the circuit arrangement surface provided on the side surface of the backing member, and the other end of the wiring circuit is electrically connected to a jumper wire of the FPC. Since it has, the jumper wire of the FPC can be firmly connected to the circuit arrangement surface of the backing member. Therefore, even if an unreasonable physical force is applied to the FPC, the FPC will not be easily separated from the backing member. Further, when connecting the jumper wires of the FPC, the wiring circuit and the jumper wires can be connected on a wide circuit arrangement surface, so that the work can be performed very easily.

[Brief description of drawings]

FIG. 1 is a perspective view showing a backing member of the present invention.

FIG. 2 is a perspective view showing a state where a backing plate is attached to a piezoelectric element plate.

FIG. 3 is a cross-sectional view showing a state in which a piezoelectric element plate attached to a backing plate is cut.

FIG. 4 is a side view showing a state in which a piezoelectric element is attached to a backing member.

FIG. 5 is a front view showing a state in which an FPC is connected to a backing member.

FIG. 6 is a front view showing another embodiment of the present invention.

FIG. 7 is a perspective view for explaining the manufacturing method of the present invention.

[Explanation of symbols]

 A ... Ultrasonic probe head B ... Connection part C ... Connection end 2 ... Backing member 4 ... Array arrangement surface 6 ...・ Circuit placement surface 8 ・ ・ ・ Wiring circuit 10 ・ ・ ・ Low edge 12 ・ ・ ・ Upper edge 14 ・ ・ ・ Piezoelectric element plate 16 ・ ・ ・ Electrode plate 18 ・ ・ ・Electrode plate 19 Adhesive 20 Acoustic matching layer 22 Acoustic matching layer 24 Backing plate 26 Notch 28 Piezoelectric element 30 FPC 31 Connector 32 Conductor 34 FPC 35 36 Connector 38 Jumper wire 40 ... Curved surface 41 ... Circuit pattern

Claims (7)

[Claims] 1. A convex ultrasonic probe having a plurality of strip-shaped piezoelectric elements arranged side by side on a convexly curved array-arranged surface of a backing member. A circuit provided on a side surface of the backing member. A wiring circuit, one end of which is electrically connected to the electrode of the piezoelectric element, is provided on the arrangement surface,
A convex type ultrasonic probe, wherein the other end of the wiring circuit is electrically connected to a jumper wire of a flexible printed circuit board. 2. The convex type ultrasonic probe according to claim 1, wherein the wiring circuit is formed of an ultraviolet curable conductive adhesive. 3. The convex type ultrasonic probe according to claim 1, wherein the wiring circuit is a wiring circuit formed by etching a metal foil attached to a backing member. 4. A jumper wire arranged in parallel in the flexible printed circuit board is electrically connected to a wiring circuit via a conductive wire, and the flexible printed circuit board is connected to a backing member. The convex type ultrasonic probe according to claim 1, wherein the convex type ultrasonic probe is bonded. 5. The convex type ultrasonic probe according to claim 1, wherein a corner portion of a side edge portion of the backing member has a curved surface for preventing disconnection of wiring. 6. A method for manufacturing a convex type ultrasonic probe having a plurality of strip-shaped piezoelectric elements arranged side by side on a convexly curved array disposition surface of a backing member. The step of making the corners of the curved surface curved,
A step of drawing on the surface of the backing member including the curved surface a wiring pattern to be connected to the electrodes of the piezoelectric element with a solidifying conductive resin; and a step of solidifying the conductive resin after the drawing operation. A method for manufacturing a convex type ultrasonic probe. 7. The method for manufacturing a convex type ultrasonic probe according to claim 6, wherein the wiring pattern is drawn by an ink jet printing method.