JP2009066583A - Viscous fluid applying apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a viscus fluid applying apparatus capable of improving operation efficiency in the coating of a viscous fluid without making the apparatus large-sized. <P>SOLUTION: The viscus fluid applying apparatus 101 for applying a viscous fluid on a plurality of coating positions of a substrate is provided with a first nozzle 11a for discharging the viscous fluid, a second nozzle 12a provided to change the distance from the first nozzle 11a and for discharging the viscous fluid and a control part 30 for simultaneously coating a first coating position and another coating position on one substrate with the viscous fluid by simultaneously discharging the viscous fluid from the first nozzle and the second nozzle. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a viscous fluid coating apparatus for coating a printed circuit board with a viscous fluid necessary for component mounting.

  2. Description of the Related Art Conventionally, there is an apparatus for applying a viscous fluid necessary for component mounting such as cream solder and adhesive to a printed circuit board (hereinafter simply referred to as “substrate”). For example, there is an apparatus for applying cream solder to a substrate using a mask.

  According to this apparatus, the substrate is brought close to the lower surface of the mask, and the squeegee is slid on the mask. Thereby, the cream solder can be applied to a predetermined application position on the substrate through a plurality of holes opened in the mask.

  Thus, the cream solder can be applied to a plurality of application positions in a short time by using the mask.

  However, in recent years, parts to be mounted on a substrate have been downsized. Along with this, the application area per location of viscous fluid such as cream solder is reduced, and the distance between a plurality of application positions is also very short.

  For this reason, in a conventional apparatus using a mask, the holes of the mask are miniaturized and dense, and it has become difficult to apply cream solder accurately and reliably.

  In addition, when the cream solder application pattern is changed, it is necessary to change and adjust the mask each time, and there is a problem that so-called setup change takes time.

  Therefore, an apparatus for applying a viscous fluid to a substrate using a nozzle that discharges the viscous fluid without using a mask is also used.

  In such an apparatus, the viscous fluid is applied one place at a time, so that the working efficiency related to the application of the viscous fluid is relatively low as compared with an apparatus using a mask.

  Therefore, in a device for applying a viscous fluid to a substrate using a nozzle, a technique for improving production tact by performing a viscous fluid application operation on a plurality of substrates using a plurality of heads provided with nozzles is also disclosed ( For example, see Patent Document 1).

FIG. 22 is a diagram showing a main configuration of a conventional adhesive application device.
In the adhesive application device 200 shown in FIG. 22, each substrate 61 is individually positioned in a direction perpendicular to the transport direction by the movement of the tables 63 and 64. Further, the coating heads 67 and 68 are moved and moved in the conveying direction to be individually positioned.

  Each of the coating heads 67 and 68, which are multi-nozzle heads, has nozzles 71, 72, and 73 having different coating diameters. The adhesive is applied to the necessary positions of the two substrates 61.

In this way, the adhesive application device 200 improves the working efficiency related to the application of the adhesive to the substrate 61.
JP-A-9-141165

  The conventional adhesive application apparatus 200 is an apparatus that applies an adhesive to a substrate. However, such a method of applying a viscous fluid to a substrate using a nozzle can also be applied to the application of cream solder to the substrate.

  That is, by applying the cream solder to the substrate using the nozzle, the accuracy and certainty of the application of the cream solder to a minute range, which is difficult with the application method using the mask, is improved.

  However, the conventional adhesive application device 200 is nothing but a configuration that improves work efficiency by performing application work of viscous fluid on a plurality of substrates in parallel by an application line composed of a plurality of application units. .

  With such a configuration, the number of coatings per unit time is improved as compared with coating with a single coating unit. However, it is necessary to control the operation of the coating unit for each substrate that each coating unit is responsible for, and the processing related to the control becomes complicated.

  Further, the improvement in work efficiency is an increase in the number of coating units, and the improvement in work efficiency leads to an increase in the size of the entire apparatus and an increase in cost.

  In addition, as for the motor and the like constituting the device, each device is required to have high speed. As a result, the output required for each motor, the processing capacity required for the control device, and the like are increased, leading to an increase in the cost of the entire facility.

  The present invention provides an apparatus for applying a viscous fluid to a substrate in consideration of the above-described conventional problems, and improving the working efficiency related to application of the viscous fluid without increasing the size of the apparatus. With the goal.

  In order to achieve the above object, a viscous fluid application apparatus according to the present invention is a viscous fluid application apparatus that applies a viscous fluid to a plurality of application positions on a substrate, the first nozzle discharging the viscous fluid, The distance between the first nozzle and the first nozzle can be changed. The second nozzle that discharges the viscous fluid, and the first nozzle and the second nozzle simultaneously discharge the viscous fluid to form one substrate. And control means for simultaneously applying the viscous fluid to the one application position and the other application position.

  Thus, the viscous fluid coating apparatus of the present invention includes two nozzles that discharge viscous fluid, and can change the distance between nozzles. Furthermore, the control means which discharges viscous fluid to two nozzles simultaneously is provided.

  In the viscous fluid application device of the present invention, the distance between the nozzles is variable as described above, and the two nozzles simultaneously discharge the viscous fluid, whereby the viscosity is simultaneously applied to two application positions on one substrate. A fluid can be applied.

  In addition, it is possible to sequentially perform an efficient viscous fluid application operation with simultaneous application on a plurality of substrates having different arrangements of application positions.

  Therefore, the present invention can provide a viscous fluid application device that improves the working efficiency related to application of a viscous fluid without increasing the size of the device.

  In this specification and the like, the term “one substrate” includes various substrates handled as one substrate. For example, a single substrate includes a so-called multi-sided substrate that is handled as one substrate at the time of operations such as application of viscous fluid or component mounting, and is subsequently divided into a plurality of substrates.

  In addition, in the present specification and the like, the term “simultaneous application” includes not only the case where the application periods of the viscous fluid by the respective nozzles completely match, but also the case where at least part of the application period of the viscous fluid by each nozzle overlaps. . The same applies to the case of “simultaneously discharging”.

  Further, the substrate includes: a base that holds the first nozzle and holds the second nozzle such that a distance between the first nozzle and the first nozzle can be changed; and the base and the substrate. Drive means for changing a relative position on a plane parallel to the surface to which the viscous fluid is applied may be provided.

  Thereby, for example, the viscous fluid application device of the present invention can be realized as a viscous fluid application device having two nozzles and having one multi-nozzle head capable of changing the distance between the nozzles.

  Furthermore, a change means for changing an inter-nozzle distance between the first nozzle and the second nozzle, and an acquisition means for acquiring application data which is data indicating a plurality of application positions on the substrate are provided. The control means is further configured so that the first nozzle is positioned on the one application position based on the application data before the viscous fluid is simultaneously discharged to the first nozzle and the second nozzle. Further, the drive unit may change the relative position, and the change unit may change the inter-nozzle distance so that the second nozzle is positioned on the other application position.

  In this way, by obtaining the application data and changing the relative position between the substrate and the substrate and the distance between the nozzles based on the application data, for example, the application operation can be efficiently performed on many different substrates. I can go.

  Further, the control means further determines the one application position from the plurality of application positions based on the application data, and the first nozzle is positioned on the determined one application position. Further, it may have a determining means for determining an application position within the application possible range of the second nozzle as the other application position.

  In this way, by determining the application position to be assigned to each nozzle from a plurality of application positions based on the acquired application data, for example, a combination of a nozzle and an application position that improves the efficiency of the application work most. Can be determined.

  Further, the control means may change the relative position so that the first nozzle is positioned on the one application position by moving the substrate by the driving means.

  That is, the present invention is, for example, a viscous fluid application apparatus configuration that applies a viscous fluid to a plurality of application positions on a substrate by moving a base including two nozzles in a direction parallel to the substrate while the substrate is stationary. realizable.

  Further, the apparatus further comprises a table on which the substrate is placed and movable in a direction parallel to a surface of the substrate to which the viscous fluid is applied, and the control means moves the table to the driving means. The relative position may be changed so that the first nozzle is positioned on the one application position.

  That is, the present invention is, for example, a viscous fluid application device that applies viscous fluid to a plurality of application positions on a substrate by moving a table on which the substrate is placed in a direction parallel to the substrate while the base is stationary. realizable.

  In addition, the present invention can be realized as a viscous fluid coating method including the operation of the characteristic components of the viscous fluid coating apparatus of the present invention.

  Furthermore, the present invention is realized as a program including characteristic steps in the viscous fluid application method of the present invention, realized as a storage medium such as a CD-ROM storing the program, or realized as an integrated circuit. You can also. The program can also be distributed via a transmission medium such as a communication network.

  ADVANTAGE OF THE INVENTION According to this invention, it is an apparatus which apply | coats a viscous fluid to a board | substrate, Comprising: The viscous fluid application apparatus which improves the working efficiency which concerns on application | coating of a viscous fluid, without enlarging an apparatus can be provided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
First, the configuration of the viscous fluid applying apparatus 101 according to the first embodiment will be described with reference to FIGS.

FIG. 1 is a top view showing a main configuration of the viscous fluid applying apparatus 101 according to the first embodiment.
A viscous fluid applying apparatus 101 shown in FIG. 1 is an apparatus for applying cream solder, which is a kind of viscous fluid necessary for mounting components on a substrate, to the substrate.

  As shown in FIG. 1, the viscous fluid coating apparatus 101 includes a coating unit 10, a table 15, a beam 16, a Y-axis motor 17, an X-axis motor 18, a carry-in unit 19, and a carry-out unit 20. Is provided.

  The application unit 10 is a component that applies cream solder to the substrate 50, and includes a base body 10 a, a first head 11, a second head 12, a recognition unit 13, and an inter-nozzle distance changing unit 14.

  The coating unit 10 includes a plurality of nozzles as described above, and is a kind of multi-nozzle head.

  Each of the first head 11 and the second head 12 is a component that includes a nozzle (not shown in FIG. 1) in the direction of the table 15 and applies cream solder to the substrate 50 placed on the table 15.

  The second head 12 is held by the base body 10a so that the distance from the first head 11 can be changed.

The recognition unit 13 is a component that optically recognizes the recognition mark attached to the substrate 50.
When the recognition unit 13 recognizes at least two recognition marks attached to the substrate 50, position correction or the like at the time of applying the cream solder is performed.

  The inter-nozzle distance changing unit 14 is a component that changes the inter-nozzle distance between the nozzles of the first head 11 and the nozzles of the second head 12.

  Specifically, the first head 11 does not move in the Y-axis direction with respect to the base body 10a, and the second head 12 is moved to the side surface of the base body 10a by means of an inter-nozzle distance changing unit 14 constituted by, for example, a motor and a ball screw. Move up in the Y-axis direction.

  As a result, the distance between the nozzles of the first head 11 and the nozzles of the second head 12 is changed.

  That is, the viscous fluid coating apparatus 101 is an apparatus including one multi-nozzle head (coating unit 10) that can change the distance between two nozzles.

  The weight of the second head 12 is light compared to the weight of the coating unit 10, and the moving distance of the second head 12 is short compared to the moving distance of the coating unit 10.

  Therefore, a motor having a smaller output than the Y-axis motor 17 and the X-axis motor 18 is employed as the motor included in the inter-nozzle distance changing unit 14.

  The table 15 is a component that places the substrate 50 carried in by the carry-in unit 19. The substrate 50 placed on the table 15 and coated with cream solder is unloaded by the unloading unit 20.

  The table 15 has a mechanism for receiving and holding the substrate 50 carried in by the carry-in unit 19 at a predetermined position and holding it, and sending it out to the carry-out unit 20 after applying the cream solder. In addition, this mechanism is a conventional technique and will not be described and illustrated.

  The table 15 is not limited to such a form. For example, the form may be such that the substrate 50 is fixed at a predetermined position and the back surface of the substrate 50 is supported by support pins.

  The beam 16 is a component that holds the coating unit 10 so as to be movable in the Y-axis direction. The movement of the coating unit 10 in the Y-axis direction is driven by a Y-axis motor 17.

The beam 16 is driven to move in the X-axis direction by an X-axis motor 18.
In this way, the application unit 10 is moved in a direction parallel to the surface of the substrate 50 to which the cream solder is applied, that is, on a plane parallel to the XY plane, by the Y-axis motor 17 and the X-axis motor 18. Is driven.

  The X and Y axis directions of the XY plane defined on the surface on which the components of the substrate 50 are mounted and the XY plane formed by driving the X axis motor 18 and the Y axis motor 17 are the same. So that it is adjusted.

  Note that at least one of the Y-axis motor 17 and the X-axis motor 18 implements a driving unit in the viscous fluid applying apparatus of the present invention.

FIG. 2 is an enlarged perspective view showing the appearance of the vicinity of the coating unit 10 of the first embodiment.
As shown in FIG. 2, the first head 11 includes a first nozzle 11 a that discharges cream solder, and the second head 12 includes a second nozzle 12 a that discharges cream solder.

  The first head 11 does not move in the XY direction with respect to the base body 10a, but moves in the Z-axis direction. The second head 12 moves in the Y-axis direction with respect to the base body 10a as described above, and also moves in the Z-axis direction.

  The first head 11 and the second head 12 are driven to move in the Z-axis direction by a motor provided inside the base body 10a.

  The positions of the first head 11, the second head 12, and the coating unit 10 are controlled by the control unit 30 described later via each motor that drives these movements.

  That is, the cream solder is applied to a predetermined application position on the substrate 50 under the control of the control unit 30.

  FIG. 3A is a diagram showing the positions of the first nozzle 11a and the second nozzle 12a in each head.

  As shown in FIG. 3A, each of the first nozzle 11a and the second nozzle 12a is disposed on the inner side so that the distance between the nozzles is shortened when the first head 11 and the second head 12 approach each other. Yes.

  Thereby, it becomes possible to apply | coat cream solder simultaneously to two application | coating positions which adjoined.

  In addition, the control part 30 controls the discharge amount of the 1st nozzle 11a and the 2nd nozzle 12a based on the application | coating data mentioned later.

  FIG. 3B is a diagram illustrating an example of a configuration for controlling the discharge amounts of the first nozzle 11a and the second nozzle 12a. In FIG. 3B, a dotted line extending from the air pressure source indicates an air path.

  As shown in FIG. 3B, each of the first nozzle 11 a and the second nozzle 12 a is connected to an air pressure source via the pressure control unit 21. The pressure control unit 21 is realized by an electromagnetic valve that can change the flow rate of air, for example.

  In addition, each pressure control part 21 of the 1st nozzle 11a and the 2nd nozzle 12a can be independently controlled by the control part 30. FIG.

  The control unit 30 controls the pressure control unit 21 to control the discharge amount of the cream solder of each of the first nozzle 11a and the second nozzle 12a.

  The control unit 30 can be realized by a computer having a central processing unit (CPU), a storage device, and an interface for inputting and outputting information.

  In addition, the mechanism in which the 1st nozzle 11a and the 2nd nozzle 12a discharge cream solder is not restricted to what utilizes such an air pressure.

  For example, a mechanism for controlling the start and end of the discharge of cream solder and the discharge amount using the vibration of the piezo element may be employed.

  FIG. 4 is a block diagram illustrating a main configuration of the viscous fluid applying apparatus 101 according to the first embodiment.

  As shown in FIG. 4, in addition to the mechanism unit 25 including the above-described coating unit 10 and the like, the viscous fluid coating apparatus 101 includes a control unit 30, a storage unit 33, an operation unit 34, and a functional configuration. And a display unit 35.

  The control unit 30 is a component that controls the operation of the mechanism unit 25, and includes an acquisition unit 31 and a determination unit 32.

  The acquisition unit 31 is a component that acquires application data that is data indicating a plurality of application positions on the substrate. In the present embodiment, the acquisition unit 31 acquires application data from the storage unit 33. However, for example, application data may be acquired through communication with another apparatus.

  The determination unit 32 is a component that determines two application positions at which each of the first nozzle 11a and the second nozzle 12a applies cream solder based on the application data acquired by the acquisition unit 31.

  Specifically, the determination unit 32 determines one application position from a plurality of application positions indicated in the application data, and the second nozzle when the first nozzle 11a is positioned on the determined one application position. The application position within the application possible range of the nozzle 12a is determined as another application position.

  The control unit 30 can control the positions of the coating unit 10, the first head 11, and the second head 12 by controlling the operation of the Y-axis motor 17 and the like based on the determination by the determination unit 32.

  The storage unit 33 is a storage device that stores the above-described application data. The application data includes necessary information such as application pressure and application amount in addition to information indicating a plurality of application positions for each substrate.

  The operation unit 34 is a keyboard or the like for an operator of the viscous fluid applying apparatus 101 to input an instruction such as start of application.

  The display unit 35 is a liquid crystal monitor or the like that presents the state of the viscous fluid applying apparatus 101 to the operator.

  Next, the operation of the viscous fluid applying apparatus 101 according to the first embodiment will be described with reference to FIGS.

  FIG. 5 is a flowchart showing an outline of the operation flow of the viscous fluid applying apparatus 101 according to the first embodiment.

  The determination unit 32 reads application data from the storage unit 33. Furthermore, one application position where the first nozzle 11a applies is determined from among a plurality of application positions (S1).

  Next, the determination unit 32 checks whether or not the application position is within the application possible range of the second nozzle 12a when the first nozzle 11a is positioned on the determined application position (S2).

  If there is a corresponding application position (Yes in S2), one application position to be applied by the second nozzle 12a is determined from the corresponding application positions (S3).

  Thereafter, when the nozzles (first nozzle 11a or second nozzle 12a) in charge of application for all application positions have not been determined (No in S4), the application position for application by the first nozzle 11a is determined (S1). Transition.

  Thus, when the nozzles in charge of application for all application positions are determined (Yes in S4), the application of cream solder to each application position by the first nozzle 11a and the second nozzle 12a are performed according to the determined order. The adhesive is applied to each application position (S5).

  A specific example of the operation related to the application of the cream solder of the viscous fluid applying apparatus 101 described above will be described with reference to FIGS.

FIG. 6 is a diagram illustrating an example of an arrangement of application positions on the substrate 50.
In FIG. 6, two application positions such as A1 and B1, A2 and B2,..., C1 and D1 that face each other in the A row and the B row and the C row and the D row are one chip. Corresponds to parts.

  In addition, since both ends of a chip component are generally soldered to the substrate, there are two sets of application positions on the substrate in this way.

  FIG. 7A is a diagram for explaining an application order or the like when applying cream solder to the substrate 50 shown in FIG.

  When the application position is arranged as shown in FIG. 7 (A), the determination unit 32 is, for example, the most on the application unit 10 side (left side in FIG. 7 (A)) among the plurality of application positions and the most. A1 on the first nozzle 11a side (the lower side in FIG. 7A) is determined as the application position where the first nozzle 11a applies first.

  Furthermore, when A1 is used as a reference, that is, when the first nozzle 11a is positioned on A1, any one of B1, C1, and D1 included in the applicable range of the second nozzle 12a is set as the second nozzle 12a. Assign to.

  Here, when D1 is assigned to the second nozzle 12a, the first nozzle 11a and the second nozzle 12a are simultaneously applied to the application positions of the A row and the D row by the first nozzle 11a and the second nozzle 12a. It is also conceivable to change the distance to 12a and simultaneously apply each coating position in the B row and the C row.

  However, when B1 is assigned to the second nozzle 12a, the distance between the first nozzle 11a and the second nozzle 12a is adjusted to the distance between A1 and B1, for example, (A1, B1), (A2, B2), (A3, B3), (A4, B4), (C4, D4), (C3, D3), (C2, D2), (C1, D1) in order of cream solder to all application positions Can be applied.

  In addition, when describing (P, Q), P shows the application position where the 1st nozzle 11a applies cream solder, and Q shows the application position where the 2nd nozzle 12a applies cream solder. The same applies to the following description.

  In addition, when C1 is assigned to the second nozzle 12a, for example, (A1, C1),..., (A4, C4), (B4, D4),. Cream solder can be applied to the application position.

  Further, when B1 is assigned to the second nozzle 12a (pattern α) and C1 is assigned to the second nozzle 12a (pattern β), the movement distance in the X-axis direction from the start to the end of application of the application unit 10 is compared. Are the same.

  However, the movement distance from the start to the end of application in the Y-axis direction of the application unit 10 is shorter in the pattern β.

  Specifically, in the pattern α, the movement distance of the coating unit 10 in the Y-axis direction is the movement distance when moving from (A4, B4) to (C4, D4), and between the A row and the C row. Distance (= distance between row B and row C).

  On the other hand, in the pattern β, the movement distance in the Y-axis direction of the coating unit 10 is a movement distance when moving from (A4, C4) to (B4, D4), and between the A row and the B row. Distance (= distance between column C and column D).

  From the above, the movement distance from the start to the end of application of the application unit 10 is shorter in the pattern β than in the pattern α.

  In addition, since the pattern β has a longer distance between the first nozzle 11a and the second nozzle 12a, the moving distance of the second nozzle 12a before the start of application may be longer than when the pattern α is employed. .

  However, as described above, the motor included in the inter-nozzle distance changing unit 14 has a smaller output than the Y-axis motor 17, and the movement of the second nozzle 12a is also a relatively short distance.

  That is, the pattern β having a shorter moving distance of the coating unit 10 requires less power consumption for the coating operation.

  Accordingly, the determination unit 32 determines C1 as the application position where the first nozzle 11a applies cream solder to A1 and the second nozzle 12a applies cream solder.

  Next, the determination unit 32 determines A2 closest to A1 as the application position where the first nozzle 11a applies the cream solder next. Further, C2 which is an application position where the second nozzle 12a can apply the cream solder without changing the inter-nozzle distance is determined.

In this way, the determination unit 32 sequentially determines the application position of each nozzle.
FIG. 7B is a diagram illustrating an example of the application order and nozzle assignment determined by the determination unit 32.

  When the application order and the nozzle assignment are determined in this way, the control unit 30 refers to the application data and controls the operations of the Y-axis motor 17 and the X-axis motor 18 so that the first nozzle 11 a The coating unit 10 is moved so as to be positioned on A1.

  That is, the control unit 30 moves the base body 10a to change the relative position between the base body 10a and the substrate 50 so that the first nozzle 11a is positioned on A1.

Further, the control unit 30 causes the inter-nozzle distance changing unit 14 to change the inter-nozzle distance so that the second nozzle 12a is positioned on C1. As a result, the inter-nozzle distance becomes L _n 1 shown in FIG.

If the distance between the first nozzle 11a and the second nozzle 12a is already L _n 1 before the change, this change is not performed.

Thereafter, the control unit 30 applies the cream solder simultaneously to the application positions in the order shown in FIG. 7B while keeping the first nozzle 11a and the second nozzle 12a at the distance L _n 1. And the discharge of cream solder from the first nozzle 11a and the second nozzle 12a are controlled.

  Thereby, the cream solder is applied to all application positions A1 to D4. Moreover, compared with the case where no simultaneous application is performed, the application operation is completed in approximately half the time.

  Here, the application position of the cream solder on the substrate corresponds to a plurality of chip components and corresponds to an integrated circuit (IC) in addition to the arrangement shown in FIG. 6 and the like, and the arrangement shown in FIG. It may become.

  FIG. 8A is a first diagram for explaining the order of applying the cream solder to the IC region on the substrate 50.

  In the case of an IC, the electrodes are arranged at equal intervals on the periphery of the rectangular main body, and the solder application position on the substrate 50 is arranged as shown in FIG. 8A, for example.

  In FIG. 8A, both the H row and the J row are parallel to the Y axis, and the straight line connecting the application positions with the same numbers is parallel to the X axis. For example, H10 and J10 are on a straight line parallel to the X axis.

  Further, both the G row and the K row are parallel to the X axis, and the straight line connecting the application positions with the same numbers is parallel to the Y axis. For example, G10 and K10 are on a straight line parallel to the Y axis.

  When the application position is arranged in this way, the determination unit 32 sets, for example, H10 that is closest to the application unit 10 and that is closest to the first nozzle 11a as the application position where the first nozzle 11a applies first. decide.

  Furthermore, when H10 is used as a reference, any one of H1 to H9 included in the applicable range of the second nozzle 12a is assigned to the second nozzle 12a.

  Here, in the case of simultaneous application with two nozzles for 10 application positions of H1 to H10, all the nozzles are in charge of 5 places.

  Furthermore, in order to apply all at the same time without changing the distance between the nozzles, H9 and H5 can be considered as the application positions where the second nozzle 12a applies the cream solder first.

  That is, two adjacent application positions are taken as a set, and the application is performed in the order of (H10, H9), (H8, H7),. It is conceivable that each nozzle is applied in the order of (H10, H5), (H9, H4),..., (H6, H1).

  Comparing the movement distances of the coating unit 10 in these two cases, the former is the distance between H10 and H2, and the latter is the distance between H10 and H6. Therefore, the latter application order and nozzle assignment are more efficient because the movement distance of the application unit 10 is smaller.

  Accordingly, the determination unit 32 determines that the application position where the second nozzle 12a first applies the cream solder is H5.

  The determination unit 32 further determines positions where the first nozzle 11a and the second nozzle 12a are shifted in the direction of decreasing the number one by one as the application positions where the cream solder is applied.

  FIG. 8B is a diagram showing the application order and nozzle assignment determined by the determination unit 32 in this way.

By this determination, the first nozzle 11a and the second nozzle 12a simultaneously apply cream solder to each application position of the H row that they are in charge of while maintaining the distance between them at L _n 2; Become.

  When the determination unit 32 determines the application order and nozzle allocation for the H row in this way, the application is performed for the G row and the K row that are close to the application unit 10 at the end of cream solder application to the H row. Determine order and nozzle assignment.

  FIG. 9A is a second diagram for explaining the application sequence of the cream solder to the IC region on the substrate 50 and the like.

  At the end of application of cream solder to the H row, the first nozzle 11a exists on H6. Therefore, the determination unit 32 determines G1 closest to the first nozzle 11a among the application positions in the G row as the application position where the first nozzle 11a applies next to H6.

  Furthermore, when G1 is used as a reference, K1 included in the applicable range of the second nozzle 12a is assigned to the second nozzle 12a.

  The determination unit 32 further determines positions where the first nozzle 11a and the second nozzle 12a are shifted in the direction of increasing the number one by one as the application positions where the cream solder is applied.

  FIG. 9B is a diagram showing the application order and nozzle assignment determined by the determination unit 32 in this way.

By this determination, the first nozzle 11a and the second nozzle 12a simultaneously apply cream solder to each application position of the G row or K row that they are in charge of while maintaining the distance between them at L _n 3. Will be.

  When the determination unit 32 determines the application order and nozzle assignment for the G and K rows in this manner, the determination unit 32 determines the application order and nozzle assignment for the remaining J rows.

  FIG. 10A is a third diagram for explaining the order of applying the cream solder to the IC region on the substrate 50.

  The first nozzle 11a exists on G10 at the end of application of cream solder to the G row and the K row. Therefore, the determination unit 32 determines J10 closest to the first nozzle 11a among the application positions in the J row as the application position where the first nozzle 11a applies next to G10.

  Here, the J column is a column in which the same number of application positions are arranged in the same direction as the H column in which the application order and nozzle assignment have been determined previously.

  Therefore, as in the case of the H row, the determination unit 32 assigns J5 serving as one starting point when the ten application positions are divided at the center of the row to the second nozzle 12a.

  The determination unit 32 further determines positions where the first nozzle 11a and the second nozzle 12a are shifted in the direction of decreasing the number one by one as the application positions where the cream solder is applied.

  FIG. 10B is a diagram showing the application order and nozzle assignment determined by the determination unit 32 in this way.

By this determination, the first nozzle 11a and the second nozzle 12a simultaneously apply cream solder to each application position in the J row that they are in charge of while maintaining the distance between them at L _n 2; Become.

  Through the flow as described above, nozzles for applying cream solder are determined for all application positions in the H, G, K, and J rows, and the application order is also determined.

  The control unit 30 controls the operation of the mechanism unit 25 in accordance with this determination. As a result, the viscous fluid applying apparatus 101 executes the application of the cream solder to all application positions in the H row, the G row, the K row, and the J row of the IC region on the substrate 50.

  In general, a chip component area and an IC area coexist on one substrate. Furthermore, there may be a region on the substrate where an odd-numbered component (hereinafter referred to as “special component”) such as one or three contacts with the substrate is mounted.

  Therefore, the operation of the viscous fluid applying apparatus 101 in the case where various regions with different arrangements of application positions exist on one substrate will be described with reference to FIGS. 11 and 12.

  FIG. 11 is a diagram illustrating an example of the substrate 50 in which various regions having different arrangements of application positions exist.

  In FIG. 11, each application position in the IC area is the same as each application position shown in FIG. 8A, and each application position in the chip part area is the same as each application position shown in FIG. is there. The special part area is an area where two special parts are mounted, and each of M1 and M2 is a cream solder application position for mounting one special part.

  As shown in FIG. 11, when the IC area, the chip part area, and the special part area exist on the substrate 50, the viscous fluid applying apparatus 101 performs, for example, the cream in the order of the IC area, the chip part area, and the special part area. Perform solder application.

  Specifically, for the IC region, the application order described with reference to FIGS. 8A to 10B is determined, and cream solder is applied according to the determination.

  For the chip component region, the application order described with reference to FIGS. 7A and 7B is determined, and cream solder is applied according to the determination.

  Further, in the special component region, M1 and M2 are not arranged along the arrangement direction (Y-axis direction) of the first nozzle 11a and the second nozzle 12a, so simultaneous application is impossible.

  Therefore, the determination unit 32 determines that cream solder is applied to M1 and M2 on the second nozzle 12a close to the special component region.

  FIG. 12 is a time chart showing a flow of operation of the viscous fluid applying apparatus 101 when cream solder is applied to the substrate 50 shown in FIG.

  In FIG. 12, “XY robot” means the entire mechanism including the Y-axis motor 17, the X-axis motor 18, the beam 16, and the like that moves the coating unit 10 in the Y-axis direction and the X-axis direction.

  As shown in FIG. 12, the application unit 10 first moves to an initial position for application of cream solder to the IC region.

At this time, the distance between the first nozzle 11a and a second nozzle 12a is changed to L _n 2.

  Thereafter, simultaneous application to the H rows by the first nozzle 11a and the second nozzle 12a is executed while sandwiching the upward movement in the drawing parallel to the Y axis of the application unit 10.

  When application to the H row is completed, the application unit 10 moves to an initial position for applying cream solder to the G row and the K row.

At this time, the distance between the first nozzle 11a and the second nozzle 12a is changed to L _n 3.

  Thereafter, simultaneous application to the G row and the K row by the first nozzle 11a and the second nozzle 12a is executed while sandwiching the movement of the coating unit 10 in the right direction in the drawing parallel to the X axis.

  When application to the G row and the K row is completed, the application unit 10 moves to an initial position for applying cream solder to the J row.

At this time, the distance between the first nozzle 11a and a second nozzle 12a is changed to L _n 2.

  Thereafter, simultaneous application to the J rows by the first nozzle 11a and the second nozzle 12a is performed while sandwiching the upward movement in the drawing parallel to the Y axis of the application unit 10.

  When the application of the cream solder to the IC area is thus completed, the application unit 10 moves to the initial position for applying the cream solder to the chip part area.

At this time, the distance between the first nozzle 11a and a second nozzle 12a is changed to L _n 1.

  Thereafter, simultaneous application to A1 to A4 and C1 to C4 by the first nozzle 11a and the second nozzle 12a is performed while sandwiching the movement of the application unit 10 in the right direction in the drawing parallel to the X axis.

  When the application of the cream solder to A4 and C4 is completed, the application unit 10 moves in parallel to the Y axis so that the first nozzle 11a is positioned on D4. By this movement, the second nozzle 12a is positioned on B4.

  Thereafter, simultaneous application to B4 to B1 and D4 to D1 by the first nozzle 11a and the second nozzle 12a is executed while sandwiching the movement of the application unit 10 in the left direction in parallel with the X axis.

  When the application of cream solder to the chip component area is completed in this way, the application unit 10 moves to the initial position for applying the cream solder to the special component area.

  Specifically, at the end of the application of cream solder to the chip component area, the application unit 10 moves so that the second nozzle 12a existing near the special component area is positioned above M1.

  After this movement, cream solder is applied by the second nozzle 12a in the order of M1 and M2.

  As described above, the viscous fluid coating device 101 includes the first nozzle 11a and the second nozzle 12a that can change the distance between each other. A viscous fluid can be efficiently applied with two nozzles.

  Further, for example, immediately after the simultaneous application of cream solder to the substrate 50 shown in FIG. 7A by these two nozzles, the cream solder to the substrate 50 shown in FIG. Can be applied simultaneously.

  In other words, unlike the conventional viscous fluid application apparatus, the application of the viscous fluid to one substrate by one nozzle is performed in parallel, so that the working efficiency related to the application of the viscous fluid is not improved. By realizing the simultaneous application of the viscous fluid to one substrate, the working efficiency related to the application of the viscous fluid can be improved.

It should be noted that simultaneous application is not always possible for all application positions on every substrate.
For example, when there are two application positions on the substrate and the distance between the two application positions is not within the maximum distance between the first nozzle 11a and the second nozzle 12a, and when M1 and M2 shown in FIG. Thus, when two application positions are not aligned along the alignment direction (Y-axis direction) of the first nozzle 11a and the second nozzle 12a, simultaneous application of cream solder to the two application positions is not possible. Can not.

  However, for these two application positions, either the first nozzle 11a or the second nozzle 12a can apply cream solder. That is, even with such a substrate, the viscous fluid applying apparatus 101 can complete the application of cream solder without any problem.

  These nozzles are provided in one base 10a, and the distance between the nozzles is changed by the inter-nozzle distance changing unit 14 included in the base 10a.

  The inter-nozzle distance changing unit 14 only changes the relative position of the second nozzle 12a with respect to the first nozzle 11a, and can be realized by a small output motor as described above.

  That is, the only motor for changing the position of the entire mechanism for applying the viscous fluid to the substrate is a set of motors (the Y-axis motor 17 and the X-axis motor 18) for moving the application unit 10.

  Therefore, the viscous fluid coating apparatus 101 can efficiently apply the viscous fluid to the substrate also from the viewpoint of power consumption.

  Thus, the viscous fluid coating apparatus 101 according to the present embodiment can improve the working efficiency related to the application of viscous fluid without increasing the size of the apparatus.

  Note that each of the coating order and the nozzle assignment described with reference to FIG. 7A and the like is an example, and is not limited to the coating order described above.

For example, when applying cream solder to the substrate 50 having the IC region shown in FIG. 8A, the distance between the first nozzle 11a and the second nozzle 12a is kept at L _n 2 and the H row You may perform simultaneous application | coating continuously with J row | line | column.

In this case, after continuously applying to the H row and the J row, the inter-nozzle distance is changed to L _n 3 and the first nozzle 11a and the second nozzle 12a are simultaneously applied to the G row and the K row. Should be executed.

  Further, in each of the chip component area and the IC area shown in FIG. 11, even coating positions are arranged in the arrangement direction of the first nozzle 11a and the second nozzle 12a, that is, the Y-axis direction.

  However, the viscous fluid application device 101 applies cream solder efficiently using two nozzles even when odd-numbered application positions are aligned in the Y-axis direction, as in the case where even-numbered application positions are aligned. Can do.

  For example, in the IC region, when nine application positions H1 to H9 are arranged in the Y-axis direction, the determination unit 32 divides eight places obtained by subtracting one place of H1 from nine places at the center (H9, The order of (H5), (H8, H4), (H7, H3), (H6, H2) is determined.

  Further, the remaining H1 is determined so that the second nozzle 12a close to H1 is applied with cream solder at the end of the simultaneous application of (H6, H2).

  The control unit 30 causes the first nozzle 11a and the second nozzle 12a to apply cream solder to each application position in accordance with the order and nozzle assignment determined in this way.

  In addition, at the time of the last application | coating of H1, the whole coating unit 10 does not move, but only the 2nd nozzle 12a moves to a Y-axis direction, and applies cream solder to H1.

  In this way, the cream solder can be applied to all nine application positions in the H row, and the application of the cream solder to the H row can be completed in nearly half the time when no simultaneous application is performed. it can.

  Further, in the present embodiment, the case where the viscous fluid application device 101 applies cream solder to a substrate having a plurality of application positions arranged at equal intervals has been described.

  However, the substrate to which the viscous fluid applying apparatus 101 is to be applied with cream solder is not limited to such a substrate.

  Among the plurality of application positions on the substrate, there are at least two application positions on a straight line parallel to the arrangement direction of the first nozzle 11a and the second nozzle 12a, and the distance between the two application positions is the first nozzle. If it is within the maximum distance between 11a and the second nozzle 12a, cream solder can be applied simultaneously to the two application positions.

  In other words, two application positions where cream solder can be applied simultaneously by the first nozzle 11a and the second nozzle 12a are applied simultaneously, and the other application positions are either the first nozzle 11a or the second nozzle 12a. Apply cream solder.

  As described above, the viscous fluid applying apparatus 101 can selectively perform simultaneous application of cream solder by a plurality of nozzles and single application of cream solder by one nozzle at a plurality of application positions on the substrate.

  Therefore, even with such a substrate, the coating operation can be completed in a shorter time than when no simultaneous coating is performed.

  Moreover, the viscous fluid application apparatus 101 of this Embodiment can also be used as an apparatus which apply | coats viscous fluids other than cream solder to members, such as a board | substrate.

  For example, the viscous fluid applying apparatus 101 may be used as an apparatus for applying an adhesive, which is a kind of viscous fluid, for fixing a component to a substrate.

  The various supplementary matters regarding the viscous fluid coating apparatus 101 of the present embodiment described above are also applied to the viscous fluid coating apparatuses 102 to 105 of the second to fifth embodiments described below.

(Embodiment 2)
As a second embodiment of the present invention, a viscous fluid coating apparatus 102 in which the coating unit 10 is movable not only in the Y axis direction but also in the X axis direction with respect to the beam 16 will be described.

FIG. 13 is a top view illustrating a main configuration of the viscous fluid applying apparatus 102 according to the second embodiment.
A viscous fluid applying apparatus 102 shown in FIG. 13 is an apparatus that applies cream solder to a substrate, similar to the viscous fluid applying apparatus 101 of the first embodiment.

  Similarly to the viscous fluid applying apparatus 101, the application unit 10, the table 15, the beam 16, the Y-axis motor 17, the X-axis motor 18, the carry-in unit 19, and the carry-out unit 20 are provided. The operation of these components is controlled by the control unit 30 in the same manner as the viscous fluid applying apparatus 101.

  However, in the viscous fluid coating device 102, the coating unit 10 is attached to the beam 16 via the sub beam 16a. Further, the coating unit 10 is movable in the X-axis direction with respect to the sub beam 16a.

  That is, the coating unit 10 can move not only in the Y-axis direction with respect to the beam 16 but also in the X-axis direction.

FIG. 14 is an enlarged perspective view showing the appearance of the vicinity of the coating unit 10 of the second embodiment.
As shown in FIG. 14, the coating unit 10 is attached to, for example, the lower surface of the sub beam 16a, and moves in the X-axis direction along the sub beam 16a by a motor included in the base 10a.

  The movement of the coating unit 10 in the X-axis direction is controlled by the control unit 30. Further, the movable direction and movable range in the coating unit 10 of the first head 11 and the second head 12 are the same as those in the first embodiment.

  Accordingly, when the cream solder is sequentially applied to each application position on the substrate 50 while the application unit 10 moves in the X-axis direction, the beam 16 may remain stationary.

  That is, the application unit 10 can be moved in the X-axis direction by driving a motor having a relatively small output, not by driving the X-axis motor 18.

For example, when applying cream solder to the chip component region on the substrate 50 shown in FIG. 11, the application unit 10 moves in the X-axis direction along the sub-beam 16a while keeping the distance between the nozzles at L _n 1. Thus, cream solder can be applied simultaneously in the order of (A1, C1), (A2, C2),.

  Thus, by increasing the degree of freedom of the application unit 10 with respect to the beam 16, simultaneous application by the first nozzle 11a and the second nozzle 12a can be performed more efficiently.

  In addition, it is possible to reduce the use time and use frequency of a motor with relatively large power consumption.

  Therefore, the viscous fluid application device 102 is also a device that realizes improvement in work efficiency related to application of viscous fluid without increasing the size of the device, similar to the viscous fluid application device 101 described above.

(Embodiment 3)
As a third embodiment of the present invention, a viscous fluid coating apparatus 103 in which both the first head 11 and the second head 12 can move in the X-axis direction and the Y-axis direction in the coating unit 10 will be described.

FIG. 15 is a top view showing a main configuration of the viscous fluid applying apparatus 103 according to the third embodiment.
A viscous fluid applying apparatus 103 shown in FIG. 15 is an apparatus that applies cream solder to a substrate in the same manner as the viscous fluid applying apparatus 101 of the first embodiment.

  Similarly to the viscous fluid applying apparatus 101, the application unit 10, the table 15, the beam 16, the Y-axis motor 17, the X-axis motor 18, the carry-in unit 19, and the carry-out unit 20 are provided. The operation of these components is controlled by the control unit 30 in the same manner as the viscous fluid applying apparatus 101.

  However, in the coating unit 10 of the viscous fluid coating device 103, the first head 11 and the second head 12 are both movable in the Y-axis direction and the X-axis direction.

  Specifically, the first head 11 is attached to the first arm 11b so as to be movable in the X-axis direction, and the first arm 11b is movable in the Y-axis direction with respect to the base body 10a.

  The second head 12 is attached to the second arm 12b so as to be movable in the X-axis direction, and the second arm 12b is movable in the Y-axis direction with respect to the base body 10a.

  The first arm 11b and the second arm 12b are driven to move in the Y-axis direction relative to the base body 10a by the inter-nozzle distance changing unit 14.

  Further, the first head 11 moves in the X-axis direction along the first arm 11b from, for example, a motor included in the base body 10a. Similarly, the second head 12 is moved in the X-axis direction along the second arm 12b by, for example, a motor included in the base 10a.

  Since these motors are only in charge of movement along each arm of the first head 11 or the second head 12, respectively, they are of small output like the motor of the inter-nozzle distance changing unit 14.

  For example, each of the first head 11 and the second head 12 may be moved independently by a combination of one motor and a plurality of gears.

  Further, the movement of the first head 11 in the Y-axis direction with respect to the first arm 11b, the movement of the second head 12 in the Y-axis direction with respect to the second arm 12b, and the movement of the first arm 11b and the second arm 12b in the Y-axis direction. The movement is controlled by the control unit 30.

  As described above, in the viscous fluid applying apparatus 103 according to the present embodiment, the first head 11 and the second head 12 are held by the base body 10a while having freedom in the XY directions with respect to the base body 10a.

FIG. 16 is a diagram showing areas where the first nozzle 11a and the second nozzle 12a can be applied.
In addition, each application | coating area | region shown in FIG. 16 has shown the relative range with respect to the base | substrate 10a.

  The first nozzle 11a and the second nozzle 12a can apply cream solder to each application position within the range shown in FIG. 16 without the entire application unit 10 moving.

  FIG. 17 is a diagram in which the areas where the first nozzle 11 a and the second nozzle 12 a can be applied are superimposed on the IC area on the substrate 50.

  As shown in FIG. 17, the IC area on the substrate 50 may be included in the areas where the first nozzle 11a and the second nozzle 12a can be applied.

  In this case, it is possible to apply cream solder to each application position in the IC area by moving only the first nozzle 11a and the second nozzle 12a while the base 10a is stationary.

Specifically, the first nozzle 11a and the second nozzle 12a are simultaneously applied to the H rows by moving in parallel with the Y axis while maintaining the distance between them at L _n 2 and upward in the figure. Execute.

Thereafter, the first nozzle 11a and the second nozzle 12a change the distance between them to L _n 3 and move in parallel to the X axis and in the right direction in the figure, thereby simultaneously applying to the G row and the K row. Execute.

Further, the first nozzle 11a and the second nozzle 12a change the distance between them to L _n 2 and move in parallel with the Y axis and in the upward direction in the figure, thereby executing simultaneous application to the J row. .

  In this manner, the first nozzle 11a and the second nozzle 12a move without moving the entire application unit 10, and thus it is possible to simultaneously apply cream solder to all application positions in the IC region.

  In other words, when considering from the start to the end of the application of cream solder to the IC area, the Y-axis motor 17 and the X-axis motor 18 only operate when moving the application unit 10 to the application start position. is there.

  Thereafter, the movement of the first nozzle 11a and the second nozzle 12a is driven by a motor having a relatively small output. Thereby, simultaneous application | coating of the cream solder with respect to each application position is performed.

  Thus, the simultaneous application | coating by the 1st nozzle 11a and the 2nd nozzle 12a can be performed more efficiently by increasing the freedom degree in the application | coating unit 10 of the 1st nozzle 11a and the 2nd nozzle 12a.

  Accordingly, the viscous fluid application device 103 is also a device that realizes an improvement in working efficiency related to the application of the viscous fluid without increasing the size of the device, similar to the above-described viscous fluid application device 101 and the like.

(Embodiment 4)
As a fourth embodiment of the present invention, a viscous fluid coating apparatus 104 including a coating unit 10 having two nozzles in addition to the first nozzle 11a and the second nozzle 12a will be described.

FIG. 18 is a top view illustrating a main configuration of the viscous fluid applying apparatus 104 according to the fourth embodiment.
A viscous fluid application device 104 shown in FIG. 18 is a device that applies cream solder to a substrate in the same manner as the viscous fluid application device 101 of the first embodiment.

  Similarly to the viscous fluid applying apparatus 101, the application unit 10, the table 15, the beam 16, the Y-axis motor 17, the X-axis motor 18, the carry-in unit 19, and the carry-out unit 20 are provided. The operation of these components is controlled by the control unit 30 in the same manner as the viscous fluid applying apparatus 101.

  However, the application unit 10 of the viscous fluid application device 104 has a third head 23 and a fourth head 24 in addition to the first head 11 and the second head 12.

  The third head 23 is attached to a base body 10b that can move in the Y-axis direction along the sub beam 16a. The fourth head 24 is attached to the base body 10b so as to be movable in the Y-axis direction.

  The third head 23 and the fourth head 24 are each provided with a nozzle (not shown in FIG. 18) in the direction of the table 15.

  The base body 10b has the inter-nozzle distance changing section 14 as in the base body 10a, and the relative position of the fourth head 24 with respect to the third head 23 is changed by the inter-nozzle distance changing section 14.

  Further, the sub beam 16a moves on the beam 16 in the Y-axis direction together with the base body 10a. This movement is driven by the Y-axis motor 17.

  That is, the base body 10a and the base body 10b can move in the Y-axis direction along the beam 16, and the base body 10b can further move in the X-axis direction along the sub beam 16a.

  By adopting such a configuration, the viscous fluid applying apparatus 104 according to the fourth embodiment can perform simultaneous application to four application positions using, for example, four nozzles.

  FIG. 19 is a diagram showing an outline of the operation of the coating unit 10 in the fourth embodiment. In FIG. 19, the beam 16 and the sub beam 16a are not shown.

  In the coating unit 10 according to the fourth embodiment, when the first nozzle 11a is used as a reference, the second nozzle 12a is movable in the Y-axis direction.

  Similarly, using the first nozzle 11a as a reference, the third nozzle 23a can move in the X-axis direction, and the fourth nozzle 24a can move in the Y-axis direction and the X-axis direction. These movements are controlled by the control unit 30.

  That is, the entire coating unit 10 moves on the XY plane, and each nozzle has such a degree of freedom, so that it is possible to cope with patterns of various coating positions on the substrate 50. That is, two or more places of cream solder can be applied simultaneously.

  For example, as shown in FIG. 19, it is assumed that there is an IC area and a chip component area on one substrate 50.

  In this case, for example, during the period in which the first nozzle 11a and the second nozzle 12a are simultaneously applying cream solder to the chip component region, the third nozzle 23a and the fourth nozzle 24a are in the IC component region. On the other hand, simultaneous application of cream solder can be performed.

  Of course, not all substrates can be applied simultaneously at four locations, but at least two locations can be applied simultaneously on most substrates.

  Furthermore, if there is an application position in each of the application possible areas of the two nozzles other than the two nozzles that perform the simultaneous application, cream solder can be applied simultaneously to three or four places.

  Therefore, the viscous fluid application device 104 is also a device that realizes improvement in working efficiency related to application of viscous fluid without increasing the size of the device, similar to the above-described viscous fluid application device 101 and the like.

  In addition, as for the position of the nozzle in each head of the 1st head 11-the 4th head 24, it is desirable to exist in the position where these several nozzles can approach as much as possible.

  FIG. 20 is a diagram illustrating an example of nozzle positions in each of the first head 11 to the fourth head 24.

  As shown in FIG. 20, the shape of each head body of the first head 11 to the fourth head 24 is a rectangular shape when viewed from the Z-axis direction.

  Furthermore, the nozzles are arranged at the corners of the head bodies so that the nozzles of the first nozzle 11a to the fourth nozzle 24a are as close as possible when the heads are close to each other.

  This increases the possibility that two or more places can be simultaneously applied when the distance between the application positions is very short, such as when application positions are dense.

(Embodiment 5)
Each of the viscous fluid coating apparatuses 101 to 104 according to the first to fourth embodiments described above basically exists on a single substrate by moving the coating unit 10 including a plurality of nozzles in the XY directions. Simultaneous application of cream solder to a plurality of application positions is possible.

  However, simultaneous application of cream solder to one substrate may be performed by moving the table 15 in the XY direction, for example, while the application unit 10 is stationary in the apparatus.

  Therefore, as a fifth embodiment, a viscous fluid coating apparatus 105 in which the table 15 moves in the XY direction will be described.

FIG. 21 is a top view showing a main configuration of the viscous fluid applying apparatus 105 according to the fifth embodiment.
A viscous fluid applying apparatus 105 shown in FIG. 21 is an apparatus that applies cream solder to a substrate, similar to the viscous fluid applying apparatus 101 of the first embodiment.

  Similarly to the viscous fluid application device 101, the application unit 10, the table 15, the beam 16, the carry-in unit 19, and the carry-out unit 20 are provided. The operation of these components is controlled by the control unit 30 in the same manner as the viscous fluid applying apparatus 101.

  The application unit 10 includes a first head 11 and a second head 12 as in the viscous fluid application apparatus 101, and an inter-nozzle distance changing unit 14 that changes the distance between the first head 11 and the second head 12 is also provided. Prepare.

That is, the second head 12 can move in the Y-axis direction with respect to the base body 10a.
The first head 11 is provided with a first nozzle 11a, and the second head 12 is provided with a second nozzle 12a in the direction of the table 15 (not shown in FIG. 21).

  However, the viscous fluid coating apparatus 105 does not include the X-axis motor 18 that moves the beam 16 in the X-axis direction and the Y-axis motor 17 that moves the coating unit 10 along the beam 16 in the Y-axis direction. .

  That is, the beam 16 is fixed at a predetermined position of the viscous fluid coating apparatus 105, and the coating unit 10 is also fixed at a predetermined position of the beam 16.

  However, the table 15 is provided so as to move under the control unit 30 in the X-axis direction and the Y-axis direction.

  Specifically, driving means for driving the movement of the table 15 in the X-axis direction and the Y-axis direction is provided, for example, under the table 15, and the control unit 30 controls the operation of this driving means.

  Thereby, the substrate 50 placed on the table 15 can be moved in the X-axis direction and the Y-axis direction with respect to the coating unit 10.

  That is, the relative position between the application unit 10 and the substrate 50 when the application unit 10 applies the cream solder to the substrate 50 can be changed in the same manner as the viscous fluid application apparatus 101 of the first embodiment.

  By adopting such a configuration, the viscous fluid applying apparatus 105 according to the fifth embodiment simultaneously applies cream solder to one substrate by the first nozzle 11a and the second nozzle 12a shown in FIG. 7A and the like. Can be executed.

  Accordingly, the viscous fluid application device 105 is also a device that realizes improvement in work efficiency related to application of viscous fluid without increasing the size of the device, similar to the above-described viscous fluid application device 101 and the like.

  When the table 15 is moved in the XY directions as in the present embodiment, the first head 11 and the second head may be directly attached to the beam 16. In this case, the beam 16 becomes a base in the viscous fluid coating apparatus of the present invention.

  In the present embodiment, the table 15 is moved in the X-axis direction and the Y-axis direction. However, for example, the table 15 may move only in the X axis direction, and the coating unit 10 may move only in the Y axis direction.

  Further, both the table 15 and the coating unit 10 may move in the X-axis direction and the Y-axis direction.

  That is, any of the coating unit 10 and the table 15 may move as long as the relative position between the coating unit 10 and the substrate can be changed.

  In addition, the various structures, procedures, mechanisms, and the like described in the above embodiments may be combined as appropriate.

  For example, the viscous fluid coating apparatus has a structure in which the table 15 described in the fifth embodiment moves and a structure in which the coating unit 10 described in the second embodiment can move in the X-axis direction with respect to the beam 16. Also good.

  Even in this case, the viscous fluid application apparatus is an apparatus that realizes improvement in work efficiency related to application of the viscous fluid without increasing the size of the apparatus.

  The present invention can be applied to an apparatus for applying a viscous fluid to a member. In particular, it is useful as an apparatus for applying a viscous fluid such as cream solder necessary for mounting components such as semiconductor elements to a substrate.

FIG. 3 is a top view showing a main configuration of the viscous fluid applying apparatus according to the first embodiment. FIG. 3 is an enlarged perspective view showing an appearance in the vicinity of a coating unit according to the first embodiment. (A) is a figure which shows the position in each head of a 1st nozzle and a 2nd nozzle, (B) is a figure which shows an example of the structure for controlling the discharge amount of a 1st nozzle and a 2nd nozzle. is there. 1 is a block diagram illustrating a main configuration of a viscous fluid applying apparatus according to a first embodiment. FIG. 3 is a flowchart showing an outline of an operation flow of the viscous fluid applying apparatus according to the first embodiment. It is a figure which shows an example of the arrangement | sequence of the application position on a board | substrate. (A) is a figure for demonstrating the application order at the time of apply | coating cream solder to the board | substrate shown in FIG. 6, (B) is an example of the application order determined by the determination part, and allocation of a nozzle. FIG. (A) is the 1st figure for demonstrating the application order etc. of cream solder to IC area | region on a board | substrate, (B) is a figure which shows the application order determined by the determination part, and allocation of a nozzle. It is. (A) is the 2nd figure for demonstrating the application order etc. of cream solder to IC area | region on a board | substrate, (B) is a figure which shows the application order determined by the determination part, and allocation of a nozzle. It is. (A) is the 3rd figure for demonstrating the application order etc. of cream solder to IC area | region on a board | substrate, (B) is a figure which shows the application order determined by the determination part, and allocation of a nozzle. It is. It is a figure which shows an example of the board | substrate with which various area | regions from which the arrangement | sequence of an application position differs exist. It is a time chart which shows the flow of operation | movement of a viscous fluid application apparatus at the time of apply | coating cream solder to the board | substrate shown in FIG. It is a top view which shows the main structures of the viscous fluid application apparatus of Embodiment 2. FIG. 10 is an enlarged perspective view showing an appearance in the vicinity of a coating unit according to a second embodiment. FIG. 6 is a top view showing a main configuration of a viscous fluid applying apparatus according to a third embodiment. It is a figure which shows the application | coating area | region of the 1st nozzle of Embodiment 3, and a 2nd nozzle. FIG. 17 is a diagram in which the application possible areas of the first nozzle and the second nozzle shown in FIG. 16 are superimposed on the IC area on the substrate. It is a top view which shows the main structures of the viscous fluid application apparatus of Embodiment 4. It is a figure which shows the operation | movement outline | summary of the coating unit in Embodiment 4. FIG. It is a figure which shows the example of the position of the nozzle in each head of a 1st head-a 4th head. It is a top view which shows the main structures of the viscous fluid application apparatus of Embodiment 5. It is a figure which shows the main structures of the conventional adhesive agent coating apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Application | coating unit 10a, 10b Base | substrate 11 1st head 11a 1st nozzle 11b 1st arm 12 2nd head 12a 2nd nozzle 12b 2nd arm 13 Recognition part 14 Inter-nozzle distance change part 15 Table 16 Beam 16a Sub beam 17 For Y-axis Motor 18 X-axis motor 19 Carry-in part 20 Carry-out part 21 Pressure control part 23 3rd head 23a 3rd nozzle 24 4th head 24a 4th nozzle 25 Mechanism part 30 Control part 31 Acquisition part 32 Determination part 33 Storage part 34 Operation part 35 Display unit 50 Substrate 101, 102, 103, 104, 105 Viscous fluid application device

Claims (12)

A viscous fluid application device for applying a viscous fluid to a plurality of application positions on a substrate,
A first nozzle for discharging the viscous fluid;
A second nozzle for changing the distance from the first nozzle and discharging the viscous fluid;
Control means for simultaneously applying the viscous fluid to one application position and another application position on one substrate by simultaneously discharging the viscous fluid to the first nozzle and the second nozzle; A viscous fluid application device comprising: Furthermore, one substrate that holds the first nozzle and holds the second nozzle so that the inter-nozzle distance between the first nozzle and the first nozzle can be changed;
The viscous fluid coating apparatus according to claim 1, further comprising: a driving unit configured to change a relative position of the base body and the substrate on a plane parallel to a surface of the substrate on which the viscous fluid is coated. And changing means for changing the inter-nozzle distance;
Obtaining means for obtaining application data which is data indicating a plurality of application positions on the substrate;
The control means may further be configured such that the first nozzle is positioned on the one application position based on the application data before the viscous fluid is simultaneously discharged to the first nozzle and the second nozzle. The viscous fluid coating apparatus according to claim 2, wherein the driving unit is configured to change the relative position, and the changing unit is configured to change the inter-nozzle distance so that the second nozzle is positioned on the other coating position. . The control means further includes
Based on the application data, the first application position is determined from the plurality of application positions, and the second nozzle can be applied when the first nozzle is positioned on the determined application position. The viscous fluid coating apparatus according to claim 3, further comprising a determining unit that determines a coating position within a range as the other coating position. 5. The control unit according to claim 2, wherein the relative position is changed so that the first nozzle is positioned on the one application position by moving the base body to the driving unit. The viscous fluid application apparatus described. And a table on which the substrate is placed and movable in a direction parallel to the surface of the substrate to which the viscous fluid is applied,
The control unit causes the relative position to be changed so that the first nozzle is positioned on the one application position by moving the table by the driving unit. The viscous fluid application apparatus described. A viscous fluid application method for applying the viscous fluid to a plurality of application positions on the substrate where the viscous fluid is to be applied,
A change step of changing the inter-nozzle distance between the first nozzle and the second nozzle;
After the inter-nozzle distance is changed in the changing step, the viscous fluid is ejected simultaneously to the first nozzle and the second nozzle, so that one application position and one application position on one substrate are discharged. And a control step of simultaneously applying the viscous fluid. A program for controlling an apparatus for applying the viscous fluid to a plurality of application positions on the substrate where the viscous fluid is to be applied,
A change step of changing the inter-nozzle distance between the first nozzle and the second nozzle;
After the inter-nozzle distance is changed in the changing step, the viscous fluid is ejected simultaneously to the first nozzle and the second nozzle, so that one application position and one application position on one substrate are discharged. A program for causing a computer to execute a control step of simultaneously applying the viscous fluid. A viscous fluid application device having a plurality of nozzles for applying a viscous fluid to a plurality of application positions on a substrate,
By changing the distance between the plurality of nozzles and simultaneously discharging the viscous fluid onto the substrate from the plurality of nozzles, the viscous fluid to one application position on one substrate and another application position A viscous fluid application device comprising control means for simultaneously applying the liquid. A viscous fluid application method for applying a viscous fluid to a plurality of application positions on a substrate using a plurality of nozzles,
When it is possible to apply the viscous fluid simultaneously to one application position and another application position on one substrate by changing the distance between the plurality of nozzles, By changing the distance between the plurality of nozzles and causing the plurality of nozzles to simultaneously discharge the viscous fluid, the viscous fluid is simultaneously applied to the one application position and the other application position. Application method. After applying the viscous fluid to the one application position and the other application position, the viscous fluid is simultaneously applied to a plurality of application positions other than these application positions by changing the distance between the plurality of nozzles. When application is possible, the distance between the plurality of nozzles is changed, and the viscous fluid is simultaneously discharged to the plurality of nozzles, thereby simultaneously applying the viscous fluid to the plurality of application positions. The viscous fluid application method according to claim 10. When it is impossible to apply the viscous fluid simultaneously to the one application position and the other application position by the plurality of nozzles, any one of the plurality of nozzles causes the one application position to be applied. The viscous fluid application method according to claim 10, wherein the viscous fluid is applied to each of the other application positions.

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