JP4891185B2 - Viscous fluid application device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a viscous fluid applying apparatus which is an apparatus for applying cream solder and adhesive on a substrate and in which the operation efficiency in the application of the viscous fluid is improved without making the apparatus large-scaled. <P>SOLUTION: The viscous fluid applying apparatus 101 for applying the viscous fluid on the substrate is provided with a first nozzle 11a for discharging the cream solder of the viscous fluid and applying the cream solder on a solder applying position where is a position to be coated with the cream solder on one substrate, a second nozzle 22a for discharging the adhesive which is the viscous fluid and applying the adhesive on an adhesive applying position where is a position to be coated with the adhesive on the substrate, a base body 10a holding the first nozzle 11a and the second nozzle 22a and a Y-axis motor 17 and an X-axis motor 18 for changing the relative position of the base body 10a and the substrate where is in parallel to the surface of the substrate to be coated with the viscous liquid. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a viscous fluid coating apparatus for coating a printed circuit board with a viscous fluid necessary for component mounting.

  2. Description of the Related Art Conventionally, there is an apparatus for applying a viscous fluid necessary for component mounting such as cream solder and adhesive to a printed circuit board (hereinafter simply referred to as “substrate”). For example, there is an apparatus for applying cream solder to a substrate using a mask.

  According to this apparatus, the substrate is brought close to the lower surface of the mask, and the squeegee is slid on the mask. Thereby, the cream solder can be applied to a predetermined application position on the substrate through a plurality of holes opened in the mask.

  Thus, the cream solder can be applied to a plurality of application positions in a short time by using the mask.

  However, in recent years, parts to be mounted on a substrate have been downsized. Along with this, the application area per location of viscous fluid such as cream solder is reduced, and the distance between a plurality of application positions is also very short.

  For this reason, in a conventional apparatus using a mask, the holes of the mask are miniaturized and dense, and it has become difficult to apply cream solder accurately and reliably.

  In addition, when the cream solder application pattern is changed, it is necessary to change and adjust the mask each time, and there is a problem that so-called setup change takes time.

  Therefore, an apparatus for applying a viscous fluid to a substrate using a nozzle that discharges the viscous fluid without using a mask is also used.

  In such an apparatus, the viscous fluid is applied one place at a time, so that the working efficiency related to the application of the viscous fluid is relatively low as compared with an apparatus using a mask.

  Therefore, in a device for applying a viscous fluid to a substrate using a nozzle, a technique for improving production tact by performing a viscous fluid application operation on a plurality of substrates using a plurality of heads provided with nozzles is also disclosed ( For example, see Patent Document 1).

  FIG. 24 is a diagram showing a main configuration of a conventional adhesive application device.

  In the adhesive application device 200 shown in FIG. 24, the respective substrates 61 are individually positioned in the direction perpendicular to the transport direction by the movement of the tables 63 and 64. Further, the coating heads 67 and 68 are moved and moved in the conveying direction to be individually positioned.

  Each of the coating heads 67 and 68, which are multi-nozzle heads, has nozzles 71, 72, and 73 having different coating diameters. The adhesive is applied to the necessary positions of the two substrates 61.

In this way, the adhesive application device 200 improves the working efficiency related to the application of the adhesive to the substrate 61.
JP-A-9-141165

  The conventional adhesive application apparatus 200 is an apparatus that applies an adhesive to a substrate. However, such a method of applying a viscous fluid to a substrate using a nozzle can also be applied to the application of cream solder to the substrate.

  That is, by applying the cream solder to the substrate using the nozzle, the accuracy and certainty of the application of the cream solder to a minute region, which is difficult with the application method using the mask, is improved.

  Here, there is also a board in which a position where cream solder is to be applied (hereinafter also referred to as “solder application position”) and a position where adhesive is to be applied (hereinafter also referred to as “adhesive application position”). Generally present.

  In such a substrate, the number of adhesive application positions is often significantly smaller than the number of solder application positions.

  However, such a substrate naturally requires a process of applying cream solder and a process of applying an adhesive. Therefore, in the field where these viscous fluids are applied to the substrate, it is necessary to install an adhesive application device in addition to the solder application device.

  In other words, it is necessary to install a dedicated coating apparatus for applying the adhesive to the substrate despite the small amount of application work per substrate. This is inefficient from an economic point of view and an effective use of space.

  Therefore, it is conceivable to use the above-described conventional adhesive application device 200 to apply cream solder to one application unit and apply adhesive to the other application unit.

  Thus, the cream solder and the adhesive can be applied with a single device, and the viscous fluid can be applied to a minute region.

  However, the conventional adhesive application device 200 is nothing but a configuration that improves work efficiency by performing application work of viscous fluid on a plurality of substrates in parallel by an application line composed of a plurality of application units. .

  With such a configuration, it is considered that economic and spatial efficiency is improved rather than physically arranging two devices. However, it is necessary to control the operation of the coating unit for each substrate handled by each coating unit, and the process related to the control is still complicated.

  Further, the improvement in work efficiency is an increase in the number of coating units, and the improvement in work efficiency leads to an increase in the size of the entire apparatus and an increase in cost.

  In addition, as for the motor and the like constituting the device, each device is required to have high speed. As a result, the output required for each motor, the processing capacity required for the control device, and the like are increased, leading to an increase in the cost of the entire facility.

  The present invention is an apparatus for applying cream solder and an adhesive to a substrate in consideration of the above-described conventional problems, and is a viscous fluid application apparatus that improves the working efficiency of applying these viscous fluids without increasing the size of the apparatus The purpose is to provide.

  In order to achieve the above object, a viscous fluid application apparatus of the present invention is a viscous fluid application apparatus that applies a viscous fluid to a substrate, and discharges cream solder, which is a viscous fluid, to the substrate on one substrate. A first nozzle that applies the cream solder to a solder application position that is a position where the cream solder is to be applied, and a position where the adhesive on the substrate is to be applied by discharging the adhesive that is a viscous fluid. The viscous fluid of the substrate is applied by the second nozzle that applies the adhesive at the adhesive application position, one base that holds the first nozzle and the second nozzle, and the base and the substrate. Drive means for changing the relative position on a plane parallel to the surface to be measured.

  As described above, the viscous fluid application apparatus of the present invention employs a configuration in which cream solder and adhesive are applied to one substrate by two nozzles provided in one base.

  That is, the cream solder and the adhesive can be applied to one substrate by one application unit.

  Therefore, the viscous fluid application apparatus of the present invention is an apparatus that improves the working efficiency related to application of viscous fluid without increasing the size of the apparatus.

  In this specification and the like, the term “one substrate” includes various substrates handled as one substrate. For example, a single substrate includes a so-called multi-sided substrate that is handled as one substrate at the time of operations such as application of viscous fluid or component mounting, and is subsequently divided into a plurality of substrates.

  Further, the cream solder is discharged to the first nozzle and the adhesive is discharged to the second nozzle, whereby the application of the cream solder to the solder application position and the application of the cream solder to the adhesive application position are performed. Control means for simultaneously applying the adhesive may be provided.

  Thus, the efficiency of application | coating operation | work can be improved more by apply | coating cream solder and an adhesive agent simultaneously.

  In the present specification and the like, “simultaneous application” includes not only the case where the application periods of the viscous fluid by the nozzles completely coincide, but also the case where at least a part of the application period of the viscous fluid by each nozzle overlaps. . The same applies to the case of “simultaneously discharging”.

  Further, the second nozzle may be held by the base so that a distance between the nozzles between the second nozzle and the first nozzle can be changed.

  Thus, since the distance between nozzles is variable, the opportunity for simultaneous application of cream solder and adhesive can be increased.

  The control unit further includes a changing unit that changes the distance between the nozzles, and an acquisition unit that acquires application data that is data indicating the solder application position and the adhesive application position. Before discharging the cream solder and the adhesive to the nozzle and the second nozzle, based on the application data, the relative position is set on the driving means so that the first nozzle is positioned on the solder application position. And changing the distance between the nozzles so that the second nozzle is positioned on the adhesive application position.

  In this way, by obtaining the application data and changing the relative position between the substrate and the substrate and the distance between the nozzles based on the application data, for example, the application operation can be efficiently performed on many different substrates. I can go.

  The application data is data indicating a plurality of solder application positions and one or more adhesive application positions on the substrate, and the control unit further includes a plurality of solder application positions based on the application data. When the first nozzle is positioned on the determined solder application position, the second nozzle has one adhesive application position within the applicable range of the second nozzle. You may have a determination means to determine with the adhesive application position which apply | coats the said adhesive agent.

  In this way, by determining the application position to be assigned to each nozzle from a plurality of application positions based on the acquired application data, for example, a combination of a nozzle and an application position that improves the efficiency of the application work most. Can be determined.

  Further, the control means may change the relative position so that the first nozzle is positioned on the solder application position by moving the base to the driving means.

  That is, the present invention can be realized, for example, as a viscous fluid application device that applies cream solder and an adhesive to a substrate by moving a base including two nozzles in a direction parallel to the substrate while the substrate is stationary.

  Further, the apparatus further comprises a table on which the substrate is placed and movable in a direction parallel to a surface of the substrate to which the viscous fluid is applied, and the control means moves the table to the driving means. The relative position may be changed so that the first nozzle is positioned on the solder application position.

  That is, the present invention can be realized as, for example, a viscous fluid application device that applies cream solder and adhesive to a substrate by moving a table on which the substrate is placed while the base is stationary in a direction parallel to the substrate. .

  Furthermore, it is good also as providing the 3rd nozzle which is hold | maintained at the said base | substrate so that the distance between said 1st nozzles can be changed, and discharges the said cream solder.

  As a result, the viscous fluid applying apparatus of the present invention can apply adhesive to the substrate and simultaneously apply cream solder to two solder application positions on the substrate.

  In addition, the present invention can be realized as a viscous fluid coating method including the operation of the characteristic components of the viscous fluid coating apparatus of the present invention.

  Furthermore, the present invention is realized as a program including characteristic steps in the viscous fluid application method of the present invention, realized as a storage medium such as a CD-ROM storing the program, or realized as an integrated circuit. You can also. The program can also be distributed via a transmission medium such as a communication network.

  ADVANTAGE OF THE INVENTION According to this invention, it is an apparatus which apply | coats cream solder and an adhesive agent to a board | substrate, Comprising: The viscous fluid application apparatus which improves the working efficiency which concerns on application | coating of these viscous fluids without enlarging an apparatus can be provided. .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
First, the configuration of the viscous fluid applying apparatus 101 according to the first embodiment will be described with reference to FIGS.

  FIG. 1 is a top view showing a main configuration of the viscous fluid applying apparatus 101 according to the first embodiment.

  A viscous fluid applying apparatus 101 shown in FIG. 1 is an apparatus that applies cream solder and adhesive, which are viscous fluids necessary for mounting components on a substrate, to the substrate.

  As shown in FIG. 1, the viscous fluid coating apparatus 101 includes a coating unit 10, a table 15, a beam 16, a Y-axis motor 17, an X-axis motor 18, a carry-in unit 19, and a carry-out unit 20. Is provided.

  The application unit 10 is a component that applies cream solder and an adhesive to the substrate 50, and includes a base body 10 a, a first head 11, a second head 22, and a recognition unit 23.

  The coating unit 10 includes a plurality of nozzles as described above, and is a kind of multi-nozzle head.

  The first head 11 includes a nozzle (not shown in FIG. 1) for discharging cream solder in the direction of the table 15.

  Further, the second head 22 includes a nozzle (not shown in FIG. 1) for discharging the adhesive in the direction of the table 15.

  The recognition unit 23 is a component that optically recognizes the recognition mark attached to the substrate 50.

  When the recognition unit 23 recognizes at least two recognition marks attached to the substrate 50, position correction or the like at the time of applying the cream solder is performed.

  The table 15 is a component that places the substrate 50 carried in by the carry-in unit 19. The substrate 50 placed on the table 15 and coated with cream solder is unloaded by the unloading unit 20.

  The table 15 has a mechanism for receiving and holding the substrate 50 carried in by the carry-in unit 19 at a predetermined position and holding it, and sending it out to the carry-out unit 20 after applying the cream solder. In addition, this mechanism is a conventional technique and will not be described and illustrated.

  The table 15 is not limited to such a form. For example, the form may be such that the substrate 50 is fixed at a predetermined position and the back surface of the substrate 50 is supported by support pins.

  The beam 16 is a component that holds the coating unit 10 so as to be movable in the Y-axis direction. The movement of the coating unit 10 in the Y-axis direction is driven by a Y-axis motor 17.

  The beam 16 is driven to move in the X-axis direction by an X-axis motor 18.

  In this way, the coating unit 10 is moved in a direction parallel to the surface of the substrate 50 to which the viscous fluid is applied, that is, in a direction parallel to the XY plane, by the Y-axis motor 17 and the X-axis motor 18. Driven.

  The X and Y axis directions of the XY plane defined on the surface on which the components of the substrate 50 are mounted and the XY plane formed by driving the X axis motor 18 and the Y axis motor 17 are the same. So that it is adjusted.

  Note that at least one of the Y-axis motor 17 and the X-axis motor 18 implements a driving unit in the viscous fluid applying apparatus of the present invention.

  FIG. 2 is an enlarged perspective view showing the appearance of the vicinity of the coating unit 10 of the first embodiment.

  As shown in FIG. 2, the first head 11 includes a first nozzle 11 a that discharges cream solder, and the second head 22 includes a second nozzle 22 a that discharges an adhesive.

  The first head 11 and the second head 22 move downward in the Z-axis direction with respect to the base body 10a when the cream solder or the adhesive is discharged.

  The first head 11 and the second head 22 are driven to move in the Z-axis direction by a motor provided in the base body 10a.

  The controller 30 controls the vertical movement of the first head 11 and the second head 22, the position of the coating unit 10, and the discharge amount of the first nozzle 11 a and the second nozzle 22 a based on coating data to be described later.

  That is, under the control of the control unit 30, the cream solder and the adhesive are applied to predetermined application positions on the substrate 50.

  FIG. 3 is a diagram illustrating an example of a configuration for controlling the discharge amounts of the first nozzle 11a and the second nozzle 22a. In FIG. 3, a dotted line extending from the pneumatic pressure source indicates an air path.

  As shown in FIG. 3, each of the first nozzle 11 a and the second nozzle 22 a is connected to an air pressure source via a pressure control unit 21. The pressure control unit 21 is realized by an electromagnetic valve that can change the flow rate of air, for example.

  In addition, each pressure control part 21 of the 1st nozzle 11a and the 2nd nozzle 22a can be independently controlled by the control part 30. FIG.

  The controller 30 controls the pressure controller 21 to control the amount of cream solder discharged from the first nozzle 11a and the amount of adhesive discharged from the second nozzle 22a.

  The control unit 30 can be realized by a computer having a central processing unit (CPU), a storage device, and an interface for inputting and outputting information.

  The mechanism in which the first nozzle 11a and the second nozzle 22a discharge the viscous fluid is not limited to that using such air pressure.

  For example, a mechanism may be employed that uses the vibration of the piezo element to start and end the discharge of the viscous fluid and control the discharge amount.

  FIG. 4 is a block diagram illustrating a main configuration of the viscous fluid applying apparatus 101 according to the first embodiment.

  As shown in FIG. 4, in addition to the mechanism unit 25 including the above-described coating unit 10 and the like, the viscous fluid coating apparatus 101 includes a control unit 30, a storage unit 33, an operation unit 34, and a functional configuration. And a display unit 35.

  The control unit 30 is a component that controls the operation of the mechanism unit 25, and includes an acquisition unit 31 and a determination unit 32.

  The acquisition unit 31 is a component that acquires application data that is data indicating a plurality of application positions on the substrate. In the present embodiment, the acquisition unit 31 acquires application data from the storage unit 33. However, for example, application data may be acquired through communication with another apparatus.

  The determination unit 32 is a component that determines the application position where the first nozzle 11a applies the cream solder and the application position where the second nozzle 22a applies the adhesive based on the application data acquired by the acquisition unit 31. .

  The control unit 30 can control the position of the coating unit 10 by controlling the operation of the Y-axis motor 17 and the like based on the determination by the determination unit 32.

  The storage unit 33 is a storage device that stores the above-described application data. The application data includes necessary information such as application pressure and application amount in addition to information indicating the solder application position and adhesive application position for each substrate.

  The operation unit 34 is a keyboard or the like for an operator of the viscous fluid applying apparatus 101 to input an instruction such as start of application.

  The display unit 35 is a liquid crystal monitor or the like that presents the state of the viscous fluid applying apparatus 101 to the operator.

  Next, the operation of the viscous fluid applying apparatus 101 according to the first embodiment will be described with reference to FIGS.

  FIG. 5 is a flowchart showing an outline of the operation flow of the viscous fluid applying apparatus 101 according to the first embodiment.

  The determination unit 32 reads application data from the storage unit 33. Further, the order in which the first nozzle 11a applies the cream solder is determined for a plurality of solder application positions indicated in the application data (S1).

  Next, the determination unit 32 confirms whether or not there is an adhesive application position on the substrate. When there is an adhesive application position (Yes in S2), the determination unit 32 determines the movement path of the second nozzle 22a and the adhesive application position when the first nozzle 11a moves according to the previously determined cream solder application order. Are compared (S3).

  By this comparison, the order in which the adhesive is applied to the adhesive application position in the entire application operation is determined (S4).

  For example, it is assumed that there are five solder application positions on one substrate and one adhesive application position.

  In this case, first, the order of applying the cream solder is determined from the first to the fifth. As a result, the timing of applying the adhesive is five timings simultaneously with the application of the first to fifth cream solders, and six timings before or after the application timings of the first to fifth cream solders. There are 11 possible timings.

  Among these 11 timings, for example, the timing at which the moving distance of the coating unit 10 is the shortest is determined as the timing for applying the adhesive.

  When the application order is determined for all application positions in this manner, the application of cream solder to the solder application position by the first nozzle 11a and the adhesive to the adhesive application position by the second nozzle 22a are performed according to the determined order. Application is performed (S5).

  A specific example of the operation related to the application of the cream solder and the adhesive of the viscous fluid applying apparatus 101 described above will be described with reference to FIG.

  FIG. 6 is a diagram illustrating an example of an IC region on the substrate 50.

  The IC area is an area where the IC is mounted. In the case of an IC, the electrodes are arranged at equal intervals on the periphery of the rectangular main body, and the solder application position on the substrate 50 is arranged as shown in FIG. 6, for example.

  In FIG. 6, both the H row and the J row are parallel to the Y axis, and the straight line connecting the application positions with the same numbers is parallel to the X axis. For example, H9 and J9 are on a straight line parallel to the X axis.

  Further, both the G row and the K row are parallel to the X axis, and the straight line connecting the application positions with the same numbers is parallel to the Y axis. For example, G9 and K9 are on a straight line parallel to the Y axis.

  Further, P1 surrounded by these solder application positions is a position where an adhesive should be applied.

  When the application position is arranged in this way, the determination unit 32 determines, for example, H1 at the end of the H row closest to the application unit 10 as the application position where the first nozzle 11a applies cream solder first. .

  Thereafter, for example, H2 closest to H1 is determined as an application position where cream solder is applied next. In this way, by sequentially determining the application position where the cream solder is applied, it is determined that the cream solder is applied in the order of the H row, the G row, the J row, and the K row.

  As a result, the movement path of the first nozzle 11a becomes the path shown in FIG. Moreover, the movement path | route of the 2nd nozzle 22a which does not change the relative position on the XY plane with the 1st nozzle 11a becomes a path | route shown in FIG.

  In this case, the point on the moving path of the second nozzle 22a closest to P1 is Q. Further, H5 exists on a straight line passing through Q and parallel to the Y axis.

  Therefore, the determination unit 32 determines that the adhesive is applied to P1 immediately before or after the cream solder is applied to H5.

  FIG. 7 is a diagram showing an example of the application order of cream solder and adhesive in the viscous fluid applying apparatus 101 of the first embodiment.

  According to this order, the adhesive is applied to P1 by the second nozzle 22a while the first nozzle 11a applies cream solder to G5 and G6.

  Here, considering the movement distance of the coating unit 10 when the application is performed in the order shown in FIG. 7, the adhesive is applied to P1 at the movement distance when the cream solder is applied to each application position of H1 to K1. Only a slight movement in the Y-axis direction is added.

  That is, as compared with the case where the application of the cream solder and the application of the adhesive are performed by different application devices as in the conventional case, the efficiency of the application work is significantly improved.

  In addition, in the viscous fluid applying apparatus 101 according to the present embodiment, cream solder and adhesive are applied by two nozzles (first nozzle 11a and second nozzle 22a) provided in one multi-nozzle head called application unit 10. And has been covered.

  That is, as in the prior art, even a single device is not a device having a plurality of multi-nozzle heads arranged side by side. Therefore, the viscous fluid coating apparatus 101 is more advantageous than the conventional apparatus from the viewpoint of effective use of space.

  As described above, the viscous fluid application apparatus 101 according to the present embodiment is an apparatus that improves the working efficiency related to the application of these viscous fluids without increasing the size of the apparatus.

  If the adhesive application position exists at a position where the straight line passing through any solder application position and parallel to the Y axis intersects the movement path of the second nozzle 22a, cream solder and adhesive can be applied simultaneously. It is.

  For example, when the adhesive application position P1 is present at Q on the substrate 50 shown in FIG. 6, it is possible to simultaneously apply cream solder to G5 and adhesive to P1.

  In this case, the application unit 10 can apply the adhesive to P1 without moving only for applying the adhesive. That is, paying attention to the movement path of the application unit 10, it is not different from the case where only the cream solder is applied.

  This operation is realized by causing the first nozzle 11a to discharge cream solder and the second nozzle 22a to discharge adhesive when the control unit 30 positions the first nozzle 11a on G5.

  Moreover, the application order shown in FIG. 7 is an example, and another application order may be sufficient. For example, starting from K1, cream solder may be applied up to H1 in the clockwise direction in FIG.

  In this case, for example, the adhesive may be applied to P1 between the application to G6 and the application to G5.

  Further, the procedure for determining the application order of cream solder and adhesive is not limited to the procedure shown in FIG.

  For example, when determining the application order of cream solder by the first nozzle 11a, the application order of the entire application operation is determined by checking whether there is an adhesive application position near the second nozzle 22a as needed. May be.

  For example, in the middle of determining the application order for a plurality of solder application positions, the adhesion is performed within a predetermined range centered on the second nozzle 22a when the first nozzle 11a is positioned on a certain solder application position X. Assume that there is an agent application position.

  In this case, it may be determined that the adhesive is applied to the adhesive application position immediately after the cream solder is applied to X.

  Further, the viscous fluid applying apparatus 101 of the present embodiment is provided with one nozzle for discharging cream solder and one nozzle for discharging adhesive. However, the number of these nozzles may be larger.

  The first head 11 and the second head 22 may be provided so as to be movable in the Y-axis direction or the X-axis direction with respect to the base body 10a.

  Thereby, the inter-nozzle distance between the first nozzle 11a and the second nozzle 22a can be changed.

  When the inter-nozzle distance is variable, for example, before applying cream solder and an adhesive to the substrate 50 shown in FIG. 6, the inter-nozzle distance is made equal to the distance between the center of G5 and the center of P1.

  As a result, the first nozzle 11a can apply the cream solder to G5, and the second nozzle 22a can apply the adhesive to P1.

  An apparatus in which the distance between the nozzle that discharges solder and the nozzle that discharges adhesive or the distance between two nozzles that discharge solder can be changed will be described below in each embodiment. .

(Embodiment 2)
As a second embodiment of the present invention, a viscous fluid applying apparatus 102 in which the distance between the first nozzle 11a and the second nozzle 22a can be changed will be described.

  FIG. 8 is a top view showing a main configuration of the viscous fluid applying apparatus 102 according to the second embodiment.

  A viscous fluid applying apparatus 102 shown in FIG. 8 is an apparatus that applies cream solder and an adhesive to a substrate, similar to the viscous fluid applying apparatus 101 of the first embodiment.

  Similarly to the viscous fluid applying apparatus 101, the application unit 10, the table 15, the beam 16, the Y-axis motor 17, the X-axis motor 18, the carry-in unit 19, and the carry-out unit 20 are provided. The operation of these components is controlled by the control unit 30 in the same manner as the viscous fluid applying apparatus 101.

  However, in the viscous fluid applying apparatus 102, the second head 22 is held by the base body 10a so that the distance from the first head 11 can be changed.

  Further, an inter-nozzle distance changing unit 24 that changes the distance between the first nozzle 11a and the second nozzle 22a is provided.

  The inter-nozzle distance changing unit 24 is configured by, for example, a motor and a ball screw, and can move the second nozzle 22a in the Y-axis direction along the side surface of the base body 10a.

  That is, the viscous fluid coating device 102 is a device including one multi-nozzle head (coating unit 10) that can change the distance between two nozzles.

  The weight of the second head 22 is light compared to the weight of the coating unit 10, and the moving distance of the second head 22 is short compared to the moving distance of the coating unit 10.

  Therefore, a motor having a smaller output than the Y-axis motor 17 and the X-axis motor 18 is employed as the motor included in the inter-nozzle distance changing unit 24.

  FIG. 9 is an enlarged perspective view showing the appearance of the vicinity of the coating unit 10 of the second embodiment.

  As shown in FIG. 9, the second head 22 moves in the Y-axis direction with respect to the base body 10a and also moves in the Z-axis direction.

  The movement of the second head 22 in the Y-axis direction relative to the base body 10 a is driven by the inter-nozzle distance changing unit 24, and the inter-nozzle distance changing unit 24 is controlled by the control unit 30.

  That is, under the control of the control unit 30, the distance between the first nozzle 11a and the second nozzle 22a is changed.

  Thus, the opportunity of simultaneous application | coating to the board | substrate of cream solder and an adhesive agent can be increased by changing the distance between nozzles.

  FIG. 10 is a flowchart showing an outline of the operation flow of the viscous fluid applying apparatus 102 according to the second embodiment.

  The determination unit 32 determines the order in which the first nozzle 11a applies the cream solder for a plurality of solder application positions indicated in the application data (S11).

  Next, the determination unit 32 confirms whether or not there is an adhesive application position on the substrate. When there is an adhesive application position (Yes in S12), the determination unit 32 applies the adhesive application area of the second nozzle 22a and the adhesive application when the first nozzle 11a moves according to the previously determined application order of cream solder. The position is compared (S13).

  By this comparison, the order in which the adhesive is applied to the adhesive application position in the entire application operation is determined (S14).

  When the application order is determined for all the application positions in this way, cream solder application by the first nozzle 11a and adhesive application by the second nozzle 22a are executed according to the determined order (S15).

  A specific example of the operation related to the application of the cream solder and the adhesive of the viscous fluid applying apparatus 102 described above will be described with reference to FIG.

  FIG. 11 is a diagram illustrating an example of the movement path of the first nozzle 11a and the application possible region of the second nozzle 22a in the second embodiment.

  Each application position on the substrate 50 shown in FIG. 11 is the same as each application position shown in FIG. Further, the movement path of the first nozzle 11a is the same as the movement path shown in FIG.

  That is, the application order of the cream solder by the first nozzle 11a is the same as that in the first embodiment.

  Here, the distance between the second nozzle 22a and the first nozzle 11a can be changed. Therefore, when the first nozzle 11a moves as shown in FIG. 11, the application possible area of the second nozzle 22a extends over a wide range as shown in FIG.

In the case of this example, when the first nozzle 11a is positioned on G5, if the inter-nozzle distance is L _n 1 shown in the figure, the application unit 10 does not move in the Y-axis direction, and the second nozzle 22a moves P1 An adhesive can be applied.

  FIG. 12 is a diagram illustrating an example of the application order of cream solder and adhesive in the viscous fluid applying apparatus 102 according to the second embodiment.

  Since the inter-nozzle distance can be changed, the viscous fluid applying device 102 can apply the adhesive to P1 at the same time as applying cream solder to G5, as shown in FIG.

  Specifically, the control unit 30 controls the operations of the Y-axis motor 17 and the X-axis motor 18 to move the coating unit 10 so that the first nozzle 11a is positioned on G5.

  That is, the controller 30 moves the base body 10a to change the relative position between the base body 10a and the substrate 50 so that the first nozzle 11a is positioned on G5.

  At this time, the control unit 30 further causes the inter-nozzle distance changing unit 24 to change the inter-nozzle distance so that the second nozzle 22a is positioned on P1.

  After this change, the control unit 30 causes the first nozzle 11a to eject cream solder and causes the second nozzle 22a to eject adhesive. In this manner, the application of cream solder to G5 and the application of adhesive to P1 are performed simultaneously.

  Therefore, it can be seen that the coating operation is completed in a short time as compared with the coating sequence in the viscous fluid coating apparatus 101 shown in FIG.

  That is, the viscous fluid coating apparatus 102 of the present embodiment can more efficiently perform the viscous fluid coating operation on the substrate.

  In addition, before the start of the whole application | coating operation | work, the control part 30 is the distance between nozzles to the inter-nozzle distance change part 24 so that the 2nd nozzle 22a may be located on P1, when the 1st nozzle 11a is located on G5. May be changed.

  Even if P1 is in the application possible region of the second nozzle 22a shown in FIG. 11, if it is not on or near the straight line parallel to the Y axis extending from any solder application position, It cannot be applied.

  However, even in such a case, the application unit 10 does not need to move in the Y-axis direction only for application of the adhesive to P1, as long as it exists within the application possible region of the second nozzle 22a. Further, by changing the distance between the nozzles, it is possible to apply the adhesive to P1 between the application of cream solder to each solder application position.

(Embodiment 3)
As a third embodiment of the present invention, a viscous fluid applying apparatus 103 having two nozzles for discharging solder and one nozzle for discharging adhesive will be described.

  FIG. 13 is a top view showing a main configuration of the viscous fluid applying apparatus 103 according to the third embodiment.

  A viscous fluid applying apparatus 103 shown in FIG. 8 is an apparatus that applies cream solder and an adhesive to a substrate in the same manner as the viscous fluid applying apparatus 101 of the first embodiment.

  The basic configuration is the same as that of the viscous fluid applying apparatus 101 of the first embodiment, and the operation of each component is controlled by the control unit 30 as in the viscous fluid applying apparatus 101.

  However, the viscous fluid applying device 103 includes a third head 13 for applying cream solder in addition to the first head 11 and the second head 22.

  The viscous fluid applying apparatus 103 according to the third embodiment includes two nozzles that discharge cream solder, so that cream solder can be simultaneously applied to two application positions.

  FIG. 14 is an enlarged perspective view showing the appearance of the vicinity of the coating unit 10 of the third embodiment.

  As shown in FIG. 14, the third head 13 moves in the Y-axis direction with respect to the base body 10a and also moves in the Z-axis direction.

  The movement of the third head 13 in the Y-axis direction relative to the base body 10 a is driven by the inter-nozzle distance changing unit 24, and the inter-nozzle distance changing unit 24 is controlled by the control unit 30.

  That is, under the control of the control unit 30, the distance between the first nozzle 11a and the third nozzle 13a is changed.

  By adopting such a configuration, the viscous fluid applying apparatus 103 can improve the efficiency of the application work of the cream solder and the adhesive onto the substrate.

  Further, the basic flow of the viscous fluid application of the viscous fluid application device 103 is the same as that of the viscous fluid application device 101 of the first embodiment (see FIG. 5).

  That is, the application order of the cream solder is determined, and the application order of the adhesives in the entire application operation is determined from the movement path of the second nozzle 22a based on the determination.

  However, since the viscous fluid application device 103 applies the cream solder to the substrate with two nozzles (the first nozzle 11a and the third nozzle 13a) that can change the distance between the nozzles, the procedure for determining the application order of the cream solder is performed. This is different from the first form.

  FIG. 15 is a flowchart showing a procedure for determining the application order of cream solder in the third embodiment.

  The determination unit 32 determines one solder application position to be applied by the first nozzle 11a from among a plurality of solder application positions indicated in the application data (S21).

  Next, the determination unit 32 confirms whether or not the solder application position is within the application possible range of the third nozzle 13a when the first nozzle 11a is positioned on the determined solder application position (S22).

  When there is a corresponding solder application position (Yes in S22), one solder application position to be applied by the third nozzle 13a is determined from the corresponding solder application positions (S3).

  Thereafter, when the nozzles (first nozzle 11a or third nozzle 13a) in charge of application are not determined for all solder application positions (No in S24), determination of the application position to be applied by the first nozzle 11a (S21). Migrate to

  Thus, when the nozzles in charge of application are determined for all solder application positions (Yes in S24), it is determined at which timing the adhesive is applied next.

  A specific example of the operation related to the application of the cream solder and the adhesive of the viscous fluid applying apparatus 103 described above will be described with reference to FIGS.

  FIG. 16 is a diagram illustrating an example of the substrate 50 in which various regions having different arrangements of application positions exist.

  A substrate 50 shown in FIG. 16 is an example of a substrate having a chip component region, an IC region, and a special component region having different arrangements of application positions.

  The chip component area is an area where a plurality of chip components are mounted. In FIG. 16, A1 and B1, A2 and B2,..., C1 and D1, and the two coating positions that face each other in the A row and the B row and the C row and the D row exist in one chip component. It corresponds.

  In addition, since both ends of a chip component are generally soldered to the substrate, there are two sets of application positions on the substrate in this way.

  Further, the IC area shown in FIG. 16 is the same as the IC area shown in FIG. In addition, it is assumed that the adhesive application position P1 is on a straight line parallel to the Y axis extending from A1 of the chip part region.

  The special component region is a region where two special components are mounted, and each of M1 and M2 is a cream solder application position for mounting one special component.

  As shown in FIG. 16, when the chip component area, the IC area, and the special component area exist on the substrate 50, the viscous fluid application device 103 performs, for example, a cream in the order of the chip component area, the IC area, and the special component area. Perform solder application.

  First, the procedure for determining the application order for each solder application position in the chip component area will be described.

  When the solder application position is arranged as shown in the figure, the determination unit 32 is located, for example, on the application unit 10 side (left side in the drawing) closest to the first nozzle 11a side (from the plurality of solder application positions ( A1 on the lower side in the figure is determined as the application position where the first nozzle 11a applies first.

  Further, when A1 is used as a reference, that is, when the first nozzle 11a is positioned on A1, any one of B1, C1, and D1 included in the applicable range of the third nozzle 13a is set as the third nozzle 13a. Assign to.

  Here, when D1 is assigned to the third nozzle 13a, the first nozzle 11a and the third nozzle 13a are applied simultaneously to the application positions of the A row and the D row by the first nozzle 11a and the third nozzle 13a. It is also conceivable to change the distance to 13a and apply each coating position in the B row and C row simultaneously.

  However, when B1 is assigned to the third nozzle 13a, the distance between the first nozzle 11a and the third nozzle 13a is adjusted to the distance between A1 and B1, for example, (A1, B1), (A2, B2), (A3, B3), (A4, B4), (C4, D4), (C3, D3), (C2, D2), (C1, D1) in order of cream solder to all application positions Can be applied.

  In addition, when describing (R, S), R shows the application position in which the 1st nozzle 11a applies cream solder, and S shows the application position in which the 3rd nozzle 13a applies cream solder. The same applies to the following description.

  In addition, when C1 is assigned to the third nozzle 13a, for example, (A1, C1),..., (A4, C4), (B4, D4),. Cream solder can be applied to the application position.

  Further, when B1 is assigned to the third nozzle 13a (pattern α) and C1 is assigned to the third nozzle 13a (pattern β), the movement distance in the X-axis direction from the start to the end of application of the application unit 10 is compared. Are the same.

  However, the movement distance from the start to the end of application in the Y-axis direction of the application unit 10 is shorter in the pattern β.

  Specifically, in the pattern α, the movement distance of the coating unit 10 in the Y-axis direction is the movement distance when moving from (A4, B4) to (C4, D4), and between the A row and the C row. Distance (= distance between row B and row C).

  On the other hand, in the pattern β, the movement distance in the Y-axis direction of the coating unit 10 is a movement distance when moving from (A4, C4) to (B4, D4), and between the A row and the B row. Distance (= distance between column C and column D).

  From the above, the movement distance from the start to the end of application of the application unit 10 is shorter in the pattern β than in the pattern α.

  In addition, since the pattern β has a longer distance between the first nozzle 11a and the third nozzle 13a, the moving distance of the third nozzle 13a before the start of coating may be longer than when the pattern α is adopted. .

  However, as described above, the motor included in the inter-nozzle distance changing unit 24 has a smaller output than the Y-axis motor 17, and the movement of the third nozzle 13a is also a relatively short distance.

  That is, the pattern β having a shorter moving distance of the coating unit 10 requires less power consumption for the coating operation.

  Accordingly, the determination unit 32 determines C1 as an application position where the first nozzle 11a applies cream solder to A1 and the third nozzle 13a applies cream solder.

  Next, the determination unit 32 determines A2 closest to A1 as the application position where the first nozzle 11a applies the cream solder next. Furthermore, C2, which is an application position where the third nozzle 13a can apply the cream solder without changing the inter-nozzle distance, is determined.

  In this way, the determination unit 32 sequentially determines the application position of each nozzle.

  FIG. 17A is a diagram illustrating an example of the coating order and nozzle assignment for the chip component region determined by the determination unit 32.

By this determination, the first nozzle 11a and the third nozzle 13a simultaneously apply cream solder to each solder application position in charge while keeping the distance between them at L _n 2.

  In this case, compared with the case where no simultaneous application is performed, the application operation is completed in approximately half the time.

  Next, a procedure for determining the application order for each solder application position in the IC area will be described.

  When the solder application position is arranged as shown in the drawing in the IC region, the determination unit 32, for example, selects H9 that is closest to the application unit 10 and that is on the first nozzle 11a side, and the first nozzle 11a first It is determined as the application position to be applied.

  Furthermore, when H9 is used as a reference, any one of H1 to H8 included in the applicable range of the third nozzle 13a is assigned to the third nozzle 13a.

  Here, when applying cream solder with two nozzles to nine locations H1 to H9, the application operation is completed by four simultaneous coatings for eight consecutive locations, and one nozzle for the remaining one location. Application of cream solder is most efficient.

  Therefore, the determination unit 32 determines, for example, that the application operation is completed by four simultaneous applications for H2 to H9, and cream solder is applied by one nozzle for the remaining H1.

  Furthermore, in order to simultaneously apply two places at eight places without changing the inter-nozzle distance, H8, H7 and H5 can be considered as the application positions where the third nozzle 13a first applies the cream solder.

  That is, when two adjacent application positions are set as a set (H9, H8), (H7, H6), (H5, H4) (H3, H2) in this order, H2 to H9 are four in the center. When applying in order of (H9, H5), (H8, H4), (H7, H3), (H6, H2) by assigning each nozzle separately, and simultaneous application at two places for four places It is considered that the coating is performed twice in the order of (H9, H7), (H8, H6), (H5, H3), (H4, H2).

  Comparing the movement distance of the coating unit 10 in these three cases, the movement distance of the coating unit 10 in the second case is the shortest distance from H9 to H6.

  Accordingly, the determination unit 32 determines that the application position at which the third nozzle 13a first applies the cream solder is H5.

  The determination unit 32 further determines positions where the first nozzle 11a and the third nozzle 13a are shifted in the direction of decreasing the number one by one as the application positions where the cream solder is applied.

  For the remaining H1, it is determined that the third nozzle 13a close to H2 applies cream solder at the time of (H6, H2).

  FIG. 17B is a diagram showing an example of the application order and nozzle assignment for the IC region determined by the determination unit 32 in this way.

By this determination, the first nozzle 11a and the third nozzle 13a apply cream solder to the application positions H9 to H2 at the same time while keeping the distance between them at L _n 3. Moreover, the 3rd nozzle 13a will apply | coat cream solder with respect to H1.

  When the third nozzle 13a applies cream solder to H1, the application unit 10 moves in the Y-axis direction to position the third nozzle 13a on H1. Alternatively, the coating unit 10 does not move, and the third nozzle 13a moves in the Y-axis direction with respect to the base body 10a, thereby positioning the third nozzle 13a on H1.

  When the determination unit 32 determines the application order and nozzle allocation for the H row in this way, the application is performed for the G row and the K row that are close to the application unit 10 at the end of cream solder application to the H row. Determine order and nozzle assignment.

  At the end of application of cream solder to the H row, the first nozzle 11a exists on H6 or H5. Therefore, the determination unit 32 determines G1 that is close to the first nozzle 11a among the application positions in the G row as an application position at which the first nozzle 11a applies next to H6.

  Furthermore, when G1 is used as a reference, K1 included in the applicable range of the third nozzle 13a is assigned to the third nozzle 13a.

  The determination unit 32 further determines positions where the first nozzle 11a and the third nozzle 13a are shifted in the direction of increasing the number one by one as the application positions where the cream solder is applied.

  FIG. 17C is a diagram illustrating the application order and nozzle assignment determined by the determination unit 32 in this manner.

This decision, the first nozzle 11a and the third nozzle 13a, while keeping the distance between each other to L _n 4, a cream solder at the same time for each application position of the G column or K columns each charge applied Will be.

  When the determination unit 32 determines the application order and nozzle assignment for the G and K rows in this manner, the determination unit 32 determines the application order and nozzle assignment for the remaining J rows.

  At the end of the application of cream solder to the G row and the K row, the first nozzle 11a is above G9. Therefore, the determination unit 32 determines J9 closest to the first nozzle 11a among the application positions in the J row as the application position at which the first nozzle 11a applies next to G9.

  Here, the J column is a column in which the same number of application positions are arranged in the same direction as the H column in which the application order and nozzle assignment have been determined previously.

  Therefore, as in the case of the H row, the determination unit 32 assigns J5, which is one starting point when the eight application positions J9 to J2 are divided at the center of the row, to the third nozzle 13a.

  The determination unit 32 further determines positions where the first nozzle 11a and the third nozzle 13a are shifted in the direction of decreasing the number one by one as the application positions where the cream solder is applied.

  FIG. 17D is a diagram illustrating the application order and nozzle assignment determined by the determination unit 32 in this manner.

With this determination, the first nozzle 11a and the third nozzle 13a simultaneously apply cream solder to each application position of J9 to J2 in charge while maintaining the distance between them at L _n 3. It becomes. For J1, the third nozzle 13a applies cream solder.

  By the flow as described above, the nozzles for applying the cream solder are determined at all the solder application positions in the H row, the G row, the K row, and the J row, and the application order is also determined.

  Next, a procedure for determining the application order for each solder application position in the special component area will be described.

  The first nozzle 11a is positioned on J5 or J6 and the third nozzle 13a is positioned on J1 at the end of application of cream solder to the J row in the IC area.

  Therefore, the determination unit 32 determines M1 closest to the third nozzle 13a as the application position at which the third nozzle 13a applies next to J1.

  For M2, it is determined that the third nozzle 13a existing near M2 is applied when cream solder is applied to M1.

  As described above, the application order of the cream solder to the substrate 50 shown in FIG. 16 is determined.

  When determining the cream solder application order, the determination unit 32 determines the adhesive application order.

  Specifically, it is determined at which timing before or after the cream solder application sequence determined as described above or at which timing the adhesive is applied to P1.

  Here, as shown in FIG. 16, P1 exists on a straight line extending parallel to the Y axis from G5.

  Therefore, the determination unit 32 determines, for example, that the first nozzle 11a causes the second nozzle 22a to apply the adhesive to P1 immediately before or after the cream solder is applied to G5.

  The control unit 30 controls the operation of the coating unit 10 in accordance with the allocation of the coating order nozzle determined in this way.

  FIG. 18 is a time chart showing the flow of operation of the viscous fluid applying apparatus 103 when cream solder and an adhesive are applied to the substrate 50 shown in FIG.

  In FIG. 18, “XY robot” means an entire mechanism that includes the Y-axis motor 17, the X-axis motor 18, the beam 16, and the like and moves the coating unit 10 in the Y-axis direction and the X-axis direction.

  As shown in FIG. 18, the application unit 10 first moves to an initial position for application of cream solder to the chip component region.

At this time, the distance between the first nozzle 11a and the third nozzle 13a is changed to L _n 2.

  Thereafter, simultaneous application to A1 to A4 and C1 to C4 by the first nozzle 11a and the third nozzle 13a is executed while sandwiching the movement of the application unit 10 in the right direction in the drawing parallel to the X axis.

  Further, after the simultaneous application to A3 and C3, the application unit 10 moves so that the application nozzle 10 is positioned on the P1 of the IC region by the second nozzle 22a. After this movement, an adhesive is applied to P1 by the second nozzle 22a.

  The adhesive may be applied to P1 before simultaneous application to A3 and C3.

  When the application of the cream solder to A4 and C4 is completed, the application unit 10 moves in parallel to the Y axis so that the first nozzle 11a is positioned on D4. By this movement, the third nozzle 13a is positioned on B4.

  Thereafter, simultaneous application to B4 to B1 and D4 to D1 by the first nozzle 11a and the third nozzle 13a is performed while sandwiching the movement of the application unit 10 in the left direction in parallel with the X axis.

  When the application of the cream solder to the chip component area and the application of the adhesive to P1 is completed in this way, the application unit 10 moves to the initial position for applying the cream solder to the IC area.

At this time, the distance between the first nozzle 11a and the third nozzle 13a is changed to L _n 3.

  Thereafter, simultaneous application to the H rows by the first nozzle 11a and the third nozzle 13a is executed while sandwiching the upward movement in the drawing parallel to the Y axis of the application unit 10. When the third nozzle 13a applies cream solder to H1, the first nozzle 11a does not discharge solder.

  When application to the H row is completed, the application unit 10 moves to an initial position for applying cream solder to the G row and the K row.

At this time, the distance between the first nozzle 11a and the third nozzle 13a is changed to L _n 4.

  Thereafter, simultaneous application to the G row and the K row by the first nozzle 11a and the third nozzle 13a is performed while sandwiching the movement of the coating unit 10 in the right direction in the drawing parallel to the X axis.

  When application to the G row and the K row is completed, the application unit 10 moves to an initial position for applying cream solder to the J row.

At this time, the distance between the first nozzle 11a and the third nozzle 13a is changed to L _n 3.

  Thereafter, simultaneous application to the J rows by the first nozzle 11a and the third nozzle 13a is executed while sandwiching the upward movement in the drawing parallel to the Y axis of the application unit 10. When the third nozzle 13a applies cream solder to J1, the first nozzle 11a does not discharge solder.

  When the application of cream solder to the IC area is completed in this way, the application unit 10 moves to the initial position for application of cream solder to the special component area.

  After this movement, cream solder is applied by the third nozzle 13a in the order of M1 and M2.

  As described above, the viscous fluid coating device 103 includes the first nozzle 11a and the third nozzle 13a that can change the distance between each other, so that the number of coating positions existing on one substrate is 2. A viscous fluid can be efficiently applied with two nozzles.

  Also, for example, immediately after the simultaneous application of cream solder to a certain substrate is performed by these two nozzles, the simultaneous application of cream solder to another substrate having a completely different application position can be executed.

  In other words, unlike the conventional viscous fluid application apparatus, the application of the viscous fluid to one substrate by one nozzle is performed in parallel, so that the working efficiency related to the application of the viscous fluid is not improved. By realizing the simultaneous application of the viscous fluid to one substrate, the working efficiency related to the application of the viscous fluid can be improved.

  These nozzles are provided in one base 10a, and the distance between the nozzles is changed by the inter-nozzle distance changing section 24 of the base 10a.

  The inter-nozzle distance changing unit 24 only changes the relative position of the third nozzle 13a with respect to the first nozzle 11a, and can be realized by a small output motor as described above.

  That is, the only motor for changing the position of the entire mechanism for applying the viscous fluid to the substrate is a set of motors (the Y-axis motor 17 and the X-axis motor 18) for moving the application unit 10.

  Therefore, the viscous fluid applying apparatus 103 can efficiently apply the viscous fluid to the substrate also from the viewpoint of power consumption.

  Furthermore, the application unit 10 of the viscous fluid application device 103 includes a second nozzle 22a for discharging an adhesive in addition to the two nozzles for applying the cream solder.

  Thereby, application | coating of an adhesive agent can be completed between the periods when the simultaneous application | coating of cream solder is performed as mentioned above. In other words, the viscous fluid can be efficiently applied to the substrate that needs to be applied with the cream solder and the adhesive.

  Thus, the viscous fluid coating apparatus 103 according to the present embodiment can improve the working efficiency related to the application of the viscous fluid without increasing the size of the apparatus.

  In addition, each of the application | coating order and nozzle allocation demonstrated using FIG. 17 etc. is an example, and is not limited to these demonstrated application | coating order.

For example, when applying cream solder to the IC region shown in FIG. 16, the distance between the first nozzle 11a and the third nozzle 13a is kept at L _n 3 and simultaneously in the H and J rows. Application may be performed.

In this case, after applying continuously to the H row and the J row, the inter-nozzle distance is changed to L _n 4 and the first nozzle 11a and the third nozzle 13a are simultaneously applied to the G row and the K row. Should be executed.

  Further, in the time chart shown in FIG. 18, the application of the adhesive to P1 may be at another timing.

  For example, since G5 exists on a straight line extending from P1 in the Y-axis direction, the first nozzle 11a and the third nozzle 13a may apply P1 by the second nozzle 22a before or after simultaneously applying cream solder to G5 and K5. You may apply the adhesive agent to.

  Further, in the present embodiment, the case where the viscous fluid applying device 103 applies cream solder to a substrate having a plurality of solder application positions arranged at equal intervals has been described.

  However, the substrate to which the viscous fluid application device 103 is to be applied with the viscous fluid is not limited to such a substrate.

  Among the plurality of solder application positions on the substrate, there are at least two application positions on a straight line parallel to the arrangement direction of the first nozzle 11a and the third nozzle 13a, and the distance between the two application positions is the first. If it is within the maximum distance between the nozzle 11a and the third nozzle 13a, the cream solder can be simultaneously applied to the two application positions.

  Therefore, even with such a substrate, the coating operation can be completed in a shorter time than when no simultaneous coating is performed.

  In the present embodiment, the second nozzle 22a that discharges the adhesive is not moved in the Y-axis direction with respect to the base body 10a.

  However, the second nozzle 22a may move in the Y-axis direction with respect to the base body 10a.

  In this case, as described in Embodiment 2, the opportunity for simultaneous application of cream solder and adhesive to one substrate increases.

  For example, when both the third nozzle 13a and the second nozzle 22a are movable in the Y-axis direction with respect to the base body 10a, simultaneous application of cream solder to A3 and C3 is performed by the first nozzle 11a and the third nozzle 13a. The adhesive can be applied to P1 by the second nozzle 22a at the timing to be performed. That is, simultaneous application of viscous fluid to three locations is possible.

  Thus, by increasing the degree of freedom of each nozzle with respect to the base body 10a, it is possible to widen the application possible area of each nozzle without moving the entire coating unit 10.

  Moreover, the possibility of the simultaneous application | coating of two or more places improves with respect to the arrangement | sequence of the application position of various patterns because the application | coating area | region of each nozzle spreads.

  When the chip component is large, the chip component may move before the chip component is mounted on the cream solder and the solder is melted and joined in the reflow furnace. Therefore, an adhesive may be applied to the mounting position of the chip component on the substrate.

  FIG. 19 is a diagram showing an example of the adhesive application position in the chip component region on the substrate.

  Thus, the adhesive is applied between two solder application positions corresponding to one chip component, such as between A1 and B1 and between A2 and B2.

  When such a plurality of solder application positions exist in the chip component region of the substrate 50 shown in FIG. 16, for example, before applying cream solder to the chip component region, each adhesive application in the chip component region is applied. The adhesive is applied to the position by the second nozzle 22a.

  Thereafter, cream solder or adhesive is applied to each application position in the order shown in FIG.

  Thereby, the cream solder or the adhesive can be applied to all application positions on the substrate 50.

(Embodiment 4)
As a fourth embodiment of the present invention, a viscous fluid coating apparatus 104 in which the coating unit 10 is movable not only in the Y axis direction but also in the X axis direction with respect to the beam 16 will be described.

  FIG. 20 is a top view illustrating a main configuration of the viscous fluid applying apparatus 104 according to the fourth embodiment.

  A viscous fluid applying apparatus 104 shown in FIG. 20 is an apparatus that applies cream solder to a substrate in the same manner as the viscous fluid applying apparatus 101 of the first embodiment.

  The basic configuration is the same as that of the viscous fluid applying apparatus 101 of the first embodiment, and the operation of each component is controlled by the control unit 30 as in the viscous fluid applying apparatus 101.

  The first head 11 includes a first nozzle 11a, the second head 22 includes a second nozzle 22a, and the third head 13 includes a third nozzle 13a in the direction of the table 15 (not shown in FIG. 20). ).

  However, in the viscous fluid coating device 104, the coating unit 10 is attached to the beam 16 via the sub beam 16a. Further, the coating unit 10 is movable in the X-axis direction with respect to the sub beam 16a.

  That is, the coating unit 10 can move not only in the Y-axis direction with respect to the beam 16 but also in the X-axis direction.

  The movement of the coating unit 10 in the X-axis direction is controlled by the control unit 30. Further, the movable direction and movable range of the coating unit 10 of the first head 11 and the third head 13 are the same as those in the third embodiment.

  Accordingly, when the cream solder is sequentially applied to each application position on the substrate 50 while the application unit 10 moves in the X-axis direction, the beam 16 may remain stationary.

  That is, the application unit 10 can be moved in the X-axis direction by driving a motor having a relatively small output, not by driving the X-axis motor 18.

For example, when applying cream solder to the chip component region on the substrate 50 shown in FIG. 16, the application unit 10 moves in the X-axis direction along the sub-beam 16a while keeping the distance between the nozzles at L _n 2. Thus, cream solder can be applied simultaneously in the order of (A1, C1), (A2, C2),.

  Further, an adhesive can be applied to P1 by the second nozzle 22a between the cream solder application operations.

  As described above, by increasing the degree of freedom of the application unit 10 with respect to the beam 16, the application of the cream solder and the adhesive to the substrate can be performed more efficiently.

  In addition, it is possible to reduce the use time and use frequency of a motor with relatively large power consumption.

  Therefore, the viscous fluid application device 104 is also a device that realizes improvement in working efficiency related to application of viscous fluid without increasing the size of the device, similar to the above-described viscous fluid application device 101 and the like.

(Embodiment 5)
As a fifth embodiment of the present invention, a viscous fluid coating apparatus 105 in which both the first head 11 and the third head 13 can move in the X-axis direction and the Y-axis direction in the coating unit 10 will be described.

  FIG. 21 is a top view showing a main configuration of the viscous fluid applying apparatus 105 according to the fifth embodiment.

  A viscous fluid applying apparatus 105 shown in FIG. 21 is an apparatus that applies cream solder to a substrate, similar to the viscous fluid applying apparatus 101 of the first embodiment.

  The basic configuration is the same as that of the viscous fluid applying apparatus 101 of the first embodiment, and the operation of each component is controlled by the control unit 30 as in the viscous fluid applying apparatus 101.

  The first head 11 includes a first nozzle 11a, the second head 22 includes a second nozzle 22a, and the third head 13 includes a third nozzle 13a in the direction of the table 15 (not shown in FIG. 21). ).

  However, in the coating unit 10 of the viscous fluid coating apparatus 105, the first head 11 and the third head 13 are both movable in the Y-axis direction and the X-axis direction.

  Specifically, the first head 11 is attached to the first arm 11b so as to be movable in the X-axis direction, and the first arm 11b is movable in the Y-axis direction with respect to the base body 10a.

  The third head 13 is attached to the second arm 13b so as to be movable in the X-axis direction, and the second arm 13b is movable in the Y-axis direction with respect to the base body 10a.

  The first arm 11b and the second arm 13b are driven to move in the Y-axis direction relative to the base body 10a by the inter-nozzle distance changing unit 24.

  Further, the first head 11 moves in the X-axis direction along the first arm 11b from, for example, a motor included in the base body 10a. Similarly, the third head 13 is moved in the X-axis direction along the second arm 13b by, for example, a motor included in the base 10a.

  Since these motors are only responsible for movement along the respective arms of the first head 11 or the third head 13, they are of small output, similar to the motor of the inter-nozzle distance changing unit 24.

  For example, each of the first head 11 and the third head 13 may be independently moved by a combination of one motor and a plurality of gears.

  Further, the movement of the first head 11 in the Y-axis direction with respect to the first arm 11b, the movement of the third head 13 in the Y-axis direction with respect to the second arm 13b, and the movement of the first arm 11b and the second arm 13b in the Y-axis direction. The movement is controlled by the control unit 30.

  As described above, in the viscous fluid applying apparatus 105 according to the present embodiment, the first head 11 and the third head 13 are held by the base body 10a while having freedom in the XY directions with respect to the base body 10a.

  Since the first head 11 and the third head 13 have such degrees of freedom, for example, the IC area on the substrate 50 shown in FIG. 16 is included in the areas where the first nozzle 11a and the third nozzle 13a can be applied. There is a case.

  In this case, it is possible to apply cream solder to each application position in the IC region by moving only the first nozzle 11a and the third nozzle 13a while the base 10a is stationary.

  In other words, when considering from the start to the end of the application of cream solder to the IC area, the Y-axis motor 17 and the X-axis motor 18 only operate when moving the application unit 10 to the application start position. is there.

  Thereafter, the movement of the first nozzle 11a and the third nozzle 13a is driven by a motor having a relatively small output. Thereby, simultaneous application | coating of the cream solder with respect to each application position is performed.

  Thus, the simultaneous application | coating by the 1st nozzle 11a and the 3rd nozzle 13a can be performed more efficiently by increasing the freedom degree in the application | coating unit 10 of the 1st nozzle 11a and the 3rd nozzle 13a.

  Accordingly, the viscous fluid application device 105 is also a device that realizes improvement in work efficiency related to application of viscous fluid without increasing the size of the device, similar to the above-described viscous fluid application device 101 and the like.

(Embodiment 6)
As a sixth embodiment of the present invention, a viscous fluid applying device 106 in which the third head 13 for applying solder and the second head 22 for applying adhesive can move in the Y-axis direction with respect to the base body 10a will be described. .

  FIG. 22 is a top view showing a main configuration of the viscous fluid applying apparatus 106 according to the sixth embodiment.

  A viscous fluid application device 106 shown in FIG. 22 is a device that applies cream solder to a substrate, similar to the viscous fluid application device 101 of the first embodiment.

  The basic configuration is the same as that of the viscous fluid applying apparatus 101 of the first embodiment, and the operation of each component is controlled by the control unit 30 as in the viscous fluid applying apparatus 101.

  The first head 11 includes a first nozzle 11a, the second head 22 includes a second nozzle 22a, and the third head 13 includes a third nozzle 13a in the direction of the table 15 (not shown in FIG. 22). ).

  However, in the viscous fluid applying device 106, the third head 13 for applying solder and the second head 22 for applying adhesive are provided so as to be movable in the Y-axis direction with respect to the base body 10a.

  The base 10a is provided with two inter-nozzle distance changing units 24 so as to drive the respective movements, and the operation of the two inter-nozzle distance changing units 24 is controlled by the control unit 30.

  As a result, the possibility of simultaneous application to three locations, in which cream solder is simultaneously applied by the first nozzle 11a and the third nozzle 13a and adhesive is applied by the second nozzle 22a, is improved.

  Accordingly, the viscous fluid application device 106 is also a device that realizes improvement in working efficiency related to application of viscous fluid without increasing the size of the device, similar to the above-described viscous fluid application device 101 and the like.

  In order to more efficiently apply the viscous fluid, for example, a head for cream solder application or adhesive application may be provided on the side of the substrate 10a on which the second head 22 is provided.

  These heads may be movable in the X-axis direction and the Y-axis direction with respect to the base body 10a. Further, for example, the base body 10a shown in FIG. 22 may be separated at the beam 16 and each may be movable with respect to the beam 16 in the X-axis direction.

(Embodiment 7)
Each of the viscous fluid coating apparatuses 101 to 106 according to the first to sixth embodiments described above basically exists on a single substrate by moving the coating unit 10 including a plurality of nozzles in the XY directions. In this configuration, the viscous fluid is sequentially applied to a plurality of application positions.

  However, with the application unit 10 stationary in the apparatus, for example, the cream solder and the adhesive may be applied to one substrate by moving the table 15 in the XY direction.

  Therefore, as a seventh embodiment, a viscous fluid coating device 107 in which the table 15 moves in the XY direction will be described.

  FIG. 23 is a top view showing a main configuration of the viscous fluid applying apparatus 107 according to the seventh embodiment.

  A viscous fluid applying apparatus 107 shown in FIG. 23 is an apparatus that applies cream solder to a substrate in the same manner as the viscous fluid applying apparatus 101 of the first embodiment.

  The basic configuration is the same as that of the viscous fluid applying apparatus 101 of the first embodiment, and the operation of each component is controlled by the control unit 30 as in the viscous fluid applying apparatus 101.

  The application unit 10 includes a first head 11 and a second head 22 as in the viscous fluid application apparatus 101.

  The first head 11 is provided with a first nozzle 11a, and the second head 22 is provided with a second nozzle 22a in the direction of the table 15 (not shown in FIG. 23).

  However, the viscous fluid coating device 107 does not include the X-axis motor 18 that moves the beam 16 in the X-axis direction and the Y-axis motor 17 that moves the coating unit 10 along the beam 16 in the Y-axis direction. .

  That is, the beam 16 is fixed at a predetermined position of the viscous fluid coating device 107, and the coating unit 10 is also fixed at a predetermined position of the beam 16.

  However, the table 15 is provided so as to move under the control unit 30 in the X-axis direction and the Y-axis direction.

  Specifically, driving means for driving the movement of the table 15 in the X-axis direction and the Y-axis direction is provided, for example, under the table 15, and the control unit 30 controls the operation of this driving means.

  Thereby, the substrate 50 placed on the table 15 can be moved in the X-axis direction and the Y-axis direction with respect to the coating unit 10.

  That is, the relative position between the application unit 10 and the substrate 50 when the application unit 10 applies the viscous fluid to the substrate 50 can be changed in the same manner as the viscous fluid application apparatus 101 of the first embodiment.

  By adopting such a configuration, the viscous fluid applying apparatus 107 according to the seventh embodiment is similar to the viscous fluid applying apparatus 101 according to the first embodiment and the like in the interval between cream solder application operations on one substrate. Can be applied.

  Accordingly, the viscous fluid application device 107 is also a device that realizes improvement in work efficiency related to application of viscous fluid without increasing the size of the device, like the above-described viscous fluid application device 101 and the like.

  When the table 15 is moved in the XY directions as in the present embodiment, the first head 11 and the second head 22 may be directly attached to the beam 16. In this case, the beam 16 becomes a base in the viscous fluid coating apparatus of the present invention.

  In the present embodiment, the table 15 is moved in the X-axis direction and the Y-axis direction. However, for example, the table 15 may move only in the X axis direction, and the coating unit 10 may move only in the Y axis direction.

  Further, both the table 15 and the coating unit 10 may move in the X-axis direction and the Y-axis direction.

  That is, any of the coating unit 10 and the table 15 may move as long as the relative position between the coating unit 10 and the substrate can be changed.

  Further, the second head 22 may move in the Y-axis direction with respect to the base body 10a, similarly to the second head 22 in the second embodiment.

  Further, like the first head 11 or the third head 13 in the fifth embodiment, the head 10a may move in the X-axis direction.

  In this way, by increasing the degree of freedom of the second nozzle 22a that discharges the adhesive, the possibility of simultaneous application of cream solder and adhesive to one substrate is improved. Moreover, the efficiency of the application work is improved.

  In addition, the various structures, procedures, mechanisms, and the like described in the above embodiments may be combined as appropriate.

  For example, the viscous fluid coating apparatus includes a structure in which the table 15 described in the seventh embodiment moves and a structure in which the coating unit 10 described in the fourth embodiment can move in the X-axis direction with respect to the beam 16. Also good.

  Even in this case, the viscous fluid application apparatus is an apparatus that realizes improvement in work efficiency related to application of the viscous fluid without increasing the size of the apparatus.

  The present invention can be applied to an apparatus for applying a viscous fluid to a member. In particular, it is useful as an apparatus for applying cream solder and adhesive necessary for mounting components such as semiconductor elements to a substrate.

FIG. 3 is a top view showing a main configuration of the viscous fluid applying apparatus according to the first embodiment. FIG. 3 is an enlarged perspective view showing an appearance in the vicinity of a coating unit according to the first embodiment. It is a figure which shows an example of the structure for controlling the discharge amount of a 1st nozzle and a 2nd nozzle. 1 is a block diagram illustrating a main configuration of a viscous fluid applying apparatus according to a first embodiment. FIG. 3 is a flowchart showing an outline of an operation flow of the viscous fluid applying apparatus according to the first embodiment. It is a figure which shows an example of the IC area | region on a board | substrate. It is a figure which shows an example of the application sequence of cream solder and an adhesive agent in the viscous fluid application apparatus of Embodiment 1. It is a top view which shows the main structures of the viscous fluid application apparatus of Embodiment 2. FIG. 10 is an enlarged perspective view showing an appearance in the vicinity of a coating unit according to a second embodiment. FIG. 10 is a flowchart showing an outline of an operation flow of the viscous fluid applying apparatus according to the second embodiment. It is a figure which shows the example of the movement path | route of the 1st nozzle in Embodiment 2, and the application | coating possible area | region of a 2nd nozzle. It is a figure which shows an example of the application order of the cream solder and adhesive agent in the viscous fluid application apparatus of Embodiment 2. FIG. 6 is a top view showing a main configuration of a viscous fluid applying apparatus according to a third embodiment. FIG. 10 is an enlarged perspective view showing an appearance in the vicinity of a coating unit according to a third embodiment. FIG. 10 is a flowchart showing a procedure for determining the application order of cream solder in the third embodiment. It is a figure which shows an example of the board | substrate with which various area | regions from which the arrangement | sequence of an application position differs exist. (A) is a figure which shows an example of the application order and nozzle allocation with respect to the chip component area | region determined by the determination part of Embodiment 3, (B) is an example of the application order and nozzle allocation with respect to IC area | region. (C) is a second diagram, and (D) is a third diagram. It is a time chart which shows the flow of operation | movement of the viscous fluid application apparatus at the time of apply | coating cream solder and an adhesive agent to the board | substrate shown in FIG. It is a figure which shows the example of the adhesive agent application position in the chip | tip component area | region on a board | substrate. It is a top view which shows the main structures of the viscous fluid application apparatus of Embodiment 4. It is a top view which shows the main structures of the viscous fluid application apparatus of Embodiment 5. It is a top view which shows the main structures of the viscous fluid application apparatus of Embodiment 6. It is a top view which shows the main structures of the viscous fluid application apparatus of Embodiment 7. It is a figure which shows the main structures of the conventional adhesive agent coating apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Application | coating unit 10a Base | substrate 11 1st head 11a 1st nozzle 11b 1st arm 13 3rd head 13a 3rd nozzle 13b 2nd arm 15 Table 16 Beam 16a Sub beam 17 Y-axis motor 18 X-axis motor 19 Loading part 20 Unloading Unit 21 pressure control unit 22 second head 22a second nozzle 23 recognition unit 24 inter-nozzle distance change unit 25 mechanism unit 30 control unit 31 acquisition unit 32 determination unit 33 storage unit 34 operation unit 35 display unit 50 substrate 101, 102, 103 , 104, 105, 106, 107 Viscous fluid application device

Claims (4)

A viscous fluid application device for applying a viscous fluid to a substrate,
A first nozzle that applies the cream solder to a solder application position that is a position where the cream solder should be applied on one substrate by discharging the cream solder that is a viscous fluid;
A second nozzle that applies the adhesive to an adhesive application position on the substrate by discharging the adhesive that is a viscous fluid;
One base for holding the first nozzle and the second nozzle;
Driving means for changing a relative position of the base body and the substrate on a plane parallel to a surface of the substrate to which the viscous fluid is applied ;
The cream solder is discharged to the first nozzle and the adhesive is discharged to the second nozzle so that the cream solder is applied to the solder application position and the adhesive is applied to the adhesive application position. Control means for simultaneously performing application,
The second nozzle is held by the base body so that a distance between the nozzles between the second nozzle and the first nozzle can be changed.
And changing means for changing the inter-nozzle distance;
Obtaining means for obtaining application data which is data indicating the solder application position and the adhesive application position;
The control means may further be configured to position the first nozzle on the solder application position based on the application data before discharging the cream solder and the adhesive to the first nozzle and the second nozzle. The drive means to change the relative position, and the change means to change the inter-nozzle distance so that the second nozzle is located on the adhesive application position,
The application data is data indicating a plurality of solder application positions and one or more adhesive application positions on the substrate,
The control means further includes
Based on the application data, one solder application position is determined from the plurality of solder application positions, and the application range of the second nozzle when the first nozzle is positioned on the determined solder application position One adhesive application position located inside is determined by the second nozzle as an adhesive application position where the second nozzle applies the adhesive.
Viscous fluid application device. Wherein, by moving said substrate to said drive means, the viscous fluid application device of claim 1, wherein said first nozzle to change the relative position so as to be positioned on the solder coating position. And a table on which the substrate is placed and movable in a direction parallel to the surface of the substrate to which the viscous fluid is applied,
Wherein, by moving said table to said driving means, the viscous fluid application device of claim 1, wherein said first nozzle to change the relative position so as to be positioned on the solder coating position. Further, the held in distance changeably the substrate between the first nozzle, a viscous fluid application device according to any one of claim 1 3 comprising a third nozzle for discharging the cream solder.

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