JP2004146641A - Method for simulating optimized facility configuration in electronic part mounting line - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for simulating an optimized facility configuration in an electronic part mounting line which can select a facility configuration matching a target unit process time. <P>SOLUTION: The method for simulating the optimized facility configuration for selecting the configuration matching the target unit process time in the electronic part mounting line in which a plurality of electronic part mounting units are arranged includes the steps of forming production data based on mounting data and apparatus data, calculating the unit process time when the production of the substrate is performed in the electronic part mounting ling based on this production data, and determining whether the configuration is proper or not by comparing the calculated result with the target unit process time. If the configuration is determined to be improper to perform the target unit process time, the configuration is changed, and the unit process simulation and the determination of the facility to be proper or not are repeatedly performed. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an equipment configuration optimization simulation method for an electronic component mounting line that performs a simulation for optimizing the equipment configuration of an electronic component mounting line.
[0002]
[Prior art]
An electronic component mounting line used for manufacturing a mounting board is configured by connecting a plurality of electronic component mounting apparatuses, and the mounting board is manufactured by the electronic component mounting line through a number of processes. As a method of performing production control of such electronic components, a method of performing a simulation for production control by a computer has been used (for example, see Patent Document 1).
[0003]
[Patent Document 1]
JP-A-7-40206
[0004]
[Problems to be solved by the invention]
In recent years, electronic equipment production sites have been required to be capable of handling a wide variety of products, so it is necessary to change the equipment configuration, that is, the combination of electronic component mounting devices that make up the same electronic component mounting line, according to the board to be produced. It has become required. When a production plan for execution is drafted at the production site, the production capacity of the electronic component mounting line, that is, the tact time indicating the time required for one board satisfies the target tact time given as a target value by the basic production plan. It is important to determine whether you are doing it.
[0005]
However, when performing a mounting operation on a plurality of types of boards in a flexible electronic component mounting line in which the equipment configuration can be changed, the production capacity differs for each board and also depending on the maintenance configuration. For this reason, when performing a mounting operation on a plurality of types of boards in a flexible electronic component mounting line as described above, it is difficult to select an optimal equipment configuration corresponding to each board, and the target tact time is reduced. There is a problem that it is difficult to realize a matched equipment configuration.
[0006]
Therefore, an object of the present invention is to provide an equipment configuration optimization simulation method in an electronic component mounting line that can select an equipment configuration that matches a target tact time.
[0007]
[Means for Solving the Problems]
The method for simulating equipment configuration optimization in an electronic component mounting line according to claim 1, wherein the electronic component mounting line includes a plurality of electronic component mounting apparatuses arranged to pick up an electronic component from a component supply unit using a transfer head and mount the electronic component on a substrate. A method for simulating equipment configuration optimization in an electronic component mounting line for optimizing a combination of types of the electronic component mounting apparatus under given conditions, wherein the method is used for mounting data relating to a board to be produced and for producing the board. Storing in advance device data relating to a plurality of electronic component mounting apparatuses, and production data necessary for causing a transfer head to perform a mounting operation in the plurality of electronic component mounting apparatuses based on the mounting data and the device data. And input the target tact time of the board to be produced And the tact time when the production of the board is performed in the electronic component mounting line based on the equipment configuration data and the production data indicating the combination of the electronic component mounting apparatus constituting the electronic component mounting line. A tact simulation step, and a facility suitability determination step of comparing the calculation result of the tact simulation step with a target tact time to determine the suitability of the facility configuration. If it is determined that the tact simulation is inappropriate for the achievement, the tact simulation step and the equipment suitability determination step are repeatedly executed after changing the equipment configuration based on the calculation result of the tact simulation.
[0008]
According to the present invention, a tact simulation for calculating a tact time when a board is produced in an electronic component mounting line based on equipment configuration data and production data, and a calculation result of the tact simulation are compared with a target tact time. It is possible to select the equipment configuration that matches the target tact time by repeatedly performing the equipment appropriateness determination for determining the appropriateness of the equipment configuration.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of an electronic component mounting line according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of a mounting facility configuration of an electronic component mounting line according to an embodiment of the present invention, and FIG. FIG. 4 is a plan view of an electronic component mounting apparatus constituting an electronic component mounting line according to the first embodiment. FIG. 4 is a diagram showing storage contents of a program storage unit and a data storage unit of a simulation apparatus according to one embodiment of the present invention. FIG. 6 is a diagram showing feeder arrangement data of an electronic component mounting apparatus according to an embodiment of the present invention; FIG. 6 is a functional block diagram illustrating processing functions of a simulation apparatus according to an embodiment of the present invention; FIG. 8 is a flow chart of a facility configuration optimizing process by the simulation apparatus of the embodiment, and FIG. 8 is a flowchart of a facility configuration changing process by the simulation apparatus of one embodiment of the present invention.
[0010]
First, an electronic component mounting line will be described with reference to FIG. The plurality of electronic component mounting apparatuses M1, M2,... Constituting the electronic component mounting line 1 are connected to a host computer 3 by a LAN system 2. A simulation device 4 is connected to the host computer 3. The simulation device 4 has a function of performing various processes for optimizing a mounting operation performed by the electronic component mounting line 1. These functions include a production data creation function for optimizing a mounting operation in each electronic component mounting apparatus, as described later, and a configuration of the mounting apparatus constituting the electronic component mounting line 1 which matches a target tact time. And a tact simulation function for achieving a optimized configuration.
[0011]
The simulation device 4 has the same configuration as a general personal computer, and includes a communication unit 5, a read / write unit 6, a display unit 7, a calculation unit 8, a program storage unit 9, a data storage unit 10, and an operation / input unit 11. ing. The communication unit 5 exchanges data with the host computer 3. The read / write unit 6 reads data from external storage media such as FDs and CD-Rs and writes data to these external storage media. The display unit 7 is a display monitor, and displays an operation / input guidance screen and a graph of various simulation results.
[0012]
The calculation unit 8 is a CPU, and performs various calculations and processes by using the various data stored in the data storage unit 10 and executing the processing programs stored in the program storage unit 9. The program storage unit 9 stores various processing programs such as a production data creation program, an optimization calculation program, and a tact simulation program described later. The data storage unit 10 stores various data such as device data for the electronic component mounting line 1 and mounting data for a board to be produced. The operation / input unit 11 is a keyboard, a mouse, and the like, and performs data input and operation instruction input.
[0013]
Next, a configuration of a mounting facility of the electronic component mounting line 1 will be described with reference to FIG. In FIG. 2, the electronic component mounting line 1 has a configuration in which a plurality of electronic component mounting apparatuses are connected in series. Each of the electronic component mounting apparatuses is not the same type of equipment. In the example shown in FIG. 2, two types of electronic component mounting apparatuses having different characteristics, that is, a high-speed mounting apparatus and a multi-function mounting apparatus, are combined. Also, the number of electronic component mounting apparatuses included in the electronic component mounting line 1 is not always the same, and the number is increased or decreased according to a board to be produced and a required production tact time.
[0014]
That is, FIG. 2A shows a mounting facility configuration in which two high-speed mounting apparatuses and one multi-function mounting apparatus are connected, and FIG. 2B shows one mounting apparatus and two multi-function mounting apparatuses. It has a mounting facility configuration in which multifunctional mounting devices are connected. FIG. 2C shows a mounting facility configuration in which the total number is increased and three high-speed mounting apparatuses are connected to one multi-function mounting apparatus.
[0015]
Next, an electronic component mounting apparatus that forms the electronic component mounting line 1 will be described with reference to FIG. Each of these electronic component mounting apparatuses has a configuration in which electronic components are picked up by a transfer head from a component supply unit in which a plurality of parts feeders for supplying electronic components are arranged and mounted on a substrate. (A) and (b) show a high-speed mounting device and a multi-function mounting device, respectively. These electronic component mounting apparatuses have connection compatibility, and an electronic component mounting line can be configured by an arbitrary combination.
[0016]
In FIG. 3A, reference numeral 12 denotes a transport path provided in the electronic component mounting apparatus, and the transport path 12 transports the substrate 13 and positions it at a mounting position of the electronic component. A component supply unit 14 is arranged on the front side of the transport path 12, and a number of parts feeders 15 are arranged in the component supply unit 14. The parts feeder 15 accommodates electronic components held on a tape and feeds the electronic components by pitch feeding the tape, and a vibration feeder that supplies the electronic components accommodated in a stick by vibration. Includes different types of feeders.
[0017]
The electronic component mounting apparatus is provided with two transfer heads 16A. Each of the transfer heads 16A is moved by a head moving mechanism 17 composed of an XY table mechanism. To pick up. A camera 18 for recognizing electronic components is provided between the transport path 12 and the component supply unit 14. The transfer head 16A holding the electronic component moves from the component supply unit 14 onto the camera 18, where the electronic component is recognized. Thereafter, the transfer head 16A moves onto the substrate 13 and mounts the electronic component on the substrate 13.
[0018]
The transfer head 16A is a multi-type transfer head in which eight sets of unit transfer heads 16a mainly for small electronic components are assembled. Since eight electronic components can be simultaneously taken out and mounted on a substrate in one mounting turn that reciprocates twice, and two transfer heads 16A are arranged in one electronic component mounting apparatus, a short time is required. And a high-speed mounting apparatus capable of mounting a large number of electronic components.
[0019]
The electronic component mounting apparatus shown in FIG. 3B includes only one transfer head 16B having three sets of unit transfer heads 16b. The unit transfer head 16b can hold a large electronic component that cannot be held by the unit transfer head 16a, so that it can handle a wide variety of electronic components from small components to large components. Multifunctional mounting device. However, since only three electronic components can be held simultaneously in one mounting turn, it is not suitable for high-speed mounting.
[0020]
By combining two types of electronic component mounting apparatuses having different characteristics in this way, an optimal electronic component mounting line can be configured according to a substrate to be produced and a required production tact time. Of course, the types of electronic component mounting apparatuses are not limited to two types, and more types of electronic component mounting apparatuses may be used.
[0021]
Next, the storage contents of the program storage unit 9 and the data storage unit 10 will be described with reference to FIG. First, data contents stored in the data storage unit 10 will be described. The mounting data 10a is design information on a product to be produced, which indicates what type of electronic component is to be mounted on the substrate to be produced and at which position. Here, mounting coordinate data and types of electronic components mounted on each mounting point are given for a plurality of types of boards to be produced in the form of unique data on the boards. It is possible to grasp the amount of mounting work.
[0022]
The work distribution data 10b is data obtained by distributing the mounting operation for one board to each of the electronic component mounting apparatuses constituting the electronic component mounting line. The work distribution data 10b determines the workload of each electronic component mounting apparatus. You. When allocating the work, the operator may determine the total amount of mounting work of the board and allocate the work to each electronic component mounting apparatus, or may automatically allocate the work based on a predetermined logic.
[0023]
The device data 10c is equipment information of an electronic component mounting device used for the production of a mounting board, and here, placement data such as a mounting stage for positioning the board, a feeder table for supplying the mounted electronic component, and an electronic component. The configuration of a transfer head that takes out a component feeder arranged on a feeder table, transfers the component to a substrate on a mounting stage, and mounts the component is given as unique data for each electronic component mounting apparatus.
[0024]
The production data 10d is data created for operating the electronic component mounting apparatus to produce the mounting board, and is created based on the mounting data, the work distribution data for each electronic component mounting apparatus, and the apparatus data. You. In other words, by producing the production data, the kind, quantity and arrangement of the parts feeder and the like in the feeder table, and the suction order and the mounting order when the electronic components are sucked from the parts feeder by the transfer head and mounted on the board are determined. The mounting sequence data shown is created, and the electronic component mounting apparatus is operated based on the data, thereby producing a mounting board as instructed by the design information.
[0025]
When creating such production data, optimization is performed so that the work efficiency of taking out the electronic component by the transfer head and transferring and mounting the electronic component on the substrate is maximized under given conditions. In other words, even when producing a mounting board based on the same mounting data, if the setting of the feeder arrangement and the mounting sequence is inappropriate, the transfer head repeats unnecessary movement and repeats the same quantity of electronic components. The time required for mounting on a substrate is delayed, and mounting efficiency is reduced. For this reason, the feeder arrangement and the mounting sequence that minimize the total time required for the mounting operation by the transfer head are calculated.
[0026]
Next, among the above-described production data, feeder arrangement data for determining a feeder arrangement in the component supply unit 14 will be described. When the board type to be produced is switched, the component supply unit 14 performs a feeder rearrangement in which the arrangement of the parts feeder 15 is changed in accordance with the board type. That is, in order to supply electronic components of the type and quantity necessary for the production of the board, the required number of parts feeders 15 for supplying these types of electronic components are arranged.
[0027]
In this feeder arrangement, not only are the tape feeders of the type and the number corresponding to the electronic components to be mounted simply arranged, but also the arrangement of these parts feeders 15 in the component supply unit 14 needs to be determined appropriately. In the mounting operation, a mounting operation in which the transfer head 16 reciprocates between the component supply unit 14 and the substrate 13 to pick up electronic components from these parts feeders 5 and transfer and mount the electronic components on the substrate 13 is frequently repeated. Therefore, the operation efficiency of the transfer head largely depends on whether the arrangement of the parts feeders 15 in the parts supply unit 14 properly matches the mounting sequence. Therefore, when creating the feeder arrangement data for determining the feeder arrangement, the arrangement of the parts feeders 15 is determined for the purpose of optimizing the efficiency of the mounting operation by the transfer head.
[0028]
The feeder arrangement data is given in the form of a data table as shown in FIG. 5, and in the data table, each individual part is provided in a feeder arrangement column provided corresponding to the address of the feeder table of the component supply unit 4. Feeder names (a, b,...) And component names (Pa, Pb,...) For specifying the feeders, and other necessary data are assigned. The position of the parts feeder 15 in the parts supply unit 14 is fixed by the assignment of the feeder name on the data table.
[0029]
The target tact time 10e is a tact time specified in advance when producing a mounting board on the electronic component mounting line 1, and is stored in the data storage unit 10 when the operator inputs a numerical value from the operation / input unit 11. Is done. In the equipment structure optimization processing described later, an equipment structure that clears the target tact time is selected.
[0030]
The equipment change pattern data 10f is data in which the contents of change when changing the equipment configuration of the electronic component mounting line in advance when the target tact time cannot be cleared are patterned in advance. Here, as will be described later, the slowest device among the plurality of electronic component mounting devices, that is, the electronic component mounting device in which the tact time difference between the target tact time and the estimated arrival tact time is the largest, the type of the device and The content of the change is set in advance according to the value of the tact time difference. The equipment configuration data 10f is the current equipment configuration of the electronic component mounting line, and is constantly updated to a new equipment configuration every time the equipment configuration change processing is performed.
[0031]
Next, the contents of the program stored in the program storage unit 9 will be described with reference to the functional block diagram shown in FIG. Here, the production data creation processing unit 20, the tact simulation unit 21, the equipment suitability determination unit 22, and the equipment configuration change processing unit 23 are stored in the program storage unit 9 using the data stored in the data storage unit 10. The processing functions realized by executing the production data creation program 9a, the optimization calculation processing program 9b, the tact simulation program 9c, the equipment suitability determination program 9d, and the equipment configuration change processing program 9e are shown.
[0032]
The production data creation processing unit 20 generates production data necessary for performing the mounting operation by the transfer head 16 such as feeder arrangement data and mounting sequence data based on the mounting data 10a, the work distribution data 10b, and the device data 10c. Perform the creation process. In this process, the mounting operation by the transfer head 16 is optimized by executing the optimization operation processing program 9b. The production data creation processing unit 20 is a production data creation unit, and the created production data 10d is stored in the data storage unit 10.
[0033]
The tact simulation unit 21 performs the tact simulation by executing the tact simulation program 9c using the production data 10d thus created. That is, since the production data 10d includes all information necessary for executing the operation of the transfer head 16 such as feeder arrangement data and mounting sequence data, the production data 10d is executed in each electronic component mounting apparatus to execute the production data 10d. Can be obtained by calculation.
[0034]
The equipment suitability determination unit 22 determines whether the equipment configuration of the electronic component mounting line is appropriate by comparing the calculation result of the tact simulation unit 21 with the target tact time input and input. The facility configuration change processing unit 23 performs a process of changing the facility configuration based on the calculation result of the tact simulation unit 21 when the facility suitability determination unit 22 determines that the facility configuration is inappropriate for achieving the target tact time. Do. In the setting change process, the change content is automatically selected based on the tact simulation result and the equipment change pattern data 10f.
[0035]
Next, the equipment configuration optimization processing will be described with reference to FIG. This processing is to automatically select the optimal equipment configuration according to the specified target tact time in a flexible electronic component mounting line in which the equipment configuration can be changed. Optimization is achieved by executing a facility configuration optimization simulation for optimizing a combination of types of component mounting apparatuses under given conditions such as a type of a substrate to be produced and a designated target tact time.
[0036]
First, prior to the execution of the simulation, the board to be produced and the type of electronic component mounting apparatus used for the mounting operation are specified, and the mounting data 10a of the board and the apparatus data 10c of the electronic component mounting apparatus stored in advance are read. It is. Next, an instruction for an initial equipment configuration is input (ST1). As this initial equipment configuration, a preset equipment configuration or the most basic equipment configuration is used, but a configuration that is considered optimal in advance may be input based on the experience of the operator. The designated equipment configuration data 10g is stored in the data storage unit 10.
[0037]
Next, a target tact time is input as an instruction (ST2), and then, based on the mounting data 10a, the mounting operation of the board is distributed to each mounting apparatus (ST3). This distribution is performed by the operator determining the total amount of mounting work of the board and allocating the same to each electronic component mounting apparatus. Of course, the distribution may be performed automatically based on a predetermined logic. The work distribution data 10b is stored in the data storage unit 10.
[0038]
Next, production data creation processing is executed (ST4). That is, for each electronic component mounting apparatus, production data necessary for causing the transfer head to perform a mounting operation in the electronic component mounting apparatus is created based on the mounting data 10a, the work distribution data 10b, and the apparatus data 10c. I do. In this production data creation process, the optimization calculation process is executed as described above, and a mounting sequence and a feeder arrangement are determined so that the mounting operation is performed in the shortest takt time in each electronic component mounting apparatus. The optimization result is stored in the data storage unit 10 as production data 10d.
[0039]
Next, a tact simulation for calculating a tact time when the board is produced in the electronic component mounting line based on the equipment configuration data and the production data is executed (ST5). Thus, the estimated arrival tact time is calculated for each electronic component mounting apparatus, and the calculation result is output.
[0040]
Then, by comparing this calculation result with the target tact time, it is determined whether the equipment configuration is appropriate (ST6). Here, if the estimated arrival tact time of each electronic component mounting apparatus clears the target tact time, the equipment configuration is suitable as an equipment configuration of an electronic component mounting line that produces a production target board within the target tact time. And the optimization process is terminated.
[0041]
Further, in (ST6), if the estimated arrival tact time of any of the electronic component mounting apparatuses does not clear the target tact time, it is determined that the equipment configuration is inappropriate, and the equipment configuration change processing is executed ( ST7). The equipment configuration change processing will be described with reference to FIG. First, electronic component mounting apparatuses whose estimated arrival tact time exceeds the target tact time are extracted (ST11), and a tact time difference is calculated for these electronic component mounting apparatuses (ST12). Then, the electronic component mounting apparatus having the maximum tact time difference is specified as the equipment to be changed (ST13).
[0042]
When the equipment to be changed is specified, a change pattern is selected based on the equipment change pattern data 10f stored in advance according to the type of the equipment to be changed and the tact time difference (ST14). In the equipment change pattern data 10f, specific changes to be made when changing the equipment configuration are patterned in advance based on the type of equipment to be changed and the criterion based on the tact time difference.
[0043]
For example, the equipment configuration shown in FIG. 2A is input as an initial equipment setting, and as a result of the simulation, the estimated arrival tact time of the electronic component mounting apparatus M3 in which the multi-function mounting apparatus is arranged clears the target tact time. If not, it is determined that the amount of work to be performed by the multi-function mounting device is large in the mounting operation of the board, and the multi-function mounting device is used as the electronic component mounting device M2 as shown in FIG. The equipment configuration is changed to a facility configuration in which the capacity of the multi-function mounting device is enhanced by arrangement.
[0044]
Similarly, the equipment configuration shown in FIG. 2A is input as an initial equipment setting, and as a result of the simulation, the estimated arrival tact time is set to the target in each of the electronic component mounting apparatuses M1 and M2 in which the high-speed mounting apparatus is arranged. If the tact time is greatly exceeded, it is determined that the line mounting capability is significantly insufficient for the amount of work to be subjected to high-speed mounting, and as shown in FIG. First, the equipment configuration will be changed to add one high-speed mounting device.
[0045]
In any case, the process returns to (ST3) and executes the same processing for the changed new equipment configuration. That is, if the equipment configuration is determined to be unsuitable for achieving the target tact time in the equipment suitability determination step, the equipment configuration is changed based on the calculation result of the tact simulation, and then the tact simulation step and the equipment suitability determination step are performed. Is repeatedly executed.
[0046]
As described above, according to the equipment configuration optimization simulation shown in the present embodiment, even when performing a mounting operation on a plurality of types of boards in a flexible electronic component mounting line in which the equipment configuration can be changed. In addition, it is possible to automatically set an optimum equipment configuration according to each substrate, and to realize an equipment configuration that matches a target tact time.
[0047]
In the above-described embodiment, an example is shown in which the simulation device 4 is provided as a dedicated device separately from the host computer 3. However, the processing functions of the simulation device 4 are taken into the host computer 3 to perform similar processing. Is also good.
[0048]
【The invention's effect】
According to the present invention, a tact simulation for calculating a tact time when a board is produced in an electronic component mounting line based on equipment configuration data and production data, and a calculation result of the tact simulation are compared with a target tact time. Thus, the equipment suitability determination for determining the suitability of the equipment configuration is repeatedly executed, so that the equipment configuration that matches the target tact time can be selected.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of an electronic component mounting line according to an embodiment of the present invention.
FIG. 2 is an explanatory diagram of a mounting equipment configuration of an electronic component mounting line according to an embodiment of the present invention.
FIG. 3 is a plan view of a mounting apparatus constituting an electronic component mounting line according to one embodiment of the present invention;
FIG. 4 is a diagram showing storage contents of a program storage unit and a data storage unit of the simulation device according to one embodiment of the present invention;
FIG. 5 is a view showing feeder arrangement data of the electronic component mounting apparatus according to the embodiment of the present invention;
FIG. 6 is a functional block diagram illustrating processing functions of a simulation device according to an embodiment of the present invention.
FIG. 7 is a flowchart of a facility configuration optimizing process performed by the simulation apparatus according to the embodiment of the present invention;
FIG. 8 is a flowchart of a facility configuration change process performed by the simulation apparatus according to the embodiment of the present invention;
[Explanation of symbols]
1 Electronic component mounting line
4 Simulation equipment
9 Program storage
9a Production data creation program
9c Tact simulation program
9d Equipment suitability judgment program
9e Equipment configuration change processing program
10 Data storage unit
10a Implementation data
10c device data
10d Production data
10e Target takt time
13 Substrate
14 Parts supply unit
15 Parts feeder
16A, 16B, transfer head

Claims (1)

In an electronic component mounting line in which a plurality of electronic component mounting devices that pick up electronic components from a component supply unit by a transfer head and mount them on a substrate are used, the combination of the types of the electronic component mounting devices is optimized under given conditions. A method of simulating equipment configuration optimization in an electronic component mounting line to be converted, in which mounting data relating to a substrate to be produced and device data relating to a plurality of electronic component mounting apparatuses used for production of the substrate are stored in advance, and A step of creating production data necessary for causing the transfer head to perform a mounting operation in the plurality of electronic component mounting apparatuses based on the mounting data and the apparatus data; and inputting a target tact time of a target board to be produced. Equipment that shows the combination of the process to perform and the electronic component mounting equipment that constitutes the electronic component mounting line A tact simulation step of calculating a tact time when the board is produced in the electronic component mounting line based on the production data and the production data; and comparing a calculation result of the tact simulation step with a target tact time. And a facility suitability determination step of determining the suitability of the facility configuration according to the above, if the facility configuration is determined to be unsuitable for achieving the target tact time in the facility suitability determination step, based on the calculation result of the tact simulation A method of optimizing the equipment configuration in an electronic component mounting line, wherein the tact simulation step and the equipment suitability determination step are repeatedly executed after changing the equipment configuration.

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