JP5440486B2 - Component mounting apparatus and model switching method in component mounting apparatus - Google Patents

Description

  The present invention relates to a component mounting apparatus for mounting electronic components on a substrate and a model switching method for performing work processing when switching a board type to be mounted in the component mounting apparatus.

  An electronic component mounting system that manufactures a mounting board by mounting electronic components on a substrate is configured by connecting multiple component mounting devices that mount electronic components to the substrate after the paste for solder bonding is printed Has been. In recent years, with the diversification of production forms in the electronic industry, the production forms of high-mix low-volume production types are also increasing in the component mounting field. For this reason, in the component mounting system, the frequency of model switching work accompanying the switching of the board type to be produced is increasing, and the model switching work is efficiently performed at the component mounting production site for the purpose of improving productivity. Various measures have been proposed (for example, see Patent Document 1). In the prior art shown in this patent document example, the part type information of the current production lot and the next production lot is collated, and the part types common to both production lots and the different part types are identified and displayed based on the collation result. I am doing so. This makes it possible to prepare the necessary part types for the next production lot during the current production.

JP-A-7-202486

  By the way, as a component mounting apparatus, there is known a component mounting apparatus having a configuration including two independent mounting lanes including a substrate transport mechanism for transporting a substrate and a component mounting mechanism for mounting a component on the substrate. With such a configuration, it is possible to perform component mounting work in parallel on two different boards by using two mounting lanes. However, since the end timing of one production lot differs in each mounting lane in the component mounting apparatus having such a configuration, it is necessary to perform the model switching operation accompanying the change of the board type for each mounting lane. is there. From the viewpoint of improving the apparatus operation rate, it is desirable that the operation of the mounting lane during the production is not stopped and the model switching operation can be performed only for the mounting lane in which the production lot is completed.

  However, this model switching operation involves manual operations by the operator, such as replacement of a component feeder such as a tape feeder that supplies components to the component mounting mechanism, and replacement of a suction nozzle used in the component mounting mechanism. In order to enable model switching work in the mounting lane on the other side while the mounting lane is in operation, a complicated operation is required so as not to impair operator safety. For this reason, in a component mounting device equipped with multiple mounting lanes, it is easy to switch the model when changing the board type without stopping the operation of the mounting lane on one side and without compromising the safety of the operator. There has been a demand for a component mounting apparatus and a model switching method that can be executed by simple operations.

  Therefore, the present invention, in the component mounting apparatus having a plurality of mounting lanes, without changing the model switching work accompanying the change of the board type, without stopping the operation of the mounting lane on one side, and without impairing the safety of the operator, It is another object of the present invention to provide a component mounting apparatus that can be executed with an easy operation and a model switching method in the component mounting apparatus.

The component mounting apparatus according to the present invention includes a first substrate transport mechanism and a second substrate each having a substrate holding portion that transports the substrate delivered from the upstream device in the substrate transport direction and positions and holds the substrate. A first component supply unit and a second component supply unit that are provided on the respective sides of the transfer mechanism, the first substrate transfer mechanism, and the second substrate transfer mechanism, and supply components mounted on the substrate. And the first substrate transport mechanism provided corresponding to each of the first substrate transport mechanism and the second substrate transport mechanism to take out components from the first component supply unit and the second component supply unit. The first component mounting mechanism, the second component mounting mechanism, the first substrate transport mechanism, and the first component mounting mechanism that are respectively mounted on the substrates held by the substrate holders of the second substrate transport mechanism. The component supply unit is composed of a first component mounting mechanism. An operation panel capable of inputting an operation for any one of the first mounting lane and the second mounting lane composed of the second board transport mechanism, the second component supply unit, and the second component mounting mechanism; , A lane specifying switch that is provided on the operation panel and that specifies a mounting lane to be an operation input target, a stop switch for stopping the operation of the specified mounting lane, and an operation related to model switching An operation switch including a work operation switch, a model changeover switch for making the work operation switch operable, and an input control processing unit for controlling an operation input performed via the operation switch; processing unit, the operator operates the pre Symbol operation panel to identify the object mounting lane to be operated by the lane identification switch, identified After stopping the working operation of the subject mounting lane, said by operating the type change switch, and executes the model switch when operating the process of the working operation switch in an operational state, non-other than the subject mounting lane When the target mounting lane is performing a component mounting operation, an input control process is executed that permits operation input by the work operation switch and prohibits operation input by the lane specifying switch.

The model switching method in the component mounting apparatus according to the present invention includes: a first substrate transport mechanism that includes a substrate holding unit that transports the substrate delivered from the upstream device in the substrate transport direction and positions and holds the substrate; A first component supply unit that is provided on each side of the second substrate transfer mechanism, the first substrate transfer mechanism, and the second substrate transfer mechanism, and that supplies components mounted on the substrate; The component supply unit, the first substrate transfer mechanism, and the second substrate transfer mechanism are provided corresponding to each of the first component supply unit and the second component supply unit to take out the component from the first component supply unit and the second component supply unit. A first component mounting mechanism, a second component mounting mechanism, and a first substrate transport mechanism, each of which is mounted on a substrate held by a substrate retainer of the second substrate transport mechanism. Mechanism, first component supply unit, first unit Operation input for any of the first mounting lane configured by the mounting mechanism, the second substrate transport mechanism, the second component supply unit, and the second mounting lane configured by the second component mounting mechanism. An operation panel that can be used, a lane specification switch that is provided on the operation panel and that specifies a mounting lane that is a target of operation input, a stop switch that stops the operation of the device in the specified mounting lane, and model switching A work operation switch for performing work, an operation switch including a model changeover switch for making the work operation switch operable, and an input control processing unit for controlling operation input performed via the operation switch; A component switching method for switching the board model, wherein an operator operates the operation panel to switch the model. And mounting lane specifying step of specifying an object mounting lane to be operated by the down specific switch, after stopping the working operation of the subject mounting lane identified by manipulating the type change switch, the working operation switch A target switching lane including a model switching operation processing step for executing a model switching operation process to make an operable state, and a work execution step for performing a task related to the model switching by operating the work switch. When a non-target mounting lane other than is performing a work operation, the operation input by the work operation switch is permitted, and the operation input by the lane specifying switch is prohibited.

  According to the present invention, when a non-target mounting lane other than a target mounting lane to be operated is performing a work operation in a work execution step of operating a work operation switch to execute work related to model switching. Changing the board type by allowing operation input using work operation switches for executing work related to model switching and prohibiting operation input using the lane specific switch that identifies the mounting lanes subject to operation input Therefore, the model switching work accompanying the above can be performed with an easy operation without stopping the operation of the mounting lane on one side and without sacrificing the safety of the operator.

The perspective view which shows the structure of the component mounting system of one embodiment of this invention The top view of the component mounting system of one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention Explanatory drawing of a structure and function of the operation screen in the component mounting apparatus of one embodiment of this invention Explanatory drawing which shows the operation procedure of the operation screen in the component mounting apparatus of one embodiment of this invention Explanatory drawing which shows the operation procedure of the operation screen in the component mounting apparatus of one embodiment of this invention Explanatory drawing which shows the operation procedure of the operation screen in the component mounting apparatus of one embodiment of this invention The top view of the component mounting system of one embodiment of this invention The flowchart which shows the model switching process in the component mounting apparatus of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the configuration of the component mounting system 1 will be described with reference to FIGS. 1 and 2. The component mounting system 1 is configured by connecting a plurality (here, three) of component mounting apparatuses M1, M2, and M3 in series, and has a function of mounting a component on a substrate and manufacturing a mounting substrate. is there. As shown in FIG. 2, the component mounting system 1 includes a first mounting lane L1 and a second mounting lane L2 that can be operated independently, and the mounting target supplied from the upstream side (arrow a) is displayed. The board is provided with a board transfer mechanism provided in the apparatus via a transfer opening 2 provided in the component mounting apparatus M1 located at the most upstream (see the front board transfer mechanism 11A and the rear board transfer mechanism 11B shown in FIG. 2). ) And sequentially conveyed in the component mounting system 1 in the X direction (substrate conveyance direction). The board that has been carried in becomes an object of component mounting work by each device, and the board after the component mounting work is further carried out to the downstream device.

  On the side surfaces of the component mounting apparatuses M1 to M3, operation panels 3 are provided corresponding to the first mounting lane L1 and the second mounting lane L2, respectively. The operation panel 3 includes an operation panel 4 such as a liquid crystal panel, and an operation screen 30 for operation input (see FIG. 4) for operating each device is displayed on the operation panel 4. Further, a signal tower 5 is provided on the upper surface of the component mounting apparatuses M1 to M3, and the signal tower 5 displays the operating state of each apparatus by a signal lamp for each color.

  The configuration of the component mounting apparatuses M1 to M3 will be described. Since the component mounting apparatuses M1 to M3 have the same configuration, only the component mounting apparatus M1 is described here with reference numerals, and the description of the component mounting apparatuses M2 and M3 is omitted. In FIG. 2, a front substrate transport mechanism 11A (first substrate transport mechanism) and a rear substrate transport mechanism 11B (second substrate transport mechanism) are arranged in the X direction (substrate transport direction) at the center of the base 10. Is provided. Here, the lower side of the drawing is defined as the front side, and the upper side of the drawing is defined as the rear side. The front substrate transport mechanism 11A and the rear substrate transport mechanism 11B transport the substrate 6 delivered from the upstream device to the downstream side in the X direction. Each of the front substrate transport mechanism 11A and the rear substrate transport mechanism 11B has a substrate holding portion 7, and the substrate 6 transported from the upstream side is positioned and held at the mounting work position by the component mounting mechanism described below by the substrate holding portion 7. Is done.

  On the outer side of each of the front substrate transport mechanism 11A and the rear substrate transport mechanism 11B, a front component supply unit 12A (first component supply unit) that supplies components mounted on the substrate 6 and a rear component supply unit 12B. (Second component supply unit) is provided. A plurality of tape feeders 13 are arranged in parallel in the front part supply part 12A and the rear part supply part 12B, respectively, and the tape feeder 13 feeds these parts into parts by pitch-feeding the carrier tape storing and holding the parts. Supply to the component removal position by the mounting mechanism.

  A Y-axis moving table 14 having a linear drive mechanism is disposed horizontally in the Y direction at one end of the base 10 in the X direction. Similarly, the Y-axis moving table 14 has a linear drive mechanism 2. Two X-axis moving tables 15A and 15B are coupled. A front mounting head 17A (first mounting head) and a rear mounting head 17B (second mounting head) are mounted on the X-axis moving tables 15A and 15B, respectively, so as to be movable in the X direction. The Y-axis movement table 14, the X-axis movement table 15A, the Y-axis movement table 14, and the X-axis movement table 15B constitute a front head movement mechanism 16A and a rear head movement mechanism 16B, respectively. By driving the front head moving mechanism 16A and the rear head moving mechanism 16B, the front mounting head 17A and the rear mounting head 17B move horizontally in the X direction and the Y direction, respectively. The components are taken out from the tape feeder 13 of the section 12B and mounted on the substrate 6 positioned and held by the substrate holding portions 7 of the front substrate transport mechanism 11A and the rear substrate transport mechanism 11B (the front mounting head 17A and the front substrate transport (See thick arrows connecting the mechanism 11A, the rear mounting head 17B, and the rear substrate transport mechanism 11B).

  That is, the combination of the front head moving mechanism 16A, the front mounting head 17A, the rear head moving mechanism 16B, and the rear mounting head 17B includes a front substrate transport mechanism 11A (first substrate transport mechanism) and a rear substrate transport mechanism 11B ( Provided corresponding to each of the second substrate transport mechanisms), taking out the components from the front component supply unit 12A (first component supply unit) and the rear component supply unit 12B (second component supply unit), A first component mounting mechanism and a second component mounting mechanism are configured to be mounted on the substrate 6 held by the substrate holding portions 7 of the front substrate transfer mechanism 11A and the rear substrate transfer mechanism 11B.

  A substrate recognition camera 8 that moves integrally with the front mounting head 17A and the rear mounting head 17B is provided on the lower surface side of the X-axis moving table 15A and the X-axis moving table 15B. When the front mounting head 17A and the rear mounting head 17B move onto the substrates 6 of the front substrate transport mechanism 11A and the rear substrate transport mechanism 11B, respectively, the substrate recognition camera 8 images each substrate 6. Also, a component recognition camera 9 is disposed between the front side component supply unit 12A and the front side substrate transfer mechanism 11A, and between the rear side component supply unit 12B and the rear side substrate transfer mechanism 11B, and the front side component supply unit 12A and the rear side When the front mounting head 17A and the rear mounting head 17B that have taken out components from the component supply unit 12B move above the component recognition camera 9, the component recognition camera 9 is held by the front mounting head 17A and the rear mounting head 17B. Take a picture of the part in the wet state.

  Then, the component mounting position on the substrate 6 is recognized by performing recognition processing on the imaging result of the substrate recognition camera 8, and is held in the front mounting head 17A and the rear mounting head 17B by performing recognition processing on the imaging result of the component recognition camera 9. Identification of components in the state and detection of misalignment are performed. In the component mounting operation by the first component mounting mechanism and the second component mounting mechanism, the mounting position is corrected in consideration of these recognition results.

  In the component mounting system 1, each of the front substrate transport mechanisms 11A, the front component supply unit 12A, the front head moving mechanism 16A, and the front mounting head 17A of each of the component mounting apparatuses M1 to M3 is a series of substrates connected to the front substrate transport mechanism 11A. A first mounting lane L1 for performing component mounting work on the board 6 transported along the transport lane is configured. Similarly, the rear substrate transport mechanism 11B, the rear component supply unit 12B, the rear head moving mechanism 16B, and the rear mounting head 17B of each of the component mounting apparatuses M1 to M3 are connected to the rear substrate transport mechanism 11B. A second mounting lane L2 for performing component mounting work on the board 6 transported along the board transport lane is configured.

  As shown in FIG. 1, the operation panel 3 provided in each of the component mounting apparatuses M1 to M3 is arranged on the side surfaces corresponding to the first mounting lane L1 and the second mounting lane L2, respectively. However, in the component mounting system 1 shown in the present embodiment, these two operation panels 3 perform operation inputs for both the first mounting lane L1 and the second mounting lane L2 in the apparatus. Is possible. That is, even when the operator working on the front side of the apparatus needs to input an operation on the second mounting lane L2 located on the rear side, the operator can move the work position on his / her own side without moving the work position. Necessary operation input can be performed through the operation panel 3.

  Similarly, when the operator is working on the rear side, if it is necessary to perform an operation input for the first mounting lane L1 located on the front side, the operator can use the operation panel 3 on the rear side. Necessary operation input. In the present embodiment, an example is shown in which two operation panels 3 are provided for each device in an arrangement corresponding to each of the first mounting lane L1 and the second mounting lane L2. A single operation panel 3 capable of changing the orientation on both the front and rear sides may be provided.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 3, the control device 20 controls the following units constituting the component mounting devices M1 to M3. The control device 20 controls the front head moving mechanism 16A, the front mounting head 17A, and the front part supply unit 12A, so that the board 6 loaded into the front board transport mechanism 11A is set to the first mounting lane L1 as the target mounting lane. Component mounting work is executed. Further, the control device 20 controls the rear head moving mechanism 16B, the rear mounting head 17B, and the rear component supply unit 12B, so that the second mounting lane L2 is taken into the rear substrate transport mechanism 11B as the target mounting lane. A component mounting operation is performed on the board 6.

  At this time, the control device 20 individually controls the first mounting lane L1 and the second mounting lane L2, thereby performing component mounting work individually and independently in the first mounting lane L1 and the second mounting lane L2. It can be executed. That is, even when the mounting lane on one side is stopped due to the model switching work accompanying the change of the board type, the component mounting work can be continuously executed by the mounting lane on the other side.

  The communication unit 21 is connected to other devices via a LAN system (not shown), and exchanges control signals and data with other devices. The display unit 22 performs processing for displaying a screen such as an operation screen or various notification screens on the operation panel 4 provided on the operation panel 3. The operation input unit 23 is an input means such as a touch panel switch provided on the operation panel 4 and is operated when an operation input for operating the apparatus, an input of production data, or the like. The input control processing unit 24 performs processing for controlling an operation input performed via an operation switch constituting the operation input unit 23. Detailed functions of the input control processing unit 24 will be described later together with the configuration and functions of the operation screen 30 shown in FIGS. The storage unit 25 stores a mounting program 26 and production information 27 necessary for executing a board transfer operation and a component mounting operation.

  Next, the configuration and detailed functions of the operation screen 30 displayed on the operation panel 4 will be described with reference to FIG. As shown in FIG. 4, the operation screen 30 is hierarchically displayed with a screen name 31 indicating contents displayed as information, production data 32 indicating a substrate type to be produced, and touch panel switches set in the screen. A first operation switch frame 33, a second operation switch frame 34, a message frame 38, and an information display area 39 are included.

  In the screen name 31, the content of the specific information displayed in the information display area 39 is displayed according to the input operation by each operation switch displayed in the first operation switch frame 33 and the second operation switch frame 34. In the production data 32, “production data name 1” 32a and “production data name 2” 32b indicating the board types that are the production targets in the first mounting lane L1 and the second mounting lane L2, respectively, are displayed. . In the first operation switch frame 33, a first hierarchy operation switch in which contents of information to be displayed on the operation screen 30 are classified into a plurality of sections is displayed. These first level operation switches include “home” 33a, “production” 33b, “model switching” 33c, “production management information” 33d, and “maintenance” 33e.

  By operating “Home” 33 a, an initial screen is displayed on the operation screen 30. By operating the “production” 33b, production work for mounting the component on the board, that is, information regarding execution of the component mounting work is displayed. “Model switching” 33c is a model switching switch, and by operating “model switching” 33c, information related to execution of model switching work for changing the board type to be produced is displayed. By operating the “production management information” 33d and “maintenance” 33e, information related to production management such as production schedule and production results in the apparatus, and information related to apparatus maintenance such as maintenance work history and work schedule in the apparatus. Is displayed.

  In the second operation switch frame 34, a plurality of function switches 35 (functions 1 to 4) and a lane specifying switch 36 are displayed. Here, as the function switch 35, each of “Home” 33a, “Production” 33b, “Model switching” 33c, “Production management information” 33d, and “Maintenance” 33e selected and operated by the first operation switch frame 33 is used. The operation switch of the operation content having the function corresponding to is displayed. The lane specifying switch 36 is an operation switch for specifying the mounting lane to be operated by the operation screen 30. By operating the lane specifying switch 36, the operation input is set to the first mounting lane. Only L1, only the second mounting lane L2, and both the first mounting lane L1 and the second mounting lane L2 can be switched.

  Similarly, the stop switch 37 is a touch panel switch type operation switch. When the stop switch 37 is operated, the work operation in the mounting lane is stopped when one cycle of the component mounting operation being executed is completed. In the message frame 38, a message for notification to the operator and instructions / instructions are displayed as necessary. In the information display area 39, display contents specified by sequentially selecting and operating the operation switches displayed in the first operation switch frame 33 and the second operation switch frame 34, that is, the contents shown in the screen name 31 are displayed. Detailed information such as text information, charts, and graphs is displayed.

  That is, on the operation screen 30 displayed on the operation panel 4 shown in the present embodiment, the lane specifying switch 36 for specifying the mounting lane that is the target of the operation input, and the stop for stopping the operation of the specified mounting lane A plurality of operation switches including a switch 37 and a “model changeover” 33c which is a model changeover switch for performing a changeover operation associated with the board type changeover of a board to be mounted are set in a touch panel switch method. Yes. In the above embodiment, touch panel switches set on the operation screen 30 are used as these operation switches. However, the operation switch is not limited to the touch panel switches, and push buttons, snap switches, etc. A machine-operated switch may be used. In this case, the operation screen 30 displays a screen for specifying the function and arrangement of these machine-operated switches.

  Next, the operation content and operation procedure executed on the operation screen 30 when executing the model switching work in a specific mounting lane while the production is continued by the component mounting apparatuses M1 to M3 constituting the component mounting system 1. This will be described with reference to FIGS. FIG. 5 shows that automatic production is executed for the board types specified by “production data name 1” 32a and “production data name 2” 32b in the first mounting lane L1 and the second mounting lane L2, respectively. The example of a display of the operation screen 30 in the case of being is shown.

  That is, here, “production” 33 b is selected in the first operation switch frame 33, and “remaining number monitor” 35 a and “adsorption monitor” are displayed as function switches 35 in the second operation switch frame 34 in accordance with the selection contents. 35b, “status monitor” 35c, and “inspection monitor” 35d are displayed, and “in production” 38a indicating that production is in progress is displayed in the message frame 38. The “remaining number monitor” 35a, “suction monitor” 35b, “status monitor” 35c, and “inspection monitor” 35d are respectively the remaining number of parts in the component supply unit, the nozzle type and suction vacuum degree in the component suction by the mounting head, etc. It is an operation switch for referring to information about each item such as parameter setting, operating status of the device, and inspection executed by the device. In the example shown in FIG. 5, the “remaining number monitor” 35 a is selected. As a result, the “production-remaining number monitor” 31 a is displayed as the screen name 31 according to the selected content, and the information display area 39 includes A remaining parts table in which the remaining number 39b is associated with each part name 39a is displayed.

  Next, FIG. 6 shows a preparation screen for executing the model switching work. That is, an example of operation when the planned number of production is completed in the first mounting lane L1 and the model switching work for the next production board type is executed while continuing the automatic production in the second mounting lane L2. Is shown. Here, first, the “model switching” 33 c can be selected in the first operation switch frame 33, and then the lane specifying switch 36 is operated in the second operation switch frame 34 in order to specify the mounting lane to be the model switching target. The first mounting lane L1 is specified and the stop switch 37 is operated. Accordingly, the movable mechanism on the first mounting lane L1 side of the component mounting apparatuses M1 to M3 stops after completing one cycle of the component mounting operation in the first mounting lane L1, and targets the first mounting lane L1. The selected model can be switched.

  Next, as shown in FIG. 7, “model switching” 33 c is operated in the first operation switch frame 33. Thereby, in the second operation switch frame 34, “file operation” 35e, “part preparation” 35f, and “production plan” 35g, which are work operation switches for executing work related to model switching, are displayed. This work operation switch becomes operable. Here, an example is shown in which “file operation” 35 e is selected and operated in the second operation switch frame 34, whereby “model switching-file operation” 31 b is displayed as the screen name 31, and the message frame 38 is displayed. Then, “Load production data” 38b is displayed to prompt the user to download a file corresponding to the board type of the next production. In the information display area 39, a download history table in which the file name 39c is associated with the date 39d is displayed. Then, by sequentially selecting and operating the “component preparation” 35f and the “production plan” 35g, it is possible to refer to information such as parts information and production quantity corresponding to the board type of the next production. The model switching work can be executed.

  The input control process described above is executed by the input control processing unit 24. That is, after the operator operates the operation panel 4 to specify the target mounting lane to be operated by the lane specifying switch 36 and stops the work operation of the specified target mounting lane, the input control processing unit 24 By operating the changeover switch 33c, work operation switches ("file operation" 35e, "member preparation" 35f, "production plan" 35g) for executing work related to model switching for the target mounting lane. Execute the operation process at the time of model switching to make the system operable.

  The input control processing unit 24 refers to the operation state of the second mounting lane L2 together with the operation process at the time of switching the model, and when the second mounting lane L2 is executing the component mounting work, the lane specifying switch The process of prohibiting the operation by 36 is performed. That is, the operator cannot specify the second mounting lane L2 as the operation target by operating the lane specifying switch 36, and the operation target mounting lane is fixed to the first mounting lane L1. At this time, only the operation switch (“file operation” 35e, “member preparation” 35f, “production plan” 35g) for the first mounting lane L1 is allowed, and the first mounting lane L1 is The target model switching operation can be executed.

  That is, as shown in FIG. 8, for the first mounting lane L1 that is the target of model switching in the component mounting system 1, all of the component mounting apparatuses M1 to M3 are mounted on the carriage from the front-side component supply unit 12A. The plurality of tape feeders 13 are collectively removed and replaced with a tape feeder 13 corresponding to the substrate type of the next production. Further, the adjustment of the conveyance width of the front substrate conveyance mechanism 11A and the operation of making the suction nozzle mounted on the front mounting head 17A correspond to the substrate type of the next production are executed as necessary. In the second mounting lane L2, the tape feeder of the rear component supply unit 12B is used by the front mounting head 17A for the substrate 6 transported by the rear substrate transport mechanism 11B for all of the component mounting apparatuses M1 to M3. The component mounting operation for mounting the component taken out from 13 on the substrate 6 is continuously executed.

  At this time, since the operation by the lane specifying switch 36 is prohibited on the operation screen 30, the operation performed through the operation screen 30 is limited to the one for the first mounting lane L1. As a result, there is no situation in which the operator erroneously inputs the second mounting lane L2 as an operation target due to an error or the like, and normal execution of the component mounting work in the second mounting lane L2 during production is continued. Guaranteed. That is, when the non-target mounting lane other than the target mounting lane is performing component mounting work, the input control processing unit 24 operates the operation switch (“file operation” 35e, “member preparation” 35f, “production plan”). An input control process that permits the operation input by 35g) and prohibits the operation input by the lane specifying switch 36 is executed.

  Next, a model switching process for switching the board type to be produced in the component mounting system 1 will be described with reference to the flow of FIG. Here, as in the above example, in the process of continuously executing automatic production by both the first mounting lane L1 and the second mounting lane L2, the model switching operation is executed only for the first mounting lane L1. A processing example is shown. First, the operator operates the operation panel 4 to specify a target mounting lane to be operated by the lane specifying switch 36 (mounting lane specifying step) (ST1). That is, as shown in FIG. 6, the first mounting lane L1 is specified as an operation target by operating the lane specifying switch 36.

  Next, the work operation of the identified target mounting lane is stopped (ST2). That is, by operating the stop switch 37, the work operation of the first mounting lane L1 is stopped. Next, an operation process at the time of model switching is performed to make a work operation switch operable to perform work related to model switching for the target mounting lane (ST3) (operation processing process at model switching). That is, as shown in FIG. 7, by operating the “model switching” 33c which is a model switching switch, “file operation” 35e, “member preparation” 35f and “production plan” 35g corresponding to the “model switching” 33c. Is displayed on the second operation switch frame 34 and becomes operable.

  Thereafter, by operating the “file operation” 35e, “member preparation” 35f, and “production plan” 35g, work related to model switching is executed (ST4) (work execution process). In this work execution step, the input control processing unit 24 checks whether or not the second mounting lane L2 that is a non-target mounting lane is executing a work operation (ST5). Here, if YES, that is, if the second mounting lane L2, which is a non-target mounting lane, is executing a work operation, operation input by the lane specifying switch 36 is prohibited (ST6). At this time, operation inputs by the “file operation” 35e, “member preparation” 35f, and “production plan” 35g that are work operation switches are permitted, and the execution of the model switching work is not hindered. Thereafter, if the production in the second mounting lane L2 is completed and it is confirmed in (ST5) that the second mounting lane L2 is not performing a work operation, the input control processing unit 24 sets the lane specifying switch. The process which permits the operation input by 36 is performed. As a result, it is possible to perform an operation input for performing model switching work for the second mounting lane L2.

  As described above, the component mounting apparatus and the model switching method shown in the present embodiment are other than the target mounting lane to be operated in the work execution process in which the work operation switch is operated to execute the work related to the model switching. When the non-target mounting lane is performing work operations, the operation input by the work operation switch for executing the work related to the model switching is permitted, and the mounting lane that is the target of the operation input is specified. Operation input by a specific switch is prohibited. As a result, it is possible to perform the model switching work accompanying the change of the board type without stopping the operation of the mounting lane on one side and without sacrificing the operator's safety, and with an easy operation.

  The component mounting apparatus and the model switching method in the component mounting apparatus according to the present invention, in the component mounting apparatus having a plurality of mounting lanes, stop the operation of the mounting lane on one side in the model switching work accompanying the change of the board type. This is advantageous in that it can be executed by an easy operation without impairing the safety of the operator, and is useful in the field of manufacturing a mounting board by mounting components on a wiring board.

DESCRIPTION OF SYMBOLS 1 Component mounting system 3 Operation panel 4 Operation panel 6 Board | substrate 7 Board | substrate holding | maintenance part 11A Front side board | substrate conveyance mechanism (1st board | substrate conveyance mechanism)
11B Rear substrate transport mechanism (second substrate transport mechanism)
12A Front side component supply unit (first component supply unit)
12B Rear side component supply unit (first component supply unit)
14 Y-axis moving table 15A X-axis moving table 15B X-axis moving table 16A Front head moving mechanism (first head moving mechanism)
16B Rear head moving mechanism (second head moving mechanism)
17A Front mounting head (first mounting head)
17B Rear mounting head (second mounting head)
33c “Model selection” (model selection switch)
36 Lane specific switch 37 Stop switch 35e "File operation" (work operation switch)
35f “Part preparation” (work operation switch)
35g "Production plan" (work operation switch)
L1 First mounting lane L2 Second mounting lane M1, M2, M3 Component mounting device

Claims (2)

A first substrate transport mechanism, a second substrate transport mechanism, each of which has a substrate holding section that transports the substrate delivered from the upstream device in the substrate transport direction and positions and holds the substrate;
A first component supply unit, a second component supply unit, which are provided on each side of the first substrate transfer mechanism and the second substrate transfer mechanism, and supply components mounted on the substrate;
The board of the first substrate transport mechanism is provided corresponding to each of the first substrate transport mechanism and the second substrate transport mechanism and takes out components from the first component supply unit and the second component supply unit. A first component mounting mechanism, a second component mounting mechanism, each of which is mounted on a substrate held by a substrate holding unit of the second substrate transport mechanism;
A first mounting lane and a second substrate transport mechanism, a second component supply unit, and a second component configured by the first substrate transport mechanism, the first component supply unit, and the first component mounting mechanism. An operation panel capable of operating input for any of the second mounting lanes configured by the mounting mechanism;
A lane identification switch that is provided on the operation panel and identifies a mounting lane that is a target of operation input, a stop switch for stopping the operation of the identified mounting lane, and work for performing work related to model switching An operation switch including an operation switch, a model changeover switch for making the work operation switch operable ; and
An input control processing unit that controls an operation input performed via the operation switch,
The input control processor, after the operator operates the pre Symbol operation panel to identify the object mounting lane to be operated by the lane identification switch to stop the operation performance of the subject mounting lane identified, the and executes the time operation processing switching model to be in an operational state the working operation switch by operating a type change switch,
When a non-target mounting lane other than the target mounting lane is performing a component mounting work, an input control process is performed that permits operation input by the work operation switch and prohibits operation input by the lane specifying switch. A component mounting apparatus characterized by that. The first substrate transport mechanism, the second substrate transport mechanism, and the first substrate transport mechanism, each of which includes a substrate holder that transports the substrate delivered from the upstream apparatus in the substrate transport direction and positions and holds the substrate. A first component supply unit, a second component supply unit, and a first substrate transfer unit that are provided on the respective sides of the substrate transfer mechanism and the second substrate transfer mechanism and supply components mounted on the substrate. A component is provided corresponding to each of the mechanism and the second substrate transport mechanism, and components are taken out from the first component supply unit and the second component supply unit, the substrate holding unit of the first substrate transport mechanism, and the second The first component mounting mechanism, the second component mounting mechanism, the first substrate transport mechanism, the first component supply unit, the first component mounting mechanism, and the first component mounting mechanism, which are respectively mounted on the substrates held by the substrate holding unit of the substrate transport mechanism. A first mounting lane composed of a component mounting mechanism and a first mounting lane; An operation panel capable of performing an operation input for any of the second mounting lanes configured by the board transport mechanism, the second component supply unit, and the second component mounting mechanism, and provided in the operation panel. Lane specifying switch for specifying a mounting lane to be an operation input target, a stop switch for stopping the operation of the specified mounting lane, a work operation switch for executing work related to model switching, and the work operation switch In a component mounting apparatus comprising an operation switch including a model changeover switch for making a switch operable, and an input control processing unit for controlling an operation input performed via the operation switch, the board type is switched. A model switching method to be performed,
A mounting lane specifying step in which an operator operates the operation panel and specifies a target mounting lane to be operated by the lane specifying switch;
After stopping the working operation of the identified object mounting lane, the model by operating the changeover switch, the model switch during operation processing step of performing a type change when operating the process of the working operation switch in an operational state When,
Including a work execution step of operating the work operation switch to perform work related to the model switching,
Component mounting characterized in that when a non-target mounting lane other than the target mounting lane is performing a work operation, an operation input by the work operation switch is permitted and an operation input by the lane specific switch is prohibited. How to switch models in equipment.

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