JP4960312B2 - Mounting condition determination method - Google Patents

Description

  The present invention relates to a mounting condition determining method for determining conditions for mounting a component on a board.

  The component mounter is a device that produces a mounting board by mounting components such as electronic components on the board. By connecting a plurality of such component mounting machines, for example, a production line for producing a complex mounting board at high speed can be configured.

  Conventionally, a mounting condition determination method for determining a mounting condition for mounting a component on a board has been proposed for the above-described component mounter or production line (see, for example, Patent Document 1). The mounting condition is, for example, an arrangement of components (component arrangement) arranged on the component mounting machine.

In the mounting condition determination method (operation analysis method) described in Patent Document 1, a common component arrangement is mounted on a plurality of types of mounting boards so that the time required to produce a plurality of types of mounting boards (total production time) is minimized. Determine as a condition. Therefore, a manufacturer that produces a plurality of types of mounting boards, incorporates them into an electronic device, and sells the electronic device can reduce the manufacturing cost of the electronic device by this mounting condition determination method.
Japanese Patent Laid-Open No. 2002-111298 (FIGS. 31, 33 to 35)

  However, the mounting condition determination method of Patent Document 1 has a problem that the mounting conditions cannot be optimized for each type of mounting board.

  Specifically, a company that contracts the production of a mounting board from each manufacturer (hereinafter referred to as a contractor) has a component mounting machine, a production line, etc., and mounts multiple types of mounting boards requested by each manufacturer. Etc. to produce. Here, the contractor is requested by each manufacturer to produce a mounting board, and a cost target for the mounting board is also set. Accordingly, the contractor must produce a mounting board at a set cost or less for each type of mounting board.

  However, in the mounting condition determination method of Patent Document 1, the mounting conditions are determined so that the total production time is the shortest. Therefore, it is not possible to optimize the mounting conditions for each type of mounting board. It takes a lot of time to produce such a variety of mounting boards, which may cost more than the set cost. Therefore, the contractor cannot determine the mounting conditions by such a mounting condition determination method.

  Therefore, the present invention has been made in view of such problems, and an object thereof is to provide a mounting condition determination method capable of optimizing the mounting conditions for each type of mounting board.

  In order to achieve the above object, a mounting condition determination method according to the present invention is a common method for producing a plurality of types of mounting boards for a component mounting machine that produces mounting boards by mounting components on a board. A mounting condition determination method in which a computer determines a mounting condition, in which a target time for production of one mounting board is received as a target time for each type of mounting board, and a plurality of types of mounting boards are produced. When the component mounter mounts a component according to the common temporary mounting conditions, the tact time required for production of one mounting board is specified for each type of mounting board, and is specified for each type of mounting board. By displaying the tact time and the target time accepted for the product type, and changing the provisional mounting conditions so that the tact time not less than the target time is shortened. , To determine the modified the temporary mounting conditions as the mounting conditions.

  Thereby, for example, a common temporary mounting condition for producing a plurality of types of mounting boards is derived by a conventional optimization program, and as a result, the tact time for any of the mounting board types under the temporary mounting conditions ( Even if the tact) is longer than the target time (target time), the provisional mounting conditions are changed so that the tact time is shortened, and the changed provisional mounting conditions are determined as the mounting conditions. Mounting conditions can be optimized for each type of substrate. Furthermore, since the tact time and the target time are displayed for each type of mounting board, the operator can check whether the tact time is longer than the target time, and the tact time is longer than the target time. It is possible to easily grasp the type of long mounting board and the difference between the tact time and the target time.

  The mounting condition determination method further accepts the priority of each type of the mounting board, and in the change of the temporary mounting condition, the higher the priority of the type of the mounting board, the higher the tact time of the type. The provisional mounting conditions are changed so as to shorten the time.

  Thus, the operator can input the priority for each type of mounting board with reference to the tact time and the target time displayed for each type of mounting board. For example, the operator can set a high priority for the type of the mounting board whose tact time is longer than the target time. As a result, it is possible to determine a mounting condition such that the tact time is less than or equal to the target time for any mounting board type.

  In addition, the component mounting machine includes a head that picks up and moves a component, and in changing the temporary mounting condition, the type of the head that is a premise of the temporary mounting condition is changed. Change to provisional mounting conditions corresponding to the type.

  For example, when many components are mounted on a type of mounting board corresponding to a tact time that is not less than the target time, the head type of 8 heads, which is a precondition for provisional mounting conditions, is the head type of 12 heads. Changed to type. The 12-head can mount more parts in a shorter time than the 8-head. Therefore, by changing the type of the head as described above, it is possible to determine a mounting condition that reliably shortens the tact time that is not less than the target time.

  In addition, the component mounter includes a resource for mounting a component on a board, and the change of the temporary mounting condition increases the number of the resources that are the premise of the temporary mounting condition, and the increased number of resources. Change to provisional mounting conditions corresponding to.

  For example, the number of nozzles that are frequently used for mounting components on the type of mounting board that corresponds to a tact time that is not less than the target time, and the number of component cassettes that supply components that are often mounted on that type are increased. . That is, by increasing the resources, it is possible to determine a mounting condition that reliably shortens the tact time that is not less than the target time.

  Further, the mounting condition determination method further derives a provisional mounting condition and determines whether or not the specified tact time is less than or equal to the target time received for the product type for each product type of the mounting substrate. In the change of the temporary mounting condition, the temporary mounting condition is changed so that the tact time determined not to be less than the target time is shortened. For example, in changing the temporary mounting condition, the temporary mounting condition is changed so that the tact time determined as not being equal to or less than the target time is equal to or less than the target time.

  Thereby, like the above-mentioned, mounting conditions can be optimized for every kind of mounting board.

  Further, by treating the changed temporary mounting condition as a new temporary mounting condition, it is possible to specify the tact time, display the tact time and the target time, and whether or not the tact time is equal to or less than the target time. The determination and the change of the provisional mounting condition are repeated, and in the determination of the mounting condition, when it is determined that the tact time is less than the target time for each of all types of mounting boards, The provisional mounting condition changed to is determined as the mounting condition.

  As a result, even if the takt time for any of the mounting board types does not fall below the target time under the changed temporary mounting conditions, the temporary mounting until the takt time for all mounting board types falls below the target time. Since the conditions are changed repeatedly, the temporary mounting conditions can be changed by simple processing without requiring strict processing in changing the temporary mounting conditions per time. It is possible to easily determine the mounting conditions so that the time is less than the target time.

  Further, in the derivation of the temporary mounting conditions, the temporary mounting conditions are derived so that the time required for producing the plurality of types of mounting boards is minimized, and it is determined that the change in the temporary mounting conditions is not less than the target time. The priority of the production of the mounting board of the type corresponding to the tact time determined is prioritized over the production of the mounting board of other types, and the production of the mounting board of the plurality of types is performed under the priority condition. The temporary mounting condition is changed by deriving a new common temporary mounting condition for producing the plural types of mounting boards so that the time required is the shortest.

  For example, in the derivation or change of the provisional mounting conditions, a conventional optimization program is used to derive provisional mounting conditions that minimize the time required for producing a plurality of types of mounting boards. In particular, in changing the temporary mounting condition, a new temporary mounting condition is derived such that the above-mentioned time is minimized while satisfying the priority condition. Therefore, the total time required to produce a plurality of types of mounting boards can be shortened as much as possible under the determined mounting conditions. In addition, tentative mounting conditions are not derived so that the time required to produce a plurality of types of mounting boards is minimized, and only when the temporary mounting conditions are changed, the priority conditions are satisfied and the above-mentioned conditions are satisfied. When the provisional mounting condition that leads to the shortest time is derived, the provisional mounting condition derived first may be greatly changed. However, in the present invention, even when the provisional mounting conditions are derived, the provisional mounting conditions that lead to the shortest time required to produce a plurality of types of mounting boards are derived, so that changes in the provisional mounting conditions can be kept small. .

  Further, in the determination of the priority condition, the weight for the type of each mounting board is set to the priority so that the weight of the type corresponding to the tact time determined not to be less than or equal to the target time is larger than the weight of the other type. In the derivation of the new provisional mounting condition, the new provisional mounting condition is derived so that the larger the weight, the shorter the tact time of the product corresponding to the weight, according to the weight for the product of each mounting board determined as the priority condition. Deduced temporary mounting conditions.

  For example, the weight determined for each type of mounting board is the weight of each type of mounting board set for the conventional optimization program. When the optimization program is executed, a large weight is obtained. The provisional mounting conditions are derived so that the set type has a shorter takt time for the type. Therefore, in the present invention, in the determination of the priority condition, the weight for the type of each mounting board is determined so that the weight of the type corresponding to the tact time longer than the target time is larger than the weight of the other type. In the derivation of the provisional mounting condition, for example, the determined weight is set for the above-described optimization program, and the optimization program is executed. As a result, the tact time longer than the target time can be easily shortened by using the conventional optimization program, that is, by adjusting the parameters of the optimization program.

  Further, in the determination of the priority condition, a component used more frequently in the production of a mounting board of a type corresponding to the tact time determined not to be less than the target time is placed in a component supply unit near the board in the component mounting machine. It is determined as the priority condition that it is arranged or arranged continuously so that it can be adsorbed simultaneously.

  As a result, when a new temporary mounting condition is derived, the new temporary mounting condition is a component that is often used in the production of mounting boards of the type corresponding to the tact time that was longer than the target time in the previous temporary mounting condition. However, it is always placed near the board in the component mounter. As a result, the tact time that was longer than the target time in the previous provisional mounting condition can be reliably shortened in the new provisional mounting condition.

  In addition, in the determination of the priority condition, among a plurality of types of nozzles that are attached to the component mounting machine and suck components, it is often used to produce a variety of mounting boards corresponding to the tact time determined not to be less than the target time. It is determined as the priority condition that the type of nozzle to be used is more frequently attached to the component mounter.

  As a result, when a new provisional mounting condition is derived, the new provisional mounting condition is a type that is often used for the production of mounting boards of the type corresponding to the tact time that was longer than the target time in the previous provisional mounting condition. Many nozzles are always attached to the component mounting machine. As a result, the tact time that was longer than the target time in the previous provisional mounting condition can be reliably shortened in the new provisional mounting condition.

  Further, in the determination of the priority condition, the parts used more frequently in the production of the mounting board of the type corresponding to the tact time determined not to be less than the target time in the previous period can be supplied to the board at the same time. It is determined as the priority condition that it is placed on the mounting machine.

  As a result, when a new temporary mounting condition is derived, the new temporary mounting condition is a component that is often used in the production of mounting boards of the type corresponding to the tact time that was longer than the target time in the previous temporary mounting condition. However, it is always arranged so that a large amount can be supplied to the substrate at the same time, that is, divided into parts. As a result, the tact time that was longer than the target time in the previous provisional mounting condition can be reliably shortened in the new provisional mounting condition.

  The present invention can be realized not only as such a mounting condition determination method, but also as a device for determining mounting conditions according to the method, a component mounting machine equipped with the device, and processing included in the method as a computer. The present invention can also be realized as a program to be executed and a storage medium for storing the program.

  The mounting condition determining method of the present invention has an effect that the mounting conditions can be optimized for each type of mounting board.

  Hereinafter, a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is an external view of a component mounting system according to an embodiment of the present invention.

  The component mounting system 1000 according to the present embodiment includes a plurality of component mounters 100 (six component mounters 100 in the example shown in FIG. 1) and a mounting condition determination device 200.

  The plurality of component mounting machines 100 are configured as a production line for mounting components such as electronic components while sending a circuit board (hereinafter simply referred to as a board) 20 from upstream to downstream. That is, each component mounting machine 100 receives the substrate 20 from the upstream side, mounts the component on the substrate 20, and sends the substrate 20 on which the component is mounted to the downstream side. In addition, the board | substrate 20 with which components were mounted by the production line which consists of such a some component mounting machine 100 is hereafter called a mounting board | substrate.

  The mounting condition determining apparatus 200 can determine mounting conditions for mounting components on a production line that is a plurality of component mounting machines 100, and can optimize the mounting conditions for each type of mounting board. Here, when determining the mounting condition, the mounting condition determining apparatus 200 determines a mounting condition common to the production of a plurality of types of mounting boards. As a result, all types of mounting boards are produced under the determined mounting conditions. For example, the mounting condition determination device 200 determines a component arrangement, a nozzle arrangement, and a component mounting order, which will be described later, as the mounting conditions.

  Then, the mounting condition determination apparatus 200 instructs the component mounting system 1000 to use, manage, or operate the component mounting system 1000 and each component mounting machine 100 so that the components are mounted on the board 20 according to the mounting conditions. .

  FIG. 2 is an external view of the component mounter 100.

  The component mounting machine 100 includes two sub facilities (a front sub facility 110 and a rear sub facility 120) that perform component mounting simultaneously and independently. Each of the sub-equipment 110 and 120 is an orthogonal robot type mounting stage, and includes a component supply unit 115, a multi mounting head 112, an XY robot 113, a component recognition camera 116, and the like. The rear sub-equipment 120 includes a tray supply unit 117. The component supply unit 115 includes an array of a plurality of component cassettes (feeders) 114 that store component tapes.

  The multi-mounting head 112 (hereinafter simply referred to as a head) can include, for example, a maximum of 10 suction nozzles (hereinafter simply referred to as nozzles). 20 can be attached. The XY robot 113 moves the head 112. The component recognition camera 116 is used for two-dimensionally or three-dimensionally inspecting the suction state of the component sucked by the head 112. The tray supply unit 117 supplies tray parts. Each such sub-equipment executes component mounting on the board 20 in charge of each sub-equipment independently (in parallel) with other sub-equipment.

  The component tape is, for example, a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound on a reel or the like.

  Specifically, the component mounting machine 100 is a mounting machine having both functions of a component mounting machine called a high-speed mounting machine and a component mounting machine called a multi-function mounting machine. A high-speed mounting machine is a facility characterized by high productivity that mainly mounts electronic parts of □ 10 mm or less at a speed of about 0.1 seconds per point. A multi-function mounting machine is a large model of □ 10 mm or more. It is equipment for mounting electronic parts, odd-shaped parts such as switches and connectors, and IC parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

  In other words, the component mounting machine 100 is designed so that almost all types of electronic components (from 0.4 mm × 0.2 mm chip resistance to 200 mm connector as components to be mounted) can be mounted.

  FIG. 3 is a plan view showing the main configuration of the component mounter 100.

  When the tray supply unit 117 is attached to the sub-equipment, the shuttle conveyor 118 carries the parts taken out from the tray supply unit 117 and transports them to a position where the parts can be adsorbed by the head 112. It is a table. The nozzle station 119 is a table on which replacement nozzles corresponding to various types of component types are placed.

  The component recognition camera 116 is disposed near the center of the component supply unit 115 along the arrangement direction of the component cassettes 114. The head 112 that has picked up the component from the component supply unit 115 moves to the mounting point of the substrate 20 after passing through the component recognition camera 116, and repeats the operation of sequentially mounting all of the sucked components. Note that the mounting point is a position on the board on which a component is to be mounted.

  FIG. 4 is a schematic diagram showing the positional relationship between the head 112 and the component cassette 114.

  For example, a maximum of ten nozzles 112a can be attached to the head 112. The head 112 to which the ten nozzles 112a are attached can simultaneously pick up components from each of up to ten component cassettes 114 (by one up and down movement).

  The position of the component cassette 114 (component tape) in the component supply unit 115 is referred to as “position on the Z axis (Z number)”. The “Z axis” is a coordinate axis for specifying the position of the component cassette 114 set for each component mounter (sub-equipment). The arrangement of the component cassette 114 or the component tape along the Z-axis direction is called a component arrangement, and the arrangement of the nozzles 112a attached to the head 112 is called a nozzle arrangement.

  FIG. 5 is an external view showing an external appearance of an electronic component to be mounted. FIG. 6 is a diagram illustrating an example of a component tape and a reel containing electronic components.

  Various chip-type electronic components 423a to 423d as shown in FIGS. 5 (a) to 5 (d) are stored in a storage recess 424a formed continuously at a predetermined interval on the carrier tape 424 shown in FIG. Then, the cover tape 425 is attached to the upper surface for packaging. The carrier tape 424 to which the cover tape 425 is thus attached is supplied to the user in a taping form wound around the reel 426 by a predetermined quantity. The carrier tape 424 and the cover tape 425 constitute a component tape. The configuration of the component tape may be other than the configuration shown in FIG.

  Such a component mounting machine 100 moves the head 112 to the component supply unit 115 and sucks the component onto the head 112. Then, the component mounter 100 moves the head 112 onto the component recognition camera 116 at a constant speed, causes the component recognition camera 116 to capture images of all the components attracted by the head 112, and accurately determines the component suction position. Let it be detected. Further, the component mounting machine 100 moves the head 112 to the substrate 20 and sequentially mounts all the sucked components on the mounting points. The component mounter 100 mounts all the predetermined components on the substrate 20 by repeatedly executing such operations of suction, movement, and mounting by the head 112.

  FIG. 7 is a block diagram showing a functional configuration of the mounting condition determining apparatus 200 in the present embodiment.

  The mounting condition determining apparatus 200 in the present embodiment includes an input unit 201, a display unit 202, an optimization unit 203, an evaluation unit 204, a priority processing unit 205, a communication unit 206, a first storage unit 207, a second storage unit 208, And a third storage unit 209.

  The input unit 201 includes, for example, a keyboard and a mouse, receives an operation from an operator, and notifies the optimization unit 203 of the operation result.

  The display unit 202 is configured by, for example, a liquid crystal display, and displays operation states of the evaluation unit 204 and the optimization unit 203, and the first storage unit 207, the second storage unit 208, and the third storage unit 209. Display the data stored in the

  The optimization unit 203 optimizes the mounting conditions for mounting the components on the plurality of component mounting machines 100 as the production line by executing an optimization program provided conventionally. Further, when a priority condition described later is determined by the priority processing unit 205, the optimization unit 203 optimizes the above-described mounting condition under the priority condition. Then, the optimization unit 203 generates mounting condition data 209 a indicating the finally optimized mounting conditions and stores the mounting condition data 209 a in the third storage unit 209.

  Specifically, the optimization unit 203 of the present embodiment derives common provisional mounting conditions for producing a plurality of types of mounting boards. Further, every time the above-described priority condition is determined, the optimization unit 203 repeatedly executes the optimization program under the priority condition to derive a new temporary mounting condition, thereby obtaining the previous temporary mounting condition. To change. Then, the optimization unit 203 determines the finally changed provisional mounting condition as the finally optimized mounting condition, and generates mounting condition data 209a indicating the mounting condition. That is, in the present embodiment, the optimization unit 203 is configured as a determination unit that determines the changed provisional mounting condition as the mounting condition.

  Based on the mounting conditions (temporary mounting conditions) derived by the optimization unit 203, the evaluation unit 204 calculates the tact of the board type for each type of mounting board to be produced on the production line (hereinafter referred to as board type). evaluate. As a result, the evaluation unit 204 specifies a board type (hereinafter referred to as a priority type) whose tact should be shortened with priority. The tact is the time required to produce one mounting board on the production line.

  Here, in this embodiment, the evaluation unit 204 is configured as an accepting unit and a tact specifying unit. That is, the evaluation unit 204 accepts, as a target time (target time), a target time for producing one mounting board for each board type, and target time data 208a indicating the target time for each accepted board type. Is generated and stored in the second storage unit 208. Furthermore, the evaluation unit 204 identifies the tact for each board type when the production line mounts components in accordance with the provisional mounting conditions described above. Then, the evaluation unit 204 determines, for each board type, whether or not the identified tact is equal to or less than the target time accepted for the type, and determines the board type corresponding to the tact that is not less than the target time as the priority type. As specified.

  The priority processing unit 205 determines a condition that shortens the tact of the priority product as the above-described priority condition, and notifies the optimization unit 203 of the priority condition.

  In other words, the provisional implementation described above, in which the priority processing unit 205 determines the priority condition and the optimization unit 203 repeats the optimization under the priority condition, thereby shortening the tact determined that it is not less than the target time. Condition changes are made.

  The first storage unit 207 stores NC data 207a indicating information regarding each mounting point, and a component library 207b indicating information regarding each component. The second storage unit 208 stores the target time data 208a generated by the evaluation unit 204. The third storage unit 209 stores the mounting condition data 209a generated by the optimization unit 203.

  The communication unit 206 communicates with each component mounter 100. For example, the communication unit 206 transmits the mounting condition data 209a stored in the third storage unit 209 to each component mounting machine 100, thereby mounting each component according to the mounting condition indicated by the mounting condition data 209a. The component mounter 100 is executed.

  FIG. 8 is a diagram illustrating an example of the NC data 207a.

  The NC data 207a indicates information on the mounting points of all components to be mounted in the board type for each board type. As shown in FIG. 8, one mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, control data φi, and a mounting angle θi. Here, the component type corresponds to a component name in the component library 207b (see FIG. 9), and the X coordinate xi and the Y coordinate yi are coordinates of the mounting point (coordinates indicating a specific position on the board), and control data φi indicates constraint information related to the mounting of the component, for example, the type of nozzle 112a that can be used, the maximum movement acceleration of the head 112, and the like. Further, the mounting angle θi indicates an angle at which the nozzle 112a that sucks the component of the component type ci should rotate.

  FIG. 9 is a diagram illustrating an example of the component library 207b.

  The component library 207b is a library that collects unique information about each of all component types that can be handled by the component mounter 100. As shown in FIG. 9, the component library 207b includes a component size for each component type, a tact for the component type, and constraint information.

  The tact shown in the component library 207b is a time specific to the component type required to mount the component on the board 20 under a certain condition, and the constraint information includes, for example, the types of usable nozzles 112a (SX and , SA, etc.), recognition method by the component recognition camera 116 (reflection, etc.), maximum acceleration ratio of the head 112, and the like. FIG. 9 also shows the appearances of the components of each component type for reference. In addition, the component library 207b may include information such as the color of the component and the shape of the component.

  FIG. 10 is a diagram illustrating an example of the target time data 208a.

  The target time data 208a indicates, for each board type, the board type, the number of components mounted on the board type (hereinafter referred to as the number of parts), and the target time determined for the board type.

  For example, the target time data 208a indicates the board type “A”, the number of parts “550” of the board type, and the target time “23 seconds” of the board type. The target time data 208a indicates the board type “B”, the number of parts “647” of the board type, and the target time “21 seconds” of the board type.

  Such a target time is, for example, a time set based on a cost target required by a manufacturer when the contractor subcontracts production of a mounting board from the manufacturer. That is, if the tact of the mounting board exceeds the target time corresponding to the board type of the mounting board, the contractor cannot make a predetermined profit for the production of the mounting board. Therefore, it is necessary for the contractor to keep the tact of the mounting substrate (substrate type) below this target time.

  In the present embodiment, the above target time is received in advance by the evaluation unit 204. That is, the evaluation unit 204 causes the display unit 202 to display a message that prompts input of the target time for each board type. The operator who sees the message operates the input unit 201 to input the target time for each board type. As a result, the evaluation unit 204 generates the target time data 208a described above and stores it in the second storage unit 208.

  In the target time data 208a in the present embodiment, the number of parts of the board type is shown, but the number of parts may not be shown. Further, the target time is not necessarily proportional to the number of parts.

  FIG. 11 is an explanatory diagram for explaining optimization of mounting conditions.

  First, based on the operation result notified from the input unit 201, the optimization unit 203 determines, for example, that the board types of the mounting boards to be produced on the production line are “A to E”. As a result, the optimization unit 203 first sets the board types A to E so that the total time required to produce all the mounted boards of the board types A to E (hereinafter referred to as total line tact) is the shortest. A common mounting condition (provisional mounting condition) is derived.

  When the mounting conditions are derived in this way, the evaluation unit 204 specifies a tact for each of the board types A to E under the mounting conditions, for example, by executing a tact simulation program. Further, the evaluation unit 204 reads the target time data 208a stored in the second storage unit 208, and knows the target times of the above-described substrate types A to E.

  Then, the evaluation unit 204 determines, for each board type A to E, whether or not the tact of the board type is within the target time of the board type, and selects the board type with the tact not within the target time. It is specified as the above-mentioned priority variety. Here, when the evaluation unit 204 determines that the tact of the plurality of substrate types is longer than each target time, for example, the substrate corresponding to the tact having the largest difference from the target time among the plurality of substrate types. The variety is identified as the preferred variety.

  For example, when the evaluation unit 204 specifies the board type E as the priority type, the priority processing unit 205 shortens the tact of the board type E, that is, the production of the mounting board of the board type E is different from the other board types. Priority conditions are determined so as to be advantageous compared to the production of the mounting board.

  When the priority condition for the board type E is determined in this way, the optimization unit 203 performs optimization again under the priority condition, and the mounting condition (temporary condition) that minimizes the total line tact under the priority condition. Derive mounting conditions).

  The optimization unit 203, the evaluation unit 204, and the priority processing unit 205 repeatedly execute the processing described above. As a result, when the tacts of all board types A to E fall below their respective target times, the optimization unit 203 uses the latest mounting conditions (temporary mounting conditions) derived at that time as final mounting. Determine as a condition.

  FIG. 12 is a diagram illustrating an example of a tact for each board type that is changed by repeated optimization.

  For example, as shown in FIG. 12A, the evaluation unit 204 identifies the tacts of the board types A to E based on the mounting conditions derived by the optimization unit 203 in a situation where the priority conditions are not determined. . Then, the evaluation unit 204 determines that the tact of the board types C to E is longer than each target time, and calculates the difference between the tact of the board types C to E and the target time of the board types C to E, respectively. .

  That is, the evaluation unit 204 calculates the difference “1 second” between the tact “19 seconds” of the board type C and the target time “18 seconds”, and the tact “23 seconds” and the target time “21 seconds” of the board type D. The difference “2 seconds” is calculated, and the difference “3 seconds” between the tact “18 seconds” of the board type E and the target time “15 seconds” is calculated.

  As a result, the evaluation unit 204 specifies the board type E having the largest difference between the tact and the target time as the priority type from among the board types C to E.

  As a result, the priority processing unit 205 determines a priority condition that shortens the tact of the board type E, which is the priority type, and the optimization unit 203 performs optimization again under the priority condition, and the priority condition Below, we derive the mounting conditions that minimize the total line tact.

  Based on the mounting conditions derived by the optimization unit 203 as described above, the evaluation unit 204 identifies the tacts of the board types A to E again, for example, as shown in FIG. For each E, it is determined whether the takt of the board type is within the target time of the board type. As a result, the evaluation unit 204 determines that the tact “13 seconds” of the board type E is within the target time “15 seconds” of the board type E, and the tacts of the board types C and D are longer than the respective target times. To do.

  Then, the evaluation unit 204 calculates the difference between the tact of the board types C and D and the target time of the board types C and D. That is, the evaluation unit 204 calculates the difference “1 second” between the tact “19 seconds” of the board type C and the target time “18 seconds”, and the tact “24 seconds” and the target time “21 seconds” of the board type D. The difference “3 seconds” is calculated.

  Then, the evaluation unit 204 identifies the board type D having the largest difference between the tact and the target time as the priority type among the board types C and D.

  As a result, the priority processing unit 205 determines a priority condition that shortens the tact of the board type D, which is the priority type, and the optimization unit 203 performs optimization again under the priority condition, and the priority condition Below, we derive the mounting conditions that minimize the total line tact.

  Based on the mounting conditions derived by the optimization unit 203 as described above, the evaluation unit 204 identifies the tacts of the board types A to E again, for example, as shown in FIG. For each E, it is determined whether the takt of the board type is within the target time of the board type. As a result, the evaluation unit 204 determines that the tact “20 seconds” of the board type D is within the target time “21 seconds” of the board type D, and that only the tact of the board type C is longer than the target time. The type C is specified as the priority type.

  As a result, the priority processing unit 205 determines a priority condition that shortens the tact of the substrate type C, which is the priority type, and the optimization unit 203 performs optimization again under the priority condition, and the priority condition Below, we derive the mounting conditions that minimize the total line tact.

  Based on the mounting conditions derived by the optimization unit 203 as described above, the evaluation unit 204 identifies the tacts of the board types A to E again, for example, as shown in FIG. For each E, it is determined whether the takt of the board type is within the target time of the board type. As a result, the evaluation unit 204 determines that the tacts of all the board types A to E are within the respective target times, and instructs the optimization unit 203 to end the optimization.

  Here, the evaluation unit 204 in the present embodiment causes the display unit 202 to display the tact and target time for each board type shown in FIGS. 12 (a) to 12 (d). That is, each time an optimized mounting condition is derived, the evaluation unit 204 identifies the tact of each board type A to E under the mounting condition, and the identified tact and target time for each board type. Are displayed on the display unit 202 in association with each other.

  When receiving the optimization termination instruction from the evaluation unit 204, the optimization unit 203 determines the mounting condition derived by the last optimization as the final mounting condition, and mounting condition data 209a indicating the mounting condition Is stored in the third storage unit 209. Further, the optimization unit 203 displays the mounting condition data 209 a on the display unit 202 or transmits the mounting condition data 209 a to each component mounting machine 100 via the communication unit 206.

  Note that when the mounting conditions are optimized again under the priority conditions as described above, the takt of the board type that is less than or equal to the target time may increase as shown in FIG. For example, as shown in FIG. 12A, as a result of the optimization of the initial mounting conditions, the tact of the board type A was 19 seconds. Increases from 21 seconds → 22 seconds → 23 seconds, as shown in FIGS. 12B, 12C, and 12D.

  Further, if the mounting conditions are optimized again under the priority conditions as described above, the total line tact may also increase. For example, as shown in FIG. 12 (a), the total line tact is 94 seconds as a result of the optimization of the mounting conditions first, but the total line tact is obtained by repeatedly performing the optimization. Increases from 95 seconds → 96 seconds → 97 seconds as shown in FIGS. 12B, 12C, and 12D.

  However, even if the board type tact and total line tact increase in this way, if the tact of each board type under the finally determined mounting conditions is less than or equal to the target time, the contractor will have a predetermined profit. Can give. In other words, the contractor can produce a plurality of board types of mounting boards at a cost lower than their respective target costs and sell them to the manufacturer, and can make a predetermined profit.

  Here, the above-described priority condition determined by the priority processing unit 205 will be described.

  The priority processing unit 205 determines a priority condition in which the production of the mounting board of the type corresponding to the tact determined to be longer than the target time is given priority over the production of the mounting board of other types. That is, the priority processing unit 205 determines, for example, a weight, a component arrangement, a nozzle arrangement, and a component division number for the priority product as priority conditions for shortening the priority product tact.

  Specifically, when the priority processing unit 205 determines the weight for the priority product as the priority condition, the priority processing unit 205 has a weight larger than the weight of the priority product set in the optimization program executed previously by the optimization unit 203 described above. Are determined as new weights for the priority varieties. In other words, the priority processing unit 205 determines the weight for the type of each mounting board as a priority condition so that the weight of the type corresponding to the tact determined not to be less than the target time is larger than the weight of the other type. .

  Here, the weight is a value set for each board type in the optimization by the optimization unit 203, and is, for example, the number of mounted boards to be produced (production quantity), strictly speaking, the production quantity. It is proportional to the total number of parts. In other words, the optimization unit 203 sets the weight for each board type in the optimization program and executes the program, so that the weight set for the board type (production number or total number of parts) increases. Optimization is performed so that the tact of the board type is shortened.

  For example, in a situation where the priority condition is not determined, the optimization unit 203 first sets the same weight “1” for each of the board types A to E and performs optimization. That is, the optimization unit 203 performs the optimization under the condition that the number of produced boards of the board types A to E is equal.

  Here, the priority processing unit 205 determines the weight “10” as the priority condition for the substrate type E, which is the priority type. As a result, the optimization unit 203 sets the same weight “1” for each of the board types A to D, and sets the weight “10” only for the board type E to perform optimization. In other words, the optimizing unit 203 has the condition that the number of produced boards of the board types A to D is equal, and the number of produced boards of the board type E is 10 times higher than the number of produced boards (priority). Optimization). The tact of the board type E determined by such optimization tends to be shorter than the tact of the board type E determined by the previous optimization.

  FIG. 13 is an explanatory diagram for explaining a component arrangement, a nozzle arrangement, and a component division number determined as priority conditions.

  First, when the priority processing unit 205 determines the component arrangement as a priority condition, for example, among the plurality of component cassettes 114, the component cassette 114 that supplies a large number of components to the substrate 20 of the priority product type is used as the multi-supply component cassette. As specified. Then, the priority processing unit 205 determines the Z number of the multi-supply component cassette as a priority condition so that the multi-supply component cassette is located near the board 20 arranged in the component mounter 100. It should be noted that an arrangement in which a plurality of multi-supply component cassettes are continuous may be determined as a priority condition so that components supplied from a plurality of multi-supply component cassettes can be simultaneously picked up by a single suction operation.

  In other words, the priority processing unit 205 indicates that the components used more frequently in the production of the mounting board of the type corresponding to the tact determined not to be less than the target time are arranged closer to the board 20 in the component mounting machine 100. Determine as a priority condition.

  For example, as shown in FIG. 13, the positions of ten component cassettes 114 arranged in the component mounter 100 are identified by Z numbers “Z1, Z2, Z3,..., Z10”, respectively. In this case, the priority processing unit 205 determines “Z6, Z7, Z5” or the like as the Z number of the multi-supply component cassette. That is, the priority processing unit 205 preferentially determines the Z number close to the approximate center of the substrate 20 in the component arrangement direction (Z-axis direction) as the Z number of the multi-supply component cassette.

  Specifically, as shown in FIG. 13, the optimization unit 203 has a component cassette 114 for supplying a component of the component type c1 in the Z number Z1 by the first optimization in a situation where the priority condition is not determined. The component arrangement in which the component cassette 114 for supplying the component type c2 is in the Z number Z2 and the component cassette 114 for supplying the component type c3 is in the Z number Z3 is derived as a mounting condition.

  Here, as described above, the priority processing unit 205 supplies the component cassette 114 that supplies components of the component type c2 to the substrate 20 of the priority type E, and the multiple supply that supplies the most components to the substrate 20. It is specified as a component cassette, and it is determined as a priority condition that the multi-supply component cassette should be in Z number Z6.

  When such a priority condition is determined, the optimization unit 203 performs the second optimization so that the multi-supply component cassette that supplies the component type c2 is always arranged at the Z number Z6. That is, the optimization unit 203 performs the second optimization by fixing the multi-supply component cassette that supplies the component type c2 to the Z number Z6.

  As a result of the second optimization, for example, when the tact of the board type E does not fall below the target time and the board type E is still the priority type, the priority processing unit 205 supplies a component cassette for supplying the component type c2. Among the plurality of component cassettes 114 other than 114, the component cassette 114 that supplies the most components to the substrate 20 of the priority type E is specified as the second multi-supply component cassette. For example, the priority processing unit 205 specifies the component cassette 114 that supplies components of the component type c9 for the substrate 20 of the priority product type E as the second multi-supply component cassette, and the multi-supply component cassette is Z number Z7. It is decided as a priority condition what should be.

  When such priority conditions are determined, the optimization unit 203 always arranges the first multi-supply component cassette that supplies the component type c2 in the Z number Z6 and supplies the component type c9 component. The third optimization is performed so that the second multi-feed component cassette is always arranged at the Z number Z7. That is, the optimization unit 203 fixes the multi-supply component cassette that supplies the component type c2 to Z number Z6 and fixes the multi-supply component cassette that supplies the component type c9 component to Z number Z7 for the third time. Perform optimization.

  As described above, the multi-feed component cassette is arranged near the substrate 20 (near the center) such as Z numbers Z6 and Z7, so that the head 112 sucks and moves the components supplied from the multi-feed component cassette. The time required for mounting can be reduced. As a result, the tact can be shortened in the mounting board of the priority type produced by attracting and mounting many components from the multi-supply component cassette.

  Next, when the priority processing unit 205 determines the nozzle arrangement as a priority condition, for example, among the plural types of nozzles 112a that can be attached to the head 112, the priority processing unit 205 is often used for mounting components on the priority type substrate 20. The type of the nozzle 112a is specified as the multiple mounting nozzle type. The priority processing unit 205 arranges the multiple mounting nozzle type nozzles 112a so that the number of the multiple mounting nozzle type nozzles 112a attached to the head 112 is increased and the nozzles 112a are attached at predetermined positions. Is determined as a priority condition.

  That is, the priority processing unit 205 is mounted on the head 112 of the component mounting machine 100, and among the plurality of types of suction members (nozzles 112a) that suck the components, mounting the type corresponding to the tact determined not to be less than the target time. It is determined as a priority condition that a suction member of a type that is often used for production of a board is attached to the head 112 of the component mounting machine 100 more.

  For example, as shown in FIG. 13, the positions of the nozzles 112a attached to the head 112 of the component mounter 100 are identified by the attachment positions “h1, h2, h3,. In this example, eight nozzles 112 a can be attached to the head 112.

  In such a case, as shown in FIG. 13, the optimization unit 203 performs the first optimization in the situation where the priority condition is not determined, so that the type 112 nozzle 112a is located at the mounting positions h1 and h2, and the type k2 The nozzle arrangement in which the nozzle 112a is at the mounting position h3 and the type 112 nozzle 112a is at the mounting position h4 is derived as a mounting condition.

  Here, the priority processing unit 205 identifies the type k2 of the nozzle 112a that is most frequently used for mounting components on the substrate 20 of the priority type E as the multiple mounting nozzle type. Then, the priority processing unit 205 determines the arrangement of the nozzles 112a of the multiple mounting nozzle type k2 as a priority condition so that there are two nozzles 112a of the multiple mounting nozzle type k2 and these nozzles 112a are mounted adjacent to each other. To do. That is, the number of the nozzles 112a of the multiple mounting nozzle type k2 is one more than the number “1” in the nozzle arrangement derived by the first optimization, and the two nozzles 112a of the multiple mounting nozzle type k2 are increased. The arrangement is determined so that the mounting positions of “h2, h3” are.

  When such a priority condition is determined, the optimization unit 203 performs the second optimization so that the nozzle 112a of the multiple mounting nozzle type k2 is always attached to the attachment positions h2 and h3. That is, the optimization unit 203 performs the second optimization by fixing the nozzle 112a of the multiple mounting nozzle type k2 at the attachment positions h2 and h3.

  As a result of the second optimization, for example, when the tact of the substrate type E does not fall below the target time and the substrate type E is still the priority type, the priority processing unit 205 has 3 nozzles 112a of the multi-mounted nozzle type k2. The arrangement of the nozzles 112a of the multi-mounted nozzle type k2 is determined as a priority condition so that the nozzles 112a are attached next to each other. That is, the number of nozzles 112a of the multiple mounting nozzle type k2 is one more than the number “2” in the nozzle arrangement derived by the second optimization, and the three nozzles of the multiple mounting nozzle type k2 The arrangement is determined such that the mounting position of 112a is “h2, h3, h4”.

  When such priority conditions are determined, the optimization unit 203 performs the third optimization so that the nozzle 112a of the multiple mounting nozzle type k2 is always attached to the attachment positions h2, h3, and h4. That is, the optimization unit 203 performs the third optimization by fixing the nozzle 112a of the multiple mounting nozzle type k2 to the attachment positions h2, h3, and h4.

  In this way, by increasing the number of nozzles 112a of the multiple mounting nozzle type, when producing a mounting board of a priority product type, a large number of components can be mounted on the substrate 20 in one task. The tact time on the mounting board can be shortened. The above-described task is a series of operations until the head 112 picks up and moves the component and mounts the component. The component mounter 100 repeats this task to repeat all the predetermined tasks. The component is mounted on the substrate 20.

  Furthermore, by attaching a plurality of nozzles 112a of multiple mounting nozzle type next to each other, when producing a priority type of mounting board, simultaneous suction can be performed by these nozzles 112a. That is, if a plurality of component cassettes 114 that supply components to be sucked by the multiple mounting nozzle type nozzle 112a are arranged side by side, the plurality of nozzles of the multiple mounting nozzle type without the head 112 moving in the horizontal direction. 112a can simultaneously pick up components from each component cassette 114. As a result, the time required for the task can be reduced, and the tact time on the priority type mounting board can be further reduced.

  Next, when the priority processing unit 205 determines the number of component divisions as a priority condition, for example, among the plurality of component cassettes 114, the multiple supply of the component cassettes 114 that supply a large number of components to the priority type substrate 20 Identifies as a component cassette. Then, the priority processing unit 205 sets the number larger than the number of multi-supply component cassettes in the mounting condition (component arrangement) derived by the previous optimization as the new number of multi-supply component cassettes, that is, the number of component divisions. decide. That is, the priority processing unit 205 divides a multi-supply component cassette corresponding to the priority product type, and determines the number of component divisions obtained as a priority condition.

  That is, the priority processing unit 205 allows the component mounter 100 so that more components used for production of the mounting board of the type corresponding to the tact determined not to be less than the target time can be supplied to the board 20 at the same time. Is determined as a priority condition.

  Specifically, as shown in FIG. 13, the priority processing unit 205 supplies a component cassette 114 that supplies components of the component type c2 to the substrate 20 of the priority type E, and supplies the most components to the substrate 20. Specified as a multi-supply component cassette to be supplied. Then, the priority processing unit 205 increases the number of the multi-supply component cassettes from one to two in the component array obtained by the first optimization, and the number of parts division of the multi-supply component cassette is “2”. Is determined as a priority condition.

  When such priority conditions are determined, the optimization unit 203 performs the second optimization so that the number of multi-supply component cassettes that supply components of the component type c2 is always “two”.

  In this way, by dividing the parts of the multi-feed parts cassette, when producing a priority type of mounting board, it is possible to simultaneously pick up as many parts as the number of parts divided. As a result, the time required for the task can be shortened, and the tact time of the priority type mounting board can be shortened.

  FIG. 14 is a flowchart showing the operation of the mounting condition determining apparatus in the present embodiment.

  First, the optimization unit 203 of the mounting condition determining apparatus 200 reads the NC data 207a and the component library 207b necessary for optimizing the mounting conditions (Step S100), and the evaluation unit 204 reads the target time data 208a (Step S102). ). At this time, if the priority processing unit 205 holds a previously determined priority condition, the priority processing unit 205 deletes the priority condition and performs initialization, and sets the number of optimization iterations N to “0”.

  Next, the optimization unit 203 optimizes the mounting conditions using the NC data 207a and the component library 207b read in step S100 (step S104). The evaluation unit 204 identifies the tact of each board type in the mounting condition derived by the optimization in step S104 (step S106), and the tact of each board type indicated by the target time data 208a read in step S102. It is determined whether or not each time is within the time (step S108).

  If the evaluation unit 204 determines that the tact of any one of the plurality of board types exceeds the target time of the board type (N in step S108), the evaluation unit 204 determines that the tact exceeds the target time. A priority type is identified from the corresponding board types, and the priority type is notified to the priority processing unit 205.

  As a result, the priority processing unit 205 determines the priority condition for the priority product notified from the evaluation unit 204, that is, the priority condition for the substrate product corresponding to the tact exceeding the target time (step S110). Then, the priority processing unit 205 notifies the optimization unit 203 of the determined priority condition, and causes the optimization unit 203 to perform optimization again under the priority condition (step S104).

  Here, when the priority processing unit 205 determines the priority condition and notifies it to the optimization unit 203, the priority processing unit 205 increments the number of optimization iterations N described above. Then, the priority processing unit 205 determines a priority condition according to the value of the repetition count N, for example.

  On the other hand, when the evaluation unit 204 determines in step S108 that the tacts of all board types are equal to or less than the respective target times (Y in step S108), the evaluation unit 204 instructs the optimization unit 203 to determine the mounting conditions. To do. As a result, the optimization unit 203 determines the finally derived mounting condition as the final mounting condition, and generates mounting condition data 209a indicating the mounting condition (step S112).

  FIG. 15 is a flowchart illustrating an example of a detailed operation of the process performed by the priority processing unit 205 (step S110 in FIG. 14).

  First, when the priority processing unit 205 receives a notification of a priority product type from the evaluation unit 204 (step S200), the priority processing unit 205 determines whether or not the number of optimization iterations N is greater than or equal to f times (f is an integer equal to or greater than 0). (Step S202).

  If the priority processing unit 205 determines that the number of repetitions N is less than f (N in step S202), the priority processing unit 205 determines the weight for the priority product as a priority condition and notifies the optimization unit 203 (step S204). . On the other hand, if the priority processing unit 205 determines that the number of repetitions N is equal to or greater than f (Y in step S202), is the optimization number of repetitions N equal to or less than g (g is an integer greater than f)? It is determined whether or not (step S206).

  As a result, when the priority processing unit 205 determines that the number of repetitions N is equal to or less than g times (Y in step S206), the priority processing unit 205 determines the component arrangement for the priority product as a priority condition and notifies the optimization unit 203 (step S208). ). On the other hand, if the priority processing unit 205 determines that the number of iterations N is greater than g (N in step S206), is the optimization number of iterations N less than h (h is an integer greater than g)? It is determined whether or not (step S210).

  If the priority processing unit 205 determines that the number of repetitions N is less than or equal to h (Y in step S210), the priority processing unit 205 determines the number of parts divided for the priority product as a priority condition and notifies the optimization unit 203 (step S210). S212). On the other hand, if the priority processing unit 205 determines that the number of iterations N is greater than h (N in step S210), is the optimization iteration number N equal to or less than i (i is an integer greater than h)? It is determined whether or not (step S214).

  As a result, when the priority processing unit 205 determines that the number of repetitions N is equal to or less than i (Y in step S214), the priority processing unit 205 determines the nozzle arrangement for the priority product as a priority condition and notifies the optimization unit 203 (step S216). ). On the other hand, if the priority processing unit 205 determines that the number of repetitions N is greater than i (N in step S214), the priority processing unit 205 determines that it is impossible to determine further priority conditions for the priority product, for example, the production line The optimization unit 203 is instructed to execute the optimization by increasing the number of the component mounting machines 100 (step S218).

  Then, the priority processing unit 205 increments the optimization repetition count N after determining and notifying the priority condition in steps S204, S208, S212, and S216 (step S220).

  As described above, in the mounting condition determining apparatus 200 according to the present embodiment, common mounting conditions for producing a plurality of types of mounting boards are derived by the conventional optimization program. Even if the tact for the type of mounting board becomes longer than the target time, the mounting conditions are changed so that the tact is shortened, and the changed mounting conditions are determined as the final mounting conditions. Mounting conditions can be optimized for each type of substrate.

  In the present embodiment, if there is at least one tact longer than the target time among the tacts for each board type specified by the evaluation unit 204, the priority condition is determined and the determined priority condition is satisfied. The optimization of the mounting conditions is repeatedly performed until the long tact as described above is eliminated. On the other hand, the conventional optimization program cannot shorten the longest machine tact among the machine tacts of the component mounter 100 included in the production line (the time per component mounter required for component mounting). When the optimization process ends. That is, the optimization processing of the optimization unit 203 in the present embodiment is continuously executed even if the longest machine tact cannot be shortened any longer, as long as there is at least one tact longer than the target time. The process ends with an end condition (optimization algorithm) different from that of the conventional optimization program.

(Modification 1)
In the above embodiment, the evaluation unit 204 identifies one priority product and the priority processing unit 205 determines the weight for the priority product as a priority condition. However, the operator sets the weight for each board product as the priority condition. May be.

  That is, in this modification, the priority processing unit 205 does not determine the priority condition, and the evaluation unit 204 receives the weight for each board type as a priority condition from the operator via the input unit 201. In this modification, the weight is referred to as priority.

  FIG. 16 is a diagram for explaining the operation of the evaluation unit 204 according to this modification.

  First, as shown in FIG. 16A, the evaluation unit 204 displays a message for prompting input of the target time and priority, and a table ta for displaying the tact, target time, and priority on the display unit 202. Display. The table ta includes, for each board type, a cell for displaying a tact, a cell for displaying a target time, and a cell for displaying a priority. These cells are empty in the initial state.

  Here, the operator operates the input unit 201 to input the target time and priority for each board type. As a result, as shown in FIG. 16B, the evaluation unit 204 acquires the target time and priority for each board type input by the operator, and displays them in the cells corresponding to each of the tables ta. Let For example, the evaluation unit 204 acquires the target time “100 seconds” and the priority “4” of the board type A, and displays the target time and the priority in the corresponding cells. Further, when the target time and priority of all board types are displayed on the table ta as a result of the operation by the operator, the evaluation unit 204 causes the display unit 202 to display a button bt1 instructing execution of optimization. Each time the evaluation unit 204 acquires the target time, the evaluation unit 204 writes the target time in the target time data 208a stored in the second storage unit 208.

  When the operator operates the input unit 201 to select the button bt1, the evaluation unit 204 notifies the optimization unit 203 of the priority acquired for each board type and causes the optimization to be executed. That is, the optimization unit 203 treats the priority for each board type displayed in the table ta as the above-described weight (production number) for each board type set in the optimization program, and implements using the weight. Perform condition optimization.

  In this modification, the priority is indicated by a numerical value. The smaller the numerical value, the higher the priority of the numerical value. In other words, a board type with a lower priority value is given priority over a board type with a higher priority value. That is, a number proportional to the reciprocal of the numerical value indicating the priority corresponds to the above-described weight (production number).

  When the optimization unit 203 optimizes the mounting conditions, the evaluation unit 204 identifies the tact for each board type based on the optimized mounting conditions. Then, as shown in FIG. 16C, the evaluation unit 204 displays the identified tact for each substrate type in the corresponding cell of the table ta. Further, the evaluation unit 204 compares the tact and the target time for each board type. As a result, if there is a board type whose tact is longer than the target time, the evaluation unit 204 changes, for example, the color of the cell of the board type, tact and target time in the table ta (in FIG. 16C). Shaded cells). At this time, the evaluation unit 204 further causes the display unit 202 to display a button bt2 for instructing determination of the mounting condition and a button bt3 for instructing change of the priority.

  Here, if the operator is not satisfied that there is a tact longer than the target time, the operator operates the input unit 201 to operate the button bt3. As a result, as shown in (d) of FIG. 16, the evaluation unit 204 displays a message for urging the priority to be changed on the display unit 202 and makes the priority displayed in the table ta changeable. To do. The operator who sees such a message operates the input unit 201 to change the priority for each board type. That is, as illustrated in FIG. 16D, the evaluation unit 204 changes the priority displayed in the table ta according to the operation of the operator. For example, since the tact “150 seconds” of the board type C is considerably longer than the target time “120 seconds”, the operator changes the priority of the board type C from “5” to “1”. Also, since the tact “120 seconds” of the board type A is longer than the target time “100 seconds”, the priority of the board type A is changed from “4” to “2”. At this time, the evaluation unit 204 further causes the display unit 202 to display a button bt1 that instructs execution of optimization.

  Note that the evaluation unit 204 may change not only the priority displayed in the table ta but also the target time. In this case, the evaluation unit 204 changes the displayed target time according to the operation of the input unit 201 by the operator, and updates the target time indicated in the target time data 208a to the changed target time. .

  When the operator operates the input unit 201 and selects the button bt1, the evaluation unit 204 notifies the optimization unit 203 of the priority changed for each board type and causes the optimization to be executed again. That is, the optimization unit 203 sets the changed priority for each board type displayed in the table ta (a number proportional to the inverse of the numerical value indicating the priority) for each board type set in the optimization program. It is treated as a new weight, and the mounting conditions are optimized again using the weight (priority).

  When the optimization unit 203 optimizes the mounting conditions again, the evaluation unit 204 identifies the tact for each board type based on the optimized mounting conditions. Then, as shown in FIG. 16E, the evaluation unit 204 displays the specified tact for each substrate type in a corresponding cell of the table ta. Further, the evaluation unit 204 compares the tact and the target time for each board type. As a result, if there is a board type whose tact is longer than the target time, the evaluation unit 204 changes the color of the cell of the board type, tact and target time in the table ta (see (e) in FIG. 16). Shaded cells). At this time, the evaluation unit 204 further causes the display unit 202 to display a button bt2 for instructing determination of the mounting condition and a button bt3 for instructing change of the priority.

  Here, even if there is a tact longer than the target time, the operator operates the button bt2 by operating the input unit 201 if the tact is satisfied. As a result, as shown in FIG. 16F, the evaluation unit 204 displays a message notifying that the mounting condition has been determined on the display unit 202, and instructs the optimization unit 203 to end the optimization.

  FIG. 17 is a flowchart showing the operation of the mounting condition determining apparatus in this modification.

  First, the optimizing unit 203 of the mounting condition determining apparatus 200 reads the NC data 207a and the component library 207b necessary for optimizing the mounting conditions (step S300), and the evaluating unit 204 is based on an operation on the input unit 201 by the operator. The target time and priority for each board type are acquired (step S302).

  Next, the optimization unit 203 optimizes the mounting conditions using the NC data 207a and the component library 207b read in step S300 and the priority acquired by the evaluation unit 204 (step S304). The evaluation unit 204 identifies the tact of each board type in the mounting conditions derived by the optimization in step S304 (step S306), and causes the display unit 202 to display the tact and target time (step S308).

  Here, the evaluation unit 204 determines whether or not the button bt2 instructing the determination of the mounting condition is selected by the operation of the input unit 201 by the operator, that is, the operator satisfies the tact of each board type and determines the mounting condition. Is determined (step S310).

  Here, when the evaluation unit 204 determines that the button bt2 has not been operated, in other words, the button bt3 instructing the priority change has been selected (N in step S310), for example, as illustrated in FIG. As described above, a change in priority is accepted (step S312). Note that the evaluation unit 204 may accept not only the priority but also a change in the target time acquired in step S302.

  When the priority is changed, the optimization unit 203 acquires the changed priority from the evaluation unit 204, and again executes the optimization of the mounting condition using the changed priority (step S304). .

  On the other hand, when determining that the button bt2 has been operated in step S310 (Y in step S310), the evaluation unit 204 instructs the optimization unit 203 to determine the mounting conditions. As a result, the optimization unit 203 determines the mounting condition derived last as the final mounting condition, and generates mounting condition data 209a indicating the mounting condition (step S314).

  As described above, in the mounting condition determining apparatus 200 according to the present modification, as in the above-described embodiment, common provisional mounting conditions for producing a plurality of types of mounting boards are derived by the conventional optimization program, As a result, even if the tact for any of the mounting board types is longer than the target time under the temporary mounting conditions, the temporary mounting conditions are changed so that the tact is shortened, and the changed temporary mounting conditions are changed. Therefore, the mounting conditions can be optimized for each type of mounting board. Furthermore, since the tact and target time are displayed for each type of mounting board, the operator can check whether the tact is longer than the target time and the mounting board has a longer tact than the target time. And the difference between tact and target time can be easily grasped.

  In this modified example, the operator inputs the priority, but the number of mounted boards produced in proportion to the priority may be input.

(Modification 2)
In the present embodiment, the priority processing unit 205 determines the specific content of the weight, the component arrangement, the number of component divisions, or the nozzle arrangement as the priority condition, but other contents may be determined as the priority condition. .

  For example, the priority processing unit 205 determines the type of the head 112 that shortens the tact of the priority product as the priority condition.

  Specifically, the optimization is performed on the assumption that the head 112 has 8 heads, and when the number of components mounted on the priority type board is large, the priority processing unit 205 sets the 12 heads. Is determined as a priority condition. The eight heads are heads to which a maximum of eight nozzles 112a can be attached, and the twelve heads are heads to which a maximum of twelve nozzles 112a can be attached. That is, the priority processing unit 205 changes the type of the head 112 from 8 heads to 12 heads.

  When optimization is performed on the premise that the head 112 has eight heads, and a large number of odd-shaped parts such as switches and connectors are mounted on a board of a priority type, the priority processing unit 205 has three heads. The head is determined as a priority condition. The three heads are heads to which a maximum of three nozzles 112a can be attached. That is, the priority processing unit 205 changes the type of the head 112 from eight heads to three heads.

  The priority processing unit 205 may determine the number of resources of the component mounter 100 as a priority condition. The resources are, for example, the nozzle 112a and the component cassette 114.

  FIG. 18 is a diagram for explaining the number of resources determined as priority conditions.

  For example, as shown in FIG. 18A, it is assumed that “the number of nozzles 112a attached to the head 112 is eight” even though the number of nozzles 112a that can be attached to the head 112 is twelve. When the optimization is performed, the priority processing unit 205 determines the priority condition “the number of nozzles 112a attached to the head 112 is twelve”. That is, the priority processing unit 205 increases the number of nozzles 112a attached to the head 112 from eight to twelve.

  Further, as shown in FIG. 18B, although the number of component cassettes 114 that can be attached to the component supply unit 115 is 24, “the number of component cassettes 114 attached to the component supply unit 115 is When optimization is performed on the assumption that “18”, the priority processing unit 205 determines the priority condition “the number of component cassettes 114 attached to the component supply unit 115 is 24”. That is, the priority processing unit 205 increases the number of component cassettes 114 attached to the component supply unit 115 from 18 to 24.

  The priority processing unit 205 may determine the type of priority condition to be determined based on an operation by the operator. For example, the priority processing unit 205 causes the display unit 202 to display a priority condition selection screen that allows the operator to select the type of priority condition to be determined.

  FIG. 19 shows a priority condition selection screen.

  The priority processing unit 205 determines, for example, a message “Please select a priority condition”, each type of priority condition, a check box cb associated with each type, and the selected priority condition. Button bt4 is displayed on the display unit 202 as a priority condition selection screen. For example, the above-mentioned “weight”, “part arrangement”, “part division number”, “nozzle arrangement”, “head type”, “number of nozzles (increase)”, and “number of part cassettes (increase)” Each is displayed as a priority condition type.

  When the operator selects a desired type from among the types of priority conditions, the operator operates the input unit 201 to put a check mark in the check box cb associated with the desired type. , Button bt4 is selected. As a result, the priority processing unit 205 determines the type corresponding to the check box cb in which the check mark is input as the type of priority condition to be determined.

  For example, the operator puts a check mark in the check box cb associated with “weight” and selects the button bt4. In this case, the priority processing unit 205 determines “weight” as the type of priority condition to be determined. As a result, when the priority product is specified by the evaluation unit 204, the priority processing unit 205 determines a weight for the priority product so that the tact of the priority product is shortened.

  As mentioned above, although the mounting condition determination method and the mounting condition determination apparatus according to the present invention have been described using the above-described embodiment and its modifications, the present invention is not limited to these.

  For example, in the above-described embodiment and its modification, the mounting conditions in the production line are determined, but the mounting conditions for only one component mounting machine 100 may be determined.

  In the above embodiment and its modification, the component mounter 100 shown in FIGS. 2 and 3 is used as the component mounter. However, other component mounters other than the component mounter 100 may be used. Good. For example, the component mounting machine may be a so-called alternating mounting component mounting machine in which components are alternately mounted on a single board with a plurality of heads, and the board is moved by an XY table to each mounting position. It may be a rotary mounting machine that positions and mounts components with a rotary head.

  Further, in the above-described embodiment and its modified examples, the mounting conditions are optimized so that the total line tact is minimized or the total line tact is minimized under the priority conditions. Other optimizations other than optimal optimization may be performed. That is, in the present invention, any conventional optimization program can be used.

  In the present embodiment, the type of priority condition such as weight, component arrangement, nozzle arrangement, etc. for the priority type is changed according to the number of optimization iterations N, but the type of priority condition is changed according to other situations. It may be changed. For example, even if priority conditions such as weights are repeatedly determined and optimized, the priority type tact does not fall below the target time, or the reduction rate of the tact is smaller than a predetermined threshold, the type of the priority condition (Weight) may be changed to a type of priority condition such as another component arrangement, and the priority condition of that type may be determined. Furthermore, the determination of priority conditions may be greedy or empirical.

  In this embodiment and its modification, the weight, which is a kind of parameter of the optimization program, is determined as the priority condition, but other parameters may be determined as the priority condition.

  In the present embodiment and its modifications, the component mounting system 1000 includes a production line and a mounting condition determining device 200, respectively. However, the mounting condition determining apparatus 200 may be provided in the production line, or may be provided in any of the component mounting machines 100.

  The mounting condition determination method of the present invention has an effect that the mounting conditions can be optimized for each type of mounting board, and can be applied to, for example, a computer that determines mounting conditions for a component mounting machine.

1 is an external view of a component mounting system in an embodiment of the present invention. It is an external view of a component mounting machine same as the above. It is a top view which shows the main structures of a component mounting machine same as the above. It is a schematic diagram which shows the positional relationship of a head same as the above and a component cassette. It is an external view which shows the external appearance of an electronic component same as the above. It is a figure which shows the example of the component tape and the reel which accommodated the electronic component same as the above. It is a block diagram which shows the function structure of the mounting condition determination apparatus same as the above. It is a figure which shows an example of NC data same as the above. It is a figure which shows an example of a component library same as the above. It is a figure which shows an example of target time data same as the above. It is explanatory drawing for demonstrating the optimization of the mounting conditions same as the above. It is a figure which shows an example of the tact for every board | substrate kind which changes by optimization same as the above. It is explanatory drawing for demonstrating the component arrangement | sequence, nozzle arrangement | sequence, and component division number which are determined as a priority condition same as the above. It is a flowchart which shows operation | movement of the mounting condition determination apparatus same as the above. It is a flowchart which shows an example of detailed operation | movement of a priority processing part same as the above. It is a figure for demonstrating operation | movement of the evaluation part which concerns on the modification 1 same as the above. It is a flowchart which shows operation | movement of the mounting condition determination apparatus which concerns on the modification 1 same as the above. It is a figure for demonstrating the number of the resources determined as a priority condition which concerns on the modification 2 same as the above. It is a figure which shows the priority condition selection screen which concerns on the modification 2 same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Component mounting machine 200 Mounting condition determination apparatus 201 Input part 202 Display part 203 Optimization part 204 Evaluation part 205 Priority processing part 206 Communication part 207 1st storage part 207a NC data 207b Parts library 208 Second storage part 208a Target time data 209 Third storage unit 209a Mounting condition data

Claims (1)

A mounting condition determination method in which a computer determines common mounting conditions for producing a plurality of types of mounting boards for a component mounting machine that produces mounting boards by mounting components on a board,
For each type of mounting board, accept the target time for the production of one mounting board as the target time,
Derived common provisional mounting conditions for producing multiple types of mounting boards ,
When the component mounter mounts a component according to the provisional mounting condition, the tact time required for production of one mounting substrate is specified for each type of mounting substrate,
For each type of mounting board, the specified tact time and the target time accepted for the type are displayed.
For each type of mounting substrate, determine whether the specified tact time is less than or equal to the target time accepted for the type,
Change the provisional mounting conditions so that the tact time determined not to be less than or equal to the target time is shortened ,
By handling the changed provisional mounting condition as a new provisional mounting condition, identification of the tact time, display of the tact time and target time, and determination of whether or not the tact time is equal to or less than the target time, , Repeatedly changing the provisional mounting conditions,
A mounting condition determining method for determining, as the mounting condition, the temporary mounting condition that has been changed recently when it is determined that the tact time is equal to or less than the target time for each of all types of mounting boards .

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