JP5360016B2 - Paste applicator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a paste applying device capable of improving the productivity of a mounting substrate by shortening the time required for a process for applying a paste to a substrate. <P>SOLUTION: A paste applying device comprises: a base portion 31 provided so as to relatively move to a substrate 2; four discharge nozzles 42 provided so as to extend downward from the base portion 31 and discharging a paste Pst; and a discharge nozzle moving mechanism 45 relatively moving the four discharge nozzles 42 in a direction in horizontal surface to the base portion 31. The discharge nozzle moving mechanism 45 is composed of: a pair of moving members 34 approaching and separating from each other on a first feeding screw 32 extending in a first direction in the horizontal surface fixed on the base portion 31; and four nozzle holders 39 which makes two pairs respectively fixed on the moving members 34, and approaching and separating from each other on a second feeding screw 37 extending in a second direction in the horizontal surface orthogonal to the first direction. The discharge nozzles 42 are respectively mounted on the nozzle holders 39. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to a paste for fixing an electronic component to a substrate in a rectangular component mounting region partitioned on the substrate as a region for mounting the electronic component on the substrate in an electronic component mounting step for mounting the electronic component on the substrate. The present invention relates to a paste coating apparatus for coating

  In an electronic component mounting process for mounting an electronic component on a substrate, an adhesive is provided in advance (or after mounting of the electronic component) around a rectangular component mounting portion partitioned on the substrate as a region on which the electronic component is mounted on the substrate. Etc. is applied. The paste is applied on the board by a paste applicator equipped with a discharge nozzle that discharges the paste. The paste is applied to the component mounting part so that a high bonding force between the board and the electronic component can be obtained with a small amount of paste. Are drawn in a predetermined shape (for example, L-shape) at the four corners (see, for example, Patent Document 1).

JP 2008-300538 A

  However, in the above-described conventional paste application apparatus, when applying paste to the four corners of the component mounting portion on the substrate, it is necessary to sequentially move the discharge nozzles to the four corners of the substrate to perform the paste application operation four times in total. As a result, the time required for the coating operation becomes longer and the improvement of the productivity of the mounting substrate is hindered.

  Accordingly, an object of the present invention is to provide a paste coating apparatus capable of reducing the time required for a paste coating process on a substrate and improving the productivity of a mounting board.

In the electronic component mounting process for mounting an electronic component on a substrate, the paste application apparatus according to claim 1 places the electronic component on a rectangular component mounting portion partitioned on the substrate as a region on which the electronic component is mounted on the substrate. A paste application device for applying a paste for fixing to a substrate, wherein a base part is provided so as to be relatively movable with respect to the substrate, and four paste parts are provided extending downward from the base part to discharge the paste. a discharge nozzle, wherein a four ejection nozzle moving mechanism of the discharge nozzle is relatively moved in the horizontal plane direction with respect to the base portion, the discharge nozzle movement mechanism, within the first fixed horizontal plane to the base portion A pair of moving members approaching and separating from each other on a first track extending in the direction of the first and second members fixed to the respective moving members and extending in a second direction in a horizontal plane perpendicular to the first direction. Of and a pair by a total of four nozzle holder adjacent and spaced from each other in orbit, the discharge nozzle to the each nozzle holder is attached one by one.

  In the present invention, the paste can be applied simultaneously to a plurality of component mounting sites on the substrate while relatively moving the respective discharge nozzles. Productivity can be improved.

Then, the plurality of ejection nozzles consists of four discharge nozzles, by positioning four discharge nozzles above the four corners of each respective component mounting site, simultaneously applying a paste to the four corners of the component mounting portion it Ki de, can be further shorten the time required for application of the paste. Still further, the discharge nozzle moving mechanism is fixed to a pair of moving members that are close to and separated from each other on a first track extending in a first direction in a horizontal plane fixed to the base portion, and each moving member, A configuration in which a total of four nozzle holders are arranged close to and away from each other on a second track extending in a second direction within a horizontal plane perpendicular to the direction, and each of the four discharge nozzles is attached to each nozzle holder. and turned to than that, the four discharge nozzles Ri of facilitate the operation of applying a paste in an L-shape at the four corners of the moved component mounting region along the four corners of the component mounting site on the substrate, more The time required for applying the paste can be shortened.

The principal part perspective view of the electronic component mounting apparatus in one embodiment of this invention The partial expanded sectional view of the paste coating device with which the electronic component mounting apparatus in one embodiment of this invention is provided The partial expanded sectional view of the paste coating apparatus in one embodiment of this invention (A) (b) The fragmentary perspective view of the paste coating device in one embodiment of this invention The block diagram which shows the control system of the electronic component mounting apparatus in one embodiment of this invention The flowchart of the main routine which shows the procedure of the electronic component mounting process which the electronic component mounting apparatus in one embodiment of this invention performs (A) (b) The figure which shows the procedure which mounts an electronic component on a board | substrate with the electronic component mounting apparatus in one embodiment of this invention. The figure which shows the four L-shaped paste application | coating area | regions along the four corners of a component mounting part with the paste application | coating apparatus in one embodiment of this invention. The flowchart of the subroutine which shows the procedure of the electronic component mounting process which the electronic component mounting apparatus in one embodiment of this invention performs (A) (b) (c) (d) The figure explaining the procedure which apply | coats a paste to a board | substrate with the paste coating apparatus in one embodiment of this invention. (A) (b) (c) (d) The figure explaining the procedure which apply | coats a paste to a board | substrate with the paste coating apparatus in one embodiment of this invention. The figure which shows the two linear paste application | coating area | regions along two opposing sides of a component mounting part with the paste application | coating apparatus in one embodiment of this invention. (A) (b) (c) The figure explaining the procedure which apply | coats a paste to a board | substrate with the paste application | coating apparatus in one embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, an electronic component mounting apparatus 1 provided with a paste application apparatus according to the present embodiment has a paste made of a resin or the like having electrical insulating properties on each of a plurality of component mounting parts 2a partitioned on a substrate 2 (see FIG. This is an apparatus used in the electronic component mounting process in which the surface mount type electronic component 3 is mounted after the adhesive Pst is applied.

  The electronic component mounting apparatus 1 includes a conveyor 11 that carries a substrate 2 and positions the substrate 2 at a predetermined work position, an electronic component supply unit 12 that supplies the electronic component 3 with the bump 3a facing downward, and a bump 3a of the electronic component 3 Flux supply unit 13 for supplying flux FK attached to each other, on each component mounting part 2a of substrate 2 positioned by conveyor 11 (each component mounting part 2a has a plurality of electrodes 2b) The electronic component 3 supplied from the paste application device 14 and the electronic component supply unit 12 for applying (drawing) the paste Pst in a predetermined shape at a predetermined position is picked up, and the bump 3a of the electronic component 3 is picked up by the flux supply unit 13 Each component mounting part 2a of the board 2 in which the electronic component 3 is positioned by the conveyor 11 is immersed in the supplied flux FK. And a mounting head 15 for mounting. Hereinafter, for convenience of explanation, a direction in a horizontal plane in which the substrate 2 is transported by the transport conveyor 11 is defined as an X-axis direction, and a horizontal plane direction orthogonal to the X-axis direction is defined as a Y-axis direction. Also, the vertical direction is the Z-axis direction.

  The transport conveyor 11 is driven and operated by a transport conveyor drive mechanism 20 including an actuator (not shown), and receives the substrate 2 loaded from the outside of the electronic component mounting apparatus 1 and transports it in the X-axis direction (shown in FIG. 1). In addition, the substrate 2 is sequentially positioned at the first positioning position S1 for paste application work and the second positioning position S2 for electronic component mounting work in accordance with the progress of the work.

  The paste applicator 14 is attached to a moving base 22 that is moved in the horizontal plane (in the XY plane) and in the vertical direction (Z-axis direction) by a paste applicator moving mechanism 21 comprising an orthogonal axis robot (FIG. 1). As shown in FIG. 2, the paste applying device 14 is attached to an elevating plate 30 having a nut portion 30 a that is screwed into a feed screw 23 that extends in the vertical direction on the moving base 22. The elevating plate 30 moves up and down with respect to the moving base 22 as the feed screw 23 rotates about the vertical axis.

  2 and 3, the paste application device 14 has a base portion 31 fixed to the elevating plate 30, and the base portion 31 is fixed to the elevating plate 30 and extends horizontally in the Y-axis direction. The base 31a includes a pair of vertical bases 31b extending downward from both ends in the Y-axis direction. The pair of vertical bases 31b support both ends of a first feed screw 32 that is a first shaft member extending in the Y-axis direction (first direction in a horizontal plane). A pair of first guide rods 33 extending in the Y-axis direction are provided in parallel with the first feed screw 32 at both positions sandwiched from (X-axis direction).

  2 and 3, a pair (two) of moving members 34 are provided between the pair of vertical bases 31b so as to face each other in the Y-axis direction. Each moving member 34 extends in parallel with the vertical base 31b and extends in the XZ plane, and the first moving plates 34a face each other from both ends in the Y-axis direction of the first moving plate 34a. The first moving plate 34a of each moving member 34 includes a first feed screw 32 and a pair of first guide rods extending in the Y-axis direction. 33 penetrates. The screw on the surface of the first feed screw 32 is a reverse screw with the middle part of the pair of vertical bases 31b as a boundary (see FIG. 2), and the first feed screw 32 is attached to one vertical base 31b. When driven by the drive motor 35 and rotated about a rotation axis parallel to the Y axis, the pair of first moving plates 34a (and thus the pair of moving members 34) approach or separate from each other.

  2 and 3, the pair of second moving plates 34b included in each moving member 34 is a second shaft member extending in the X-axis direction (second direction in a horizontal plane perpendicular to the first direction). Both ends of the two feed screw 37 are supported, and a second guide rod 38 extending in the X-axis direction is provided below the second feed screw 37 in parallel with the second feed screw 37.

  2 and 3, a pair of (two) nozzle holders 39 are provided opposite to each other in the X-axis direction between a pair of second moving plates 34b included in each moving member 34. The screw on the surface of the second feed screw 37 is a reverse screw with the middle portion of the pair of second moving plates 34b as a boundary, and the second drive screw 37 is attached to one second moving plate 34b. When rotating around a rotation axis parallel to the X axis via a belt-type transmission mechanism 41 driven by the motor 40 and operating, the pair of nozzle holders 39 facing in the X axis direction approach or separate from each other.

  2, 3, and 4 (a) and 4 (b), the nozzle holding portion 39 a below each nozzle holder 39 is provided with a discharge nozzle 42 that protrudes downward. Each discharge nozzle 42 is connected to a paste reservoir 44 disposed on the upper surface of the horizontal base 31a via a paste pipe 43.

  As described above, when the first drive motor 35 is driven, the first feed screw 32 rotates around the rotation axis parallel to the Y axis, and the pair of moving members screwed to the reverse screw on the first feed screw 32. 34 approaches or separates. When each second drive motor 40 is driven, the second feed screw 37 connected to the second drive motor 40 rotates around a rotation axis parallel to the X axis, and the second feed screw 37 is reversed. A pair of nozzle holders 39 screwed into the screws approach or separate from each other. For this reason, in the paste application device 14 included in the electronic component mounting device 1, the four discharge nozzles 42 are moved to the base portion 31 by controlling the operation of one first drive motor 35 and two second drive motors 40. Can be moved relative to each other in the horizontal plane direction.

  4A shows a state in which the pair of moving members 34 opposed on the first feed screw 32 are closest to each other and the pair of nozzle holders 39 facing each other on each second feed screw 37 are closest to each other. In FIG. 4B, the pair of moving members 34 that face each other on the first feed screw 32 are the most spaced apart, and the pair of nozzle holders 39 that face each other on each second feed screw 37 are the most spaced apart. Shows the state.

  Thus, a mechanism for moving the four discharge nozzles 42 relative to the base portion 31 in the horizontal plane direction, that is, the first drive motor 35, the first feed screw 32, the pair of first guide rods 33, and the pair of moving members 34. A mechanism comprising two second drive motors 40, two second feed screws 37, two second guide rods 38, and a total of four nozzle holders 39 has four discharge nozzles 42 in a horizontal plane with respect to the base portion 31. It is a discharge nozzle moving mechanism 45 that relatively moves in the direction (see also FIG. 1). And the paste application device 14 with which the electronic component mounting apparatus 1 is provided is provided with the base part 31 provided so that relative movement was possible with respect to the board | substrate 2 positioned by the conveyance conveyor 11, and extended below from the base part 31. There are provided four (a plurality) of discharge nozzles 42 that discharge the paste Pst, and a discharge nozzle moving mechanism 45 that moves these four discharge nozzles 42 relative to the base portion 31 in the horizontal plane direction. The base 31, the four discharge nozzles 42, and the discharge nozzle moving mechanism 45 are entirely covered by a cover member 46 attached to the base 31 (FIGS. 1, 2, and 3). reference).

  A paste discharge mechanism 47 (FIG. 1) is provided outside the paste application device 14. By operation of the paste discharge mechanism 47, each of the four discharge nozzles 42 connects the paste storage unit 44 connected by the paste pipe 43. Paste Pst is discharged. The paste discharge mechanism 47 includes a plurality of compressed air supply units connected to each paste storage unit 44, and each compressed air supply unit supplies compressed air into the corresponding paste storage unit 44 to paste the paste storage unit 44. The inner paste Pst is discharged from the discharge nozzle 42.

  In FIG. 1, the mounting head 15 includes a suction nozzle 15 a extending downward, and is movable up and down, and is moved in a horizontal plane by a head moving mechanism 51 including an orthogonal axis robot. The suction nozzle 15 a is moved up and down by a suction nozzle lifting mechanism 52 built in the mounting head 15. Further, the suction by the suction nozzle 15a and the releasing operation thereof are performed by supplying and stopping the vacuum pressure to the suction nozzle 15a by the vacuum pressure supply mechanism 53 including an actuator (not shown).

  The transport and positioning operations of the substrate 2 by the transport conveyor 11 are performed by the control device 60 (FIG. 5) provided in the electronic component mounting apparatus 1 performing operation control of the transport conveyor drive mechanism 20 (FIG. 5). .

  The movement operation of the paste applying device 14 in the horizontal plane direction and the vertical direction is performed by the control device 60 performing operation control of the paste applying device moving mechanism 21 (FIG. 5). Further, the relative movement operation of the four discharge nozzles 42 constituting the paste applying device 14 in the horizontal plane is performed by the control device 60 controlling the operation of the discharge nozzle moving mechanism 45 (FIG. 5). Further, the discharge operation of the paste Pst from each discharge nozzle 42 is performed when the control device 60 controls the operation of the paste discharge mechanism 47 described above (FIG. 5).

  The movement operation of the mounting head 15 in the horizontal plane direction is performed when the control device 60 controls the operation of the head moving mechanism 51 described above (FIG. 5). Moreover, the raising / lowering operation | movement of the suction nozzle 15a is made when the control apparatus 60 performs operation control of the above-mentioned suction nozzle raising / lowering mechanism 52 (FIG. 5). Further, the suction by the suction nozzle 15a and the releasing operation thereof are performed by the control device 60 controlling the operation of the vacuum pressure supply mechanism 53 (FIG. 5).

  Next, the procedure of the electronic component mounting process executed by the electronic component mounting apparatus 1 will be described with reference to FIGS. In the electronic component mounting process, the control device 60 first controls the operation of the transport conveyor drive mechanism 20 to operate the transport conveyor 11, carries the substrate 2 supplied from the outside into the electronic component mounting device 1, and pastes Positioning is performed at the first positioning position S1 for application work (the carrying-in and the first positioning step of step ST1 shown in FIG. 6).

  After positioning the substrate 2 at the first positioning position S1, the control device 60 applies the paste Pst on each component mounting portion 2a of the substrate 2 to form the paste ejection body W on the substrate 2 (FIG. 6). Step ST2 shown in FIG.

  At this time, as shown in FIG. 7A, the paste Pst (paste ejector W) is formed between the substrate 2 and the electronic component 3 in a state where the electronic component 3 is mounted on the substrate 2 (FIG. 7B). It is formed on the substrate 2 so as to have a height h higher than the distance H therebetween.

  Here, in the paste application process of step ST2, as shown in FIG. 8, the apexes P at the four corners of the rectangular component mounting part 2a are used as representative points, and each side of the component mounting part 2a of the component mounting part 2a from each representative point. A case where the paste Pst is applied to the four L-shaped paste application regions Sd1 formed with extending portions extending in the axial direction and the Y-axis direction (forms the paste discharge body W) will be described.

  As shown in FIG. 8, the end of the extending portion extending in the Y-axis direction from the vertex P, which is a representative point in each L-shaped paste application region Sd1, is a point Q1, and each L-shaped paste application region Sd1. When the end portion of the extending portion extending in the X-axis direction from the apex P is defined as a point Q2, the control device 60 first controls the operation of the paste applicator moving mechanism 21 so that the paste applicator 14 moves the paste Pst. It is moved immediately above the component mounting site 2a to be applied (paste application device moving step in step ST11 shown in FIG. 9). Then, the operation of the discharge nozzle moving mechanism 45 is controlled, and the four discharge nozzles 42 are positioned immediately above the point Q1 on the four L-shaped paste application regions Sd1, thereby making the four discharge nozzles 42 a component mounting site. They are arranged in the vicinity of the four representative points (vertices P) set at the four corners 2a (FIG. 10A. Discharge nozzle arrangement step of step ST12 shown in FIG. 9).

  When the control device 60 disposes the four discharge nozzles 42 at positions near the four representative points (vertices P) set at the four corners of the component mounting part 2a, the control device 60 discharges the paste Pst from the four discharge nozzles 42 while The moving members 34 are separated from each other along the first feed screw 32 (that is, on a first track extending in a first direction (Y-axis direction) in a horizontal plane fixed to the base portion 31) (see FIG. 10 (b), each discharge nozzle 42 is moved to four representative points (vertex P) (FIG. 10 (b), discharge nozzle moving step of step ST13 shown in FIG. 9).

  The control device 60 is arranged on the same second feed screw 37 while continuously discharging the paste Pst from the four discharge nozzles 42 after moving each discharge nozzle 42 to the four representative points (vertex P). By bringing the nozzle holders 39 close to each other (arrow C shown in FIG. 10C), along the second feed screw 37 (that is, fixed to each moving member 34 and within a horizontal plane perpendicular to the Y-axis direction) On the second orbit extending in the second direction (X-axis direction), each discharge nozzle 42 is moved to four points Q2, and the discharge of the paste Pst by each discharge nozzle 42 is stopped (FIG. 10C). (Discharge nozzle moving step of step ST14 shown in FIG. 9). As a result, the paste discharger W is placed on the L-shaped paste application region Sd1 having the extended portions along the four sides of the component mounting part 2a through the representative points (vertices P) set at the four corners of the component mounting part 2a. In this state (FIG. 10D), the paste Pst is applied to the four corners of the component mounting portion 2a.

  After step ST14 ends, control device 60 determines whether there is another component mounting part 2a to which paste Pst is to be applied (determination step of step ST15 shown in FIG. 9). As a result, when there is no other component mounting portion 2a to which the paste Pst is to be applied, the control device 60 exits this subroutine and returns to the main routine, and there is another component mounting portion 2a to which the paste Pst is to be applied. When this occurs, the paste applying device 14 is moved immediately above the component mounting portion 2a to be applied with the paste Pst (paste applying device moving step in step ST16 shown in FIG. 9). Then, by positioning the four discharge nozzles 42 at the points Q2 on the four L-shaped paste application regions Sd1, four representative points (vertices P) where the four discharge nozzles 42 are set at the four corners of the component mounting portion 2a. (FIG. 11A. Discharge nozzle arrangement step of step ST17 shown in FIG. 9).

  When the control device 60 disposes the four discharge nozzles 42 in the vicinity of the four representative points (vertices P) set at the four corners of the component mounting portion 2a, By separating the nozzle holders 39 arranged on the second feed screw 37 (arrow D shown in FIG. 11B), the nozzle holder 39 is fixed along the second feed screw 37 (that is, fixed to each moving member 34). , Each discharge nozzle 42 is moved to four representative points (vertex P) (on a second trajectory extending in a second direction (X-axis direction) in a horizontal plane perpendicular to the Y-axis direction) (FIG. 11B). (Discharge nozzle moving step in step ST18 shown in FIG. 9).

  The control device 60 moves the pair of moving members 34 to the first feed screw 32 while continuously discharging the paste Pst from the four discharge nozzles 42 after moving each discharge nozzle 42 to the four representative points (vertex P). (That is, on a first trajectory extending in a first direction (Y-axis direction) in a horizontal plane fixed to the base portion 31) along each other (arrows shown in FIG. 11C) E) Each discharge nozzle 42 is moved to four points Q1, and the discharge of the paste Pst by each discharge nozzle 42 is stopped (FIG. 11 (c). Discharge nozzle moving step of step ST19 shown in FIG. 9). As a result, the paste discharger W is placed on the L-shaped paste application region Sd1 having the extended portions along the four sides of the component mounting part 2a through the representative points (vertices P) set at the four corners of the component mounting part 2a. Thus, the paste Pst is applied to the four corners of the component mounting portion 2a (see FIG. 11D).

  After step ST19 ends, control device 60 determines whether there is another component mounting part 2a to which paste Pst is to be applied (determination step of step ST20 shown in FIG. 9). As a result, when there is no other component mounting portion 2a to which the paste Pst is to be applied, the control device 60 exits this subroutine and returns to the main routine, and there is another component mounting portion 2a to which the paste Pst is to be applied. If this happens, the process returns to step ST11, and the pace applicator 14 is moved immediately above the component mounting site 2a to be applied with the paste Pst.

  In the above example, the paste Pst is applied in an L shape to each of the four corners of the component mounting part 2a. However, as shown in FIG. 12, the X axis is opposed to the Y axis direction of the component mounting part 2a. The paste Pst is applied to each of the two linear paste application regions Sd2 including two vertices (P1 and P2) opposed in the X-axis direction among the four vertices P of the component mounting part 2a along the two sides extending in the direction. The case of applying (forming the paste discharge body W) will also be described.

  In this case, the control device 60 moves the paste application device 14 to a position immediately above the component mounting portion 2a to be applied with the paste Pst, and then, among the four discharge nozzles 42, a pair (in the Y-axis direction) The two discharge nozzles 42 are positioned immediately above the point P1 on the two linear paste application regions Sd2 (FIG. 13A). Then, while discharging the paste Pst from the two discharge nozzles 42, the nozzle holders 39 arranged on the same second feed screw 37 are separated (or approached), and the pair of discharge nozzles 42 are moved to the point P2. (FIG. 13 (b), arrow F shown in the figure). When the pair of discharge nozzles 42 reaches the point P2, the discharge of the paste Pst by each discharge nozzle 42 is stopped. As a result, the paste Pst is applied (the paste discharge body W is formed) to each of the two linear paste application regions Sd2 along two sides facing the Y-axis direction of the component mounting part 2a (FIG. 5). 13 (c)). Then, the control device 60 determines whether or not there is another component mounting part 2a to which the paste Pst is to be applied, and when there is another component mounting part 2a to which the paste Pst is to be applied, the above process is performed. repeat.

  At this time, it is preferable to apply the paste Pst by using two discharge nozzles 42 different from the two discharge nozzles 42 used last time (that is, not used last time). As described above, since the four discharge nozzles 42 are connected to the independent paste storage portions 44, if the four discharge nozzles 42 are used alternately two by two to apply the paste Pst, The paste Pst stored in each paste storage unit 44 can be reduced evenly.

  Further, as described above, when applying the paste Pst to each of the two linear paste application regions Sd2 along the two sides facing the Y-axis direction of the component mounting part 2a, Of these, a pair (two) of discharge nozzles 42 facing in the Y-axis direction are positioned immediately above the point P1 on the two linear paste application regions Sd2, and then the paste Pst is discharged from the two discharge nozzles 42. However, the entire paste spouting device 14 may be moved in the X-axis direction.

  When the paste application process of step ST2 is completed, the control device 60 controls the operation of the transport conveyor drive mechanism 20 to operate the transport conveyor 11, and positions the substrate 2 at the second positioning position S2 for electronic component mounting work. (Transfer and second positioning step in step ST3 shown in FIG. 6). And the control apparatus 60 performs the electronic component mounting process (electronic component mounting process of step ST4 shown in FIG. 6) which mounts the electronic component 3 in each component mounting site | part 2a on the board | substrate 2. FIG.

  In the electronic component mounting process of step ST4, the control device 60 first controls the operation of the head moving mechanism 51 to move the mounting head 15, and the suction nozzle 15a of the electronic component 3 supplied by the electronic component supply unit 12 is controlled. After moving upward, the operation of the suction nozzle lifting mechanism 52 is controlled to lower the suction nozzle 15 a relative to the mounting head 15, and the lower end of the suction nozzle 15 a is brought into contact with the upper surface of the electronic component 3. Then, the operation of the vacuum pressure supply mechanism 53 is controlled to supply the vacuum pressure into the suction nozzle 15a, and the electronic component 3 is sucked (pickup) by the suction nozzle 15a.

  When the electronic component 3 is sucked by the suction nozzle 15a, the control device 60 controls the operation of the head moving mechanism 51 to move the mounting head 15, and the bump 3a of the electronic component 3 sucked by the suction nozzle 15a is transferred to the flux supply unit 13. The mounting head 15 is lowered so as to be immersed in the flux FK supplied by the above. When the bump 3a of the electronic component 3 is immersed in the flux FK, the control device 60 raises the mounting head 15, and the electronic component 3 adsorbed by the adsorption nozzle 15a is positioned at the second positioning position S2. So that it is positioned directly above the component mounting part 2a. The control device 60 lowers the suction nozzle 15a with respect to the mounting head 15, and supplies the vacuum pressure into the suction nozzle 15a while bringing the electronic component 3 at the lower end of the suction nozzle 15a into contact with the upper surface of the component mounting portion 2a. The electronic component 3 is mounted on the component mounting portion 2a so that the bumps 3a on the lower surface of the electronic component 3 are brought into contact with the respective electrodes 2b on the substrate 2. At this time, the control device 60 causes the paste discharger W formed on the component mounting portion 2a to be pressed against the substrate 2 by the peripheral portion of the electronic component 3 (FIG. 7B).

  After executing the electronic component mounting process on the component mounting portion 2a on the substrate 2 positioned at the second positioning position S2, the control device 60 controls the transport conveyor drive mechanism 20 to operate the transport conveyor 11. Then, the substrate 2 is unloaded from the electronic component mounting apparatus 1 (unloading step of step ST5 shown in FIG. 6).

  When the carrying-out process in step ST5 is completed, the control device 60 determines whether there is another board 2 on which the electronic component 3 is mounted (determination process in step ST6 shown in FIG. 6). As a result, if there is another board 2 on which the electronic component 3 is mounted, the process returns to step ST1 to carry in a new board 2, and there is no other board 2 on which the electronic component 3 is mounted. Ends a series of electronic component mounting processes.

  As described above, the paste application device 14 provided in the electronic component mounting apparatus 1 according to the present embodiment mounts the electronic component 3 on the substrate 2 in the electronic component mounting step of mounting the electronic component 3 on the substrate 2. A base part provided for applying a paste Pst for fixing the electronic component 3 to the substrate 2 on a rectangular component mounting portion 2a partitioned on the substrate 2 as a region, and provided relative to the substrate 2 31, a plurality of discharge nozzles 42 that extend downward from the base portion 31 and discharge the paste Pst, and a discharge nozzle moving mechanism that moves the plurality of discharge nozzles 42 relative to the base portion 31 in the horizontal plane direction. 45 is provided.

  For this reason, in the electronic component mounting apparatus 1 according to the present embodiment, the paste Pst can be simultaneously applied to a plurality of component mounting portions 2a on the substrate 2 while relatively moving the discharge nozzles 42. The required time can be shortened and the productivity of the mounting board can be improved.

  Here, in the electronic component mounting apparatus 1 according to the present embodiment, the plurality of discharge nozzles 42 are composed of four discharge nozzles 42. Therefore, these four discharge nozzles 42 are respectively placed above the four corners of the component mounting portion 2a. By positioning, the paste Pst can be simultaneously applied to the four corners of the component mounting part 2a.

  Furthermore, in the electronic component mounting apparatus 1 according to the present embodiment, the discharge nozzle moving mechanism 45 is on the first track (first axis) extending in the first direction (Y-axis direction) in the horizontal plane fixed to the base portion 31. A pair of moving members 34 that are close to and away from each other on the feed screw 32) and a second member that is fixed to each moving member 34 and extends in a second direction (X-axis direction) in a horizontal plane perpendicular to the first direction. A total of four nozzle holders 39 that are close to and away from each other on the track (on the second feed screw 37), and each discharge nozzle is attached to each nozzle holder. It is easy to perform an operation of moving the nozzle 42 along the four corners of the component mounting part 2a on the substrate 2 to apply the paste Pst to the four corners of the component mounting part 2a in an “L” shape.

  Although the embodiments of the present invention have been described so far, the present invention is not limited to those shown in the above-described embodiments. For example, the configuration of the discharge nozzle moving mechanism 45 that moves the plurality of discharge nozzles 42 shown in the above embodiment is an example, and the mechanism that moves the plurality of discharge nozzles 42 relative to the base portion 31 in the horizontal plane direction. If so, the configuration is not limited.

  For example, the discharge nozzle moving mechanism 45 is fixed to a pair of moving members 34 and each moving member 34 that are close to and away from each other on a first track extending in a first direction within a horizontal plane fixed to the base portion 31. What is necessary is just to have the structure provided with a total of four nozzle holders 39 each in the vicinity of and away from each other on the second track extending in the second direction in the horizontal plane orthogonal to the first direction. In the above-described embodiment, the feed screw (first feed screw) is respectively supplied to the mechanism for moving the pair of moving members 34 close to and away from each other in the Y-axis direction and the mechanism for moving the pair of four nozzle holders 39 close to and away from each other in the X-axis direction. 32 and the second feed screw 37) are used so that the feed screw itself becomes the trajectory (first trajectory and second trajectory) of the moving member 34 and the nozzle holder 39. However, these mechanisms are not necessarily limited to the feed screw. The moving member 34 and the nozzle holder 39 are moved on a virtually set track (first track and second track) by using a link mechanism, a cam mechanism, or the like. It is good also as composition to do.

  Provided is a paste coating apparatus capable of improving the productivity of a mounting substrate by shortening the time required for a paste coating process on a substrate.

2 Substrate 2a Component mounting site 3 Electronic component 14 Paste coating device 31 Base portion 32 First feed screw (first track)
34 Moving member 37 Second feed screw (second track)
39 Nozzle holder 42 Discharge nozzle 45 Discharge nozzle moving mechanism Pst Paste

Claims (1)

In an electronic component mounting process for mounting an electronic component on a substrate, a paste for applying a paste for fixing the electronic component to the substrate on a rectangular component mounting portion partitioned on the substrate as an area where the electronic component on the substrate is mounted A coating device,
A base portion provided to be movable relative to the substrate;
Four discharge nozzles for discharging the paste provided extending downwardly from said base portion,
Wherein a discharge nozzle moving mechanism for relatively moving the horizontal plane direction four discharge nozzles relative to the base portion,
The discharge nozzle moving mechanism is fixed to a pair of moving members that are close to and separated from each other on a first track extending in a first direction within a horizontal plane fixed to the base portion, and the first moving member is fixed to the first moving member. A total of four nozzle holders that are close to and away from each other on a second track extending in a second direction in a horizontal plane perpendicular to the direction, and that each discharge nozzle is attached to each nozzle holder. A paste applicator characterized.

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