KR102476630B1 - Pattern forming apparatus, pattern forming method, and discharge data generating method - Google Patents

Abstract

(Problem) To provide a technique for forming a resist film having an appropriate thickness on a wiring board.
(Solution Means) A pattern forming apparatus includes a holding portion for holding a wiring board, a head portion for discharging ink droplets of a solder resist toward the surface of the wiring board by an inkjet method, and a direction parallel to the surface of the wiring board. A movement mechanism for relatively moving the head portion with respect to the holding portion, and ejection data generation for generating ejection data 75 representing an ejection amount of ink per unit area based on resist pattern data 71 expressing a pattern of a resist film A part 61 is provided. Further, the pattern forming apparatus includes a control unit that forms a pattern of the resist film on the wiring substrate by controlling the head unit and the moving mechanism based on the discharge data 75 . The ejection data generating section 61 generates the ejection data 75 with different ejection amounts set for each different type of pattern included in the resist pattern data.

Description

Pattern forming device, pattern forming method, and discharge data generating method

The present invention relates to a technique for forming a pattern of a resist film on a wiring board.

A resist film may be formed on a wiring board for the purpose of protecting the conductive pattern of the wiring board. The resist film also has a role of preventing solder from adhering to regions such as conductor wiring during solder application in a later step, and is also called "solder resist". As one method of forming a resist film, a method of discharging droplets of ink of a solder resist toward a wiring board by an inkjet method is known. Such techniques are disclosed in Patent Literatures 1 and 2, for example.

Japanese Unexamined Patent Publication No. 9-283893 Japanese Unexamined Patent Publication No. 2008-4820

By the way, the pattern of the resist film formed on the wiring board varies depending on the purpose or site. When a certain amount of ink per unit area is applied to the wiring board, the thickness (film thickness) of the resist film may not be the target film thickness depending on the type of pattern. For example, in the case of a thin line pattern, the height tends to decrease as the line width becomes thinner. Further, in the pattern of intersecting lines in which lines intersect, the film thickness tends to increase as the resist film swells. For this reason, a technique for forming a resist film having an appropriate film thickness has been required.

An object of the present invention is to provide a technique for forming a resist film having an appropriate thickness on a wiring board.

In order to solve the above problem, a first aspect is a pattern forming apparatus for forming a pattern of a resist film on a wiring board. The pattern forming apparatus includes a holding part for holding a wiring board, a head part for discharging ink droplets of a solder resist toward the surface of the wiring board by an inkjet method, and a holding part in a direction parallel to the surface of the wiring board. a moving mechanism for relatively moving the head portion with respect to the head unit; a discharge data generation unit for generating discharge data representing an amount of ink discharged per unit area based on resist pattern data representing a pattern of a resist film; and a control unit that forms a pattern of a resist film on the wiring board by controlling the head unit and the moving mechanism. The ejection data generator generates the ejection data with different ejection amounts set for each different type of pattern included in the resist pattern data.

A 2nd aspect is the pattern forming apparatus of a 1st aspect. The pattern of the resist film includes a first line pattern having a first line width and a line second pattern having a second line width smaller than the first line width. The discharge data generation unit generates discharge data in which the discharge amount for the second pattern is set to a greater value than the discharge amount for the first pattern.

A 3rd aspect is the pattern forming apparatus of a 1st aspect or a 2nd aspect. The pattern of the resist film includes a third pattern of crossed images. The ejection data generation unit generates ejection data in which the ejection amount for the third pattern is set to a value smaller than a predetermined reference ejection amount.

A 4th aspect is the pattern forming apparatus of a 2nd aspect. The pattern of the resist film includes a third pattern of crossed images. The discharge data generation unit generates discharge data in which the discharge amount for the third pattern is set to a smaller value than the discharge amounts for the first pattern and the second pattern.

A 5th aspect is the pattern forming apparatus in any one of the 1st aspect - 4th aspect. The pattern forming apparatus further includes a storage unit for storing correction table information defining discharge amounts per unit area for a plurality of types of patterns. The discharge data generating unit includes a pattern specifying unit for specifying a pattern registered in the correction table information in the resist pattern data, and a discharge amount for the pattern specified by the pattern specifying unit based on the correction table information. Includes a discharge amount setting unit to set.

A sixth aspect is a pattern formation method for forming a pattern of a resist film on a wiring board. The pattern formation method includes a) a step of discharging ink droplets of a solder resist from a head portion toward the surface of the wiring board by an inkjet method, and b) in the step a), in a direction parallel to the surface of the wiring board a step of relatively moving the head with respect to the wiring board, and c) a step of varying the discharge amount of ink per unit area according to the type of pattern of the resist film formed on the wiring board in step a). includes

The 7th aspect is the ejection data generation method which generates ejection data used when ejecting the ink droplet of a soldering resist from a head part toward a wiring board by an inkjet system. The discharge data generation method includes the steps of A) preparing resist pattern data to be formed on a wiring board, and B) generating discharge data in which different discharge amounts per unit area are set for different types of patterns included in the resist pattern data. do.

According to the pattern forming apparatuses of the first to fifth aspects, the discharge amount of ink per unit area increases or decreases depending on the type of pattern. In this way, a resist film having an appropriate thickness can be formed on the wiring board for each type of pattern.

According to the pattern forming apparatus of the second aspect, a resist film having an appropriate thickness for the second pattern can be formed on the wiring board by increasing the ejection amount per unit area for the second pattern with a small line width.

According to the pattern forming apparatus of the third aspect, by making the ejection amount per unit area for the third pattern of intersecting patterns, which tends to increase in film thickness, smaller than the standard ejection amount, a resist film having an appropriate thickness for the intersecting pattern can be formed on the wiring board. have.

According to the pattern forming apparatus of the fourth aspect, the discharge amount per unit area for the third pattern of the cross pattern, which tends to increase in film thickness, is smaller than that of the first and second patterns of the linear pattern, thereby forming a resist film of a cross pattern having an appropriate film on the wiring board. can be formed in

According to the pattern forming apparatus of the fifth aspect, the discharge amount per unit area for a plurality of types of patterns is defined by the correction table information, so that the discharge amount of each pattern included in the resist pattern data can be appropriately set.

1 is a perspective view showing a pattern forming apparatus of an embodiment.
Fig. 2 is a diagram showing the configuration of a computer included in a control unit.
Fig. 3 is a diagram showing a functional configuration realized by a computer.
4 : is a figure which shows the flow of the operation of the pattern forming apparatus 1. As shown in FIG.
5 is a plan view schematically showing a part of a wiring board on which resist films of a plurality of types of patterns are formed.
6 is a cross-sectional view schematically showing a part of a wiring board on which resist films of a plurality of types of patterns are formed.
7 is a diagram showing an example of correction table information.
8 is a cross-sectional view schematically showing a wiring board on which resist films of a plurality of types of patterns are formed.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring an accompanying drawing. In addition, the constituent elements described in this embodiment are examples only, and are not intended to limit the scope of the present invention only to them. In the drawings, in order to facilitate understanding, the dimensions and numbers of each part may be exaggerated or simplified as needed.

In FIG. 1, for convenience of explanation, arrows indicating mutually orthogonal X, Y, and Z axes are added. Here, the Z axis is parallel to the vertical direction, and the X and Y axes are parallel to the horizontal direction. In the following description, the direction in which the tips of the arrows face is referred to as the + (plus) direction, and the opposite direction is referred to as the - (minus) direction.

<1. embodiment>

1 is a perspective view showing a pattern forming apparatus 1 of an embodiment. The pattern forming apparatus 1 forms a resist film pattern on the surface 9a of a printed wiring board (hereinafter simply referred to as "wiring board") 9 with solder resist ink. The pattern forming apparatus 1 forms a pattern by an inkjet method. The wiring board 9 is a plate-shaped member made of, for example, glass epoxy resin. However, the wiring board 9 may have other shapes, such as a sheet-shaped member having flexibility. The resist film protects the conductive pattern on the wiring board 9 . Conductive patterns include wires, lands, and other patterns. A resist film is not formed in a region to which solder paste is applied in a later step or in other regions where a resist film is not to be formed.

The pattern forming apparatus 1 includes an apparatus main body 11 and a control unit 12 . The device main body 11 includes a moving mechanism 2 , a head part 3 , and a tank 4 . The moving mechanism 2 includes a Y-direction moving mechanism 2a and an X-direction moving mechanism 2b. The Y-direction moving mechanism 2a moves the wiring board 9 in the Y-direction parallel to the surface 9a of the wiring board 9 . The X-direction moving mechanism 2b moves the head 3 in the X-direction perpendicular to the Y-direction and parallel to the surface 9a of the wiring board 9 . Various mechanisms can be used as the Y-direction moving mechanism 2a and the X-direction moving mechanism 2b. For example, a ball screw mechanism equipped with a motor may be employed, or a linear motor may be employed.

The head part 3 discharges minute droplets of solder resist ink (hereinafter simply referred to as "ink") toward the wiring board 9 in the middle of movement. The tank 4 stores ink supplied to the head portion 3 . The control unit 12 controls the moving mechanism 2 and the head unit 3 . Ink is supplied to the head portion 3 from the tank 4 through the tube 41 .

The Y-direction moving mechanism 2a has a stage 21 holding a wiring board 9 . The stage 21 is an example of a holding part. The wiring board 9 is held on the upper surface of the stage 21 . A large number of holes are formed on the surface of the stage 21, and the holes are connected to an unillustrated suction device. By sucking air through the holes, the wiring board 9 is attracted to the upper surface of the stage 21 . Further, the surface of the stage 21 may have a groove extending horizontally from the hole, and the area to which the wiring board 9 is adsorbed may be widened by the groove. Alternatively, the surface of the stage 21 may be made of a porous member, and the wiring board 9 may be adsorbed through the porous member. Further, the stage 21 may include a mechanical mechanism for holding the wiring board 9 .

In the pattern forming apparatus 1, as long as the head part 3 moves relatively with respect to the stage 21, various structures can be employ|adopted as the moving mechanism 2. For example, the stage 21 may be fixed and the head 3 may move in the X direction and the Y direction. The head part 3 may move in the Y direction, and the stage 21 may move in the X direction.

In the head portion 3, a discharge unit having a plurality of discharge ports arranged at equal intervals with respect to the X direction is formed. Droplets of ink are ejected from each ejection port in an inkjet manner. Ink is ejected in the (-Z) direction toward the surface 9a of the wiring board 9 . In the inkjet method, various structures can be used, and a structure using a piezo or a structure using a heater can be used.

The stage 21 is moved in the Y-direction parallel to the wiring board 9 by the Y-direction moving mechanism 2a while ejecting ink droplets from a plurality of ejection ports, so that ink is applied to a region extending in the Y-direction. Hereinafter, the movement of the wiring board 9 in the Y direction is also referred to as "main scan". Actually, in one main scan of the wiring board 9, a plurality of lines of ink corresponding to a plurality of discharge ports are formed on the wiring board 9. When one main scan is completed, the head part 3 is slightly moved in the X direction parallel to the wiring board 9 by the X-direction moving mechanism 2b, and the wiring board 9 is moved by the Y-direction moving mechanism 2a. moves in the (-Y) direction by In this way, the second main scan is performed, and ink lines are formed adjacent to each ink line formed in the previous main scan.

By repeating the main scan a predetermined number of times, a resist film is formed in a region having a width substantially equal to the arrangement width of the plurality of heads in the X direction. Since the resist film is formed only in necessary regions, a pattern of the resist film is precisely formed. Hereinafter, a width substantially equal to the arrangement width of a plurality of heads in the X direction is referred to as a "unit width", and a region in which a resist film is formed within this width is referred to as a "unit region". When the resist film is formed in one unit area, the head portion 3 is moved by the unit width in the X direction by the X-direction moving mechanism 2b, and the unit adjacent to the previous unit area is repeated by repeating the above-described main scan. A resist film is formed in the region. By repeating the formation of the resist film in the unit area and the movement of the head portion 3 in the X direction, a resist film pattern is formed over the entire required area on the wiring board 9 . In addition, a plurality of times of scanning may be performed on the same unit area. This makes it possible to increase the amount of ink applied to the unit area.

2 is a diagram showing the configuration of the computer 5 included in the control unit 12. As shown in FIG. The computer 5 includes a CPU 51 for performing various arithmetic processes, a ROM 52 for storing basic programs, and a RAM 53 for storing various types of information. In addition, the computer 5 includes a fixed disk 54 for storing information, a display 55 for displaying various types of information such as images, an input unit 56 for receiving input from an operator, and a computer A reading device (57) for reading information from a readable recording medium (8) and a communication unit (58) for transmitting and receiving signals between the main body (11) of the device are provided. The input unit 56 includes a keyboard 56a and a mouse 56b. The recording medium 8 is, for example, an optical disk, a magnetic disk, a magneto-optical disk, or a memory card.

In the computer 5, the program 80 is previously read from the recording medium 8 through the reading device 57 and stored in the fixed disk 54. The program 80 may be stored in the fixed disk 54 via a network. The CPU 51 executes arithmetic processing while using the RAM 53 or the fixed disk 54 according to the program 80. CPU 51 functions as an arithmetic unit in computer 5 . In addition, the computer 5 may include other processors (such as GPUs) that function as arithmetic units other than the CPU 51 .

3 is a diagram showing a functional configuration realized by the computer 5. As shown in FIG. The computer 5 functions as a discharge data generating unit 61 and a storage unit 62 . The storage unit 62 corresponds to the RAM 53 or the fixed disk 54. The discharge data generating unit 61 includes a pattern specifying unit 611 and a discharge amount setting unit 612 . Also, the ejection data generation unit 61 may be realized by a plurality of computers. In addition, all or part of the functions of the ejection data generation unit 61 may be implemented in terms of hardware by dedicated electric circuits.

The storage unit 62 stores resist pattern data 71 , correction table information 73 and ejection data 75 . The resist pattern data 71 and the correction table information 73 are supplied to the computer 5 via, for example, the reading device 57 or the communication unit 58, or may be generated using the computer 5. do. Functions of the pattern specifying unit 611 and the discharge amount setting unit 612 will be described in detail in the description of the operation of the pattern forming apparatus 1.

4 : is a figure which shows the flow of the operation of the pattern forming apparatus 1. As shown in FIG. 4 , steps S12 to S14 are arithmetic processing by the control unit 12, and step S15 is an operation of the device main body 11 under control of the control unit 12.

First, resist pattern data 71 and correction table information 73 are prepared and stored in storage unit 62 (step S11). The resist pattern data 71 is information indicating a pattern of a resist film to be formed on the surface 9a of the wiring board 9 . At the stage where the resist pattern data 71 is stored in the storage unit 62, it may be vector data, but is appropriately converted to raster data. The correction table information 73 is information used to set the amount of ink per unit area (hereinafter simply referred to as “ejection amount”) that the head unit 3 ejects in accordance with the type of pattern defined in advance. In the present embodiment, "pattern" refers not to the entire resist film formed on the wiring board 9, but to the shape of a part of the resist film of the entire resist film.

5 is a plan view schematically showing a part of the wiring board 9 on which resist films 911, 913, and 93 of a plurality of types of patterns are formed. Fig. 6 is a cross-sectional view schematically showing a part of the wiring board 9 on which resist films 911, 913, and 93 of a plurality of types of patterns are formed. The resist films 911 and 913 are linear patterns, and the resist film 93 is a solid coating pattern having an area equal to or greater than a certain level.

A plurality of (here, four) conductive patterns 81 arranged at intervals are formed on the surface 9a of the wiring board 9 . The conductive pattern 81 is, specifically, a circuit pattern formed by etching a copper film having a predetermined thickness. The upper side of each conductive pattern 81 is covered with solder 85 . A resist film 911 as a linear pattern is formed between adjacent conductive patterns 81 and 81 . As shown in FIG. 6 , each resist film 911 functions as a dam that insulates solders 85 and 85 covering adjacent conductive patterns 81 and 81 from contacting each other.

The resist film 913 also has a linear pattern like the resist film 911 . However, the resist film 913 has a line width L2 larger than the line width L1 of the resist film 911 .

A conductive pattern 83 is formed on the surface 9a of the wiring board 9 . The resist film 93 covers the front end of the conductive pattern 83 and has a circular opening 931 exposing the front end of the conductive pattern 83 to the outside.

In this way, the pattern forming apparatus 1, based on the resist pattern data 71, forms various shapes and patterns in addition to the resist films 911, 913, and 93 shown in FIGS. 5 and 6 on the wiring board 9. form a size pattern.

Returning to Fig. 4, the pattern specifying unit 611 specifies the registration pattern included in the resist pattern data 71 (Fig. 4: step S12). As will be described later, the registration pattern is a pattern defined in the correction table information 73 (see Fig. 7). The pattern specifying unit 611 searches the resist pattern data 71 for a portion matching each registered pattern, and when a registered pattern is found, specific information indicating the size and position of the area occupied by the registered pattern ( 711) is passed to the discharge amount setting unit 612.

7 is a diagram showing an example of the correction table information 73. As shown in FIG. In the correction table information 73, a plurality of &quot;substrate types&quot; are defined as processing conditions for forming a resist pattern. In addition, in the correction table information 73, one or a plurality of "thickness of copper" is defined as a condition for each "substrate type". The copper thickness is the thickness of the conductive pattern made of copper that the wiring board 9 has before forming the resist film (for example, the thickness of the conductive pattern 83 shown in FIGS. 4 and 5 ). In addition, in the correction table information 73, one or more "surface treatment" is prescribed as a condition for each "copper thickness". "Surface treatment" is a condition indicating the treatment state of the surface 9a of the wiring board 9, and specifically includes buff polishing and substrate.

Further, in the correction table information 73, a plurality of "registered patterns" and a "discharge amount (dot area ratio)" are defined in a one-to-one correspondence for each "surface treatment". Specifically, as a "registration pattern", "line" representing a linear pattern, "SRO intersection" representing an intersection pattern, and an intersection formed between SROs and a pattern formed in an intermediate region connecting the intersections An "SRO middle line" is defined. In addition, with respect to the "line", 70 µm, 100 µm, and 150 µm are defined as different line widths.

In step S12 shown in FIG. 4 , the pattern specifying unit 611 first specifies processing conditions (substrate type, copper thickness, surface treatment) to which the wiring board 9 as the processing target corresponds. In addition, processing conditions of the wiring board 9 may be specified based on information given to the control unit 12 by the user in advance. The pattern specifying unit 611 searches the resist pattern data 71 for a registered pattern corresponding to the processing condition specified in the correction table information 73, and if found, the size and position of the registered pattern be specific

The resist pattern data 71 is image data representing a pattern of a resist film, and a value of "1" indicating application of ink or a value of "0" indicating application of ink is defined for each pixel. Hereinafter, a value indicating the presence or absence of application of ink is referred to as an "applied value". The discharge amount setting unit 612 sets an assigned value for each pixel represented by the resist pattern data 71 . That is, the discharge amount setting unit 612 sets an imparted value of 1 for a pixel to which ink is applied, and further sets a discharge amount per unit area. The discharge amount is a value corresponding to the film thickness of the resist film. That is, as the discharge amount increases, the film thickness basically increases.

The ejection amount setting unit 612 basically sets a predetermined standard ejection amount for pixels to which ink is applied. Further, when a registration pattern is specified in the resist pattern data 71 by the pattern specifying section 611, the discharge amount setting unit 612 provides correction table information for pixels corresponding to the specified registration pattern. Set the discharge amount specified in (73). That is, the discharge amount setting unit 612 sets the discharge amount for the registration pattern specified by the pattern specifying unit 611 based on the correction table information 73 . Then, the discharge amount setting unit 612 generates discharge data 75 indicating the discharge amount set for each pixel, and stores the discharge data 75 in the storage unit 62 (FIG. 4: step S14).

The apparatus main body 11 receives discharge data 75 from the control unit 12 and controls the head unit 3 and the moving mechanism 2 according to the discharge data 75 . Specifically, the step of discharging ink droplets from the head portion 3 toward the wiring board 9, and the head portion 3 relative to the wiring board 9 in a direction parallel to the wiring board 9. The process of moving to is carried out in parallel. In this way, ink is applied on the wiring board 9, and a pattern of the resist film 92 corresponding to the resist pattern data 71 is formed (Fig. 4: step S15).

As described above, in the correction table information 73 shown in Fig. 7, the discharge amount is set for each registration pattern. In the pattern forming apparatus 1, the dot area ratio is used as the discharge amount. For this reason, in the correction table information 73, the dot area ratio is used as the discharge amount. In the example shown in Fig. 7, the standard discharge amount is set to 60% in terms of dot area ratio.

In the correction table information 73 shown in Fig. 7, paying attention to the linear pattern (line), it is stipulated that the discharge amount increases as the line width decreases. This is because the film thickness tends to become thinner as the line width decreases. In addition, when the surface treatment of the wiring board 9 is buff polishing, the discharge amount is set relatively larger than in the case of the substrate. This is because, in the case of buff polishing, the film thickness of the linear pattern tends to be thinner than in the case of the substrate. In addition, the discharge amount for the cross pattern (SRO intersection point) is defined as a smaller value (for example, 50%) than the discharge amount for the linear pattern. This is because the film thickness of the cross-image pattern tends to be relatively large.

8 is a cross-sectional view schematically showing a wiring substrate 9 on which resist films of a plurality of types of patterns are formed. The upper part of FIG. 8 shows a case where the resist film is formed with a constant standard discharge amount, and the lower part of FIG. 8 shows the case where the discharge amount is changed based on the correction table information 73. The resist films 911, 912, and 913 are linear patterns, and the line widths are set to 70 µm, 100 µm, and 150 µm. The resist film 94 shows a cross-image pattern. In addition, the resist films 911, 912, and 913 are formed in order of increasing line width. In addition, the broken line LN1 represents the surface height (film thickness) of the designed resist film.

As shown in the upper part of FIG. 8 , when each resist film is formed with a constant standard discharge amount, the resist film 913 with a relatively large line width has a sufficient thickness, whereas the resist films 911 and 912 with a small line width have: The required thickness is not reached. In addition, the resist film 94 is larger than the target film thickness. On the other hand, in the correction table information 73, for the linear pattern, the discharge amount is set to be large as the line width becomes smaller. For this reason, even the resist films 911 and 912 having a relatively small line width can be set to a target height. Further, in the correction table information 73, a discharge amount (50%) smaller than the standard discharge amount (60%) is set for the crossed image pattern (SRO intersection). For this reason, the film thickness of the resist film 94 which is a cross pattern can be matched with the designed film thickness.

In the pattern forming apparatus 1, since the discharge amount of ink per unit area is set according to the type of pattern, a resist film having an appropriate film thickness can be formed on the wiring board 9 for each type of pattern.

<2. Variation>

In the above embodiment, the registration pattern defined in the correction table information 73 is not limited to that shown in Fig. 7, and other sizes or shapes (for example, a curved pattern or a dotted line pattern) etc.) is assumed.

Further, in the above embodiment, the discharge amount is changed by changing the dot area ratio, but this is not essential. For example, the discharge amount may be changed by changing the size of the ink droplet discharged by the head unit 3 or the discharge frequency per unit time.

Although the present invention has been described in detail, the above description is by way of example in all respects, and the present invention is not limited thereto. It is interpreted that countless modified examples not illustrated can be assumed without departing from the scope of the present invention. Each configuration described in each of the above embodiments and each modification can be appropriately combined or omitted as long as they do not contradict each other.

1 pattern forming device
11 device body
12 Control
2 moving devices
21 stage
2a Y-direction movement mechanism
2b X-direction movement mechanism
3 head
61 discharge data generator
611 pattern specific part
612 Discharge amount setting unit
62 storage
71 resist pattern data
711 specific information
73 Calibration Table Information
75 discharge data
9 wiring board
911, 912, 913, 92, 93, 94 resist film
9a surface

Claims (8)

A pattern forming apparatus for forming a pattern of a resist film on a wiring board, comprising:
a holding portion holding the wiring board;
a head unit for discharging ink droplets of a solder resist toward the surface of the wiring board by an inkjet method;
a moving mechanism for relatively moving the head portion with respect to the holding portion in a direction parallel to the surface of the wiring board;
an ejection data generation unit that generates ejection data indicating an ink ejection amount per unit area based on resist pattern data expressing a pattern of a resist film;
a control unit that forms a pattern of a resist film on the wiring substrate by controlling the head unit and the moving mechanism based on the ejection data;
the ejection data generating unit generates the ejection data with different ejection amounts set for each different type of pattern included in the resist pattern data;
The pattern of the resist film includes a first line pattern having a first line width and a line second pattern having a second line width smaller than the first line width;
wherein the ejection data generation unit generates ejection data in which the ejection amount for the second pattern is set to a value greater than the ejection amount for the first pattern. A pattern forming apparatus for forming a pattern of a resist film on a wiring board, comprising:
a holding portion holding the wiring board;
a head unit for discharging ink droplets of a solder resist toward the surface of the wiring board by an inkjet method;
a moving mechanism for relatively moving the head portion with respect to the holding portion in a direction parallel to the surface of the wiring board;
an ejection data generation unit that generates ejection data indicating an ink ejection amount per unit area based on resist pattern data expressing a pattern of a resist film;
a control unit that forms a pattern of a resist film on the wiring substrate by controlling the head unit and the moving mechanism based on the ejection data;
the ejection data generating unit generates the ejection data with different ejection amounts set for each different type of pattern included in the resist pattern data;
The pattern of the resist film includes a third pattern of crossed images,
The pattern forming apparatus of claim 1 , wherein the ejection data generation unit generates ejection data in which the ejection amount for the third pattern is set to a value smaller than a predetermined reference ejection amount. According to claim 1,
The pattern of the resist film includes a third pattern of crossed images,
The pattern forming apparatus of claim 1 , wherein the discharge data generation unit generates discharge data in which the discharge amount for the third pattern is set to a smaller value than the discharge amounts for the first pattern and the second pattern. According to claim 1 or 3,
further comprising a storage unit for storing correction table information defining discharge amounts per unit area for a plurality of types of patterns;
The discharge data generating unit,
a pattern specifying unit for specifying a pattern registered in the correction table information in the resist pattern data;
and a discharge amount setting unit that sets a discharge amount for the pattern specified by the pattern specification unit, based on the correction table information. A pattern formation method for forming a pattern of a resist film on a wiring board, comprising:
a) a step of discharging ink droplets of a solder resist from a head portion toward the surface of the wiring board by an inkjet method;
b) a step of relatively moving the head portion with respect to the wiring board in a direction parallel to the surface of the wiring board in step a);
c) In step a), a step of varying the discharge amount of ink per unit area according to the type of pattern of the resist film formed on the wiring board;
The pattern of the resist film includes a first line pattern having a first line width and a line second pattern having a second line width smaller than the first line width;
In step c), the discharge amount for the second pattern is set to be larger than the discharge amount for the first pattern. A pattern formation method for forming a pattern of a resist film on a wiring board, comprising:
a) a step of discharging ink droplets of a solder resist from a head portion toward the surface of the wiring board by an inkjet method;
b) a step of relatively moving the head portion with respect to the wiring board in a direction parallel to the surface of the wiring board in step a);
c) In step a), a step of varying the discharge amount of ink per unit area according to the type of pattern of the resist film formed on the wiring board;
The pattern of the resist film includes a third pattern of crossed images,
In step c), the discharge amount for the third pattern is set to be smaller than a predetermined standard discharge amount. As an ejection data generation method for generating ejection data used when ejecting droplets of ink of a solder resist from a head toward a wiring board by an inkjet method,
A) a step of preparing resist pattern data to be formed on a wiring board;
B) generating ejection data in which different ejection amounts per unit area are set for different types of patterns included in the resist pattern data;
The pattern of the resist film includes a first line pattern having a first line width and a line second pattern having a second line width smaller than the first line width;
In the step B), the ejection amount for the second pattern is set to be larger than the ejection amount for the first pattern. As an ejection data generation method for generating ejection data used when ejecting droplets of ink of a solder resist from a head toward a wiring board by an inkjet method,
A) a step of preparing resist pattern data to be formed on a wiring board;
B) generating ejection data in which different ejection amounts per unit area are set for different types of patterns included in the resist pattern data;
The pattern of the resist film includes a third pattern of crossed images,
In the step B), the ejection amount for the third pattern is set to be smaller than a predetermined standard ejection amount.

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