JP2001267380A - Marking device of semiconductor wafer, and semiconductor inspecting device using marking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a marking device of a semiconductor wafer that can easily and stably form a uniform marking trace in the semiconductor wafer, and a semiconductor-inspecting device that has the marking device. SOLUTION: A marking device 120 of a semiconductor wafer is equipped with a head 126 for liquid discharge for discharging liquid for marking to a semiconductor wafer 200 without contacts, and head control parts 123 and 125 for controlling the operation of the head for liquid discharge.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer marking apparatus for marking, for example, a test result of a semiconductor wafer for each semiconductor chip of the semiconductor wafer, and a semiconductor inspection apparatus having the same.

[0002]

2. Description of the Related Art Generally, a semiconductor wafer has a large number of semiconductor chips formed on one semiconductor wafer. Then, the semiconductor chip is separated for each semiconductor chip after an electrical characteristic test is performed for each semiconductor chip.

[0003] Of the separated semiconductor chips, only those semiconductor chips having a good electrical characteristic test result are selected and incorporated into an integrated circuit or the like.

At this time, of the inspected semiconductor wafers,
As you can immediately see which semiconductor chip is good and which semiconductor chip is bad by looking at the surface of the semiconductor wafer,
2. Description of the Related Art A semiconductor wafer marking device for marking a defective semiconductor chip is used. This marking device
For example, it is configured as shown in FIG. In FIG. 7, a marking device 10 includes a semiconductor wafer table 1 on which a semiconductor wafer 11 to be marked is placed.
3 and a table control unit 14 for controlling the semiconductor wafer table 13.

[0005] The table controller 14 is controlled by a controller 15, and a data manager 16 is connected to the controller 15. The data management unit 16 stores good and bad data for each semiconductor chip, which is the result of the electrical characteristic test of the semiconductor wafer 11, for example, on a medium such as a floppy disk, and reads the data into the data management unit 16. .

Therefore, the semiconductor wafer table 13 is driven on the basis of the data of good and bad semiconductor chips on the semiconductor wafer 11 read into the data management section 16.

On the other hand, the data management section 16
5. Connected to the inker 18 via the inker drive unit. The inker 18 is used to transfer ink to the semiconductor wafer 11.
The ink is discharged so that marking marks 12 are formed on the defective semiconductor chip as shown in FIG.

The ink discharge position of the inker 18 is accurately positioned by the control unit 15 and the inker drive unit 17 based on the data of the data management unit 16.

The semiconductor wafer 11 having such defective semiconductor chips with the marking marks 12 is separated for each semiconductor chip as described above, and only good semiconductor chips without the marking marks 12 are used as products. Will be used.

[0010]

The inker 18 used in such a marking device 10 is specifically as shown in FIG. That is, an ink discharge port 18 b is provided at the tip of the inker 18, and the fishing line 18 a is arranged from the ink discharge port 18 b toward the inside of the inker 18.

The fishing line 18a is adapted to move vertically in the drawing by means of a solenoid in the inker 18.

When the fishing line 18a is lowered by the solenoid and its tip comes into contact with the surface of the defective semiconductor chip of the semiconductor wafer 11, the fishing line 18a
Since the ink passes through the ink reservoir inside, the ink travels along the fishing line 18a and reaches the semiconductor chip, and forms a circular marking mark 12 as shown in FIG.

However, since the marking mark 12 is formed by the vertical movement of the fishing line 18a by the solenoid as described above, the marking mark 12 formed on the surface of the defective semiconductor chip due to the deformation or deterioration of the fishing line 18a is marked. May not be. In this case, since there is a possibility that the judgment of good or bad of the semiconductor chip may be erroneously made in a later process, the semiconductor wafer 11 is set on the marking device 10 again, the mark is inspected, the mark is removed, and the inker 18 is removed.
Then, it was necessary to redo the marking again, which increased the cost.

When the marking marks 12 are formed by the inker 18 shown in FIG.
Since the diameter of the circular marking mark 12 shown in FIG. 8 changes depending on the state of the fishing line 18a, the diameter of the marking mark 12 shown in FIG.

Further, when the marking mark 12 is formed by the inker 18 shown in FIG. 9, the amount of ink discharged is determined by the amount of ink transmitted through the fishing line 18a, so that the height of the circular marking mark 12 shown in FIG. However, there is also a problem that the semiconductor wafer 11 changes easily depending on the state of the fishing line 18a, and the semiconductor wafer 11 is easily broken when the semiconductor wafer 11 is ground in a later step.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a semiconductor wafer marking apparatus capable of easily and stably forming a uniform marking mark on a semiconductor wafer, and a semiconductor inspection apparatus having the same.

[0017]

According to the first aspect of the present invention, there is provided a liquid discharging head for discharging a marking liquid to a semiconductor wafer in a non-contact manner, and an operation of the liquid discharging head. And a head controller for controlling the semiconductor wafer.

According to the above configuration, the semiconductor wafer includes the liquid discharge head for discharging the marking liquid to the semiconductor wafer in a non-contact manner and the head control unit for controlling the operation of the liquid discharge head. , An appropriate amount of the marking liquid can be discharged stably.

Preferably, according to the second aspect of the present invention, there is provided the semiconductor wafer marking apparatus according to the first aspect of the present invention, further comprising a table section on which the semiconductor wafer is placed.

According to the above configuration, since the table for mounting the semiconductor wafer is provided, the semiconductor wafer can be arranged at an optimum position with respect to the liquid discharge head.

Preferably, according to the third aspect of the present invention, in the configuration of the second aspect, the table section is provided with an X-axis and a Y-axis which are orthogonal to each other in a plane coordinate system in a plane direction of the semiconductor wafer. This is a marking device for a semiconductor wafer having an axis table and a Y axis table separately.

According to the above configuration, the table unit has an X-axis table and a Y-axis table respectively corresponding to the X-axis and the Y-axis orthogonal to each other in the plane coordinate system in the plane direction of the semiconductor wafer. Therefore, the semiconductor wafer can be moved to a more accurate and optimum position in the plane direction with respect to the liquid discharge head.

Preferably, according to the invention of claim 4, in the configuration of claim 3, the X-axis table and / or the Y-axis table are marked on a semiconductor wafer provided on the liquid ejection head side. Device.

According to the above-described structure, since the X-axis table and / or the Y-axis table are provided on the liquid discharge head side, the position of the liquid discharge head with respect to the semiconductor wafer can be changed. By operating the axis table and / or the Y-axis table, it can be moved to an optimum position.

Preferably, according to the fifth aspect of the present invention, in the configuration of the third or fourth aspect, the head control section controls the liquid discharge head to maintain a constant inclination with respect to a moving direction thereof. This is a marking device for semiconductor wafers that is configured to be controlled in the following manner.

According to the above configuration, the head control section includes:
Since the liquid discharge head is configured to control so as to maintain a constant inclination with respect to the moving direction,
For example, the position of the liquid ejection head in the moving direction of the nozzle, for example, can be adjusted so as to match the position of the semiconductor chip on the semiconductor wafer.

According to a sixth aspect of the present invention, there is provided the semiconductor wafer marking apparatus according to the first to fifth aspects, wherein the liquid discharging head is an ink jet head for discharging ink from nozzles. .

According to the above configuration, since the liquid discharge head is an ink jet head that discharges ink from nozzles, it is possible to accurately adjust the ink to be discharged for adjusting the discharge mechanism in the ink jet head.

Preferably, according to a seventh aspect of the present invention, in the configuration of the sixth aspect, the head angle adjusting unit for matching the pitch between the nozzle chips between the nozzles of the ink jet head and the row between the semiconductor chips is provided. It is a marking device for a semiconductor wafer provided.

According to the above configuration, since the head angle adjusting section is provided for matching the pitch between the nozzle chips between the nozzles of the ink jet head and the line pitch between the semiconductor chips, the nozzle between the nozzles of the ink jet head is provided. The pitch between rows between the nozzle chip and the semiconductor chip can be easily matched.

Preferably, according to the eighth aspect of the present invention, in the configuration of the sixth or seventh aspect, the length of the portion of the ink jet head where the nozzles are arranged in the longitudinal direction is smaller than the length of the semiconductor wafer. This is a marking device for a semiconductor wafer formed to have the same length as or longer than the radial length of the portion where the semiconductor chip is provided.

According to the above construction, the longitudinal length of the portion of the ink jet head where the nozzles are arranged is equal to or greater than the radial length of the portion of the semiconductor wafer where the semiconductor chips are provided. Since the ink jet head is formed once longer, if the ink jet head is moved once over the semiconductor wafer, marking can be performed on the entire semiconductor chip of the semiconductor wafer, and the processing speed can be improved as compared with the related art.

Preferably, according to the ninth aspect of the present invention, in the configuration of the sixth to eighth aspects, the ink jet head forms a character, a symbol or a graphic on the semiconductor wafer. This is a wafer marking device.

[0034] According to the above-described structure, characters, symbols or figures are formed on the semiconductor wafer by the ink-jet head. Therefore, arbitrary information on the semiconductor wafer is appropriately written on the semiconductor wafer. be able to.

Preferably, according to the tenth aspect of the present invention,
8. A marking device for a semiconductor wafer according to claim 6, wherein a plurality of said ink jet heads are arranged in a head unit.

According to the arrangement, a plurality of the ink jet heads are arranged in the head unit.
A normal inkjet head can be arranged in the head unit.

[0037] Preferably, according to the invention of claim 11,
A semiconductor inspection apparatus having a semiconductor wafer marking apparatus according to any one of claims 1 to 10.

[0038]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a view showing a semiconductor inspection apparatus 100 according to a first embodiment of the present invention. As shown in FIG. 1, the semiconductor inspection device 100 includes a tester device 110 and a marking device 100 that is a marking device for a semiconductor wafer.

The tester device 110 is a device for inspecting electrical characteristics of individual semiconductor chips formed on the semiconductor wafer 200 to be inspected.

Specifically, the tester device 110 includes a stylus configured to sequentially move and be arranged at the positions of the electrodes provided on the individual semiconductor chips of the semiconductor wafer 200 to be inspected. A probe card having a stylus.

Then, the semiconductor wafer 200 to be inspected is placed on the tester device 110, and the stylus is sequentially brought into contact with the electrode of each semiconductor chip of the semiconductor wafer 200, and the tester device 110 makes contact with the electrode. Input signals will be sent sequentially.

In response to the input signal from the tester device 110, an output signal is sent from the electrode of each semiconductor chip to the tester device 110 side. By judging this output signal by the judging section formed in the tester device 110, it is judged whether each semiconductor chip is good or defective.

When the tester device 110 has finished inspecting all the semiconductor chips of one semiconductor wafer 110 to be inspected in this manner, the resulting inspection data is stored in the data management unit of the marking device 120 shown in FIG. 121, for example, via a network.

The inspection data transmitted to the data management unit 121 of the marking device 120 is
The coordinates (XY coordinates) above 0 indicate the position of the defective semiconductor chip.

The marking device 120 that receives inspection data as described above is configured as follows.

As shown in FIG. 1, the marking device 120 has a data management unit 121 for receiving the above-described inspection data from the tester device 110. This data management unit 121 is constituted by, for example, a computer.

The data management section 121 is connected to a control section 122 constituted by a computer, for example. The control unit 122 sends a signal to the inkjet head control unit 123 and the XY table control unit 124 based on the data from the data management unit 121, and the inkjet head control unit 123 and the XY table control unit 1
24 is controlled.

The ink-jet head control unit 123 controlled by the control unit 122 is constituted by, for example, a computer, and controls the head control unit and the head angle indexing unit 125 which is a head angle adjustment unit. .

The head angle indexing section 125 is connected to the ink jet head 126, and adjusts the angle of the ink jet head 126 with respect to the semiconductor wafer 200.

Specifically, as shown in FIG. 2, the angle θ is relative to the horizontal direction in FIG.
The head angle indexing unit 125 is used when arranging the inkjet head 126 at only a tilt.

That is, the ink jet head 12
6 in the longitudinal direction of the surface facing the semiconductor wafer 200,
A plurality of nozzles 126a are arranged at a constant nozzle pitch. The portion where the nozzle 126a is provided is formed longer than the radial length of the portion where the semiconductor chips arranged in the vertical radial direction of the semiconductor wafer 200 shown in FIG. 2 are provided, for example.

By making the length of the portion where the nozzle 126a is provided longer than the radial length of the portion where the semiconductor chip is provided, the ink jet head 126 can move once over the semiconductor wafer 200 once. After passing through, it becomes possible to perform marking on all the semiconductor chips. For this reason, marking can be performed on the semiconductor wafer 200 quickly.

However, as described above, the nozzle 126a
Even if the portion where the semiconductor chip is provided is formed longer than the radial direction of the portion where the semiconductor chip is provided, accurate marking can be performed if the individual nozzles 126a do not accurately correspond to the position of the semiconductor chip. Can not.

Normally, the pitch between rows of semiconductor chips is not an integral multiple of the nozzle pitch, so that the pitch distance between rows of these semiconductor chips does not coincide with the integral multiple of the nozzle pitch. Does not correspond accurately, and the position of the marking becomes defective.

In order to make the distance between the rows of these semiconductor chips equal to the integral multiple of the nozzle pitch, as shown in FIG. 2, the ink jet head 126 is arranged at an angle θ with respect to the left and right directions in the figure. And adjust the distance. The nozzles 126a corresponding to integral multiples of the nozzle pitch are each configured to correspond to a semiconductor chip.

For example, as shown in FIG. 2, the nozzle 126a corresponding to a nozzle chip of a certain integral multiple is set as the nozzle 126a corresponding to the row 1 of the semiconductor chip, and the nozzle 126a of the next integral multiple is placed in the row 2 of the semiconductor chip. Let it be the corresponding nozzle 126a. In this manner, the nozzles 126a are arranged by the number of rows in the vertical direction in the drawing of the semiconductor chip,
Marking was done.

In the present embodiment, for example, the head angle indexing unit 125 rotates the ink jet head 126 so that the angle θ is adjusted to, for example, 80.07 degrees. This angle 80.07 degrees is obtained by the following equation.

For example, the pitch between rows of semiconductor chips is 5 m.
m, when the nozzle pitch is 141 μm, 5000
(Pitch between semiconductor rows) ÷ 141 (nozzle pitch) = 3
The pitch is 5.76 (approximately 36), and θ (the angle of the inkjet head 126) = sin-1 (5000 (pitch between semiconductor rows) / 141 (nozzle pitch) × 36 (pitch)) = 80.07 degrees.

The ink jet head 126 rotated and the like by the head angle indexing unit 125 as shown in FIG.
As shown in FIG. 2, a long rectangular parallelepiped is formed, and its long side is formed longer than the diameter of the semiconductor wafer 200, for example.

FIG. 3 shows the relationship between the nozzle 126a and the ink jet head 126 thus configured.
It is.

As shown in FIG. 3, the ink jet head 126 has a cavity 126 for containing ink therein.
b. A wall 126c is provided on the left side of the cavity 126b in the figure, and the diaphragm 126b and the piezoelectric element 126e are arranged on the upper side in the figure so as to overlap with each other.

When a voltage is applied to the piezoelectric element 126e from a power supply (not shown), the piezoelectric element 126e made of ceramic or the like is deformed, and the diaphragm arranged so as to overlap with the piezoelectric element 126e is deformed by the deformation of the piezoelectric element 126e. 1
26d is also deformed. These piezoelectric elements 1
The deformed piezoelectric element 126e 'and the deformed diaphragm 126d' shown by broken lines in the figure show the deformed state of the diaphragm 26e and the diaphragm 126d.

On the other hand, a supply port 126f and a reservoir 126g are provided on the right side in the drawing of the cavity 126b.

For the ink jet head 126 having the above-described structure, UV curable ink, thermosetting ink, or the like is used as the ink. More specifically, “UV MET ink” manufactured by Teikoku Ink Co., Ltd. is used. As the main raw material,
A material whose viscosity is set to about 10 cP is used.

When such an ink is used for the ink jet head 126, the ink is filled in the reservoir 126g and the cavity 126b. In this state, when a voltage is applied to the piezoelectric element 126e as described above, the piezoelectric element 126e is deformed, and the diaphragm 126b is deformed,
The volume in the cavity 126b decreases, and pressure is generated.

Due to this pressure, the ink filled in the cavity 126 tends to move to the nozzle 126a which is an open port or the supply port 126f. However, the supply port 126f
There is a reservoir 126g on the side, which is filled with ink. As a result, the ink moves in the direction of the nozzle 126a and, as shown in FIG.
a.

As described above, in the present embodiment, since the marking is performed by discharging the ink droplets from the ink jet head 126, unlike the conventional inker, it is necessary to mark the semiconductor chips of the semiconductor wafer 200 with ink without contact. Can be. The voltage applied to the piezoelectric element 126e can be controlled by a computer or the like with respect to the amount of ink discharged. That is, by adjusting the application of the voltage, the deformation of the piezoelectric element 126e is controlled, whereby the ejection amount is accurately controlled.

As described above, the ink jet head 126
Is configured, but this inkjet head 12
The table section on which the semiconductor wafer 200 marked by 6 is mounted has, for example, a semiconductor wafer mounting section 129 on which the semiconductor wafer 200 is directly mounted, a Y-axis table 127 and an X-axis table 128.

The position is accurately determined by the alignment by image processing using a so-called CCD camera for mounting the semiconductor wafer 200 on the semiconductor wafer mounting portion 129.

The semiconductor wafer mounting portion 129 is
As shown in FIG. 1, it is fixed on a Y-axis table 127, and moves with the movement of the Y-axis table 127.

The Y-axis table 127 has a motor and the like, and moves in the Y-axis direction shown in FIG. 1 according to an instruction from the XY table control unit 124 shown in FIG. This Y-axis direction is
Is a direction orthogonal to the X-axis direction, which is the direction in which marking is performed on the semiconductor wafer 200. The Y-axis table 127 that moves in the Y-axis direction is used, for example, for an ink dot pitch that is a line feed pitch.

That is, as shown in FIG. 2, the semiconductor wafer 200 is
Ink droplets are ejected onto the semiconductor chip to perform marking. Specifically, this marking is one marking with four ink dots as shown in FIG. This ink dot represents a state in which an ink droplet is ejected once by the nozzle 126a, and an ink droplet for forming the ink dot is ejected four times by the nozzle 126a.
Is discharged from the nozzle.

After the ink dots are continuously marked rightward in the X-axis direction twice, the Y-axis table 127 moves by the ink dot pitch shown in FIG. The relative position changes by the amount of the ink dot pitch.

Then, conversely, ink dots are continuously marked twice to the left in the X-axis direction.
In this way, the four ink dots are marked close to each other, and the marking of one semiconductor chip is completed.

In order to perform marking on one semiconductor chip in this way, it is necessary to move the semiconductor chip by an ink dot pitch. For this reason, a Y-axis table 127 is provided.

On the other hand, the X-axis table 128 also has a motor and the like, and moves in the X-axis direction in FIG. When the X-axis table 128 moves, the Y-axis table 127 and the semiconductor wafer mounting part 129 thereon move accordingly.

The X-axis table 128 first moves from left to right in FIG. 2 on the semiconductor chip of the semiconductor wafer 200, and continuously prints two ink dots on the semiconductor chip to be marked from the nozzle 126a. Will be marked. Then, after moving in the Y-axis direction by the ink dot pitch in the above-described Y-axis table 127, the X-axis table 128 moves from right to left in FIG.
Two ink dots are continuously marked on the semiconductor chip to be marked from 26a. At this time, the ink dots to be marked later are, as described above,
This is performed so as to be in contact with the lower side of the first marked ink dot.

Semiconductor inspection apparatus 100 according to the present embodiment
Is configured as described above, and operates as follows.

First, the semiconductor wafer 200 to be inspected is
Is mounted on the tester device 110 of FIG. 1, the probe card provided in the tester device 110 is brought into contact with the electrodes of the individual semiconductor chips, and the semiconductor chips are individually inspected as described above, and the individual It is determined whether the semiconductor chip is non-defective.

The positions of non-defective semiconductor chips and defective semiconductor chips thus inspected are indicated by, for example, XY coordinates on the semiconductor wafer 200, and are used as inspection data.

The inspection data is transmitted to the data management unit 121 in the marking device 120 via a network and stored as shown in FIG.

Next, the semiconductor wafer 200 mounted on the tester device 110 is mounted on the semiconductor wafer mounting portion 129 in the marking device 120. Thereafter, the control unit 122 drives the inkjet head control unit 123 and the XY table control unit 124 based on the information on the non-defective and defective semiconductor chips stored in the data management unit 121.

More specifically, based on the data that the line pitch of the semiconductor wafer 200 is, for example, 5 mm and the data that the nozzle pitch of the ink jet head 126 of the marking device 120 is, for example, 141 μm, The angle θ with respect to the X-axis direction in 2 is determined by the above-described calculation formula, and for example, 8
0.07 degrees.

The head angle indexing section 125 is operated so that the angle becomes 80.07 degrees, and the ink jet head 126 is moved to set the angle to 80.07 degrees.

Next, as shown in FIG. 2, the semiconductor wafer 200 out of the nozzles 126a of the ink jet head 126 is
The nozzles 126a corresponding to the rows of the semiconductor chips of the X-axis table 128 and the Y-axis
The axis table 127 is moved and adjusted. That is, row 1
The nozzles 126a for marking, the nozzles 126a for marking row 2 and the like are adjusted to be at positions corresponding to those rows.

Next, based on the good / bad XY coordinate data of the semiconductor chip in the data management section 121, the nozzles 126a of the ink jet head 126 corresponding to the rows of the semiconductor wafer 200 are operated to discharge ink. .

At this time, the ink jet head 126
The X-axis table 128 is moved so that the nozzle passes through the semiconductor wafer 200 from right to left in FIG. 2, and the nozzle 126 a corresponding to the row of the semiconductor wafer 200 detects a defective semiconductor chip in the data management unit 121. When the ink reaches the XY coordinate data, the ink droplet is continuously ejected twice,
As shown in FIG. 2, two ink dots are formed in the horizontal direction.

In this manner, for the rows of the semiconductor chips on the semiconductor wafer 200, the ink jet head 126
Then, the Y-axis table 127 is moved by the ink dot pitch (line feed pitch) in FIG.

Then, the X-axis table 128 is moved from the right to the left in FIG. 2 and, when the X-axis table 128 is moved from the left to the right in FIG.
The ink is ejected to form two ink dots.

At this time, the ink dots formed later are formed below the previously formed ink dots as shown in FIG.

One defective mark is formed by the four ink dots thus formed, and the defective mark is detected by an optical device or the like (not shown) so that a defective semiconductor chip on the semiconductor wafer 200 can be easily detected. It will be able to identify.

By the way, when the X-axis table 128 moves from right to left in FIG. 2 and marks all the defective semiconductor chips on the semiconductor wafer 200 as defective, a series of operations is completed, and the semiconductor wafer 200 is transferred to the semiconductor wafer 200. The semiconductor chip is taken out from the mounting portion 129 and separated into semiconductor chips by a separating device (not shown).

At this time, the defective semiconductor chip is identified by the optical device or the like, and only a good semiconductor chip is incorporated into, for example, an integrated circuit.

As described above, according to the present embodiment, the defective mark of the semiconductor chip is formed by discharging the ink droplet from the nozzle 126a due to the deformation of the piezoelectric element 126e which can be finely adjusted by the voltage, and the nozzle 126a Since there is no contact with the surface of the chip, the size of the defective mark can always be made uniform, and the recognition of the defective mark in a subsequent process can be facilitated.

Further, the defective mark is formed from a plurality of, for example, four ink dots, so that the size of the defective mark can be arbitrarily adjusted. Therefore, when the diameter required for the defective mark is 200 to 600 μm, ± 50
The standard of μm and thickness of 30 μm or less (target of 25 μm or less) can be easily satisfied.

Further, in this embodiment, the defective mark is formed by four ink dots. However, other characters, symbols, or figures can be formed on the semiconductor chip.

Further, in the present embodiment, the X-axis table 128 and the Y-axis table 127 are formed on the side of the semiconductor wafer mounting portion 129. However, the present invention is not limited to this. It may be attached to the inkjet head 126 side. Further, one of the X-axis table 128 and the Y-axis table 127 can be formed on the semiconductor wafer mounting portion side, and the other can be formed on the inkjet head 126 side.

(Second Embodiment) FIG. 4 is a diagram showing a main part of a semiconductor inspection apparatus according to a second embodiment of the present invention. Since the configuration of the semiconductor inspection apparatus of the present embodiment is substantially the same as the configuration of the above-described first embodiment, the following description will focus on the differences from the first embodiment.

In this embodiment, the configuration of the head unit 226 is different from that of the first embodiment. That is,
In the inkjet head 126 according to the first embodiment,
Nozzle 1 at a constant nozzle pitch on semiconductor wafer 200 side
In this embodiment, an ink jet head 226h is provided in the head unit 226, and the nozzle 126a is provided in the ink head 226h.
Is provided.

That is, in this embodiment, as in the first embodiment, the ink jet head 12 in which many nozzles 126a are specially arranged for the marking device 120 is provided.
6, without using an existing ink jet head 226h of a printer, for example.

For this reason, as shown in FIG. 4, the ink jet heads 226h are arranged at regular intervals in the head unit 226.

As shown in FIG. 4, the interval between the ink jet heads 226h is, as shown in FIG. 4, a length A between both ends of the nozzle 226a of the ink jet head 226h. , The nozzle pitch of the nozzles 226a of the discontinuously arranged, for example, three inkjet heads 226h is formed to be an integral multiple.

The head unit 22 thus formed
6 with the inkjet head 126 of the first embodiment.
Is mounted on the head angle indexing unit 125 in place of. Then, similarly to the first embodiment, the head unit 22
6 is tilted with respect to the X-axis direction by an angle θ, for example, 80.07 degrees, and the X-axis table 127 is moved so as to relatively move on the semiconductor wafer 200.

The process by which the head unit 226 forms the ink dots on the semiconductor chips of the semiconductor wafer 200 is the same as in the first embodiment. But,
The difference from the first embodiment is that, as shown in FIG.
The movement in the axial direction includes not only the movement of the ink dot pitch (line feed pitch (1)) but also the movement of the line feed pitch (2).

That is, as shown in FIG. 6, first, after forming a defective mark on a specific semiconductor chip row, for example, rows 1, 2, 5 and 6, by marking, line feed pitch (1) and marking, FIG. And a line feed pitch (2) shown in FIG.

At this line feed pitch (2), marking, line feed pitch (1) and marking shown in FIG. 6 are performed in order to perform marking on lines 3, 4, 7, and 8, which are not marked with a defect mark.

This operation is performed the required number of times by moving the X-axis table 128 and the Y-axis table 127,
The marking of the defective mark on the semiconductor chip of No. 00 is completed.

As described above, according to the present embodiment, a uniform defective mark can be formed by attaching an ink jet head 226h of an existing printer or the like to the head unit 226 without providing a special ink jet head 126. A semiconductor inspection device having a marking device capable of performing the above can be provided.

[0110]

As described above, according to the present invention, it is possible to provide a semiconductor wafer marking apparatus capable of easily and stably forming uniform marking marks on a semiconductor wafer and a semiconductor inspection apparatus having the same. it can.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an outline of a semiconductor inspection device according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram showing a relationship between the ink jet head of FIG. 1 and a semiconductor wafer.

FIG. 3 is a schematic sectional view showing the configuration of the ink jet head of FIG.

FIG. 4 is a schematic diagram showing a relationship between a head unit and an inkjet head of a semiconductor device according to a second embodiment of the present invention.

FIG. 5 is a schematic diagram showing a relationship between the ink jet head of FIG. 4 and a semiconductor wafer.

FIG. 6 is an explanatory diagram showing movement of the ink jet head and the semiconductor wafer of FIG. 5;

FIG. 7 is a schematic view showing a conventional marking device.

FIG. 8 is a schematic diagram showing a semiconductor wafer marked by the marking device of FIG. 7;

FIG. 9 is a schematic sectional view showing a main part of the inker of FIG. 7;

[Explanation of symbols]

 Reference Signs List 100 semiconductor inspection device 110 tester device 120 marking device 121 data management unit 122 control unit 123 inkjet head control unit 124 XY table control unit 125 ..Head angle indexing unit 126 ... Inkjet head 127 ... Y-axis table 128 ... X-axis table 129 ... Semiconductor wafer mounting unit 200 ... Semiconductor wafer 226 ... Head unit

Claims (11)

[Claims] 1. A liquid discharge head comprising: a liquid discharge head for discharging a marking liquid in a non-contact manner with respect to a semiconductor wafer; and a head control unit for controlling an operation of the liquid discharge head. Marking device. 2. The apparatus for marking a semiconductor wafer according to claim 1, further comprising a table on which the semiconductor wafer is placed. 3. An X-axis table and a Y-axis table respectively corresponding to an X-axis and a Y-axis orthogonal to each other in a plane coordinate system in a plane direction of a semiconductor wafer. 3. The apparatus for marking a semiconductor wafer according to claim 2, wherein: 4. The apparatus for marking a semiconductor wafer according to claim 3, wherein the X-axis table and / or the Y-axis table are provided on the liquid ejection head side. 5. The liquid ejection head according to claim 3, wherein the head control unit controls the liquid ejection head to maintain a constant inclination with respect to a moving direction of the liquid ejection head. A marking device for a semiconductor wafer as described in the above. 6. The semiconductor wafer marking apparatus according to claim 1, wherein the liquid discharge head is an ink jet head that discharges ink from nozzles. 7. The semiconductor wafer according to claim 6, further comprising a head angle adjusting unit for matching a nozzle pitch between nozzles of the inkjet head and a row pitch between the semiconductor chips. Marking device. 8. The ink jet head according to claim 1, wherein a length in a longitudinal direction of a portion where the nozzle is disposed is equal to or longer than a radial length of a portion of the semiconductor wafer on which the semiconductor chip is provided. The marking device for a semiconductor wafer according to claim 6 or 7, wherein: 9. The marking of a semiconductor wafer according to claim 6, wherein a character, a symbol or a figure is formed on said semiconductor wafer by said ink jet head. apparatus. 10. The ink jet head according to claim 8, wherein:
8. The apparatus for marking a semiconductor wafer according to claim 6, wherein the apparatus is arranged in a head unit. 11. A semiconductor inspection apparatus having the semiconductor wafer marking apparatus according to claim 1. Description: