JP3922226B2 - Semiconductor wafer marking apparatus and semiconductor inspection apparatus having the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor wafer marking apparatus for marking, for example, a test result of a semiconductor wafer for each semiconductor chip of the semiconductor wafer, and a semiconductor inspection apparatus having the same.
[0002]
[Prior art]
As for a semiconductor wafer, many semiconductor chips are usually formed on one semiconductor wafer. The semiconductor chip is separated for each semiconductor chip after the electrical characteristic inspection is performed for each semiconductor chip.
[0003]
Of the semiconductor chips separated in this way, only those with good electrical characteristic inspection results are selected and incorporated into an integrated circuit or the like.
[0004]
At this time, marking of the semiconductor wafer that marks the defective semiconductor chip so that it can be immediately understood from the surface of the semiconductor wafer which semiconductor chip is good and which is defective among the inspected semiconductor wafers. The device is in use. This marking device is configured, for example, as shown in FIG. In FIG. 7, the marking apparatus 10 includes a semiconductor wafer table 13 on which a semiconductor wafer 11 to be marked is placed, and a table control unit 14 that controls the semiconductor wafer table 13.
[0005]
The table control unit 14 is controlled by the control unit 15, and a data management unit 16 is connected to the control unit 15. In the data management unit 16, good and bad data for each semiconductor chip, which is an electrical characteristic test result of the semiconductor wafer 11, is stored in a medium such as a floppy disk (registered trademark) and is read into the data management unit 16. It has become.
[0006]
Therefore, the semiconductor wafer table 13 is driven based on the good / bad data of the semiconductor chips of the semiconductor wafer 11 read into the data management unit 16.
[0007]
On the other hand, the data management unit 16 is connected to the inker 18 via the control unit 15 and the inker drive unit. The inker 18 discharges ink so that a marking mark 12 is formed on a defective semiconductor chip of the semiconductor wafer 11 as shown in FIG.
[0008]
The ink discharge position of the inker 18 is accurately positioned by the control unit 15 and the inker drive unit 17 based on the data of the data management unit 16.
[0009]
Then, the semiconductor wafer 11 having the marking trace 12 on the defective semiconductor chip as described above is separated for each semiconductor chip as described above, and only a good semiconductor chip without the marking trace 12 is used as a product. It will be.
[0010]
[Problems to be solved by the invention]
Incidentally, the inker 18 used in such a marking device 10 is specifically as shown in FIG. That is, an ink discharge port 18 b is provided at the tip of the inker 18, and a fishing line 18 a is disposed from the ink discharge port 18 b toward the inside of the inker 18.
[0011]
The fishing line 18a is moved in the vertical direction in the figure by a solenoid in the inker 18.
[0012]
When the fishing line 18a is lowered by the solenoid and the tip of the fishing line 18a comes into contact with the surface of the defective semiconductor chip of the semiconductor wafer 11, the fishing line 18a passes through the ink reservoir in the inker 18, so that the ink passes through the fishing line 18a. Then, it reaches the semiconductor chip and forms a circular marking mark 12 as shown in FIG.
[0013]
However, since the marking trace 12 is performed by the vertical movement of the fishing line 18a by the solenoid as described above, the marking trace 12 formed on the surface of the defective semiconductor chip may not be marked due to deformation or deterioration of the fishing line 18a. is there. In this case, since there is a possibility that the determination of the quality of the semiconductor chip in the subsequent process may be wrong, the semiconductor wafer 11 is again installed in the marking device 10 to inspect the mark, remove the mark, and again with the inker 18 It was necessary to redo the marking, resulting in increased costs.
[0014]
Further, when the marking mark 12 is formed by the inker 18 shown in FIG. 9, the ink discharge amount is determined by the amount of ink transmitted through the fishing line 18a. Therefore, the diameter of the circular marking mark 12 shown in FIG. It changed depending on the state, and had a great influence on the recognizability of the marking trace 12 in the subsequent process.
[0015]
Further, when the marking mark 12 is formed by the inker 18 shown in FIG. 9, the amount of ink discharged is determined by the amount of ink transmitted through the fishing line 18a. Therefore, the height of the circular marking mark 12 shown in FIG. There is also a problem that the semiconductor wafer 11 is easily broken when the semiconductor wafer 11 is ground in a subsequent process.
[0016]
SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor wafer marking apparatus and a semiconductor inspection apparatus having the same that can easily and stably form uniform marking marks on a semiconductor wafer.
[0017]
[Means for Solving the Problems]
The object is, according to the present invention, a liquid discharge head for discharging a marking liquid in a non-contact manner to a semiconductor chip formed on a semiconductor wafer;
A head controller for controlling the operation of the liquid ejection head;
Comprising
This is achieved by a marking device for a semiconductor wafer, wherein marks having different sizes are formed on the semiconductor wafer.
[0018]
According to the above configuration, the liquid ejection head that ejects the marking liquid in a non-contact manner with respect to the semiconductor wafer and the head control unit that controls the operation of the liquid ejection head are provided. An appropriate amount of marking liquid can be stably discharged.
[0019]
According to the configuration, since the table portion for mounting the semiconductor wafer is provided, the semiconductor wafer can be disposed at an optimum position with respect to the liquid ejection head.
[0020]
Preferably, a semiconductor wafer marking device is provided, wherein a table portion for mounting the semiconductor wafer is provided.
[0021]
Preferably, in the configuration of the present invention, the table unit has an X-axis table and a Y-axis table separately corresponding to the X-axis and the Y-axis that are orthogonal to each other in the plane coordinate system in the plane direction of the semiconductor wafer. This is a marking device for a semiconductor wafer.
[0022]
According to the above configuration, the table unit has the X-axis table and the Y-axis table separately corresponding to the X-axis and the Y-axis that are orthogonal to each other in the plane coordinate system in the plane direction of the semiconductor wafer. The semiconductor wafer can be moved to a more accurate and optimal position in the surface direction with respect to the liquid discharge head.
[0023]
Preferably, in the configuration of the present invention, the semiconductor wafer marking device is provided with a table portion on which the semiconductor wafer is placed.
[0024]
Preferably, in the configuration of the present invention, the X-axis table and / or the Y-axis table is a semiconductor wafer marking device provided on the liquid discharge head side.
[0025]
According to the above configuration, since the X-axis table or / and the Y-axis table are provided on the liquid discharge head side, the position of the liquid discharge head with respect to the semiconductor wafer is determined by the position of the X-axis table or / And can be moved to an optimal position by operating the Y-axis table.
[0026]
Preferably, in the configuration of the present invention, the head control unit is a marking device for a semiconductor wafer configured to control the liquid discharge head so as to maintain a certain inclination with respect to a moving direction thereof.
[0027]
According to the above configuration, the head control unit is configured to control the liquid discharge head so as to maintain a certain inclination with respect to the moving direction thereof, and thus is provided in the liquid discharge head. For example, the position of the nozzle in the moving direction can be adjusted to coincide with the position of the semiconductor chip of the semiconductor wafer.
[0028]
Preferably, in the configuration of the present invention, the liquid ejection head is a marking device for a semiconductor wafer, which is an inkjet head that ejects ink from a nozzle.
[0029]
According to the above configuration, since the liquid ejection head is an inkjet head that ejects ink from the nozzles, it is possible to accurately adjust the ejected ink for adjusting the ejection mechanism in the inkjet head.
[0030]
Preferably, in the configuration of the present invention, a length in a longitudinal direction of a portion where the nozzle of the inkjet head is arranged is equal to or more than a length in a radial direction of a portion where the semiconductor chip of the semiconductor wafer is provided. This is a marking device for a semiconductor wafer that is formed long.
[0031]
According to the above configuration, the length in the longitudinal direction of the portion of the inkjet head where the nozzle is disposed is the same as or longer than the length of the portion of the semiconductor wafer where the semiconductor chip is provided. Therefore, if the inkjet head is moved once onto the semiconductor wafer, marking can be performed on the entire semiconductor chip of the semiconductor wafer, and the processing speed can be improved as compared with the conventional method.
[0032]
Preferably, in the configuration of the present invention, the marking device for a semiconductor wafer is configured to form characters, symbols or figures on the semiconductor wafer with the inkjet head.
[0033]
According to the above configuration, since the inkjet head is configured to form characters, symbols, or figures on the semiconductor wafer, any information regarding the semiconductor wafer can be appropriately entered on the semiconductor wafer. .
[0034]
Preferably, in the configuration of the present invention, a semiconductor wafer marking device in which a plurality of the inkjet heads are arranged in a head unit.
[0035]
According to the above configuration, since a plurality of the inkjet heads are arranged in the head unit, a normal inkjet head can be arranged in the head unit.
[0036]
Preferably, according to the present invention, the semiconductor inspection apparatus includes a semiconductor wafer marking apparatus.
[0037]
Next, according to the present invention, the operation of the liquid discharge head for placing the semiconductor wafer on the table unit and discharging the marking liquid is controlled by the head control unit, and the marking liquid is discharged from the liquid discharge head. A method for marking semiconductor chips formed on the semiconductor wafer by discharging, the method comprising the step of forming marks of different sizes on the semiconductor wafer. Is the method.
[0038]
According to the invention, there is provided a marking method for a semiconductor wafer, characterized in that the head control unit controls the liquid discharge head so as to maintain a certain inclination with respect to the moving direction thereof.
[0039]
In addition, according to the present invention, there is provided a method for marking a semiconductor wafer, wherein the mark formed on the semiconductor wafer by the ink jet head is a character, symbol, or figure.
[0040]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the drawings.
[0041]
(First embodiment)
FIG. 1 is a diagram showing a semiconductor inspection apparatus 100 according to the first embodiment of the present invention. As shown in FIG. 1, the semiconductor inspection apparatus 100 includes a tester apparatus 110 and a marking apparatus 100 which is a semiconductor wafer marking apparatus.
[0042]
The tester device 110 is a device for inspecting electrical characteristics of individual semiconductor chips formed on the semiconductor wafer 200 to be inspected.
[0043]
Specifically, the tester device 110 includes a stylus configured to sequentially move and be arranged at the position of an electrode provided on each semiconductor chip of the semiconductor wafer 200 to be inspected, and the stylus. Having a probe card.
[0044]
Then, the semiconductor wafer 200 to be inspected is placed on the tester device 110, and the stylus is sequentially brought into contact with the electrodes of the individual semiconductor chips of the semiconductor wafer 200, and the tester device 110 sequentially inputs the electrodes. A signal will be sent.
[0045]
In response to the input signal from the tester device 110, an output signal is sent from the electrodes of the individual semiconductor chips to the tester device 110 side. By judging this output signal by the judgment unit formed in the tester device 110, it is judged whether each semiconductor chip is a non-defective product or a defective product.
[0046]
When the tester device 110 finishes inspecting all the semiconductor chips of one semiconductor wafer 110 to be inspected in this way, the inspection data as a result is stored in the data management unit 121 of the marking device 120 shown in FIG. It will be sent over the network.
[0047]
Here, the inspection data transmitted to the data management unit 121 of the marking device 120 indicates at which coordinates (XY coordinates) on the semiconductor wafer 200 the defective semiconductor chip exists.
[0048]
The marking device 120 that receives inspection data in this way is configured as follows.
[0049]
As shown in FIG. 1, the marking device 120 includes a data management unit 121 that receives the above-described inspection data from the tester device 110. The data management unit 121 is configured by a computer, for example.
[0050]
The data management unit 121 is connected to a control unit 122 configured by, for example, a computer. The control unit 122 sends a signal to the inkjet head control unit 123 and the XY table control unit 124 based on the data from the data management unit 121 so as to control the inkjet head control unit 123 and the XY table control unit 124. It has become.
[0051]
Thus, the inkjet head control part 123 controlled by the control part 122 is comprised, for example with a computer, and controls the head angle determination part 125 which is a head control part and a head angle adjustment part.
[0052]
The head angle indexing unit 125 is connected to the ink jet head 126 and adjusts the angle of the ink jet head 126 with respect to the semiconductor wafer 200.
[0053]
Specifically, as shown in FIG. 2, when the inkjet head 126 is arranged at an angle θ with respect to the horizontal direction in the drawing, which is the marking direction of the inkjet head 126 with respect to the semiconductor wafer 200, the head angle is determined. Part 125 is used.
[0054]
That is, a plurality of nozzles 126a are arranged at a constant nozzle pitch in the longitudinal direction of the surface of the inkjet head 126 facing the semiconductor wafer 200. The portion provided with the nozzle 126a is formed longer than the length in the radial direction of the portion provided with the semiconductor chips arranged in the radial direction of the semiconductor wafer 200 shown in FIG. 2, for example.
[0055]
By making the length of the portion where the nozzle 126a is provided in this way longer than the length in the radial direction of the portion where the semiconductor chip is provided, the inkjet head 126 passes once over the semiconductor wafer 200. Marking can be performed on all semiconductor chips. For this reason, the semiconductor wafer 200 can be marked quickly.
[0056]
However, even if the portion where the nozzle 126a is provided in this way is longer than the radial direction of the portion where the semiconductor chip is provided, the individual nozzle 126a does not correspond to the position of the semiconductor chip accurately. Can not be accurately marked.
[0057]
Usually, since the pitch between the rows of the semiconductor chips is not an integral multiple of the nozzle pitch, the pitch distance between the rows of these semiconductor chips and the integral multiple of the nozzle pitch do not match, so the nozzle 126a is positioned accurately on the semiconductor chip. It does not correspond, and the position of marking becomes defective.
[0058]
Therefore, in order to make the distance between the row pitches of these semiconductor chips coincide with an integral multiple of the nozzle pitch, as shown in FIG. Together. The nozzles 126a corresponding to integer multiples of the nozzle pitch are each configured to correspond to the semiconductor chip.
[0059]
For example, a nozzle 126a corresponding to a certain integer multiple nozzle chip is a nozzle 126a corresponding to row 1 of the semiconductor chip as shown in FIG. 2, and a next integer multiple nozzle 126a is a nozzle corresponding to row 2 of the semiconductor chip. 126a. As described above, the nozzles 126a are arranged by the number of rows in the vertical direction in the figure of the semiconductor chip so as to perform marking.
[0060]
In the present embodiment, for example, the head angle indexing unit 125 rotates the inkjet head 126 so that the angle θ is adjusted to 80.07 degrees, for example. This angle 80.07 degrees is obtained by the following equation.
[0061]
For example, when the row pitch of semiconductor chips is 5 mm and the nozzle pitch is 141 μm,
5000 (semiconductor line pitch) / 141 (nozzle pitch) = 35.76 (about 36) pitch
And
θ (angle of inkjet head 126) = sin−1 (5000 (semiconductor row pitch) / 141 (nozzle pitch) × 36 (pitch)) = 80.07 degrees.
In this way, the inkjet head 126 rotated by the head angle indexing portion 125 forms a horizontally long rectangular parallelepiped as shown in FIGS. 1 and 2, and its long side is formed longer than the diameter of the semiconductor wafer 200, for example. Yes.
[0062]
FIG. 3 shows the relationship between the nozzle 126a configured as described above and the inkjet head 126. As shown in FIG.
[0063]
As shown in FIG. 3, the inkjet head 126 has a cavity 126b for containing ink therein. A wall 126c is provided on the left side of the cavity 126b in the figure, and the diaphragm 126b and the piezoelectric element 126e are arranged on the upper side in the figure so as to overlap each other.
[0064]
When a voltage is applied to the piezoelectric element 126e from a power source (not shown), the piezoelectric element 126e made of ceramic or the like is deformed. Due to the deformation of the piezoelectric element 126e, the diaphragm 126d disposed so as to overlap with the piezoelectric element 126e is also deformed. It is supposed to be. The state after deformation of the piezoelectric element 126e and the diaphragm 126d is the deformed piezoelectric element 126e 'and the deformed diaphragm 126d' shown by the broken lines in the figure.
[0065]
On the other hand, a supply port 126f and a reservoir 126g are provided on the right side of the cavity 126b.
[0066]
The ink-jet head 126 configured as described above uses UV curable ink, thermosetting ink, or the like as ink. More specifically, “UV MET ink” manufactured by Teikoku Inc. is used as a main raw material. A material whose viscosity is set to about 10 cP is used.
[0067]
When such ink is used for the inkjet head 126, the ink is filled in the reservoir 126g and the cavity 126b. In this state, when a voltage is applied to the piezoelectric element 126e as described above, the piezoelectric element 126e is deformed, and the diaphragm 126b is deformed, the volume in the cavity 126b is reduced and pressure is generated.
[0068]
Due to this pressure, the ink filled in the cavity 126 tends to move to the nozzle 126a and the supply port 126f which are open ports. However, there is a reservoir 126g on the supply port 126f side, which is filled with ink. Therefore, the ink moves in the direction of the nozzle 126a and is ejected from the nozzle 126a as ink droplets as shown in FIG.
[0069]
Thus, in this embodiment, since marking is performed by ejecting ink droplets from the inkjet head 126, unlike the conventional inker, the semiconductor chip of the semiconductor wafer 200 can be marked with ink in a non-contact manner. The amount of ink discharged can be controlled by a computer or the like as to the voltage applied to the piezoelectric element 126e. That is, by adjusting the voltage application, the deformation of the piezoelectric element 126e is controlled, and thereby the ejection amount is accurately controlled.
[0070]
Although the inkjet head 126 is configured as described above, the table portion on which the semiconductor wafer 200 marked by the inkjet head 126 is placed is, for example, a semiconductor wafer placement portion 129 on which the semiconductor wafer 200 is directly placed, A Y-axis table 127 and an X-axis table 128 are provided.
[0071]
The position is accurately determined by alignment by image processing using a so-called CCD camera for mounting the semiconductor wafer 200 on the semiconductor wafer mounting portion 129.
[0072]
Further, the semiconductor wafer mounting portion 129 is fixed on the Y-axis table 127 as shown in FIG. 1, and moves as the Y-axis table 127 moves.
[0073]
The Y-axis table 127 has a motor and the like, and moves in the Y-axis direction shown in FIG. 1 according to an instruction from the XY table control unit 124 shown in FIG. This Y-axis direction is a direction orthogonal to the X-axis direction, which is the direction in which the inkjet head 126 performs marking on the semiconductor wafer 200. The Y-axis table 127 that moves in the Y-axis direction is used for an ink dot pitch that is a line feed pitch, for example.
[0074]
That is, as shown in FIG. 2, ink droplets are ejected onto the semiconductor chip of the semiconductor wafer 200 by the nozzle 126a of the ink jet head 126, and marking is performed. This marking is specifically shown in FIG. Each ink dot has four markings. This ink dot represents a state in which an ink droplet is ejected once by the nozzle 126a, and an ink droplet for forming this ink dot is ejected from the nozzle 126a four times.
[0075]
After this ink dot is marked twice in the right direction in the X-axis direction, the Y-axis table 127 moves by the ink dot pitch shown in the figure, and the relative position between the nozzle 126a and the semiconductor chip is changed. It will change by the ink dot pitch.
[0076]
Then, conversely, ink dots are marked twice in succession to the left in the X-axis direction. In this way, four ink dots are marked close to each other, and marking of one semiconductor chip is completed.
[0077]
Thus, in order to perform marking on one semiconductor chip, it is necessary to move by the ink dot pitch, and for this reason, a Y-axis table 127 is provided.
[0078]
On the other hand, the X-axis table 128 also has a motor and the like, and moves in the X-axis direction in FIG. 2 according to an instruction from the XY table control unit 124. When the X-axis table 128 is moved, the Y-axis table 127 and the semiconductor wafer mounting portion 129 thereon are also moved accordingly.
[0079]
The X-axis table 128 first moves from the left to the right in FIG. 2 on the semiconductor chip of the semiconductor wafer 200, and continuously marks two ink dots on the semiconductor chip to be marked from the nozzle 126a. become. Thereafter, the Y-axis table 127 is moved in the Y-axis direction by the ink dot pitch, and then the X-axis table 128 is moved from the right to the left in FIG. 2 to be marked on the semiconductor chip to be marked from the nozzle 126a. Two ink dots are marked continuously. At this time, the ink dot to be marked later is in contact with the lower side of the ink dot marked first as described above.
[0080]
The semiconductor inspection apparatus 100 according to the present embodiment is configured as described above, and operates as follows.
[0081]
First, the semiconductor wafer 200 to be inspected is mounted on the tester device 110 of FIG. 1, and the probe card provided in the tester device 110 is brought into contact with the electrodes of the individual semiconductor chips, and the semiconductor as described above. Each chip is inspected to determine whether each semiconductor chip is a non-defective product.
[0082]
The individual semiconductor chips inspected in this way indicate the positions of the good semiconductor chip and the defective semiconductor chip by, for example, XY coordinates on the semiconductor wafer 200 and serve as inspection data.
[0083]
As shown in FIG. 1, the inspection data is transmitted to the data management unit 121 in the marking device 120 via the network and stored.
[0084]
Next, the semiconductor wafer 200 mounted on the tester device 110 is mounted on the semiconductor wafer mounting portion 129 in the marking device 120. Thereafter, the inkjet head control unit 123 and the XY table control unit 124 are driven via the control unit 122 based on the information on the non-defective product and the defective product of the semiconductor chip stored in the data management unit 121.
[0085]
Specifically, first, based on the data that the row pitch of the semiconductor wafer 200 is, for example, 5 mm and the data that the nozzle pitch of the inkjet head 126 of the marking device 120 is, for example, 141 μm, the X of the inkjet head 126 in FIG. The angle θ with respect to the axial direction is determined by the above formula, and is set to 80.07 degrees, for example.
[0086]
The head angle indexing unit 125 is operated so that the angle is 80.07 degrees, the inkjet head 126 is moved, and the angle is set to 80.07 degrees.
[0087]
Next, as shown in FIG. 2, among the nozzles 126a of the inkjet head 126, the nozzles 126a corresponding to the rows of the semiconductor chips of the semiconductor wafer 200 are set to the positions corresponding to the X-axis table 128 and the Y-axis table 127, respectively. Move and adjust. That is, the nozzle 126a that marks row 1 and the nozzle 126a that marks row 2 are adjusted so as to be in positions corresponding to those rows.
[0088]
Next, based on the good / bad XY coordinate data of the semiconductor chip in the data management unit 121, the nozzle 126a corresponding to each row of the semiconductor wafer 200 of the inkjet head 126 is operated to discharge ink.
[0089]
At this time, the X-axis table 128 is moved so that the inkjet head 126 passes over the semiconductor wafer 200 from the right to the left in FIG. 2, and the nozzle 126 a corresponding to the row of the semiconductor wafer 200 is transferred to the data management unit 121. When the defective XY coordinate data of a certain semiconductor chip is reached, ink droplets are ejected twice in succession to form two ink dots in the horizontal direction as shown in FIG.
[0090]
In this way, when the inkjet head 126 passes through the semiconductor chip row of the semiconductor wafer 200, the Y-axis table 127 is then moved by the ink dot pitch (line feed pitch) in FIG.
[0091]
Then, the X-axis table 128 is moved from the right to the left in FIG. 2, and ink is ejected onto the semiconductor chip on which the ink dots are formed when the X-axis table 128 is moved from the left to the right. Two will be formed.
[0092]
At this time, the ink dots formed later are formed below the previously formed ink dots as shown in FIG.
[0093]
One defective mark is formed by the four ink dots thus formed, and the defective semiconductor chip on the semiconductor wafer 200 can be easily identified by detecting the defective mark with an optical device (not shown). Will be able to.
[0094]
By the way, when the X-axis table 128 moves from right to left in FIG. 2 and all the defective semiconductor chips of the semiconductor wafer 200 are marked as defective, the series of operations is completed, and the semiconductor wafer 200 is moved to the semiconductor wafer mounting portion. The semiconductor chip is taken out from 129 and separated for each semiconductor chip by a separation device (not shown).
[0095]
At this time, the defective semiconductor chip is identified by the optical device or the like, and only good semiconductor chips are incorporated into an integrated circuit or the like, for example.
[0096]
As described above, according to the present embodiment, defective marks on a semiconductor chip are formed by ejecting ink droplets from the nozzle 126a by deformation of the piezoelectric element 126e that can be finely adjusted by voltage, and the nozzle 126a is provided on the surface of the semiconductor chip. Therefore, the size of the defective mark can always be made uniform, and the recognition of the defective mark in the subsequent process can be facilitated.
[0097]
Further, since the defect mark is formed from a plurality of, for example, four ink dots, the size of the defect mark can be arbitrarily adjusted. Accordingly, it is possible to easily satisfy the standards of a diameter of 200 to 600 μm required for a defective mark, ± 50 μm, and a thickness of 30 μm or less (target 25 μm or less).
[0098]
In this embodiment, the defective mark is formed by four ink dots, but other characters, symbols, or figures can be formed on the semiconductor chip.
[0099]
In this embodiment, the X-axis table 128 and the Y-axis table 127 are formed on the semiconductor wafer mounting portion 129 side. However, the present invention is not limited to this, and the X-axis table 128 and the Y-axis table 127 are connected to the inkjet head 126. You may attach to the side. Furthermore, either the X-axis table 128 or the Y-axis table 127 can be formed on the semiconductor wafer mounting portion side, and the other can be formed on the inkjet head 126 side.
[0100]
(Second Embodiment)
FIG. 4 is a diagram showing a main part of a semiconductor inspection apparatus according to the second embodiment of the present invention. Since the configuration of the semiconductor inspection apparatus according to the present embodiment is substantially the same as the configuration of the first embodiment described above, the following description will focus on differences from the first embodiment.
[0101]
In the present embodiment, the configuration of the head unit 226 is different from that of the first embodiment. That is, in the inkjet head 126 of the first embodiment, the nozzles 126a are arranged at a constant nozzle pitch on the semiconductor wafer 200 side, but in the present embodiment, an inkjet head 226h is provided in the head unit 226. The inkjet head 226h is provided with a nozzle 126a.
[0102]
That is, in this embodiment, unlike the first embodiment, the inkjet head 126 in which many nozzles 126a for the marking device 120 are specially arranged is not formed, and the existing inkjet head 226h of a printer, for example, is used. Is.
[0103]
For this reason, as shown in FIG. 4, the inkjet unit 226 h is arranged in the head unit 226 at a certain interval.
[0104]
As shown in FIG. 4, the interval between the inkjet heads 226h is the length A between both ends of the nozzle 226a of the inkjet head 226h as shown in FIG. Thus, for example, the nozzle pitch of the nozzles 226a of the inkjet head 226h arranged discontinuously, for example, is formed to be an integral multiple.
[0105]
The head unit 226 formed in this way is attached to the head angle indexing unit 125 instead of the inkjet head 126 of the first embodiment. Similarly to the first embodiment, the head unit 226 is inclined at an angle θ, for example, 80.07 degrees with respect to the X-axis direction, and the X-axis table 127 is moved relative to the semiconductor wafer 200. Move.
[0106]
The process in which the head unit 226 forms ink dots on the semiconductor chip of the semiconductor wafer 200 is the same as that in the first embodiment. However, the difference from the first embodiment is that the movement in the Y-axis direction is not only the movement of the ink dot pitch (line feed pitch (1)) but also the line feed pitch (2) as shown in FIG. Is also included.
[0107]
That is, as shown in FIG. 6, first, defective marks are formed in specific semiconductor chip rows, for example, rows 1, 2, 5, and 6, by (1) marking, (2) line feed pitch (1), and (3) marking. When finished, (4) line feed pitch (2) shown in FIGS. 5 and 6 is performed.
[0108]
In order to perform marking on the lines 3, 4, 7 and 8 with no defect mark at this (4) line feed pitch (2), (5) marking, (6) line feed pitch (1) and (7) Perform marking.
[0109]
This operation is performed as many times as necessary by moving the X-axis table 128 and the Y-axis table 127, and the marking of the defective mark on the semiconductor chip of the semiconductor wafer 200 is completed.
[0110]
As described above, according to the present embodiment, it is possible to form a uniform defect mark by attaching an inject head 226h such as an existing printer to the head unit 226 without providing a special ink jet head 126. A semiconductor inspection apparatus having a marking device that can be provided can be provided.
[0111]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a semiconductor wafer marking apparatus and a semiconductor inspection apparatus having the same that can easily and stably form a uniform marking mark on a semiconductor wafer.
[Brief description of the drawings]
FIG. 1 is a schematic view showing an outline of a semiconductor inspection apparatus according to a first embodiment of the present invention.
FIG. 2 is a schematic view showing the relationship between the inkjet head of FIG. 1 and a semiconductor wafer.
3 is a schematic cross-sectional view showing the configuration of the ink jet head of FIG. 1. FIG.
FIG. 4 is a schematic diagram showing a relationship between a head unit and an ink jet head of a semiconductor device according to a second embodiment of the present invention.
5 is a schematic view showing the relationship between the inkjet head of FIG. 4 and a semiconductor wafer.
6 is an explanatory diagram showing movement of the inkjet head and the semiconductor wafer of FIG.
FIG. 7 is a schematic view showing a conventional marking device.
8 is a schematic view showing a semiconductor wafer marked by the marking apparatus of FIG.
9 is a schematic cross-sectional view showing a main part of the inker of FIG.
[Explanation of symbols]
100: Semiconductor inspection apparatus
110 ... Tester device
120 ... Marking device
121: Data management unit
122... Control unit
123 ... Inkjet head controller
124... XY table control unit
125 ... Head angle indexing part
126 ... Inkjet head
127 ... Y-axis table
128 ... X-axis table
129 ... Semiconductor wafer mounting part
200: Semiconductor wafer
226 ... Head unit

Claims (9)

An inkjet head that discharges a marking liquid in a non-contact manner to a semiconductor chip formed on a semiconductor wafer;
A head controller for controlling the operation of the inkjet head;
Comprising
The length in the longitudinal direction of the portion where the nozzle formed in the inkjet head is arranged is formed to be equal to or longer than the length in the radial direction of the portion where the semiconductor chip of the semiconductor wafer is provided,
A marking device for a semiconductor wafer, wherein marks having different sizes are formed on the semiconductor wafer.   2. The semiconductor wafer marking device according to claim 1, further comprising a table portion on which the semiconductor wafer is placed. The table unit corresponds to the X axis and the Y axis orthogonal to each other in the plane coordinate system in the plane direction of the semiconductor wafer, and the X axis table and the Y axis table are
3. The semiconductor wafer marking device according to claim 2, wherein the marking device is provided separately.   4. The semiconductor wafer marking device according to claim 3, wherein at least one of the X-axis table and the Y-axis table is provided on the liquid discharge head side.   5. The semiconductor wafer according to claim 3, wherein the head control unit is configured to control the liquid discharge head so as to maintain a certain inclination with respect to a moving direction thereof. 6. Marking device.   A head angle adjustment unit is provided for matching the pitch between the semiconductor chips arranged in a direction orthogonal to the moving direction of the table unit and the nozzle pitch of the nozzle formed in the liquid ejection head. The marking device for a semiconductor wafer according to any one of claims 1 to 5, wherein:   7. The semiconductor wafer marking device according to claim 1, wherein the inkjet head is configured to form characters, symbols, or figures on the semiconductor wafer.   The semiconductor wafer marking device according to claim 1, wherein a plurality of the ink jet heads are arranged in a head unit.   A semiconductor inspection apparatus comprising the semiconductor wafer marking apparatus according to claim 1.

Images