TWI760131B - Pattern forming apparatus, pattern forming method, and discharge data generating method - Google Patents

Abstract

An object of the present invention is to provide a technique for forming a resist film of an appropriate thickness on a wiring board. The pattern forming apparatus includes: a holding part for holding a wiring board; a head part for ejecting ink droplets of the solder resist toward the surface of the wiring board by an inkjet method; and a moving mechanism for moving the head part relative to the The holding portion moves relatively in a direction parallel to the surface of the wiring board; and the ejection data generating portion generates ejection of ink per unit area based on the resist pattern data for expressing the pattern of the resist film Quantity of ejected data. Further, the pattern forming apparatus includes a control unit that controls the head and the moving mechanism based on the ejection data, thereby forming a pattern of the resist film on the wiring board. The ejection data generation unit generates the ejection data with different ejection amounts set for each type of pattern included in the resist pattern data.

Description

Pattern forming apparatus, pattern forming method, and ejection data generating method

The present invention relates to a technique for forming a pattern of a resist film on a wiring substrate.

In order to protect the conductive pattern which the wiring board has, a resist film may be formed on the wiring board. The resist film also has a function of preventing the solder from adhering to regions such as conductor wiring during the subsequent process of solder coating, so it is also called "solder resist". As one of the methods of forming a resist film, there is known a method of ejecting droplets of an ink of a solder resist toward a wiring board by an ink jet method. Such a technique is disclosed in Patent Document 1 and Patent Document 2, for example. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Laid-Open No. 9-283893. [Patent Document 2] Japanese Patent Application Laid-Open No. 2008-4820.

[The problem to be solved by the invention]

However, the pattern of the resist film formed on the wiring board differs depending on the purpose and location. When applying a certain amount of ink per unit area to the wiring board, the thickness (film thickness) of the resist film may not be the desired film thickness depending on the type of pattern. For example, in the case of a thin line-like pattern, there is a tendency that the thinner the line width, the lower the height. In addition, in the cross-shaped pattern in which the lines intersect, there is a tendency that the resist film is raised to increase the film thickness. Therefore, a technique for forming a resist film with an appropriate film thickness is required.

An object of the present invention is to provide a technique for forming a resist film of an appropriate thickness on a wiring board. [means to solve the problem]

In order to solve the above-mentioned problems, a first aspect is a patterning apparatus for forming a pattern of a resist film on a wiring board. The pattern forming apparatus is provided with: a holding part for holding the wiring board; a head part for ejecting ink droplets of the solder resist toward the surface of the wiring board by an ink jet method; The holding part moves relatively in a direction parallel to the surface of the wiring board; the ejection data generating part generates the ejection of ink per unit area based on the resist pattern data for expressing the pattern of the resist film A quantity of ejection data; and a control unit for controlling the head and the moving mechanism based on the ejection data, thereby forming a pattern of the resist film on the wiring substrate. The ejection data generation unit generates the ejection data with different ejection amounts set for each type of pattern included in the resist pattern data.

The second aspect is the patterning device of the first aspect. The pattern of the resist film includes: a linear first pattern having a first line width; and a linear second pattern having a second line width smaller than the first line width. The ejection data generating unit generates ejection data in which the ejection amount for the second pattern is set to a larger value than the ejection amount for the first pattern.

The third aspect is the patterning device of the first aspect or the second aspect. The pattern of the resist film includes a third pattern in a cross shape. The ejection data generating unit generates ejection data in which the ejection amount for the third pattern is set to a value smaller than a predetermined reference ejection amount.

The fourth aspect is the patterning device of the second aspect. The pattern of the resist film includes a third pattern in a cross shape. The ejection data generating unit generates ejection data in which the ejection amount for the third pattern is set to a value smaller than the ejection amount for the first pattern and the second pattern.

The fifth aspect is the patterning device of any one of the first aspect to the fourth aspect. The pattern forming apparatus further includes: a memory unit for storing correction table information that defines the discharge amount per unit area for a plurality of types of patterns. The ejection data generating unit includes: a pattern specifying unit that specifies, in the resist pattern data, a pattern registered in the correction table information; and an ejection amount setting unit that sets, based on the correction table information, a pattern specified by the pattern specifying unit. The amount of ejection of the specified pattern.

A sixth aspect is a pattern forming method for forming a pattern of a resist film on a wiring board. The pattern forming method includes: a step (a) of ejecting ink droplets of the solder resist from the head toward the surface of the wiring substrate by an inkjet method; step (b), in the step (a), the The head is relatively moved relative to the wiring board in a direction parallel to the surface of the wiring board; and step (c) is based on the type of the pattern of the resist film formed on the wiring board in the step (a) The amount of ink ejected per unit area is varied.

A seventh aspect is an ejection data generation method for generating ejection data used when ink droplets of solder resist are ejected from a head toward a wiring board by an inkjet method. The method for generating the ejection data includes: step (A), preparing resist pattern data to be formed on the wiring substrate; and step (B), setting each unit for each different type of pattern generation included in the resist pattern data Ejection data with different ejection amounts in area. [Inventive effect]

According to the pattern forming apparatuses of the first aspect to the fifth aspect, the ejection amount of the ink per unit area is increased or decreased according to the type of the pattern. Thereby, the resist film of an appropriate thickness can be formed on the wiring board for each type of pattern.

According to the pattern forming apparatus of the second aspect, the discharge amount per unit area of the second pattern having a small line width is set to be large, whereby a resist film having an appropriate thickness can be formed for the second pattern. on the wiring board.

According to the pattern forming apparatus of the third aspect, by setting the discharge amount per unit area of the cross-shaped third pattern that tends to increase in film thickness to be smaller than the reference discharge amount, it is possible to appropriately adjust the cross-shaped pattern. A thick resist film is formed on the wiring board.

According to the pattern forming apparatus of the fourth aspect, the discharge amount per unit area of the cross-shaped third pattern that tends to increase in film thickness is set to be smaller than that of the linear first and second patterns, whereby it is possible to A resist film having an appropriate cross pattern of the film is formed on the wiring board.

According to the pattern forming apparatus of the fifth aspect, the ejection amount per unit area for plural types of patterns is predetermined by the correction table information, whereby the ejection amount of each pattern included in the resist pattern data can be appropriately set.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the components described in this embodiment are merely examples, and are not shown to limit the scope of the present invention to these embodiments. For easy understanding, the drawings may exaggerate or simplify the size and number of various parts as required.

For the convenience of description, arrows showing the X-axis, the Y-axis, and the Z-axis which are orthogonal to each other are attached to FIG. 1 . Here, the Z axis is set parallel to the vertical direction, and the X axis and the Y axis are set parallel to the horizontal direction. In addition, in the following description, the direction which the front-end|tip of each arrow faces is set as the positive (+) direction, and the opposite direction is set as the negative (-) direction.

[1. Embodiment] FIG. 1 is a perspective view showing a pattern forming apparatus 1 according to an embodiment. The patterning apparatus 1 forms a pattern of a resist film on the surface 9a of a printed wiring board (hereinafter simply referred to as a "wiring board") 9 using a solder resist ink. The pattern forming apparatus 1 forms a pattern by an ink jet method. The wiring board 9 is, for example, a plate-shaped member made of glass epoxy resin. However, the wiring board 9 may have other shapes such as a sheet-like member having flexibility. The resist film protects the conductive pattern on the wiring board 9 . The conductive patterns include wirings, lands, and other patterns. The resist film is not formed in the areas where the solder paste is applied in the subsequent steps and other areas where the resist film should not be provided.

The patterning apparatus 1 includes an apparatus body 11 and a control unit 12 . The apparatus main body 11 includes a moving mechanism 2 , a head 3 , and a tank 4 . The moving mechanism 2 includes a Y-direction moving mechanism 2a and an X-direction moving mechanism 2b. The Y-direction moving mechanism 2 a moves the wiring board 9 in the Y-direction parallel to the surface 9 a of the wiring board 9 . The X-direction moving mechanism 2 b is perpendicular to the Y-direction, and moves the head 3 in the X-direction parallel to the surface 9 a of the wiring board 9 . Various mechanisms can be used as the Y-direction moving mechanism 2a and the X-direction moving mechanism 2b. For example, a ball screw mechanism mounted with a motor may be used, or a linear motor may be used.

The head 3 ejects minute droplets of the solder resist ink (hereinafter abbreviated as "ink") toward the wiring board 9 in the middle of the movement. The tank 4 stores ink supplied to the head 3 . The control unit 12 controls the moving mechanism 2 and the head 3 . The ink is supplied from the tank 4 to the head 3 via a tube 41 .

The Y-direction moving mechanism 2 a has a stage 21 for holding the wiring board 9 . The table 21 is an example of a holding portion. The wiring board 9 is held on the upper surface of the table 21 . A plurality of holes are formed on the surface of the table 21, and the holes are connected to a suction device not shown. By suction of air from the holes, the wiring board 9 is attracted to the upper surface of the stage 21 . In addition, the surface of the stage 21 may have a groove extending in the horizontal direction from the hole, and the area for sucking the wiring board 9 may be expanded by the groove. In addition, the surface of the stage 21 may be used as a porous member, and the wiring board 9 may be adsorbed through the porous member. In addition, the stage 21 may be provided with a mechanism for holding the mechanical properties of the wiring board 9 .

In the pattern forming apparatus 1 , as long as the head 3 moves relatively with respect to the table 21 , various configurations can be employed as the moving mechanism 2 . For example, the stage 21 may be fixed and the head 3 may be moved in the X direction and the Y direction. It is also possible that the head 3 moves in the Y direction and the stage 21 moves in the X direction.

The head 3 is provided with a discharge unit, and the discharge unit has a plurality of discharge ports arranged at equal intervals in the X direction. Droplets of ink are ejected from each ejection port in an ink jet manner. The ink is ejected in the −Z direction toward the surface 9 a of the wiring board 9 . Various structures can be used as the ink jet method, and a structure using a piezoelectric (piezo) or a structure using a heater can be used.

While ejecting ink droplets from the plurality of ejection ports, the stage 21 is moved in the Y direction parallel to the wiring board 9 by the Y direction moving mechanism 2a, thereby applying ink to the area extending in the Y direction. Hereinafter, the movement in the Y direction of the wiring board 9 is also referred to as "main scan". Actually, in one main scan of the wiring board 9 , a plurality of ink lines corresponding to the plurality of ejection ports are formed on the wiring board 9 . When one main scan is completed, the head 3 is slightly moved in the X direction parallel to the wiring board 9 by the X-direction moving mechanism 2b, and the wiring board 9 is moved in the −Y direction by the Y-direction moving mechanism 2a. Thereby, the second main scan is performed, and lines of ink are formed adjacent to the lines of ink formed in the previous main scan.

The main scanning is repeated a predetermined number of times, whereby a resist film is formed in a region having a width substantially equal to the array width of the plurality of heads in the X direction. Since the resist film is formed only in a necessary region, the pattern of the resist film is accurately formed. Hereinafter, the width substantially equal to the array width of the plurality of heads in the X direction is referred to as "cell width", and the region where the resist film is formed in this width is referred to as "cell region". When the resist film is formed in one unit area, the head 3 is moved in the X direction by the X direction moving mechanism 2b to reach the unit width, and the above-mentioned main scan is repeated, whereby the unit area adjacent to the previous unit area is moved. A resist film is formed. By repeating the formation of the resist film in the cell region and the movement of the head 3 in the X direction, a pattern of the resist film is formed in the entire necessary region on the wiring board 9 . In addition, a plurality of main scans may be performed on the same unit area. Thereby, the amount of ink applied to the unit area can be increased.

FIG. 2 is a diagram showing the configuration of the computer 5 included in the control unit 12 . The computer 5 is provided with: a CPU (Central Processing Unit; Central Processing Unit) 51, which performs various arithmetic processing; a ROM (Read Only Memory) 52, which stores basic programs; and a RAM (Random Access Memory; fetching memory) 53, which stores various information. In addition, the computer 5 includes: a hard disk 54 for storing information; a display 55 for displaying various information such as images; an input unit 56 for accepting input from an operator; The read recording medium 8 reads information; and the communication unit 58 transmits and receives signals between the communication unit 58 and the device body 11 . The input unit 56 includes a keyboard 56a and a mouse 56b. The recording medium 8 is, for example, an optical disk, a magnetic disk, an optical disk, or a memory card.

In the computer 5 , the program 80 is read out from the recording medium 8 via the reading device 57 in advance and stored in the hard disk 54 . The program 80 can also be stored on the hard disk 54 via a network. The CPU 51 executes arithmetic processing using the RAM 53 and the hard disk 54 in accordance with the program 80 . The CPU 51 functions as an arithmetic unit in the computer 5 . In addition, the computer 5 may be provided with another processor (GPU (Graphics Processing Unit; Graphics Processing Unit), etc.) that functions as an arithmetic unit other than the CPU 51 .

FIG. 3 is a diagram showing a functional configuration realized by the computer 5 . The computer 5 functions as the ejection data generation unit 61 and the memory unit 62 . The memory unit 62 corresponds to the RAM 53 and the hard disk 54 . The ejection data generation unit 61 includes a pattern specifying unit 611 and an ejection amount setting unit 612 . In addition, the ejection data generation unit 61 may be realized by a plurality of computers. In addition, all or part of the functions of the ejection data generation unit 61 may be implemented in hardware by a dedicated electrical circuit.

The memory portion 62 is the memristor pattern data 71 , the correction table information 73 , and the ejection data 75 . The resist pattern data 71 and the correction table information 73 may be provided by the computer 5 via, for example, the reading device 57 or the communication unit 58 , or may be generated using the computer 5 . The functions of the pattern specifying unit 611 and the discharge amount setting unit 612 are described in detail in the description of the operation of the pattern forming apparatus 1 .

FIG. 4 is a diagram showing the flow of the operation of the pattern forming apparatus 1 . In FIG. 4 , steps S12 to S14 are arithmetic processing performed by the control unit 12 , and step S15 is an operation of the apparatus body 11 that is controlled by the control unit 12 .

First, the resist pattern data 71 and the correction table information 73 are prepared and stored in the memory unit 62 (step S11). The resist pattern data 71 is information for showing the pattern of a predetermined resist film formed on the surface 9 a of the wiring board 9 . The resist pattern data 71 may also be vector data at the stage of being stored in the memory unit 62, but may be appropriately converted into raster data. The correction table information 73 is information used to set the amount of ink per unit area (hereinafter simply referred to as "discharge amount") to be ejected by the head 3 according to the type of predetermined pattern. In addition, in this embodiment, "pattern" means the shape of the resist film formed on a part of the whole resist film of the wiring board 9, and does not mean the whole resist film formed on the wiring board 9.

FIG. 5 is a plan view schematically showing a part of the wiring board 9 on which the resist films 911 , 913 , and 93 of plural kinds of patterns are formed. FIG. 6 is a cross-sectional view schematically showing a part of the wiring board 9 on which the resist films 911 , 913 , and 93 having a plurality of patterns are formed. The resist films 911 and 913 are linear patterns, and the resist film 93 is a pattern applied in a planar shape having a certain area or more.

A plurality of (here, four) conductive patterns 81 are arranged at intervals on the surface 9 a of the wiring board 9 . Specifically, the conductive pattern 81 is a circuit pattern formed by etching a film of copper having a predetermined thickness. The upper side of each conductive pattern 81 is covered with solder 85 . The resist film 911 belonging to the linear pattern is provided between the adjacent conductive patterns 81 and 81 . As shown in FIG. 6 , each resist film 911 functions as an insulating dam so that the solders 85 and 85 covering the adjacent conductive patterns 81 and 81 do not come into contact with each other.

Similar to the resist film 911, the resist film 913 also has a linear pattern. However, the resist film 913 has a line width L2 larger than the line width L1 of the resist film 911 .

A conductive pattern 83 is formed on the surface 9 a of the wiring board 9 . The resist film 93 covers the portion other than the front end of the conductive pattern 83 and has a circular opening 931 for exposing the front end of the conductive pattern 83 to the outside.

In this way, the patterning apparatus 1 forms patterns of various shapes and sizes on the wiring board 9 based on the resist pattern data 71 in addition to the resist films 911 , 913 , and 93 shown in FIGS. 5 and 6 .

Returning to FIG. 4 , the pattern specifying unit 611 specifies the registered pattern included in the resist pattern data 71 (step S12 in FIG. 4 ). The registered pattern is a pattern defined by the correction table information 73 as described later (see FIG. 7 ). The pattern specifying unit 611 searches the resist pattern data 71 for a part that matches each registered pattern and finds a registered pattern, and transmits the specific information 711 for displaying the size and position of the area occupied by the registered pattern to The discharge amount setting unit 612 .

FIG. 7 is a diagram showing an example of the correction table information 73 . In the correction table information 73, plural "substrate types" are specified as processing conditions when forming the resist pattern. In addition, in the correction table information 73, one or a plurality of "copper thicknesses" are specified as conditions for various "substrate types". The copper thickness is the thickness of the conductive pattern (for example, the thickness of the conductive pattern 83 shown in FIGS. 4 and 5 ) composed of copper included in the wiring board 9 before forming the resist film. In addition, in the correction table information 73, one or a plurality of "surface treatments" are specified as conditions for various "copper thicknesses". "Surface treatment" is a condition showing the treatment state of the surface 9a of the wiring board 9, and specifically includes buff polishing and material.

In addition, in the correction table information 73, a plurality of "registered patterns" and "discharge amount (dot area ratio)" are defined in one-to-one correspondence with each "surface treatment". Specifically, as the "registration pattern", the following are specified: "Line", which shows a linear pattern; "SRO (short range order; short-range order) intersection point", which shows a cross-shaped pattern; and "SRO middle line", which shows The pattern formed in the middle region is shown, and the middle region connects the intersections formed between the SROs. In addition, 70 μm, 100 μm, and 150 μm are specified as different line widths for “line”.

In step S12 shown in FIG. 4 , first, the pattern specifying unit 611 specifies the processing conditions (substrate type, copper thickness, surface treatment) corresponding to the wiring substrate 9 to be processed. In addition, the processing conditions of the wiring board 9 may be specified in advance based on information given to the control unit 12 by the user. The pattern specifying unit 611 searches the resist pattern data 71 and finds a registered pattern corresponding to the processing conditions specified by the correction table information 73, and specifies the size and position of the registered pattern.

The resist pattern data 71 is data for displaying an image of the pattern of the resist film, and is specified for each pixel to display a value of "1" to be assigned ink or a value of "0" to display no ink assigned to it . Hereinafter, the value for indicating whether or not the ink is applied will be referred to as an "applied value". The discharge amount setting unit 612 sets a given value for each pixel represented by the resist pattern data 71 . That is, the ejection amount setting unit 612 sets the value "1" for the pixel to which the ink is applied, and further sets the ejection amount per unit area. The discharge amount is a value corresponding to the film thickness of the resist film. That is, basically, the larger the ejection amount, the larger the film thickness.

Basically, the ejection amount setting unit 612 sets a predetermined reference ejection amount for the pixels to which the ink is applied (step S13 in FIG. 4 ). In addition, the ejection amount setting unit 612 sets the ejection amount specified by the correction table information 73 for the pixels corresponding to the specified registration pattern when the registered pattern is specified in the resist pattern data 71 by the pattern specifying unit 611 . That is, the ejection amount setting unit 612 sets the ejection amount for the registered pattern specified by the pattern specifying unit 611 based on the correction table information 73 . Then, the ejection amount setting unit 612 generates ejection data 75 for displaying the set ejection amount for each pixel, and stores the ejection data 75 in the memory unit 62 (step S14 in FIG. 4 ).

The device body 11 receives the ejection data 75 from the control unit 12 , and controls the head 3 and the moving mechanism 2 according to the ejection data 75 . Specifically, a step of ejecting ink droplets from the head 3 toward the wiring board 9 , and a step of relatively moving the head 3 with respect to the wiring board 9 in a direction parallel to the wiring board 9 are performed in parallel. Thereby, the ink is applied to the wiring board 9, and the pattern of the resist film corresponding to the resist pattern data 71 is formed (step S15 in FIG. 4).

As described above, in the correction table information 73 shown in FIG. 7 , the discharge amount is set for each registered pattern. In addition, in the pattern forming apparatus 1, the dot area ratio is used as the discharge amount. Therefore, in the correction table information 73, the dot area ratio is used as the discharge amount. In the example shown in FIG. 7 , the standard discharge amount is set to 60% at the halftone area ratio.

In the correction table information 73 shown in FIG. 7 , when focusing on the linear pattern (line), it is specified that the smaller the line width, the larger the ejection amount. The reason for this is that the thinner the line width is, the thinner the film thickness becomes. In addition, in the case where the surface treatment of the wiring board 9 is buffing, the discharge amount is set to be larger than that in the case of the material. This is because the film thickness of the linear pattern tends to be thinner in the case of buffing than in the case of the material. In addition, the discharge amount for the cross-shaped pattern (SRO intersection) is specified to be a smaller value (eg, 50%) than the discharge amount for the line-shaped pattern. This is because the film thickness of the cross-shaped pattern tends to be large.

FIG. 8 is a cross-sectional view schematically showing a wiring board 9 on which a resist film having a plurality of patterns is formed. In addition, the upper stage of FIG. 8 shows each resist film when the resist film is formed with a certain reference discharge amount, and the lower stage of FIG. 8 shows the case where the discharge amount is changed based on the correction table information 73 . The resist films 911, 912, and 913 are linear patterns, and the line widths are set to 70 μm, 100 μm, and 150 μm. The resist film 94 shows a cross-shaped pattern. In addition, the resist films 911 , 912 , and 913 are formed so that the line widths increase in the order of the resist films 911 , 912 , and 913 . In addition, the dotted line LN1 shows the surface height (film thickness) of the resist film on design.

As shown in the upper part of FIG. 8 , in the case where each resist film is formed with a certain reference discharge amount, the resist film 913 with a larger line width has a sufficient thickness; The resist films 911 and 912 do not have the necessary thickness. In addition, the resist film 94 becomes larger than the target film thickness. On the other hand, in the correction table information 73, for the linear pattern, the smaller the line width is, the larger the discharge amount is set. Therefore, the resist films 911 and 912 with a small line width can also be set to a target height. In addition, in the correction table information 73, the discharge amount (50%) smaller than the reference discharge amount (60%) is set for the intersecting pattern (SRO intersection). Therefore, the film thickness of the resist film 94 belonging to the cross-shaped pattern can be matched to the designed film thickness.

In the pattern forming apparatus 1 , since the discharge amount of ink per unit area is set according to the type of pattern, a resist film having an appropriate thickness can be formed on the wiring board 9 for each type of pattern.

[2. Variations] In the above-described embodiment, the registration pattern specified in the correction table information 73 is assumed to be another size or shape (eg, a curved pattern or a zigzag pattern), and is not limited to the pattern shown in FIG. 7 .

In addition, in the above-described embodiment, the discharge amount is changed by changing the dot area ratio, but this is not essential. For example, the ejection amount may be changed by changing the size of the ink droplets ejected by the head 3 or the ejection frequency per unit time.

Although the present invention has been described in detail, the above description is merely an example in all the embodiments and modifications, and the present invention is not limited to the above-described embodiments and modifications. It can be construed that countless variations not illustrated can be conceived without departing from the scope of the present invention. The respective configurations described in the above-described respective embodiments and respective modified examples can be appropriately combined or omitted as long as they do not contradict each other.

1: Patterning device 2: Mobile Mechanism 2a: Y-direction moving mechanism 2b: X-direction moving mechanism 3: head 4: Slot 5: Computer 8: Recording Media 9: Wiring board (printed wiring board) 9a: Surface 11: Device body 12: Control Department 21: Desk 41: Tube 51: CPU 52: ROM 53: RAM 54: Hard Disk 55: Display 56: Input part 56a: Keyboard 56b: Mouse 57: Reader 58: Communications Department 61: Ejection Data Generation Department 62: Memory Department 71: Resist pattern information 73: Correction table information 75: Squirting data 80: Program 81,83: Conductive pattern 85: Solder 93,94,911,912,913: Resist Film 611: Pattern specific part 612: Discharge amount setting part 711: Specific information 931: Opening L1, L2: Line width LN1: dotted line

1 is a perspective view showing a pattern forming apparatus according to an embodiment. [FIG. 2] It is a figure which shows the structure of the computer which the control part has. [Fig. 3] is a diagram showing the functional structure realized by the computer. 4 is a diagram showing the flow of the operation of the pattern forming apparatus 1 . [ Fig. 5] Fig. 5 is a plan view schematically showing a part of a wiring board on which a resist film having a plurality of patterns is formed. [ Fig. 6] Fig. 6 is a cross-sectional view schematically showing a part of a wiring board on which a resist film having a plurality of patterns is formed. Fig. 7 is a diagram showing an example of correction table information. [ Fig. 8] Fig. 8 is a cross-sectional view schematically showing a wiring board on which a resist film having a plurality of patterns is formed.

61: Ejection Data Generation Department

62: Memory Department

71: Resist pattern information

73: Correction table information

75: Squirting data

611: Pattern specific part

612: Discharge amount setting part

711: Specific information

Claims (8)

A pattern forming apparatus for forming a pattern of a resist film on a wiring board, comprising: a holding part for holding the wiring board; and a head for directing ink droplets of a solder resist toward the wiring by an inkjet method The surface of the substrate is ejected; the moving mechanism moves the head relative to the holding portion in a direction parallel to the surface of the wiring substrate; the ejection data generating portion is based on the resistance of the pattern used to express the resist film. The agent pattern data generates ejection data showing the ejection amount of ink per unit area; and a control unit controls the head and the moving mechanism based on the ejection data, thereby forming a pattern of the resist film on the wiring substrate ; The aforementioned ejection data generating section generates the aforementioned ejection data with different ejection amounts for each different type of pattern included in the aforementioned resist pattern data; the aforementioned pattern of the resist film comprises: a linear first pattern, which is The first line width; and the linear second pattern, which is a second line width smaller than the first line width; The ejection data of the first pattern has a larger ejection amount. The pattern forming apparatus as claimed in claim 1, wherein the pattern of the resist film includes a third cross-shaped pattern; The ejection data generating unit generates ejection data in which the ejection amount for the third pattern is set to a value smaller than the ejection amount for the first pattern and the second pattern. A pattern forming apparatus for forming a pattern of a resist film on a wiring board, comprising: a holding part for holding the wiring board; and a head for directing ink droplets of a solder resist toward the wiring by an inkjet method The surface of the substrate is ejected; the moving mechanism moves the head relative to the holding portion in a direction parallel to the surface of the wiring substrate; the ejection data generating portion is based on the resistance of the pattern used to express the resist film. The agent pattern data generates ejection data showing the ejection amount of ink per unit area; and a control unit controls the head and the moving mechanism based on the ejection data, thereby forming a pattern of the resist film on the wiring substrate The above-mentioned ejection data generation part generates the above-mentioned ejection data with different ejection amounts for each different type of pattern included in the above-mentioned resist pattern data; the pattern of the above-mentioned resist film is composed of a cross-shaped third pattern; The data generating unit generates ejection data in which the ejection amount for the third pattern is set to a value smaller than a predetermined reference ejection amount. A pattern forming apparatus for forming a pattern of a resist film on a wiring board, and comprising: a holding part for holding the wiring board; The head part ejects the ink droplets of the solder resist toward the surface of the wiring board by an inkjet method; the moving mechanism makes the head part opposite to the holding part in a direction parallel to the surface of the wiring board The ejection data generation unit generates ejection data for displaying the ejection amount of ink per unit area based on the resist pattern data for expressing the pattern of the resist film; the control unit controls the aforementioned ejection data based on the aforementioned ejection data. the head and the moving mechanism, whereby a pattern of the resist film is formed on the wiring board; and the memory portion is for storing correction table information, and the correction table information defines the ejection amount per unit area for a plurality of patterns; The above-mentioned ejection data generation part generates the above-mentioned ejection data with different ejection amounts for each different type of patterns included in the above-mentioned resist pattern data; The data specifies the pattern registered in the correction table information; and the ejection amount setting unit sets the ejection amount for the pattern specified by the pattern specification unit based on the correction table information. A pattern forming method for forming a pattern of a resist film on a wiring substrate, comprising: step (a), spraying ink droplets of the solder resist from a head toward the surface of the wiring substrate by an inkjet method; Step (b), in the step (a), the head portion is relatively moved relative to the wiring board in a direction parallel to the surface of the wiring board; and step (c), in the step (a) The amount of ink ejected per unit area is different according to the type of the pattern of the resist film formed on the wiring substrate; the pattern of the resist film includes: a linear first pattern, which is a first line width; and The line-shaped second pattern is a second line width smaller than the first line width; in the step (c), the ejection amount for the second pattern is larger than the ejection amount for the first pattern . A pattern forming method for forming a pattern of a resist film on a wiring substrate, comprising: step (a), spraying ink droplets of the solder resist from a head toward the surface of the wiring substrate by an inkjet method; Step (b), in the step (a), the head portion is relatively moved relative to the wiring board in a direction parallel to the surface of the wiring board; and step (c), in the step (a) According to the type of pattern of the resist film formed on the wiring substrate, the amount of ink ejected per unit area is different; the pattern of the resist film includes a third cross-shaped pattern; in the aforementioned step (c), The ejection amount for the third pattern is smaller than the predetermined reference ejection amount. A method for generating ejection data, which is used to generate ejection data used when ink droplets of solder resist are ejected from a head toward a wiring substrate by an inkjet method, and comprises: step (A), preparing to form on the wiring substrate the resist pattern data; and Step (B) is to generate ejection data with different ejection amounts per unit area for each different type of pattern included in the resist pattern data; the resist pattern data includes: linear first pattern data , the aforesaid first pattern is a first line width; and the data of a linear second pattern, the aforesaid second pattern is a second line width smaller than the aforesaid first line width; in the aforesaid step (B), for The ejection data is generated such that the ejection amount of the second pattern becomes larger than the ejection amount of the first pattern. A method for generating ejection data, which is used to generate ejection data used when ink droplets of solder resist are ejected from a head toward a wiring substrate by an inkjet method, and comprises: step (A), preparing to form on the wiring substrate The resist pattern data; and step (B), for each different type of patterns included in the resist pattern data, the ejection data with different ejection amounts per unit area are generated; the above-mentioned resist pattern data includes cross-shaped patterns data of the third pattern; in the step (B), the ejection data is generated in such a way that the ejection amount for the third pattern becomes smaller than the ejection amount for the first pattern and the second pattern.

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