TWI717086B - Pattern forming apparatus, pattern forming method and ejection data generation method - Google Patents

Abstract

A pattern forming apparatus ejects droplets of ink of solder resist by inkjet method toward a wiring board (9) to form a pattern of a resist film (92a) on the wiring board (9). An air flow is generated around a through hole by suction to hold the wiring board (9). While forming a pattern of ink of solder resist on the wiring board (9), an ink ejection amount per area to a peripheral applying region (94) around a suction hole (91a) which is a through hole where a suction flow is generated is made larger than that to a region outside the peripheral applying region (94). This makes it possible to form an appropriate resist film on the wiring board (9).

Description

Pattern forming device, pattern forming method, and ejection data generating method

The present invention relates to a technique for forming a pattern on a wiring substrate by ink jet.

Conventionally, the purpose of forming a resist film on a wiring board is to protect the conductor pattern on the wiring board. The resist film also has the task of preventing solder from adhering to areas such as conductor wiring during post-process solder coating, and is also called "solder resist." As a method of forming a resist film, there is known a method of ejecting droplets of solder resist ink to a wiring board by an inkjet method. Such a technique has been disclosed in Japanese Patent Application Publication No. 9-283893 and Japanese Patent Application Publication No. 2008-4820, for example.

However, since the wiring board may be warped or distorted, if the wiring board is simply placed on a stage, a part of the wiring board will be separated from the stage. Therefore, the wiring board is preferably held on the mounting table by suction. On the other hand, most wiring boards have through holes. When a wiring board having a through hole is held on the mounting table, there may be a case where an air flow is generated in the through hole.

When the air flow in which the air is sucked in is generated in the through hole, the ink droplets flying in the inkjet method will be attracted by the through hole and attached to the inner surface of the through hole or the droplets enter the mounting table The concern of the attraction department. The droplets arriving on the wiring board will also deviate from the design position. When the arrival position of the ink droplets deviates, the ink may adhere to unnecessary areas or produce areas with insufficient ink adhesion.

As described above, when air is attracted by the through hole, ink cannot be properly applied around the through hole, and the resist film will not become the designed shape or thickness. Such a problem is not limited to the application of solder resist ink, and it may occur even when characters or graphics are drawn on the wiring board by inkjet or when liquids for other purposes are applied on the wiring board. .

The present invention relates to a pattern forming device for applying ink on a wiring substrate, thereby forming a pattern of the ink on the wiring substrate. A preferred aspect of the pattern forming apparatus of the present invention is provided with: a holding portion for holding the wiring substrate with through holes on a plane by suction; and a head portion for discharging droplets of the ink by inkjet Ejected to the wiring board; a moving mechanism that relatively moves the head relative to the holding portion in a direction parallel to the wiring board; and a control portion that controls the head and the moving mechanism to act as a surrounding In the ink application area around the through-hole that generates suction flow when sucked by the holding portion, the ejection amount of the ink per unit area is set to be higher than that of the surrounding area. The ejection amount of the ink per unit area in the area outside the application area is greater and the pattern of the ink is formed on the wiring board.

According to the present invention, it is possible to form a pattern on a wiring substrate by inkjet Then form an appropriate pattern around the through hole.

Preferably, the control portion includes: a memory portion, which stores through hole data and ink pattern data, the through hole data represents the pattern of the through hole, and the ink pattern data It represents the design pattern of the aforementioned ink; and the ejection data generating section generates ejection data based on the aforementioned through-hole data and the aforementioned ink pattern data, and the aforementioned ejection data represents the direction from the head to each of the wiring boards. The amount of the aforementioned ink ejected from the position.

More preferably, the ejection data generating section sets an ejection prohibition area on the inner periphery of the design coating area around the through hole, and sets the peripheral provision area outside the ejection prohibition area.

Preferably, in the aforementioned peripheral provision area, the ejection amount of the ink per unit area increases as it approaches the through hole.

Preferably, in the peripheral providing area of all the through-holes included in the wiring board, the ejection amount of the ink per unit area is greater than that of each unit area in the area outside the peripheral providing area. The ejection amount of the aforementioned ink is larger.

Preferably, in the peripheral providing area of all the through holes that generate suction when sucked by the holding portion, the ejection amount of the ink per unit area is greater than the area outside the peripheral providing area The ejection amount of the aforementioned ink per unit area is more.

Another preferred form of the pattern forming apparatus of the present invention is provided with: a holding portion for holding a wiring substrate with through holes on a plane by suction; a head portion for discharging droplets of the aforementioned ink by inkjet Spray to the aforementioned wiring board; the moving mechanism is the aforementioned The head portion relatively moves in a direction parallel to the wiring board with respect to the holding portion; and the control portion controls the head and the moving mechanism, thereby forming the ink pattern on the wiring board; the control portion It is provided with: a memory unit for storing through hole data and ink pattern data, the through hole data represents the pattern of the through hole, the ink pattern data represents the pattern on the design of the ink; and the ejection data generating unit , The ejection data is generated based on the through hole data and the ink pattern data. The ejection data represents the amount of the ink ejected from the head to each position on the wiring board; the ejection data generating unit is in The inner circumference of the ink application area in the design around the through hole is set to an ejection prohibition area.

According to the present invention, it is possible to form an appropriate pattern around the through hole when the pattern is formed on the wiring substrate by the inkjet method.

The present invention also relates to a pattern forming method for applying ink on a wiring substrate, thereby forming a pattern of the ink on the wiring substrate. A pattern forming method of a preferred form of the present invention includes: a) step of holding the above-mentioned wiring substrate with through holes on a plane by suction by the holding portion; b) step of using an inkjet method The ink droplets are ejected from the head to the wiring board; and c) step is to move the head relative to the wiring board in a direction parallel to the wiring board; by the step b) and the foregoing c) A step of setting the ejection amount of the ink per unit area in the ink application area around the through-hole that is sucked when sucked by the holding portion as a surrounding area. The ejection amount of the ink per unit area is greater than the area outside the surrounding provision area, and the pattern of the ink is formed on the wiring board.

The present invention also relates to a method for generating ejection data, which is used when ink droplets are ejected from the head to the wiring substrate by an inkjet method. A preferred aspect of the ejection data generation method of the present invention includes the steps of preparing through hole data and ink pattern data. The through hole data represents the pattern of through holes on the wiring substrate, and the ink pattern data represents The pattern of the ink on the design of the wiring board; and the process of generating the ejection data based on the through hole data and the ink pattern data. The ejection data is provided as a surrounding area and the wiring board is drawn by suction. When held on a flat surface, the ink application area around the through-hole that generates suction is set to have a discharge amount of ink per unit area per unit area in the area outside the peripheral application area. The ink ejection volume is more.

Another preferred form of the ejection data generation method of the present invention includes the steps of preparing through hole data and ink pattern data. The through hole data represents the pattern of through holes on the wiring substrate, and the ink pattern data represents The design of the ink pattern on the wiring substrate; and the process of generating the ejection data based on the through hole data and the ink pattern data, the ejection data being used when the wiring substrate is held on a flat surface by suction The inner peripheral portion of the ink application area in the design around the through hole that generates the suction flow is set to an ejection prohibition area.

The above-mentioned objects and other objects, features, aspects and advantages are understood with reference to the accompanying drawings and the following detailed description of the present invention.

1: Pattern forming device

2: mobile agency

2a: Y direction moving mechanism

2b: X direction moving mechanism

3: head

4: slot

5: Computer

8: Recording media

9: Wiring board (printed wiring board)

11: body

12: Control Department

21: Mounting table (holding part)

41: pipe fittings

51: Central Processing Unit

52: ROM

53: RAM

54: fixed disk

55: display

56: Input section

56a: keyboard

56b: Mouse

57: reading device

58: Ministry of Communications

61: Ejection data generation department

62: Memory Department

71: Through hole data

72: Ink pattern data

73: Platform Information

75: Squirting data

80: program

91: Through hole

91a: suction hole

92, 92a: Resist film

93: Ejection prohibited area

94: surrounding area

211: Suction Hole

212: groove

611: Correction Department

612: suction hole specific part

613: Conversion Department

901: void area (area)

911: inner circumference

920: coating area (area)

921: inner periphery

X, Y, Z: direction

[Figure 1] is a perspective view showing the appearance of the pattern forming device.

[Figure 2] is a diagram showing the structure of a computer.

[Figure 3] is a diagram showing the functional composition realized by a computer.

[Fig. 4] A diagram showing the flow of the operation of the pattern forming apparatus.

[Figure 5] A plan view of the mounting table.

[Fig. 6] is a plan view showing the state where the wiring board has been placed on the mounting table.

[Fig. 7] A longitudinal sectional view showing an aspiration hole.

[Figure 8] is a diagram showing the flight of a droplet without suction.

[Figure 9] A diagram showing the flight of a droplet with suction.

[Fig. 10] A diagram showing a resist film in which there is suction and no correction is made.

[Fig. 11] A longitudinal cross-sectional view showing the ejection prohibited area and the surrounding area.

[Fig. 12] A plan view showing the ejection prohibited area and the surrounding area.

[Figure 13] is a diagram showing the profile of the amount of ink on the design.

[Figure 14] is a diagram showing the contour of the corrected ink volume.

[Figure 15] is a diagram showing another example of the contour of the corrected ink volume.

[Figure 16] is a diagram showing another example of the contour of the corrected ink volume.

FIG. 1 is a perspective view showing the appearance of the pattern forming device 1. The pattern forming apparatus 1 applies a solder resist ink on a printed wiring board (hereinafter referred to as “wiring board”) 9 to form a resist film pattern on the wiring board 9. Although the wiring board 9 is preferably plate-shaped The member may be a sheet-shaped member having flexibility. The resist film protects the conductor pattern on the wiring board 9. The conductor pattern includes wiring, land, and other patterns. The resist film is not formed in the area where the solder paste is applied in the subsequent process, or other areas where the resist film is not provided.

The pattern forming apparatus 1 includes a main body 11 and a control unit 12. The main body 11 is equipped with a Y-direction moving mechanism 2a, which moves the wiring board 9 in the Y direction parallel to the wiring board 9, and a head 3, which sprays solder resist ink (hereinafter referred to as " Ink"); X-direction moving mechanism 2b, which moves the head 3 in the X direction perpendicular to the Y direction and parallel to the wiring substrate 9; and a tank 4, which stores and supplies to the head 3 Of ink. Hereinafter, the Y-direction moving mechanism 2a and the X-direction moving mechanism 2b are collectively referred to as "moving mechanism 2". As the Y-direction moving mechanism 2a and the X-direction moving mechanism 2b, multiple mechanisms can be used. For example, a ball screw mechanism with a motor can be used, or a linear motor can be used. The control unit 12 controls the moving mechanism 2 and the head 3. The ink system is supplied from the tank 4 to the head 3 via a tube 41.

The Y-direction moving mechanism 2a has a holding portion 21 that holds the wiring board 9. In this embodiment, the holding part 21 is a mounting table, and the holding part 21 is called "the mounting table 21" below. The wiring board 9 is held on the mounting table 21 by suction. The upper surface of the mounting table 21 is substantially flat, and the mounting table 21 holds the wiring board 9 on the flat surface. In this embodiment, as described later, a groove extending in the horizontal direction from a hole provided on the surface of the mounting table 21 is formed, and the hole is connected to a suction device (not shown). The air is sucked from the hole, so that the wiring board 9 can be sucked in the groove area (refer to FIG. 5). The holding of the wiring board 9 can also be performed by other plural methods. For example, a plurality of holes may be formed on the surface of the mounting table 21 and suction may be performed from the plurality of holes. The mounting table 21 can also be made of porous material. It is formed and sucked from the porous material.

The head 3 is provided with a discharge unit, and the discharge unit has a plurality of discharge ports arranged at equal intervals in the X direction. The ink droplets are ejected from each ejection port in an ink-jet manner. The ink is ejected toward the wiring board 9 in the (-Z) direction of FIG. 1. As the inkjet system, a plurality of structures can be used, and the usable structure is a structure using a piezo or a structure using a heater.

While ejecting ink droplets from a plurality of ejection ports, the mounting table 21 is moved in the Y direction parallel to the wiring substrate 9 by the Y direction moving mechanism 2a, whereby ink can be applied to the area extending in the Y direction. Hereinafter, the movement of the wiring board 9 in the Y direction is also referred to as "main scanning". In fact, in one main scan of the wiring board 9, a plurality of ink lines corresponding to a plurality of ejection ports are formed on the wiring board 9. When one main scan is completed, the head 3 is slightly moved in the X direction parallel to the wiring substrate 9 by the X direction moving mechanism 2b, and the wiring substrate 9 is moved in the (-Y) direction by the Y direction moving mechanism 2a. Thereby, the second main scan can be performed and the ink lines are formed adjacent to the lines of the ink formed by the previous main scan.

The main scan is repeatedly performed a predetermined number of times, whereby a resist film is formed in an area having a width substantially equal to the arrangement width of the plurality of ejection ports in the X direction. Since the resist film is formed only in the necessary area, the pattern of the resist film can be formed accurately. Hereinafter, the width substantially equal to the arrangement width of the plurality of ejection ports in the X direction is referred to as "cell width", and the area where the resist film is formed with this width is referred to as "cell area". When a resist film is formed in a unit area, the head 3 is moved in the X direction by the X-direction moving mechanism 2b to reach the unit width, and is adjacent to the previous unit area by repeatedly performing the above-mentioned main scan A resist film is formed in the cell area.

The formation of the resist film on the cell area and the movement of the head 3 in the X direction are repeated, thereby forming a pattern of the resist film on the entire necessary area of the wiring substrate 9.

FIG. 2 is a diagram showing the configuration of the computer 5 included in the control unit 12. Computer 5 has become a general computer system including CPU (Central Processing Unit) 51, ROM (Read Only Memory) 52 and RAM (Random Access Memory) 53. The CPU 51 performs various calculations, the ROM 52 stores basic programs, and the RAM 53 stores various information. The computer series 5 further includes: a fixed disk 54 for information storage; a display 55 for displaying various information such as images; a keyboard 56a and a mouse as the input unit 56 ( mouse) 56b, which accepts input from the operator; reading device 57, which reads information from a computer-readable recording medium 8 such as optical discs, magnetic discs, magneto-optical discs, and memory cards; and The communication unit 58 transmits and receives signals to and from the main body 11.

The computer 5 reads the program 80 from the recording medium 8 via the reading device 57 in advance and stores it on the fixed disk 54. The program 80 can also be stored on the fixed disk 54 via a network. The CPU 51 executes arithmetic processing while using the RAM 53 or the fixed disk 54 in accordance with the program 80. The CPU 51 has a function as an arithmetic unit in the computer 5. It is also possible to adopt other configurations that have a function as an arithmetic unit other than the CPU 51.

FIG. 3 is a diagram showing the functional structure realized by the computer 5 executing arithmetic processing according to the program 80. These functional configurations include a discharge data generation unit 61 and a storage unit 62. The memory 62 corresponds to the RAM 53 and the fixed disk 54 and so on. The ejection data generation unit 61 includes a correction unit 611 and a conversion unit 613. The correcting part 611 includes a suction hole specifying part 612 as needed. All or part of these functions can also be realized by dedicated electronic circuits. In addition, multiple computers can also be used to implement these functions.

FIG. 4 is a diagram showing the flow of the operation of the pattern forming apparatus 1. Steps S12 to S14 in FIG. 4 are arithmetic processing performed by the control unit 12, and step S15 is an operation of the main body 11 performed by the control of the control unit 12. The through hole data 71 and the ink pattern data 72 input via the communication unit 58 and the reading device 57 and the like are stored and prepared in the storage unit 62 in advance (step S11). The through hole data 71 indicates the position and size of the through hole of the wiring substrate 9, that is, the pattern of the through hole. The ink pattern data 72 indicates the resist pattern to be formed on the design of the wiring substrate 9. The through hole data 71 and the ink pattern data 72 may be vector data or raster data. The storage unit 62 memorizes and prepares mounting table information 73 as needed. The mounting table information 73 indicates the area where suction is performed on the mounting table 21, that is, the area where the wiring substrate 9 is suctioned.

FIG. 5 is a plan view of the mounting table 21. The mounting table 21 is provided with suction holes 211 at equal intervals in the X direction and the Y direction. The suction hole 211 is opened on the surface of the mounting table 21. The suction hole 211 is connected to a suction device, such as a vacuum pump, via the inside of the mounting table 21. The suction hole 211 may also be connected to a vacuum pipe installed in the room where the pattern forming device 1 is installed.

A groove 212 extending from the suction hole 211 along the surface of the mounting table 21 is provided on the surface of the mounting table 21. In the example of FIG. 5, the groove 212 extends from the suction hole 211 in the X direction and the Y direction. The wiring substrate 9 is placed on the mounting table 21 and sucked from the suction hole 211, whereby the inside of the groove 212 is reduced in pressure, and the wiring substrate 9 can be sucked by the mounting table 21.

FIG. 6 is a plan view showing a state where the wiring board 9 has been placed on the mounting table 21. In FIG. 6, the groove 212 is represented by a broken line. The wiring board 9 has a plurality of through holes 91. In a plan view, air flows in from the through hole 91 overlapping the groove 212. Hereinafter, the flow of air generated in the through hole 91 is referred to as "suction flow". The through hole 91 that generates suction when sucked by the mounting table 21 is referred to as an "suction hole". In FIG. 6, component symbols 91a are attached to certain suction holes.

Fig. 7 is a longitudinal sectional view showing the suction hole 91a. When the suction hole 91a overlaps the groove 212, the air flowing in from the suction hole 91a is guided to the suction hole 211 shown in FIG. 6 via the groove 212. In FIG. 7, the resist film 92 formed on the predetermined design of the wiring substrate 9 is also indicated by a broken line. The designed resist film 92 has a fixed thickness. The design of the resist film 92 is based on the premise that there is no suction. In this case, as shown by the dashed arrow in FIG. 8, the ink droplets from the head 3 move straight toward the wiring substrate 9 in the (-Z) direction.

However, in the presence of suction, as shown by the dotted arrow in FIG. 9, the ink droplets from the head 3 are attracted to the suction hole 91a. As a result, as shown in FIG. 10, the actual resist film 92a is attached to the inner peripheral surface of the suction hole 91a and the resist film 92a around the suction hole 91a becomes thinner.

In order to eliminate such a problem, in the pattern forming apparatus 1, the suction hole 91a is specified from the plurality of through holes 91 (step S12), and the ink pattern data 72 is corrected around the suction hole 91a (step S12). S13).

It is not necessary to specify the suction hole 91a. For example, when the mounting table 21 is formed of a porous material and suction is generated in all the through holes 91 of the wiring substrate 9, the ink pattern data 72 can be corrected around all the through holes 91. In addition, even when a part of the through holes 91 does not cause suction, as long as there is no problem as a resist film, the ink pattern data 72 can be corrected around all the through holes 91. In this case, step S12 can be omitted. By omitting step S12, the processing in the correction unit 611 can be simplified. On the contrary, sucking When the air hole 91a is specified, the calculation amount of the correction process described later can be reduced. Even when the suction hole 91a is specified, the correction by the correction part 611 can be performed on the part of the through hole 91 that does not generate suction. At least, the correction by the correction part 611 is performed on all the suction holes 91a around which the resist film 92 is formed.

In the specification of the suction hole 91a, first, the through hole data 71 prepared in the memory portion 62 is input to the suction hole specifying portion 612 of the correction portion 611. The storage unit 62 stores table information 73 indicating the suction area on the table 21, and the table information 73 is also input to the suction hole specifying unit 612. In this embodiment, the suction area is the area of the suction hole 211 and the groove 212 in FIG. 5. When the mounting table 21 is provided with only suction holes, the suction area is only the area of the suction port. The suction hole specifying section 612 specifies the through hole 91 overlapping the suction area as the suction hole 91 a based on the through hole data 71 and the mounting table information 73. Furthermore, even if the suction hole 91a is not coated with solder resist ink around it, it can be excluded from the calculation process.

The correction unit 611 also inputs ink pattern data 72 from the storage unit 62. The correction part 611 converts the applied value of each pixel of the ink pattern data 72 into the applied amount of ink per unit area corresponding to the designed thickness of the resist film. The amount of ink provided is the amount of ink ejected from the head 3. In other words, the correction unit 611 sets the ejection amount of ink per unit area determined in advance for the pixels with "provided". Hereinafter, the amount of ink ejected per unit area is simply referred to as "ink amount". For the pixels that are "not assigned", set the ink amount to "0". The amount of ink may be a value indicating a specific ink amount that establishes an association relationship with the unit, or a simple value that establishes an association relationship with the ink amount.

Then, the correction part 611 sets the prohibition of ejection of ink not provided with solder resist in the area very close to the suction hole 91a among the area where the resist film is formed in the design. Area (part of step S13). Furthermore, the correcting part 611 corrects the ink amount of each pixel near the suction hole 91a and outside the ejection prohibition area, so as to increase the thickness of the designed resist film (the other part of step S13).

A specific example of step S13 will be further described with reference to FIGS. 11 to 14. 11 is a longitudinal cross-sectional view showing the ejection prohibition area 93 and the peripheral provision area 94 set by the correction section 611 in the area on the design where the resist film 92 is formed. FIG. 12 is a plan view showing the ejection prohibition area 93 and the surrounding provision area 94. In FIG. 11, the designed resist film 92 is shown by a broken line. In FIG. 12, a two-dot chain line is used to indicate the inner periphery 921 of the designed resist film 92. In the example of FIGS. 11 and 12, the planar shape of the suction hole 91a is circular.

As shown in FIG. 11 and FIG. 12, in a plan view, the inner periphery 921 of the resist film 92 is designed to be away from the inner periphery 911 of the suction hole 91 a by a fixed distance. Hereinafter, the area 901 between the inner peripheral edge 921 of the designed resist film 92 and the inner peripheral surface 911 of the suction hole 91a is referred to as a "gap region". As shown in FIG. 11, the area outside the void area 901 is the area 920 formed by the resist film 92 in the design, that is, the ink application area, and is hereinafter referred to as "coating area".

As described above, in step S13, first, the correction section 611 of the ejection data generating section 61 sets the ejection prohibition area 93 on the inner periphery of the design coating area 920 around the suction hole 91a. Then, the correction unit 611 sets the peripheral provision area 94 on the outside of the ejection prohibition area 93. The peripheral provision area 94 is not greatly separated from the suction hole 91, but is a coating area around the suction hole 91a. As shown in FIG. 12, when the air intake hole 91a is circular, the ejection prohibition area 93 and the surrounding provision area 94 are concentric circular rings in a plan view.

The lower layer of Figure 13 shows the part on the left of Figure 11, and the upper layer shows the design The amount of ink is the amount of ink ejected per unit area. Also in FIG. 13, a line corresponding to the boundary between the ejection prohibition area 93 and the peripheral provision area 94 is indicated by a broken line. As shown in FIG. 13, the amount of ink guided from the ink pattern data 72 is constant throughout the design coating area 920. That is, in terms of design, the value "1" is given to the entire range of the coating area 920. The correction unit 611 first sets the ink amount to a predetermined value over the entire range of the coating area 920 as the ink amount before correction. In this embodiment, the ink amount of a predetermined value is expressed as "100%". This value is lower than the upper limit of the amount of ink that the head 3 can eject.

14 is a diagram showing the corrected ink amount and the cross-section of the actual resist film 92a formed on the wiring substrate 9. Due to the correction by the correction unit 611, the ink droplets are not ejected to the ejection prohibition area 93. That is, the amount of ink in the ejection prohibited area 93 is "0%". Furthermore, the amount of ink indicates the amount of ink ejected from the head 3 in the (-Z) direction, not the amount of ink reaching the ejection prohibition area 93 on the wiring board 9.

On the other hand, the ink amount rises sharply from the ejection prohibition area 93 to the outside, that is, to the left in FIG. 14 and greatly exceeds "100%". After that, gradually decrease. Typically, as shown in FIG. 14, the decrease in the amount of ink will gradually decrease as it moves away from the suction hole 91a. On the outer side than the surrounding area 94, the ink amount is "100%". That is, on the outer side than the surrounding area 94, the ink amount is equal to the ink amount designed in FIG. 13. Hereinafter, the distribution of the ink amount in the radial direction with the suction hole 91a as the center is referred to as the "contour" of the ink amount. The radial width of the ejection prohibition area 93 with the suction hole 91a as the center and the surrounding provision area 94 is based on the size of the suction hole 91a, the pressure in the suction hole 211 of the mounting table 21, and the ink ejected from the head 3. The size of the droplet and the speed of the droplet are set in advance.

The corrected ink pattern data 72 is input to the conversion unit 613 of FIG. 3 and converted into ejection data 75, which represents the amount of ink ejected by each ejection port of the head 3 at each position (step S14). In other words, the ejection data 75 indicates the amount of ink ejected from the head 3 to various positions on the wiring board 9.

As described above, the ejection data generation unit 61 generates the ejection data 75 based on the through hole data 71 and the ink pattern data 72. The ejection data 75 is stored in the memory 62. The ejection data 75 is generated, for example, as data indicating the size of ink droplets, and the ink droplets are set to each position on the wiring substrate 9 in a grid pattern with a pitch of 10 μm. The corrected ink pattern data 72 and the ejection data 75 differ only in the form of information, and essentially represent the ejection amount of ink per unit area.

When the ejection data 75 is generated, a step of holding the wiring board 9 on the plane of the mounting table 21 by suction is performed. The main body 11 receives the ejection data 75 from the control unit 12 and controls the head 3 and the moving mechanism 2 according to the ejection data 75. Specifically, the process of ejecting ink droplets from the head 3 to the wiring substrate 9 and the process of relatively moving the head 3 relative to the wiring substrate 9 in a direction parallel to the wiring substrate 9 are performed in parallel. Thereby, ink is applied to the wiring board 9 to form a pattern of the resist film 92 (step S15). In other words, the control unit 12 controls the head 3 and the movement mechanism 2 to execute step S15.

The ink droplets are ejected from the head 3 to the wiring substrate 9 with the outline of the ink volume shown in the upper layer of FIG. 14, whereby as shown in the lower layer of FIG. 14, the actually formed resist film 92a will be close to that shown in FIG. Shows the resist film 92 on the design. That is, the ink droplets ejected from the head 3 to the surrounding application area 94 are attracted by the suction holes 91a by suction and reach the wiring. Substrate 9. Although a part of the droplet reaches the ejection prohibition area 93, it is possible to prevent the droplet from adhering to the suction hole 91a.

The distance that the droplet is attracted by the suction hole 91a is greater the closer to the suction hole 91a. In contrast, as described above, the amount of ink in the inner peripheral portion of the peripheral application area 94 is the largest, and the amount of ink gradually decreases as it moves away from the suction hole 91a. Thereby, the thickness becomes substantially constant throughout the entire resist film 92a. By setting the ejection prohibition area 93 and adjusting the amount of ink in the surrounding area 94, an appropriate resist film having a substantially uniform thickness and close to the design shape in a plan view is formed in the entire design coating area 920 The pattern of 92a.

Fig. 15 is a diagram showing another example of the contour of the ink amount after correction. In FIG. 15, the two-dot chain line indicates the position of the inner peripheral edge 921 of the resist film 92 in the design, and the symbol 921 is added (the same in FIG. 16 ). The amount of ink rises from the inner periphery 921 of the designed resist film 92 to the outside of the suction hole 91a, and then gradually decreases. That is, in the example of FIG. 15, the ejection prohibition area 93 of FIG. 14 is not provided, and only the peripheral application area 94 is provided as the ink application area around the suction hole 91a. The amount of ink in the peripheral application area 94 is larger than the area outside the peripheral application area 94. Even in the case where the ejection prohibition area 93 is not provided, if the gap area 901 is sufficiently large, the ink droplets are still not sucked by the suction hole 91a. Therefore, as long as the amount of ink in the surrounding area 94 is corrected, it is possible to form an appropriate resist film 92a pattern having a substantially constant thickness.

Figure 16 is a diagram showing another example of the contour of the corrected ink amount. In the example of FIG. 16, although the ejection prohibition area 93 is provided outside the gap area 901, the amount of ink outside the ejection prohibition area 93 is constant, and the ink amount before correction can be maintained. That is, in the example of FIG. 16, although the ink application area is designed around the suction hole 91a The spray prohibition area 93 is provided on the inner periphery of the coating area 920 of the domain, but the peripheral provision area 94 is not provided. In the case where there is no problem even if the thickness of the resist film 92a becomes thinner around the suction hole 91a, only the ejection prohibition area 93 can be provided to prevent the ink droplets from being attracted by the suction hole 91a or suppress the ink. The material is attached to the inner surface of the suction hole 91a. As a result, an appropriate pattern of resist film 92 is formed around the suction hole 91a.

There may be a plurality of variations in the pattern forming device 1.

The contours shown in FIGS. 14 to 16 are just examples, and the shape of the contour can be changed appropriately. The profile can be appropriately set in consideration of the size of the suction hole 91a, the pressure in the suction hole 211 of the mounting table 21, the size of ink droplets ejected from the head 3, and the speed of the droplets. The contour can be made theoretically according to the strength of the suction flow or can be determined by repeated experiments. Only one outline may be applied to one wiring board 9 or plural kinds of outlines may be applied to one wiring board 9. It is also possible to apply a different contour for each suction hole 91a.

In the pattern forming apparatus 1, at least in the peripheral application area 94, the ejection amount of ink per unit area is set to be greater than the ejection volume of ink per unit area in the area outside the peripheral application area 94 In addition, a pattern of ink is formed on the wiring substrate 9, thereby forming a film having a substantially uniform thickness.

Preferably, as shown in FIG. 14, in the surrounding area 94, the amount of ink, that is, the ejection amount of ink per unit area, increases as it approaches the suction hole 91a. To be precise, in the vicinity of the inner periphery of the peripheral providing area 94, the amount of ink decreases from the maximum value to 0% toward the suction hole 91a. The amount of ink may gradually increase as it approaches the suction hole 91a or may also increase stepwise. In the contour, the amount of ink can also increase linearly or in a broken line.

The planar shape of the through hole 91 is not limited to a circle. As long as the through hole 91 is through The hole may be a through hole of any shape, and is not limited to a so-called through hole for wiring. When the through hole 91 is not circular, the ejection prohibition area 93 or the surrounding providing area 94 does not need to be set to a circular shape.

The ink ejected from the head 3 is not limited to solder resist ink. The method of providing the ejection prohibition area 93 or the surrounding provision area 94 can be applied to various technologies in which a wiring board having through holes is patterned by an inkjet method. For example, the above-mentioned technique can also be used when the wiring board 9 uses ink to draw characters, symbols, graphics, and the like.

In the above-mentioned pattern forming apparatus 1, although the correction part 611 automatically corrects the ink pattern data 72, the correction of the ink pattern data 72 may be performed by a person.

It is not necessary to increase the amount of ink in the peripheral application area 94 in a ring shape. For example, a plurality of island-shaped regions with a large amount of ink may be arranged annularly around the suction hole 91a.

In the pattern forming apparatus 1, as long as the head 3 moves relative to the mounting table 21, a plurality of structures can be adopted as the moving mechanism 2. For example, the mounting table 21 may be fixed and the head 3 may move in the X direction and the Y direction. The head 3 may move in the Y direction and the mounting table 21 may move in the X direction.

The arrangement of the ejection ports in the head 3 can be variously changed, and the relationship between the size of the liquid droplet and the distance between the ejection ports in the X direction can also be variously changed. It is also possible that the head 3 has a pattern in which a resist film is formed in the area below the head 3 by one relative movement with respect to the wiring substrate 9.

The configurations in the above-mentioned embodiment and each modification example can be appropriately combined as long as they do not contradict each other.

Although the invention has been described and illustrated in detail, the description that has been described is illustrative rather than limiting. Therefore, it can be said that various changes or aspects are possible as long as they do not depart from the scope of the present invention.

9: Wiring board (printed wiring board)

91a: suction hole

92a: Resist film

93: Ejection prohibited area

94: surrounding area

901: void area (area)

920: coating area (area)

Claims (10)

A pattern forming device is provided with ink on a wiring substrate, whereby a pattern of the ink is formed on the wiring substrate, and the pattern forming device includes: The holding part is for holding the aforementioned wiring substrate with through holes on a plane by suction; The head part ejects droplets of the aforementioned ink to the aforementioned wiring substrate by means of inkjet; A moving mechanism that relatively moves the head relative to the holding portion in a direction parallel to the wiring board; and The control section controls the head and the moving mechanism, whereby the ink application area around the through-hole that is sucked when sucked by the holding section is used as a peripheral providing area, and each The ejection amount of the ink per unit area is set to be greater than the ejection amount of the ink per unit area in the area outside the peripheral providing area, and the ink pattern is formed on the wiring board. The pattern forming apparatus described in claim 1, wherein the aforementioned control unit includes: The memory part stores through hole data and ink pattern data, the through hole data represents the pattern of the through hole, and the ink pattern data represents the design pattern of the ink; and The ejection data generating unit generates ejection data based on the through hole data and the ink pattern data, and the ejection data represents the amount of the ink ejected from the head to each position on the wiring board. The pattern forming apparatus according to claim 2, wherein the ejection data generating section sets an ejection prohibition area on the inner circumference of the design coating area around the through hole, and sets the circumference outside the ejection prohibition area Give the area. The pattern forming device according to any one of claims 1 to 3, wherein in the peripheral provision area, the ejection amount of the ink per unit area increases as it approaches the through hole. The pattern forming device according to claim 1, wherein in the peripheral providing area of all the through holes of the wiring board, the ejection amount of the ink per unit area is outside the peripheral providing area The ejection amount of the aforementioned ink per unit area in the area is more. The pattern forming device according to claim 1, wherein in the peripheral providing area of all the through holes that generate suction when sucked by the holding portion, the ejection amount of the ink per unit area is The ejection amount of the ink per unit area in the area outside the surrounding provision area is larger. A pattern forming device is provided with ink on a wiring substrate, whereby a pattern of the ink is formed on the wiring substrate, and the pattern forming device includes: The holding part is for holding the aforementioned wiring substrate with through holes on a plane by suction; The head part ejects droplets of the aforementioned ink to the aforementioned wiring substrate by means of inkjet; A moving mechanism that relatively moves the head relative to the holding portion in a direction parallel to the wiring board; and The control unit controls the head and the moving mechanism, thereby forming the ink pattern on the wiring board; The aforementioned control unit has: The memory part stores through hole data and ink pattern data, the through hole data represents the pattern of the through hole, and the ink pattern data represents the design pattern of the ink; and The ejection data generating unit generates ejection data based on the through hole data and the ink pattern data, and the ejection data represents the amount of the ink ejected from the head to each position on the wiring board; The ejection data generating section sets an ejection prohibition area on the inner periphery of the ink application area in the design around the through hole. A pattern forming method is to apply ink on a wiring substrate, thereby forming a pattern of the ink on the wiring substrate, the pattern forming method includes: a) The process of holding the above-mentioned wiring board with through holes on a plane by suction by the holding portion; b) The process of ejecting droplets of the aforementioned ink from the head to the aforementioned wiring substrate by means of inkjet; and c) A step of relatively moving the head portion relative to the wiring board in a direction parallel to the wiring board; According to the step b) and the step c), each unit area of the ink supply area around the through-hole that is sucked by the holding portion is a peripheral providing area. The ejection amount of the ink is set to be greater than the ejection amount of the ink per unit area in the area outside the peripheral providing area, and the pattern of the ink is formed on the wiring board. A method for generating ejection data is to generate ejection data. The ejection data is used when ink droplets are ejected from the head to the wiring substrate by inkjet. The ejection data generation method includes: The process of preparing through hole data and ink pattern data, wherein the through hole data represents the pattern of the through hole on the wiring substrate, and the ink pattern data represents the ink pattern on the design on the wiring substrate; and The process of generating the ejection data based on the through hole data and the ink pattern data. The ejection data is formed around the through hole which is used as a peripheral providing area and sucks when the wiring substrate is held on a plane by suction. In the ink application area, the ejection amount of the ink per unit area is set to be greater than the ejection amount of the ink per unit area in the area outside the peripheral application area. A method for generating ejection data is to generate ejection data. The ejection data is used when ink droplets are ejected from the head to the wiring substrate by inkjet. The ejection data generation method includes: The process of preparing through hole data and ink pattern data, wherein the through hole data represents the pattern of the through hole on the wiring substrate, and the ink pattern data represents the ink pattern on the design on the wiring substrate; and The process of generating the ejection data based on the through-hole data and the ink pattern data. The ejection data is the ink designed around the through-hole that sucks when the wiring board is held on a plane by suction. Set the ejection prohibition area on the inner periphery of the material application area.

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