TWI723612B - Pattern forming apparatus, pattern forming method and ejection data generation method - Google Patents

Abstract

A pattern forming apparatus ejects droplets of ink of solder resist by inkjet method toward a wiring board to form a pattern of a resist film (92) on the wiring board. While ejecting droplets, an ink ejection amount per area to an edge neighbor region (951) in a conductive pattern (91) on the wiring board is made larger than that to a base region (953) where no conductive pattern (91) is formed. In addition, an ink ejection amount per area to a pattern center region (952) which is a region in the conductive pattern (91) and is apart from edges is made smaller than that to the base region (953). This makes it possible to form a resist film having appropriate thickness on the wiring board.

Description

Pattern forming device, pattern forming method, and ejection data generating method

The present invention relates to a technique for forming a pattern of a resist film on a wiring substrate.

Conventionally, the purpose of forming a resist film on a wiring board is to protect the conductor pattern on the wiring board. The resist film also has the task of preventing solder from adhering to areas such as conductor wiring during post-process solder coating, and is also called "solder resist". As a method of forming a resist film, there is known a method in which droplets of solder resist ink (ink) are ejected onto a wiring board by an ink jet method. Such a technique has been disclosed in Japanese Patent Application Publication No. 9-283893 and Japanese Patent Application Publication No. 2008-4820, for example.

However, on the wiring board, conductor patterns such as conductor wiring and lands slightly protrude from the surface of a base material such as glass epoxy resin. Therefore, when a fixed amount of ink per unit area is applied to the wiring board, the resist film may not have the desired thickness. For example, in the step difference between the surface of the substrate and the surface of the conductive pattern, ink may flow from the conductive pattern to the surface of the substrate, and it is impossible to form a resist film of sufficient thickness on the edge of the conductive pattern. Yu.

Moreover, in the case where a fixed amount of ink per unit area has been applied to the wiring board In this case, the thickness of the conductor pattern may affect the unevenness of the surface of the resist film in this state, and the unevenness of the surface of the resist film may exceed the allowable range. In this case, for example, the solder paste may not be applied correctly when a metal mask is used in the subsequent process.

The present invention relates to a pattern forming device, which uses solder resist ink to form a resist film pattern on a wiring substrate.

The object of the present invention is to be able to form a pattern of a resist film having an appropriate thickness on a wiring board.

A preferred pattern forming apparatus of the present invention is provided with: a holding portion for holding a wiring board; a head portion for ejecting droplets of solder resist ink onto the wiring board by an inkjet method; and a moving mechanism for holding the foregoing wiring board. The head portion relatively moves in a direction parallel to the wiring board with respect to the holding portion; and the control portion controls the head and the moving mechanism, thereby removing each area near the edge of the conductive pattern on the wiring board. The ejection amount of ink per unit area is set to be greater than the ejection amount of ink per unit area in the region where the conductive pattern is not formed, and a pattern of resist film is formed on the aforementioned wiring substrate.

Preferably, the amount of ink ejected per unit area in the central area of the pattern farther from the edge in the area of the conductive pattern on the wiring board is set to be higher than that of the area where the conductive pattern is not formed. The ejection amount of ink per unit area is smaller and a resist film pattern is formed on the aforementioned wiring substrate.

More preferably, by the control of the aforementioned control unit, the area near the aforementioned edge The amount of ink ejected per unit area between the central area of the pattern and the ejected amount of ink per unit area in the area near the edge and the amount of ink per unit area in the central area of the pattern And the pattern of resist film is formed on the aforementioned wiring board.

Another preferred form of the pattern forming device of the present invention is to use solder resist ink to form a pattern of resist film on the wiring substrate. The pattern forming device includes: a holding portion for holding the wiring substrate; a head portion for spraying The ink method ejects droplets of solder resist ink to the wiring board; the moving mechanism relatively moves the head relative to the holding portion in a direction parallel to the wiring board; and the control section controls the head Portion and the moving mechanism, whereby the ejection amount of ink per unit area in the central area of the pattern far from the edge in the area of the conductive pattern on the wiring board is set to be higher than that per unit area in the area where the conductive pattern is not formed. The ejection amount of ink per unit area is smaller and a resist film pattern is formed on the aforementioned wiring substrate.

In either of the above-mentioned preferred forms, it is preferable that the aforementioned control unit includes: a memory unit for storing conductive pattern data and resist pattern data, the aforementioned conductive pattern data represents the aforementioned conductive pattern, and the aforementioned The resist pattern data represents the pattern of the aforementioned resist film; and the ejection data generating section generates ejection data based on the aforementioned conductive pattern data and the aforementioned resist pattern data, and the aforementioned ejection data represents the direction from the head to the wiring board The amount of ink ejected from each position.

The present invention also relates to a pattern forming method in which a solder resist ink is used to form a resist film pattern on a wiring substrate. A preferred form of the pattern formation method of the present invention includes: a) step, which is to spray droplets of solder resist ink from the head to the Discharging the wiring board; and b) step, in parallel with the step a), moving the head relative to the wiring board in a direction parallel to the wiring board; by the step a) and the step b), Set the ejection amount of ink per unit area in the area near the edge of the conductive pattern on the aforementioned wiring board to be more than the ejection amount of ink per unit area in the area where the conductive pattern is not formed, and A resist film pattern is formed on the aforementioned wiring substrate.

The pattern forming method of another preferred aspect of the present invention includes: a) step of ejecting droplets of solder resist ink from the head to the wiring board by an inkjet method; and b) step, which is the same as the aforementioned a ) The process is parallel, and the head is relatively moved relative to the wiring substrate in a direction parallel to the wiring substrate; through the a) process and b) process, the area of the conductive pattern on the wiring substrate is far away from the edge The ejection amount of ink per unit area in the central area of the pattern is set to be less than the ejection amount of ink per unit area in the area where the conductive pattern is not formed, and a resist film is formed on the aforementioned wiring substrate. The pattern.

The present invention also relates to a method for generating ejection data, which is used when ejecting droplets of solder resist ink from the head to the wiring board by an inkjet method. A preferred form of the ejection data generation method of the present invention includes the steps of preparing conductive pattern data and resist pattern data. The conductive pattern data represents the conductive pattern on the wiring substrate, and the resist pattern data represents the resist. The pattern of the film; and the process of generating ejection data based on the conductive pattern data and the resist pattern data, the ejection data is based on the ejection amount of ink per unit area in the area near the edge of the conductive pattern as the ratio Every unit in the area where no conductive pattern is formed The ink ejection amount is more for the area.

Another preferred aspect of the ejection data generation method of the present invention includes the steps of preparing conductive pattern data and resist pattern data. The conductive pattern data represents the conductive pattern on the wiring substrate, and the resist pattern data represents the resist. The pattern of the agent film; and the process of generating ejection data based on the conductive pattern data and the resist pattern data. The ejection data is for each unit in the central area of the pattern far from the edge of the area of the conductive pattern on the wiring substrate The ejection amount of ink per area is set to be smaller than the ejection amount of ink per unit area in the area where the conductive pattern is not formed.

The above objectives and other objectives, features, aspects, and advantages are understood by referring to the accompanying drawings and the detailed description of the present invention described below.

1: Pattern forming device

2: mobile agency

2a: Y direction moving mechanism

2b: X direction moving mechanism

1: head

4: slot

5: Computer

8: Recording media

9: Wiring board (printed wiring board)

11: body

12: Control Department

21: Mounting table (holding part)

41: pipe fittings

51: Central Processing Unit

52: ROM

53: RAM

54: fixed disk

55: display

56: Input section

56a: keyboard

56b: Mouse

57: Reading device

58: Ministry of Communications

61: Ejection data generation department

611: Edge Extraction Department

612: Correction Department

613: Conversion Department

62: Memory Department

71: Conductive pattern data

72: Resist pattern data

75: Spouting data

80: program

90: Substrate

91: conductive pattern

92: Resist film

611: Edge Extraction Department

612: Correction Department

613: Conversion Department

931,932: area

94: Edge

951: The area near the edge

952: Pattern Central Area

953: substrate area

954: middle area

[Fig. 1] A perspective view showing the appearance of the pattern forming device.

[Figure 2] is a diagram showing the composition of a computer.

[Figure 3] is a diagram showing the functional composition realized by a computer.

[Fig. 4] is a diagram showing the flow of the operation of the pattern forming apparatus.

[Fig. 5] A diagram illustrating a conductive pattern.

[FIG. 6] A diagram illustrating a state in which a resist film is formed on a wiring board.

[FIG. 7] A diagram showing the cross section of the wiring board at the position VII-VII in FIG. 6. [FIG.

[Fig. 8] is a plan view showing the wiring board near the position of VII-VII in Fig. 6. [Fig.

[Figure 9] is a diagram showing the amount of ink and the cross-section of the wiring board before correction.

[Fig. 10] is a diagram showing the amount of ink and the cross-section of the wiring board after correction.

[Fig. 11] is a diagram showing a cross-section of the wiring board after ink application is performed with the amount of ink before correction.

[Fig. 12] is a diagram showing a cross-section of the wiring board after ink application is performed with the corrected ink amount.

[Fig. 13] is a diagram showing another example of the ink amount after correction.

FIG. 1 is a perspective view showing the appearance of the pattern forming device 1. The pattern forming apparatus 1 forms a resist film pattern on a printed wiring board (hereinafter referred to as "wiring board") 9 using solder resist ink. The pattern forming apparatus 1 forms a pattern by an inkjet method. Although the wiring board 9 is preferably a plate-shaped member, it may be a sheet-shaped member having flexibility. The resist film protects the conductor pattern on the wiring board 9. The conductor pattern includes wiring, land, and other patterns. The resist film is not formed in the area where the solder paste is applied in the subsequent process, or other areas where the resist film is not provided.

The pattern forming apparatus 1 includes a main body 11 and a control unit 12. The main body 11 is equipped with a Y-direction moving mechanism 2a, which moves the wiring board 9 in the Y direction parallel to the wiring board 9, and a head 3, which sprays solder resist ink (hereinafter referred to as " Ink"); the X-direction moving mechanism 2b, which moves the head 3 in the X direction perpendicular to the Y direction and parallel to the wiring board 9; and the tank 4, which is stored and supplied to the head 3的ink material. Hereinafter, the Y-direction moving mechanism 2a and the X-direction moving mechanism 2b are collectively referred to as "moving mechanism 2". As the Y-direction moving mechanism 2a and the X-direction moving mechanism 2b, multiple mechanisms can be used. For example, a roller equipped with a motor can be used Ball screw mechanism can also use linear motor. The control unit 12 controls the moving mechanism 2 and the head 3. The ink system is supplied from the tank 4 to the head 3 via a tube 41.

The Y-direction moving mechanism 2a has a holding portion 21 that holds the wiring board 9. In the present embodiment, the holding part 21 is a stage, and the holding part 21 is hereinafter referred to as a "stage 21". The wiring board 9 is held on the mounting table 21. In this embodiment, a plurality of holes are formed on the surface of the mounting table 21, and the holes are connected to a suction device (not shown). By sucking air from the hole, the wiring board 9 can be held on the mounting table 21. The holding of the wiring board 9 may also be performed by other plural methods. For example, a groove extending in the horizontal direction from the hole may be formed on the surface of the mounting table 21 to expand the area where the wiring substrate 9 is attracted and sucked. The mounting table 21 may be formed of a porous material and sucked from the porous material. The mounting table 21 may hold the wiring board 9 by a mechanical mechanism.

The head 3 is provided with a discharge unit having a plurality of discharge ports arranged at equal intervals in the X direction. The ink droplets are ejected from each ejection port in an ink-jet manner. The ink is ejected toward the wiring board 9 and in the (-Z) direction of FIG. 1. As the inkjet system, a plurality of structures can be used, and the usable structure is a structure using a piezoelectric (piezo) or a structure using a heater (heater).

While ejecting ink droplets from a plurality of ejection ports, the mounting table 21 is moved in the Y direction parallel to the wiring substrate 9 by the Y-direction moving mechanism 2a, whereby ink can be applied to the area extending in the Y direction. Hereinafter, the movement of the wiring board 9 in the Y direction is also referred to as "main scanning". In fact, in one main scan of the wiring substrate 9, a plurality of ink lines corresponding to a plurality of ejection ports are formed on the wiring substrate 9. When one main scan is completed, the head 3 is slightly moved in the X direction parallel to the wiring board 9 by the X-direction moving mechanism 2b, and the wiring board 9 The Y-direction moving mechanism 2a moves in the (-Y) direction. Thereby, the second main scan can be performed and the ink lines formed adjacent to each line of the ink formed by the previous main scan are formed.

The main scan is repeatedly performed a predetermined number of times, whereby a resist film is formed in a region having a width substantially equal to the arrangement width of the plurality of ejection ports in the X direction. Since the resist film is formed only in the necessary area, the pattern of the resist film can be formed accurately. Hereinafter, the width substantially equal to the arrangement width of the plurality of ejection ports in the X direction is referred to as the "cell width", and the area where the resist film is formed with this width is referred to as the "cell area". When a resist film is formed in a unit area, the head 3 is moved in the X direction by the X-direction moving mechanism 2b to reach the unit width, and is adjacent to the previous unit area by repeatedly performing the above-mentioned main scan A resist film is formed in the cell area.

The formation of the resist film on the cell area and the movement of the head 3 in the X direction are repeated, thereby forming a pattern of the resist film on the entire necessary area of the wiring substrate 9.

FIG. 2 is a diagram showing the configuration of the computer 5 included in the control unit 12. Computer 5 has become a general computer system including CPU (Central Processing Unit) 51, ROM (Read Only Memory) 52, and RAM (Random Access Memory) 53. The CPU 51 performs various arithmetic processing, the ROM 52 stores basic programs, and the RAM 53 stores various information. The computer 5 series further includes: a fixed disk 54 for information storage; a display 55 for displaying various information such as images; a keyboard 56a and a mouse as the input unit 56 ( mouse) 56b, which accepts input from the operator; the reading device 57, which is from CD, disk, A computer-readable recording medium 8 such as a magneto-optical disc, a memory card, etc. reads information; and a communication unit 58 is used to send and receive signals to and from the main body 11.

The computer 5 reads the program 80 from the recording medium 8 via the reading device 57 in advance and stores it on the fixed disk 54. The program 80 can also be stored on the fixed disk 54 via a network. The CPU 51 executes arithmetic processing while using the RAM 53 or the fixed disk 54 in accordance with the program 80. The CPU 51 has a function as an arithmetic unit in the computer 5. It is also possible to adopt other configurations that have a function as an arithmetic unit other than the CPU 51.

FIG. 3 is a diagram showing the functional structure realized by the computer 5 executing arithmetic processing in accordance with the program 80. These functional configurations include a discharge data generation unit 61 and a storage unit 62. The memory 62 corresponds to the RAM 53 and the fixed disk 54 and so on. The ejection data generation unit 61 includes an edge extraction unit 611, a correction unit 612, and a conversion unit 613. All or part of these functions can also be realized by dedicated electronic circuits. Moreover, these functions can also be realized by a plurality of computers.

FIG. 4 is a diagram showing the flow of the operation of the pattern forming apparatus 1. Steps S12 to S14 in FIG. 4 are arithmetic processing performed by the control unit 12, and step S15 is an operation of the main body 11 performed by the control of the control unit 12. The conductive pattern data 71 and the resist pattern data 72 are stored and prepared in advance in the memory portion 62 via the communication portion 58 and the reading device 57 and the like (step S11). The conductive pattern data 71 is information indicating the conductive pattern on the wiring substrate 9. The resist pattern data 72 is information indicating the pattern of a predetermined resist film formed on the wiring substrate 9. Furthermore, the conductive pattern data 71 and the resist pattern data 72 may also be vector data at the stage where they are stored in the memory 62.

FIG. 5 is a diagram illustrating the conductive pattern 91 on the wiring board 9. In FIG. 5, parallel diagonal lines are attached to the conductive pattern 91. The conductive pattern 91 is typically a pattern of relatively thin copper that has been formed on the substrate 90. Although the base material 90 is formed of, for example, glass epoxy resin, it may be formed of other materials. The height of the conductive pattern 91 from the surface of the substrate 90 is, for example, 35 μm. As the height of the conductive pattern 91, there are a plurality of heights. FIG. 6 is a diagram illustrating a state in which a resist film 92 as an insulating layer is formed on the wiring substrate 9. A parallel diagonal line is added to the resist film 92. The regions 931 and 932 are regions where the resist film 92 does not exist.

The edge extraction unit 611 in FIG. 3 applies edge extraction processing to the conductive pattern data 71 to thereby generate an image representing the edge of the conductive pattern 91. To be precise, edge data, which is the data of the image representing the edge, is generated (step S12). The marginal data is input to the correction unit 612. The correction part 612 also inputs conductive pattern data 71 and resist pattern data 72. The resist pattern data 72 is data representing the image of the pattern of the resist film, and each pixel is set with a value of "1" indicating that the ink is "applied" or a value of "0" indicating that the ink is "not provided". Hereinafter, the value indicating whether or not the ink is applied is referred to as the "applied value".

The correction part 612 converts the assigned value of each pixel of the resist pattern data 72 into the amount of ink per unit area corresponding to the designed thickness of the resist film. That is, in the correction unit 612, the amount of ink per unit area determined in advance is set for the pixels with "provided". Hereinafter, the amount of ink per unit area is abbreviated as "ink amount". Set the amount of ink to "0" for pixels that are "not assigned". The amount of ink can also be a value indicating a specific amount of ink that establishes an association relationship with the unit, or it can be a simple value that establishes an association relationship with the amount of ink.

Secondly, the correction unit 612 corrects the ink of each pixel based on the edge data. The amount of the material is such that the thickness of the resist film in the area near the edge of the conductive pattern 91 becomes thick (a part of step S13). That is, the correcting part 612 corrects the resist pattern data 72 in order to increase the amount of ink applied near the position where the pattern of the predetermined resist film and the edge of the conductive pattern 91 overlap.

The correcting part 612 further corrects the ink amount of each pixel by referring to the conductive pattern data 71 and the edge data, so that the thickness of the resist film in the central area of the wiring far from the edge of the conductive pattern 91 becomes thinner (step S13 Part). That is, the correcting portion 612 corrects the resist pattern data 72 in order to reduce the amount of ink applied in the area where the pattern formed with the predetermined resist film overlaps with the area on the inner side of the edge of the conductive pattern 91.

Specific examples of step S12 and step S13 will be further described with reference to FIGS. 6 to 10. FIG. 7 is a diagram showing a cross-section of the wiring substrate 9 at the position VII-VII in FIG. 6 at a stage before the formation of the resist film 92. As shown in FIG. FIG. 8 is a plan view showing the wiring substrate 9 near the position of VII-VII in the stage before the formation of the resist film 92. The conductive pattern 91 is formed on the base 90 and has a certain thickness. The correction unit 612 obtains the edge of the conductive pattern 91 with the reference numeral 94 in FIGS. 7 and 8 from the conductive pattern data 71 (step S12).

Here, in the stage before the formation of the resist film 92, the range of VII-VII in FIG. 6 is a plan for forming the resist film 92 as a whole. That is, the value "1" is assigned to the entire range. Therefore, the correction unit 612 sets the ink amount to a predetermined value throughout the entire range. In this embodiment, the predetermined value of ink is expressed as "100%". This value is lower than the upper limit of the amount of ink that the head 3 can eject. The lower layer of FIG. 9 shows the cross section of the wiring board 9 in the position of VII-VII in the same manner as in FIG. 7, and the upper layer shows that the ink amount is set in the range of VII-VII. Set at 100%.

Secondly, the correction unit 612 corrects the amount of ink based on the edge data, that is, corrects the pixel value so that the area near the edge of the conductive pattern 91 (in FIGS. 7 and 8 is the area with the component symbol 951, in FIG. 8 is Note that the thickness of the resist film in the area of the parallel diagonal line becomes thicker (a part of step S13). On the upper layer of FIG. 10, a component symbol 951 is attached at a position corresponding to the area near the edge 951, and the amount of ink displayed in the area 951 near the edge exceeds 100% and is more than a predetermined value.

Furthermore, the correction part 612 refers to the conductive pattern data 71 and the edge data, thereby specifying the pattern central area 952 far from the edge 94 among the areas of the conductive pattern 91 as shown in FIGS. 7 and 8. In FIG. 8, parallel diagonal lines are attached to the central area 952 of the pattern. Then, the amount of ink is corrected in such a way that the thickness of the resist film in the central area 952 of the pattern becomes thinner, that is, the pixel value is corrected (a part of step S13). On the upper layer of Fig. 10, a component symbol 952 is attached to the position corresponding to the central area 952 of the pattern, and the central area 952 of the pattern indicates that the ink amount is less than 100% and the ink amount is less than the predetermined value.

FIG. 11 is a diagram showing the resist film 92 assuming that the pattern forming apparatus 1 is provided with ink at 100% of the ink amount in the entire range of VII-VII in FIG. 6. Since the ink of the solder resist is lost to a certain extent from the conductive pattern 91 to the substrate 90 near the edge 94 of the conductive pattern 91, the thickness of the resist film 92 becomes thinner in the region 951 near the edge. As a result, there is a risk of poor insulation near the edge. The thickness of the resist film 92 needs to be more than ten μm, for example. The necessary thickness of the resist film 92 is different depending on the type of the wiring board 9.

On the other hand, in the central region 952 of the pattern, the thickness of the resist film 92 becomes a thickness corresponding to 100% of the ink amount. Here, the area that is more outside than the area near the edge 951 It is called the base area 953 (refer to FIGS. 7 and 8). When the height difference between the pattern center area 952 and the base area 953 of the resist film 92 is significantly different, it will happen when the solder paste is applied in the subsequent process. The fear of bad situations. Specifically, when a metal plate with an opening corresponding to the area where the solder paste is applied is placed on the resist film 92 and the solder paste is printed (that is, applied) using a squeegee, there may be a problem between the metal plate and the solder paste. There is a possibility that a large gap is locally generated between the resist films 92 and the coating cannot be performed appropriately.

In the pattern forming apparatus 1, in order to solve the above-mentioned problems in the edge vicinity area 951 and the pattern central area 952, the amount of ink in the edge vicinity area 951 can be made larger than the ink amount in the substrate area 953 as described above. It is set in such a way that the amount of ink in the central area 952 of the pattern becomes less than the amount of ink in the substrate area 953. Hereinafter, the correction unit 612 converts it into data indicating the amount of ink applied per unit area, and then the corrected resist pattern data 72 is referred to as "corrected resist pattern data".

The corrected resist pattern data is input to the conversion part 613 of FIG. 3 and converted into ejection data 75, which represents the amount of ink ejected from each ejection port of the head 3 at each position (step S14). In other words, the ejection data 75 indicates the amount of ink ejected from the head 3 to various positions on the wiring board 9. The ejection data 75 is stored in the memory 62. The ejection data 75 is generated, for example, as data indicating the size of ink droplets, which are applied to each position on the wiring substrate 9 in a grid pattern with a pitch of 10 μm.

As described above, the ejection data generation unit 61 generates the ejection data 75 based on the conductive pattern 71 and the resist pattern data 72. The corrected resist pattern data is different from the ejection data 75 only in the form of information, which essentially represents the ejection amount of ink per unit area.

The main body 11 receives the ejection data 75 from the control unit 12 and controls it according to the ejection data 75 制head 3 and moving mechanism 2. Specifically, the process of ejecting ink droplets from the head 3 to the wiring substrate 9 and the process of relatively moving the head 3 relative to the wiring substrate 9 in a direction parallel to the wiring substrate 9 are performed in parallel. Thereby, the ink is applied on the wiring board 9 and the pattern of the resist film 92 is formed (step S15).

FIG. 12 is a diagram showing the resist film 92 formed at the positions VII-VII in FIG. 6 according to the ejection data 75 derived from the corrected resist pattern data. In FIG. 12, the shape of the resist film 92 of FIG. 11 is shown by a two-dot chain line. Under the control of the control unit 12, the ejection amount of ink per unit area in the edge vicinity area 951 is greater than that of the ink per unit area in the substrate area 953, that is, the area where the conductive pattern 91 is not formed. The ejection amount is larger and the pattern of the resist film 92 is formed on the wiring substrate 9. Thereby, a sufficient thickness of the resist film 92 can be ensured in the region 951 near the edge.

On the other hand, the ejection amount of ink per unit area in the central area of the pattern 952 is greater than that of the substrate area 953, that is, the ejection of ink per unit area in the area where the conductive pattern 91 is not formed. The pattern of the resist film 92 is formed on the wiring substrate 9 with a smaller amount. Thereby, the resist film 92 can be prevented from becoming an unnecessary thickness in the pattern central region 952, and the unevenness of the surface of the resist film 92 can be alleviated. As a result, it is possible to suppress the occurrence of defects in the post process such as the application of solder paste. In addition, it can also reduce ink consumption.

As long as the amount of ink in the area 951 near the edge can exceed the amount of ink in the substrate area 953, multiple settings can also be made. The normal ink amount in the substrate area 953 is set to 100%, and the ink amount in the area near the edge 951 is set to be more than 100% and less than 300%. Preferably it is 110% or more and 200% or less. The amount of ink in the central area 952 of the pattern can be lower than the amount of ink in the substrate area 953, so multiple settings can also be performed. Set the normal ink volume in the substrate area 953 to 100%, as shown in the figure The ink volume in the central area 952 of the case is set to be above 20% but less than 100%. Preferably it is 30% or more and 80% or less. The amount of ink in the area near the edge 951 and the central area 952 of the pattern can be changed in multiple ways according to the viscosity of the ink. The viscosity of the ink is preferably 10 mPa˙s or more and 30 mPa˙s or less at a temperature of 50°C.

The width in the direction perpendicular to the edge 94 of the region 951 near the edge is 0.3 mm or less from the edge 94 to both sides (the overall width is 0.6 mm or less). Preferably, it is 0.05 mm or more and 0.15 mm or less from the edge 94 to both sides (the overall width is 0.1 mm or more and 0.3 mm or less). However, since the positions of the droplets that can be applied to ink are discretely present on the wiring substrate 9 and the ink droplets are spread on the wiring substrate 9, there is also a case where the area 951 near the edge is thinner. Only one row of dots formed on the wiring substrate 9 is formed by droplets with a large amount of liquid.

In the corrected resist pattern data, the concept of increasing the amount of ink in the region 951 near the edge means that in the ejection data 75, the center of the ejected droplet is located in the region 951 near the edge. many. As a method of increasing the liquid volume of the droplet, a plurality of methods can be used. For example, there are methods such as increasing the size of one droplet, or increasing the number of a plurality of minute droplets that can be regarded as one droplet.

In addition, since the positions of the droplets that can be applied to the ink are only discretely present on the wiring substrate 9, the width of the conductive pattern 91 applied to the corrected resist pattern data is preferably 100 μm or more, more preferably 150 μm or more. The best is 200 μm or more. The positions that can be applied by the ink droplets on the wiring substrate 9 are preferably at a pitch of 20 μm or less, and more preferably at a pitch of 10 μm or less.

Fig. 13 is a diagram showing another example of the amount of ink at positions VII-VII in Fig. 6. In FIG. 13, as shown by the reference symbol 954, compared with FIG. 10, the area 951 near the edge and the center of the pattern Between the areas 952 is set an ink quantity that is less than the ink quantity of the area 951 near the edge and more than the ink quantity of the central area 952 of the pattern. The area where the amount of ink is in the middle is, for example, when the conductive pattern data 71 and the edge data are input in the correction unit 612 and the edge vicinity area 951 and the pattern central area 952 are set, it is set between the edge vicinity area 951 and the pattern central area 952 , Or set at the part where the central area 952 of the pattern is in contact with the area near the edge 951. Hereinafter, the area in which the amount of ink between the edge vicinity area 951 and the pattern central area 952 is in the middle is referred to as the "intermediate area 954". The amount of ink in the middle area 954 can also be equal to the amount of ink in the substrate area 953.

The ejection data is generated from the corrected resist pattern data shown in FIG. 13 and the ink is applied, whereby the pattern forming apparatus 1 is controlled by the control unit 12 to divide the area near the edge 951 and the center area 952 of the pattern. The amount of ink ejected per unit area in the middle area 954 is set as the amount of ink ejected per unit area in the area near the edge 951 and the ejection amount of ink per unit area in the central area 952 of the pattern. The amount of ejection between the amount and the pattern of the resist film 92 are formed on the wiring substrate 9. Thereby, the difference in the amount of ink between the area near the edge 951 and the central area 952 of the pattern can be alleviated, and the occurrence of unnatural irregularities on the resist film 92 on the conductive pattern 91 can be suppressed.

There may be a plurality of variations in the pattern forming device 1.

The edge 94 does not need to be located in the center of the region 951 near the edge, and the region 951 near the edge may have different widths from the edge 94 to the left and right. The amount of ink in the area 951 near the edge can also decrease steadily as it moves away from the edge 94.

In the above embodiment, although the increase in the amount of ink in the area near the edge 951 and the decrease in the amount of ink in the central area 952 of the pattern are performed, only one of these processes may be performed in the pattern forming apparatus 1. Be executed. Even in the case where only one side of the process is performed, it is still better to form an appropriate thickness on the wiring substrate 9 than when no process is performed. The pattern of the resist film 92 of high degree.

The area 951 near the edge changes according to the shape of the edge 94. Therefore, the shape of the region 951 near the edge is not limited to a straight line or a broken line, but has a plurality of shapes. The pattern central area 952 also has a plurality of shapes consistent with the shape of the conductive pattern 91.

In the pattern forming apparatus 1, as long as the head 3 moves relatively with respect to the mounting table 21, a plurality of structures can be adopted as the moving mechanism 2. For example, the mounting table 21 may be fixed and the head 3 may move in the X direction and the Y direction. The head 3 may move in the Y direction and the mounting table 21 may move in the X direction.

The arrangement of the ejection ports in the head 3 can be changed in multiple ways, and the relationship between the size of the droplet and the distance between the ejection ports in the X direction can also be changed in multiple ways. It is also possible to form a pattern of a resist film in the area under the head 3 by one relative movement of the head 3 with respect to the wiring substrate 9.

The configurations in the above-mentioned embodiments and the respective modification examples can be appropriately combined as long as they do not contradict each other.

Although the invention has been described and illustrated in detail, the described description is illustrative rather than limiting. Therefore, it can be said that various changes or aspects are possible as long as they do not depart from the scope of the present invention.

90: Substrate

91: conductive pattern

92: Resist film

951: The area near the edge

952: Pattern Central Area

953: substrate area

Claims (9)

A pattern forming device uses solder resist ink to form a pattern of resist film on a wiring substrate. The pattern forming device includes: The holding part is for holding the wiring board; The head part ejects droplets of solder resist ink to the aforementioned wiring board by means of inkjet; The moving mechanism relatively moves the head portion relative to the holding portion in a direction parallel to the wiring board; and The control unit controls the head and the moving mechanism, thereby setting the ejection amount of ink per unit area in the area near the edge of the conductive pattern on the wiring board to be higher than that in the area where the conductive pattern is not formed. The ejection amount of ink per unit area is more and a pattern of resist film is formed on the aforementioned wiring substrate. The pattern forming apparatus according to claim 1, wherein the discharge amount of ink per unit area in the central area of the pattern far from the edge in the area of the conductive pattern on the wiring substrate is set by the control of the control unit The ejection amount of ink per unit area is smaller than that in the area where the conductive pattern is not formed, and the pattern of the resist film is formed on the aforementioned wiring substrate. The pattern forming apparatus according to claim 2, wherein the ejection amount of ink per unit area between the area near the edge and the central area of the pattern is set in the area near the edge under the control of the control unit The ejection amount between the ejection amount of ink per unit area and the ejection amount of ink per unit area in the central area of the pattern, and a pattern of resist film is formed on the wiring substrate. A pattern forming device uses solder resist ink to form a pattern of resist film on a wiring substrate. The pattern forming device includes: The holding part is for holding the wiring board; The head part ejects droplets of solder resist ink to the aforementioned wiring board by means of inkjet; The moving mechanism relatively moves the head portion relative to the holding portion in a direction parallel to the wiring board; and The control section controls the head and the moving mechanism, thereby setting the ejection amount of ink per unit area in the central area of the pattern far from the edge in the area of the conductive pattern on the wiring board to be higher than that of the area where the conductive pattern is not formed. The ejection amount of ink per unit area in the area of the conductive pattern is smaller and a resist film pattern is formed on the aforementioned wiring substrate. The pattern forming device according to any one of claims 1 to 4, wherein the aforementioned control unit includes: The memory portion stores conductive pattern data and resist pattern data, the conductive pattern data represents the conductive pattern, and the resist pattern data represents the pattern of the resist film; and The ejection data generating unit generates ejection data based on the conductive pattern data and the resist pattern data, and the ejection data represents the amount of ink ejected from the head to each position on the wiring board. A pattern forming method is to use a solder resist ink to form a pattern of a resist film on a wiring substrate. The aforementioned pattern forming method includes: a) The process is to eject droplets of solder resist ink from the head to the wiring board by inkjet; and b) step, which is parallel to the step a), moving the head relative to the wiring board in a direction parallel to the wiring board; Through the foregoing a) process and the foregoing b) process, the ejection amount of ink per unit area in the area near the edge of the conductive pattern on the wiring substrate is set to be higher than that of each area in which the conductive pattern is not formed. The ejection amount of ink per unit area is greater and a resist film pattern is formed on the aforementioned wiring substrate. A pattern forming method is to use a solder resist ink to form a pattern of a resist film on a wiring substrate. The aforementioned pattern forming method includes: a) The process is to eject droplets of solder resist ink from the head to the wiring board by inkjet; and b) step, which is parallel to the step a), moving the head relative to the wiring board in a direction parallel to the wiring board; Through the aforementioned step a) and the aforementioned step b), the ejection amount of ink per unit area in the central area of the pattern far from the edge in the area of the conductive pattern on the wiring board is set to be higher than that of the area where no conductive pattern is formed. The ejection amount of ink per unit area in the area is smaller and a resist film pattern is formed on the aforementioned wiring substrate. A method for generating ejection data is to generate ejection data. The ejection data is used when the droplets of solder resist ink are ejected from the head to the wiring board by inkjet. The ejection data generation method includes: The process of preparing conductive pattern data and resist pattern data, wherein the conductive pattern data represents the conductive pattern on the wiring substrate, and the resist pattern data represents the pattern of the resist film; and The process of generating ejection data based on the aforementioned conductive pattern data and the aforementioned resist pattern data. The aforementioned ejection data sets the ejection amount of ink per unit area in the area near the edge of the conductive pattern to be lower than that without the conductive pattern formed The ink ejection amount per unit area in the area is more. A method for generating ejection data is to generate ejection data. The ejection data is used when the droplets of solder resist ink are ejected from the head to the wiring board by inkjet. The ejection data generation method includes: The process of preparing conductive pattern data and resist pattern data, wherein the conductive pattern data represents the conductive pattern on the wiring substrate, and the resist pattern data represents the pattern of the resist film; and The process of generating ejection data based on the conductive pattern data and the resist pattern data. The ejection data is the ejection of ink per unit area in the central area of the pattern away from the edge in the area of the conductive pattern on the wiring substrate The amount is set to be smaller than the ejection amount of ink per unit area in the area where the conductive pattern is not formed.

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