KR102327960B1 - Pattern forming apparatus, pattern forming method and ejection data generation method - Google Patents

Abstract

A pattern forming apparatus forms the pattern of the resist film 92 on a wiring board by discharging the droplet of the ink of a soldering resist toward a wiring board by an inkjet method. At this time, the discharge amount of ink per unit area in the edge vicinity region 951 of the conductive pattern 91 on the wiring board per unit area in the base material region 953 in which the conductive pattern 91 is not formed. Make it larger than the amount of ink ejected. In addition, the discharge amount of ink per unit area in the pattern center area 952 separated from the edge among the areas of the conductive pattern 91 is made smaller than the discharge amount of ink per unit area in the base area 953 . Thereby, a pattern of a resist film having an appropriate thickness is formed on the wiring board.

Description

PATTERN FORMING APPARATUS, PATTERN FORMING METHOD AND EJECTION DATA GENERATION METHOD

The present invention relates to a technique for forming a pattern of a resist film on a wiring board.

BACKGROUND ART Conventionally, a resist film is formed on a wiring board for the purpose of protecting a conductor pattern on the wiring board. A resist film also has a role which prevents that solder adheres to areas|regions, such as a conductor wiring, at the time of solder application|coating of a post process, and is also called a "solder resist." As one method of forming a resist film, the method of discharging the ink droplet of a soldering resist toward a wiring board by an inkjet method is known. Such a technique is disclosed, for example in Unexamined-Japanese-Patent No. 9-283893 and Unexamined-Japanese-Patent No. 2008-4820.

By the way, on a wiring board, conductor patterns, such as a conductor wiring and a land, protrude slightly from the surface of base materials, such as a glass epoxy resin. Therefore, when a certain amount of ink per unit area is applied to the wiring board, the resist film may not have the desired thickness. For example, in a step difference between the surface of the substrate and the surface of the conductor pattern, ink flows from on the conductor pattern toward the surface of the substrate, and there is a risk that a resist film of sufficient thickness may not be formed on the edge of the conductor pattern.

In addition, when a certain amount of ink per unit area is applied to the wiring board, the thickness of the conductor pattern directly affects the unevenness of the surface of the resist film, and there is a possibility that the unevenness of the surface of the resist film exceeds the allowable range. In this case, for example, when the solder paste is applied using a metal mask in the subsequent step, there is a risk that the solder may not be applied correctly.

TECHNICAL FIELD This invention relates to the pattern forming apparatus which forms the pattern of a resist film on a wiring board with the ink of a soldering resist.

It is an object of the present invention to form a pattern of a resist film having an appropriate thickness on a wiring board.

A pattern forming apparatus according to one preferred aspect of the present invention comprises: a holding part for holding a wiring board; a head part for discharging droplets of solder resist ink toward the wiring board by an inkjet method; a moving mechanism for relatively moving the head portion with respect to the holding portion in the direction, and by controlling the head portion and the moving mechanism, the amount of ink ejected per unit area in the region near the edge of the conductive pattern on the wiring board; and a control unit for forming a pattern of a resist film on the wiring board while increasing the amount of ink discharged per unit area in a region where no conductive pattern is formed.

Preferably, the discharge amount of ink per unit area in the pattern center region away from the edge among the conductive pattern regions on the wiring board is set by the control of the control unit in units of the conductive pattern area area. A pattern of a resist film is formed on the wiring board while being smaller than the amount of ink discharged per area.

More preferably, the amount of ink discharged per unit area between the region near the edge and the center of the pattern is determined by the control of the control unit, the amount of ink discharged per unit area in the region near the edge and the center of the pattern A pattern of a resist film is formed on the wiring substrate as the discharge amount between the discharge amounts of the ink per unit area in the region.

A pattern forming apparatus according to another preferred aspect of the present invention includes: a holding part for holding a wiring board; a head part for discharging droplets of solder resist ink toward the wiring board by an inkjet method; and parallel to the wiring board. A unit in a pattern central region separated from an edge among regions of a conductive pattern on the wiring board by controlling a moving mechanism for moving the head relative to the holding portion in one direction, and controlling the head and the moving mechanism. and a control unit configured to form a resist film pattern on the wiring board while reducing the ink discharge amount per area less than the ink discharge amount per unit area in a region where no conductive pattern is formed.

In any of the above preferred embodiments, preferably, the control unit includes a storage unit for storing conductive pattern data indicating the conductive pattern and resist pattern data indicating the pattern of the resist film, the conductive pattern data and the resist pattern data and an ejection data generating portion that generates ejection data indicating the amount of ink ejected from the head portion toward each position on the wiring board based on the ?

This invention also relates to the pattern formation method which forms the pattern of a resist film on a wiring board with the ink of a soldering resist. A pattern forming method according to one preferred aspect of the present invention comprises: a) a step of discharging ink droplets of a solder resist from a head portion toward a wiring board by an inkjet method; b) in parallel with step a), the wiring and a step of relatively moving the head portion with respect to the wiring board in a direction parallel to the substrate, and by the steps a) and b), ink per unit area in a region near the edge of the conductive pattern on the wiring board. A pattern of a resist film is formed on the wiring board while increasing the discharge amount of the ink per unit area in the region where the conductive pattern is not formed.

A pattern forming method according to another preferred aspect of the present invention comprises: a) discharging droplets of solder resist ink from a head portion toward a wiring board by an inkjet method; b) in parallel with step a), a step of relatively moving the head portion with respect to the wiring board in a direction parallel to the wiring board; A pattern of a resist film is formed on the wiring board while making the ink discharge amount per unit area smaller than the ink discharge amount per unit area in the region where the conductive pattern is not formed.

The present invention also relates to an ejection data generating method for generating ejection data used when ejecting droplets of ink of a solder resist from a head portion toward a wiring board by an inkjet method. A discharge data generating method according to one preferred aspect of the present invention comprises the steps of: preparing conductive pattern data representing a conductive pattern on a wiring board and resist pattern data representing a pattern of a resist film; the conductive pattern data and the resist pattern data a step of generating ejection data in which the ejection amount of ink per unit area in the region near the edge of the conductive pattern is greater than the ejection amount of ink per unit area in the region where the conductive pattern is not formed based on do.

A discharge data generating method according to another preferred aspect of the present invention comprises the steps of preparing conductive pattern data representing a conductive pattern on a wiring board and resist pattern data representing a pattern of a resist film, the conductive pattern data and the resist pattern Based on the data, the ink ejection amount per unit area in the pattern center region separated from the edge among the conductive pattern regions on the wiring board is higher than the ink ejection amount per unit area in the region where the conductive pattern is not formed. and a step of generating less discharge data.

The above-mentioned and other objects, features, aspects, and advantages will become clear by the detailed description of this invention given below with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the external appearance of a pattern forming apparatus.
Fig. 2 is a diagram showing the configuration of a computer.
Fig. 3 is a diagram showing a functional configuration realized by a computer.
4 : is a figure which shows the flow of operation|movement of a pattern forming apparatus.
5 is a diagram illustrating a conductive pattern.
6 is a diagram illustrating a state in which a resist film is formed on a wiring board.
FIG. 7 is a diagram showing a cross section of the wiring board at positions VII-VII in FIG. 6 .
Fig. 8 is a plan view of a wiring board in the vicinity of a position VII-VII in Fig. 6;
Fig. 9 is a view showing the amount of ink before correction and the cross section of the wiring board.
Fig. 10 is a diagram showing the amount of ink after correction and the cross section of the wiring board.
11 is a diagram showing a cross section of a wiring board to which ink has been applied with the amount of ink before correction.
Fig. 12 is a diagram showing a cross section of a wiring board to which ink has been applied with the amount of ink after correction.
13 is a diagram showing another example of the amount of ink after correction.

1 : is a perspective view which shows the external appearance of the pattern forming apparatus 1. As shown in FIG. The pattern forming apparatus 1 forms the pattern of a resist film on the printed wiring board (henceforth simply a "wiring board") 9 with the ink of a soldering resist. The pattern forming apparatus 1 forms a pattern by an inkjet method. The wiring board 9 is preferably a plate-shaped member, but may be a flexible sheet-shaped member. The resist film protects the conductor pattern on the wiring board 9 . The conductor pattern includes wirings, lands, and other patterns. The resist film is not formed in the region to which the solder paste is applied in the post process, or in other regions where the resist film is not to be formed.

The pattern forming apparatus 1 includes a main body 11 and a control unit 12 . The main body 11 is the Y-direction movement mechanism 2a which moves the wiring board 9 in the Y direction parallel to the wiring board 9, and the ink of a soldering resist toward the wiring board 9 in the middle of movement (the following) , simply referred to as "ink"), a head portion 3 for discharging minute droplets, and an X-direction moving mechanism for moving the head portion 3 in the X direction perpendicular to the Y direction and parallel to the wiring board 9 . (2b) and a tank (4) for storing ink supplied to the head (3). Hereinafter, the Y-direction movement mechanism 2a and the X-direction movement mechanism 2b are collectively called "the movement mechanism 2". Various mechanisms can be used as the Y-direction movement mechanism 2a and the X-direction movement mechanism 2b. For example, a ball screw mechanism with a motor may be employed, or a linear motor may be employed. The control unit 12 controls the moving mechanism 2 and the head unit 3 . Ink is supplied from the tank 4 to the head portion 3 through the tube 41 .

The Y-direction movement mechanism 2a has a holding portion 21 that holds the wiring board 9 . In this embodiment, the holding|maintenance part 21 is a stage, and hereafter, the holding|maintenance part 21 is called "stage 21." The wiring board 9 is held on the stage 21 . In this embodiment, a large number of holes are formed in the surface of the stage 21, and the holes are connected to an unillustrated suction device. By sucking air from the hole, the wiring board 9 is held on the stage 21 . The holding of the wiring board 9 may be performed by other various methods. For example, a groove extending in the horizontal direction from the hole may be formed in the surface of the stage 21 to increase the area for sucking and adsorbing the wiring board 9 . The stage 21 may be formed of a porous material, and suction may be performed from the porous material. The stage 21 may hold the wiring board 9 by a mechanical mechanism.

In the head portion 3, a discharge unit having a plurality of discharge ports arranged at equal intervals with respect to the X direction is formed. Droplets of ink are discharged from each discharge port in an inkjet method. The ink is discharged toward the wiring board 9 in the (-Z) direction in FIG. 1 . In the inkjet method, various structures are available, and a structure using a piezo or a structure using a heater may be used.

The stage 21 is moved in the Y direction parallel to the wiring board 9 by the Y direction moving mechanism 2a while discharging ink droplets from the plurality of discharge ports, whereby ink is supplied to the region extending in the Y direction. Hereinafter, the movement of the wiring board 9 in the Y direction is also referred to as "main scanning". In fact, a plurality of ink lines corresponding to a plurality of discharge ports are formed on the wiring board 9 by one main scan of the wiring board 9 . When one main scan is completed, the head 3 is slightly moved in the X direction parallel to the wiring board 9 by the X direction moving mechanism 2b, and the wiring board 9 is moved by the Y direction moving mechanism 2a. moves in the (-Y) direction. In this way, the second main scanning is performed, and ink lines are formed adjacent to the respective lines of ink formed by the previous main scanning.

By repeating the main scanning a predetermined number of times, a resist film is formed in a region having a width substantially equal to the arrangement width of the plurality of discharge ports in the X direction. Since the resist film is formed only in a necessary region, a pattern of the resist film is precisely formed. Hereinafter, a width substantially equal to the arrangement width in the X direction of the plurality of discharge ports is referred to as a "unit width", and a region in which the resist film is formed with this width is referred to as a "unit area". When a resist film is formed in one unit area, the head 3 is moved by the unit width in the X direction by the X direction movement mechanism 2b, and by repeating the above-mentioned main scanning, the unit adjacent to the previous unit area is A resist film is formed in the region.

By repeating the formation of the resist film in the unit region and the movement of the head portion 3 in the X direction, a pattern of the resist film is formed in the entire required region on the wiring board 9 .

FIG. 2 : is a figure which shows the structure of the computer 5 which the control part 12 has. The computer 5 has a configuration of a general computer system including a CPU 51 for performing various arithmetic processing, a ROM 52 for storing basic programs, and a RAM 53 for storing various kinds of information. The computer 5 includes a fixed disk 54 for storing information, a display 55 for displaying various information such as images, a keyboard 56a serving as an input unit 56 for receiving input from an operator, and a mouse. (56b), a reading device (57) for reading information from a computer-readable recording medium (8) such as an optical disk, a magnetic disk, a magneto-optical disk, a memory card, and a signal between the main body (11) It further includes a communication unit 58 for transmitting and receiving.

In the computer 5 , the program 80 is read out from the recording medium 8 through the reading device 57 in advance and stored in the fixed disk 54 . The program 80 may be stored in the fixed disk 54 via a network. The CPU 51 executes arithmetic processing while using the RAM 53 or the fixed disk 54 according to the program 80 . The CPU 51 functions as an arithmetic unit in the computer 5 . In addition to the CPU 51, other configurations that function as an arithmetic unit may be employed.

FIG. 3 is a diagram showing a functional configuration realized by the computer 5 executing arithmetic processing in accordance with the program 80 . These functional configurations include a discharge data generation unit 61 and a storage unit 62 . The storage unit 62 corresponds to the RAM 53 , the fixed disk 54 , or the like. The discharge data generating unit 61 includes an edge extracting unit 611 , a correcting unit 612 , and a converting unit 613 . All or part of these functions may be realized by a dedicated electric circuit. In addition, these functions may be realized by a plurality of computers.

4 : is a figure which shows the flow of operation|movement of the pattern forming apparatus 1 . Steps S12 to S14 in FIG. 4 are arithmetic processing by the control unit 12 , and step S15 is an operation of the main body 11 under the control of the control unit 12 . In the storage unit 62, the conductive pattern data 71 and the resist pattern data 72 are stored and prepared in advance through the communication unit 58, the reading device 57, or the like (step S11). The conductive pattern data 71 is information indicating a conductive pattern on the wiring board 9 . The resist pattern data 72 is information indicating a pattern of a resist film to be formed on the wiring board 9 . In addition, the conductive pattern data 71 and the resist pattern data 72 may be vector data at a stage stored in the storage unit 62 .

FIG. 5 is a diagram illustrating the conductive pattern 91 on the wiring board 9 . In FIG. 5 , a parallel diagonal line is provided to the conductive pattern 91 . The conductive pattern 91 is typically a thin copper pattern formed on the base material 90 . The base material 90 is formed of, for example, a glass epoxy resin, but may be formed of other materials. The height of the conductive pattern 91 from the surface of the base material 90 is, for example, 35 µm. The height of the conductive pattern 91 may vary. FIG. 6 is a diagram illustrating a state in which a resist film 92 which is an insulating layer is formed on the wiring board 9 . A parallel diagonal line is provided to the resist film 92 . The regions 931 and 932 are regions in which the resist film 92 does not exist.

The edge extraction unit 611 of FIG. 3 generates an image representing the edge of the conductive pattern 91 by performing edge extraction processing on the conductive pattern data 71 . More precisely, edge data, which is data of an image representing an edge, is generated (step S12). The edge data is input to the correction unit 612 . Conductive pattern data 71 and resist pattern data 72 are also input to the correction unit 612 . The resist pattern data 72 is image data indicating a pattern of a resist film, and a value "1" indicating "with application" or a value "0" indicating "without application" of ink is set in each pixel. Hereinafter, a value indicating the presence or absence of application of ink is referred to as a “applied value”.

The correction unit 612 converts the given value of each pixel in the resist pattern data 72 into an ink amount per unit area corresponding to the design thickness of the resist film. That is, the correction unit 612 sets a predetermined amount of ink per unit area for a pixel of "provided". Hereinafter, the amount of ink per unit area is simply referred to as "ink amount". The ink amount is set to "0" for the pixel of "no application". The ink amount may be a value indicating a specific ink amount associated with a unit, or may be a simple value associated with the ink amount.

Next, the correction unit 612 corrects the ink amount of each pixel based on the edge data so that the thickness of the resist film in the region near the edge of the conductive pattern 91 becomes thick (part of step S13). That is, the correction unit 612 corrects the resist pattern data 72 so that the amount of ink applied is increased in the vicinity of the position where the pattern of the resist film to be formed and the edge of the conductive pattern 91 overlap.

The correction unit 612 further refers to the conductive pattern data 71 and the edge data so that, among the regions of the conductive pattern 91, the thickness of the resist film in the central region of the wiring separated from the edge is thinned with the ink of each pixel. amount is corrected (part of step S13). That is, the correction unit 612 corrects the resist pattern data 72 so that the amount of ink to be applied decreases in the region where the pattern of the resist film to be formed and the region inside the conductive pattern 91 overlap.

Specific examples of steps S12 and S13 will be further described with reference to FIGS. 6 to 10 . FIG. 7 is a diagram showing a cross section of the wiring board 9 at positions VII-VII in FIG. 6 at a stage before the resist film 92 is formed. 8 is a plan view of the wiring board 9 in the vicinity of the positions VII-VII in the stage before the resist film 92 is formed. The conductive pattern 91 is formed on the base material 90 and has a certain thickness. The correction unit 612 acquires, from the conductive pattern data 71 , the edge of the conductive pattern 91 assigned with reference numeral 94 in FIGS. 7 and 8 (step S12 ).

Here, in the stage before the resist film 92 is formed, in the range VII-VII in FIG. 6, the resist film 92 is scheduled to be formed entirely. That is, in the entire range, the given value is "1". Therefore, the correction unit 612 sets the ink amount to a predetermined value over the entire range. In this embodiment, the ink amount of the preset value is expressed as "100%". This value is lower than the upper limit of the amount of ink that the head part 3 can eject. The lower end of Fig. 9 shows a cross section of the wiring board 9 at the position VII-VII, similar to Fig. 7, and the upper end shows that the ink amount is set to 100% in the range VII-VII.

Next, the correction unit 612 is a region in the vicinity of the edge of the conductive pattern 91 (in Figs. 7 and 8, a region assigned the reference numeral 951, in Fig. 8, a parallel diagonal line is assigned, based on the edge data) The ink amount, that is, the pixel value, is corrected so that the thickness of the resist film in step S13 is increased (part of step S13). In the upper part of FIG. 10, the code|symbol 951 is attached|subjected to the position corresponding to the edge vicinity area|region 951, and it has shown that the ink amount exceeds 100% in the edge vicinity area|region 951, and it is more than a predetermined value.

In addition, the correction unit 612 refers to the conductive pattern data 71 and the edge data, and as shown in FIGS. 7 and 8 , among the regions of the conductive pattern 91 , the pattern center region separated from the edge 94 . (952) is specified. In FIG. 8, the parallel diagonal line is provided in the pattern center area|region 952. Then, the ink amount, ie, the pixel value, is corrected so that the thickness of the resist film in the pattern center region 952 is reduced (part of step S13). In the upper part of FIG. 10, the reference|symbol 952 is attached|subjected to the position corresponding to the pattern center area 952, and it shows that the ink amount is less than 100% in the pattern center area 952, and the ink amount is smaller than a predetermined value.

Fig. 11 is a diagram showing the resist film 92 in the case where the pattern forming apparatus 1 applies ink at 100% of the ink amount in the entire range VII-VII in Fig. 6 . In the vicinity of the edge 94 of the conductive pattern 91, the ink of the soldering resist flows to some extent from the conductive pattern 91 toward the base material 90, and therefore the thickness of the resist film 92 is a region near the edge. (951), it becomes thinner. As a result, there exists a possibility that insulation defect may generate|occur|produce in the edge vicinity. The thickness of the resist film 92 is, for example, tens of micrometers. The required thickness of the resist film 92 is variously different depending on the kind of the wiring board 9 .

On the other hand, in the pattern center region 952, the resist film 92 has a thickness corresponding to 100% of the ink amount. Here, if the region outside the edge vicinity region 951 is called the base region 953 (see Figs. 7 and 8), the height of the resist film 92 in the pattern center region 952 and the substrate region 953 is If the difference is significantly different, there is a possibility that a problem may arise during application of the solder paste in the subsequent step. Specifically, when a metal plate having an opening corresponding to the area to which the solder paste is applied is disposed on the resist film 92 and the solder paste is printed, that is, applied, between the metal plate and the resist film 92 using a squeegee. There is a possibility that a large gap is partially formed on the surface, so that the application may not be performed properly.

In the pattern forming apparatus 1, in order to solve the said problem in the edge vicinity area|region 951 and the pattern center area|region 952, as mentioned above, the ink amount in the edge vicinity area|region 951 is a base material It is set so that it may become larger than the amount of ink of the area|region 953, and it is set so that the amount of ink in the pattern center area|region 952 may become smaller than the amount of ink of the base material area|region 953. Hereinafter, the corrected resist pattern data 72 converted into data indicating the amount of ink applied per unit area by the correction unit 612 is referred to as "corrected resist pattern data".

The corrected resist pattern data is input to the conversion unit 613 in Fig. 3, and is converted into discharge data 75 indicating the amount of ink discharged at each position by each discharge port of the head unit 3 (step S14). In other words, the ejection data 75 indicates the amount of ink ejected from the head portion 3 toward each position on the wiring board 9 . The discharge data 75 is stored in the storage unit 62 . The ejection data 75 is generated, for example, as data indicating the size of the ink droplet given to each position set in a grid shape with a pitch of 10 mu m on the wiring board 9 .

As described above, the discharge data generation unit 61 generates the discharge data 75 based on the conductive pattern data 71 and the resist pattern data 72 . The corrected resist pattern data and the ejection data 75 have different information formats, and substantially both indicate the ejection amount of ink per unit area.

The main body 11 receives the discharge data 75 from the control unit 12 , and controls the head 3 and the moving mechanism 2 according to the discharge data 75 . Specifically, a step of discharging ink droplets from the head portion 3 toward the wiring board 9, and the head portion 3 relative to the wiring board 9 in a direction parallel to the wiring board 9 The moving process is carried out in parallel. Thereby, ink is applied on the wiring board 9, and the pattern of the resist film 92 is formed (step S15).

Fig. 12 is a diagram showing a resist film 92 formed in accordance with ejection data 75 derived from corrected resist pattern data at positions VII-VII in Fig. 6; In Fig. 12, the shape of the resist film 92 in Fig. 11 is indicated by a double-dotted line. Under the control of the control unit 12, the discharge amount of ink per unit area in the edge vicinity region 951 is set per unit area in the base material region 953, that is, in the region where the conductive pattern 91 is not formed. A pattern of the resist film 92 is formed on the wiring board 9 while increasing the amount of ink discharged. Thereby, sufficient thickness of the resist film 92 in the edge vicinity area|region 951 is ensured.

On the other hand, while the discharge amount of ink per unit area in the pattern center area 952 is smaller than the discharge amount of ink per unit area in the base area 953, that is, in the area where the conductive pattern 91 is not formed, A pattern of a resist film 92 is formed on the wiring board 9 . Thereby, it is suppressed that the resist film 92 thickens unnecessarily in the pattern center area|region 952, and the unevenness|corrugation of the surface of the resist film 92 is relieved. As a result, it is possible to suppress the occurrence of problems in subsequent steps such as application of the solder paste. Furthermore, the consumption amount of ink can also be reduced.

The amount of ink in the region near the edge 951 may be set variously as long as it exceeds the amount of ink in the base region 953 . Assuming that the normal amount of ink in the base region 953 is 100%, the amount of ink in the region near the edge 951 exceeds 100% and is 300% or less. Preferably it is 110 % or more and 200 % or less. The amount of ink in the pattern center region 952 may be variously set as long as it is less than the amount of ink in the base region 953 . The amount of ink in the pattern center area 952 is 20% or more and less than 100% by setting the normal amount of ink in the base region 953 to 100%. Preferably it is 30 % or more and 80 % or less. The ink amounts of the edge vicinity region 951 and the pattern center region 952 are variously changed depending on the viscosity of the ink. The viscosity of the ink is preferably 10 mPa·s or more and 30 mPa·s or less at a temperature of 50°C.

The width in the direction perpendicular to the edge 94 of the region near the edge 951 is 0.3 mm or less on both sides from the edge 94 (0.6 mm or less in width as a whole). Preferably, it is 0.05 mm or more and 0.15 mm or less on both sides from the edge 94 (0.1 mm or more and 0.3 mm or less in overall width). However, positions where ink droplets can be applied exist discretely on the wiring board 9, and since the ink droplets spread on the wiring board 9, when the edge vicinity region 951 is thin, In some cases, only a line of dots formed on the wiring board 9 is formed of droplets with a large amount of liquid.

The concept of increasing the amount of ink in the region near the edge 951 in the corrected resist pattern data is that, in the ejection data 75, the center of the ejected droplet is located in the region 951 near the edge, and the liquid amount of the droplet is large. means that Various methods are employable as a method of increasing the liquid amount of a droplet. For example, there is a method of increasing the size of one droplet or increasing the number of a plurality of microdroplets that can be regarded as one droplet substantially.

In addition, since there are only discrete positions on the wiring board 9 where ink droplets can be applied, the width of the conductive pattern 91 to which the corrected resist pattern data is applied should be 100 µm or more. Preferably, it is more preferably 150 μm or more, and most preferably 200 μm or more. The positions on the wiring board 9 where the ink droplets can be applied are preferably at a pitch of 20 µm or less, and more preferably at a pitch of 10 µm or less.

Fig. 13 is a diagram showing another example of the amount of ink at positions VII-VII in Fig. 6; In FIG. 13, as indicated by reference numeral 954, between the edge vicinity region 951 and the pattern center region 952, as compared with FIG. 10, the amount of ink in the edge vicinity region 951 is smaller than that of the pattern center region 952 ), an ink amount greater than the ink amount of ) is set. The region where the ink amount is intermediate is, for example, an edge vicinity region when the conductive pattern data 71 and edge data are input to the correction unit 612 to set the edge vicinity region 951 and the pattern center region 952. It is set between (951) and the pattern center area|region 952, or in the part in contact with the edge vicinity area|region 951 of the pattern center area|region 952. Hereinafter, a region with an intermediate amount of ink between the edge vicinity region 951 and the pattern center region 952 is referred to as an "intermediate region 954". The amount of ink in the intermediate region 954 may be equal to the amount of ink in the base region 953 .

By applying ink by generating discharge data from the corrected resist pattern data shown in Fig. 13, in the pattern forming apparatus 1, under the control of the control unit 12, the edge vicinity region 951 and the pattern center region ( 952), the ink ejection amount per unit area in the intermediate region 954 is calculated as the amount of ink ejected per unit area in the edge vicinity region 951 and the ink per unit area in the pattern center region 952. A pattern of a resist film 92 is formed on the wiring board 9 with the discharge amount between the discharge amounts. Thereby, the difference in the ink amount between the edge vicinity area|region 951 and the pattern center area|region 952 is relieve|moderated, and generation|occurrence|production of unnatural unevenness in the resist film 92 on the conductive pattern 91 is suppressed.

In the pattern forming apparatus 1, various deformation|transformation is possible.

The edge 94 does not need to be located at the center of the edge vicinity region 951 , and the edge vicinity region 951 may exist by a width different from the edge 94 to the left and right. The amount of ink in the region near the edge 951 may decrease gently as it moves away from the edge 94 .

In the above embodiment, an increase in the amount of ink in the edge vicinity region 951 and a decrease in the amount of ink in the pattern center region 952 are performed, but only one of these processes is performed in the pattern forming apparatus 1 may be executed in Even in the case where only one process is performed, a pattern of the resist film 92 having an appropriate thickness can be formed on the wiring board 9 as compared with the case in which neither process is performed.

The region 951 near the edge is changed in accordance with the shape of the edge 94 . Therefore, the shape of the region near the edge 951 is not limited to a straight line or a broken line, and has various shapes. The pattern center region 952 also has various shapes to match the shape of the conductive pattern 91 .

In the pattern forming apparatus 1, as long as the head part 3 moves relatively with respect to the stage 21, various structures are employable as the moving mechanism 2. For example, the stage 21 may be fixed, and the head part 3 may move in an X direction and a Y direction. The head 3 may move in the Y direction, and the stage 21 may move in the X direction.

The arrangement of the discharge ports in the head 3 can be variously changed, and the relationship between the size of the droplet and the pitch of the discharge ports in the X direction can be variously changed. The pattern of the resist film may be formed in the region below the head 3 by one relative movement of the head 3 with respect to the wiring board 9 .

The configurations in the above embodiment and each modification may be appropriately combined as long as they do not contradict each other.

Although the invention has been described and described in detail, the foregoing description is illustrative and not restrictive. Therefore, it can be said that many modifications and aspects are possible without departing from the scope of the present invention.

1: pattern forming device
2: moving mechanism
3: head part
9: wiring board
12: control unit
21: Stage (maintenance part)
61: discharge data generation unit
62: memory
71: conductive pattern data
72: resist pattern data
75: discharge data
91: challenge pattern
92: resist film
94 : edge
951: edge vicinity region
952: pattern center area
953: substrate area
954: middle area
S11 ~ S15: Step

Claims (9)

A pattern forming apparatus for forming a resist film pattern on a wiring board with solder resist ink, comprising:
a holding part for holding the wiring board;
a head for discharging droplets of solder resist ink toward the wiring board by an inkjet method;
a moving mechanism for relatively moving the head portion with respect to the holding portion in a direction parallel to the wiring board;
By controlling the head part and the moving mechanism, the ink discharge amount per unit area in the region near the edge of the conductive pattern on the wiring board is higher than the ink discharge amount per unit area in the area where the conductive pattern is not formed. a control unit for forming a pattern of a resist film on the wiring board while increasing the number;
Under the control of the control unit, the discharge amount of ink per unit area in the pattern center region separated from the edge among the conductive pattern regions on the wiring board is adjusted to the amount of ink per unit area in the region where the conductive pattern is not formed. A pattern forming apparatus in which a pattern of a resist film is formed on the wiring board while being less than the discharge amount. The method of claim 1,
Under the control of the control unit, the ink ejection amount per unit area between the edge vicinity region and the pattern center region is determined by the ink ejection amount per unit area in the edge vicinity region and the unit in the pattern central region. A pattern forming apparatus in which a pattern of a resist film is formed on the wiring board, with a discharge amount between the discharge amounts of ink per area. A pattern forming apparatus for forming a resist film pattern on a wiring board with solder resist ink, comprising:
a holding part for holding the wiring board;
a head for discharging droplets of solder resist ink toward the wiring board by an inkjet method;
a moving mechanism for relatively moving the head portion with respect to the holding portion in a direction parallel to the wiring board;
By controlling the head part and the moving mechanism, the discharge amount of ink per unit area in the pattern center region separated from the edge among the conductive pattern regions on the wiring board is determined in units of the region where the conductive pattern is not formed. and a control unit for forming a pattern of a resist film on the wiring board while reducing the amount of ink discharged per area. 4. The method according to any one of claims 1 to 3,
the control unit,
a storage unit for storing conductive pattern data indicating the conductive pattern and resist pattern data indicating the pattern of the resist film;
and an ejection data generating unit that generates ejection data representing an amount of ink ejected from the head portion toward each position on the wiring board, based on the conductive pattern data and the resist pattern data. A pattern forming method for forming a pattern of a resist film on a wiring board with an ink of a solder resist, the pattern forming method comprising:
a) a step of discharging the ink droplets of the solder resist from the head toward the wiring board by the inkjet method;
b) in parallel with step a), comprising a step of relatively moving the head unit with respect to the wiring board in a direction parallel to the wiring board;
Through the steps a) and b), the ink discharge amount per unit area in the region near the edge of the conductive pattern on the wiring board is higher than the ink discharge amount per unit area in the region where the conductive pattern is not formed. and, in the area of the conductive pattern on the wiring board, the ink discharge amount per unit area in the pattern central area separated from the edge is smaller than the ink discharge amount per unit area in the area where the conductive pattern is not formed. A pattern forming method in which a pattern of a resist film is formed on a wiring board. A pattern forming method for forming a pattern of a resist film on a wiring board with an ink of a solder resist, the pattern forming method comprising:
a) a step of discharging the ink droplets of the solder resist from the head toward the wiring board by the inkjet method;
b) in parallel with step a), comprising a step of relatively moving the head unit with respect to the wiring board in a direction parallel to the wiring board;
According to the steps a) and b), the discharge amount of ink per unit area in the pattern central region separated from the edge among the conductive pattern regions on the wiring board per unit area in the region where the conductive pattern is not formed A pattern forming method in which a pattern of a resist film is formed on the wiring board while being less than the amount of ink ejected. An ejection data generating method for generating ejection data used when ejecting droplets of ink of a solder resist from a head portion toward a wiring board by an inkjet method, the method comprising:
A step of preparing conductive pattern data representing a conductive pattern on a wiring board and resist pattern data representing a pattern of a resist film;
Based on the conductive pattern data and the resist pattern data, the ink discharge amount per unit area in the region near the edge of the conductive pattern is larger than the ink discharge amount per unit area in the area where the conductive pattern is not formed. and the discharge amount of ink per unit area in the pattern central area separated from the edge among the areas of the conductive pattern on the wiring board is less than the amount of ink per unit area in the area where the conductive pattern is not formed. A discharge data generating method comprising the step of generating data. An ejection data generating method for generating ejection data used when ejecting droplets of ink of a solder resist from a head portion toward a wiring board by an inkjet method, the method comprising:
A step of preparing conductive pattern data representing a conductive pattern on a wiring board and resist pattern data representing a pattern of a resist film;
Based on the conductive pattern data and the resist pattern data, the discharge amount of ink per unit area in the pattern central region separated from the edge among the conductive pattern regions on the wiring board is determined in the region where the conductive pattern is not formed. An ejection data generating method comprising the step of generating ejection data that is smaller than an ejection amount of ink per unit area of . delete

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