CN111446184A - Pattern forming apparatus, pattern forming method, and ejection data generating method - Google Patents
Pattern forming apparatus, pattern forming method, and ejection data generating method Download PDFInfo
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- CN111446184A CN111446184A CN202010032383.6A CN202010032383A CN111446184A CN 111446184 A CN111446184 A CN 111446184A CN 202010032383 A CN202010032383 A CN 202010032383A CN 111446184 A CN111446184 A CN 111446184A
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- pattern
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- solder resist
- wiring substrate
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
Abstract
The invention provides a pattern forming apparatus, which forms a pattern of a solder resist film (92) on a wiring substrate by ejecting droplets of solder resist ink onto the wiring substrate in an ink jet manner. At this time, the amount of ink ejected per unit area of the near-edge region (951) of the conductive pattern (91) on the wiring board is set to be greater than the amount of ink ejected per unit area of the base material region (953) in which the conductive pattern (91) is not formed. The ink discharge amount per unit area of the pattern center region (952) that is far from the edge in the region of the conductive pattern (91) is set to be smaller than the ink discharge amount per unit area of the base region (953). Thereby, a pattern of a solder resist having an appropriate thickness is formed on the wiring substrate.
Description
Technical Field
The present invention relates to a technique for forming a pattern of a solder resist (resist) film on a wiring substrate.
Background
Conventionally, a solder resist is formed on a wiring board in order to protect a conductor pattern on the wiring board. The solder resist film has a function of preventing solder from adhering to a region such as a conductor wiring at the time of solder application in a subsequent step, and is also called a "solder resist (solder resist)". As a method for forming a solder resist film, a method of ejecting ink droplets of a solder resist onto a wiring board by an ink jet method is known. Such techniques are disclosed in Japanese patent laid-open publication Nos. 9-283893 and 2008-4820.
However, in the wiring board, conductor patterns such as conductor wiring and pads slightly protrude from the surface of a base material such as glass epoxy resin. Therefore, if a certain amount of ink is applied per unit area of the wiring substrate, the solder resist may not be formed to a desired thickness. For example, at the height difference between the surface of the substrate and the surface of the conductor pattern, ink flows from above the conductor pattern to the surface of the substrate, and a solder resist film of a sufficient thickness may not be formed on the edge of the conductor pattern.
Also, there is a fear that: when a certain amount of ink is applied to each unit area of the wiring substrate, the thickness of the conductor pattern directly affects the unevenness of the surface of the solder resist, and the unevenness of the surface of the solder resist may exceed the allowable range. In this case, for example, when the solder paste is applied using a metal mask in a subsequent process, the solder may not be applied correctly.
Disclosure of Invention
The invention aims to provide a pattern forming device for forming a solder mask pattern on a wiring substrate by using solder mask ink.
The purpose of the present invention is to form a pattern of a solder resist film having an appropriate thickness on a wiring substrate.
A pattern forming apparatus according to a preferred embodiment of the present invention includes: a holding unit for holding the wiring substrate; a head configured to eject droplets of solder resist ink onto the wiring board by an inkjet method; a moving mechanism that moves the head portion relative to the holding portion in a direction parallel to the wiring substrate; and a control unit configured to control the head unit and the moving mechanism to form a pattern of a solder resist on the wiring substrate such that an amount of ink ejected per unit area of a region near an edge of the conductive pattern on the wiring substrate is larger than an amount of ink ejected per unit area of a region where the conductive pattern is not formed.
Preferably, the control unit performs control so that an amount of ink ejected per unit area of a pattern center region distant from an edge in a region of the conductive pattern on the wiring substrate is smaller than an amount of ink ejected per unit area of a region where the conductive pattern is not formed, and forms a pattern of the solder resist on the wiring substrate.
More preferably, the control unit sets the ink ejection rate per unit area between the edge vicinity area and the pattern center area to an ejection rate between the ink ejection rate per unit area of the edge vicinity area and the ink ejection rate per unit area of the pattern center area, and forms the pattern of the solder resist on the wiring substrate.
A pattern forming apparatus holding unit according to another preferred embodiment of the present invention holds a wiring board; a head configured to eject droplets of solder resist ink onto the wiring board by an inkjet method; a moving mechanism that moves the head portion relative to the holding portion in a direction parallel to the wiring substrate; and a control unit configured to control the head unit and the moving mechanism to set an ejection rate of ink per unit area of a pattern center region distant from an edge in a region of the conductive pattern on the wiring substrate to be smaller than an ejection rate of ink per unit area of a region where the conductive pattern is not formed, and to form a pattern of a solder resist on the wiring substrate.
In any one of the above preferred embodiments, the control unit preferably includes: a storage unit that stores conductive pattern data representing the conductive pattern and solder resist pattern data representing a pattern of the solder resist; and an ejection data generating section that generates ejection data indicating an amount of ink ejected from the head section to each position on the wiring substrate, based on the conductive pattern data and the solder resist pattern data.
The invention provides a pattern forming method for forming a solder resist pattern on a wiring substrate by using solder resist ink. A pattern forming method according to a preferred embodiment of the present invention includes: a step a) of ejecting a droplet of solder resist ink from a head to a wiring board by an ink jet method, and a step b) of moving the head relative to the wiring board in a direction parallel to the wiring board by the step a) and the step b) so that an ejection amount of ink per unit area of a region near an edge of a conductive pattern on the wiring board is larger than an ejection amount of ink per unit area of a region where the conductive pattern is not formed, and forming a pattern of a solder resist on the wiring board.
A pattern forming method according to another preferred embodiment of the present invention includes: a step a) of ejecting a droplet of solder resist ink from a head to a wiring board by an ink jet method, and a step b) of moving the head relative to the wiring board in a direction parallel to the wiring board by the step a) and the step b) so that an ejection amount of ink per unit area of a pattern center region distant from an edge in a region of a conductive pattern on the wiring board is smaller than an ejection amount of ink per unit area of a region where the conductive pattern is not formed, and forming a pattern of a solder resist film on the wiring board.
The invention aims to provide a method for generating ejection data, which is used for generating ejection data when an ink droplet of a solder resist is ejected from a head part to a wiring substrate in an ink jet mode. An ejection data generating method according to a preferred embodiment of the present invention includes: a preparation step of preparing conductive pattern data representing a conductive pattern on the wiring substrate and solder resist pattern data representing a pattern of the solder resist; and an ejection data generation step of generating, from the conductive pattern data and the solder resist pattern data, ejection data in which the amount of ink ejected per unit area in the region near the edge of the conductive pattern is set to be greater than the amount of ink ejected per unit area in the region where the conductive pattern is not formed.
Another preferred embodiment of the present invention provides an ejection data generating method including: a preparation step of preparing conductive pattern data representing a conductive pattern on the wiring substrate and solder resist pattern data representing a pattern of the solder resist; and an ejection data generation step of generating ejection data in which the amount of ink ejected per unit area of a pattern center region located away from the edge in a region of the conductive pattern on the wiring substrate is set to be smaller than the amount of ink ejected per unit area of a region where the conductive pattern is not formed, based on the conductive pattern data and the solder resist pattern data.
The above and other objects, features, aspects and advantages will become apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.
Drawings
Fig. 1 is a perspective view showing an external appearance of a pattern forming apparatus.
Fig. 2 is a diagram showing a configuration of a computer.
Fig. 3 is a diagram showing a functional configuration realized by a computer.
Fig. 4 is a diagram showing an operation flow of the pattern forming apparatus.
Fig. 5 is an exemplary view of a conductive pattern.
Fig. 6 is an exemplary view of a form in which a solder resist film is formed on a wiring substrate.
Fig. 7 is a cross-sectional view of the wiring substrate at VII-VII in fig. 6.
Fig. 8 is a plan view of the wiring substrate near the position VII-VII in fig. 6.
Fig. 9 is a view showing the amount of ink before correction and a cross section of the wiring substrate.
Fig. 10 is a view showing the corrected ink amount and the cross section of the wiring substrate.
Fig. 11 is a cross-sectional view showing a wiring substrate to which ink is applied in an amount of ink before correction.
Fig. 12 is a view showing a cross section of the wiring substrate to which ink is applied in the corrected ink amount.
Fig. 13 is a diagram showing another example of the corrected ink amount.
Wherein the reference numerals are as follows:
1 Pattern forming apparatus
2 moving mechanism
3 head part
9 Wiring board
12 control part
21 stage (holding part)
61 discharge data generating part
62 storage unit
71 conductive pattern data
72 solder mask pattern data
75 ejection data
91 conductive pattern
92 solder mask
94 edge
951 near the edge region
952 central region of pattern
953 region of the substrate
954 middle region
S11-S15
Detailed Description
Fig. 1 is a perspective view showing an external appearance of a pattern forming apparatus 1. The pattern forming apparatus 1 forms a solder resist pattern on a printed wiring board (hereinafter, simply referred to as "wiring board") 9 using solder resist ink. The pattern forming apparatus 1 forms a pattern by an ink jet method. The wiring board 9 is preferably a plate-like member, but may be a plate-like member having flexibility. The solder resist protects the conductor pattern on the wiring substrate 9. The conductor pattern includes a wiring, a pad, and other patterns. The solder resist is not formed in the area where the solder paste is applied in the subsequent process and other areas where the solder resist should not be provided.
The pattern forming apparatus 1 has a main body 11 and a control section 12. The main body 11 has: a Y-direction moving mechanism 2a that moves the wiring substrate 9 in a Y-direction parallel to the wiring substrate 9; a head 3 that ejects a minute droplet of solder resist ink (hereinafter simply referred to as "ink") onto the moving wiring board 9; an X-direction moving mechanism 2b for moving the head 3 in an X-direction perpendicular to the Y-direction and parallel to the wiring substrate 9; and a tank 4 for storing the ink supplied to the head 3. Hereinafter, the Y-direction moving mechanism 2a and the X-direction moving mechanism 2b will be generically referred to as "moving mechanisms 2". As the Y-direction moving mechanism 2a and the X-direction moving mechanism 2b, various mechanisms can be used. For example, a ball screw mechanism having a motor mounted thereon may be used, or a linear motor may be used. The control unit 12 controls the moving mechanism 2 and the head 3. Ink is supplied from the tank 4 to the head 3 via the tube 41.
The Y-direction moving mechanism 2a includes a holding portion 21 for holding the wiring substrate 9. In the present embodiment, the holding portion 21 is a stage, and hereinafter, the holding portion 21 is referred to as "stage 21". The wiring substrate 9 is held on the stage 21. In the present embodiment, a plurality of holes are formed in the surface of the stage 21, and the holes are connected to a suction device, not shown. By sucking air from the hole, the wiring substrate 9 is held on the stage 21. The holding of the wiring substrate 9 may be achieved by other various methods. For example, a groove extending horizontally from the hole may be formed on the surface of the stage 21 to increase the area for sucking and adsorbing the wiring board 9. The stage 21 may be formed of a porous material, and the suction may be performed by the porous material. The stage 21 may hold the wiring substrate 9 by a mechanical mechanism.
The head 3 is provided with a discharge unit having a plurality of discharge ports arranged at equal intervals in the X direction. Droplets of the ink are ejected from the respective ejection openings by an ink jet method. Ink is ejected toward the wiring substrate 9 along the (-Z) direction in fig. 1. As the ink jet system, various structures can be used, and a structure using a piezoelectric and a structure using a heater can be used.
Droplets of ink are ejected from the plurality of ejection ports, and the stage 21 is moved in the Y direction parallel to the wiring substrate 9 by the Y direction moving mechanism 2a, thereby applying ink to a region extending in the Y direction. Hereinafter, the movement of the wiring substrate 9 in the Y direction is referred to as "main scanning". In practice, a plurality of ink lines corresponding to a plurality of ejection ports are formed on the wiring substrate 9 during one main scanning of the wiring substrate 9. When one main scanning is completed, the head 3 is slightly moved in the X direction parallel to the wiring substrate 9 by the X direction moving mechanism 2b, and the wiring substrate 9 is moved in the (-Y) direction by the Y direction moving mechanism 2 a. Thereby, the second main scanning is performed, and ink lines adjacent to the respective lines of ink formed in the previous main scanning are formed.
The main scanning is repeated a predetermined number of times, and a solder resist film is formed in a region having a width substantially equal to the array width of the plurality of ejection orifices in the X direction. Since the solder resist is formed only in a desired area, the pattern of the solder resist can be formed accurately. Hereinafter, a width substantially equal to the array width of the plurality of ejection orifices in the X direction is referred to as a "unit width", and a region where the solder resist is formed with the width is referred to as a "unit region". When forming a solder resist in one unit area, the head 3 is moved by the X-direction moving mechanism 2b by a unit width in the X direction, and the main scanning is repeated to form a solder resist in a unit area adjacent to the previous unit area.
By repeating the formation of the solder resist in the unit area and the movement of the head 3 in the X direction, a solder resist pattern is formed in all necessary areas on the wiring substrate 9.
Fig. 2 is a diagram showing a configuration of the computer 5 included in the control unit 12. The computer 5 is formed as a structure of a conventional computer system, and includes a CPU51 that performs various computing processes, a ROM52 that stores basic programs, and a RAM53 that stores various information. The computer 5 further includes: a fixed disk 54 for storing information, a display 55 for displaying various information such as images, a keyboard 56a and a mouse 56b as an input unit 56 for receiving an input from an operator, a reading device 57 for reading information from a computer-readable storage medium 8 such as an optical disk, a magnetic disk, a magneto-optical disk, and a memory card, and a communication unit 58 for transmitting and receiving signals to and from the main body 11.
In the computer 5, the program 80 is read from the storage medium 8 by the reading device 57 in advance and stored in the fixed disk 54. The program 80 may also be stored on the fixed disk 54 via a network. The CPU51 performs calculation processing using the RAM53 or the fixed disk 54 according to the program 80. The CPU51 functions as a calculation unit in the computer 5. Other configurations than the CPU51 may be employed to function as a calculation unit.
Fig. 3 is a diagram showing a functional configuration realized by the computer 5 performing calculation processing according to the program 80. These functional configurations include an ejection data generation unit 61 and a storage unit 62. The storage unit 62 corresponds to the RAM53, the fixed disk 54, and the like. The discharge data generating unit 61 includes an edge extracting unit 611, a correcting unit 612, and a converting unit 613. All or a portion of these functions may be implemented by dedicated circuitry. These functions may also be implemented by a plurality of computers.
Fig. 4 is a diagram showing the flow of operation of the pattern forming apparatus 1. Steps S12 to S14 in fig. 4 are calculation processes executed by the control unit 12, and step S15 is an operation of the control unit 12 on the main body 11. The storage section 62 stores and prepares the conductive pattern data 71 and the solder resist pattern data 72 in advance by the communication section 58, the reading device 57, or the like (step S11). The conductive pattern data 71 is information indicating a conductive pattern on the wiring substrate 9. The solder resist pattern data 72 is information indicating a pattern of a predetermined solder resist film formed on the wiring substrate 9. Further, at the stage of being stored in the storage section 62, the conductive pattern data 71 and the solder resist pattern data 72 may be vector data.
Fig. 5 is an exemplary view of a conductive pattern 91 on the wiring substrate 9. In fig. 5, the conductive pattern 91 is marked with parallel oblique lines. Typically, the conductive pattern 91 is a pattern of thin copper formed on the substrate 90. The substrate 90 is formed of, for example, glass epoxy resin, but may be formed of other materials. The height of the conductive pattern 91 above the surface of the base material 90 is, for example, 35 μm. The height of the conductive pattern 91 is various. Fig. 6 is an explanatory diagram of a case where a solder resist 92 as an insulating layer is formed on the wiring substrate 9. The solder resist 92 is marked with parallel oblique lines. The regions 931, 932 are regions where the solder resist 92 is absent.
The edge extraction unit 611 in fig. 3 performs an edge extraction process on the conductive pattern data 71 to generate an image representing the edge of the conductive pattern 91. Edge data, which is data of an image representing an edge, is correctly generated (step S12). The edge data is input to the correction section 612. The correction unit 612 also receives the conductive pattern data 71 and the solder resist pattern data 72. The solder resist pattern data 72 is data representing an image of a pattern of the solder resist, and a value "1" indicating that ink is "given" or a value "0" indicating that ink is "not given" is set for each pixel. Hereinafter, the value indicating whether or not the ink is given will be referred to as "given value".
The correction section 612 converts the given value of each pixel of the solder resist pattern data 72 into an ink amount per unit area corresponding to the thickness of the solder resist in design. That is, the correction unit 612 sets a predetermined amount of ink per unit area for the "given" pixel. Hereinafter, the amount of ink per unit area is simply referred to as "ink amount". For the "not-given" pixel, the ink amount is set to "0". The ink amount may be a value indicating a specific ink amount associated with a unit, or may be a simple value associated with the ink amount.
Then, the correcting section 612 corrects the ink amount of each pixel based on the edge data so that the thickness of the solder resist in the area near the edge of the conductive pattern 91 becomes thicker (part of step S13). That is, the correction unit 612 corrects the solder resist pattern data 72 so as to increase the amount of ink applied in the vicinity of the position where the pattern of the solder resist film to be formed overlaps with the edge of the conductive pattern 91.
Further, the correcting section 612 corrects the ink amount of each pixel by referring to the conductive pattern data 71 and the edge data to thin the thickness of the solder resist in the wiring center area away from the edge in the area of the conductive pattern 91 (part of step S13). That is, the correction section 612 corrects the solder resist pattern data 72 so that the amount of ink given to the area where the pattern of the solder resist film to be formed and the area closer to the inside than the edge of the conductive pattern 91 overlap is reduced.
Specific examples of steps S12 and S13 will be further described with reference to fig. 6 to 10. Fig. 7 is a cross-sectional view of the wiring substrate 9 at a position VII-VII in fig. 6 before the solder resist 92 is formed. Fig. 8 is a plan view of the wiring substrate 9 near the position VII-VII at the stage before the solder resist 92 is formed. The conductive pattern 91 is formed on the substrate 90 to have a certain programmed thickness. The correction unit 612 obtains the edge of the conductive pattern 91 marked with the reference numeral 94 in fig. 7 and 8 from the conductive pattern data 71 (step S12).
Wherein the reservation is: at a stage before forming the solder resist 92, the solder resist 92 is formed as a whole in the range of VII-VII of fig. 6. That is, a value of "1" is given throughout the range. Therefore, the correction unit 612 sets the ink amount to a predetermined value over the entire range. In the present embodiment, the ink amount of the predetermined value is expressed as "100%". This value is lower than the upper limit value of the amount of ink that can be ejected from the head 3. Similarly to fig. 7, the lower half of fig. 9 shows a cross section of the wiring board 9 at a position VII-VII, and the upper half shows that the amount of ink is set to 100% in a range VII-VII.
Then, the correcting unit 612 corrects the pixel value, which is the amount of ink, based on the edge data so that the solder resist film in the area near the edge of the conductive pattern 91 (the area marked with the reference character 951 in fig. 7 and 8, and the parallel oblique lines in fig. 8) becomes thicker (part of step S13). In the upper part of fig. 10, a position corresponding to the edge vicinity region 951 is marked with a symbol 951, and it is shown that the ink amount exceeds 100%, that is, exceeds a predetermined value in the edge vicinity region 951.
As shown in fig. 7 and 8, the correction unit 612 refers to the conductive pattern data 71 and the edge data to specify a pattern center area 952 that is far from the edge 94 in the area of the conductive pattern 91. In fig. 8, the pattern central region 952 is marked with parallel oblique lines. Then, the ink amount, that is, the pixel value is corrected so that the thickness of the solder resist in the pattern center area 952 becomes thinner (part of step S13). In the upper half of fig. 10, a position corresponding to the pattern central region 952 is marked with a symbol 952, showing that the amount of ink in the pattern central region 952 is less than 100% ink amount, i.e., less than a predetermined value.
Fig. 11 is a diagram showing the solder resist 92 in a case where the patterning device 1 is assumed to supply ink in an amount of 100% of the ink over the entire range VII to VII in fig. 6. Since the ink of the solder resist flows down to some extent from the conductive pattern 91 to the substrate 90 in the vicinity of the edge 94 of the conductive pattern 91, the thickness of the solder resist 92 becomes thin in the vicinity of the edge 951. As a result, insulation failure occurs near the edge. The thickness of the solder resist 92 needs to be, for example, ten and several micrometers. The required thickness of the solder resist 92 varies depending on the kind of the wiring substrate 9.
On the other hand, in the pattern center region 952, the thickness of the solder resist 92 is formed to a thickness corresponding to 100% of the ink amount. Note that, a region located outside the edge vicinity region 951 is referred to as a base material region 953 (see fig. 7 and 8), and if the difference in height of the solder resist 92 between the pattern center region 952 and the base material region 953 is significantly different, a problem occurs in the subsequent step of applying the solder paste. Specifically, when a metal plate having an opening corresponding to a region to which the solder paste is applied is placed on the solder resist 92 and the solder paste is applied by printing using a squeegee, a large gap is locally formed between the metal plate and the solder resist 92, and thus the solder paste cannot be applied properly.
In the pattern forming apparatus 1, in order to solve the above-described problems of the edge vicinity area 951 and the pattern center area 952, as described above, the ink amount in the edge vicinity area 951 is set to be larger than the ink amount in the base area 953, and the ink amount in the pattern center area 952 is set to be smaller than the ink amount in the base area 953. Hereinafter, the data indicating the amount of ink applied per unit area is converted by the correction unit 612, and the corrected solder resist pattern data 72 is referred to as "corrected solder resist pattern data".
The corrected solder resist pattern data is input to the conversion portion 613 of fig. 3, and is converted into ejection data 75 (step S14), the ejection data 75 indicating the amount of ink ejected from each ejection port of the head 3 at each position. In other words, the ejection data 75 indicates the amount of ink ejected from the head unit 3 to each position on the wiring substrate 9. The discharge data 75 is stored in the storage unit 62. The ejection data 75 is generated as data indicating, for example, the size of ink droplets to be applied to each position on the wiring substrate 9 in a grid pattern at a pitch of 10 μm.
As described above, the ejection data generating section 61 generates the ejection data 75 from the conductive pattern data 71 and the solder resist pattern data 72. The corrected solder resist pattern data and the ejection data 75 are different only in the form of information, and substantially both represent the ejection amount of ink per unit area.
The main body 11 receives the ejection data 75 from the control section 12, and controls the head 3 and the moving mechanism 2 according to the ejection data 75. Specifically, a step of ejecting droplets of ink from the head unit 3 to the wiring substrate 9 and a step of relatively moving the head unit 3 with respect to the wiring substrate 9 in a direction parallel to the wiring substrate 9 are performed in parallel. Thereby, the ink is supplied onto the wiring substrate 9, and the pattern of the solder resist 92 is formed (step S15).
Fig. 12 is a diagram showing a solder resist 92 formed from the ejection data 75 derived from the corrected solder resist pattern data at a position VII-VII in fig. 6. In fig. 12, the shape of the solder resist 92 of fig. 11 is indicated by a two-dot chain line. The control of the controller 12 causes the amount of ink ejected per unit area of the near-edge region 951 to be larger than the amount of ink ejected per unit area of the base material region 953, that is, the region where the conductive pattern 91 is not formed, and forms a pattern of the solder resist 92 on the wiring substrate 9. Thereby, a sufficient thickness of the solder resist 92 is ensured in the edge vicinity region 951.
On the other hand, the amount of ink discharged per unit area of the pattern center region 952 is made smaller than the amount of ink discharged per unit area of the base material region 953, that is, the region where the conductive pattern 91 is not formed, and the pattern of the solder resist 92 is formed on the wiring substrate 9. This can suppress unnecessary thickening of the solder resist 92 in the pattern center region 952, and can alleviate unevenness on the surface of the solder resist 92. As a result, occurrence of defects in subsequent steps such as application of solder paste can be suppressed. Further, the amount of ink consumed can be reduced.
The ink amount in the edge vicinity region 951 can be variously set as long as it is larger than the ink amount in the substrate region 953. The conventional ink amount in the base material region 953 is set to 100%, and the ink amount in the edge vicinity region 951 is set to more than 100% and 300% or less, preferably 110% or more and 200% or less. The ink amount in the pattern center region 952 can be variously set as long as it is lower than that in the base material region 953. The conventional ink amount in the base material region 953 is set to 100%, and the ink amount in the pattern center region 952 is set to 20% or more and less than 100%, preferably 30% or more and 80% or less. The ink amounts in the near-edge region 951 and the pattern center region 952 are variously changed depending on the viscosity of the ink. The viscosity of the ink is preferably 10 mPas to 30 mPas at a temperature of 50 ℃.
The width in the direction perpendicular to the edge 94 of the near-edge region 951 is 0.3mm or less from the edge 94 to both sides (the entire width is 0.6mm or less), and preferably 0.05mm or more and 0.15mm or less from the edge 94 to both sides (the entire width is 0.1mm or more and 0.3mm or less). However, since the positions of the droplets capable of giving ink are present discretely on the wiring substrate 9 and the droplets of ink spread on the wiring substrate 9, if the edge vicinity region 951 is fine, only one row of pixels formed on the wiring substrate 9 may be formed with droplets having a large liquid amount.
The concept that the ink amount is increased in the near-edge region 951 in the corrected solder resist pattern data means that the liquid amount of the liquid droplet in which the center of the liquid droplet to be ejected is positioned in the near-edge region 951 is large in the ejection data 75. There are various methods of increasing the amount of the droplet liquid, for example, a method of setting the size of one droplet to be large, or a method of setting the number of a plurality of fine droplets that can be substantially regarded as one droplet to be large.
Further, since the positions of the droplets capable of imparting ink are present discretely on the wiring substrate 9, the width of the conductive pattern 91 to which the corrected solder resist pattern data is applied is preferably 100 μm or more, more preferably 150 μm or more, and most preferably 200 μm or more. The positions on the wiring substrate 9 where the ink droplets can be applied are preferably present at a pitch of 20 μm or less, more preferably at a pitch of 10 μm or less.
Fig. 13 is a diagram showing another example of the ink amounts at the positions VII to VII in fig. 6. In fig. 13, as indicated by reference numeral 954, an ink amount smaller than that in the edge vicinity area 951 and larger than that in the pattern center area 952 is set between the edge vicinity area 951 and the pattern center area 952 as compared with fig. 10. For example, when the conductive pattern data 71 and the edge data are input to the correction unit 612 and the edge vicinity area 951 and the pattern center area 952 are set, an area where the amount of ink is located between the edge vicinity area 951 and the pattern center area 952 or in a portion in contact with the edge vicinity area 951 of the pattern center area 952 is set. Hereinafter, a region where the ink amount between the edge vicinity region 951 and the pattern center region 952 is located in the middle is referred to as a "middle region 954". The amount of ink in the intermediate region 954 may be equal to the amount of ink in the substrate region 953.
By generating the ejection data from the corrected solder resist pattern data shown in fig. 13 and applying the ink, the pattern forming apparatus 1 sets the ejection rate of the ink per unit area of the intermediate region 954 between the near-edge region 951 and the pattern central region 952 to the ejection rate between the ejection rate of the ink per unit area of the near-edge region 951 and the ejection rate of the ink per unit area of the pattern central region 952 by the control of the control unit 12, and forms the pattern of the solder resist 92 on the wiring substrate 9. This can alleviate the difference in the ink amount between the edge vicinity region 951 and the pattern center region 952, and can suppress the occurrence of unnatural unevenness in the solder resist 92 on the conductive pattern 91.
Various modifications are possible in the patterning device 1.
The edge 94 need not be located at the center of the near-edge region 951, and the near-edge region 951 may have different widths from the edge 94 to the left and right. The amount of ink in the near-edge region 951 may steadily decrease with distance from the edge 94.
In the above embodiment, the amount of ink in the edge vicinity region 951 and the amount of ink in the pattern center region 952 may be increased and decreased by the pattern forming apparatus 1, or only one of these processes may be performed. Even in the case where only one process is performed, a pattern of the solder resist 92 having an appropriate thickness can be formed on the wiring substrate 9 as compared with the case where no process is performed.
The edge environ 951 varies according to the shape of the edge 94. Therefore, the shape of the edge vicinity region 951 is not limited to a straight line or a broken line, and may have various shapes. The pattern central region 952 also forms various shapes according to the shape of the conductive pattern 91.
In the patterning device 1, the moving mechanism 2 can take various configurations as long as the head 3 can move relative to the stage 21. For example, the head 3 may be moved in the X direction and the Y direction by fixing the stage 21. The head 3 may be moved in the Y direction and the stage 21 may be moved in the X direction.
The arrangement of the ejection orifices of the head 3 can be variously changed, and the relationship between the size of the liquid droplet and the pitch of the ejection orifices in the X direction can be variously changed. The pattern of the solder resist can be formed in the lower area of the head portion 3 by one relative movement of the head portion 3 with respect to the wiring substrate 9.
The configurations of the above-described embodiments and the modifications can be combined as appropriate as long as they are not contradictory to each other.
While the invention has been illustrated and described in detail, the foregoing description is illustrative and not restrictive. Therefore, various modifications and modes can be made without departing from the scope of the invention.
Claims (9)
1. A pattern forming apparatus for forming a pattern of a solder resist film on a wiring substrate by an ink of the solder resist, wherein,
the pattern forming apparatus has:
a holding unit for holding the wiring substrate;
a head configured to eject droplets of solder resist ink onto the wiring board by an inkjet method;
a moving mechanism that moves the head portion relative to the holding portion in a direction parallel to the wiring substrate;
and a control unit configured to control the head unit and the moving mechanism to form a pattern of a solder resist on the wiring substrate such that an amount of ink ejected per unit area of a region near an edge of the conductive pattern on the wiring substrate is larger than an amount of ink ejected per unit area of a region where the conductive pattern is not formed.
2. The patterning device of claim 1,
the control unit controls the ink ejection amount per unit area of a pattern center region distant from an edge of the region of the conductive pattern on the wiring substrate to be smaller than the ink ejection amount per unit area of a region where the conductive pattern is not formed, and forms a pattern of a solder resist on the wiring substrate.
3. The patterning device of claim 2,
the control unit sets the ink discharge rate per unit area between the edge vicinity area and the pattern center area to a discharge rate between the ink discharge rate per unit area of the edge vicinity area and the ink discharge rate per unit area of the pattern center area, and forms a pattern of a solder resist on the wiring substrate.
4. A pattern forming apparatus for forming a pattern of a solder resist film on a wiring substrate by an ink of the solder resist, wherein,
the pattern forming apparatus has:
a holding unit for holding the wiring substrate;
a head configured to eject droplets of solder resist ink onto the wiring board by an inkjet method;
a moving mechanism that moves the head portion relative to the holding portion in a direction parallel to the wiring substrate;
and a control unit configured to control the head unit and the moving mechanism to set an ejection rate of ink per unit area of a pattern center region distant from an edge in a region of the conductive pattern on the wiring substrate to be smaller than an ejection rate of ink per unit area of a region where the conductive pattern is not formed, and to form a pattern of a solder resist on the wiring substrate.
5. The pattern forming apparatus according to any one of claims 1 to 4,
the control section includes:
a storage unit that stores conductive pattern data representing the conductive pattern and solder resist pattern data representing a pattern of the solder resist;
and an ejection data generating section that generates ejection data indicating an amount of ink ejected from the head section to each position on the wiring substrate, based on the conductive pattern data and the solder resist pattern data.
6. A pattern forming method for forming a pattern of a solder resist on a wiring substrate by an ink of the solder resist,
the pattern forming method includes:
a step a) of ejecting a droplet of solder resist ink from a head to a wiring substrate by an ink jet method;
a step b) of moving the head portion relative to the wiring substrate in a direction parallel to the wiring substrate, the step b) being performed in parallel with the step a),
forming a pattern of a solder resist on the wiring substrate by the steps a) and b) so that the amount of ink ejected per unit area of the region near the edge of the conductive pattern on the wiring substrate is larger than the amount of ink ejected per unit area of the region where the conductive pattern is not formed.
7. A pattern forming method for forming a pattern of a solder resist on a wiring substrate by an ink of the solder resist,
the pattern forming method includes:
a step a) of ejecting a droplet of solder resist ink from a head to a wiring substrate by an ink jet method;
a step b) of moving the head portion relative to the wiring substrate in a direction parallel to the wiring substrate, the step b) being performed in parallel with the step a),
forming a pattern of a solder resist on the wiring substrate by the steps a) and b) so that an ejection rate of ink per unit area of a pattern center region distant from an edge of a region of the conductive pattern on the wiring substrate is smaller than an ejection rate of ink per unit area of a region where the conductive pattern is not formed.
8. A method for generating ejection data used when ejecting a droplet of solder resist ink from a head onto a wiring board by an ink jet method,
the ejection data generation method includes:
a preparation step of preparing conductive pattern data representing a conductive pattern on the wiring substrate and solder resist pattern data representing a pattern of the solder resist;
and an ejection data generation step of generating, from the conductive pattern data and the solder resist pattern data, ejection data in which the amount of ink ejected per unit area in the region near the edge of the conductive pattern is set to be greater than the amount of ink ejected per unit area in the region where the conductive pattern is not formed.
9. A method for generating ejection data used when ejecting a droplet of solder resist ink from a head onto a wiring board by an ink jet method,
the ejection data generation method includes:
a preparation step of preparing conductive pattern data representing a conductive pattern on the wiring substrate and solder resist pattern data representing a pattern of the solder resist;
and an ejection data generation step of generating ejection data in which the amount of ink ejected per unit area of a pattern center region located away from the edge in a region of the conductive pattern on the wiring substrate is set to be smaller than the amount of ink ejected per unit area of a region where the conductive pattern is not formed, based on the conductive pattern data and the solder resist pattern data.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-006304 | 2019-01-17 | ||
| JP2019006304A JP7281907B2 (en) | 2019-01-17 | 2019-01-17 | PATTERN FORMING APPARATUS, PATTERN FORMING METHOD AND EJECTION DATA GENERATION METHOD |
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| CN111446184A true CN111446184A (en) | 2020-07-24 |
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| CN202010032383.6A Pending CN111446184A (en) | 2019-01-17 | 2020-01-13 | Pattern forming apparatus, pattern forming method, and ejection data generating method |
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| Country | Link |
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| JP (1) | JP7281907B2 (en) |
| KR (1) | KR102327960B1 (en) |
| CN (1) | CN111446184A (en) |
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| CN112533393A (en) * | 2020-12-04 | 2021-03-19 | 广州兴森快捷电路科技有限公司 | PCB solder mask method, PCB solder mask system and storage medium |
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| JP2022013150A (en) | 2020-07-03 | 2022-01-18 | オムロン株式会社 | X-ray inspection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH08288623A (en) * | 1995-04-10 | 1996-11-01 | Canon Inc | Manufacture of printed wiring board and printed wiring board |
| JP4664242B2 (en) * | 2006-06-23 | 2011-04-06 | 太陽ホールディングス株式会社 | Printed wiring board and manufacturing method thereof |
| JP5324480B2 (en) * | 2008-02-06 | 2013-10-23 | パナソニック株式会社 | Information recording medium manufacturing method |
| JP2012081381A (en) * | 2010-10-07 | 2012-04-26 | Sharp Corp | Liquid drawing method, liquid drawing device, and functional mask for solar cell |
| KR101794803B1 (en) * | 2011-07-15 | 2017-11-07 | 스미도모쥬기가이고교 가부시키가이샤 | Thin film forming method and thin film forming apparatus |
| KR101849177B1 (en) * | 2011-11-11 | 2018-06-01 | 엘지디스플레이 주식회사 | 3 dimensional stereography image display device and method of fabricationg the same |
| WO2017077603A1 (en) * | 2015-11-04 | 2017-05-11 | 株式会社メイコー | Print curing method, print curing device, and method for manufacturing printed wiring board |
| WO2017164032A1 (en) * | 2016-03-23 | 2017-09-28 | 富士フイルム株式会社 | Printing plate, printing method, and printing plate production method |
| JPWO2017169624A1 (en) * | 2016-03-31 | 2019-02-07 | 太陽インキ製造株式会社 | Curing apparatus and solder resist manufacturing method |
| WO2017183608A1 (en) * | 2016-04-19 | 2017-10-26 | 株式会社カネカ | Printed wiring board and method for manufacturing same |
| JP2018086637A (en) * | 2016-11-30 | 2018-06-07 | 東レエンジニアリング株式会社 | Insulator film material coating method |
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| CN112533393A (en) * | 2020-12-04 | 2021-03-19 | 广州兴森快捷电路科技有限公司 | PCB solder mask method, PCB solder mask system and storage medium |
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| Publication number | Publication date |
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| JP2020115517A (en) | 2020-07-30 |
| TW202029855A (en) | 2020-08-01 |
| JP7281907B2 (en) | 2023-05-26 |
| TWI723612B (en) | 2021-04-01 |
| KR20200089597A (en) | 2020-07-27 |
| KR102327960B1 (en) | 2021-11-17 |
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