JP7281907B2 - PATTERN FORMING APPARATUS, PATTERN FORMING METHOD AND EJECTION DATA GENERATION METHOD - Google Patents

Description

The present invention relates to a technique for forming a resist film pattern on a wiring substrate.

Conventionally, a resist film is formed on a wiring board for the purpose of protecting a conductor pattern on the wiring board. The resist film also has the role of preventing solder from adhering to regions such as conductor wiring when solder is applied in a post-process, and is also called a "solder resist". As one method of forming a resist film, a method of ejecting ink droplets of a solder resist toward a wiring substrate by an inkjet method is known. Such techniques are disclosed in Patent Documents 1 and 2, for example.

JP-A-9-283893 JP-A-2008-4820

By the way, on a wiring board, conductor patterns such as conductor wiring and lands slightly protrude from the surface of a substrate made of glass epoxy resin or the like. Therefore, when a certain amount of ink per unit area is applied to the wiring board, the resist film may not have an ideal thickness. For example, at a step between the surface of the base material and the surface of the conductor pattern, ink may flow from the conductor pattern toward the surface of the base material, and a resist film having a sufficient thickness may not be formed on the edge of the conductor pattern. There is

Furthermore, when a certain amount of ink per unit area is applied to the wiring board, the thickness of the conductor pattern directly affects the unevenness of the surface of the resist film, and the unevenness of the surface of the resist film may exceed the allowable range. In this case, for example, when solder paste is applied using a metal mask in a post-process, the solder may not be applied correctly.

SUMMARY OF THE INVENTION An object of the present invention is to form a resist film pattern having an appropriate thickness on a wiring substrate.

According to a first aspect of the present invention, there is provided a pattern forming apparatus for forming a pattern of a resist film on a wiring substrate with solder resist ink, comprising: a holding unit for holding the wiring substrate; towards the wiring board; a moving mechanism for moving the head relative to the holding part in a direction parallel to the wiring board; and the head and the moving mechanism. By controlling the amount of ink ejected per unit area in the area near the edge of the conductive pattern on the wiring board is made larger than the amount of ink ejected per unit area in the area where the conductive pattern is not formed, and , of the areas of the conductive pattern on the wiring board, the ink ejection amount per unit area in the pattern central area away from the edge is set larger than the ink ejection amount per unit area in the area where the conductive pattern is not formed. a control unit for forming a pattern of the resist film on the wiring board while reducing the number of the resist film.

The invention according to claim 2 is the pattern forming apparatus according to claim 1 , wherein the amount of ink ejected per unit area between the edge vicinity region and the pattern center region is controlled by the control unit. is between the ejection amount of ink per unit area in the edge vicinity region and the ejection amount of ink per unit area in the pattern center region, and a resist film pattern is formed on the wiring substrate. .

According to a third aspect of the present invention, there is provided a pattern forming apparatus for forming a pattern of a resist film on a wiring substrate with solder resist ink, comprising: a holding portion for holding the wiring substrate; towards the wiring board; a moving mechanism for moving the head relative to the holding part in a direction parallel to the wiring board; and the head and the moving mechanism. By controlling the amount of ink discharged per unit area in the pattern central region away from the edge among the regions of the conductive pattern on the wiring board, the ink per unit area in the region where the conductive pattern is not formed a control unit for forming a pattern of the resist film on the wiring board while reducing the discharge amount of the resist film from the discharge amount of the resist film.

The invention according to claim 4 is the pattern forming apparatus according to any one of claims 1 to 3 , wherein the controller controls conductive pattern data indicating the conductive pattern and the pattern of the resist film. and a storage unit for storing resist pattern data indicating the amount of ink to be ejected from the head unit toward each position on the wiring board based on the conductive pattern data and the resist pattern data. and an ejection data generation unit.

According to a fifth aspect of the present invention, there is provided a pattern forming method for forming a pattern of a resist film on a wiring substrate with a solder resist ink, comprising: b) in parallel with the step a), moving the head portion relative to the wiring substrate in a direction parallel to the wiring substrate; Through steps a) and b), the amount of ink ejected per unit area in the area near the edge of the conductive pattern on the wiring substrate is made larger than the amount of ink ejected per unit area in the area where the conductive pattern is not formed. In addition, the ejection amount of ink per unit area in the pattern central area away from the edge of the area of the conductive pattern on the wiring board is defined as the ejection amount of ink per unit area in the area where the conductive pattern is not formed. A pattern of the resist film is formed on the wiring board while reducing the area.

According to a sixth aspect of the present invention, there is provided a pattern forming method for forming a pattern of a resist film on a wiring substrate with solder resist ink, comprising: b) in parallel with the step a), moving the head portion relative to the wiring substrate in a direction parallel to the wiring substrate; Through steps a) and b), the amount of ink ejected per unit area in the pattern central region away from the edge of the conductive pattern region on the wiring board is calculated as the amount per unit area in the region where the conductive pattern is not formed. A pattern of the resist film is formed on the wiring substrate while reducing the ejection amount of the ink from the above.

According to a seventh aspect of the present invention, there is provided an ejection data generating method for generating ejection data used when ejecting droplets of solder resist ink from a head section toward a wiring board by an inkjet method, the method comprising: a step of preparing conductive pattern data indicating a conductive pattern on a substrate and resist pattern data indicating a pattern of a resist film; and forming a unit in an edge vicinity region of said conductive pattern based on said conductive pattern data and said resist pattern data. The amount of ink ejected per area is made larger than the amount of ink ejected per unit area in a region where no conductive pattern is formed, and the center of the pattern away from the edge of the region of the conductive pattern on the wiring substrate. and generating ejection data in which the amount of ink ejected per unit area in the area is smaller than the amount of ink ejected per unit area in the area where the conductive pattern is not formed.

According to an eighth aspect of the present invention, there is provided an ejection data generation method for generating ejection data used when ejecting droplets of solder resist ink from a head unit toward a wiring substrate by an inkjet method, the method comprising: A step of preparing conductive pattern data indicating a conductive pattern on a substrate and resist pattern data indicating a pattern of a resist film, and based on the conductive pattern data and the resist pattern data, a region of the conductive pattern on the wiring substrate. generating ejection data in which the amount of ink ejected per unit area in the central area of the pattern away from the edge is smaller than the amount of ink ejected per unit area in the area where the conductive pattern is not formed; Prepare.

According to the present invention, a resist film pattern having an appropriate thickness can be formed on a wiring substrate.

It is a perspective view which shows the external appearance of a pattern formation apparatus. It is a figure which shows the structure of a computer. It is a figure which shows the functional structure implement|achieved by computer. It is a figure which shows the flow of operation|movement of a pattern formation apparatus. FIG. 4 is a diagram illustrating a conductive pattern; FIG. 4 is a diagram illustrating a state in which a resist film is formed on a wiring substrate; FIG. 7 is a diagram showing a cross section of the wiring board at the position of VII-VII in FIG. 6; 7 is a plan view of the wiring board in the vicinity of the position VII-VII in FIG. 6; FIG. It is a figure which shows the ink amount before correction|amendment, and the cross section of a wiring board. It is a figure which shows the ink amount after correction|amendment, and the cross section of a wiring board. FIG. 10 is a diagram showing a cross section of a wiring board to which ink is applied with an ink amount before correction; FIG. 10 is a diagram showing a cross section of a wiring board to which ink is applied with the corrected ink amount; FIG. 10 is a diagram showing another example of corrected ink amount;

FIG. 1 is a perspective view showing the appearance of the pattern forming apparatus 1. FIG. The pattern forming apparatus 1 forms a pattern of a resist film on a printed wiring board (hereinafter simply referred to as "wiring board") 9 using solder resist ink. The pattern forming apparatus 1 forms a pattern by an inkjet method. The wiring board 9 is preferably a plate-like member, but may be a flexible sheet-like member. The resist film protects the conductor pattern on the wiring board 9 . Conductor patterns include wiring, lands and other patterns. The resist film is not formed on areas where solder paste is applied in a post-process and other areas where the resist film should not be provided.

The pattern forming device 1 includes a main body 11 and a controller 12 . The main body 11 includes a Y-direction moving mechanism 2a for moving the wiring board 9 in the Y direction parallel to the wiring board 9, and a solder resist ink (hereinafter simply referred to as "ink") directed toward the wiring board 9 during movement. A head portion 3 for ejecting minute droplets, an X-direction moving mechanism 2b for moving the head portion 3 in the X direction perpendicular to the Y direction and parallel to the wiring board 9, and a tank for storing ink supplied to the head portion 3. 4. Hereinafter, the Y-direction moving mechanism 2a and the X-direction moving mechanism 2b are collectively referred to as "moving mechanism 2". Various mechanisms can be used as the Y-direction moving mechanism 2a and the X-direction moving mechanism 2b. For example, a ball screw mechanism with a motor attached may be employed, or a linear motor may be employed. The control section 12 controls the moving mechanism 2 and the head section 3 . Ink is supplied from the tank 4 to the head section 3 through the tube 41 .

The Y-direction moving mechanism 2a has a holding portion 21 for holding the wiring board 9. As shown in FIG. In this embodiment, the holding part 21 is a stage, and the holding part 21 is hereinafter referred to as the "stage 21". The wiring board 9 is held on the stage 21 . In this embodiment, a large number of holes are formed in the surface of the stage 21, and the holes are connected to a suction device (not shown). The wiring board 9 is held on the stage 21 by sucking air from the holes. The wiring board 9 may be held by various other methods. For example, grooves extending horizontally from the holes may be formed on the surface of the stage 21 to increase the area for sucking the wiring substrate 9 . The stage 21 may be made of a porous material and suction may be applied from the porous material. The stage 21 may hold the wiring board 9 by a mechanical mechanism.

The head portion 3 is provided with an ejection unit having a large number of ejection openings arranged at regular intervals in the X direction. Ink droplets are ejected from each ejection port by an inkjet method. The ink is ejected toward the wiring board 9 in the (-Z) direction in FIG. Various structures can be used as the ink jet system, and a structure using piezo or a structure using a heater can be used.

The stage 21 is moved in the Y direction parallel to the wiring substrate 9 by the Y-direction moving mechanism 2a while ejecting ink droplets from a plurality of ejection ports, thereby applying ink to the region extending in the Y direction. Hereinafter, the movement of the wiring board 9 in the Y direction is also referred to as "main scanning". In practice, one main scan of the wiring board 9 forms a plurality of ink lines corresponding to the plurality of ejection ports on the wiring board 9 . When one main scan is completed, the head unit 3 is slightly moved in the X direction parallel to the wiring board 9 by the X direction moving mechanism 2b, and the wiring board 9 is moved in the (-Y) direction by the Y direction moving mechanism 2a. do. As a result, the second main scan is performed, and ink lines are formed adjacent to the ink lines formed in the previous main scan.

By repeating main scanning a predetermined number of times, a resist film is formed in a region having a width substantially equal to the array width of the plurality of ejection ports in the X direction. Since the resist film is formed only in a necessary region, precisely, the pattern of the resist film is formed. Hereinafter, the width substantially equal to the array width of the plurality of ejection ports in the X direction will be referred to as "unit width", and the area in which the resist film will be formed with this width will be referred to as "unit area". When the resist film is formed on one unit area, the head section 3 is moved by the unit width in the X direction by the X-direction moving mechanism 2b, and by repeating the main scanning described above, the unit area adjacent to the previous unit area is moved. A resist film is formed on the

By repeating the formation of the resist film in the unit area and the movement of the head section 3 in the X direction, a pattern of the resist film is formed over the entire required area on the wiring board 9 .

FIG. 2 is a diagram showing the configuration of the computer 5 included in the control section 12. As shown in FIG. The computer 5 has a general computer system configuration including a CPU 51 for performing various arithmetic processing, a ROM 52 for storing basic programs, and a RAM 53 for storing various information. The computer 5 includes a fixed disk 54 for storing information, a display 55 for displaying various information such as images, a keyboard 56a and a mouse 56b as an input unit 56 for receiving input from an operator, an optical disk, a magnetic disk, and a magneto-optical disk. , a reader 57 that reads information from a computer-readable recording medium 8 such as a memory card, and a communication unit 58 that transmits and receives signals to and from the main body 11 .

In the computer 5 , the program 80 is read in advance from the recording medium 8 via the reading device 57 and stored in the fixed disk 54 . Program 80 may be stored on fixed disk 54 over a network. The CPU 51 uses the RAM 53 and the fixed disk 54 according to the program 80 to perform arithmetic processing. The CPU 51 functions as an arithmetic unit in the computer 5 . A configuration other than the CPU 51 that functions as an arithmetic unit may be employed.

FIG. 3 is a diagram showing a functional configuration realized by the computer 5 executing arithmetic processing according to the program 80. As shown in FIG. These functional configurations include an ejection data generation section 61 and a storage section 62 . The storage unit 62 corresponds to the RAM 53 , the fixed disk 54, and the like. The ejection data generator 61 includes an edge extractor 611 , a corrector 612 and a converter 613 . All or part of these functions may be realized by a dedicated electric circuit. Also, these functions may be realized by a plurality of computers.

FIG. 4 is a diagram showing the operation flow of the pattern forming apparatus 1. As shown in FIG. Steps S12 to S14 in FIG. 4 are arithmetic processing by the control unit 12, and step S15 is the operation of the main body 11 under the control of the control unit 12. FIG. The conductive pattern data 71 and the resist pattern data 72 are stored and prepared in advance in the storage unit 62 via the communication unit 58, the reading device 57, etc. (step S11). The conductive pattern data 71 is information indicating conductive patterns on the wiring board 9 . The resist pattern data 72 is information indicating the pattern of the resist film to be formed on the wiring board 9 . Note that the conductive pattern data 71 and the resist pattern data 72 may be vector data when stored in the storage unit 62 .

FIG. 5 is a diagram illustrating the conductive pattern 91 on the wiring board 9. As shown in FIG. In FIG. 5, the conductive pattern 91 is hatched. Conductive pattern 91 is typically a thin copper pattern formed on substrate 90 . The base material 90 is made of glass epoxy resin, for example, but may be made of other materials. The height of the conductive pattern 91 from the surface of the base material 90 is, for example, 35 μm. There are various heights of the conductive pattern 91 . FIG. 6 is a diagram illustrating a state in which a resist film 92, which is an insulating layer, is formed on the wiring substrate 9. As shown in FIG. A resist film 92 is hatched in parallel. Regions 931 and 932 are regions where the resist film 92 does not exist.

The edge extraction unit 611 in FIG. 3 generates an image showing edges of the conductive pattern 91 by performing edge extraction processing on the conductive pattern data 71 . More precisely, edge data, which is image data representing edges, is generated (step S12). The edge data is input to correction section 612 . The conductive pattern data 71 and the resist pattern data 72 are also input to the correction unit 612 . The resist pattern data 72 is data of an image representing a pattern of a resist film, and each pixel is set with a value of "1" indicating that ink is "applied" or a value of "0" indicating that ink is not applied. . A value indicating whether or not ink is applied is hereinafter referred to as an “applied value”.

The correction unit 612 converts the applied value of each pixel of the resist pattern data 72 into an ink amount per unit area corresponding to the designed thickness of the resist film. In other words, the correction unit 612 sets a predetermined amount of ink per unit area for the "applied" pixels. Hereinafter, the amount of ink per unit area is simply referred to as "ink amount". The ink amount is set to "0" for the "non-applied" pixels. The amount of ink may be a value associated with a specific amount of ink associated with a unit, or a simple value associated with an amount of ink.

Next, based on the edge data, the correction unit 612 corrects the ink amount of each pixel so that the thickness of the resist film in the region near the edge of the conductive pattern 91 is increased (part of step S13). That is, the correction unit 612 corrects the resist pattern data 72 so that the amount of applied ink increases in the vicinity of the position where the pattern of the resist film to be formed and the edge of the conductive pattern 91 overlap.

Further, the correction unit 612 refers to the conductive pattern data 71 and the edge data so that the thickness of the resist film in the central region of the wiring away from the edge of the region of the conductive pattern 91 becomes thin. Correct the amount (part of step S13). That is, the correction unit 612 corrects the resist pattern data 72 so that the amount of applied ink is reduced in the region where the pattern of the resist film to be formed and the region inside the edge of the conductive pattern 91 overlap.

Specific examples of steps S12 and S13 will be further described with reference to FIGS. 6 to 10. FIG. FIG. 7 is a diagram showing a cross section of the wiring board 9 at the position VII-VII in FIG. 6 before the resist film 92 is formed. FIG. 8 is a plan view of the wiring board 9 in the vicinity of the VII-VII position before the resist film 92 is formed. The conductive pattern 91 is formed on the base material 90 and has a certain thickness. The correction unit 612 acquires the edge of the conductive pattern 91 denoted by reference numeral 94 in FIGS. 7 and 8 from the conductive pattern data 71 (step S12).

Here, before the resist film 92 is formed, the resist film 92 is scheduled to be formed over the entire area of VII-VII in FIG. That is, the assigned value is "1" in the entire range. Therefore, the correction unit 612 sets the ink amount to the default value over the entire range. In this embodiment, the default ink amount is expressed as "100%". This value is lower than the upper limit of the amount of ink that the head section 3 can eject. Similar to FIG. 7, the lower part of FIG. 9 shows the cross section of the wiring board 9 at the position VII-VII, and the upper part shows that the ink amount is set to 100% in the range of VII-VII. .

Next, based on the edge data, the correction unit 612 adjusts the edge vicinity area of the conductive pattern 91 (the area denoted by reference numeral 951 in FIGS. 7 and 8 and hatched in FIG. 8). The amount of ink, that is, the pixel value is corrected so that the thickness of the resist film is increased (part of step S13). In the upper part of FIG. 10, a reference numeral 951 is attached to the position corresponding to the edge vicinity area 951, indicating that the ink amount in the edge vicinity area 951 exceeds 100% and is larger than the default value.

7 and 8, the correction unit 612 identifies a pattern central region 952 away from the edge 94 in the region of the conductive pattern 91 by referring to the conductive pattern data 71 and the edge data. In FIG. 8, the pattern center region 952 is hatched. Then, the ink amount, that is, the pixel value is corrected so that the thickness of the resist film in the pattern central region 952 becomes thin (part of step S13). In the upper part of FIG. 10, a reference numeral 952 is attached to the position corresponding to the pattern central region 952, indicating that the ink amount in the pattern central region 952 is less than 100% and less than the predetermined value.

FIG. 11 is a diagram showing the resist film 92 when the pattern forming apparatus 1 applies ink with an ink amount of 100% in the entire range of VII-VII in FIG. Since the ink of the solder resist flows down from the conductive pattern 91 toward the base material 90 to some extent in the vicinity of the edge 94 of the conductive pattern 91 , the thickness of the resist film 92 becomes thin in the edge vicinity region 951 . As a result, insulation failure may occur in the vicinity of the edge. The thickness of the resist film 92 needs to be ten and several μm, for example. The required thickness of the resist film 92 varies depending on the type of wiring board 9 .

On the other hand, in the pattern center region 952, the thickness of the resist film 92 corresponds to the ink amount of 100%. Here, if the region outside the edge vicinity region 951 is called a substrate region 953 (see FIGS. 7 and 8), the height difference of the resist film 92 between the pattern central region 952 and the substrate region 953 is large. If they are different, there is a risk that problems will occur when applying the solder paste in the post-process. Specifically, a metal plate having openings corresponding to regions to which the solder paste is to be applied is placed on the resist film 92, and the solder paste is printed using a squeegee. There is a possibility that a large gap may be partially generated between the film 92 and the application may not be performed appropriately.

In the pattern forming apparatus 1, in order to solve the above problems in the edge vicinity region 951 and the pattern center region 952, the amount of ink in the edge vicinity region 951 is made larger than that in the base region 953 as described above. , and the amount of ink in the pattern central region 952 is set to be less than the amount of ink in the base region 953 . Hereinafter, the resist pattern data 72 that has been converted into data indicating the amount of ink applied per unit area by the correction unit 612 and further corrected will be referred to as "corrected resist pattern data".

The corrected resist pattern data is input to the conversion unit 613 in FIG. 3 and converted into ejection data 75 indicating the amount of ink ejected at each position from each ejection opening of the head unit 3 (step S14). In other words, the ejection data 75 indicates the amount of ink ejected from the head section 3 toward each position on the wiring board 9 . The ejection data 75 is stored in the storage section 62 . The ejection data 75 is generated, for example, as data indicating the size of ink droplets applied to each position set in a grid pattern with a pitch of 10 μm on the wiring board 9 .

As described above, the ejection data generator 61 generates the ejection data 75 based on the conductive pattern data 71 and the resist pattern data 72 . The corrected resist pattern data and the ejection data 75 differ only in information format, and substantially both indicate the ejection amount of ink per unit area.

The main body 11 receives ejection data 75 from the control section 12 and controls the head section 3 and the moving mechanism 2 according to the ejection data 75 . Specifically, a step of ejecting ink droplets from the head portion 3 toward the wiring substrate 9 and a step of moving the head portion 3 relative to the wiring substrate 9 in a direction parallel to the wiring substrate 9 are performed. are performed in parallel. As a result, ink is applied onto the wiring board 9, and a pattern of the resist film 92 is formed (step S15).

FIG. 12 shows the resist film 92 formed at the position VII-VII in FIG. 6 according to the ejection data 75 derived from the corrected resist pattern data. In FIG. 12, the shape of the resist film 92 in FIG. 11 is indicated by a two-dot chain line. Under the control of the control unit 12, the ejection amount of ink per unit area in the edge vicinity region 951 is made larger than the ejection amount of ink per unit area in the base region 953, that is, the region where the conductive pattern 91 is not formed. A pattern of the resist film 92 is formed on the wiring board 9 while the pattern is formed. Thereby, a sufficient thickness of the resist film 92 is ensured in the edge vicinity region 951 .

On the other hand, the amount of ink ejected per unit area in the pattern central region 952 is smaller than the amount of ink ejected per unit area in the base region 953, that is, the region where the conductive pattern 91 is not formed. A pattern of resist film 92 is formed thereon. This prevents the resist film 92 from becoming unnecessarily thick in the pattern central region 952 , and alleviates unevenness on the surface of the resist film 92 . As a result, it is possible to suppress the occurrence of defects in post-processes such as application of solder paste. In addition, ink consumption can also be reduced.

The amount of ink in the edge vicinity region 951 may be set variously as long as it exceeds the amount of ink in the base region 953 . Assuming that the normal amount of ink in the base material area 953 is 100%, the amount of ink in the edge vicinity area 951 exceeds 100% and is 300% or less. Preferably, it is 110% or more and 200% or less. The amount of ink in the pattern central region 952 may be set variously as long as it is less than the amount of ink in the substrate region 953 . Assuming that the normal amount of ink in the base region 953 is 100%, the amount of ink in the pattern central region 952 is 20% or more and less than 100%. Preferably, it is 30% or more and 80% or less. The amount of ink in the edge vicinity region 951 and the pattern central region 952 is changed variously according to the ink viscosity. The viscosity of the ink is preferably 10 mPa·s or more and 30 mPa·s or less at a temperature of 50°C.

The width of the edge vicinity region 951 in the direction perpendicular to the edge 94 is 0.3 mm or less on both sides from the edge 94 (0.6 mm or less as a whole width). Preferably, it is 0.05 mm or more and 0.15 mm or less on both sides from the edge 94 (0.1 mm or more and 0.3 mm or less as a whole width). However, the positions to which the ink droplets can be applied exist discretely on the wiring board 9, and the ink droplets spread on the wiring board 9. Therefore, when the edge vicinity region 951 is narrow, In some cases, only one row of dots formed on the wiring board 9 is formed by droplets having a large amount of liquid.

The concept of increasing the ink amount in the edge vicinity region 951 in the corrected resist pattern data means that in the ejection data 75, the liquid volume of the droplet whose center is located in the edge vicinity region 951 is large. do. Various methods can be adopted as methods for increasing the liquid volume of the droplet. For example, there are methods such as increasing the size of one droplet, or increasing the number of a plurality of micro droplets that can be regarded as one droplet.

In addition, since the positions where ink droplets can be applied exist only discretely on the wiring substrate 9, the width of the conductive pattern 91 to which the corrected resist pattern data is applied should be 100 μm or more. is preferred, more preferably 150 µm or more, and most preferably 200 µm or more. The positions on the wiring board 9 to which the ink droplets can be applied preferably exist at a pitch of 20 μm or less, more preferably at a pitch of 10 μm or less.

FIG. 13 is a diagram showing another example of the ink amount at the position VII-VII in FIG. In FIG. 13, as indicated by reference numeral 954, compared to FIG. A larger amount of ink is set. For example, when the conductive pattern data 71 and the edge data are input to the correction unit 612 and the edge neighborhood region 951 and the pattern central region 952 are set, the area with the intermediate ink amount is the edge neighborhood region 951 and the pattern central region 952 . 952 , or a portion of the pattern central region 952 in contact with the edge vicinity region 951 . Hereinafter, a region having an intermediate amount of ink between the edge vicinity region 951 and the pattern center region 952 will be referred to as an "intermediate region 954". The amount of ink in intermediate region 954 may be equal to the amount of ink in substrate region 953 .

By generating ejection data from the corrected resist pattern data shown in FIG. The amount of ink ejected per unit area in the intermediate region 954 is between the amount of ink ejected per unit area in the edge vicinity region 951 and the amount of ink ejected per unit area in the pattern center region 952, and the wiring is performed. A pattern of resist film 92 is formed on substrate 9 . As a result, the difference in the amount of ink between the edge vicinity region 951 and the pattern central region 952 is reduced, and the resist film 92 on the conductive pattern 91 is prevented from becoming uneven.

Various modifications of the pattern forming device 1 are possible.

The edge 94 does not need to be positioned in the center of the edge neighborhood region 951 , and the edge neighborhood region 951 may exist with different widths to the left and right from the edge 94 . The amount of ink in the edge vicinity region 951 may gradually decrease as the distance from the edge 94 increases.

In the above embodiment, the ink amount is increased in the edge vicinity region 951 and the ink amount is decreased in the pattern central region 952. Even if only one of these processes is executed by the pattern forming apparatus 1, good. Even when only one of the processes is performed, a pattern of the resist film 92 having an appropriate thickness can be formed on the wiring substrate 9 as compared with the case where neither process is performed.

The edge vicinity region 951 changes according to the shape of the edge 94 . Therefore, the shape of the edge vicinity region 951 is not limited to a straight line or polygonal line, and has various shapes. The pattern central region 952 also has various shapes according to the shape of the conductive pattern 91 .

In the pattern forming apparatus 1 , various structures can be adopted as the moving mechanism 2 as long as the head section 3 moves relative to the stage 21 . For example, the stage 21 may be fixed and the head section 3 may move in the X and Y directions. The head unit 3 may move in the Y direction and the stage 21 may move in the X direction.

The arrangement of the ejection openings in the head section 3 can be changed variously, and the relationship between the droplet size and the pitch of the ejection openings in the X direction can also be changed variously. The pattern of the resist film may be formed in the area below the head section 3 by one relative movement of the head section 3 with respect to the wiring board 9 .

The configurations in the above embodiment and each modified example may be combined as appropriate as long as they do not contradict each other.

REFERENCE SIGNS LIST 1 pattern forming device 2 moving mechanism 3 head section 9 wiring board 12 control section 21 stage (holding section)
61 Ejection data generation unit 62 Storage unit 71 Conductive pattern data 72 Resist pattern data 75 Ejection data 91 Conductive pattern 92 Resist film 94 Edge 951 Edge vicinity region 952 Pattern central region 953 Base region 954 Intermediate region S11-S15 Steps

Claims (8)

A pattern forming apparatus for forming a pattern of a resist film on a wiring substrate with solder resist ink,
a holding part that holds the wiring board;
a head unit that ejects droplets of solder resist ink toward the wiring board by an inkjet method;
a movement mechanism for moving the head portion relative to the holding portion in a direction parallel to the wiring board;
By controlling the head section and the moving mechanism, the amount of ink ejected per unit area in the area near the edge of the conductive pattern on the wiring board can be adjusted to the amount of ink per unit area in the area where the conductive pattern is not formed. The discharge amount is set to be larger than the discharge amount, and the discharge amount of ink per unit area in the pattern central area away from the edge of the area of the conductive pattern on the wiring board is set to be the amount per unit area in the area where the conductive pattern is not formed. a controller for forming a pattern of the resist film on the wiring substrate while reducing the ejection amount of the ink from the
A pattern forming apparatus comprising: The pattern forming apparatus according to claim 1 ,
Under the control of the controller, the amount of ink ejected per unit area between the edge vicinity region and the pattern central region is adjusted to the amount of ink ejected per unit area in the edge vicinity region and the unit area in the pattern central region. 1. A pattern forming apparatus, wherein a pattern of a resist film is formed on said wiring substrate while maintaining an ejection amount between the ejection amount of ink per area. A pattern forming apparatus for forming a pattern of a resist film on a wiring substrate with solder resist ink,
a holding part that holds the wiring board;
a head unit that ejects droplets of solder resist ink toward the wiring board by an inkjet method;
a movement mechanism for moving the head portion relative to the holding portion in a direction parallel to the wiring board;
By controlling the head section and the moving mechanism, the ejection amount of ink per unit area in the pattern central region away from the edge of the conductive pattern region on the wiring board is reduced. a control unit that forms a resist film pattern on the wiring substrate while reducing the amount of ink ejected per unit area in a region;
A pattern forming apparatus comprising: The pattern forming apparatus according to any one of claims 1 to 3 ,
The control unit
a storage unit for storing conductive pattern data representing the conductive pattern and resist pattern data representing the pattern of the resist film;
an ejection data generating unit that generates ejection data indicating the amount of ink ejected from the head unit toward each position on the wiring board based on the conductive pattern data and the resist pattern data;
A pattern forming device comprising: A pattern forming method for forming a pattern of a resist film on a wiring substrate with solder resist ink,
a) a step of ejecting droplets of solder resist ink from a head portion toward a wiring substrate by an inkjet method;
b) in parallel with the step a), moving the head relative to the wiring board in a direction parallel to the wiring board;
with
By the steps a) and b), the amount of ink ejected per unit area in the area near the edge of the conductive pattern on the wiring board is set higher than the amount of ink ejected per unit area in the area where the conductive pattern is not formed. While increasing the ink ejection amount per unit area in the pattern central area away from the edge of the conductive pattern area on the wiring board, the ink ejection amount per unit area in the area where the conductive pattern is not formed is increased. A pattern forming method, wherein a pattern of a resist film is formed on the wiring substrate while reducing the amount of the resist film. A pattern forming method for forming a pattern of a resist film on a wiring substrate with solder resist ink,
a) a step of ejecting droplets of solder resist ink from a head portion toward a wiring substrate by an inkjet method;
b) in parallel with the step a), moving the head relative to the wiring board in a direction parallel to the wiring board;
with
Through the steps a) and b), the amount of ink ejected per unit area in the central area of the pattern away from the edge of the area of the conductive pattern on the wiring board is calculated as the unit area in the area where the conductive pattern is not formed. A pattern forming method, comprising: forming a pattern of a resist film on the wiring substrate while reducing the amount of ink ejected per hit. An ejection data generation method for generating ejection data used when ejecting droplets of solder resist ink from a head unit toward a wiring board by an inkjet method, comprising:
a step of preparing conductive pattern data indicating a conductive pattern on a wiring board and resist pattern data indicating a pattern of a resist film;
Based on the conductive pattern data and the resist pattern data, the amount of ink ejected per unit area in the area near the edge of the conductive pattern is set higher than the amount of ink ejected per unit area in the area where the conductive pattern is not formed. While increasing the ink ejection amount per unit area in the pattern central area away from the edge of the conductive pattern area on the wiring board, the ink ejection amount per unit area in the area where the conductive pattern is not formed is increased. generating less than volume dispensing data;
A method for generating ejection data, comprising: An ejection data generation method for generating ejection data used when ejecting droplets of solder resist ink from a head unit toward a wiring board by an inkjet method, comprising:
a step of preparing conductive pattern data indicating a conductive pattern on a wiring board and resist pattern data indicating a pattern of a resist film;
Based on the conductive pattern data and the resist pattern data, the ejection amount of ink per unit area in the pattern center region away from the edge of the conductive pattern region on the wiring board is calculated. generating ejection data that is less than the amount of ink ejected per unit area in the area;
A method for generating ejection data, comprising:

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