JP4664242B2 - Printed wiring board and manufacturing method thereof - Google Patents
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- JP4664242B2 JP4664242B2 JP2006174003A JP2006174003A JP4664242B2 JP 4664242 B2 JP4664242 B2 JP 4664242B2 JP 2006174003 A JP2006174003 A JP 2006174003A JP 2006174003 A JP2006174003 A JP 2006174003A JP 4664242 B2 JP4664242 B2 JP 4664242B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000004020 conductor Substances 0.000 claims description 53
- 229910000679 solder Inorganic materials 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 27
- 238000012360 testing method Methods 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 230000009974 thixotropic effect Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 229920000298 Cellophane Polymers 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- -1 bismaleimide compound Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 150000004292 cyclic ethers Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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- Manufacturing Of Printed Wiring (AREA)
Description
本発明は、導体層（例えば導体回路パターン）を形成した基板上に、インクジェット法によりソルダーレジストインキを塗布する方法及びこの方法により得られるプリント配線板に関する。 The present invention relates to a method of applying a solder resist ink by an inkjet method on a substrate on which a conductor layer (for example, a conductor circuit pattern) is formed, and a printed wiring board obtained by this method.
導体回路パターンなどの導体層を形成した基板上に、インクジェット法によりソルダーレジストインキを塗布する方法は周知である。例えば、特開昭５６−６６０８９号公報、特開昭５６−１５７０８９号公報、特開昭５８−５０７９４号公報、特公昭５９−４１３２０号公報、特開平８−２８８６３号公報参照。 A method of applying a solder resist ink by a inkjet method on a substrate on which a conductor layer such as a conductor circuit pattern is formed is well known. For example, see JP-A-56-66089, JP-A-56-157089, JP-A-58-50794, JP-B-59-41320, and JP-A-8-28863.
インクジェット法を用いて基板上にソルダーレジストインキを塗布する場合、低粘度のソルダーレジストインキを用いる。しかし、ソルダーレジストインキの粘度が低いと導体層の角の部分でソルダーレジストインキが流れて、ここの部分のソルダーレジスト層の被覆厚さが非常に薄くなり、場合によっては被着されずに露出してしまう問題がある。このような場合、所望の特性のプリント配線板を得ることができない。 When applying a solder resist ink on a board | substrate using an inkjet method, a low viscosity solder resist ink is used. However, if the viscosity of the solder resist ink is low, the solder resist ink flows at the corners of the conductor layer, and the coating thickness of the solder resist layer in this part becomes very thin. There is a problem. In such a case, a printed wiring board having desired characteristics cannot be obtained.
すなわち、インクジェット法以外で塗布する場合、インキの性状が異なり、このような問題は起きていない。例えば、ソルダーレジストの塗布で最も一般的なスクリーン印刷法ではインキは高粘度であり、チクソトロピック（thixotropic）性を持たせることにより、回路に追従した塗布ができ、その結果、導体層の角部分で充分な厚みを持たせることが可能である。また、比較的低粘度のインキが必要となるスプレーコート法やカーテンコート法でも充分なチクソトロピック性を持たせることで、塗布装置内のインキを流動させ、このことにより低粘度を保つことができ、その結果、詰まり等の問題なく塗布することができる。そして、このインキは、基板に塗布された状態では流れが止まるので、導体層の角の部分でも充分な厚みを持たせることが可能である。 That is, when the coating is performed by a method other than the ink jet method, the properties of the ink are different and such a problem does not occur. For example, in the most common screen printing method for solder resist coating, the ink is highly viscous and can be applied following the circuit by having thixotropic properties. As a result, the corners of the conductor layer It is possible to have a sufficient thickness. In addition, the spray coating method and curtain coating method, which require a relatively low viscosity ink, have sufficient thixotropic properties to allow the ink in the coating device to flow, thereby maintaining a low viscosity. As a result, it can be applied without problems such as clogging. And since this ink stops flowing when it is applied to the substrate, it is possible to provide sufficient thickness even at the corners of the conductor layer.
これに対し、インクジェット法は印刷ヘッド内でインキが滞留する箇所を作り、ピエゾ素子による振動やヒーターによるインキの突沸を利用して噴射させる。このため、他の方法よりも低粘度のインキが必要であり、また、チクソトロピック性を持ったインキでは塗布性に問題が生じてしまい、インクジェット法に適用することはできない。 On the other hand, the ink jet method creates a portion where the ink stays in the print head, and ejects the ink using vibration by a piezo element and ink bumping by a heater. For this reason, an ink having a lower viscosity than other methods is required, and ink having thixotropic properties causes a problem in coating properties and cannot be applied to an ink jet method.
このようなインクジェット法特有の問題に対して、導体層の角部分に、多量のソルダーレジストインキを付着させる方法が提案されている（特許文献1参照）。しかし、この方法でも、ソルダーレジストインキが低粘度であるために角部分から流れてしまい、本質的な解決とはいえない。
本発明は、上記事情に鑑みてなされたもので、その目的とするところは、インクジェット法により低粘度、かつチクソトロピック性の低いソルダーレジストインキを用いても、導体層の角部分からソルダーレジストインキが流れることがなく、導体層の角部分のソルダーレジスト層を所望の厚さに維持することができる方法を提供することにある。 The present invention has been made in view of the above circumstances, and the object is to use a solder resist ink from the corner portion of the conductor layer even when using a solder resist ink having a low viscosity and low thixotropic properties by an ink jet method. It is an object of the present invention to provide a method capable of maintaining a desired thickness of a solder resist layer at a corner portion of a conductor layer without flowing.
上記課題を解決するために本発明は以下の構成を備えている。 In order to solve the above problems, the present invention has the following configuration.
（１）基板上に、圭角部分を有する導体層を形成する工程と、この導体層を形成する工程の後に導体層の圭角部分を湾曲形状にする工程と、この湾曲形状にする工程の後にインクジェット法により、導体層を形成した基板上にソルダーレジストインキを塗布してソルダーレジスト層を形成する工程とを備えたプリント配線板の製造方法であって、
湾曲形状にする工程は、湾曲形状部分の曲率半径rを導体層の厚さｈに対して（1/3）ｈ以上とすることを特徴とするプリント配線板の製造方法。
(1) A step of forming a conductor layer having a depression portion on a substrate, a step of forming a depression portion of the conductor layer after the step of forming the conductor layer, and an inkjet after the step of forming the bending shape A method of manufacturing a printed wiring board comprising a step of applying a solder resist ink on a substrate on which a conductor layer is formed and forming a solder resist layer by a method,
The method of manufacturing a printed wiring board is characterized in that the step of forming a curved shape includes setting the radius of curvature r of the curved portion to (1/3) h or more with respect to the thickness h of the conductor layer.
（２）導体層の圭角部分を湾曲形状にする工程は、湾曲形状部分の曲率半径rを導体層の厚さｈに対して（1/3）ｈ≦r≦ｈの範囲とすることを特徴とする請求項１記載のプリント配線板の製造方法。 (2) The step of making the depression portion of the conductor layer into a curved shape is characterized in that the radius of curvature r of the curved portion is in the range of (1/3) h ≦ r ≦ h with respect to the thickness h of the conductor layer. The manufacturing method of the printed wiring board of Claim 1.
（３）基板と、基板上の導体層と、導体層を形成した基板上にインクジェット法により塗着されたソルダーレジスト層とを備え、前記導体層の角部分は、曲率半径rが導体層の厚さｈに対して（1/3）ｈ以上の湾曲形状をなしていることを特徴とするプリント配線板。 (3) A substrate, a conductor layer on the substrate, and a solder resist layer coated by an ink jet method on the substrate on which the conductor layer is formed, and the corner portion of the conductor layer has a radius of curvature r of the conductor layer. A printed wiring board having a curved shape of (1/3) h or more with respect to the thickness h.
ここで「圭角部分」とは、角張った（湾曲形状でない）角部分を意味し、エッチングあるいはめっき等の処理により導体層の角部に必然的に形成される。 Here, the “corner corner portion” means a corner portion that is angular (not curved), and is inevitably formed at the corner portion of the conductor layer by a process such as etching or plating.
「湾曲形状」は、バフ研磨やソフトエッチング（プリント配線板の製造工程の中で、薄いエッチング液などを用いて、銅箔表面の酸化物などを取り除く処理）などの処理により形成可能な湾曲形状を意味し、数学的に厳密な半径rの円弧を意味するものではない。 “Curved shape” is a curved shape that can be formed by processes such as buffing and soft etching (a process that removes oxides etc. from the copper foil surface using a thin etchant during the printed wiring board manufacturing process). Does not mean an arc with a mathematically exact radius r.
本発明は、導体層の角部分を予め湾曲形状にしてからインクジェット法によりソルダーレジストインキを塗布するので、ソルダーレジストインキが低粘度であっても、角部分からソルダーレジストインキが流れることがなく、導体層の角部分のソルダーレジスト層を所望の厚さに維持することができ、信頼性の高いプリント配線板を効率よく製造することができる。 In the present invention, the solder resist ink is applied by an inkjet method after the corner portion of the conductor layer is previously curved, so even if the solder resist ink has a low viscosity, the solder resist ink does not flow from the corner portion, The solder resist layer at the corners of the conductor layer can be maintained at a desired thickness, and a highly reliable printed wiring board can be efficiently manufactured.
（１）基板上に、圭角を有する導体層を形成する工程（図１（Ａ）参照）
基板（１）は、従来公知の任意のものを使用することができる。例えば、ガラス布にエポキシ樹脂やポリイミド樹脂等の樹脂を含浸させたものや、セラミックやフェノール樹脂の基体の上に、導体層として、金、銀、銅、白金、アルミニウム等の金属を設けた基板が挙げられる。
(1) Step of forming a conductor layer having a depression angle on a substrate (see FIG. 1A)
A conventionally well-known arbitrary thing can be used for a board | substrate (1). For example, a substrate in which a glass cloth is impregnated with a resin such as epoxy resin or polyimide resin, or a substrate in which a metal such as gold, silver, copper, platinum, or aluminum is provided as a conductor layer on a ceramic or phenol resin substrate Is mentioned.
この基板上に、導体回路パターンなどの導体層（２）に相当するレジストのパターンを形成した後、エッチングあるいはめっき等の処理により導体層（２）を形成する。この導体層の材質は通常銅である。 A resist pattern corresponding to the conductor layer (2) such as a conductor circuit pattern is formed on the substrate, and then the conductor layer (2) is formed by a process such as etching or plating. The material of this conductor layer is usually copper.
（２）導体層の圭角部分を湾曲形状とする工程（図１（Ｂ）参照）
エッチングあるいはめっき等の処理により形成された導体層（２）は、圭角部分（２ａ）（角部、エッジ部と称される部分）が角張っており、丸みをおびていない。本発明では、バフ研磨やソフトエッチングなどで圭角部分を削り、そこに丸みを持たせる。
(2) Step of making the depression portion of the conductor layer into a curved shape (see FIG. 1B)
The conductor layer (2) formed by etching, plating, or the like has an angled corner portion (2a) (a portion referred to as a corner portion or an edge portion) that is square, and is not rounded. In the present invention, the corner portion is shaved by buffing, soft etching, or the like, and is rounded.
湾曲形状（丸みの程度）は、その曲率半径rが導体層の厚さｈに対して（1/3）ｈ以上，好ましくは（1/3）ｈ≦r≦２ｈの範囲とするのがよく、より好ましくは（1/2）ｈ≦r≦ｈの範囲とするのがよい。従来のクリーニングを目的としたバフ研磨では小さすぎ、この場合には、圭角部に丸みを持たせる効果が薄くソルダーレジストインキが流れやすくなる。他方、研磨が多すぎてもその効果は飽和し、また、導体層の削り量が多くなり圭角部分を削る作業性が悪くなり、更に、回路の断面積が小さくなることにより、回路の信頼性が低下するので好ましくない。 The curved shape (degree of roundness) should be such that the radius of curvature r is (1/3) h or more, preferably (1/3) h ≦ r ≦ 2h, with respect to the thickness h of the conductor layer. More preferably, the range is (1/2) h ≦ r ≦ h. Buffing for the purpose of conventional cleaning is too small. In this case, the effect of rounding the corners is thin and the solder resist ink tends to flow. On the other hand, if the polishing is too much, the effect is saturated, the amount of cutting of the conductor layer is increased, the workability of cutting the depression is deteriorated, and further, the circuit cross-sectional area is reduced, thereby reducing the reliability of the circuit. Is unfavorable because it decreases.
（３）インクジェット法により、導体層を形成した基板上にソルダーレジストインキを塗布してソルダーレジスト層を形成する工程（図１（Ｃ）参照）
インクジェット法は、従来公知の方法をそのまま適用することができ、その処理条件も従来公知の方法を使用することができる。ソルダーレジストインキ組成についても、硬化物がソルダーレジストとしての特性があれば特に限定されることなく使用することができる。
(3) Step of forming a solder resist layer by applying a solder resist ink on a substrate on which a conductor layer is formed by an ink jet method (see FIG. 1C)
As the ink jet method, a conventionally known method can be applied as it is, and a conventionally known method can be used as the processing condition. The solder resist ink composition can also be used without particular limitation as long as the cured product has properties as a solder resist.
このようなインクジェット法に用いられるソルダーレジストは、インクジェットプリンタの種類によっては、印刷ヘッド部を加温できることから、塗布時の粘度（印刷ヘッドの温度における粘度）が約２０ｍＰａ・ｓ以下で、チクソトロピックインデックス（Ｔ・Ｉ値）が、１．２０以下、好ましくは１．１５〜１．０であることが好ましい。チクソトロピックインデックスが高すぎるとインクジェットプリンタのノズルの詰まりが発生しやすくなるので、好ましくない。 The solder resist used in such an ink jet method can heat the print head part depending on the type of the ink jet printer, so that the viscosity at the time of application (viscosity at the temperature of the print head) is about 20 mPa · s or less, and thixotropic. The index (T · I value) is 1.20 or less, preferably 1.15 to 1.0. If the thixotropic index is too high, the nozzles of the ink jet printer are likely to be clogged, which is not preferable.
なお、チクソトロピックインデックス（Ｔ・Ｉ値）は、ＢＬ型粘度計の６rpm値を60rpm値で割った値を示す。 The thixotropic index (T · I value) indicates a value obtained by dividing the 6 rpm value of the BL type viscometer by the 60 rpm value.
常温（２５℃）で１５０ｍＰａ・ｓ以下の粘度であれば加温することにより塗布時にこの条件を満足することができる。 If the viscosity is 150 mPa · s or less at normal temperature (25 ° C.), this condition can be satisfied at the time of application by heating.
このようなソルダーレジストとしては、例えば、インクジェットプリンタで塗布後、熱処理により硬化する熱硬化タイプ、インクジェットプリンタで塗布後、紫外線等の活性エネルギー線で硬化する光硬化タイプ、さらに、インクジェットプリンタで塗布後、紫外線等の活性エネルギー線で仮硬化した後、熱処理により、本硬化する光硬化性・熱硬化性タイプなどが挙げられる。 As such a solder resist, for example, a thermosetting type that is cured by heat treatment after being applied by an ink jet printer, a photocuring type that is cured by an active energy ray such as an ultraviolet ray after being applied by an ink jet printer, and further, after being applied by an ink jet printer Examples thereof include photo-curing and thermosetting types that are temporarily cured with an active energy ray such as ultraviolet rays and then subjected to heat treatment.
具体的には、特開２００５−１２０１４１号公報記載のカチオン重合性モノマーとカチオン重合開始剤からなる耐熱性のある組成物や特開２００５−６８２８０号公報記載の酸無水物と環状エーテル基を有する液状の化合物と光反応性希釈剤と光重合開始剤からなる耐熱性のある組成物などが挙げられる。 Specifically, it has a heat-resistant composition comprising a cationic polymerizable monomer and a cationic polymerization initiator described in JP-A-2005-120141, and an acid anhydride and a cyclic ether group described in JP-A-2005-68280. Examples thereof include a heat-resistant composition comprising a liquid compound, a photoreactive diluent, and a photopolymerization initiator.
より具体的には、下記一般式（１）で示されるビスアリルナジイミド化合物、或いは More specifically, a bisallylnadiimide compound represented by the following general formula (1), or
（式中、Ｒ１は、炭素数２〜１８のアルキル基、アリール基、又はアラルキル基を示す。）
下記一般式（２）で示されるビスマレイミド化合物を、
(In the formula, R 1 represents an alkyl group having 2 to 18 carbon atoms, an aryl group, or an aralkyl group.)
A bismaleimide compound represented by the following general formula (2):
（式中、Ｒ２は、炭素数２〜３２のアルキル基、アリール基、又はアラルキル基を示す。）
溶剤や反応性希釈剤により粘度調整した組成物などが挙げられる。
(In the formula, R 2 represents an alkyl group having 2 to 32 carbon atoms, an aryl group, or an aralkyl group.)
Examples thereof include a composition whose viscosity is adjusted with a solvent or a reactive diluent.
このようなインクジェット用ソルダーレジストインキは、導体層を形成した基板上にインクジェットプリンタで塗布した後、組成にあった好適な方法により硬化する。紫外線等の活性エネルギー線硬化タイプの場合は、紫外線等の活性エネルギー線を照射し光硬化させる。また、加熱硬化タイプの場合は１００〜２００℃、好ましくは１４０〜１８０℃で、１０〜６０分、熱硬化する。紫外線等の活性エネルギー線硬化と加熱硬化の併用の場合はソルダーレジストインキを塗布した後、紫外線等の活性エネルギー線を照射して仮硬化を行い、１００〜２００℃、好ましくは１４０〜１８０℃で、１０〜６０分、熱硬化する。 Such an ink-jet solder resist ink is applied by an ink-jet printer onto a substrate on which a conductor layer is formed, and then cured by a suitable method suitable for the composition. In the case of an active energy ray curable type such as ultraviolet rays, the active energy rays such as ultraviolet rays are irradiated and photocured. Moreover, in the case of a thermosetting type, it thermosets at 100-200 degreeC, Preferably it is 140-180 degreeC for 10 to 60 minutes. In the case of a combination of active energy ray curing such as ultraviolet rays and heat curing, after applying a solder resist ink, the active energy rays such as ultraviolet rays are irradiated to perform temporary curing, and the temperature is 100 to 200 ° C, preferably 140 to 180 ° C. For 10 to 60 minutes.
上記インクジェットプリンタとしては、オンデマンド・ピエゾ方式のインクジェットプリンタが好適に用いられ、ノズルを室温、又は約６０℃以下に加温して塗布することができる。 As the ink jet printer, an on-demand piezo ink jet printer is preferably used, and the nozzle can be applied at a room temperature or about 60 ° C. or less.
また、前記活性エネルギー線の照射光源としては、低圧水銀灯、中圧水銀灯、高圧水銀灯、超高圧水銀灯、キセノンランプ又はメタルハライドランプなどが適当であり、レーザー光線なども活性エネルギー線として利用できる。 Moreover, as the irradiation light source of the active energy ray, a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like is suitable, and a laser beam or the like can also be used as the active energy ray.
以下、本発明の実施例等により具体的に説明するが本発明はこれら実施例に限定されるものではない。なお、以下において特に断りのない限り、「部」は質量部を意味するものとする。 Hereinafter, the present invention will be specifically described with reference to examples and the like, but the present invention is not limited to these examples. In the following description, “part” means part by mass unless otherwise specified.
銅箔厚３５μｍのＦＲ−４銅張り積層板にエッチング法で１００μｍ幅の直線ラインの回路パターンを形成して、厚み３５μｍ、幅１００μｍの直線回路を形成した基板を作成し、これを試験片１とした。 A circuit board with a straight line of 100 μm width was formed by etching on an FR-4 copper-clad laminate with a copper foil thickness of 35 μm to produce a substrate having a 35 μm thick, 100 μm wide linear circuit, and this was used as test piece 1 It was.
銅箔厚１８μｍのＦＲ−４銅張り積層板にエッチング法で１００μｍ幅の直線ラインの回路パターンを形成して、厚み１８μｍ、幅１００μｍの直線回路を形成した基板を作成し、これを試験片２とした。 A circuit board with a straight line of 100 μm width was formed by etching on a FR-4 copper-clad laminate with a copper foil thickness of 18 μm to produce a substrate having a straight circuit with a thickness of 18 μm and a width of 100 μm. It was.
丸善石油化学社製ビスアリルナジイミド（製品名ＢＡＮＩ−Ｘ）４質量部、ケイアイ化成社製ビスマレイミド（製品名ＢＭＩ−８０）１質量部、プロピレングリコールモノメチルエーテルアセテート５質量部を配合して撹拌溶融させてソルダーレジストインキを作成した。 4 parts by weight of bisallyl nadiimide (product name BANI-X) manufactured by Maruzen Petrochemical Co., Ltd., 1 part by weight of bismaleimide (product name BMI-80) manufactured by Keisei Kasei Co., Ltd. and 5 parts by weight of propylene glycol monomethyl ether acetate are mixed and stirred. A solder resist ink was prepared by melting.
実施例１
試験片１を、バフ番定♯６００ついで♯１０００のバフ研磨を行なうプリント配線板用バフ研磨機に３０回通してクリーニングと同時に回路パターンの角を丸めた。次にピエゾ方式のインクジェットプリンタによりソルダーレジストインキをインキ厚み２０μmになるように全面均一に塗布して、１６０℃、３０分間加熱して硬化させた。
Example 1
The test piece 1 was passed thirty times through a buffing machine for a printed wiring board that performs buffing with a buff number # 600 and then with a # 1000 buff, and the corners of the circuit pattern were rounded simultaneously with cleaning. Next, a solder resist ink was uniformly applied over the entire surface with a piezo ink jet printer so that the ink thickness was 20 μm, and cured by heating at 160 ° C. for 30 minutes.
実施例２
試験片１を、バフ番定♯６００ついで♯１０００のバフ研磨を行なうプリント配線板用バフ研磨機に６０回通してクリーニングと同時に回路パターンの角を丸めた。次にピエゾ方式のインクジェットプリンタによりソルダーレジストインキをインキ厚み２０μｍになるように全面均一に塗布して、１６０℃、３０分間加熱して硬化させた。
Example 2
The test piece 1 was passed 60 times through a buffing machine for a printed wiring board that performs buff polishing of # 600 and then # 1000, and the corners of the circuit pattern were rounded simultaneously with cleaning. Next, a solder resist ink was uniformly applied over the entire surface with a piezo ink jet printer so that the ink thickness was 20 μm, and was cured by heating at 160 ° C. for 30 minutes.
実施例３
試験片２を、バフ番定♯６００ついで♯１０００のバフ研磨を行なうプリント配線板用バフ研磨機に１５回通してクリーニングと同時に回路パターンの角を丸めた。次にピエゾ方式のインクジェットプリンタによりソルダーレジストインキをインキ厚み１０μｍになるように全面均一に塗布して、１６０℃、３０分間加熱して硬化させた。
Example 3
The
比較例１
試験片１を、バフ番定♯６００ついで♯１０００のバフ研磨を行なうプリント配線板用バフ研磨機に３回通してクリーニングを行った。次にピエゾ方式のインクジェットプリンタによりソルダーレジストインキをインキ厚み２０μmになるように均一に塗布して、１６０℃、３０分間加熱して硬化させた。
Comparative Example 1
The test piece 1 was cleaned by passing it through a buffing machine for a printed wiring board that performs buffing of buff number # 600 and then # 1000. Next, a solder resist ink was uniformly applied to a thickness of 20 μm by a piezo ink jet printer, and was cured by heating at 160 ° C. for 30 minutes.
なお、通常は、バフ研磨回数は一回であるが、かなり汚染されていることを想定して比較例１では３回行なった。 Normally, the number of times of buffing is one, but in Comparative Example 1, the number of times of buffing was three times on the assumption that it was considerably contaminated.
比較例２
試験片１を、バフ番定♯６００ついで♯１０００のバフ研磨を行なうプリント配線板用バフ研磨機に１５回通してクリーニングを行った。次にピエゾ方式のインクジェットプリンタによりソルダーレジストインキをインキ厚み２０μｍになるように均一に塗布して、１６０℃、３０分間加熱して硬化させた。
Comparative Example 2
The test piece 1 was cleaned by passing it through a buffing machine for a printed wiring board for buffing # 600 and then buffing # 1000. Next, a solder resist ink was uniformly applied to an ink thickness of 20 μm by a piezo ink jet printer, and was cured by heating at 160 ° C. for 30 minutes.
比較例３
試験片２を、特にひどく汚染されていることを想定して上記プリント配線板用バフ研磨機に５回通してクリーニングを行った。次にピエゾ方式のインクジェットプリンタによりソルダーレジストインキを全面にインキ厚み１０μｍになるように均一に塗布して、１６０℃、３０分間加熱して硬化させた。
Comparative Example 3
The
上記実施例、比較例で得られた各試験片の特性を、下記の評価方法に基づいて調べた。 The characteristics of each test piece obtained in the above Examples and Comparative Examples were examined based on the following evaluation method.
また、これら、実施例及び比較例に係る試験片をそれぞれ切断して、光学顕微鏡により観察して回路パターンの角の湾曲度合（曲率半径）を測定した。 In addition, the test pieces according to Examples and Comparative Examples were cut and observed with an optical microscope to measure the degree of curvature (curvature radius) of the corners of the circuit pattern.
（評価方法）
耐酸性
試験片を、１０ｖｏｌ％の塩酸に１０分間浸漬した後、セロハン粘着テープによるピーリング試験を行った後の塗膜状態を評価した。
(Evaluation methods)
Acid resistance After immersing the test piece in 10 vol% hydrochloric acid for 10 minutes, the state of the coating film after a peeling test using a cellophane adhesive tape was evaluated.
○：全く変化が認められないもの
×：全面的な剥れはないがパターンの際部（角部分）に剥れが観察される。
○: No change is observed at all ×: There is no overall peeling, but peeling is observed at the edge (corner portion) of the pattern.
はんだ耐熱性
試験片を、２６０℃のはんだ槽に１０秒間浸漬後、セロハン粘着テープによるピーリング試験を行った後の塗膜状態を評価した。
Solder heat resistance After the test piece was immersed in a solder bath at 260 ° C. for 10 seconds, the state of the coating film after a peeling test using a cellophane adhesive tape was evaluated.
○：全く変化が認められないもの
×：全面的な剥れはないがパターンの際部に剥れが観察される。
○: No change is observed at all ×: There is no overall peeling, but peeling is observed at the pattern part.
無電解金めっき耐性
試験片を、市販の無電解ニッケルめっき浴及び無電解金めっき浴を用いて、ニッケル０．６μｍ、金０．０３μｍのめっき被膜を形成した。その後、セロハン粘着テープによるピーリング試験により、硬化塗膜の剥れの有無やめっきのしみ込みの有無を評価した。
Electroless gold plating resistance Using a commercially available electroless nickel plating bath and electroless gold plating bath, a plating film of nickel 0.6 μm and gold 0.03 μm was formed. Then, the presence or absence of peeling of the cured coating film or the presence or absence of plating penetration was evaluated by a peeling test using a cellophane adhesive tape.
○：全く変化が認められないもの
×：全面的な剥れはないがパターンの際部に剥れが観察される。
○: No change is observed at all ×: There is no overall peeling, but peeling is observed at the pattern part.
これらの測定結果、評価結果を表１に示す。 These measurement results and evaluation results are shown in Table 1.
表１から、本発明の範囲内に角を丸めた実施例１〜３は、耐酸性、耐熱性、無電解金めっき耐性がいずれも優れているが、角を十分には丸めていない比較例１〜３は、これらの
特性がいずれも劣っていることが分かる。
From Table 1, Examples 1 to 3 with rounded corners within the scope of the present invention are excellent in acid resistance, heat resistance, and electroless gold plating resistance, but the comparative example does not round the corners sufficiently. 1 to 3 show that these characteristics are all inferior.
１…基板
２…導体層
２ａ…導体層の圭角部分
２ｂ…導体層の湾曲形状とした角部分
３…ソルダーレジスト層
DESCRIPTION OF SYMBOLS 1 ... Board |
Claims (3)
湾曲形状にする工程は、湾曲形状部分の曲率半径rを導体層の厚さｈに対して（1/3）ｈ以上とすることを特徴とするプリント配線板の製造方法。 A step of forming a conductor layer having a depression portion on the substrate, a step of forming the depression portion of the conductor layer in a curved shape after the step of forming the conductor layer, and a step of making the curved shape by an inkjet method after the step of forming the curved shape, A method of manufacturing a printed wiring board comprising a step of applying a solder resist ink on a substrate on which a conductor layer is formed to form a solder resist layer,
The method of manufacturing a printed wiring board is characterized in that the step of forming a curved shape includes setting the radius of curvature r of the curved portion to (1/3) h or more with respect to the thickness h of the conductor layer.
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| JP5794180B2 (en) * | 2012-03-13 | 2015-10-14 | 住友金属鉱山株式会社 | Three-dimensional circuit board, method for producing film-like circuit board, and method for producing three-dimensional circuit board using the same |
| JP7281907B2 (en) * | 2019-01-17 | 2023-05-26 | 株式会社Ｓｃｒｅｅｎホールディングス | PATTERN FORMING APPARATUS, PATTERN FORMING METHOD AND EJECTION DATA GENERATION METHOD |
| CN110267457B (en) * | 2019-05-24 | 2022-03-18 | 惠州市联达金电子有限公司 | Ink screen printing process of thick-copper white solder resist ink PCB |
| JP2021153085A (en) | 2020-03-24 | 2021-09-30 | 株式会社Ｓｃｒｅｅｎホールディングス | Pattern forming device, pattern forming method, and discharge data generation method |
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| JPS62211935A (en) * | 1986-03-12 | 1987-09-17 | Fujitsu Ltd | Formation of interconnection layer |
| JP2002232090A (en) * | 2001-01-30 | 2002-08-16 | Kyocera Corp | Ceramic circuit board |
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| JPS62211935A (en) * | 1986-03-12 | 1987-09-17 | Fujitsu Ltd | Formation of interconnection layer |
| JP2002232090A (en) * | 2001-01-30 | 2002-08-16 | Kyocera Corp | Ceramic circuit board |
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