JP2007234811A - Ink jet coating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable fine circuits to be precisely and efficiently formed on a substrate by the use of a jet ink head. <P>SOLUTION: The ink jet coating device 100 is equipped with a stage 40 which holds a substrate 50 in such a manner that an ink jet printing head 30 and the substrate 50 are capable of moving relatively in two or more directions; an X-axis direct movement guide 20 which holds the ink jet printing head 30 in a movable manner; and a main controller 130 which controls the movements of the stage 40 and the X-axis direct movement guide 20, selects one of nozzles located facing a wiring pattern that is in parallel with the direction of the relative movements of the stage 40 and the guide 20, coats the above wiring pattern continuously, and forms a prescribed wiring pattern on the substrate 50 through coating by scanning the stage 40 and the X-axis direct movement guide 20 in two or more directions. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an ink jet coating apparatus, and more particularly to an ink jet coating apparatus for manufacturing an electric circuit board by forming a wiring pattern on a substrate using an ink jet print head.

  For example, in an electric circuit board, a conductive pattern for mounting a wiring pattern or an electronic component is formed on a glass epoxy board, a polyimide film, or other board.

  Conventionally, a photolithography method has been used to manufacture such an electric circuit board, and (1) bonding of the substrate and the copper plate → (2) resist application → (3) creation of a mask → (4) exposure → (5) Development → (6) Etching → (7) Resist stripping → (8) Since it is manufactured by a complex process, the necessary equipment is large, and the initial cost is high, and waste liquid etc. The environmental load was large because of

  For example, Patent Document 1 (US Pat. No. 5,132,248) discloses an ink jet method for manufacturing an electric circuit board by applying a conductive material in which metal fine particles are dispersed to a board by an ink jet print head and forming a pattern. It is disclosed. If this method is used, it can be manufactured by the process of (1) surface treatment of the substrate → (2) application of conductive material → (3) firing, so that an electric circuit substrate can be manufactured by a greatly simplified process. For this reason, the equipment is dramatically small, the initial cost is almost not required, the energy required for manufacturing is small, and there is almost no waste liquid, so the environmental load is small, masks, resists and etching liquids are unnecessary, and necessary parts However, since the conductive material is not applied, the material cost is low, and the circuit can be changed easily and inexpensively.

  In recent years, miniaturization of the pattern wiring pitch of an electric circuit board has been demanded with the miniaturization of electric elements and electric devices. On the other hand, there is an increasing demand for direct wiring without using wire bonding or a lead frame for electrodes of electric elements, and further miniaturization of the wiring pitch is desired.

Further, in Patent Document 2 (Japanese Patent Application Laid-Open No. 2004-39956), a conductive material is applied while scanning the print head in the main scanning direction, and after the substrate is fed out in the sub scanning direction, the print head is also moved in the main scanning direction. An electrical circuit board manufacturing method using a serial scan method is disclosed in which a circuit pattern is formed by repeating an operation of applying a conductive material while scanning the substrate. However, in this method, since the ink landing position error of the nozzles is different, the arrangement of dots in the wiring direction is disturbed except for the wiring pattern that is horizontal in the main scanning direction. There was a thing.
US Pat. No. 5,132,248 JP 2004-39956 A

  A method has been proposed in which a predetermined pattern is formed by continuously tracing a wiring pattern with only one nozzle against the disconnection as described above, but a circuit pattern is formed as compared with the serial scan method. There was a problem that it took a long time to finish.

  The present invention has been made in view of such a problem, and an object of the present invention is to complete an electric circuit board without causing defects even in a fine wiring pattern and without causing a significant decrease in speed.

  In order to solve the above problems, the present invention has the following means.

  The present invention relates to an inkjet coating apparatus for manufacturing an electric circuit board by applying a conductive material to a substrate using an inkjet print head in which a plurality of nozzles are arranged at a predetermined pitch, and forming a wiring pattern. , A stage holding the substrate so that relative movement directions of the inkjet print head and the substrate are a plurality of directions, a head support portion that movably supports the inkjet print head, the stage, and the head support portion And selecting a nozzle at a position facing the wiring pattern from among the plurality of nozzles, and continuously applying the wiring pattern in a direction parallel to the relative movement direction by the selected nozzle. The predetermined pattern is obtained by scanning the stage and the head support portion in a plurality of directions. And control means for applying a down on the substrate, and having a.

  The ink jet print head is installed such that a nozzle row for ejecting ink has a predetermined inclination in the horizontal direction with respect to the moving direction of the substrate, and a wiring pattern in the Y direction is applied and wiring in the X direction In the step of applying the pattern, the coating is performed without changing the direction of the nozzle row.

  In the inkjet print head, an inclination angle of the nozzle row with respect to a moving direction of the substrate is set to +45 degrees or −45 degrees.

  The inkjet print head is installed such that the nozzle row has a predetermined inclination angle with respect to the moving direction of the substrate, and a wiring pattern in the diagonally right direction is applied, and a wiring pattern in the diagonally left direction is applied. In the processing step, the coating is performed without changing the direction of the nozzle row.

  The inkjet print head is characterized in that an inclination angle of the nozzle row is set to 90 degrees or 0 degrees with respect to a moving direction of the substrate.

  The control means applies the wiring pattern by extending the wiring pattern in the scanning direction of the inkjet print head from a point where different wiring patterns intersect.

  The control means is characterized in that coating is performed so that the connection portion is enlarged by ejecting ink multiple times from the same nozzle to a region where wiring patterns in different directions intersect.

The control means is configured such that the amount of extending the wiring pattern is L, the dot landing position error is δ for all directions, the wiring pattern width is W, the space width between adjacent patterns is S, and the adjacent to the direction orthogonal to the wiring extending direction When the angle formed by the edge of the pattern is θ,
2δ−W <L <(S−2δ) / cos θ (where S> 2δ)
It is characterized by coating so as to satisfy the conditions of

  The control means forms a solid pattern having an arbitrary size by coating the inkjet print head in any of a plurality of scanning directions.

  The ink jet print head is installed such that the pitch of the nozzle matches the pitch of the grid on which the wiring pattern of the electric circuit board is formed.

  According to the present invention, the movement of the stage and the head support unit is controlled, and the wiring pattern in the direction parallel to the relative movement direction is selected from the plurality of nozzles at the position facing the wiring pattern, and the selection is performed. Since a predetermined pattern is applied onto the substrate by scanning the stage and the head support in multiple directions, the disconnection due to the dot landing position error occurs even in the fine pattern. In addition, it is possible to simultaneously form a plurality of wiring patterns by applying a plurality of wiring patterns extending in the same direction and a plurality of nozzles corresponding to each wiring pattern at the same time. Circuit printing time from the start to the end of printing can be shortened by increasing the pattern printing efficiency.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing an embodiment of an inkjet coating apparatus to which the present invention is applied. As shown in FIG. 1, the inkjet coating apparatus 100 has an X-axis linear motion guide (head support) 20 installed on a gantry arm 10, and an inkjet print head 30 is attached to the X-axis linear motion guide 20. It is. Further, the inkjet print head 30 has a plurality of nozzles arranged in a line at a predetermined pitch, and can move in the X-axis direction relative to the substrate 50 held on the stage 40. It has become.

  The stage 40 is attached to a Y-axis linear motion guide 60, and the substrate 50 on the stage 40 can be moved in the Y-axis direction relative to the inkjet print head 30. Ink jet print head 30 is supplied with ink from ink tank 70. Further, the inside of the ink tank 70 is always depressurized to an appropriate pressure by the negative pressure controller 80 so that ink does not drip from the nozzles.

  In the inkjet coating apparatus 100, the main controller (control means) 130 controls the ejection of ink from each nozzle of the inkjet print head 30, and the movement and angle of the stage 40 and the inkjet print head 30 are controlled. .

  Furthermore, the inkjet print head 30 is fixed to the rotating shaft 90, and the angle can be arbitrarily changed with respect to the substrate 50.

  The main controller 130 determines the angle of the inkjet print head 30 with respect to the substrate 50 by the rotation axis 90, and then relatively moves the inkjet print head 30 and the substrate 50 by the X-axis linear motion guide 20 and the Y-axis linear motion guide 60. Then, ink is ejected in accordance with the signal from the signal source 110 to form the circuit pattern 120 on the substrate 50.

  2A to 2D are plan views showing the orientation (angle) of the inkjet print head 30 with respect to the direction of the wiring pattern formed on the substrate 50. 2A to 2D, the substrate 50 is held so as to be movable in the Y direction, and the inkjet print head 30 is supported so as to be movable in the X direction.

  In the inkjet print head 30, a plurality of nozzles 201 are provided in a row on the lower surface side facing the printing surface (upper surface) of the substrate 50. The nozzle 201 is actually provided on the lower surface of the ink jet print head 30 and is hidden from view from above, but is shown as a black dot (in FIG. 2) in a transparent state for convenience of explanation.

  First, the case where the wiring pattern 210Y in the Ya direction is formed on the substrate 50 will be described. As shown in FIG. 2A, the inkjet print head 30 is rotated by a rotation shaft 90 so that the nozzles 201 are aligned at a target pitch with respect to the scanning direction (Y direction) 202. After tilting the angle θy, the nozzle 201 corresponding to a preset print pattern is selected from the plurality of nozzles 201, and the substrate 50 is moved in the Y direction while ejecting ink from the selected nozzle 201. A wiring pattern 210Y extending in the Y direction parallel to the moving direction is formed on the substrate 50.

  Next, a case where the X-direction wiring pattern 210X is recorded will be described. As shown in FIG. 2B, after the ink jet print head 30 is tilted by the angle θx so that the nozzles 201 are aligned at a target pitch with respect to the scanning direction (X direction) 203, the ink jet print head 30 is moved. The wiring pattern 210X in the X direction is formed on the substrate 50 by moving in the Xb direction (rightward in FIG. 2B).

Next, the case where the wiring pattern 210α in the diagonally right direction (α direction) is formed will be described. As shown in FIG. 2C, after the inkjet print head 30 is inclined by the angle θ _α so that the nozzles 201 are aligned at the target pitch with respect to the scanning direction 204, the substrate 50 is moved in the Ya direction. The wiring pattern 210α in the diagonally rightward direction is formed on the substrate 50 by moving in the Xb direction (rightward in FIG. 2C). Incidentally, the angle theta _alpha, an acute angle of 45 degrees or less, preferably set to an arbitrary angle of 5 degrees to 30 degrees.

Finally, a case where the wiring pattern 210β in the diagonally left direction is formed will be described. 2D, the inkjet print head 30 is tilted at an angle θ _β so that the nozzles 201 are aligned at the target pitch (wiring pattern pitch) with respect to the recording direction 205 using 50 is moved in the Y direction, and the inkjet print head 30 is moved in the Xa direction (left direction in FIG. 2D) to form the wiring pattern 210β in the left oblique direction (β direction).

  In most cases, the wiring pattern 210 formed on the substrate 50 is formed in four types of vertical, horizontal, diagonally right, and diagonally left as shown in FIGS. Therefore, the main controller 130 can form all the patterns by repeating the scanning of the four patterns in the scanning direction.

  As described above, the nozzle 201 at the position corresponding to each wiring pattern 210 is selected as the wiring pattern 210 formed by setting the inclination angle with respect to the scanning direction of the inkjet print head 30 and relatively moving the substrate 50. Since the selected nozzle 201 continuously ejects ink to form a pattern in the scanning direction, occurrence of disconnection due to an error in the ink ejection position from the same nozzle 201 is prevented, and the same nozzle 201 Even when one minute wiring pattern 210 is formed in a different direction by ejected minute ink droplets, the wiring pattern 210 can be formed in a state where there is no disturbance in a straight line in a direction parallel to the scanning direction. . In addition, since a plurality of wiring patterns 210 can be simultaneously formed by simultaneously ejecting ink from each nozzle 201 at a position facing the wiring pattern 210 among the plurality of nozzles 201 aligned with the inkjet print head 30, The circuit board can be completed in a shorter time than forming the wiring patterns 100 one by one.

  3A to 3D are plan views for explaining a modification. 3A to 3D are views of the substrate 50 and the inkjet print head 30 as viewed from above, and are indicated by black dots (in FIG. 3) in a state where the nozzle 201 is seen through for convenience of explanation.

  First, the case where the wiring pattern 210y in the Y direction is formed will be described with reference to FIG. The ink jet print head 30 is rotated at an angle of 45 degrees with respect to the moving direction (Y direction) of the substrate 50 by the rotation shaft 90.

  The inkjet head 30 is manufactured in advance so that the nozzles 201 are aligned at a target pitch (wiring pattern pitch) with respect to the scanning direction at this angle. In this state, the substrate 50 is moved in the Y direction to form the wiring pattern 210Y in the Y direction on the substrate 50.

  Next, the case of forming the wiring pattern 210X in the X direction will be described with reference to FIG. In this state, as in FIG. 3A, the inkjet print head 30 is rotated at an angle of 45 degrees with respect to the moving direction (Y direction) of the substrate 50 by the rotating shaft 90. Then, the inkjet print head 30 is moved in the Xb direction (right direction) to form the wiring pattern 210X in the X direction.

  In addition, in the case of an electric circuit board through which a high-frequency signal flows, the characteristics deteriorate if the wiring pattern path is bent at an angle of 90 degrees, so wiring in the right diagonal direction (α direction) and left diagonal direction (β direction) The patterns 210α and 210β are also required. Next, the case of forming the wiring pattern 210α in the 45 ° right oblique direction will be described with reference to FIG. The rotation angle of the inkjet print head 30 is adjusted to be 90 degrees with respect to the moving direction (Y direction) of the substrate 50. The inkjet head 30 is manufactured so that the nozzles 201 are aligned at a target pitch with respect to the coating direction at this angle. In this state, when the substrate 50 is moved in the Ya direction and the ink jet print head 30 is moved in the Xb direction (right direction) at the same speed, the wiring pattern 210α in the right oblique 45 degree direction can be formed.

  Finally, a case where the wiring pattern 210β having 45 degrees diagonally left is formed will be described with reference to FIG. In this state, the substrate 50 is moved in the Yb direction and the inkjet print head 30 is moved in the Xb direction (right direction) at the same speed as in the case of FIG. A wiring pattern 210β in the 45 degree direction is formed.

  In addition, the method of installing the inkjet print head 30 at an angle of 45 degrees or 90 degrees may be such that the inkjet head 30 is rotated by the rotating shaft 90, or the head fixed at each angle is respectively set. You may prepare.

  In the case of a fixed head, the number of heads is doubled, but the rotating shaft 90 is not necessary, and foreign matter such as wear powder generated by the rotation falls on the substrate 50 or the rotational position. Risks such as a decrease in accuracy due to matching can be reduced.

  Further, the present invention can be applied only by changing the direction in which the substrate 50 and the inkjet head 30 are moved even if the installation angle of the inkjet print head 30 is different from the angle shown in FIGS. 3A to 3D by 90 degrees. It is. Furthermore, when the wiring pattern 210Y in the Y direction and the wiring pattern 210X in the X direction are not required to have the same wiring pitch, the installation angle of the inkjet head 30 is not required to be 45 degrees, but other than 45 degrees. Any angle may be used.

  Further, when the wiring pattern 210α in the right oblique direction and the wiring pattern 210β in the left oblique direction are formed, if it is not necessary to make the wiring pitch equal, it is not necessary to set the installation angle of the inkjet head 30 to 90 degrees. Any angle other than degrees is acceptable.

  The wiring of the electric circuit board is usually formed on a grid (lattice-like reference line). By installing the inkjet print head 30 so that the pitch of the nozzles 201 matches the pitch of the grid, all the wiring patterns 210 extending in the scanning direction of the region through which the nozzles 201 pass are formed in one scan. It becomes possible. Therefore, the wiring pattern 210 corresponding to the printing width of the nozzle 201 row can be formed on the substrate 50 by four scans of vertical (Y direction), horizontal (X direction), right diagonal, and left diagonal. it can.

  In the serial scan method, wiring patterns that do not extend in the main scanning direction must be scanned many times until they are connected to one. However, the coating method using the present invention can apply all the wiring patterns 210 formed on the substrate 50 in a shorter time than the serial scanning method.

  Further, according to the above-described embodiment and modification, even when forming fine wiring, the wiring pattern 210 in each scanning direction is applied by the same nozzle 201 as shown in FIG. Fewer wiring patterns 210 can be obtained. Furthermore, according to the coating control of the first and second embodiments, since it is not affected by the inherent coating error of each nozzle 201, it is possible to continuously form the connecting portion 220 in each scanning direction, Disconnection of the wiring pattern 210 is prevented.

  As shown in FIG. 5, for example, when fine wiring is performed by a conventional serial scanning method in which wiring patterns 210 in different directions are printed in one scanning direction, ink ejected from a plurality of nozzles 201 is printed on the substrate 50. The wiring patterns 210 are formed in accordance with the relative speed of the nozzles 201. However, the wiring patterns 210α and 210X in the direction different from the scanning direction (Y direction) are not linear due to the coating error of each nozzle 201, and the disconnection occurs. Will occur.

  However, since the straight line of the printed wiring pattern 210 itself has an error in the ink landing position ejected from the nozzle 201 row of the inkjet print head 30, in the connection portion between the straight lines, the coating is caused by the ink landing position error. A portion where the overlap of the applied inks is large or small occurs. Therefore, depending on the error of each nozzle 201, there is no overlap between the inks, the wiring pattern 210 may not be continuous, and disconnection may occur.

  Therefore, in this embodiment, as shown in FIG. 6, both end portions 230Y of the Y-direction wiring pattern 210Y, both end portions 230X of the X-direction wiring pattern 210X, and both end portions 230α of the diagonal-direction wiring pattern 210α are arranged. The ink ejection control from the inkjet print head 30 is automatically corrected so as to extend the distance L. Thereby, even if the landing position error by each nozzle 201 arises, in the said connection part 220, it can form so that the wiring pattern 210 may be connected continuously. When a plurality of wiring patterns 210 are formed in parallel, the distance L between the extended portions of each wiring pattern is restricted in consideration of the wiring thickness W and the wiring pitch S, so Ink ejection control is performed so as not to cause a short circuit. Thereby, each wiring pattern 210 is formed so that both ends are extended by the length of the distance L so as not to short-circuit each other. For this reason, it is possible to prevent disconnection from occurring at the ends of the wiring patterns 210 in different directions.

  FIG. 7 is a diagram showing an example when the end portions of the wiring patterns in different directions are formed in a separated state. As shown in FIG. 7, when considering a state in which the wiring pattern 210Y and the wiring pattern 210α in different directions are farthest from each other due to the landing position error, the ink landing position error in each direction is represented by δ, and the width of the wiring pattern 210. Is W.

  The print position 702 of the wiring pattern 210Y in the Y direction is shifted by δ in the Ya direction with respect to the normal formation position 701 (indicated by a broken line in FIG. 7) of the wiring pattern 210Y to be originally formed, and the wiring pattern 210Y Assuming that the wiring pattern 210α is formed at a position shifted by δ in the Yb direction with respect to the end of the wiring pattern 210α, the positional relationship when the wiring patterns 210Y and 210α are shifted in the opposite direction is farthest away. Disconnected.

  Here, the distance H at which the ends of the wiring patterns 210Y and 210α are separated is represented by (2δ−W) in the Y direction. Therefore, if the wiring pattern 210Y in the Y direction is extended in the Yb direction longer than (2δ−W), the two wiring patterns 210Y and 210α are connected. Accordingly, at the connection portion of the wiring patterns in different directions, the end of the wiring pattern 210Y in the Y direction is extended by (2δ−W) regardless of the angle formed by the two wiring patterns 210Y and 210α. Disconnection in a region where the wiring patterns intersect can be prevented.

  Even when the two wiring patterns 210Y and 210α are formed in the same direction in the X direction, by extending the end portion of the other wiring pattern 210α by (2δ−W), Y The wiring pattern 210Y in the direction is connected.

  However, for example, if the end portion of the wiring pattern 210Y is excessively extended in the Yb direction, there is a possibility of short-circuiting with an adjacent wiring pattern that should not be connected.

  FIG. 8 is a diagram showing conditions for preventing a short circuit between adjacent wiring patterns. As shown in FIG. 8, assuming that two adjacent wiring patterns 210α are formed in a state of being closest to the ink landing position error, the ink landing position error is δ and the adjacent pattern in each direction. The space width between them is S, and the angle formed by the edge portion of the wiring pattern 210α with respect to the X direction orthogonal to the Y direction extending the wiring pattern 210Y is θ.

  Here, the printing position 802 (indicated by the solid line in FIG. 8) of the wiring pattern 210Y in the Y direction is connected to the normal formation position 801 (indicated by the broken line in FIG. 8) of the wiring pattern 210α to be originally formed. The distance δ is close to the wiring pattern 210α of the adjacent position 803 that should not be connected. Further, the wiring pattern 210α at the adjacent position 803 is closer to the wiring pattern 210Y by the distance δ on the side of the adjacent wiring pattern than the normal formation position 804 (indicated by a broken line in FIG. 8) that is originally intended to be formed.

  As described above, the state in which the end of the wiring pattern 210Y and the wiring pattern 210α at the adjacent position 803 are close to each other is a condition where the short circuit is most likely to occur, and the adjacent (wiring) pattern 210α and the wiring pattern that should not be connected originally. 210Y is the closest.

  Here, the distance between the wiring pattern 210Y and the edge 805 of the wiring pattern 210α at the adjacent position 803 that should not be connected is represented by (S-2δ). Since this value is (S-2δ) / cos θ with respect to the Yb direction, which is the direction extending the wiring pattern 210Y, the Yb direction of the wiring pattern 210Y is shorter than (S-2δ) / cos θ. As long as it is extended, there is no short circuit to the wiring pattern 210α at the adjacent position 803.

Accordingly, the length L for extending the end portion of the wiring pattern 210Y in the Yb direction is set so that the condition of the following expression (1) is satisfied, thereby producing a circuit board without causing any disconnection or short circuit of the wiring pattern. It becomes possible to do.
(2δ−W) <L <(S−2δ) / cos θ (1)
Needless to say, if S> 2δ is not satisfied in the equation (1), there is a possibility of short-circuiting between the wiring patterns.

  Further, in the inkjet print head 30 in which the plurality of nozzles 201 are aligned in a row as in the present embodiment, when the gap between the head surface having the nozzles 201 and the substrate 50 is set to about 0.5 mm, it is in any direction. On the other hand, the ink landing position error is about 5 μm, and the width of the wiring pattern 210 is about 10 μm although it depends on the surface state of the substrate 50 and the amount of ink to be ejected.

  In addition, when the pitch of each wiring pattern 210 is set to 20 μm, it is not necessary to consider the magnitude of the voltage and current flowing through the wiring. In order to prevent a short circuit or to secure a sufficient amount of current, the wiring pitch and line width are further increased.

  FIG. 9 is a view showing a modification for preventing disconnection at a connection portion between wiring patterns in different directions. As shown in FIG. 9, for example, when printing a connection portion between the wiring pattern 210Y and the wiring pattern 210α having different extending directions or a connecting portion 240 between the wiring pattern 210α and the wiring pattern 210X having different extending directions, Multiple printing is performed by ejecting ink multiple times from the same nozzle 201. As a result, the amount of ink at the connecting portion 240 is increased (twice or three times as normal) as the wiring pattern 210, and the diameter is increased.

  Therefore, in the connection portion 240, even if a deviation occurs in the wiring pattern 210 in each direction, it is possible to prevent disconnection if the deviation amount is within the expanded diameter range.

  Therefore, in this modification, the width (diameter) of the connection portion 240 is formed 2R larger than the width W of the normal wiring pattern 210. This R value is a value set by the number of ink ejections ejected from the nozzle 201, and in the same way as in the above-described wiring pattern end extension method (FIGS. 7 and 8), the ink landing position error, An arbitrary value is set in consideration of conditions such as wiring pitch and line width.

  Also, by managing the R value, it is possible to prevent disconnection of the wiring patterns and short-circuiting between the wiring patterns even if an ink landing position error occurs.

The setting condition of the R value in this case can be expressed as the following equation for the same reason as in the case of (1) above.
(2δ−W) / 2 <R <(S-2δ) (2)
Here, the printing process of a predetermined circuit pattern by the coating method of the present invention will be described with reference to FIGS. As shown in FIG. 10A, in the first step, when the relative movement direction of the inkjet print head 30 and the substrate 50 is the Y direction, the inkjet print head 30 is moved to the position shown in FIG. In the state shown in A), a wiring pattern 210Y is formed on the substrate 50 using the same nozzle 201 for one wiring.

  In the next step, as shown in FIG. 10B, when the relative movement direction of the ink jet print head 30 and the substrate 50 is the X direction, the ink jet print head 30 is moved to the position shown in FIG. The wiring pattern 210X is formed on the substrate 50 by the same nozzle 201 in a state where the pitch of the nozzle 201 is matched with the wiring pattern pitch.

  In the next step, as shown in FIG. 10C, when the relative movement direction of the ink jet print head 30 and the substrate 50 is the α direction, the ink jet print head 30 is moved to the position shown in FIG. The wiring pattern 210α is formed on the substrate 50 by the same nozzle 201 in a state where the pitch of the nozzle 201 and the wiring pattern pitch are matched.

  In the next step, as shown in FIG. 10D, when the relative movement direction of the ink jet print head 30 and the substrate 50 is the β direction, the ink jet print head 30 is moved to the position shown in FIG. The wiring pattern 210β is formed on the substrate 50 by the same nozzle 201 with the pitch of the nozzle 201 and the wiring pattern pitch being matched.

  In this manner, the predetermined circuit pattern 260 is completed by performing the scanning process in different directions four times. Therefore, each of the plurality of nozzles 201 forms a plurality of wiring patterns 110 in a straight line continuously, so that a fine circuit can be printed with higher accuracy and efficiency than the conventional method. .

  In addition, although the said circuit pattern 260 typically showed the comparatively simple pattern for convenience of explanation, as an actual circuit pattern, more complicated and many wiring patterns are formed precisely.

  Next, a printing process of a predetermined electrode pattern (solid pattern) by the coating method of the present invention will be described with reference to FIGS. As shown in FIG. 11A, in the first step, when the relative movement direction of the inkjet print head 30 and the substrate 50 is the Y direction, the inkjet print head 30 is moved to the position shown in FIG. In the state shown in A), a wiring pattern 210Y is formed on the substrate 50 by a plurality of nozzles 201. As a result, the Y-direction contours of the electrode patterns 280 and 282 and the external lead portion 290 can be formed simultaneously. Here, the case where two electrode patterns are formed simultaneously is illustrated.

  In the next step, as shown in FIG. 11B, when the relative movement direction of the ink jet print head 30 and the substrate 50 is the X direction, the ink jet print head 30 is moved to the position shown in FIG. The wiring pattern 210X is formed on the substrate 50 by the plurality of nozzles 201 in a state where the pitch of the nozzles 201 and the wiring pattern pitch are matched. Thus, the X-direction contours of the electrode patterns 280 and 282 and the external lead portion 292 can be formed simultaneously.

  In the next step, as shown in FIG. 11C, when the relative movement direction of the ink jet print head 30 and the substrate 50 is the α direction, the ink jet print head 30 is moved to the position shown in FIG. The wiring pattern 210α is formed on the substrate 50 by the plurality of nozzles 201 in a state where the pitch of the nozzles 201 and the wiring pattern pitch are matched. Thereby, the α direction of the electrode patterns 280 and 282 and the external lead portion 294 can be formed simultaneously.

  In the next step, as shown in FIG. 11D, when the relative movement direction of the ink jet print head 30 and the substrate 50 is the β direction, the ink jet print head 30 is moved to the position shown in FIG. The wiring pattern 210β is formed on the substrate 50 by the plurality of nozzles 201 in a state where the pitch of the nozzles 201 and the wiring pattern pitch are matched. Thereby, the β direction of the electrode patterns 280 and 282 can be formed.

  In this manner, predetermined electrode patterns 280 and 282 are completed by performing the scanning process in different directions four times. Therefore, since the electrode patterns 280 and 282 can be formed by overlapping a plurality of wiring patterns 210 having different extending directions, the circuit pattern 260 shown in FIGS. 10A to 10D is formed, and the electrodes Patterns 280 and 282 can be formed.

  For the convenience of explanation, the electrode patterns 280 and 282 are schematically shown as a relatively simple square pattern. However, the actual electrode pattern is not limited to a quadrangle, and may be other shapes, or two or more. Since a large number of electrode patterns can be simultaneously formed, it is possible to print a fine circuit with higher accuracy and efficiency than the conventional method.

  According to the present invention, fine wiring can be formed by the ink jet print head without disconnection or short-circuiting. For example, fine wiring such as wiring a resin that transmits light on a substrate to perform optical communication. It can be applied to all uses that require.

It is a perspective view which shows one Example of the inkjet coating apparatus by this invention. 4 is a plan view showing the direction (angle) of the inkjet print head 30 with respect to the direction of the wiring pattern. FIG. It is a top view for demonstrating a modification. It is an example of the fine wiring pattern at the time of applying this invention It is an example of a fine wiring pattern formed by a conventional serial scan method It is a figure which shows the case where the edge part of a wiring pattern is extended. It is a figure which shows an example at the time of forming in the state from which the edge part of the wiring pattern of a different direction was spaced apart. It is a figure which shows the conditions when preventing the short circuit between adjacent wiring patterns. It is a figure which shows the modification which prevents the disconnection in the connection part between the wiring patterns of a different direction. It is a figure which shows the printing process of a predetermined circuit pattern by the coating system of this invention. It is a figure which shows the printing process of a predetermined electrode pattern (solid pattern) by the coating system of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Gantry arm 20 X-axis linear motion guide 30 Inkjet print head 40 Stage 50 Substrate 60 Y-axis linear motion guide 70 Ink tank 80 Negative pressure controller 90 Rotating shaft 100 Inkjet coating device 120 Circuit pattern 130 Main controller 201 Nozzles 210, 210X, 210Y, 210α, 210β Wiring pattern 220 Connecting portion 260 Circuit pattern 280, 282 Electrode pattern 290, 292, 294 External lead-out portion

Claims (10)

In an inkjet coating apparatus for manufacturing an electric circuit board by applying a conductive material to a substrate using an inkjet print head in which a plurality of nozzles are aligned at a predetermined pitch, and forming a wiring pattern.
A stage that holds the substrate such that a relative movement direction of the inkjet print head and the substrate is a plurality of directions;
A head support portion for movably supporting the inkjet print head;
The movement of the stage and the head support unit is controlled, and a wiring pattern in a direction parallel to the relative movement direction is selected from the plurality of nozzles at a position facing the wiring pattern. Control means for applying a predetermined pattern on the substrate by continuously applying the nozzle and scanning the stage and the head support portion in a plurality of directions;
An inkjet coating apparatus comprising:   The ink jet print head is installed such that a nozzle row for ejecting ink has a predetermined inclination in the horizontal direction with respect to the moving direction of the substrate, and a wiring pattern in the Y direction is applied and wiring in the X direction The inkjet coating apparatus according to claim 1, wherein in the step of applying a pattern, the coating is performed without changing the direction of the nozzle row.   The inkjet coating apparatus according to claim 2, wherein the inkjet print head has an inclination angle of the nozzle row with respect to a moving direction of the substrate set to +45 degrees or -45 degrees.   The inkjet print head is installed such that the nozzle row has a predetermined inclination angle with respect to the moving direction of the substrate, and a wiring pattern in the diagonally right direction is applied, and a wiring pattern in the diagonally left direction is applied. The inkjet coating apparatus according to claim 1, wherein the coating is performed without changing a direction of the nozzle row.   5. The inkjet coating apparatus according to claim 4, wherein the inkjet print head has an inclination angle of the nozzle row set to 90 degrees or 0 degrees with respect to a moving direction of the substrate.   4. The inkjet according to claim 1, wherein the control means applies the coating by extending the wiring pattern in a scanning direction of the inkjet print head from a point where different wiring patterns intersect. 5. Coating equipment.   The said control means is coated so that a connection part may be expanded by ejecting the ink in multiple times from the same nozzle to the area | region where the wiring pattern of a different direction cross | intersects. The inkjet coating apparatus in any one. The control means is configured such that the amount of extending the wiring pattern is L, the dot landing position error is δ for all directions, the wiring pattern width is W, the space width between adjacent patterns is S, and the adjacent to the direction orthogonal to the wiring extending direction When the angle formed by the edge of the pattern is θ,
2δ−W <L <(S−2δ) / cos θ (where S> 2δ)
The inkjet coating apparatus according to claim 6, wherein the coating is performed so as to satisfy the following condition.   6. The control unit according to claim 1, wherein the control unit forms a solid pattern having an arbitrary size by coating the inkjet print head in any of a plurality of scanning directions. The inkjet coating apparatus as described.   The inkjet coating head according to any one of claims 1 to 9, wherein the inkjet print head is installed so that a pitch of a nozzle matches a pitch of a grid on which a wiring pattern of the electric circuit board is formed. apparatus.

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