JP6656102B2 - Coating device and coating method - Google Patents

Description

  The present invention relates to a coating apparatus and a coating method, and more particularly, to a coating apparatus and a coating method that can apply a film forming liquid to an end surface of a substrate or a hole formed in the substrate.

A printed wiring board using a glass epoxy member, a composite member, a paper phenol member, or the like is generally used as a substrate for mounting electronic components. The glass epoxy member is obtained by impregnating a glass fiber cloth with epoxy resin. The composite member uses a glass cloth on the surface and a cellulose paper or nonwoven fabric as the core material. The paper phenol member is obtained by impregnating kraft paper with a phenol resin. Therefore, when cutting or pressing is performed on a glass epoxy member, a composite member, or a paper phenol member, fine dust made of epoxy resin, glass fiber, or the like is generated in a cut portion or a hole. Such fine dust may cause poor contact of the substrate circuit, deterioration of the quality, and the like. Therefore, it is necessary to remove dust generated when cutting the board at the time of manufacturing the printed wiring board.
However, even if the dust is removed from the end face of the printed wiring board, the end face portion of the printed wiring board is fragile, and there is a problem that the dust may be broken and further dust may be generated.

Therefore, the present inventor has previously proposed a coating apparatus capable of preventing a collapse of an end surface portion by applying a film forming liquid to an end surface of a printed wiring board to form a film (Patent Document 1).
With the coating apparatus described in Patent Document 1, a film forming liquid is applied to both end surfaces of a printed wiring board by a coating disk, and a coating film can be formed on both end surfaces of the printed wiring board.

[Problems to be solved by the invention]
However, in the above-described coating apparatus, there is a problem that the supply state of the film forming liquid to the coating disk is likely to vary, and it is difficult to apply the thin, uniform and finely to the end face of the substrate accurately.
Further, holes having various shapes, such as slit holes, long holes, and square holes, are formed at a plurality of locations on a printed wiring board by punching (pressing) processing. There is a problem that the film forming liquid cannot be applied to the inner surface of the hole of the substrate, and dust generated from the inner surface of the hole cannot be prevented.

International Publication No. WO 2010/137418

Means for solving the problem and its effects

The present invention has been made in view of the above problems, and it is possible to accurately and neatly apply a film forming liquid to an end face of a substrate and a hole of the substrate, and to apply the film forming liquid from the end face of the substrate and the hole of the substrate. It is an object of the present invention to provide a coating apparatus and a coating method that can reliably prevent the generation of dust.

In order to achieve the above object, a coating apparatus (1) according to the present invention is a coating apparatus that applies a film forming liquid to an end face of a substrate and a hole formed in the substrate, and discharges the film forming liquid. Ink-jet type application means, a moving means for moving the coating means, and moving the coating means with the moving means, while moving the coating means along the end face of the substrate and the inner surface of the hole of the substrate. Control means for controlling the application.

According to the coating apparatus (1), the film forming liquid can be accurately and neatly applied to the end surface of the substrate and the inner surface of the hole of the substrate by the inkjet-type applying means. Generation of dust and the like from the end face and the hole of the substrate can be prevented. Therefore, it is possible to improve the quality of the substrate product and prevent the production equipment from being contaminated by the dust, thereby reducing product defects and reducing the production cost.

  Further, the coating apparatus (2) according to the present invention is characterized in that the coating apparatus (1) includes a substrate moving means for moving the substrate.

According to the coating apparatus (2) is provided with the said substrate moving means, while moving the substrate in the substrate moving means, i.e., by shifting the position of the substrate, the end face of the substrate, and the substrate The film forming liquid can be applied to the inner surface of the hole. Therefore, the configuration of the moving means can be simplified. In addition, the substrate can be transported by the substrate moving means.

  Further, in the coating apparatus (3) according to the present invention, in the coating apparatus (1) or (2), the control unit may be configured to form the film on an edge of the substrate and / or a hole of the substrate. It is characterized by having a function of performing control for applying a liquid.

According to the coating apparatus (3), the end face of the substrate, and not only the hole inner surface of the substrate, the end face periphery of the substrate (upper edge, lower edge, or upper and lower edges) and / or The film forming liquid can be applied to the peripheral portion of the hole (upper edge, lower edge, or upper and lower edges) of the substrate, and when the substrate is a thin substrate such as a package substrate, In addition to the effect of preventing the generation of dust and the like, the strength of the substrate can be increased, thereby further reducing product defects.

The coating apparatus according to the present invention (4), in any of the above coating apparatus (1) to (3), said control means, an end face of the substrate, and obliquely to the hole inner surface of the substrate The method is characterized in that the application is controlled while moving the application means so as to discharge the film forming liquid.

According to the coating apparatus (4), the coating is performed while moving the coating unit so as to discharge the film forming liquid obliquely to the end surface of the substrate and the inner surface of the hole of the substrate. The film forming liquid can be applied precisely and cleanly to not only the end surfaces of the holes but also the inner surfaces of the holes formed into various shapes and sizes.

Further, the coating device (5) according to the present invention, in any one of the coating devices (1) to (4), includes an image recognizing means for recognizing the image of the substrate, and substrate image information recognized by the image recognizing means. Coating point setting means for setting the coating point using the control means, the control means, along the end face of the substrate corresponding to the coating point data set by the coating point setting means, and along the inner surface of the hole of the substrate And controls the application of the film forming liquid.

According to the coating device (5), not only the outer shape of each substrate but also the position and shape of the hole can be accurately recognized by the image recognition means. The application location setting means can set an application location (an end surface of the substrate and a hole) using the substrate image information. The setting is such that the board image information is displayed on a display unit or the like, and an application portion is selected and set by an operator, or the board image information is compared with the board design (CAD) data, and the comparison is performed. A configuration may be adopted in which the application location (position) is automatically determined by the correction and set.
Then, the control means controls the application of the film forming liquid along the end surface of the substrate corresponding to the set application location data, and the inner surface of the hole of the substrate. A state in which the position accuracy and the size accuracy of the hole are accurately recognized, that is, in consideration of the processing accuracy (dimensional tolerance) of each substrate, the movement control of the application unit by the movement unit, The discharge of the film forming liquid can be controlled, and even if there is an error in the processing accuracy of the substrate, the film forming liquid can be precisely and cleanly placed on the end face of the substrate and the inner surface of the hole of the substrate. Can be applied.

Further, a coating method (1) according to the present invention is a coating method in which a film forming liquid is applied to an end face of a substrate and / or a hole formed in the substrate, wherein an ink jet method of discharging the film forming liquid is used. by using a coating means, it is characterized in that the end face of the substrate, and along the hole inner surface of the substrate includes a coating step of applying the film forming liquid.

According to the application method (1), by using the inkjet-type application means, it is possible to apply the film-forming liquid accurately and neatly to the end surface of the substrate and the inner surface of the hole of the substrate, the end face of the substrate, and the generation of dust or the like from the hole of the substrate can be prevented. Therefore, it is possible to improve the quality of the substrate product and prevent the production equipment from being contaminated by the dust, thereby reducing product defects and reducing the production cost.

The coating method according to the present invention (2), in the coating method (1), wherein the coating step is to eject the film-forming liquid from an oblique direction with respect to the end face, and the hole inner surface of the substrate of the substrate As described above, the method includes a step of applying while moving the applying means.

According to the application method (2), the film-forming liquid is discharged obliquely to the end surface of the substrate and the inner surface of the hole of the substrate. Therefore, not only the end surface of the substrate but also various shapes and sizes. The film forming liquid can be applied precisely and cleanly to the inner surface of the hole formed in the hole.

In addition, the coating method (3) according to the present invention uses the image recognition step of recognizing the substrate in the coating method (1) or (2), and the board image information recognized in the image recognition step. An application point setting step of setting an application point, wherein the application step moves the application means, and the end face of the substrate corresponding to the application point data set in the application point setting step, and the substrate The method is characterized by including a step of applying the film forming liquid along the inner surface of the hole.

According to the application method (3), not only the outer shape of each substrate but also the position and shape of the hole can be accurately recognized by the image recognition step. Further, in the application location setting step, the application location (the end face of the substrate and the hole) can be set using the substrate image information. The setting is performed by selecting and setting an application position by an operator, or by automatically comparing the substrate image information with the design (CAD) data of the substrate, and comparing and correcting the application position (position). A configuration for determining and setting is adopted.
Then, by the coating process, the end face of the substrate corresponding to the coating location data the set, and so applying the film forming liquid into the hole inner surface of the substrate, the outer shape accuracy of the substrate, the position of the hole In a state where the accuracy and size accuracy are accurately recognized, that is, in consideration of the processing accuracy (dimension tolerance and the like) of each substrate, the movement control of the coating unit and the discharge control of the film forming liquid by the coating unit are performed. Even if there is an error in the processing accuracy of the substrate, the film forming liquid can be applied accurately and neatly to the end surface of the substrate and the inner surface of the hole of the substrate.

It is a block diagram showing a schematic structure of a coating device concerning an embodiment of the invention. FIG. 2 is a side view schematically showing a main configuration of the coating apparatus according to the embodiment. It is the top view which showed typically the principal part structure of the coating device which concerns on Embodiment. FIG. 4 is a diagram for explaining a coating method using an inkjet head unit of the coating device according to the embodiment.

Hereinafter, embodiments of a coating apparatus and a coating method according to the present invention will be described with reference to the drawings. Note that the embodiments described below are preferred specific examples of the present invention, and therefore, various technically preferable limitations are added. However, the scope of the present invention particularly limits the present invention in the following description. It is not limited to these forms unless otherwise stated.
FIG. 1 is a block diagram showing a schematic configuration of a coating apparatus according to the embodiment. FIG. 2 is a side view schematically showing a main configuration of the coating apparatus according to the embodiment, and FIG. 3 is a plan view.

The coating device 10 according to the embodiment is a device that applies (prints, coats) a film forming liquid to an end surface 1 a of the substrate 1 and a hole 1 b formed in the substrate 1.
In the following embodiments, a case where the substrate 1 is a printed wiring board (rigid substrate) will be described, but the substrate to be applied is limited to a printed wiring board (including a single-sided, double-sided, multilayer, and build-up substrate). However, an electronic circuit board on which various electronic components are mounted, such as a metal substrate, a package substrate (copper-clad laminate substrate), a ceramic substrate, and a flexible substrate, can be applied.

The end face 1 a of the substrate 1 refers to the outer peripheral end face of the substrate 1.
In the hole 1b of the substrate 1, slit holes (including perforations), cut-out holes, notches, long holes (regardless of linear shape, bent shape, curved shape), drill holes formed in the substrate 1 are provided. , A square hole, a circular hole (including an elliptical shape), and the like, and the shape of the hole 1b to be applied is not particularly limited. However, wiring connection holes (electrically conductive holes) such as through holes and via holes are basically not applied, but may be applied depending on conditions.

  The coating apparatus 10 includes an inkjet-type coating unit 20 that discharges a film-forming liquid, a moving unit 30 that moves the coating unit 20 (for moving while changing the position and the direction), and moves the coating unit 20 using the moving unit 30. The control unit 40 controls the application of the film forming liquid to the inner surface (inner surface) of the end surface 1a of the substrate 1 and the hole 1b. Further, the coating apparatus 10 is provided with a substrate recognition unit 50. Further, the coating apparatus 10 is provided with a substrate moving unit 60 having a function of moving (reciprocating) the substrate 1 in a predetermined transport direction (X-axis direction).

(Coating unit)
The application unit 20 includes an inkjet type application unit, for example, an inkjet head unit (head unit) 21, an ink tank unit 22, an ink supply unit 23, and the like. The control is performed by a head control unit 41 included in 40.

  The ink jet head unit 21 discharges a film forming liquid for an ink jet head toward the end surface 1a of the substrate 1 and the inner surface of the hole 1b based on the discharge control performed by the head control unit 41, and contacts the end surface 1a of the substrate 1 in a non-contact manner. And a function of applying (printing, coating) only the inner surface of the hole 1b.

  In the ink tank section 22, a film forming liquid to be supplied to the inkjet head section 21 is stored. The film forming liquid is supplied from the ink tank unit 22 to the inkjet head unit 21 via the cable 24 by the ink supply unit 23. The supply control by the ink supply unit 23 is performed by the head control unit 41. In order to always store the film forming liquid in the ink tank section 22, an ink stocker tank section for supplying the film forming liquid to the ink tank section 22 may be provided.

The type (form) of the inkjet head unit 21 is not particularly limited. Ink jet heads of various types such as a piezo type, a thermal type, a bubble jet (registered trademark) type, an electromagnetic valve type, a charging type, and a combination thereof can be adopted.
The piezo method is a method in which a voltage is applied to a piezo element to deform it, and a liquid is ejected by vibrating or bending. The piezo method is preferable in that the film forming liquid is not heated.
The thermal method / bubble jet (registered trademark) method is a method in which heat is rapidly applied to a heater to boil a liquid, and the liquid is discharged using bubbles (bubbles) generated at this time or expansion of the liquid.
The electromagnetic valve method is, for example, a method in which a solenoid coil or the like is used as a valve, and a current corresponding to an opening / closing time is supplied to the coil to discharge droplets.

  The charging method (continuous method) is a method in which droplets of the film forming liquid are continuously discharged, and the coating (printing) is performed by charging and deflecting the flight direction of the droplets according to the amount of charge. It is configured to include a piezo oscillator, a nozzle plate, a charging electrode, a detection electrode, a deflection electrode, a gutter for ink recovery, and the like. The film-forming liquid sprayed from the nozzle plate of the nozzle is charged by the charging electrode to form droplets, and only the droplets necessary for forming the coating film are deflected by the deflection electrode in accordance with the amount of charge, and the coating surface ( The liquid is discharged toward the end face of the substrate or the inner surface of the hole of the substrate. On the other hand, droplets not used for forming a coating film are collected by a gutter. The charging method is preferable in that the discharge direction of the droplets can be changed in accordance with the amount of charge, and that there is little variation in printing even when the distance from the object to be coated is relatively wide (up to about 30 mm). .

  Further, the diameter of the nozzle constituting the head unit 21 for discharging the film forming liquid can be selected to be optimal according to the desired droplet size. The number of nozzles of the head unit 21 is not particularly limited either, and may be configured with one nozzle, or may be configured with two or more nozzles. A method having a nozzle diameter, the number of nozzles, and a jetting force (jetting speed) capable of performing coating efficiently and accurately according to the thickness of the substrate 1 to be coated (for example, a plate thickness of about 0.6 mm to 3.2 mm) and the like. Can be adopted.

The film forming liquid is a liquid material for forming a protective film, can be ejected from the inkjet head unit 21 in a predetermined droplet size, and can be applied (printed) to the end surface 1a of the substrate 1 or the inner surface of the hole 1b. If so, the type is not particularly limited. Such a film forming liquid includes a water-soluble ink, a water-insoluble ink (including an oil-based ink and an organic solvent-based ink), a UV-curable ink, an electron beam-curable ink, and a heat-curable ink. A liquid agent containing an acrylic emulsion resin liquid or the like as a main component can be suitably used.
In addition, the film forming liquid may contain a dye such as a dye or a pigment for coloring an application portion, or may contain a material such as a compound for increasing the adhesive strength.
Further, a liquid composition having resistance (non-peeling property) to a ferric chloride or cupric chloride liquid at the time of etching and having a property of being peelable with caustic soda or the like can be used.

(Mobile unit)
The moving unit 30 includes a translation mechanism 31 for horizontally moving the coating unit 20 in a direction (Y-axis direction) orthogonal to the transport direction (X-axis direction) of the substrate 1, and a turning mechanism attached to the translation mechanism 31. The rotation mechanism 33 includes a rotating mechanism 33 attached to the rotating mechanism 32. The inkjet head 21 is mounted on the rotating mechanism 33. The drive control of the linear motion mechanism 31, the turning mechanism 32, and the rotation mechanism 33 is performed by a movement controller 42 included in the control unit 40.

The linear motion mechanism 31 includes a Y-axis cylinder 31a and a Y-axis slider 31b slidable on the Y-axis cylinder 31a.
The turning mechanism unit 32 includes a turning drive unit 32b attached to the Y-axis slider 31b via an attachment plate 32a, and a turning arm unit 32c attached to the turning drive unit 32b, and a turning drive unit including a drive motor and the like. The rotation shaft 32d (vertical rotation shaft) 32d is connected to one end of the revolving arm 32c. The turning arm 32c is configured to be able to turn in a substantially horizontal direction at a predetermined angle (up to about 90 °) by the turning operation of the rotation shaft 32d of the turning drive unit 32b.

  The rotation mechanism unit 33 includes a rotation drive unit 33a attached to the other end of the rotation arm unit 32c, and a head holding unit 33b that holds the head unit 21. The rotation drive unit 33a includes a drive motor and the like. The rotation shaft (horizontal rotation shaft) 33c is connected to the head holding portion 33b. The rotation of the rotation shaft 33c of the rotation drive unit 33a allows the head holding unit 33b to rotate by a predetermined angle. By the operation of the rotation mechanism 33, the ink ejection surface of the inkjet head unit 21 held by the head holding unit 33b can be controlled to be inclined at a predetermined angle with respect to the vertical direction.

  By controlling the operations of the linear motion mechanism 31, the turning mechanism 32, and the rotating mechanism 33, the end faces 1a of all four sides of the substrate 1 and all the holes 1b (X The film forming liquid can be discharged from the head 21 toward the inner surface (including the holes extending in the axial direction and the Y-axis direction, and other holes).

  In the present embodiment, the case where the moving unit 30 is configured to include the one-axis (Y-axis) linear motion mechanism 31 has been described, but the configuration of the moving unit 30 is not limited to this. Instead of the one-axis linear motion mechanism 31, a two-axis (XY axis, YZ axis) or three-axis (XYZ axis) linear motion mechanism, an articulated robot mechanism, or the like can be adopted. That is, the inkjet head unit 21 is moved so that the substrate 1 and the inkjet head unit 21 are relatively moved, and the film forming liquid is discharged obliquely to the end surface 1a and the inner surface of the hole 1b of the substrate 1 ( A device having a drive mechanism (changing the position and orientation) can be applied to the moving unit 30.

(Controller unit)
The control unit 40 controls the head control unit 41 that performs ejection control and the like of the inking jet head unit 21 and the linear motion mechanism unit 31, the turning mechanism unit 32, and the turning mechanism unit 33 that constitute the moving unit 30. The movement control unit 42 is included. The control unit 40 also controls the movement (transport) operation of the substrate 1 by the substrate moving unit 60.

The head control unit 41 discharges the film forming liquid toward the end surface 1a and the inner surface of the hole 1b of the substrate 1 based on the application location data received from the application location setting unit 52 of the substrate recognition unit 50 described below. The timing, the amount of the discharged liquid, the size of the droplet, the amount of charge, and the like are controlled.
The movement control unit 42 is configured to move the moving unit 30 (each of the linear motion mechanism unit 31, the turning mechanism unit 32, and the turning mechanism unit 33) and the substrate moving unit 60 based on the application point data received from the application point setting unit 52. Operation control.
Such a control unit 40 can be constituted by one or more computer devices provided with an operation unit, a display unit, an interface unit (all not shown), and the like. Further, the head control unit 41 and the movement control unit 42 can be configured by separate computer devices.

(Board recognition unit)
The board recognizing unit 50 is a coating unit that sets a coating location (the end face 1a or the hole 1b of the board 1) using the image recognizing unit 51 for recognizing the image of the substrate 1 and the board image information recognized by the image recognizing unit 51. It is configured to include a location setting unit 52, and is configured by one or more computer devices including an operation unit 53, a display unit 54, an interface unit (not shown), and the like.

  The image recognition unit 51 is a scanner (reading) unit that optically scans the substrate 1 (using transmitted light, reflected light, or the like), and a transmission that transmits image information scanned by the scanner unit to the coating location setting unit 52. (Not shown), and has a function of accurately measuring the outer shape of the substrate 1 (position of the end face 1a) and the position and size of the hole 1b formed in the substrate 1. . The scanner unit may be configured to include an imaging unit such as a camera. Further, the scanner unit can be configured not only with a 2D scanner such as a CCD (optical reduction) system or a CIS (contact sensor) system, but also with a 3D scanner.

  The application location setting unit 52 includes a reception unit that receives the substrate image information transmitted from the image recognition unit 51, and an application location setting processing unit that performs a process of setting an application location based on the basic image information received by the reception unit. And a data transfer unit that sends the application point data set by the application point setting processing unit to each unit (the head control unit 41 and the movement control unit 42) of the control unit 40 (neither is shown). .

  The application location setting unit 52 displays, for example, the substrate image information scanned by the image recognition unit 51 on the display unit 54, and the operator looks at the substrate image information displayed on the display unit 54, and 1 has a function of selecting and setting (determining) the end surface 1a and the hole 1b) while operating the operation unit 53, and transmitting the set application location (position coordinate data on the substrate, etc.) to the control unit 40. are doing.

  The application location setting unit 52 includes a step of comparing the board image information scanned by the image recognition unit 51 with the design (CAD) data of the board 1 stored in the board recognition unit 50 in advance. A step of comparing the outer shape (the position of the end face 1a) and the position and size of the hole 1b; a step of calculating a difference from the board design data (a board processing error) as a correction amount; A step of automatically judging and setting (determining) the end surface 1a and the hole 1b) of the substrate 1; the set application location data (position (coordinate) data of the end surface 1a of the substrate 1 in consideration of the correction amount; A function (program) for executing a step of transmitting the position / shape (coordinate) data of 1b) to the control unit 40 is also provided.

(Substrate moving unit)
The substrate moving unit 60 is a transfer device that can move the substrate 1 (for example, a substrate having a size of about 500 × 400 mm) in a predetermined direction (one direction or reciprocating direction). A roller-type conveyor device is provided in which narrow rollers (wheel portions) 61 are arranged at predetermined intervals so that the contact area with the substrate 1 is reduced. It can also be constituted by a transfer device of a table type or a table type. As the table-type transfer device, for example, a table unit for mounting a substrate, a positioning unit that positions the substrate to be mounted on the table unit at a predetermined position, and a movement control unit that controls the movement of the table unit A device capable of moving the substrate to a desired position by positioning and arranging the substrate at a predetermined position on the table by the positioning unit and controlling the movement of the table by the movement control unit. Can be adopted.
Further, a positioning guide mechanism for positioning and positioning the substrate 1 at a predetermined reference position, a substrate detection sensor, and the like are provided, and information on these sensors is sent to the control unit 40, and control for improving the positional accuracy of the substrate to be moved is performed. Can be used for
The movement (movement timing / distance, stop timing, movement direction, etc.) of the substrate 1 by the substrate movement unit 60 is controlled by a command from the control unit 40.

  Next, a coating method using the coating apparatus 10 according to the embodiment will be described. FIG. 4 is a side view for explaining a coating method using the inkjet head unit 21 of the coating apparatus 10 according to the embodiment.

FIG. 4A shows a state in which the front end surface 1a of the substrate 1 that has been transported is being applied. The control unit 40 controls each part of the substrate moving unit 50 and the moving unit 30 so that the end surface 1a (vertical direction) of the substrate 1 and the droplet discharge direction A of the head unit 21 are set to a predetermined angle θ1. I do. These settings are performed using the application location data (such as the position (coordinate) data of the end surface 1a of the substrate 1) acquired from the substrate recognition unit 50.
The predetermined angle θ1 is the distance (interval) between the tip end discharge surface of the head unit 21 and the end surface 1a of the substrate 1, the thickness of the substrate 1, the performance of the head unit 21, and the like (nozzle size, droplet size, droplet ejection speed). The angle is set to be applied only to the end face 1a of the substrate 1 in consideration of the characteristics of the discharge liquid. For example, the angle θ1 can be set in a range of 30 ° to 45 °.

  After the setting, the head controller 41 controls the ejection of the liquid droplets from the head unit 21, and the movement controller 42 controls the Y-axis slider 31 b of the linear motion mechanism 31 to move at a predetermined speed (for example, in the Y-axis direction). (Movement speed of about 200 mm / sec) (movement control of one reciprocation or more is also possible), and the film forming liquid 2 is applied (printed) in a line along the end surface 1a of the substrate 1. The thickness of the applied film is, for example, preferably about several μm to several tens μm, more specifically, about 10 μm to about 60 μm. The coating thickness is not particularly limited as long as the coating can be performed with high accuracy.

After the coating on the end face 1a is completed, the control for discharging the droplets from the head unit 21 is stopped. After that, the control unit 40 controls each part of the substrate moving unit 60 and the moving unit 30 so that the state shown in FIG. 4B, that is, the inner surface (rear inner surface) of the hole 1b of the substrate 1 to be applied next and the head The droplet discharge direction A of the unit 21 is set to be a predetermined angle θ2. These settings are performed using the application location data (position / shape (coordinate) data of the hole 1b of the substrate 1) acquired from the substrate recognition unit 50.
The predetermined angle θ2 is the distance between the tip end discharge surface of the head section 21 and the hole 1b of the substrate 1, the thickness of the substrate 1, the size of the hole 1b (hole diameter), the performance of the head section 21 (nozzle size, liquid In consideration of the droplet size, the droplet ejection speed, the characteristics of the liquid to be ejected, and the like, the angle is set to be applied only to the inner surface of the hole 1b of the substrate 1. For example, the angle θ2 can be set in a range from 30 ° to 45 °.

  After the above setting, the head controller 41 controls the ejection of liquid droplets from the head unit 21, and the movement controller 42 moves the Y-axis slider 31 b of the linear motion mechanism 31 at a predetermined speed in the Y-axis direction. Then, the film forming liquid 2 is applied (printed) in a line along the inner surface of the hole 1b of the substrate 1.

  After the application to the inner surface of the hole 1b (the inner surface on the rear side) is completed, the control for discharging the droplets from the head unit 21 is stopped. After that, the control unit 40 controls each part of the substrate moving unit 60 and the moving unit 30 to obtain the state shown in FIG. 4C, that is, the liquid inside the front side inner surface of the hole 1 b of the substrate 1 and the liquid in the head part 21. The droplet ejection direction A is set so as to be a predetermined angle θ2. These settings are performed using the application location data (position / shape (coordinate) data of the hole 1b of the substrate 1) acquired from the substrate recognition unit 50.

  After the above setting, the head controller 41 controls the ejection of liquid droplets from the head unit 21, and the movement controller 42 moves the Y-axis slider 31 b of the linear motion mechanism 31 at a predetermined speed in the Y-axis direction. Then, the film forming liquid 2 is applied (printed) in a line along the inner surface of the hole 1b of the substrate 1.

  After the coating on the inner surface of the hole 1b (the inner surface on the front side) is completed, the control for discharging the droplets from the head unit 21 is stopped. Thereafter, the control unit 40 controls the substrate moving unit 60 and the moving unit 30 to perform coating on another hole 1b formed in the substrate 1 in the same manner as described above, and thereafter, as shown in FIG. In this state, the rear end surface 1a of the substrate 1 and the droplet discharge direction A of the head 21 are set to have a predetermined angle θ1. These settings are performed using the application location data (such as the position (coordinate) data of the end surface 1a of the substrate 1) acquired from the substrate recognition unit 50.

  After the above setting, the head controller 41 controls the ejection of liquid droplets from the head unit 21, and the movement controller 42 moves the Y-axis slider 31 b of the linear motion mechanism 31 at a predetermined speed in the Y-axis direction. Then, the film forming liquid 2 is applied (printed) in a line along the rear end face 1b of the substrate 1. After the coating on the end face 1a is completed, the control for discharging the liquid droplets from the head unit 21 is stopped, and then the substrate moving unit 60 is controlled by the control unit 40 to unload the substrate 1.

  Regarding the end face 1a and the hole 1b in the direction (Y-axis direction) orthogonal to the transport direction (X-axis direction) of the substrate 1, the coating is performed with the revolving arm 32c perpendicular to the Y-axis cylinder 31a. can do. Further, with respect to the end face 1a and the hole 1b in a direction (X-axis direction) parallel to the transport direction (X-axis direction) of the substrate 1, the turning arm 32c is turned in a state parallel to the Y-axis cylinder 31a. It can be applied in a hot state. By adjusting the turning angle of the turning arm 32c, it is possible to apply the liquid to the inner surface of the hole 1b having various shapes.

According to the coating apparatus 10 according to the above-described embodiment, the inkjet head unit 21 constituting the coating unit 20 applies the film forming liquid 2 to all the end faces 1a of the substrate 1 and the inner surfaces of all the holes 1b of the substrate 1 with high accuracy. This makes it possible to apply finely, and it is possible to prevent the generation of dust and the like from the end surface 1a of the substrate 1 and the inner surface of the hole 1b of the substrate 1. Therefore, it is possible to improve the quality of the substrate product and prevent the production equipment from being contaminated by the dust, thereby reducing product defects and reducing the production cost.
When the substrate 1 is a printed wiring board, generation of dust from the end surface 1a and the inner surface of the hole 1b can be prevented. Further, when the substrate is a metal substrate, for example, an aluminum substrate, it is possible to prevent erosion of the metal end surface and the inner surface of the hole. Further, when the substrate is a package substrate, the generation of dust can be prevented and the strength of the substrate can be enhanced.

  Further, according to the coating apparatus 10, control is performed such that the droplet discharge direction A of the head unit 21 is oblique and the film forming liquid 2 is discharged obliquely to the end surface 1 a and the inner surface of the hole 1 b of the substrate 1. Therefore, it is possible to apply the film forming liquid precisely and precisely not only on the end surface 1a of the substrate 1 but also on the inner surface of the hole 1b having various shapes and sizes.

Further, according to the coating apparatus 10, the image recognition unit 51 can accurately recognize not only the outer shape of each substrate but also the position and shape of the hole 1b. Further, the application location (the end surface 1a and the hole 1b of the substrate 1) can be set by the application location setting unit 52 using the substrate image information.
The control unit 40 controls the coating of the film forming liquid 2 on the end surface 1a and the inner surface of the hole 1b of the substrate 1 corresponding to the set application location data, so that the outer shape accuracy of the substrate 1 and the position of the hole 1b are controlled. The movement control of the coating unit 20 by the moving unit 30 and the discharge control of the film forming liquid 2 by the coating unit 20 in consideration of the state in which the precision and size precision are accurately recognized, that is, in consideration of the processing precision (dimensional tolerance) of each substrate. Thus, even if there is an error in the processing accuracy of the substrate 1, the film forming liquid 2 can be accurately and neatly applied to the end surface of the substrate 1 and the inner surface of the hole 1b.

  Further, since the substrate moving unit 60 is provided, the film forming liquid 2 is applied to the end surface 1a of the substrate 1 and the inner surface of the hole 1b while moving the substrate 1 by the substrate moving unit 60, that is, while shifting the position of the substrate 1. Can be applied. Therefore, the configuration of the moving unit 30 can be simplified, and the substrate 1 can be transported by the substrate moving unit 60.

  In the above embodiment, the coating unit 20 is configured to apply the end surface 1a of the substrate 1 and the inner surface of the hole 1b. However, in another embodiment, the coating unit 20 applies the hole 1 A configuration in which only the inner surface of the substrate 1b is applied, or a configuration in which only the end surface 1a of the substrate 1 is applied by the coating unit 20 can be adopted. In still another embodiment, depending on the type of the substrate and the like, the coating unit 20 allows not only the end surface 1a of the substrate 1 and the inner surface of the hole 1b but also the peripheral portion including the end surface 1a of the substrate 1 (upper edge, lower edge). Edge, or upper and lower edges) and / or a hole peripheral portion including the inner surface of the hole 1b (upper edge, lower edge, or upper and lower edges) with a constant width (narrow width). You can also.

  Further, in the above embodiment, the case where the inkjet head unit 21 of the coating unit 20 is disposed on the upper surface side of the substrate 1 has been described, but the inkjet head unit 21 may be disposed on the lower surface side of the substrate 1, or Alternatively, the inkjet head 21 may be arranged on the upper and lower surfaces of the substrate 1. When the film forming liquid is disposed on the upper and lower surfaces, the film forming liquid may be applied in a frame shape to the periphery of a thin substrate such as a package substrate and / or the periphery of a hole.

  Further, in the above-described embodiment, the case where one inkjet head unit 21 of the coating unit 20 is provided has been described. However, a plurality of inkjet head units 21 may be provided. The end face 1a and the hole 1b can be separately coated for the end face 1a and the hole 1b, so that the coating can be performed at the same time, and the coating processing speed can be increased.

10 coating device 20 coating unit (coating means)
21 inkjet head unit 22 ink tank unit 23 ink supply unit 30 moving unit (moving means)
31 linear motion mechanism 32 turning mechanism 33 rotation mechanism 40 control unit (control means)
41 head control unit 42 movement control unit 50 substrate recognition unit 51 image recognition unit 52 coating location setting unit 60 substrate movement unit (substrate movement means)

Claims (8)

An end face of the substrate, and a coating apparatus for applying a film forming liquid to the hole formed in the substrate,
An inkjet type application unit for discharging the film forming liquid,
Moving means for moving the coating means,
Control means for controlling the application of the film forming liquid along the end surface of the substrate and the inner surface of the hole of the substrate while moving the application means by the moving means. apparatus.   The coating apparatus according to claim 1, further comprising a substrate moving unit that moves the substrate.   3. The control device according to claim 1, wherein the control unit has a function of performing control of applying the film forming liquid to a peripheral edge of the end surface of the substrate and / or a peripheral edge of a hole of the substrate. The coating device according to the above. Characterized in that said control means performs control for applying while moving the coating device so as to eject the film-forming liquid from an oblique direction with respect to the end face, and the hole inner surface of the substrate of the substrate The coating device according to any one of claims 1 to 3, wherein Image recognition means for image-recognizing the substrate,
Coating part setting means for setting a coating part using the board image information image-recognized by the image recognition means,
The control means controls the application of the film forming liquid along the end face of the substrate corresponding to the application location data set by the application location setting means, and the inner surface of the hole of the substrate. The coating device according to any one of claims 1 to 4, wherein An end face of the substrate, and a coating method of applying a film forming liquid to the hole formed in the substrate,
Coating said by using a coating means of an inkjet method of discharging film-forming liquid, characterized in that it comprises a coating step of an end surface of the substrate, and along the hole inner surface of the substrate is coated with the film-forming liquid Method. The coating step,
Coating according to claim 6, characterized in that it comprises a step of coating while moving the coating device so as to eject the film-forming liquid from an oblique direction with respect to the end face, and the hole inner surface of the substrate of the substrate Method. An image recognition step of image-recognizing the substrate,
An application point setting step of setting an application point based on the board image information image-recognized by the image recognition step,
The applying step applies the film-forming liquid along the end surface of the substrate and the inner surface of the hole of the substrate corresponding to the application location data set in the application location setting step while moving the application unit. The coating method according to claim 6 or 7, further comprising a step.

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