JP2013030506A - Drawing device, and drawing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a drawing device and a drawing method for drawing a material layer of uniform thickness on a drawn object.SOLUTION: When the area of a drawn object 50 where a liquid material is made to adhere in a drawing pattern has a length of the continuous portion of an image projected vertically onto a virtual straight line orthogonal to the main scanning direction, a controller sets the width Lp of a path area being drawn by single main scanning of a nozzle head 23 to be shorter than the length La of a nozzle array in the nozzle head 23.

Description

  The present invention relates to a drawing apparatus and a drawing method for drawing a pattern by discharging a liquid material.

  A technique is known in which a liquid material containing a pattern forming material is ejected as droplets from a nozzle head (inkjet head), and a material layer is drawn in a predetermined pattern on the surface of a drawing target (for example, Patent Document 1). ).

  In such a drawing technique, for example, a printed wiring board is used as a drawing object, and a liquid solder resist is used as a liquid material. The printed wiring board includes a base material and wiring, and an electronic component or the like is soldered to a predetermined position. Solder resist is an insulating film that is formed on the wiring board so that the necessary conductor parts are exposed and the parts that do not need to be soldered are not soldered for soldering electronic components to the printed wiring board. is there.

Japanese Patent No. 3544543

  An object of the present invention is to provide a drawing apparatus and a drawing method for drawing a material layer having a uniform thickness on a drawing object.

  According to one aspect of the present invention, drawing is performed by holding a substrate, discharging an insulating liquid material toward the substrate held by the holding mechanism, and attaching the insulating liquid material to the substrate. A nozzle head provided with a plurality of nozzles to be performed and a supply path for supplying an insulating liquid material to the plurality of nozzles, and a substrate held by the holding mechanism by moving the holding mechanism to the nozzle head On the other hand, a moving mechanism that performs a main scan that scans in a first direction and a sub-scan that scans in a second direction that intersects the first direction, and image data that defines a pattern to be drawn on the substrate And a control device for controlling the moving mechanism and the nozzle head based on the image data, wherein the plurality of nozzles are arranged in the second direction, and one end side in the second direction The nozzle array length from the nozzle to the nozzle on the other end side is La, and the region to which the insulating liquid material of the pattern to be drawn on the substrate is to be vertically projected onto the virtual straight line orthogonal to the first direction When the length of the continuous portion of the image is Lw, the control device determines the width of the pass area drawn by one main scanning of the substrate based on the length Lw of the continuous portion of the image. And a drawing apparatus for drawing in the pass region by setting an Lp shorter than the nozzle arrangement length La and discharging an insulating liquid material from the nozzle while performing main scanning on the substrate. .

  According to another aspect of the present invention, a plurality of regularly arranged nozzles for discharging the insulating liquid material, and a nozzle head provided with a supply path for supplying the insulating liquid material to the plurality of nozzles, Drawing in which an insulating liquid material is ejected from the nozzle and drawing is performed on the substrate with the liquid material while performing a main scan that scans the surface of the substrate and a sub-scan that scans in a direction crossing the main scan. In this method, the nozzle arrangement length from one end side nozzle to the other end side nozzle of the plurality of regularly arranged nozzles is La, and an insulating liquid material having a pattern to be drawn is attached to the substrate. The width of the pass area drawn in one main scan of the nozzle head, where Lw is the length of the continuous portion of the image vertically projected onto the virtual straight line orthogonal to the main scan direction. The series of images Based on the length Lw of the portion to be performed, the length is set to Lp shorter than the nozzle arrangement length La, and the insulating liquid material is ejected from the nozzle while performing the main scanning of the nozzle head, thereby drawing in the pass region. A drawing method is provided.

  A drawing object in which a liquid material is drawn with a uniform thickness can be obtained.

1A is a side view showing a drawing apparatus, and FIGS. 1B and 1C are a sectional view and a bottom view showing a nozzle head provided in the drawing apparatus. FIG. 2 is a side view showing a state in which the liquid material discharged from the nozzle head adheres to the surface of the drawing object while scanning the drawing object relative to the nozzle head. 3A and 3B are a plan view and a side view showing how a predetermined pattern is drawn on the drawing object. 4A and 4B are a plan view and a side view showing how a predetermined pattern is drawn on the drawing object with a uniform thickness. FIG. 5 shows the length of the continuous portion of the image of the region to which the liquid material vertically projected onto the imaginary straight line orthogonal to the main scanning direction of the nozzle head and the width of an arbitrary pass region shorter than the nozzle arrangement length. FIG. 6A and 6B are a plan view showing a state in which drawing is performed in the pass region by the nozzle head, and a bottom view showing a modified example of the nozzle head according to the embodiment.

  FIG. 1A is a side view illustrating a configuration of a drawing apparatus according to an embodiment. The drawing apparatus includes a surface plate 20, a frame 21, a stage 22, a nozzle head 23, a CCD camera 30, and a control device 40. The surface plate 20 is installed in a plane parallel to the XY plane in the coordinate system in the drawing. The stage 22 is disposed on the surface plate 20. The frame 21 is fixed to the surface plate 20 and is disposed so as to surround the stage 22 in a gate shape when viewed along the Y-axis direction, and the nozzle head 23 and the CCD camera 30 are attached thereto. The control device 40 controls the operation of the drawing device.

  The stage 22 includes, for example, a moving mechanism such as a Y stage 22y, an X stage 22x and a θ stage 22θ arranged in order from the surface plate 20, and a holding mechanism such as a chuck plate 22a. Each of the Y stage 22y, the X stage 22x, and the θ stage 22θ includes a drive mechanism such as a ball screw or a linear motor. The chuck plate 22a holds the drawing object (for example, a printed wiring board) 50 by suction. The θ stage 22θ rotates the held drawing object 50 around a rotation axis parallel to the Z axis within a plane parallel to the XY plane. The X stage 22x and the Y stage 22y can move the drawing object 50 in the X-axis direction and the Y-axis direction, respectively. The suction of the drawing object 50 by the chuck plate 22a is controlled by the control device 40. The movement of the drawing object 50 by the X, Y, θ stages 22x, 22y, 22θ is controlled by the control device 40 via the drive mechanism of each stage. The moving mechanism may be a single movable stage that can move the drawing object in the X, Y, and θ directions, respectively.

  The frame 21 includes two support columns 21a and 21b and a beam 21c. The support columns 21 a and 21 b are erected at the approximate center of the surface plate 20 in the Y-axis direction. The beam 21c is supported by the columns 21a and 21b along the X-axis direction.

  The nozzle head 23 and the CCD camera 30 are attached to the beam 21 c of the frame 21. The nozzle head 23 discharges an insulating liquid material containing a pattern forming material (for example, a liquid solder resist to which a photocuring agent is added) as droplets toward the drawing target 50 held by the holding mechanism 22a. (Drip). The discharge of the liquid material from the nozzle head 23 is controlled by the control device 40. The CCD camera 30 images the surface of the drawing object 50 held by the holding mechanism 22a. By moving the drawing object 50 by the moving mechanism, it is possible to acquire imaging data at an arbitrary position on the drawing object 50. The acquired imaging data is transmitted to the control device 40. Based on the acquired imaging data, the control device 40 can measure the position where the liquid material should be attached to the drawing target 50 and inspect the attached liquid material. Imaging by the CCD camera 30 and transmission of the imaging data are controlled by the control device 40.

  The control device 40 includes a storage device 40a, and image data (gerber data, bitmap data, etc.) that defines a pattern to be drawn on the drawing object 50 is stored in the storage device 40a. The control device 40 moves the drawing target object 50 by the moving mechanism so that a pattern to be drawn on the drawing target object 50 is drawn based on the image data captured by the CCD camera 30 and the image data stored in the storage device 40a. And the discharge of the liquid material from the nozzle head 23 is controlled.

  The drawing object 50 is moved in the X-axis and Y-axis directions, and a liquid material is attached to the nozzle head 23 vertically below (Z-axis direction).

  In FIG. 1A, the stage 22 has a moving mechanism and the frame 21 is fixed. However, the frame 21 may have a moving mechanism.

  1B and 1C are a cross-sectional view and a bottom view showing the configuration of the nozzle head 23. As shown in FIG. 1B, the nozzle head 23 includes a plurality of nozzles 23a that are regularly arranged and eject a liquid material based on an electric signal, and a supply path 23b that supplies the liquid material to the nozzles 23a. The nozzles 23a are arranged at a pitch P along the X-axis direction, and the length from the nozzle 23a at one end to the nozzle 23a at the other end is La. For example, the nozzle has an opening diameter of about 30 μm, a pitch P of about 160 μm, and a nozzle array length La of about 30 mm. Further, as shown in FIG. 1C, the nozzle head 23 includes a light source 23c for photocuring a liquid material adhering to the drawing target 50, for example, a solder resist to which a photocuring agent is added. Each of the plurality of nozzles 23a is configured to include, for example, a piezo element, and ejects a liquid material by applying an electric signal. The discharge of the liquid material from each of the plurality of nozzles 23a is controlled by the control device 40.

  FIG. 2 is a side view showing a state in which the liquid material discharged from the nozzle head 23 is attached to the surface of the drawing object 50 while scanning the drawing object 50 with the nozzle head 23. The control device 40 (FIG. 1A) moves the drawing object 50 with respect to the nozzle head 23, for example, in the Y-axis direction with a predetermined reference voltage applied to the nozzle 23a. Based on the image data captured by the CCD camera 30 (FIG. 1A) and the image data stored in the storage device 40a (FIG. 1A), for example, a liquid material under the condition that the ejection cycle S (ejection frequency F) is about 33 μs (30 kHz) A voltage pulse is applied to the nozzle 23a that discharges water. The nozzle 23a discharges the liquid material by applying a voltage pulse starting at time T1, and causes the liquid material to adhere to the point P1 on the drawing object 50. Further, by applying a voltage pulse starting at time T2, the liquid material is ejected, and the liquid material is attached to the point P2 on the drawing object 50. The liquid material is repeatedly discharged onto the drawing object, and a pattern to be drawn is drawn on the surface of the drawing object. For example, the distance between the drawing object 50 and the nozzle 23a of the nozzle head 23 is about 1 mm, and the distance from the points P1 to P2 is about 20 μm.

  The inventors conducted an evaluation experiment in which a solder resist in which a photocuring agent is added to a printed wiring board is drawn in a predetermined pattern using the above drawing apparatus. In the following description, it is assumed that the nozzle head scans the surface of the printed wiring board for convenience.

  3A and 3B are a plan view and a side view showing how a solder resist pattern is drawn on a printed wiring board. On the printed wiring board 50, for example, a plurality of wiring regions 51 having a congruent solder resist pattern to be drawn and a width Lw in the X-axis direction are arranged in a matrix. The wiring region 51 and the solder resist layer 60 formed on the printed wiring board are indicated by hatching. In addition, the nozzle head 23 in the drawing is shown as a perspective view for convenience, so that the nozzle 23a can be shown.

  In this evaluation experiment, the control device 40 (FIG. 1A) first refers to the alignment mark M formed on the printed wiring board 50 by the CCD 30 (FIG. 1A), and one end of the nozzles 23a arranged in the nozzle head 23 is detected. The nozzle head 23 is moved so as to be arranged at the corner of the area to be drawn on the printed wiring board 50. Further, the nozzle head 23 is main-scanned from one end side to the other end side of the printed wiring board 50 along the Y-axis direction with a width equal to the nozzle arrangement length La, that is, on the pass region 52a having the width La. At the same time, a predetermined voltage pulse is applied to the nozzle 23 a provided in the nozzle head 23, and the solder resist is discharged to the region where the solder resist in the pass region 52 a is to be adhered. The solder resist adhered to the wiring area 51 in the pass area 52a is immediately photocured by the light source 23c (FIG. 1C) provided in the nozzle head 23.

  Next, the nozzle head 23 is sub-scanned to the position shifted by the arrangement length La of the nozzles 23a along the X-axis direction, and the nozzle head 23 is main-scanned on the pass region 52b having the width La. At the same time, a predetermined voltage pulse is applied to the nozzle 23 a provided in the nozzle head 23, and the solder resist is discharged to the region where the solder resist in the pass region 52 b is to be adhered. The solder resist adhering to the wiring area 51 of the pass area 52b is immediately photocured by the light source 23c provided in the nozzle head 23. As described above, the main scanning in which the nozzle head scans from one end side to the other end side of the printed wiring board and the sub scanning in which the nozzle head scans in the direction intersecting the main scanning direction are repeatedly performed. Draw on the entire surface.

  In a drawing operation of a printed wiring board in which such wiring areas are arranged in a matrix, the nozzle array length La is not normally equal to the width Lw of the wiring area 51. Therefore, in the pass areas 52a to 52d defined on the surface of the printed wiring board 50, there exist pass areas 52b and 52d including a non-attached longitudinal section that is longitudinally cut in the main scanning direction of the nozzle head 23 and does not adhere a solder resist. It will be. The non-adhesive vertical region corresponds to a gap region between a wiring region group arranged in the column direction and an adjacent wiring region group, a peripheral region of the printed wiring board, and a protruding region that is protruded from the printed wiring board and main-scanned. . When drawing is performed in the pass areas 52b and 52d including the non-attached vertical area, the nozzle 23a corresponding to the non-attached vertical area of the nozzle head 23 discharges the solder resist over the main scanning of the pass areas 52b and 52d. There is no. Here, the ratio of the nozzles 23a that discharge the solder resist at least once over the main scan of the pass area with respect to the plurality of nozzles 23a provided in the nozzle head 23 is determined as the discharge duty of the nozzle head in the pass area. It is defined as The pass regions 52a and 52c that do not include the non-adhesive vertical region have a relatively high discharge duty of the nozzle head 23, and the pass regions 52b and 52d that include the non-adhesive vertical region have a relatively low discharge duty of the nozzle head 23. .

  According to the evaluation experiment of the present inventors, in the pass regions 52a and 52c in which drawing is performed with a relatively high discharge duty, the amount of solder resist discharged at one time from one nozzle is relatively small, and FIG. As shown in the figure, it was found that the thickness of the solder resist layer 60 formed on the printed wiring board 50 is relatively thin. Further, in the pass regions 52b and 52d in which drawing is performed with a relatively low discharge duty, the amount of solder resist discharged from one nozzle at a time is relatively large, and as shown in FIG. It was found that the thickness of the solder resist layer 60 formed on the substrate becomes relatively thick. Such a phenomenon is a case where a relatively viscous liquid material such as a solder resist is discharged from the nozzle 23a, and the supply path 23b (FIG. 1B) for supplying the liquid material has a plurality of nozzles 23a. This can occur when the nozzle head 23 provided in common is used.

  The thickness of the solder resist formed on the printed wiring board is desirably uniform in terms of appearance quality. Based on the above evaluation experiment, the width of the pass area is set shorter than the nozzle arrangement length and the width of the wiring area is equally divided, and the discharge duty of the nozzle head that draws each pass area is set to the same level. Is considered desirable. The drawing of each pass area is performed with the same discharge duty, and the amount of solder resist discharged from one nozzle at a time in each pass area is made the same, so that the solder resist layer formed on the printed wiring board It is thought that the thickness can be made uniform.

  4A and 4B are a plan view and a side view showing a state in which a solder resist pattern is uniformly drawn on a printed wiring board. The wiring region 51 and the solder resist layer 60 formed on the printed wiring board are indicated by hatching. In addition, the nozzle head 23 in the drawing is shown as a perspective view for convenience, so that the nozzle 23a can be shown. In this embodiment, the control device 40 (FIG. 1A) first vertically projects on a virtual straight line perpendicular to the main scanning direction of the nozzle head 23 based on the image data stored in the storage device 40a (FIG. 1A). The position of the continuous part of the image of the area to which the solder resist is to be deposited and the length thereof are calculated. That is, the position on the X axis of the wiring region 51 group arranged in the column direction and its width Lw are calculated. Then, the width Lp of the pass area drawn in one main scan is set to a width that is shorter than the nozzle arrangement length La and equally divides the width Lw of the wiring area 51. For example, when the nozzle array length La is 30 mm and the width Lw of the wiring area is 50 mm, the width Lp of the pass area is set to 50/2 = 25 mm.

  The control device 40 refers to the alignment mark M formed on the printed wiring board 50 and moves the nozzle head 23 so as to be arranged at the corner of the area to be drawn on the printed wiring board 50. Then, the nozzle head 23 is main-scanned from one end side to the other end side of the printed wiring board 50. At this time, the solder resist is discharged from the nozzle group included in the range from the nozzle 23a on one end side arranged in the nozzle head 23 to the width Lp of the previously set pass region, and the pass region 52e having the width Lp is discharged. Draw. The nozzles shown in black in the figure are not included in the range from one end of the nozzles 23a arranged in the nozzle head 23 to the width Lp of the pass area, and the solder resist is applied over the main scan of the pass area 52e. This nozzle is controlled not to discharge.

  Next, the control device 40 sub-scans the nozzle head 23 to a position shifted by the width Lp of the pass region along the X-axis direction, and nozzles from one end side to the other end side of the printed wiring board 50 along the Y-axis direction. The head 23 is main-scanned. At this time, the solder resist is ejected from the nozzle group included in the range from the nozzle 23a on one end side arranged in the nozzle head 23 to the width Lp of the pass region, and the pass region 52f having the width Lp is drawn. As described above, the nozzle head is moved to the corner of the area where the solder resist of the printed wiring board 50 is to be adhered, and the nozzle head scans the surface of the printed wiring board, and the nozzle head intersects the main scanning direction. Sub-scanning in the scanning direction is repeated, and drawing is performed on the entire surface of the printed wiring board.

  By such a drawing operation, the discharge duty of the nozzle head in each pass region becomes approximately the same (Lp / La), and the amount of solder resist discharged from one nozzle at a time in each pass region can be made approximately the same. It becomes possible. As a result, as shown in FIG. 4B, the thickness of the solder resist layer 60 formed on the printed wiring board 50 can be made uniform.

  FIG. 5 shows a continuous portion of an image of a region to which a solder resist projected vertically onto a virtual straight line orthogonal to the main scanning direction of the nozzle head, that is, the width Lw of the wiring region, the nozzle arrangement length La, the nozzle It is a diagram which shows the relationship with the width | variety Lp of the arbitrary path | pass area | regions shorter than arrangement | sequence length La. For example, the width Lw of the wiring region is larger than twice the nozzle array length La and smaller than three times. The width Lp of the pass area is set to Lw / n1 where n1 (n1 = 3 in the relationship shown in the figure) is the minimum n that satisfies the condition of (n × La)> Lw (n is a natural number). Is desirable. This is because the discharge duty of the nozzle head in each pass region can be made comparable, and the entire wiring region having the width Lw can be drawn with the smallest number of main scans.

  However, the width Lp of the pass region may not be a width that completely divides the width Lw of the wiring region. Wiring with the pass area width Lp set to La and the number of main scans of the nozzle head when drawing is performed on the entire wiring area (three times in the relationship shown in the figure) and the pass area width Lp shorter than La The width Lp of the pass area may be set in a range in which the number of main scans of the nozzle head when drawing on the entire area is the same. In other words, the width Lp of the pass area may be set to Ld / n1 where Ld is a length equal to or greater than Lw and shorter than n1 × La. By setting the width of the pass area in this way, it is possible to suppress variation in the ejection duty of the nozzle head in each pass area, compared to when the width of the pass area is set to the nozzle arrangement length. Therefore, it is possible to suppress variations in the thickness of the solder resist layer formed on the printed wiring board, compared to when the width of the pass area is set to the nozzle arrangement length.

  FIG. 6A is a plan view showing a state in which drawing is performed in the pass region by the nozzle head. In the example, the solder resist was discharged from the nozzle group included in the range from the nozzle on one end side arranged in the nozzle head to the width Lp of the pass region, and each pass region was drawn. However, as shown in FIG. 6A, the solder resist may be discharged from the nozzle group corresponding to the width Lp of the pass region without being biased to any end side of the nozzles 23a arranged in the nozzle head 23.

  Under normal temperature, the viscosity of the solder resist is relatively high, and therefore, the solder resist may not be discharged from the nozzle. A liquid material containing a solder resist generally has a positive correlation between temperature and viscosity. The solder resist is preferably supplied to the nozzle after heating to lower the viscosity in order to facilitate discharge from the nozzle. Nozzles arranged near both ends of the nozzle head tend to decrease in temperature due to outside air, so that the viscosity of the solder resist is likely to increase. If the viscosity of the solder resist differs between the end of the nozzle provided in the nozzle head and the vicinity of the center, the amount of solder resist discharged at one time differs, and the thickness of the material layer formed on the printed wiring board does not become uniform. There is a possibility. Therefore, it would be preferable to perform drawing with a thermally stable nozzle group that is not biased to any end side of the nozzles provided in the nozzle head. Specifically, it is desirable to use a nozzle group excluding 2-3% of the nozzle arrangement length from the nozzle end provided in the nozzle head.

  Further, in order to improve the resolution in the X-axis direction of the pattern to be drawn on the printed wiring board, the nozzle head may be shifted in the X-axis direction and a plurality of scans may be performed. As shown in FIG. 6A, the nozzle head 23 is scanned in the Y-axis direction, and is shifted from the scanning position of the nozzle head 23 by a distance shorter than the pitch P of the nozzles 23a in the X-axis direction, for example, P / 2. The nozzle head 23 is scanned again in the Y-axis direction at the position. At this time, the resolution in the X-axis direction drawn in the pass area 52e is approximately twice the resolution of the nozzle head 23. Such a drawing operation makes it possible to easily improve the resolution in the X-axis direction of a pattern to be drawn in one pass area. In such a drawing operation, the main scan of the nozzle head includes a scan in the Y-axis direction and a scan in the X-axis direction shorter than the nozzle pitch, and the sub-scan of the nozzle head is an X greater than the nozzle pitch. Includes axial scanning. Further, the width of the pass area is the maximum in the X-axis positive direction in which the solder resist is discharged in the second scan from the nozzle 23a at the extreme end in the X-axis negative direction that discharges the solder resist in the first scan in the Y-axis direction. This is the width up to the nozzle 23a at the end.

  FIG. 6B is a bottom view showing a modified example of the nozzle head according to the embodiment. The nozzle head may have a configuration in which the nozzles are arranged in a staggered manner. The plurality of nozzles 23a constitute a total of two nozzle rows 23I and 23II, for example, one row each in the Y-axis negative direction and the Y-axis positive direction. The nozzles 23a constituting the nozzle rows 23I and 23II are arranged at a pitch P in the X-axis direction. The nozzles 23a constituting one nozzle row 23I are arranged with a shift of P / 2 in the X-axis direction with respect to the nozzles 23a constituting the other nozzle row 23II. By configuring the nozzle head 23 in such a configuration, the resolution in the X-axis direction can be easily increased without being restricted by the supply mechanism for supplying the solder resist to the nozzle 23a and the dimensions and layout of the piezo elements. Is possible. At this time, the nozzle array length La is the length from the nozzle at the extreme end in the X-axis positive direction of the nozzle row 23I to the nozzle at the extreme end in the X-axis negative direction of the nozzle row 23II.

  As mentioned above, although this invention was demonstrated using the Example, this invention is not restrict | limited to these. For example, the printed wiring board may have a configuration including a single resist pattern instead of a configuration including a plurality of wiring regions. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

21 frame 21a, b strut,
21c beams,
22 holding mechanism,
22a chuck plate,
22θ θ stage,
22x x stage,
22y y stage,
23 Nozzle head,
23a nozzle,
23I, II nozzle row,
23b supply path,
23c light source,
30 CCD camera,
40 control device,
40a storage device,
50 Drawing object,
51 wiring area,
52 pass area,
60 material layers,
F Discharge frequency,
La nozzle arrangement length,
Lw Wiring area width,
Lp path area width,
M alignment mark,
P nozzle pitch,
V voltage,
S discharge cycle,
T time,
Vh Voltage pulse height,
Pw Voltage pulse width.

Claims (8)

A holding mechanism for holding the substrate;
A plurality of nozzles for performing drawing by discharging an insulating liquid material toward the substrate held by the holding mechanism and attaching the insulating liquid material to the substrate, and supplying the insulating liquid material to the plurality of nozzles A nozzle head provided with a supply path,
By moving the holding mechanism, a main scan for scanning the substrate held by the holding mechanism in a first direction with respect to the nozzle head and a second direction intersecting the first direction are scanned. A sub-scanning moving mechanism;
A controller for storing image data defining a pattern to be drawn on the substrate and controlling the moving mechanism and the nozzle head based on the image data;
With
The plurality of nozzles are arranged in the second direction, and a nozzle arrangement length from one end side nozzle to the other end side nozzle in the second direction is La,
When the length of a continuous portion of an image obtained by vertically projecting the region to which the insulating liquid material of the pattern to be drawn on the substrate is to be projected onto a virtual straight line perpendicular to the first direction is Lw,
The control device sets a width of a pass region drawn in one main scan of the substrate to Lp shorter than the nozzle arrangement length La based on a length Lw of a continuous portion of the image. A drawing apparatus that performs drawing in the pass region by discharging an insulating liquid material from the nozzle while performing main scanning on the substrate.   The controller sets the width of the pass region to Lp, and the number of main scans of the substrate when drawing on the surface of the substrate corresponding to a continuous portion of the image is the width of the pass region. Is set to La, and the width Lp of the pass region is set in a range that is the same as the number of times of main scanning of the substrate when drawing is performed on the surface of the substrate corresponding to a continuous portion of the image. Item 2. The drawing apparatus according to Item 1. When n is an arbitrary natural number, the minimum n satisfying the condition of (n × La)> Lw is n1, and a length that is greater than or equal to Lw and shorter than n1 × La is Ld,
The drawing apparatus according to claim 1, wherein the control device sets a width Lp of the pass region to Ld / n1.   The said control apparatus selects the nozzle group which discharges an insulating liquid material toward the said pass area | region so that it may not be biased to any end side of the several nozzle provided in the said nozzle head. The drawing apparatus according to claim 1. A main scan that scans the surface of the substrate with a plurality of regularly arranged nozzles for discharging the insulating liquid material, and a nozzle head provided with a supply path for supplying the insulating liquid material to the plurality of nozzles; A drawing method of drawing an insulating liquid material from the nozzle and drawing on the substrate with the liquid material while performing a sub-scan that scans in a direction crossing the main scan,
The nozzle arrangement length from the nozzles on one end side to the nozzles on the other end side of the plurality of regularly arranged nozzles is La,
When the length of the continuous portion of the image vertically projected on the virtual straight line perpendicular to the main scanning direction is set to Lw, the region to which the insulating liquid material of the pattern to be drawn on the substrate is to be attached,
The width of the pass area drawn in one main scan of the nozzle head is set to Lp shorter than the nozzle arrangement length La based on the length Lw of the continuous portion of the image, and the nozzle head A drawing method of drawing in the pass region by discharging an insulating liquid material from the nozzle while performing main scanning.   When the width of the pass area is set to Lp and drawing is performed on the surface of the substrate corresponding to a continuous portion of the image, the number of main scans of the nozzle head sets the width of the pass area to La The drawing method according to claim 5, wherein the number of times of main scanning of the nozzle head when drawing is performed on the surface of the substrate corresponding to a continuous portion of the image.   The width Lp of the pass region is determined when n is an arbitrary natural number, the minimum n satisfying the condition of (n × La)> Lw is n1, and a length that is greater than Lw and shorter than n1 × La is Ld. The drawing method according to claim 5, wherein Ld / n1.   The drawing method according to claim 5, wherein the nozzle group that discharges the insulating liquid material toward the pass region is not biased to any end side of the plurality of nozzles provided in the nozzle head.

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