JP2022110842A - Pattern formation device and pattern formation method - Google Patents

Abstract

To provide a technique for reducing a positional disorder of a landing position of ink droplets around the inside of a through hole when a pattern is formed on a substrate having a through hole by an inkjet method.SOLUTION: A stage 20 has a plurality of suction holes 21 on its upper surface. When a negative pressure generation part 27 sets the inside of the plurality of suction holes 21 at a negative pressure, an atmosphere above a porous body 60 mounted on an upper surface of the stage 20 is sucked through the porous body 60. Thereby, a wiring board 9 is adsorbed onto the upper surface of the porous body 60. When the wiring board 9 is mounted on the porous body 60, the upper surface of the porous body 60 has a first overlapping region overlapping a through hole 91 of the wiring board 9. A printing head 40 discharges ink droplets to at least a part of the first overlapping region of the porous body 60.SELECTED DRAWING: Figure 7

Description

The present invention relates to a pattern forming apparatus and a pattern forming method.

A resist film is sometimes formed on the wiring board for the purpose of protecting the conductive pattern provided on the wiring board. The resist film also has the role of preventing solder from adhering to regions such as conductor wiring when solder is applied in a post-process, and is also called a "solder resist". As one method for forming a resist film, there is known a method in which droplets of solder resist ink are ejected toward a wiring substrate by an inkjet method (for example, Patent Document 1).

By the way, a wiring board is usually provided with several through holes. When the wiring board is sucked by the suction holes of the stage, the atmosphere above the wiring board may be sucked into the through holes. In the case of the ink jet method, ink droplets ejected around the through hole of the wiring board are drawn into the through hole, causing disturbance in the landing position of the ink droplets. As a result, several problems arise, such as ink being applied to unintended areas and not enough ink being applied to intended areas.

In Patent Literature 1, the amount of ink ejected per unit area in the peripheral application area around the through-hole of the wiring board is made larger than the amount of ink ejected per unit area in the area outside the peripheral application area. is proposing.

JP 2020-136549 A

According to the technique of Patent Document 1, it is possible to apply a necessary amount of ink around the through hole of the wiring board. However, since the airflow in the through-hole cannot be suppressed, it is difficult to suppress the disturbance of the ink landing position.

SUMMARY OF THE INVENTION An object of the present invention is to provide a technique for reducing the disturbance of ink droplet landing positions around a through-hole when forming a pattern on a substrate having a through-hole by an inkjet method.

In order to solve the above problems, a first aspect is a pattern forming apparatus, which includes a porous body having a top surface on which a substrate having through holes is placed and having a structure with a large number of holes; a suction mechanism that causes the substrate to be attracted to the porous body by sucking the atmosphere above the porous body through the porous body; a print head that ejects ink droplets; A movement mechanism for relatively moving a porous body, and a control unit for controlling the print head and the movement mechanism, wherein the substrate is placed on the upper surface of the porous body. a first overlapping region that overlaps with the through-hole of the substrate when the substrate is formed, and the controller instructs the print head to apply ink to at least a portion of the first overlapping region of the porous body. Eject a drop.

A second aspect is the pattern forming apparatus according to the first aspect, wherein the control unit causes the print head to eject ink droplets onto all of the first overlapping regions of the porous body.

A third aspect is the pattern forming apparatus according to the first aspect or the second aspect, wherein the suction mechanism has an upper surface on which the porous body is placed, and a plurality of suction holes are dispersed on the upper surface. and a negative pressure generating portion that creates a negative pressure inside the plurality of suction holes.

A fourth aspect is the pattern forming apparatus of the third aspect, wherein the plurality of suction holes includes overlapping suction holes that overlap the through holes of the substrate when the substrate is placed on the porous body. , the upper surface of the porous body has a second overlapping area overlapping with the overlapping suction holes, and the control unit instructs the print head to at least part of the second overlapping area of the porous body to eject ink droplets.

A fifth aspect is the pattern forming apparatus according to the fourth aspect, wherein the control section causes the print head to eject ink droplets onto all of the second overlapping regions of the porous body.

A sixth aspect is the pattern forming apparatus according to any one of the first to fifth aspects, wherein the controller controls the print head to control the pattern of the substrate placed on the upper surface of the porous body. Ink droplets are ejected inside the through holes.

A seventh aspect is a pattern forming method, comprising: a) a step of adsorbing a substrate having through holes to a porous body having a structure with a plurality of holes; a step of ejecting an ink droplet onto at least a portion of a first overlapping region overlapping the through-hole of the substrate when placed on the porous body; and then ejecting ink droplets onto the upper surface of the substrate.

An eighth aspect is the pattern forming method of the seventh aspect, wherein the step b) is performed after the step a), and the step b) ejects ink droplets inside the through holes of the substrate. By doing so, the ink is applied to the upper surface of the porous body.

According to the pattern forming apparatuses of the first to sixth aspects, the holes of the porous body are formed by ejecting ink droplets onto at least a part of the first overlapping region overlapping the through-holes of the substrate, on the upper surface of the porous body. blocked. As a result, the airflow in the through-hole of the substrate is suppressed, so that the disturbance of the landing position of the ink around the through-hole of the substrate can be reduced.

According to the pattern forming apparatus of the second aspect, since the ink is ejected onto the entire first overlapping region of the porous body, it is possible to further suppress the airflow inside the through-holes of the substrate.

According to the pattern forming apparatus of the third aspect, the atmosphere inside the porous body can be sucked by applying a negative pressure to the plurality of suction holes provided in the holding section. Therefore, the substrate can be adsorbed on the upper surface of the porous body.

According to the pattern forming apparatus of the fourth aspect, ink is ejected onto the second overlapping region of the porous body that overlaps with the overlapping suction hole located at the same position as the through hole of the substrate. Accordingly, it is possible to suppress the airflow in the through holes of the substrate that are located at the same positions as the suction holes of the holding portion.

According to the pattern forming apparatus of the fifth aspect, since the ink is ejected onto the entire second overlap region of the porous body, it is possible to further suppress the airflow inside the through-hole of the substrate.

According to the pattern forming apparatus of the sixth aspect, by ejecting ink droplets into the through-holes of the substrate placed on the upper surface of the porous body, the ink droplets are applied to the portions of the porous body overlapping the through-holes. . As a result, the pores of the porous body that overlap with the through-holes of the substrate can be blocked, so that the airflow in the through-holes can be suppressed. In addition, since the ink droplets are ejected onto the porous body while the substrate is placed on the porous body, pattern formation on the substrate can be started immediately after the ink ejection onto the porous body is completed. Thereby, the pattern can be efficiently formed on the substrate.

According to the pattern forming methods of the seventh and eighth aspects, the holes of the porous body are formed by ejecting ink droplets onto at least a portion of the first overlapping region overlapping the through-holes of the substrate on the upper surface of the porous body. blocked. As a result, the airflow in the through-hole of the substrate is suppressed, so that the disturbance of the landing position of the ink around the through-hole of the substrate can be reduced.

According to the pattern forming method of the eighth aspect, by ejecting ink droplets into the through-holes of the substrate placed on the upper surface of the porous body, the ink droplets are applied to the portions of the porous body that overlap with the through-holes. . As a result, the pores of the porous body that overlap with the through-holes of the substrate can be blocked, so that the airflow in the through-holes can be suppressed. In addition, since the ink droplets are ejected onto the porous body while the substrate is placed on the porous body, pattern formation on the substrate can be started immediately after the ink ejection onto the porous body is completed. Thereby, the pattern can be efficiently formed on the substrate.

1 is a perspective view showing a pattern forming device according to a first embodiment; FIG. 4 is a schematic cross-sectional view showing a stage; FIG. 4 is a schematic cross-sectional view showing a stage and a porous body; FIG. 3 is a schematic cross-sectional view showing a stage and a porous body on which a wiring board is placed; FIG. It is a block diagram which shows the hardware constitutions of a control part. It is a figure which shows the flow of the process which a pattern formation apparatus performs. FIG. 4 is a diagram showing a first example of formation of an ink curing portion on a porous body; FIG. 10 is a diagram showing a second example of forming an ink curing portion on a porous body; FIG. 10 is a diagram showing a third example of formation of an ink curing portion on a porous body; FIG. 10 is a schematic cross-sectional view showing a stage and a porous body according to a second embodiment;

Embodiments of the present invention will be described below with reference to the accompanying drawings. Note that the constituent elements described in the embodiment are merely examples, and are not intended to limit the scope of the present invention only to them. In the drawings, for ease of understanding, the dimensions and numbers of each part may be exaggerated or simplified as necessary.

For convenience of explanation, the drawings are provided with arrows indicating mutually orthogonal X, Y, and Z axes. In the following description, the Z direction is parallel to the vertical direction, and the X and Y directions are parallel to the horizontal plane. The direction in which the tip of each arrow points is the + (plus) direction, and the opposite direction is the - (minus) direction. Also, in the following description, the +Z side is simply referred to as the upper side, and the -Z side is simply referred to as the lower side.

<1. First Embodiment>
FIG. 1 is a perspective view showing a pattern forming apparatus 1 according to the first embodiment. The pattern forming apparatus 1 forms, for example, a pattern (image) of a resist film on the upper surface 9s of a printed wiring board (hereinafter simply referred to as "wiring board") 9 using solder resist ink. The pattern forming apparatus 1 forms an image by an inkjet method. The wiring board 9 is, for example, a rectangular plate-like base material made of glass epoxy resin. However, the wiring board 9 may be a flexible sheet-like member or the like. The resist film protects the conductive pattern on the wiring substrate 9, for example. Conductive patterns include, for example, wiring or lands. The resist film does not have to be formed on the area where the solder paste is applied in the post-process and the area where the resist film should not be provided.

The pattern forming apparatus 1 includes an apparatus main body 10 and a control section 12 . The device main body 10 includes a stage 20 , a moving mechanism 30 , a print head 40 , a tank 45 , a UV irradiation section 50 and a porous body 60 .

<Stage>
The stage 20 is a member that holds the wiring board 9 . The stage 20 has an upper surface on which the wiring substrate 9 is placed. The stage 20 is, for example, a rectangular parallelepiped member. When the wiring board 9 is placed on the upper surface of the stage 20 , a porous body 60 to be described later is arranged between the stage 20 and the wiring board 9 .

FIG. 2 is a schematic cross-sectional view showing the stage 20. As shown in FIG. A plurality of suction holes 21 are dispersedly formed on the upper surface of the stage 20 . Each suction hole 21 is connected to a negative pressure generator 27 via a channel 23 provided inside the stage 20 and a pipe 25 provided outside the stage 20 . The negative pressure generator 27 makes the inside of the suction hole 21 negative pressure by discharging the atmosphere inside the flow path 23 and the pipe 25 . The negative pressure generator 27 is configured by, for example, a vacuum pump or a fan. The negative pressure generator 27 may be a negative pressure source provided outside the pattern forming apparatus 1 .

<Movement Mechanism>
Returning to FIG. 1 , the moving mechanism 30 relatively moves the print head 40 in the X direction and the Y direction with respect to the wiring board 9 held on the stage 20 . The moving mechanism 30 includes, for example, a main scanning moving section 31 and a sub-scanning moving section 33 . The main scanning moving unit 31 moves the wiring board 9 held on the stage 20 with respect to the print head 40 in the Y direction (main scanning direction) parallel to the upper surface of the stage 20 . The sub-scanning movement unit 33 moves the print head 40 in the X direction (sub-scanning direction) with respect to the wiring board 9 held on the stage 20 . The X direction is perpendicular to the Y direction and parallel to the upper surface 9 s of the wiring board 9 placed on the stage 20 . A ball screw mechanism including a motor or a linear motor mechanism, for example, can be employed as the drive mechanism for the main scanning movement section 31 and the sub-scanning movement section 33 .

Note that the moving mechanism 30 may be configured to move the print head 40 in both the X direction and the Y direction. Also, the moving mechanism 30 may be configured to move the stage 20 in both the X direction and the Y direction.

<Print head>
The print head 40 ejects fine droplets (ink droplets) of solder resist ink (hereinafter simply referred to as “ink”) toward the wiring board 9 during movement. The tank 45 stores ink supplied to the print head 40 . Ink is supplied to the print head 40 from a tank 45 through a tube 47 . The ink supplied to the print head 40 is, for example, ink that is cured by irradiation with energy rays (radiation including particle beams and electromagnetic waves), and specifically UV curing ink.

The print head 40 has a lower surface facing the stage 20 . A plurality of nozzles are provided on the lower surface of the print head 40 . The print head 40 ejects droplets of ink from each nozzle by an inkjet method. The ink is ejected in the -Z direction toward the upper surface 9s of the wiring board 9 held by the stage 20. FIG. A piezo system or a thermal system can be adopted as the inkjet system.

While the main scanning movement unit 31 moves the stage 20 holding the wiring board 9 in the Y direction, the print head 40 ejects ink droplets from a plurality of nozzles. is given. Hereinafter, movement of the print head 40 in the Y direction with respect to the wiring board 9 is referred to as "main scanning". Further, the movement of the print head 40 in the X direction with respect to the wiring board 9 is called "sub-scanning".

The UV irradiation section 50 has a UV lamp. The UV irradiation unit 50 is located on the +Y side of the print head 40 . The UV irradiation section 50 is fixed to the print head 40 . The sub-scanning movement unit 33 moves the UV irradiation unit 50 together with the print head 40 in the X direction. The UV irradiation unit 50 cures the ink applied to the wiring board 9 by the print head 40 by irradiating the wiring board 9 with ultraviolet rays. The UV irradiator 50 is an example of an irradiator that irradiates energy rays.

In the main scanning, the wiring substrate 9 held on the stage 20 is moved in the +Y direction with respect to the print head 40 in order to cure the ink in the UV irradiation unit 50 . As a result, the print head 40 can apply ink to the wiring board 9 in one main scan, and the ink applied to the wiring board 9 can be cured by the ultraviolet rays of the UV irradiation unit 50 . Note that it is not essential that the UV irradiation unit 50 is fixed to the print head 40 . The UV irradiation section 50 may be provided separately from the print head 40 .

<Porous body>
The porous body 60 is made of a porous material and has a structure with many fine holes. The porous body 60 is, for example, a thin plate. However, the porous body 60 may be sheet-like. The porous body 60 is made of a material such as metal, paper, non-woven fabric, or pumice stone.

FIG. 3 is a schematic cross-sectional view showing stage 20 and porous body 60. As shown in FIG. With the porous body 60 placed on the upper surface of the stage 20, the negative pressure generator 27 creates a negative pressure in each of the suction holes 21 of the stage 20, so that the atmosphere above the stage 20 becomes porous. It is sucked into each suction hole 21 through the body 60 . Thereby, the porous body 60 is adsorbed on the upper surface of the stage 20 . The stage 20 is an example of a holding section that holds the porous body 60 .

As shown in FIG. 1 , the pattern forming device 1 may have a holding member 29 . The holding member 29 may be provided on the upper surface of the stage 20, for example. The holding member 29 positions and holds the porous body 60 on the upper surface of the stage 20 .

FIG. 4 is a schematic cross-sectional view showing the stage 20 and the porous body 60 on which the wiring board 9 is placed. As shown in FIG. 4, when the wiring substrate 9 is placed on the upper surface of the stage 20 via the porous body 60, the negative pressure generator 27 creates a negative pressure in each of the suction holes 21 of the stage 20. , the atmosphere above the porous body 60 is sucked into each suction hole 21 through the porous body 60 . As a result, the wiring substrate 9 placed on the upper surface of the porous body 60 is adsorbed to the porous body 60 . The plurality of suction holes 21 of the stage 20, the pipe 25, and the negative pressure generator 27 are an example of a suction mechanism.

As shown in FIG. 4, on the upper surface of the stage 20, the porous body 60 and the wiring board 9 are laminated in order toward the +Z side. That is, the Z direction coincides with the direction (stacking direction) in which the porous body 60 and the wiring board 9 are stacked on the upper surface of the stage 20 . Also, when the porous body 60 and the wiring board 9 are stacked on the stage 20 , the Z direction matches the thickness direction of the porous body 60 and the thickness direction of the wiring board 9 .

A plurality of linear grooves may be formed on the upper surface of the stage 20, and the suction holes 21 may be provided in each groove. In this case, the wiring board 9 can be sucked along the groove. Moreover, the stage 20 may include a holder that mechanically holds the wiring board 9 . For example, the stage 20 may include holders that hold both side surfaces of the wiring board 9 .

As shown in FIG. 4, the wiring board 9 has several through holes 91 penetrating through the wiring board 9 in the thickness direction. The through hole 91 is, for example, a hole for passing a wiring that electrically connects the wiring on the front side of the wiring board 9 and the wiring on the back side, a hole for inserting a component, or a hole for screwing. be. As shown in FIG. 4, when the wiring board 9 is sucked onto the stage 20 via the porous body 60, an air current can be generated in the through hole from the upper surface side of the wiring board 9 to the lower surface side of the wiring board 9. . In the example shown in FIG. 4, the through holes 91 overlap the suction holes 21 of the stage 20 in the Z direction (hereinafter referred to as "first through holes 91a"), and overlap the suction holes 21 of the stage 20 in the Z direction. The inside of the through hole 91 (hereinafter referred to as “second through hole 91b”) is included. The first through hole 91 a is located directly above the suction hole 21 . Therefore, a stronger airflow can be generated in the first through-hole 91a than in the second through-hole 91b.

If a strong air current is generated in the through hole 91 of the wiring board 9, the landing positions of the ink droplets ejected around the through hole 91 may be disturbed, and the print quality may be degraded. Therefore, in the pattern forming apparatus 1 , the airflow inside the through holes 91 is suppressed by applying ink droplets to the porous body 60 in advance. Specifically, before forming a pattern on the wiring substrate 9, ink droplets are ejected onto a region (overlapping region) of the porous body 60 that overlaps the through holes 91 of the wiring substrate 9 in the Z direction. As a result, the fine holes in the overlapping region of the porous body 60 are blocked with the ink. As a result, the airflow in the through hole 91 of the wiring board 9 is suppressed, so that the impact position of the ink droplets is less disturbed.

FIG. 5 is a block diagram showing the hardware configuration of the controller 12. As shown in FIG. The control unit 12 is configured as a computer. Specifically, the control section 12 includes a processor 71 , a RAM 72 , an auxiliary storage device 73 , a device interface 74 , a communication section 75 and a bus line 77 . The processor 71 is electrically connected to a RAM 72 , an auxiliary storage device 73 , a device interface 74 and a communication section 75 via bus wiring 77 .

The processor 71 is a circuit that performs various kinds of arithmetic processing, and is composed of a CPU, a GPU, or the like. The RAM 72 is a readable/writable memory and stores various information processed by the processor 71 . The auxiliary storage device 73 is a device for non-transitory storage of information, such as a hard disk. Auxiliary storage device 73 stores program P and through-hole information D1. Through-hole information D1 is information indicating the position and size of through-hole 91 in wiring board 9 .

The device interface 74 is an intermediary device that mediates data exchange between an external device (peripheral device, etc.) and the control unit 12 . The control unit 12 is electrically connected to the display 101 , the input device 103 and the reader 105 via the equipment interface 74 . The display 101 displays various information. The input device 103 is composed of a mouse, keyboard, or the like. The control unit 12 receives user input via the input device 103 . Note that the display 101 may function as the input device 103 by configuring the display 101 with a touch panel. A reading device 105 reads information recorded on the recording medium 106 . The recording medium 106 is, for example, an optical disk, a magnetic disk, a magneto-optical disk, or a memory card.

The communication unit 75 transmits and receives signals to and from the device body 10 . By outputting a control signal to the apparatus main body 10 , the control unit 12 causes the moving mechanism 30 to move the stage 20 and the print head 40 , the ejection of ink droplets from each nozzle of the print head 40 , and the UV irradiation by the UV irradiation unit 50 . Control irradiation.

For example, the control unit 12 reads the program P from the recording medium 106 via the reading device 105 and stores the program P in the auxiliary storage device 73 . Note that the control unit 12 may store the program P in the auxiliary storage device 73 via the network. The processor 71 executes arithmetic processing according to the program P while using the RAM 72 .

<Operation of Image Forming Apparatus 1>
FIG. 6 is a diagram showing the flow of processing executed by the pattern forming apparatus 1. As shown in FIG. In the following description, it is assumed that the operation of each part of the pattern forming apparatus 1 is performed under the control of the control part 12 unless otherwise specified.

A porous body 60 is placed on the upper surface of the stage 20 of the pattern forming apparatus 1 (step S10). Specifically, the porous body 60 is positioned by being held on the upper surface of the stage 20 by the holding member 29 . Installation of the porous body 60 may be performed by a transport device (not shown), or may be performed manually. After the porous body 60 is positioned, the controller 12 causes the negative pressure generator 27 to start suction (step S11). Thereby, the porous body 60 is adsorbed on the upper surface of the stage 20 .

Based on the through-hole information D1 stored in the auxiliary storage device 73, the control unit 12 acquires the positions of the through-holes 91 of the wiring board 9 when the wiring board 9 is placed on the porous body 60. (step S12). The controller 12 performs ink ejection and UV irradiation on the porous body 60 based on the obtained positions of the through holes 91 (step S13). Specifically, by controlling the moving mechanism 30, the control unit 12 moves the print head 40 in the main scanning direction (Y direction) and the sub scanning direction (X direction) with respect to the stage 20 and the porous body 60. move. The controller 12 then ejects ink droplets from the nozzles of the print head 40 to eject ink droplets onto the upper surface of the porous body 60 . The control unit 12 determines the area where the print head 40 ejects ink droplets based on the position and size of each through-hole 91 indicated by the through-hole information D1. In addition, the ink applied to the porous body 60 is cured by the UV irradiation section 50 irradiating the ink discharged onto the porous body 60 with ultraviolet rays. As a result, ink curing portions 61 are formed in the porous body 60 so as to match the positions of the through holes 91 of the wiring board 9 when the wiring board 9 is placed on the porous body 60 .

FIG. 7 is a diagram showing a first formation example of the ink curing portion 61 on the porous body 60. As shown in FIG. In the first formation example shown in FIG. 7, the ink curing portion 61 is formed in a region of the porous body 60 that overlaps with the first through hole 91a of the wiring board 9 . The first through hole 91a is a hole that overlaps the suction hole 21 (overlapping suction hole 21a) of the stage 20 in the Z direction, and can generate a large airflow. Therefore, by applying ink to the area of the porous body 60 that overlaps with the first through hole 91 a of the wiring board 9 , the air flow in the through hole 91 can be effectively suppressed. A first formation example is an example in which ink droplets are ejected onto a part of a region (first overlapping region) of the porous body 60 that overlaps the through hole 91 of the wiring substrate 9 .

FIG. 8 is a diagram showing a second example of formation of the ink curing portion 61 on the porous body 60. As shown in FIG. In the second formation example shown in FIG. 8, in addition to the region of the porous body 60 that overlaps the first through hole 91a of the wiring substrate 9 in the Z direction, the second through hole 91b of the wiring substrate 9 is overlapped in the Z direction. An ink curing portion 61 is also formed in the area. Although the second through hole 91b does not overlap the suction hole 21 of the stage 20, it communicates with the suction hole 21 through the fine hole of the porous body 60, so an airflow can be generated. Therefore, by forming the ink curing portion 61 in the region overlapping the second through hole 91b of the wiring board 9, the airflow inside the second through hole 91b can be further suppressed. Therefore, it is possible to suppress the disturbance of the landing positions of the ink droplets around the second through hole 91b of the wiring board 9. FIG. The second formation example is an example in which ink droplets are ejected onto all regions (first overlapping regions) of the porous body 60 that overlap with the through holes 91 of the wiring substrate 9 .

FIG. 9 is a diagram showing a third formation example of the ink curing portion 61 on the porous body 60. As shown in FIG. In the third formation example shown in FIG. 9, similarly to the first formation example shown in FIG. there is However, in the third formation example, the ink curing portion 61 is formed in the area of the porous body 60 that overlaps with the overlapping suction hole 21a. When the inner diameter of the suction hole 21 of the stage 20 is larger than the inner diameter of the first through hole 91a, as shown in FIG. 9, each ink curing portion 61 has a larger diameter than the ink curing portion 61 shown in FIG. . The position and size of the suction hole 21 on the stage 20 may be stored in advance in the auxiliary storage device 73, for example.

In the third formation example, the ink curing portion 61 is applied to the porous body 60 so as to block the overlapping suction holes 21a overlapping the first through holes 91a of the wiring substrate 9 in the Z direction among the suction holes 21 of the stage 20. It is formed. Therefore, the airflow in the first through hole 91a can be further suppressed. The third formation example is an example in which ink droplets are ejected onto all regions (second overlapping regions) of the porous body 60 that overlap with the overlapping suction holes 21 a of the stage 20 .

It should be noted that ink droplets may be ejected only on a part of the porous body 60 that overlaps with the overlapping suction holes 21 a of the stage 20 . Further, in the second formation example shown in FIG. 8, similarly to the third formation example shown in FIG. 9, an ink curing portion 61 may be formed in the porous body 60 so as to block the overlapping suction holes 21a. .

Returning to FIG. 6, when ink ejection and UV irradiation to the porous body 60 are completed, the controller 12 cancels the suction by the negative pressure generator 27 (step S14). After the suction by the negative pressure generator 27 is released, the wiring board 9 is placed on the upper surface of the porous body 60 (step S15). The placement of the wiring substrate 9 may be performed by a transport device (not shown), or may be performed manually.

A plurality of thin rod-shaped lifting pins (not shown) that are driven to move up and down in the Z direction may be provided on the upper surface of the stage 20 . The upper end of each lift pin moves between an upper position protruding from the upper surface of the stage 20 and a lower position buried in the stage 20 . When the wiring substrate 9 is placed on the stage 20, the wiring substrate 9 is placed on the upper end of each lifting pin arranged at the upper position, and the wiring substrate 9 is made porous by moving each lifting pin to the lower position. It may rest on the body 60 . In this case, the porous body 60 may be provided with a plurality of through holes through which several elevating pins are inserted.

After the wiring board 9 is placed on the porous body 60, the controller 12 causes the negative pressure generator 27 to start suction (step S16). Thereby, the wiring board 9 is adsorbed to the porous body 60 .

When the wiring board 9 is adsorbed to the porous body 60, the controller 12 ejects ink droplets onto the wiring board 9 and irradiates the ink applied to the wiring board 9 with ultraviolet rays (step S17). Specifically, the control unit 12 moves the wiring board 9 attracted to the stage 20 by the moving mechanism 30 relative to the print head 40, and ejects ink droplets from the nozzles of the print head 40. . The position on the wiring board 9 to which the ink is applied is determined based on the pattern data. In addition, the UV irradiation unit 50 irradiates the ink ejected onto the porous body 60 with ultraviolet rays, thereby curing the ink applied to the wiring board 9 . Thereby, a resist film is formed on the upper surface of the wiring board 9 .

When the ink ejection and UV irradiation to the wiring board 9 are completed, the controller 12 cancels the suction by the negative pressure generator 27 (step S18). After the suction by the negative pressure generator 27 is released, the wiring board 9 is unloaded from the pattern forming apparatus 1 (step S19).

The same porous body 60 may be reused when patterns are formed continuously on wiring substrates 9 of the same type having the same position of the through-holes 91 . Further, when patterns are formed on wiring substrates 9 of different types having through-holes 91 in different positions, the ink curing portion 61 is formed in the porous body 60 according to the positions of the through-holes 91 for each type of wiring substrate 9 . do it.

According to the pattern forming apparatus 1 , the airflow in the through holes 91 of the wiring board 9 is suppressed by applying ink to the overlapping regions of the porous body 60 that overlap with the through holes 91 of the wiring board 9 . Therefore, when ink droplets are ejected onto the upper surface of the wiring board 9 , it is possible to prevent the ink landing positions from being disturbed by air currents around the through holes 91 of the wiring board 9 . Therefore, pattern formation on the wiring substrate 9 can be performed satisfactorily.

In addition, since the same ink is applied to the porous body 60 and the wiring substrate 9, there is no need to adjust dedicated inks, and there is no need to provide dedicated print heads. Therefore, it is possible to suppress an increase in device cost. Different types of ink may be applied to the porous body 60 and the wiring substrate 9, respectively.

<2. Second Embodiment>
Next, a second embodiment will be described. In the following description, elements having functions similar to those already described may be assigned the same reference numerals or reference numerals with additional alphabetic characters, and detailed description thereof may be omitted.

In the first embodiment, ink is applied to the porous body 60 before the wiring board 9 is placed on the upper surface of the porous body 60 . However, the ink may be applied to the porous body 60 while the wiring board 9 is placed on the upper surface of the porous body 60 .

FIG. 10 is a schematic cross-sectional view showing the stage 20 and porous body 60 according to the second embodiment. As shown in FIG. 10 , when applying ink to the porous body 60 while the wiring board 9 is placed on the porous body 60 , the control unit 12 causes the print head 40 to set each through hole of the wiring board 9 . Ink droplets are ejected to the inside of 91 . As a result, ink is applied to the upper surface of the porous body 60 through each through hole 91 of the wiring board 9 . Further, the UV irradiation unit 50 irradiates the ink on the upper surface of the porous body 60 with ultraviolet rays through the through holes 91 of the wiring board 9 . As a result, an ink cured portion 61 is formed in the area of the upper surface of the porous body 60 that overlaps the through hole 91 of the wiring board 9 .

In this embodiment, ink droplets are ejected onto the porous body 60 while the wiring board 9 is placed on the porous body 60 . Therefore, pattern formation on the wiring board 9 can be started immediately after the ejection of the ink droplets onto the porous body 60 is completed. As a result, for example, the process of canceling the suction by the negative pressure generator 27 (FIG. 6: step S14) and the process of starting suction (FIG. 6: step S16) can be omitted. Therefore, patterns can be efficiently formed on the wiring board 9 .

The pattern forming apparatus 1 may include a camera (not shown) that captures an image of the upper surface of the wiring board 9 placed on the upper surface of the porous body 60 . In this case, the control unit 12 may acquire the position and size of each through hole 91 of the wiring board 9 based on the image captured by the camera. Then, the control unit 12 may determine the area in the porous body 60 where the ink droplets should be ejected based on the acquired position and size of each through hole 91 .

<3. Variation>
Although the embodiments have been described above, the present invention is not limited to the above, and various modifications are possible.

For example, the wiring board 9 may be supported by the porous body 60 by using a hard material for the porous body 60 . In this case, stage 20 is optional and can be omitted. When the stage 20 is omitted, a holding portion for connecting the porous body 60 to the main scanning moving portion 31 of the moving mechanism 30 may be provided. Also, when the stage 20 is omitted, it is preferable to connect the porous body 60 to the negative pressure generating section 27 via the pipe 25 . As a result, the negative pressure generating part 27 can apply a negative pressure to the many fine holes of the porous body 60 , so that the wiring substrate 9 can be adsorbed to the porous body 60 .

Although the present invention has been described in detail, the above description is, in all aspects, illustrative and not intended to limit the present invention. It is understood that numerous variations not illustrated can be envisioned without departing from the scope of the invention. Each configuration described in each of the above embodiments and modifications can be appropriately combined or omitted as long as they do not contradict each other.

REFERENCE SIGNS LIST 1 pattern forming device 12 control unit 20 stage (holding unit)
21 suction hole 21a duplicate suction hole 25 pipe 27 negative pressure generator 30 moving mechanism 40 print head 60 porous body 9 wiring board 91 through hole

Claims (8)

A patterning device comprising:
a porous body having an upper surface on which a substrate having through holes is placed and having a structure with a large number of holes;
a suction mechanism for adsorbing the substrate to the porous body by sucking the atmosphere above the porous body through the porous body;
a print head that ejects ink droplets;
a moving mechanism for moving the porous body relative to the print head;
a control unit that controls the print head and the moving mechanism;
with
the top surface of the porous body has a first overlapping region that overlaps with the through hole of the substrate when the substrate is placed on the top surface of the porous body;
The control unit causes the print head to eject ink droplets onto at least a portion of the first overlap region of the porous body. The pattern forming apparatus according to claim 1,
The pattern forming device, wherein the control section causes the print head to eject ink droplets onto all of the first overlapping regions of the porous body. The pattern forming apparatus according to claim 1 or 2,
The suction mechanism is
a holding part having an upper surface for holding the porous body and having a plurality of suction holes dispersedly provided on the upper surface;
a negative pressure generator that creates a negative pressure in the plurality of suction holes;
A patterning device comprising: The pattern forming apparatus according to claim 3,
the plurality of suction holes include overlapping suction holes that overlap the through holes of the substrate when the substrate is placed on the porous body;
The upper surface of the porous body has a second overlapping region overlapping with the overlapping suction holes,
The control unit causes the print head to eject ink droplets onto at least a portion of the second overlap region of the porous body. The pattern forming apparatus according to claim 4,
The pattern forming device, wherein the control section causes the print head to eject ink droplets onto all of the second overlapping regions of the porous body. The pattern forming apparatus according to any one of claims 1 to 5,
The control unit causes the print head to eject ink droplets inside the through-holes of the substrate placed on the upper surface of the porous body. A pattern forming method comprising:
a) a step of adsorbing a substrate having through holes to a porous body having a structure with a plurality of holes;
b) ejecting ink droplets onto at least a portion of a first overlap region of the porous body that overlaps with the through hole of the substrate when the substrate is placed on the porous body;
c) after steps a) and b), ejecting ink droplets onto the top surface of the substrate;
A method of forming a pattern, comprising: The pattern forming method according to claim 7,
said step b) is performed after said step a);
The step b) is a pattern forming method in which ink is applied to the upper surface of the porous body by ejecting ink droplets into the through holes of the substrate.

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