JP5891579B2 - Printing apparatus and printing method - Google Patents

Description

  The present invention relates to a printing apparatus and a printing method.

  A method is widely employed in which a functional liquid is applied as droplets and applied by an ink jet method, and the applied functional liquid is solidified to form a film. As the functional liquid, various liquid materials are used such as a liquid having a function of coloring including a dye or a pigment and a liquid having a function of forming a metal wiring including metal particles.

  Patent Document 1 discloses a droplet discharge device that applies a functional liquid to a substrate by an inkjet method. The droplet discharge device includes a stage for moving the substrate and a carriage for moving the droplet discharge head. A nozzle for discharging droplets is formed in the droplet discharge head. The stage and the carriage move in a direction orthogonal to each other. Then, droplets are ejected when the droplet ejection head is located at a location opposite to the location where the functional liquid is applied. Then, a predetermined pattern is printed on the substrate by landing the functional liquid at a predetermined position.

JP 2004-283635 A

However, the following problems exist in the conventional technology as described above.
When the temperature of the substrate is higher than a predetermined value before printing, the wet spread of the droplets discharged onto the substrate becomes large, and it becomes difficult to form a high-definition pattern.

  The present invention has been made in consideration of the above points, and an object of the present invention is to provide a printing apparatus and a printing method that enable high-definition pattern formation.

In order to achieve the above object, the present invention employs the following configuration.
The printing apparatus of the present invention includes a pretreatment unit that performs a predetermined pretreatment in a state where the base material is heated, a cooling unit that cools the heated base material, and droplets on the cooled base material. A printing unit that discharges and prints a predetermined pattern, and the cooling unit includes a stage on which the substrate is placed, a heat sink unit that is provided on the stage and has a holding surface that holds the substrate, and A flow device for flowing air in a surface direction of the holding surface in the heat sink portion, the holding surface is rectangular in a plan view having a long side and a short side, and the flow device is a surface of the holding surface. The air is caused to flow in a direction parallel to the short side in a direction, and then the air is caused to flow in a direction away from the pretreatment unit in the surface direction of the holding surface.
The flow device may flow the air in a direction parallel to the short side in the surface direction of the holding surface, and then flow the air in a direction away from the printing unit in the surface direction of the holding surface. preferable.
The printing apparatus of the present invention includes a pretreatment unit that performs a predetermined pretreatment in a state where the base material is heated, a cooling unit that cools the heated base material, and droplets on the cooled base material. A printing unit that discharges and prints a predetermined pattern, and the cooling unit includes a stage on which the substrate is placed, a heat sink unit that is provided on the stage and has a holding surface that holds the substrate, and A flow device that causes air to flow in a surface direction of the holding surface in the heat sink part, the holding surface is rectangular in a plan view having a long side and a short side, and the flow device is configured to pass the air to the short side. It is made to flow in a direction parallel to the side.
The printing apparatus of the present invention includes a pretreatment unit that performs a predetermined pretreatment in a state where the base material is heated, a cooling unit that cools the heated base material, and droplets on the cooled base material. A printing unit that discharges and prints a predetermined pattern, and the cooling unit includes a stage on which the substrate is placed, a heat sink unit that is provided on the stage and has a holding surface that holds the substrate, and A flow device for causing air to flow in the heat sink portion, wherein the heat sink portion includes cooling fins provided to extend in a flow direction of the air.
The printing apparatus of the present invention includes a pretreatment unit that performs a predetermined pretreatment in a state where the base material is heated, a cooling unit that cools the heated base material, and droplets on the cooled base material. A printing unit that discharges and prints a predetermined pattern, and the cooling unit includes a stage on which the substrate is placed, a heat sink unit that is provided on the stage and has a holding surface that holds the substrate, and And a flow device for flowing air in a direction of the holding surface in the heat sink.
The holding surface is rectangular in a plan view having a long side and a short side, and the flow device is preferably configured to flow the air in a direction parallel to the short side.
The printing apparatus of the present invention includes a pretreatment unit that performs a predetermined pretreatment in a state where the base material is heated, a cooling unit that cools the heated base material, and droplets on the cooled base material. A printing unit that discharges and prints a predetermined pattern, and the cooling unit includes a stage on which the substrate is placed, a heat sink unit that is provided on the stage and has a holding surface that holds the substrate, and And a flow device for flowing air to the heat sink part.

  Therefore, in the printing apparatus of the present invention, even when the base material is heated by a predetermined pretreatment, it is possible to suppress the wetting and spreading of the droplets discharged to the base material by cooling the base material by the cooling unit. High-definition pattern formation can be maintained. Further, in the present invention, the heat sink part that holds the base material is cooled by heat exchange by the flow of air, so that the use force that is not used in the printing part such as cooling water becomes unnecessary, and the size and cost of the apparatus are reduced. It becomes possible to plan.

As the flow device, an air intake portion that sucks in the air, an exhaust portion that exhausts the air that has been taken in, and a fan portion that causes the air sucked from the air intake portion to flow to the heat sink portion and exhausts from the exhaust portion A configuration comprising
Thus, in the present invention, the base material can be cooled via the heat sink portion by heat exchange between the air flowing by the driving of the fan portion and the heat sink portion without separately installing utility power such as cooling water. It becomes possible.

Further, in the present invention, it has a cover member surrounding the flow device, the intake portion is provided on the side surface of the cover member so as to open in a direction parallel to the holding surface, and the exhaust portion is A configuration in which an opening is provided on the lower surface of the cover member in a direction perpendicular to the holding surface can be suitably employed.
Thereby, in this invention, since an intake part and an exhaust part do not line up in the same direction, it becomes possible to make the installation area of a cooling part small.

In the said structure, the structure by which the said intake part is arrange | positioned on the opposite side to the side facing the said printing part in the said cover member can be employ | adopted suitably.
As a result, in the present invention, the flow generated by the flow of the air sucked from the suction unit has an adverse effect on the printing process in the printing unit (for example, the flying bend of the ejected droplets or the temperature distribution of the substrate in the printing unit). Can be prevented.

In the said structure, the structure which has a pipe body connected to the said exhaust part and exhausting the exhaust_gas | exhaustion from this exhaust part outside can be employ | adopted suitably.
As a result, in the present invention, the air whose temperature has been increased by heat exchange with the heat sink is released into the apparatus, which adversely affects the temperature (viscosity) of the ink, the alignment of the substrate in the printing unit, the transport unit, and the like. Can be prevented.

Moreover, as the said pre-processing part in this invention, the structure provided with the irradiation apparatus which irradiates an actinic ray to the said base material can be employ | adopted suitably.
Thereby, in this invention, while improving the surface of a base material, the adhesiveness with respect to the base material of the predetermined pattern printed on a base material by a 3rd process is improved by removing the organic substance on the surface of a base material. Is possible.

The printing method of the present invention includes a first step in which a predetermined pretreatment is performed in a pretreatment portion while the substrate is heated, a second step in which the heated substrate is cooled, and the cooled substrate. A third step of printing a predetermined pattern by ejecting droplets on the long side, and in the second step, a long side that is provided on a stage on which the substrate is placed and holds the substrate, and After flowing air in a direction parallel to the short side of the heat sink portion having a rectangular holding surface in a plan view having a short side, the direction away from the pretreatment portion The substrate is cooled by flowing air.
The printing method of the present invention includes a first step of performing a predetermined pretreatment in a state where the substrate is heated, a second step of cooling the heated substrate, and droplets on the cooled substrate. And a third step of printing a predetermined pattern by discharging the substrate, and the holding surface is rectangular in a plan view having a long side and a short side, and the substrate is placed in the second step After flowing air in a direction parallel to the short side of the heat sink portion provided on the stage and having a holding surface for holding the substrate, the direction away from the pretreatment portion The substrate is cooled by flowing air.
The printing method of the present invention includes a first step of performing a predetermined pretreatment in a state where the substrate is heated, a second step of cooling the heated substrate, and droplets on the cooled substrate. And a third step of printing a predetermined pattern by discharging the substrate, and the holding surface is rectangular in a plan view having a long side and a short side, and the substrate is placed in the second step The substrate is cooled by allowing air to flow in a direction parallel to the short side of the heat sink portion provided on the stage and having a holding surface for holding the substrate. .
The printing method of the present invention includes a first step of performing a predetermined pretreatment in a state where the substrate is heated, a second step of cooling the heated substrate, and droplets on the cooled substrate. A third step of printing a predetermined pattern by discharging the heat sink, and in the second step, a heat sink provided on a stage on which the substrate is placed and holding the substrate and a cooling fin The air is caused to flow in the direction in which the cooling fins extend to the part to cool the base material.
The printing method of the present invention includes a first step of performing a predetermined pretreatment in a state where the substrate is heated, a second step of cooling the heated substrate, and droplets on the cooled substrate. A third step of printing a predetermined pattern by discharging the substrate, and in the second step, the holding is provided on a heat sink portion having a holding surface provided on a stage on which the substrate is placed and holding the substrate. The substrate is cooled by flowing air in the surface direction of the surface.
The holding surface is rectangular in a plan view having a long side and a short side, and it is also preferable that the air flows in a direction parallel to the short side.
On the other hand, the printing method of the present invention includes a first step of performing a predetermined pretreatment in a state where the substrate is heated, a second step of cooling the heated substrate, and the cooled substrate. And a third step of printing a predetermined pattern by discharging droplets. In the second step, air is provided in a heat sink portion provided on a stage on which the base material is placed and having a holding surface for holding the base material. And the substrate is cooled.

  Therefore, in the printing method of the present invention, even when the substrate is heated by the predetermined pretreatment, the substrate is cooled in the second step, so that the liquid droplets discharged onto the substrate in the third step spread out. And high-definition pattern formation can be maintained. In addition, in the present invention, the heat sink part holding the base material is cooled by heat exchange by the flow of air, so that the use force not used in the third step such as cooling water becomes unnecessary, and the size and cost of the apparatus are reduced. Can be achieved.

(A) is a schematic plan view which shows a semiconductor substrate, (b) is a schematic plan view which shows a droplet discharge device. The schematic diagram which shows a supply part. The schematic perspective view which shows the structure of a pre-processing part. (A) is a top view of a cooling part, (b) is sectional drawing of a cooling part. (A) is a schematic perspective view showing the configuration of the coating unit, (b) is a schematic side view showing a carriage, (c) is a schematic plan view showing a head unit, and (d) is a liquid droplet ejection head. The principal part schematic cross section for demonstrating a structure. The schematic diagram which shows a storage part. The schematic perspective view which shows the structure of a conveyance part. 6 is a flowchart for illustrating a printing method.

Hereinafter, embodiments of a printing apparatus and a printing method according to the present invention will be described with reference to FIGS. 1 to 8.
The following embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each configuration easy to understand, the actual structure is different from the scale and number of each structure.

  In this embodiment, a characteristic printing apparatus of the present invention and an example of a printing method for printing by discharging droplets using this printing apparatus will be described with reference to FIGS.

(Semiconductor substrate)
First, a semiconductor substrate that is an example of an object to be drawn using a printing apparatus will be described.
FIG. 1A is a schematic plan view showing a semiconductor substrate. As shown in FIG. 1A, a semiconductor substrate 1 as a base material includes a substrate 2. The substrate 2 only needs to have heat resistance so that the semiconductor device 3 can be mounted. As the substrate 2, a glass epoxy substrate, a paper phenol substrate, a paper epoxy substrate, or the like can be used.

  A semiconductor device 3 is mounted on the substrate 2. On the semiconductor device 3, marks (print pattern, predetermined pattern) such as a company name mark 4, a model code 5, and a production number 6 are drawn. These marks are drawn by the printing apparatus.

(Printer)
FIG. 1B is a schematic plan view showing the printing apparatus.
As shown in FIG. 1B, the printing apparatus 7 mainly includes a supply unit 8, a preprocessing unit 9, a coating unit (printing unit) 10, a cooling unit 11, a storage unit 12, a transport unit 13, and a control unit 14. Has been. The printing apparatus 7 is arranged in the order of the supply unit 8, the preprocessing unit 9, the application unit 10, the cooling unit 11, the storage unit 12, and the control unit 14 in the clockwise direction with the conveyance unit 13 as the center. A supply unit 8 is arranged next to the control unit 14. A direction in which the supply unit 8, the control unit 14, and the storage unit 12 are arranged is an X direction. The direction orthogonal to the X direction is defined as the Y direction, and the coating unit 10, the transport unit 13, and the control unit 14 are arranged side by side in the Y direction. The vertical direction is the Z direction.

  The supply unit 8 includes a storage container in which a plurality of semiconductor substrates 1 are stored. The supply unit 8 includes a relay location 8a, and supplies the semiconductor substrate 1 from the storage container to the relay location 8a.

  The pretreatment unit 9 has a function of modifying the surface of the semiconductor device 3 in a heated state. The pretreatment unit 9 adjusts the spread of the ejected droplets and the adhesion of the marks to be printed. The pre-processing unit 9 includes a first relay location 9a and a second relay location 9b, and takes the semiconductor substrate 1 before processing from the first relay location 9a or the second relay location 9b to modify the surface. Thereafter, the preprocessing unit 9 moves the processed semiconductor substrate 1 to the first relay location 9a or the second relay location 9b, and makes the semiconductor substrate 1 stand by. The first relay location 9a and the second relay location 9b are collectively referred to as a relay location 9c. A place where preprocessing is performed inside the preprocessing unit 9 is defined as a processing place 9d.

  The cooling unit 11 has a function of cooling the semiconductor substrate 1 that has been heated and surface-modified in the pretreatment unit 9. The cooling unit 11 includes processing places 11 a and 11 b that hold and cool the semiconductor substrate 1. The processing places 11a and 11b are collectively referred to as a processing place 11c as appropriate.

  The application unit 10 has a function of drawing (printing) a mark by discharging droplets onto the semiconductor device 3 and solidifying or curing the drawn mark. The application unit 10 includes a relay location 10a, and performs drawing processing and curing processing by moving the semiconductor substrate 1 before drawing from the relay location 10a. Thereafter, the coating unit 10 moves the drawn semiconductor substrate 1 to the relay location 10a, and makes the semiconductor substrate 1 stand by.

  The storage unit 12 includes a storage container that can store a plurality of semiconductor substrates 1. The storage unit 12 includes a relay location 12a, and stores the semiconductor substrate 1 from the relay location 12a into the storage container. The operator carries out the storage container in which the semiconductor substrate 1 is stored from the printing apparatus 7.

  A transport unit 13 is disposed at a central location of the printing apparatus 7. The transport unit 13 is a scalar robot having two arms. A grip portion 13 a that grips the semiconductor substrate 1 is provided at the tip of the arm portion. The relay locations 8a, 9c, 10a, 11c, and 12a are located within the movement range 13b of the grip portion 13a. Accordingly, the gripping portion 13a can move the semiconductor substrate 1 between the relay locations 8a, 9c, 10a, 11c, and 12a. The control unit 14 is a device that controls the overall operation of the printing apparatus 7 and manages the operation status of each unit of the printing apparatus 7. Then, an instruction signal for moving the semiconductor substrate 1 is output to the transport unit 13. Thereby, the semiconductor substrate 1 is drawn by passing through each part sequentially.

Details of each part will be described below.
(Supply section)
FIG. 2A is a schematic front view showing the supply unit, and FIGS. 2B and 2C are schematic side views showing the supply unit. As shown in FIGS. 2A and 2B, the supply unit 8 includes a base 15. An elevating device 16 is installed inside the base 15. The elevating device 16 includes a linear motion mechanism that operates in the Z direction. As this linear motion mechanism, a mechanism such as a combination of a ball screw and a rotary motor or a combination of a hydraulic cylinder and an oil pump can be used. In this embodiment, for example, a mechanism using a ball screw and a step motor is employed. An elevating plate 17 is connected to the elevating device 16 on the upper side of the base 15. The elevating plate 17 can be moved up and down by a predetermined moving amount by the elevating device 16.

  A rectangular parallelepiped storage container 18 is installed on the elevating plate 17, and a plurality of semiconductor substrates 1 are stored in the storage container 18. The storage container 18 has openings 18a on both sides in the Y direction, and the semiconductor substrate 1 can be taken in and out from the openings 18a. Convex rails 18c are formed inside the side surfaces 18b located on both sides in the X direction of the storage container 18, and the rails 18c are arranged extending in the Y direction. A plurality of rails 18c are arranged at equal intervals in the Z direction. By inserting the semiconductor substrate 1 along the rail 18c from the Y direction or from the -Y direction, the semiconductor substrate 1 is arranged and stored in the Z direction.

  On the Y direction side of the base 15, a substrate drawing portion 22 and a relay stand 23 are installed via a support member 21. A relay stand 23 is disposed on the substrate drawing portion 22 at a location on the Y direction side of the storage container 18. The substrate drawing portion 22 includes an arm portion 22a that expands and contracts in the Y direction and a linear motion mechanism that drives the arm portion 22a. This linear motion mechanism is not particularly limited as long as it is a mechanism that moves linearly. In this embodiment, for example, an air cylinder that operates with compressed air is employed. A claw portion 22b bent into a substantially rectangular shape is installed at one end of the arm portion 22a, and the tip of the claw portion 22b is formed in parallel with the arm portion 22a.

  The substrate pull-out portion 22 extends the arm portion 22 a, so that the arm portion 22 a penetrates the storage container 18. Then, the claw portion 22 b moves to the −Y direction side of the storage container 18. Next, after the elevating device 16 moves down the semiconductor substrate 1, the substrate drawing portion 22 contracts the arm portion 22a. At this time, the claw portion 22 b moves while pushing one end of the semiconductor substrate 1.

  As a result, as shown in FIG. 2C, the semiconductor substrate 1 is moved from the storage container 18 onto the relay stand 23. The relay base 23 is formed with a recess having a width substantially the same as the width of the semiconductor substrate 1 in the X direction, and the semiconductor substrate 1 moves along the recess. And the position of the X direction of the semiconductor substrate 1 is determined by this recessed part. The position of the semiconductor substrate 1 in the Y direction is determined by the location where the semiconductor substrate 1 is stopped by being pushed by the claw portion 22b. On the relay stand 23 is a relay place 8a, and the semiconductor substrate 1 stands by at a predetermined place of the relay place 8a. When the semiconductor substrate 1 is waiting at the relay location 8 a of the supply unit 8, the transport unit 13 moves the gripping unit 13 a to a location facing the semiconductor substrate 1 to grip and move the semiconductor substrate 1.

  After the semiconductor substrate 1 is moved from the relay table 23 by the transfer unit 13, the substrate drawing unit 22 extends the arm portion 22a. Next, the lifting device 16 lowers the storage container 18, and the substrate drawing portion 22 moves the semiconductor substrate 1 from the storage container 18 onto the relay stand 23. In this way, the supply unit 8 sequentially moves the semiconductor substrate 1 from the storage container 18 onto the relay stand 23. After all the semiconductor substrates 1 in the storage container 18 are moved onto the relay stand 23, the operator replaces the empty storage container 18 with the storage container 18 in which the semiconductor substrate 1 is stored. Thereby, the semiconductor substrate 1 can be supplied to the supply unit 8.

(Pre-processing section)
FIG. 3 is a schematic perspective view showing the configuration of the preprocessing unit. As shown in FIG. 3A, the pretreatment unit 9 includes a base 24, and a pair of first guide rails 25 and second guide rails 26 extending in the X direction are arranged on the base 24. is set up. A first stage 27 as a mounting table that reciprocates in the X direction along the first guide rail 25 is installed on the first guide rail 25, and along the second guide rail 26 on the second guide rail 26. A second stage 28 is placed as a mounting table that reciprocates in the X direction. The first stage 27 and the second stage 28 include a linear motion mechanism and can reciprocate. As this linear motion mechanism, for example, a mechanism similar to the linear motion mechanism included in the lifting device 16 can be used.

  A placement surface 27a is installed on the upper surface of the first stage 27, and a suction-type chuck mechanism is formed on the placement surface 27a. After the transport unit 13 places the semiconductor substrate 1 on the placement surface 27a, the pretreatment unit 9 can fix the semiconductor substrate 1 to the placement surface 27a by operating the chuck mechanism. Similarly, a mounting surface 28a is installed on the upper surface of the second stage 28, and a suction chuck mechanism is formed on the mounting surface 28a. After the transport unit 13 places the semiconductor substrate 1 on the placement surface 28a, the pretreatment unit 9 can fix the semiconductor substrate 1 to the placement surface 28a by operating the chuck mechanism.

  The first stage 27 has a built-in heating device 27 </ b> H, and heats the semiconductor substrate 1 placed on the placement surface 27 a to a predetermined temperature under the control of the control unit 14. Similarly, the second stage 28 includes a heating device 28 </ b> H, and heats the semiconductor substrate 1 placed on the placement surface 28 a to a predetermined temperature under the control of the control unit 14.

  The place of the placement surface 27a when the first stage 27 is located on the X direction side is the first relay place 9a, and the place of the placement surface 28a when the second stage 28 is located in the X direction is the first place. 2 relay place 9b. The relay location 9c, which is the first relay location 9a and the second relay location 9b, is located within the operating range of the grip portion 13a, and the placement surface 27a and the placement surface 28a are exposed at the relay location 9c. Accordingly, the transport unit 13 can easily place the semiconductor substrate 1 on the placement surface 27a and the placement surface 28a. After the pretreatment is performed on the semiconductor substrate 1, the semiconductor substrate 1 stands by on the placement surface 27a located at the first relay location 9a or the placement surface 28a located at the second relay location 9b. Therefore, the grip part 13a of the transport part 13 can easily grip the semiconductor substrate 1 and move it.

  A flat plate-like support portion 29 is erected in the −X direction of the base 24. A guide rail 30 extending in the Y direction is installed on the upper side of the surface of the support portion 29 on the X direction side. A carriage 31 that moves along the guide rail 30 is installed at a location facing the guide rail 30. The carriage 31 includes a linear motion mechanism and can reciprocate. As this linear motion mechanism, for example, a mechanism similar to the linear motion mechanism included in the lifting device 16 can be used.

  A processing unit 32 is installed on the base 24 side of the carriage 31. Examples of the processing unit 32 include a low-pressure mercury lamp that emits actinic rays, a hydrogen burner, an excimer laser, a plasma discharge unit, and a corona discharge unit. When a mercury lamp is used, the liquid repellency of the surface of the semiconductor substrate 1 can be modified by irradiating the semiconductor substrate 1 with ultraviolet rays. When a hydrogen burner is used, the surface can be roughened by partially reducing the oxidized surface of the semiconductor substrate 1, and when an excimer laser is used, the surface of the semiconductor substrate 1 is partially melted and solidified. When plasma discharge or corona discharge is used, the surface of the semiconductor substrate 1 can be roughened by mechanical cutting. In this embodiment, for example, a mercury lamp is employed. The pre-processing unit 9 reciprocates the carriage 31 while irradiating ultraviolet rays from the processing unit 32 while the semiconductor substrate 1 is heated by the heating devices 27H and 28H. As a result, the pretreatment unit 9 can irradiate ultraviolet rays over a wide area of the treatment place 9d.

  The pretreatment unit 9 is entirely covered by the exterior unit 33. Inside the exterior part 33, a door part 34 that can move up and down is installed. Then, as shown in FIG. 3B, after the first stage 27 or the second stage 28 has moved to a position facing the carriage 31, the door 34 is lowered. Thereby, the ultraviolet rays irradiated by the processing unit 32 are prevented from leaking out of the preprocessing unit 9.

  When the mounting surface 27a or the mounting surface 28a is located at the relay place 9c, the transport unit 13 supplies the semiconductor substrate 1 to the mounting surface 27a and the mounting surface 28a. The preprocessing unit 9 performs the preprocessing by moving the first stage 27 or the second stage 28 on which the semiconductor substrate 1 is placed to the processing place 9d. After the preprocessing is completed, the preprocessing unit 9 moves the first stage 27 or the second stage 28 to the relay location 9c. Subsequently, the transport unit 13 removes the semiconductor substrate 1 from the placement surface 27a or the placement surface 28a.

(Cooling section)
4A is a plan view of the cooling unit 11 in a state where the semiconductor substrate 1 is not placed, and FIG. 4B is a front sectional view.
The cooling unit 11 includes a heat sink unit 61 provided on the stage ST disposed in each processing place 11a, 11b, and a flow device 91. The heat sink 61 includes a rectangular cooling plate 110 having a holding surface 62 for holding the semiconductor substrate 1 on the upper surface, and a plurality (four each here) of suction pads provided on the holding surface 62 to suck the semiconductor substrate 1. 63, fins 64 provided below the cooling plate 61, and a frame body 65 that forms a sealed space 65 a in which the fins 64 are accommodated between the cooling plate 110. A communication hole 67 is formed at the bottom of the frame 65.

  The fins 64 are provided extending in the X direction, and a plurality of fins 64 are provided with a gap in the Y direction. The frame body 65 is provided with an air intake portion 66 that opens along the horizontal direction on the side surface on the + X side opposite to the side facing the application portion 10.

  The flow device 91 includes a frame body 92 and a fan unit 96. The frame body 92 forms a sealed space 92a below the frame body 65, and a fan portion 96 is disposed in the sealed space 92a. The sealed space 92 a communicates with the sealed space 65 a through the communication hole 67. The frame body 65 and the frame body 92 constitute a cover member that surrounds a part of the heat sink portion 61 and a part of the flow device 91. An exhaust part 93 that opens downward is provided at the bottom of the frame 92. One end of an exhaust pipe (tube body) 94 is connected to the exhaust section 93, and the other end of the exhaust pipe 94 is drawn out of the apparatus.

  The processing places 11a and 11b (cooling plate 110) are located within the operating range of the gripping portion 13a, and the cooling plate 110 is exposed at the processing places 11a and 11b. Therefore, the transport unit 13 can easily place the semiconductor substrate 1 on each cooling plate 110. After the semiconductor substrate 1 is cooled, the semiconductor substrate 1 stands by on the cooling plate 110 located at the processing location 11a or on the cooling plate 110 located at the processing location 11b. Therefore, the gripping part 13a of the transport part 13 can easily grip and move the semiconductor substrate 1.

(Applying part)
Next, the coating unit 10 that forms marks by discharging droplets onto the semiconductor substrate 1 will be described with reference to FIG. There are various types of apparatuses for ejecting droplets, and an apparatus using an ink jet method is preferable. The ink jet method is suitable for microfabrication because it can discharge minute droplets.

  FIG. 5A is a schematic perspective view showing the configuration of the application unit. Liquid droplets are ejected onto the semiconductor substrate 1 by the application unit 10. As shown to Fig.5 (a), the application part 10 is provided with the base 37 formed in the rectangular parallelepiped shape. The direction in which the droplet discharge head and the object to be discharged move relative to each other when discharging droplets is defined as a main scanning direction. The direction orthogonal to the main scanning direction is defined as the sub scanning direction. The sub-scanning direction is a direction in which the droplet discharge head and the discharge target are relatively moved when a line feed is made. In the present embodiment, the X direction is the main scanning direction, and the Y direction is the sub scanning direction.

  On the upper surface 37a of the base 37, a pair of guide rails 38 extending in the Y direction are provided so as to protrude over the entire width in the Y direction. A stage 39 having a linear motion mechanism (not shown) corresponding to the pair of guide rails 38 is attached to the upper side of the base 37. As the linear motion mechanism of the stage 39, a linear motor, a screw type linear motion mechanism, or the like can be used. In this embodiment, for example, a linear motor is employed. Then, it moves forward or backward along the Y direction at a predetermined speed. Repeating forward and backward movement is called scanning movement. Further, a sub-scanning position detection device 40 is disposed on the upper surface 37 a of the base 37 in parallel with the guide rail 38, and the position of the stage 39 is detected by the sub-scanning position detection device 40.

  A placement surface 41 is formed on the upper surface of the stage 39, and a suction-type substrate chuck mechanism (not shown) is provided on the placement surface 41. After the semiconductor substrate 1 is placed on the placement surface 41, the semiconductor substrate 1 is fixed to the placement surface 41 by a substrate chuck mechanism.

  The place of the placement surface 41 when the stage 39 is positioned in the −Y direction is the relay place 10a. The placement surface 41 is installed so as to be exposed within the operating range of the gripping portion 13a. Therefore, the transport unit 13 can easily place the semiconductor substrate 1 on the placement surface 41. After application | coating is performed to the semiconductor substrate 1, the semiconductor substrate 1 waits on the mounting surface 41 which is the relay place 10a. Therefore, the grip part 13a of the transport part 13 can easily grip the semiconductor substrate 1 and move it.

  A pair of support bases 42 are erected on both sides of the base 37 in the X direction, and guide members 43 extending in the X direction are installed on the pair of support bases 42. A guide rail 44 extending in the X direction is provided below the guide member 43 so as to protrude over the entire width in the X direction. A carriage 45 attached so as to be movable along the guide rail 44 is formed in a substantially rectangular parallelepiped shape. The carriage 45 includes a linear motion mechanism. As the linear motion mechanism, for example, a mechanism similar to the linear motion mechanism included in the stage 39 can be used. Then, the carriage 45 scans and moves along the X direction. A main scanning position detector 46 is disposed between the guide member 43 and the carriage 45, and the position of the carriage 45 is measured. A head unit 47 is installed on the lower side of the carriage 45, and a droplet discharge head (not shown) is projected on the surface of the head unit 47 on the stage 39 side.

  FIG. 5B is a schematic side view showing the carriage. As shown in FIG. 5B, a head unit 47 and a curing unit 48 as a pair of irradiation units are disposed on the carriage 45 on the semiconductor substrate 1 side. On the semiconductor substrate 1 side of the head unit 47, three liquid droplet ejection heads 49 for ejecting liquid droplets are projected. The number and arrangement of the droplet discharge heads 49 are not particularly limited, and can be set according to the type of functional liquid to be discharged and the drawing pattern.

  An irradiating device for irradiating ultraviolet rays that cure the discharged droplets is disposed inside the curing unit 48. The curing unit 48 is disposed at a position sandwiching the head unit 47 in the main scanning direction. The irradiation device includes a light emitting unit and a heat radiating plate. A number of LED (Light Emitting Diode) elements are arranged in the light emitting unit. This LED element is an element that emits ultraviolet light, which is ultraviolet light, upon receiving power.

  A storage tank 50 is arranged on the upper side of the carriage 45 in the drawing, and the functional liquid is stored in the storage tank 50. The droplet discharge head 49 and the storage tank 50 are connected by a tube (not shown), and the functional liquid in the storage tank 50 is supplied to the droplet discharge head 49 through the tube.

  The functional liquid is mainly composed of a resin material, a photopolymerization initiator as a curing agent, a solvent or a dispersion medium. A functional liquid having an inherent function can be formed by adding a coloring material such as a pigment or a dye or a functional material such as a lyophilic or liquid repellent surface modifying material to the main material. In this embodiment, for example, a white pigment is added. The functional liquid resin material is a material for forming a resin film. The resin material is not particularly limited as long as the material is liquid at normal temperature and becomes a polymer by polymerization. Furthermore, a resin material having a low viscosity is preferable, and it is preferably in the form of an oligomer. A monomer form is more preferable. The photopolymerization initiator is an additive that acts on a crosslinkable group of the polymer to advance the crosslinking reaction. For example, benzyldimethyl ketal or the like can be used as the photopolymerization initiator. The solvent or the dispersion medium adjusts the viscosity of the resin material. By setting the viscosity at which the functional liquid can be easily discharged from the droplet discharge head, the droplet discharge head can stably discharge the functional liquid.

  FIG. 5C is a schematic plan view showing the head unit. As shown in FIG. 5C, a droplet discharge head 49 is disposed on the head unit 47, and a nozzle plate 51 is disposed on the surface of the droplet discharge head 49. A plurality of nozzles 52 are arranged on the nozzle plate 51. The number and arrangement of the nozzles 52 and heads are not particularly limited, and are set according to the pattern to be ejected. In the present embodiment, for example, one nozzle plate 51 has an array of nozzles 52 arranged in one row, and 15 nozzles 52 are arranged in one row.

  An irradiation port 48 a is formed on the lower surface of the curing unit 48. Then, ultraviolet light emitted from the irradiation device is irradiated toward the semiconductor substrate 1 from the irradiation port 48a.

  FIG. 5D is a schematic cross-sectional view of a main part for explaining the structure of the droplet discharge head. As shown in FIG. 5D, the droplet discharge head 49 includes a nozzle plate 51, and the nozzle 52 is formed on the nozzle plate 51. A cavity 53 communicating with the nozzle 52 is formed at a position above the nozzle plate 51 and facing the nozzle 52. Then, the functional liquid 54 is supplied to the cavity 53 of the droplet discharge head 49.

  A vibration plate 55 that vibrates in the vertical direction and expands or contracts the volume in the cavity 53 is installed above the cavity 53. A piezoelectric element 56 that extends in the vertical direction and vibrates the vibration plate 55 is disposed at a location facing the cavity 53 on the upper side of the vibration plate 55. The piezoelectric element 56 expands and contracts in the vertical direction to pressurize and vibrate the diaphragm 55, and the diaphragm 55 pressurizes the cavity 53 by enlarging and reducing the volume in the cavity 53. As a result, the pressure in the cavity 53 varies, and the functional liquid 54 supplied into the cavity 53 is discharged through the nozzle 52.

  When the droplet discharge head 49 receives a nozzle drive signal for controlling and driving the piezoelectric element 56, the piezoelectric element 56 expands and the diaphragm 55 reduces the volume in the cavity 53. As a result, the functional liquid 54 corresponding to the reduced volume is discharged as droplets 57 from the nozzles 52 of the droplet discharge head 49. The semiconductor substrate 1 coated with the functional liquid 54 is irradiated with ultraviolet light from the irradiation port 48a so that the functional liquid 54 containing a curing agent is solidified or cured.

(Storage section)
FIG. 6A is a schematic front view showing the storage portion, and FIGS. 6B and 6C are schematic side views showing the storage portion. As shown in FIGS. 6A and 6B, the storage unit 12 includes a base 74. An elevating device 75 is installed inside the base 74. As the lifting device 75, the same device as the lifting device 16 installed in the supply unit 8 can be used. A lifting plate 76 is connected to the lifting device 75 on the upper side of the base 74. The lifting plate 76 is lifted and lowered by the lifting device 75. A rectangular parallelepiped storage container 18 is installed on the lifting plate 76, and the semiconductor substrate 1 is stored in the storage container 18. The same container as the storage container 18 installed in the supply unit 8 is used as the storage container 18.

  A substrate extruding portion 78 and a relay stand 79 are installed on the Y direction side of the base 74 via a support member 77. A relay stand 79 is disposed on the substrate push-out portion 78 at a location on the Y direction side of the storage container 18. The board pushing part 78 includes an arm part 78a that moves in the Y direction and a linear motion mechanism that drives the arm part 78a. This linear motion mechanism is not particularly limited as long as it is a mechanism that moves linearly. In this embodiment, for example, an air cylinder that operates with compressed air is employed. The semiconductor substrate 1 is placed on the relay stand 79, and the arm portion 78 a can come into contact with the center of one end of the semiconductor substrate 1 on the Y direction side.

  The substrate pushing part 78 moves the arm part 78a in the -Y direction, so that the arm part 78a moves the semiconductor substrate 1 in the -Y direction. The relay stand 79 is formed with a recess having a width substantially the same as the width of the semiconductor substrate 1 in the X direction, and the semiconductor substrate 1 moves along the recess. And the position of the X direction of the semiconductor substrate 1 is determined by this recessed part. As a result, the semiconductor substrate 1 is moved into the storage container 18 as shown in FIG. A rail 18 c is formed in the storage container 18, and the rail 18 c is positioned on an extension line of a recess formed in the relay stand 79. Then, the semiconductor substrate 1 is moved along the rails 18 c by the substrate pushing part 78. Thereby, the semiconductor substrate 1 is stored in the storage container 18 with high quality.

  After the transport unit 13 moves the semiconductor substrate 1 onto the relay stand 79, the lifting device 75 raises the storage container 18. And the board | substrate extrusion part 78 drives the arm part 78a, and moves the semiconductor substrate 1 in the storage container 18. FIG. In this way, the storage unit 12 stores the semiconductor substrate 1 in the storage container 18. After the predetermined number of semiconductor substrates 1 are stored in the storage container 18, the operator replaces the storage container 18 in which the semiconductor substrate 1 is stored with the empty storage container 18. Thus, the operator can carry the plurality of semiconductor substrates 1 together to the next process.

  The storage unit 12 has a relay place 12a on which the semiconductor substrate 1 to be stored is placed. The transport unit 13 can store the semiconductor substrate 1 in the storage container 18 in cooperation with the storage unit 12 only by placing the semiconductor substrate 1 on the relay location 12a.

(Transport section)
Next, the conveyance part 13 which conveys the semiconductor substrate 1 is demonstrated according to FIG. FIG. 7 is a schematic perspective view illustrating the configuration of the transport unit. As shown in FIG. 7, the conveyance part 13 is provided with the base 82 formed in flat form. A support base 83 is disposed on the base 82. A cavity is formed inside the support base 83, and a rotation mechanism 83a including a motor, an angle detector, a speed reducer, and the like is installed in the cavity. The output shaft of the motor is connected to the speed reducer, and the output shaft of the speed reducer is connected to the first arm portion 84 disposed on the upper side of the support base 83. In addition, an angle detector is installed in connection with the motor output shaft, and the angle detector detects the rotation angle of the motor output shaft. Thereby, the rotation mechanism 83a can detect the rotation angle of the first arm portion 84 and rotate it to a desired angle.

  A rotation mechanism 85 is installed on the first arm portion 84 at the end opposite to the support base 83. The rotation mechanism 85 includes a motor, an angle detector, a speed reducer, and the like, and has the same function as the rotation mechanism installed in the support base 83. The output shaft of the rotation mechanism 85 is connected to the second arm portion 86. Accordingly, the rotation mechanism 85 can detect the rotation angle of the second arm portion 86 and rotate it to a desired angle.

  On the second arm portion 86, an elevating device 87 is disposed at the end opposite to the rotation mechanism 85. The elevating device 87 includes a linear motion mechanism and can be expanded and contracted by driving the linear motion mechanism. For this linear motion mechanism, for example, a mechanism similar to the lifting device 16 of the supply unit 8 can be used. A rotating device 88 is disposed below the lifting device 87.

  The rotation device 88 only needs to be able to control the rotation angle, and can be configured by combining various motors and a rotation angle sensor. In addition, a step motor capable of rotating at a predetermined rotation angle can be used. In this embodiment, for example, a step motor is employed. Further, a speed reducer may be arranged. It can be rotated at a finer angle.

  A gripping portion 13a is arranged on the lower side of the rotating device 88 in the drawing. The grip 13 a is connected to the rotation shaft of the rotation device 88. Therefore, the conveyance unit 13 can rotate the gripping unit 13 a by driving the rotating device 88. Furthermore, the conveyance part 13 can raise / lower the holding part 13a by driving the raising / lowering apparatus 87. FIG.

  The gripping portion 13a has four linear finger portions 13c, and a suction mechanism that sucks and sucks the semiconductor substrate 1 is formed at the tip of the finger portion 13c. And the holding part 13a can hold | grip the semiconductor substrate 1 by operating this adsorption | suction mechanism.

  A control device 89 is installed on the −Y direction side of the base 82. The control device 89 includes a central processing unit, a storage unit, an interface, an actuator drive circuit, an input device, a display device, and the like. The actuator drive circuit is a circuit that drives the rotation mechanism 83a, the rotation mechanism 85, the lifting device 87, the rotation device 88, and the suction mechanism of the grip portion 13a. These devices and circuits are connected to the central processing unit via an interface. In addition, an angle detector is connected to the central processing unit via an interface. The storage unit stores program software indicating operation procedures for controlling the transport unit 13 and data used for control. The central processing unit is a device that controls the transport unit 13 in accordance with program software. The control device 89 receives the output of the detector arranged in the transport unit 13 and detects the position and posture of the grip unit 13a. And the control apparatus 89 performs the control which drives the rotation mechanism 83a and the rotation mechanism 85, and moves the holding part 13a to a predetermined position.

(Printing method)
Next, a printing method using the above-described printing apparatus 7 will be described with reference to FIG. FIG. 8 is a flowchart for illustrating a printing method.
As shown in the flowchart of FIG. 8, the printing method includes a carry-in step S <b> 1 for carrying in the semiconductor substrate 1 from the storage container 18, and a pre-treatment step for performing pre-treatment on the surface of the carried-in semiconductor substrate 1 (first step). ) S2, a cooling step (second step) S3 for cooling the semiconductor substrate 1 whose temperature has increased in the pretreatment step S2, a printing step (third step) S4 for drawing and printing various marks on the cooled semiconductor substrate 1; The storage step S5 for storing the semiconductor substrate 1 on which various marks are printed in the storage container 18 is mainly configured.

Among the steps described above, the steps from the pretreatment step S2 to the printing step S4 are the characteristic portions of the present invention. Therefore, the characteristic portions will be described in the following description.
In the preprocessing step S2, in the preprocessing unit 9, one of the first stage 27 and the second stage 28 is located at the relay location 9c. The conveyance unit 13 moves the gripping unit 13a to a location facing the stage located at the relay location 9c. Subsequently, the transport unit 13 lowers the gripping unit 13a and then releases the suction of the semiconductor substrate 1, thereby placing the semiconductor substrate 1 on the first stage 27 or the second stage 28 located at the relay location 9c. To do. As a result, as shown in FIG. 9B, the semiconductor substrate 1 is placed on the first stage 27 located at the relay location 9c. Alternatively, as shown in FIG. 9C, the semiconductor substrate 1 is placed on the second stage 28 located at the relay location 9c.

  The first stage 27 and the second stage 28 are preheated by the heating devices 27H and 28H, and the semiconductor substrate 1 placed on the first stage 27 or the second stage 28 is immediately heated to a predetermined temperature. The temperature for heating the semiconductor substrate 1 is preferably below the heat-resistant temperature of the semiconductor substrate 1 and can effectively modify the surface of the semiconductor substrate 1 or efficiently remove organic substances on the surface, as will be described later. In this embodiment, the semiconductor substrate 1 is heated to a temperature of, for example, 180 ° C. so as to have a temperature in the range of 150 ° C. to 200 ° C.

  Further, when the transfer unit 13 moves the semiconductor substrate 1 onto the first stage 27, the pretreatment of the semiconductor substrate 1 on the second stage 28 is performed at the processing place 9 d inside the pretreatment unit 9. Then, after the pretreatment of the semiconductor substrate 1 on the second stage 28 is completed, the second stage 28 moves the semiconductor substrate 1 to the second relay location 9b. Next, the preprocessing unit 9 drives the first stage 27 to move the semiconductor substrate 1 placed on the first relay location 9 a to the processing location 9 d facing the carriage 31. Thereby, the pretreatment of the semiconductor substrate 1 on the first stage 27 can be started immediately after the pretreatment of the semiconductor substrate 1 on the second stage 28 is completed.

  Subsequently, in the preprocessing unit 9, the semiconductor device 3 mounted on the semiconductor substrate 1 is irradiated with ultraviolet rays. Thereby, the chemical bond of the organic irradiation object in the surface layer of the semiconductor device 3 is cut, and the active oxygen separated from the ozone generated by the ultraviolet rays is bonded to the molecules of the cut surface layer, so that the hydrophilicity is high. It is converted into a functional group (for example, —OH, —CHO, —COOH) to modify the surface of the substrate 1 and remove organic substances on the surface. Here, as described above, since the semiconductor device 3 (semiconductor substrate 1) is irradiated with ultraviolet rays in a state of being heated to 180 ° C. in advance, the semiconductor substrate 1 is not damaged, and collisions of molecules on the surface layer occur. The surface can be effectively modified by increasing the speed, and organic substances on the surface can be efficiently removed. After pre-processing, the pre-processing unit 9 drives the first stage 27 to move the semiconductor substrate 1 to the first relay location 9a.

  Similarly, when the transfer unit 13 moves the semiconductor substrate 1 onto the second stage 28, the pretreatment of the semiconductor substrate 1 on the first stage 27 is performed at the processing location 9 d inside the pretreatment unit 9. . Then, after the pretreatment of the semiconductor substrate 1 on the first stage 27 is completed, the first stage 27 moves the semiconductor substrate 1 to the first relay location 9a. Next, the pretreatment unit 9 drives the second stage 28 to move the semiconductor substrate 1 placed on the second relay place 9 b to the treatment place 9 d facing the carriage 31. Thereby, the pretreatment of the semiconductor substrate 1 on the second stage 28 can be started immediately after the pretreatment of the semiconductor substrate 1 on the first stage 27 is completed. Subsequently, the preprocessing unit 9 irradiates the semiconductor device 3 mounted on the semiconductor substrate 1 with ultraviolet rays, so that the semiconductor substrate 1 is not damaged in the same manner as the semiconductor substrate 1 on the first stage 27. The surface can be effectively modified and organic substances on the surface can be efficiently removed. After performing the pretreatment, the pretreatment unit 9 drives the second stage 28 to move the semiconductor substrate 1 to the second relay location 9b.

  When the pretreatment of the semiconductor substrate 1 is completed in the pretreatment step S2 and the process proceeds to the cooling step S3, the transfer unit 13 places the semiconductor substrate 1 in the relay place 9c on the cooling plate 110 provided in the treatment places 11a and 11b. To do.

  In the cooling unit 11, the semiconductor substrate 1 is sucked by the suction pad 63 and is held in contact with the holding surface 63 of the cooling plate 110. Further, in the flow device 91, the fan portion 96 rotates, so that air is sucked from the air intake portion 66 and flows into the sealed space 65 a, flows through the gap between the fins 64, and then passes through the communication hole 67. Then, the air flows into 92a and is further exhausted from the exhaust section 93 to the outside of the apparatus through the exhaust pipe 94.

At this time, heat exchange is performed between the semiconductor substrate 1 placed in a heated state and the cooling plate 110, and heat exchange is performed between the air flowing into the sealed space 65a and the fins 64. . Therefore, the heat that the semiconductor substrate 1 has is sequentially transferred to the cooling plate 110, the fins 64, and the air, so that the semiconductor substrate 1 is removed, that is, cooled. Further, the air heated by heat removal from the semiconductor substrate 1 is discharged outside the apparatus without leaking from the frames 65 and 92.
Thus, the semiconductor substrate 1 heated in the pretreatment step S2 is cooled (temperature adjustment) for a predetermined time to an appropriate temperature (for example, room temperature) when the printing step S4 is performed.

The semiconductor substrate 1 cooled in the cooling step S <b> 3 is transported onto the stage 39 located at the relay location 10 a of the coating unit 10 by the transport unit 13. In the printing step S <b> 5, the application unit 10 operates the chuck mechanism to hold the semiconductor substrate 1 placed on the stage 39 on the stage 39. Then, the application unit 10 ejects droplets 57 from the nozzles 52 formed on the droplet ejection head 49 while scanning and moving the stage 39 and the carriage 45. Thereby, marks such as the company name mark 4, the model code 5, and the production number 6 are drawn on the surface of the semiconductor device 3.
At this time, since the semiconductor substrate 1 has been cooled to room temperature by the cooling unit 11 in advance, it is applied to the surface of the semiconductor device 3 having a predetermined wetting characteristic, and a mark is formed with a predetermined line width. .

  Then, the mark is irradiated with ultraviolet rays from the curing unit 48 installed on the carriage 45. As a result, since the functional liquid 54 that forms the mark contains a photopolymerization initiator that starts polymerization by ultraviolet rays, the surface of the mark is immediately solidified or cured. After printing, the coating unit 10 moves the stage 39 on which the semiconductor substrate 1 is placed to the relay location 10a. Thereby, the conveyance part 13 can make it easy to hold | grip the semiconductor substrate 1. FIG. Then, the application unit 10 stops the operation of the chuck mechanism and releases the holding of the semiconductor substrate 1.

  Thereafter, the semiconductor substrate 1 is transported to the storage unit 12 by the transport unit 13 and stored in the storage container 18 in the storage step S5.

  As described above, in this embodiment, since the semiconductor substrate 1 is cooled by providing the cooling step S3 after the pretreatment step S2 and before the printing step S4, the semiconductor substrate 1 is heated before coating. Even in such a case, it is possible to form a high-definition pattern by suppressing the wetting and spreading of the droplets that have landed on the semiconductor device 3. Further, in the present embodiment, the heat sink 61 holding the semiconductor substrate 1 is cooled by heat exchange by the flow of air, so that the use force not used in the coating unit 10 such as cooling water becomes unnecessary, and the apparatus can be downsized. It is possible to reduce the price.

  Further, in this embodiment, the air flow path whose temperature has been increased by heat exchange is sealed, and the temperature (viscosity) of the ink, the application unit 10, and the conveyance unit 13 are discharged to discharge the air referred to as temperature. Adverse effects on the alignment of the semiconductor substrate 1 and the like can be prevented, and a highly accurate printing process can be realized. Further, in the present embodiment, since the intake portion 66 is disposed on the opposite side to the side facing the application portion 10 in the frame body 65, the flow generated by the flow of air sucked from the intake portion 66 is It is possible to prevent an adverse effect on the printing process in the application unit 10 (for example, flight bending of the ejected droplets or temperature distribution of the semiconductor substrate 1 in the application unit 10).

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above-described embodiment, the configuration in which the pretreatment unit 9 performs the ultraviolet irradiation is illustrated. However, the present invention is not limited to this. For example, the pretreatment may be performed by plasma treatment or the like. In this case as well, the heated semiconductor substrate 1 may be printed by the coating unit 10 after being cooled by the cooling unit 11.

  In the above embodiment, when the printing process is performed in an air atmosphere, the semiconductor substrate 1 is cooled via the heat sink 61 by the flow of air. However, the present invention is not limited to this. When the printing process is performed in an active gas atmosphere, the semiconductor substrate 1 may be cooled via the heat sink 61 by the flow of the inert gas.

In the above embodiment, the ultraviolet curable ink is used as the UV ink. However, the present invention is not limited to this, and various active light curable inks that can use visible light and infrared light as the curable light are used. be able to.
Similarly, various active light sources that emit active light such as visible light can be used as the light source, that is, an active light irradiation unit can be used.

  Here, in the present invention, the “actinic ray” is not particularly limited as long as it can impart energy capable of generating a starting species in the ink by the irradiation, and is broadly divided into α rays, γ rays, X-rays, ultraviolet rays, visible rays, electron beams and the like are included. Among these, from the viewpoints of curing sensitivity and device availability, ultraviolet rays and electron beams are preferable, and ultraviolet rays are particularly preferable. Therefore, as the actinic ray curable ink, it is preferable to use an ultraviolet curable ink that can be cured by irradiating ultraviolet rays as in the present embodiment.

  In the above embodiment, the first stage 27 has a built-in heating device 27H, and the second stage 28 has a built-in heating device 28H. However, the pretreatment unit has no built-in heating device. Instead, the semiconductor device 1 may be heated before being transported to the semiconductor device 1 by the preprocessing unit, and the heated semiconductor device 1 may be transported to the preprocessing unit.

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor substrate (base material), 3 ... Semiconductor device, 7 ... Printing apparatus, 9 ... Pre-processing part, 10 ... Application | coating part (printing part), 11 ... Cooling part, 61 ... Heat sink part, 62 ... Holding surface, 65 , 92 ... Frame (cover member), 66 ... Intake part, 93 ... Exhaust part, 94 ... Exhaust pipe (pipe), ST ... Stage

Claims (6)

A pretreatment unit that performs a predetermined pretreatment in a heated state of the substrate;
A cooling unit for cooling the heated base material;
A printing unit that prints a predetermined pattern by discharging droplets to the cooled substrate;
The cooling unit includes a stage on which the base material is placed,
A heat sink portion provided on the stage and having a holding surface for holding the substrate;
A flow device for causing air to flow in the surface direction of the holding surface in the heat sink part;
The holding surface is rectangular in a plan view having a long side and a short side,
The flow device causes the air to flow in a direction away from the pretreatment portion in the surface direction of the holding surface after flowing the air in a direction parallel to the short side in the surface direction of the holding surface. Characteristic printing device. The printing apparatus according to claim 1.
The flow device, after flowing the air in a direction parallel to the short side in the surface direction of the holding surface, causes the air to flow in a direction away from the printing unit in the surface direction of the holding surface. A printing device. The printing apparatus according to claim 1 or 2,
The flow device includes an air intake unit that intakes the air, an exhaust unit that exhausts the intake air, and a fan unit that causes the air intake from the intake unit to flow to the heat sink unit and exhausts the air from the exhaust unit. And a tubular body connected to the exhaust unit and exhausting exhaust from the exhaust unit in a direction away from the pretreatment unit. The printing apparatus according to claim 3.
A cover member surrounding the flow device;
The intake portion is provided on the side surface of the cover member so as to open in a direction parallel to the holding surface,
The exhaust device is provided on the lower surface of the cover member so as to open in a direction perpendicular to the holding surface. The printing apparatus according to claim 4.
The printing apparatus according to claim 1, wherein the suction portion is disposed on a side opposite to a side of the cover member facing the printing portion. A first step in which a predetermined pretreatment is performed in the pretreatment section while the substrate is heated;
A second step of cooling the heated substrate;
A third step of printing a predetermined pattern by discharging droplets onto the cooled substrate ,
In the previous SL second step, holding said substrate provided in a stage in which the substrate is placed, the heat sink having a rectangular holding surface in plan view with long sides and short sides, of the holding surface A printing method, wherein air is caused to flow in a direction parallel to the short side in a surface direction, and then the air is caused to flow in a direction away from the pretreatment unit to cool the substrate.

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