JP5682421B2 - Printing device - Google Patents

Description

  The present invention relates to a printing apparatus.

  In recent years, attention has been focused on a droplet discharge device that forms an image or a pattern on a recording medium using ultraviolet curable ink that is cured by ultraviolet irradiation. The ultraviolet curable ink has a preferable characteristic as a printing ink, in which the curing is very slow until it is irradiated with ultraviolet rays, and it is rapidly cured when irradiated with ultraviolet rays. Moreover, since the solvent is not volatilized during curing, there is an advantage that the environmental load is small.

  Further, the ultraviolet curable ink exhibits high adhesion to various recording media depending on the composition of the vehicle. Further, after curing, it is chemically stable, has high adhesiveness, chemical resistance, weather resistance, friction resistance, etc., and has excellent characteristics such as withstand outdoor environments. For this reason, an image can be formed not only on a thin sheet-like recording medium such as paper, a resin film, or a metal foil, but also on a recording medium having a three-dimensional surface shape such as a label surface or a textile product.

  A technique of printing attribute information such as a manufacturing number or a manufacturing company on an IC on a substrate by using the above-described ultraviolet curable ink by a droplet discharge method is disclosed (for example, Patent Document 1). When a printing process is performed on the substrate, the substrate is sequentially transported to various processing apparatuses related to printing, such as a droplet discharge device and a pretreatment device. As a substrate transfer device, a device that holds and transfers a substrate from both sides (for example, Patent Document 2) is disclosed. Patent Document 3 discloses a configuration in which a robot having an arm is provided to take out a substrate from a cassette.

JP 2003-080687 A JP 2010-269899 A JP 2010-201556 A

However, the following problems exist in the conventional technology as described above.
In the technique described in Patent Document 2, since the hand itself is large, the size of the apparatus itself is increased, and it cannot be said that the technique is suitable for the operation of taking out the substrate from the substrate housing portion.
Further, as described in Patent Document 3, since a dedicated robot is provided, the apparatus is also increased in size and cost, and in addition, the substrate taken out from the storage unit is removed from the droplet discharge device. When transferring to a transfer unit that transfers to a processing apparatus or the like, if the transfer timing is incorrect, there is a possibility that the transfer unit cannot receive the substrate or that the substrate is damaged.

  The present invention has been made in consideration of the above points, and an object of the present invention is to provide a printing apparatus capable of smoothly transporting a base material from a storage unit while contributing to downsizing and cost reduction of the apparatus. To do.

In order to achieve the above object, the present invention employs the following configuration.
The printing apparatus according to the present invention includes an extruding unit that extrudes the base material accommodated in the accommodating portion toward the delivery position, a transport unit that conveys the base material pushed out to the delivery position, and an extrusion toward the delivery position. A detection unit that detects information on the position of the base material, and a control unit that controls operations of the extrusion unit and the conveyance unit based on a detection result of the detection unit. It is what.

  Therefore, in the printing apparatus of the present invention, since the base material is pushed out from the storage unit and moved to the delivery position, it is possible to contribute to downsizing and cost reduction of the apparatus as compared with the case where a robot or the like having a hand unit is installed. Moreover, in this invention, when the detection part detects that the base material was extruded to the delivery position, while stopping the extrusion of the base material by an extrusion part, a base material can be conveyed by a conveyance part. Therefore, in this invention, it becomes possible to convey a base material smoothly, without producing the situation which cannot receive a base material, or the situation which damages a base material.

As the extrusion section in the above configuration, a configuration in which an end surface located on the opposite side of the end surface facing the delivery position in the base material can be suitably employed.
Thereby, in this invention, a base material can be easily moved to a delivery position using linear motion actuators, such as a cylinder apparatus which can be driven to one direction.

As the detection unit in the above configuration, a configuration disposed below the delivery position can be suitably employed.
Thereby, in this invention, it becomes possible to detect the information regarding the position of a base material, without interfering with the delivery of the base material by a conveyance part.

In the above configuration, the transport unit includes a first grip unit that grips the base material when transporting the base material to a processing apparatus that performs processing related to printing, and the base material by the first grip unit from the delivery position. A configuration having a second gripping part for gripping the base material when the base material is transported to the switching position for switching to gripping can be suitably employed.
Accordingly, in the present invention, after the base material pushed to the delivery position is gripped by the second gripping portion of the transport unit and transported to the switching position, for example, a state where a different position of the base material is gripped by the first gripping portion Can be transferred to the processing apparatus.

In the above configuration, the first gripping portion has a first gripping region extending in the first direction and gripping the base material, and the second gripping portion is disposed on one end side of the first gripping region. The structure which has the 2nd holding | grip area | region extended in the 2nd direction crossing the said 1st direction and holding the said base material can be employ | adopted suitably.
Thus, in the present invention, for example, even when the extending direction of the grippable region of the base material at the delivery position is different from the extending direction of the region gripped when the base material is transported to the processing apparatus, This can be handled by selecting the gripping part or the second gripping part.

In the above configuration, a configuration in which the length of the second gripping region is shorter than the length of the first gripping region can be suitably employed.
Accordingly, in the present invention, for example, when the grippable region of the base material at the delivery position is narrow and cannot be gripped by the first gripping part, the base material can be gripped by the second gripping part and gripped by the first gripping part. When the base material is gripped by the first gripping portion having a long gripping area at the switching position, stable transport to the processing apparatus is possible.

In addition, as the processing related to the printing in the above configuration, a configuration including a discharge process for discharging liquid droplets that are cured with actinic rays to the substrate transported by the transport unit can be suitably employed.
Thereby, in this invention, a highly accurate printing process can be performed rapidly and with a small environmental load by irradiating the actinic ray to the droplet discharged with respect to the smoothly conveyed base material.

Moreover, in this invention, the structure which apply | coats the said droplet to the semiconductor device provided in the surface of the said base material can be employ | adopted suitably.
Thereby, in the present invention, while realizing downsizing and cost reduction of the apparatus, a print pattern indicating the attribute information of the semiconductor device on the smoothly transported substrate is formed at a predetermined print quality and low cost. Can be printed.
In addition, the relative movement direction, the orthogonal direction, and the first and second directions in this specification include a range that is deviated due to an error caused by manufacturing and assembly.

(A) is a schematic plan view which shows a semiconductor substrate, (b) is a schematic plan view which shows a droplet discharge device. The schematic diagram which shows a supply part. (A) is a schematic perspective view which shows the structure of an application part, (b) is a model side view which shows a carriage. (A) is a schematic plan view showing a head unit, and (b) is a schematic cross-sectional view of a main part for explaining the structure of a droplet discharge head. The schematic diagram which shows a storage part. The figure which shows the structure of a conveyance part. FIG. 3 is a diagram in which detection light is projected from a detection device to a semiconductor substrate 1 The block diagram which shows a control system. 6 is a flowchart for illustrating a printing method. The figure for demonstrating operation | movement of a holding part.

Hereinafter, embodiments of a transport device and a printing device of the present invention will be described with reference to FIGS.
The following embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each configuration easy to understand, the actual structure is different from the scale and number of each structure.

(Semiconductor substrate)
First, a semiconductor substrate which is an example of an object to be drawn (printed) using a printing apparatus will be described.
FIG. 1A is a schematic plan view showing a semiconductor substrate. As shown in FIG. 1A, a semiconductor substrate 1 as a base material includes a substrate 2 and a semiconductor device 3. The substrate 2 only needs to have heat resistance so that the semiconductor device 3 can be mounted. As the substrate 2, a glass epoxy substrate, a paper phenol substrate, a paper epoxy substrate, or the like can be used. The semiconductor device 3 as the recording medium may be a package base material or a semiconductor base material.

  A semiconductor device 3 is mounted on the substrate 2. On the semiconductor device 3, marks (print pattern, predetermined pattern) such as a company name mark 4, a model code 5, and a production number 6 are drawn. These marks are drawn by a printing apparatus described later.

(Printer)
FIG. 1B is a schematic plan view showing the printing apparatus.
As shown in FIG. 1B, the printing apparatus 7 mainly includes a supply unit 8, a pre-processing unit 9, a coating unit (printing unit) 10, a cooling unit 11, a storage unit 12, a transport unit 13, a post-processing unit 14, and The control unit CONT (see FIG. 8) includes a plurality of processing devices that perform processing related to various types of printing. The direction in which the supply unit 8 and the storage unit 12 are arranged, and the direction in which the preprocessing unit 9, the cooling unit 11, and the post-processing unit 14 are arranged are defined as the X direction. The direction orthogonal to the X direction is defined as the Y direction, and the coating unit 10, the cooling unit 11, and the transport unit 13 are arranged side by side in the Y direction. The vertical direction is the Z direction.

  The supply unit 8 includes a storage container in which a plurality of semiconductor substrates 1 are stored. The supply unit 8 includes a relay location 8a, and supplies the semiconductor substrate 1 from the storage container to the relay location 8a. In the relay place 8a, a pair of rails 8b extending in the X direction and spaced from each other in the Y direction are provided at a height lower than the height of the semiconductor substrate 1 delivered from the storage container.

  The pretreatment unit 9 has a function of modifying the surface of the semiconductor device 3 while heating. The pretreatment unit 9 adjusts the spread of the ejected droplets and the adhesion of the marks to be printed. The pre-processing unit 9 includes a first relay location 9a and a second relay location 9b, and takes the semiconductor substrate 1 before processing from the first relay location 9a or the second relay location 9b to modify the surface. Thereafter, the preprocessing unit 9 moves the processed semiconductor substrate 1 to the first relay location 9a or the second relay location 9b, and makes the semiconductor substrate 1 stand by. The first relay location 9a and the second relay location 9b are collectively referred to as a relay location 9c. A place where preprocessing is performed inside the preprocessing unit 9 is defined as a processing place 9d.

  The cooling unit 11 is disposed at a relay location of the application unit 10 and has a function of cooling the semiconductor substrate 1 that has been heated and surface-modified in the pretreatment unit 9. The cooling unit 11 includes processing places 11 a and 11 b that hold and cool the semiconductor substrate 1. The processing places 11a and 11b are collectively referred to as a processing place 11c as appropriate.

  The application unit 10 has a function of drawing (printing) a mark by discharging droplets onto the semiconductor device 3 and solidifying or curing the drawn mark. The coating unit 10 performs the drawing process and the curing process by moving the semiconductor substrate 1 before drawing from the cooling unit 11 as a relay place. Thereafter, the coating unit 10 moves the drawn semiconductor substrate 1 to the cooling unit 11 and puts the semiconductor substrate 1 on standby.

  The post-processing unit 14 performs a reheating process as a post-process on the semiconductor substrate 1 placed on the cooling unit 11 after the drawing process is performed in the application unit 10. The post-processing unit 14 includes a first relay location 14a and a second relay location 14b. The first relay location 14a and the second relay location 14b are collectively referred to as a relay location 14c.

  The storage unit 12 includes a storage container that can store a plurality of semiconductor substrates 1. The storage unit 12 includes a relay location 12a, and stores the semiconductor substrate 1 from the relay location 12a into the storage container. A pair of rails 12 b extending in the X direction are provided at the relay location 12 a at substantially the same height as the storage container that stores the semiconductor substrate 1. The operator carries out the storage container in which the semiconductor substrate 1 is stored from the printing apparatus 7.

  A transport unit 13 is disposed at a central location of the printing apparatus 7. The transport unit 13 is a scalar robot having an arm 13b. A gripping portion 13a for supporting the semiconductor substrate 1 from the back surface (lower surface) and gripping the side edge in a cantilever manner is provided at the tip of the arm portion 13b. The relay locations 8a, 9c, 11, 14c, and 12a are located within the movement range of the grip portion 13a. Accordingly, the gripping portion 13a can move the semiconductor substrate 1 between the relay locations 8a, 9c, 11, 14c, and 12a. The control unit CONT is a device that controls the overall operation of the printing apparatus 7 and manages the operation status of each unit of the printing apparatus 7. Then, an instruction signal for moving the semiconductor substrate 1 is output to the transport unit 13. Thereby, the semiconductor substrate 1 is drawn by passing through each part sequentially.

Details of each part will be described below.
(Supply section)
FIG. 2A is a schematic front view showing the supply unit, and FIGS. 2B and 2C are schematic side views showing the supply unit. As shown in FIGS. 2A and 2B, the supply unit 8 includes a base 15. An elevating device 16 is installed inside the base 15. The elevating device 16 includes a linear motion mechanism that operates in the Z direction. As this linear motion mechanism, a mechanism such as a combination of a ball screw and a rotary motor or a combination of a hydraulic cylinder and an oil pump can be used. In this embodiment, for example, a mechanism using a ball screw and a step motor is employed. An elevating plate 17 is connected to the elevating device 16 on the upper side of the base 15. The elevating plate 17 can be moved up and down by a predetermined moving amount by the elevating device 16.

  A rectangular parallelepiped storage container (storage part) 18 is installed on the elevating plate 17, and a plurality of semiconductor substrates 1 are stored in the storage container 18. The storage container 18 has openings 18a on both sides in the X direction, and the semiconductor substrate 1 can be taken in and out from the openings 18a. Convex rails 18c are formed inside the side surfaces 18b located on both sides in the Y direction of the storage container 18, and the rails 18c are arranged extending in the X direction. A plurality of rails 18c are arranged at equal intervals in the Z direction. By inserting the semiconductor substrate 1 along the rail 18c from the X direction or from the -X direction, the semiconductor substrate 1 is arranged and stored in the Z direction.

  On the X direction side of the base 15, an extrusion device (extrusion unit) 23 is installed via a support member 21 and a support base 22. The extrusion device 23 is an extrusion pin that protrudes in the X direction by a linear motion mechanism similar to that of the lifting device 16 and abuts against the −X side end surface of the semiconductor substrate 1 and pushes it toward the delivery position CH1 set on the rail 8b side. 23a is provided. Therefore, the push pin 23a is installed at a position higher than the upper surface of the rail 8b. The delivery position CH <b> 1 indicates a position where the semiconductor substrate 1 is delivered to the transport unit 13.

  As shown in FIG. 2C, the extrusion pin 23a in the extrusion device 23 projects in the + X direction, so that the semiconductor substrate 1 positioned slightly on the + Z side height from the upper surface of the rail 18c and the rail 8b is accommodated. It is pushed out from the container 18 toward the delivery position CH1.

  A detection unit 90 is provided below the delivery position CH1 between the storage container 18 and the rail 8b. The detection unit 90 projects detection light such as infrared light and laser light, and receives the reflected light of the detection light reflected by the semiconductor substrate 1, thereby pushing the semiconductor substrate 1 to the delivery position CH1. The detection result of the detection unit 90 is output to the control unit CONT.

  In addition to the above configuration, the detection unit 90 includes a light projecting unit that projects detection light toward the delivery position and a light receiving unit that receives the detection light, and the semiconductor substrate 1 blocks the detection light. The semiconductor substrate 1 can be detected by detecting that the semiconductor substrate 1 has been pushed out to the delivery position CH1 when the light receiving portion is blocked, or by detecting a change in capacitance with the semiconductor substrate 1. It is possible to adopt a configuration using various sensors such as a configuration for detecting the pushing out to the delivery position CH1.

After the semiconductor substrate 1 moves onto the rail 8b, the push pin 23a returns to the standby position shown in FIG. Next, the lifting / lowering device 16 lowers the storage container 18 and moves the semiconductor substrate 1 to be processed next to a height facing the extrusion pin 23a. Thereafter, in the same manner as described above, the push pin 23a is protruded to push the semiconductor substrate 1 toward the delivery position CH1.
In this way, the supply unit 8 sequentially pushes the semiconductor substrate 1 from the storage container 18 toward the delivery position CH1. After all the semiconductor substrates 1 in the storage container 18 are moved onto the relay stand 23, the operator replaces the empty storage container 18 with the storage container 18 in which the semiconductor substrate 1 is stored. Thereby, the semiconductor substrate 1 can be supplied to the supply unit 8.

(Pre-processing section)
The preprocessing unit 9 preprocesses the semiconductor substrate 1 transported to the relay locations 9a and 9b at the processing location 9d. Examples of the pretreatment include irradiation with actinic rays in a heated state, for example, by a low-pressure mercury lamp, a hydrogen burner, an excimer laser, a plasma discharge part, a corona discharge part, or the like. When a mercury lamp is used, the liquid repellency of the surface of the semiconductor substrate 1 can be modified by irradiating the semiconductor substrate 1 with ultraviolet rays. When a hydrogen burner is used, the surface can be roughened by partially reducing the oxidized surface of the semiconductor substrate 1, and when an excimer laser is used, the surface of the semiconductor substrate 1 is partially melted and solidified. When plasma discharge or corona discharge is used, the surface of the semiconductor substrate 1 can be roughened by mechanical cutting. In this embodiment, for example, a mercury lamp is employed.
After the preprocessing is completed, the preprocessing unit 9 moves the semiconductor substrate 1 to the relay location 9c. Subsequently, the transport unit 13 removes the semiconductor substrate 1 from the relay place 9c.

(Cooling section)
The cooling unit 11 includes cooling plates 110 a and 110 b such as heat sinks that are provided at the processing places 11 a and 11 b and whose upper surfaces are suction holding surfaces of the semiconductor device 1.
The processing locations 11a and 11b (cooling plates 110a and 110b) are located within the operating range of the gripping portion 13a, and the cooling plates 110a and 110b are exposed at the processing locations 11a and 11b. Therefore, the transport unit 13 can easily place the semiconductor substrate 1 on the cooling plates 110a and 110b. After the semiconductor substrate 1 is cooled, the semiconductor substrate 1 stands by on the cooling plate 110a positioned at the processing location 11a or the cooling plate 110a positioned at the processing location 11b. Therefore, the gripping part 13a of the transport part 13 can easily grip and move the semiconductor substrate 1.

(Applying part)
Next, the coating unit 10 that forms marks by discharging droplets onto the semiconductor substrate 1 will be described with reference to FIGS. There are various types of apparatuses for ejecting droplets, and an apparatus using an ink jet method is preferable. The ink jet method is suitable for microfabrication because it can discharge minute droplets.

  FIG. 3A is a schematic perspective view showing the configuration of the application unit. Liquid droplets are ejected onto the semiconductor substrate 1 by the application unit 10. As shown in FIG. 3A, the application unit 10 includes a base 37 formed in a rectangular parallelepiped shape. The direction in which the droplet discharge head and the object to be discharged move relative to each other when discharging droplets is defined as a main scanning direction. The direction orthogonal to the main scanning direction is defined as the sub scanning direction. The sub-scanning direction is a direction in which the droplet discharge head and the discharge target are relatively moved when a line feed is made. In the present embodiment, the Y direction (second direction) is the main scanning direction, and the X direction (first direction) is the sub scanning direction.

  On the upper surface 37a of the base 37, a pair of guide rails 38 extending in the X direction is provided so as to protrude over the entire width in the X direction. A stage 39 having a linear motion mechanism (not shown) corresponding to the pair of guide rails 38 is attached to the upper side of the base 37. As the linear motion mechanism of the stage 39, a linear motor, a screw type linear motion mechanism, or the like can be used. In this embodiment, for example, a linear motor is employed. The stage 39 moves forward or backward along the X direction at a predetermined speed. Repeating forward and backward movement is called scanning movement. Further, a sub-scanning position detection device 40 is disposed on the upper surface 37 a of the base 37 in parallel with the guide rail 38, and the position of the stage 39 is detected by the sub-scanning position detection device 40.

  A placement surface 41 is formed on the upper surface of the stage 39, and a suction-type substrate chuck mechanism (not shown) is provided on the placement surface 41. After the semiconductor substrate 1 is placed on the placement surface 41, the semiconductor substrate 1 is fixed to the placement surface 41 by a substrate chuck mechanism.

  For example, the place of the mounting surface 41 when the stage 39 is located on the + X side is a relay place of the load position or unload position of the semiconductor substrate 1. The placement surface 41 is installed so as to be exposed within the operating range of the gripping portion 13a. Therefore, the transport unit 13 can easily place the semiconductor substrate 1 on the placement surface 41. After application (mark drawing) is performed on the semiconductor substrate 1, the semiconductor substrate 1 stands by on the mounting surface 41 which is a relay place. Therefore, the grip part 13a of the transport part 13 can easily grip the semiconductor substrate 1 and move it.

  A pair of support bases 42 are erected on both sides of the base 37 in the Y direction, and a guide member 43 extending in the Y direction is installed on the pair of support bases 42. A guide rail 44 extending in the Y direction is provided below the guide member 43 so as to protrude over the entire width in the X direction. A carriage (moving means) 45 movably attached along the guide rail 44 is formed in a substantially rectangular parallelepiped shape. The carriage 45 includes a linear motion mechanism. As the linear motion mechanism, for example, a mechanism similar to the linear motion mechanism included in the stage 39 can be used. Then, the carriage 45 scans and moves along the Y direction. A main scanning position detector 46 is disposed between the guide member 43 and the carriage 45, and the position of the carriage 45 is measured. A head unit 47 is installed on the lower side of the carriage 45, and a droplet discharge head (not shown) is projected on the surface of the head unit 47 on the stage 39 side.

  FIG. 3B is a schematic side view showing the carriage. As shown in FIG. 3B, on the semiconductor substrate 1 side of the carriage 45, a head unit 47 and a pair of curing units 48 as irradiation units are arranged at equal intervals from the center of the carriage 45 in the Y direction. A liquid droplet ejection head (ejection head) 49 for ejecting liquid droplets is provided on the side of the semiconductor substrate 1 of the head unit 47.

  A storage tank 50 is arranged on the upper side of the carriage 45 in the drawing, and the functional liquid is stored in the storage tank 50. The droplet discharge head 49 and the storage tank 50 are connected by a tube (not shown), and the functional liquid in the storage tank 50 is supplied to the droplet discharge head 49 through the tube.

  The functional liquid mainly contains a resin material, a photopolymerization initiator as a curing agent, a solvent or a dispersion medium. A functional liquid having an inherent function can be formed by adding a coloring material such as a pigment or a dye or a functional material such as a lyophilic or liquid repellent surface modifying material to the main material. In this embodiment, for example, a white pigment is added. The functional liquid resin material is a material for forming a resin film. The resin material is not particularly limited as long as the material is liquid at normal temperature and becomes a polymer by polymerization. Furthermore, a resin material having a low viscosity is preferable, and it is preferably in the form of an oligomer. A monomer form is more preferable. The photopolymerization initiator is an additive that acts on a crosslinkable group of the polymer to advance the crosslinking reaction. For example, benzyldimethyl ketal or the like can be used as the photopolymerization initiator. The solvent or the dispersion medium adjusts the viscosity of the resin material. By setting the viscosity at which the functional liquid can be easily discharged from the droplet discharge head, the droplet discharge head can stably discharge the functional liquid.

  FIG. 4A is a schematic plan view showing the head unit. As shown in FIG. 4A, in the head unit 47, two liquid droplet ejection heads 49 are arranged with an interval in the sub-scanning direction (X direction). Plates 51 (see FIG. 4B) are respectively arranged. A plurality of nozzles 52 are arranged in each nozzle plate 51. In this embodiment, it can be said that the nozzle rows 60B to 60E in which the fifteen nozzles 52 are arranged along the sub-scanning direction are arranged on each nozzle plate 51 at intervals in the Y direction. In addition, the nozzle rows 60B to 60E in the two droplet discharge heads 49 are arranged on a straight line along the X direction. The nozzle rows 60B and 60E are arranged at equal intervals from the center of the carriage 45 in the Y direction. Similarly, the nozzle rows 60C and 60D are arranged at equal intervals from the center of the carriage 45 in the Y direction. Therefore, the distance between the + Y side curing unit 48 and the nozzle row 60B is the same as the distance between the −Y side curing unit 48 and the nozzle row 60E. Also, the distance between the + Y side curing unit 48 and the nozzle row 60C is the same as the distance between the −Y side curing unit 48 and the nozzle row 60D.

  FIG. 4B is a schematic cross-sectional view of a main part for explaining the structure of the droplet discharge head. As shown in FIG. 4B, the droplet discharge head 49 includes a nozzle plate 51, and a nozzle 52 is formed on the nozzle plate 51. A cavity 53 communicating with the nozzle 52 is formed at a position above the nozzle plate 51 and facing the nozzle 52. A functional liquid (liquid) 54 is supplied to the cavity 53 of the droplet discharge head 49.

  A vibration plate 55 that vibrates in the vertical direction and expands or contracts the volume in the cavity 53 is installed above the cavity 53. A piezoelectric element 56 that extends in the vertical direction and vibrates the vibration plate 55 is disposed at a location facing the cavity 53 on the upper side of the vibration plate 55. The piezoelectric element 56 expands and contracts in the vertical direction to pressurize and vibrate the diaphragm 55, and the diaphragm 55 pressurizes the cavity 53 by enlarging and reducing the volume in the cavity 53. As a result, the pressure in the cavity 53 varies, and the functional liquid 54 supplied into the cavity 53 is discharged through the nozzle 52.

  As shown in FIGS. 3B and 4A, the curing unit 48 is disposed at positions on both sides of the head unit 47 in the main scanning direction (relative movement direction). An irradiating device for irradiating ultraviolet rays that cure the discharged droplets is disposed inside the curing unit 48. The irradiation device includes a light emitting unit and a heat radiating plate. A number of LED (Light Emitting Diode) elements are arranged in the light emitting unit. This LED element is an element that emits ultraviolet light, which is ultraviolet light, upon receiving power. An irradiation port 48 a is formed on the lower surface of the curing unit 48. Then, ultraviolet light emitted from the irradiation device is irradiated toward the semiconductor substrate 1 from the irradiation port 48a.

  When the droplet discharge head 49 receives a nozzle drive signal for controlling and driving the piezoelectric element 56, the piezoelectric element 56 expands and the diaphragm 55 reduces the volume in the cavity 53. As a result, the functional liquid 54 corresponding to the reduced volume is discharged as droplets 57 from the nozzles 52 of the droplet discharge head 49. The semiconductor substrate 1 coated with the functional liquid 54 is irradiated with ultraviolet light from the irradiation port 48a so that the functional liquid 54 containing a curing agent is solidified or cured.

(Storage section)
FIG. 5A is a schematic front view showing the storage portion, and FIG. 5B and FIG. 5C are schematic side views showing the storage portion. As shown in FIGS. 5A and 5B, the storage unit 12 includes a base 74. An elevating device 75 is installed inside the base 74. As the lifting device 75, the same device as the lifting device 16 installed in the supply unit 8 can be used. A lifting plate 76 is connected to the lifting device 75 on the upper side of the base 74. The lifting plate 76 is lifted and lowered by the lifting device 75. A rectangular parallelepiped storage container 18 is installed on the lifting plate 76, and the semiconductor substrate 1 is stored in the storage container 18. The same container as the storage container 18 installed in the supply unit 8 is used as the storage container 18.

  The semiconductor substrate 1 placed on the rail 12 b as a relay place by the transport unit 13 is moved from the rail 12 b to the storage container 18 by the transport unit 13. Or after moving to the middle of the storage container 18 from the rail 12b by the transport unit 13, for example, as shown in FIG. 5C, located below the rail 12b, between the rails 12b, 12b in the Y direction, An extrusion device 80 having the same configuration as the extrusion device 23 and capable of being raised to a position facing the semiconductor substrate 1 in the middle position by a lifting device (not shown) is provided, and the transfer unit 13 moves the semiconductor substrate 1 to the rail 12b. When the transfer unit 13 is retracted from the rail 12b, the extrusion device 80 is lifted so as to face the side surface of the semiconductor substrate 1 and the extrusion pin. The semiconductor substrate 1 may be moved to the storage container 18 by projecting 23a in the + X direction.

  As described above, a predetermined number of semiconductor substrates 1 are stored in the storage container 18 by repeatedly storing the semiconductor substrate 1 in the storage container 18 and moving the storage container 18 in the Z direction by the lifting device 75. After that, the operator replaces the storage container 18 in which the semiconductor substrate 1 is stored with the empty storage container 18. Thus, the operator can carry the plurality of semiconductor substrates 1 together to the next process.

(Transport section)
Next, the transport unit 13 for transporting the semiconductor substrate 1 will be described with reference to FIGS. 1, 6 and 7.
The transport unit 13 includes a support body 83 provided on the top of the apparatus, and a rotation mechanism including a motor, an angle detector, a speed reducer, and the like is installed inside the support body 83. The output shaft of the motor is connected to the speed reducer, and the output shaft of the speed reducer is connected to the first arm portion 84 disposed below the support body 83. In addition, an angle detector is installed in connection with the output shaft of the motor, and the angle detector detects a rotation angle around an axis parallel to the Z direction (third direction) of the output shaft of the motor. Accordingly, the rotation mechanism can detect the rotation angle of the first arm portion 84 and rotate it to a desired angle.

  A rotation mechanism 85 is installed on the first arm portion 84 at the end opposite to the support body 83. The rotation mechanism 85 includes a motor, an angle detector, a speed reducer, and the like, and has the same function as the rotation mechanism installed inside the support body 83. The output shaft of the rotation mechanism 85 is connected to the second arm portion 86. Accordingly, the rotation mechanism 85 can detect the rotation angle of the second arm portion 86 and rotate it to a desired angle.

  On the second arm portion 86, a lifting device 87 and a rotation mechanism (drive unit) 88 are disposed at the end opposite to the rotation mechanism 85. The elevating device 87 includes a linear motion mechanism, and the grip portion 13a can be moved up and down with respect to the second arm portion 86 by expanding and contracting in the Z direction by driving the linear motion mechanism. For this linear motion mechanism, for example, a mechanism similar to the lifting device 16 of the supply unit 8 can be used. The rotation mechanism 88 has the same configuration as the rotation mechanism 85 described above, and rotates the grip portion 13a around the axis 13c (see FIG. 6C) parallel to the Z direction with respect to the second arm portion 86. .

6A is a front view in which the grip portion 13a is provided on the −Z side of the arm portion 13b, FIG. 6B is a plan view (however, the arm portion 13b is not shown), and FIG. 6C. Is a left side view.
The gripping portion 13a is provided so as to be able to rotate and move in the θZ direction (rotation direction about the Z axis) with respect to the arm portion 13b by the rotation mechanism 88, and the position in the XY plane varies. A direction parallel to the XY plane will be described as the x direction, and a direction parallel to the XY plane and orthogonal to the x direction will be described as the y direction (Z direction is common).

  The grip portion 13a is rotatable in the θZ direction with respect to the arm portion 13b, and is provided so as to be movable in the Z direction with respect to the fixed portion 100 used in a fixed state when the semiconductor substrate 1 is gripped. The moving part 110 is provided.

  The fixed portion 100 is mainly configured by a Z-axis member 101, a suspension member 102, a connecting member 103, a connecting plate (connecting portion) 104, a supporting plate (supporting portion) 105, and a fork portion 106. The Z-axis member 101 extends in the Z direction and is provided on the arm portion 13b so as to be rotatable around the Z axis. The suspension member 102 is formed in a plate shape extending in the x direction, and is fixed to the lower end of the Z-axis member 101 at the center in the x direction.

  The connecting plate 104 is arranged in parallel with the suspension member 102 with a gap therebetween, and is connected by the connecting member 103 at both ends in the x direction. At both ends in the x direction of the connecting plate 104, notches 108 are formed penetrating in the y direction at a depth (width in the Z direction) to which the semiconductor substrate 1 is fitted. As shown in FIG. 6A, the notch 108 and the support surface 105a of the support portion 105 form a groove 107 having a rectangular shape when viewed from the front and opening outward in the x direction and having a predetermined depth inside. The

  The support plate 105 is formed in a plate shape extending in the x direction, and is connected to the lower end of the connection plate 104 at the + y side edge on the + Z side surface, as shown in FIG. . The surface on the + Z side of the support plate 105 is formed in parallel with the x direction and the y direction, and serves as a support surface 105 a when gripping the semiconductor substrate 1.

  The fork portion 106 supports the lower surface (the surface on the −Z side) of the semiconductor substrate 1 held by the support surface 105a from below, and extends from the −y side surface of the support plate 105 in the y direction. And a plurality (four in this case) are provided at intervals in the x direction. The arrangement interval and the number of the fork portions 106 are set so that they can be supported at least at one place, preferably at two or more places in the length direction even when the length of the semiconductor substrate 1 varies depending on the model.

  The moving part 110 is mainly composed of an elevating part 111 and a clamping plate (clamping part) 112. The elevating unit 111 is composed of an air cylinder mechanism or the like and moves up and down along the Z-axis member 101. The sandwiching plate 112 is provided so as to be able to move up and down integrally with the lifting unit 111, and is shorter than the gap length in the x direction between the connecting members 103 and 103, and is shorter than the gap between the suspension member 102 and the connecting plate 104. An insertion portion 112a having a small width and inserted in the gap between the connection members 103 and 103 and the gap between the suspension member 102 and the connection plate 104 so as to be movable in the Z direction, and below the insertion portion 112a A sandwiching plate 112b that is positioned below the suspension member 102 and extends in the x-direction with substantially the same length as the support plate 105 is integrally formed.

  The sandwiching plate 112 composed of the insertion portion 112a and the sandwiching plate 112b moves integrally in the Z direction in accordance with the elevation of the elevation unit 111. When the sandwiching plate 112 is lowered, one edge of the semiconductor substrate 1 can be sandwiched and held between the support plate 105 and when the sandwiching plate 112 is lifted, it is separated from the support plate 105. The grip on the semiconductor substrate 1 is released.

  With the support plate 105 and the sandwiching plate 112 capable of gripping the semiconductor substrate 1, the support surface 105 a is positioned in the gap between the support plate 105 and the sandwiching plate 112 and on the −y side of the connection plate 104. A first gripping portion H1 having a first gripping region 13d that continuously extends in the x direction with a width of is configured. As shown in FIG. 6B, the length L1 of the support plate 105, the clamping plate 112, and the gripping region 13d is formed to be longer than the length L2 of the fork portion 106. Further, the total length in the y direction of the fork portion 106, the connecting plate 104, and the support portion 105 is formed to be shorter than the gap between the rails 8b shown in FIG. And the support part 105 can move to a Z direction through the said clearance gap.

  Further, the connecting plate 104 and the support plate 105 that form the groove 107 to be fitted and gripped with the inserted semiconductor substrate 1, and the semiconductor substrate 1 that extends from the groove 107 on the −y side extension line from the groove 107. The support plate 105 and the holding plate 112 capable of gripping a second portion constitute a second grip portion H2 having a second grip region 13e extending in the y direction with a length approximately equal to the width of the support plate 105. That is, the support plate 105 and the clamping plate 112 are shared by the first gripping portion H1 and the second gripping portion H2, and a part of the second gripping region 13e forms a first gripping region 13d. 105 and the sandwiching plate 112.

  In the present embodiment, the rotation center axis (axis) 13c when the gripping portion 13a is rotated by the rotation mechanism 88 is shown in FIG. 6C regarding the y direction that is the length direction of the fork portion 106. In this way, it is set so as to be located in the region where the fork portion 106 is arranged. Further, the rotation center axis 13c is arranged at the approximate center of the gripping region 13d with respect to the x direction, which is the length direction of the support plate 105 and the holding plate 112, as shown in FIG.

  When the semiconductor substrate 1 is transported by the first gripping portion H1 in the transport unit 13, the fork unit 106 supports the semiconductor substrate 1 from below, so that the transported semiconductor substrate 1 is placed on the surface. The first and second relay locations 9a and 9b of the pre-processing unit 9, the processing locations 11a and 11b of the cooling unit 11, and the first and second relay locations 14a and 14b of the post-processing unit 14 (hereinafter referred to as the mounting unit 140). As shown in FIG. 7, a groove portion 141 is provided at a position corresponding to the fork portion 106 during conveyance. A plurality of suction portions 142 for sucking and holding the semiconductor substrate 1 placed on the placement portion 140 are disposed near the groove portion 140 in the placement portion 141.

FIG. 8 is a block diagram of a control system related to the printing apparatus 7.
As shown in FIG. 8, the control unit CONT receives the detection result of the detection unit 90, and supplies the above-described supply unit 8 (extrusion device 23), pre-processing unit 9, application unit 10, post-processing unit 14, The operations of the storage unit 12 and the conveyance unit 13 are comprehensively controlled.

(Printing method)
Next, a printing method using the above-described printing apparatus 7 will be described with reference to FIG. FIG. 9 is a flowchart for illustrating a printing method.
As shown in the flowchart of FIG. 9, the printing method includes a carry-in process S <b> 1 for carrying in the semiconductor substrate 1 from the storage container 18, a pre-treatment process S <b> 2 for pre-treating the surface of the semiconductor substrate 1 carried in, Cooling step S3 for cooling the semiconductor substrate 1 whose temperature has increased in step S2, printing step S4 for drawing and printing various marks on the cooled semiconductor substrate 1, and post-processing for the semiconductor substrate 1 printed with various marks The post-processing step S5 to be performed and the storage step S6 for storing the post-processed semiconductor substrate 1 in the storage container 18 are mainly configured.

  When the semiconductor substrate 1 is processed in each of the above steps, first, in the transport unit 13, the connecting plate 104 and the support plate 105 extend in the X direction as shown in FIG. The holding part 13a is lowered through the gap of the rail 8b until the opening in the groove part 107 on the -x side faces the edge of the semiconductor substrate 1 in the vicinity of the delivery position CH1. At this time, the clamping plate 112 is separated from the support plate 105 by a distance equal to or larger than the width of the groove portion 107 in the Z direction.

  Next, as illustrated in FIG. 2C, in the supply unit 8, the push pin 23 a protrudes in the + X direction and pushes the semiconductor substrate 1 from the storage container 18 toward the delivery position CH <b> 1. The arrival information of the semiconductor substrate 1 at the delivery position CH1 is detected by the detection unit 90 and output to the control unit CONT. When the control unit CONT determines that the semiconductor substrate 1 has reached the delivery position CH1, the control unit CONT stops the pushing operation of the semiconductor substrate 1 by the pushing device 23 and returns the pushing pin 23a to the standby position shown in FIG. .

  When the semiconductor substrate 1 is positioned at the delivery position CH1, the control device CONT moves the grip portion 13a in the −X direction, and inserts the + X side edge of the semiconductor substrate 1 into the groove portion 107 in the delivery portion CH1. As shown in FIG. 10B, the holding plate 112 is lowered to hold the semiconductor substrate 1 located in the gap between the rails 8 b with the support plate 105. Thereby, the semiconductor substrate 1 is gripped between the support plate 105 and the sandwiching plate 112 on the −y side of the groove portion 107 while the edge of the short side on the + X side is fitted and held in the groove portion 107. . In other words, the + X side edge of the semiconductor substrate 1 is gripped in the second gripping region 13e extending in the Y direction in the second gripping portion H2.

  Subsequently, by moving the grip portion 13a in the + X direction, as shown in FIG. 10C, the semiconductor substrate 1 is completely pulled out from the storage container 18, and the semiconductor substrate 1 is moved in the −Z direction by a small amount. The substrate 1 is placed and supported on the rail 8b. At this time, the position where the semiconductor substrate 1 is placed on the rail 8b is a position at which the side edge of the semiconductor substrate 1 can be gripped by the first gripping portion H1 in the gripping portion 13a, as shown in FIG. In other words, it is the switching position CH2 for switching the gripping of the semiconductor substrate 1 from the second gripping part H2 to the first gripping part H1.

  The gripping portion 13a that has moved the semiconductor substrate 1 to the switching position CH2 lifts the holding plate 112 to release the gripping of the semiconductor substrate 1 from the support plate 105, and further moves the gripping portion 13a in the + X direction. Thus, the fitting / gripping of the semiconductor substrate 1 to the groove 107 is released.

  When the gripping of the semiconductor substrate 1 by the gripping part 13a (second gripping part H2) is released, the gripping part 13a rises and separates from the gap of the rail part 8b, and as shown in FIG. After moving to a position facing the + Y side edge of the substrate 1, the gap between the support plate 105 and the sandwiching plate 112 is the edge on the + Y side of the semiconductor substrate 1, as in the case of gripping by the second gripping portion H <b> 2. Descends to the opposite position.

  Thereafter, similarly to the case shown in FIG. 7A, after the transport unit 13a is moved in the −Y direction until the edge of the semiconductor substrate 1 is located between the support plate 105 and the sandwiching plate 112, The clamping plate 112 is lowered and the edge of the long side on the + Y side of the semiconductor substrate 1 is gripped in the first gripping region 13d of the first gripping portion H1 between the support plate 105 and the fork portion 106 from below. To support.

  At this time, since the length of the gripping region 13d is larger than the length of the fork portion 106 and larger than the long side of the semiconductor substrate 1, for example, even when the semiconductor substrate 1 is warped due to heating during pretreatment. By holding the one side edge of the semiconductor substrate 1 in a lump, it can be stably held in a state where the warp is corrected.

  Then, after the gripping portion 13a is moved to a predetermined height by the lifting device 87, the semiconductor substrate 1 gripped by the gripping portion 13a is driven by controlling the rotation angle of the rotation mechanisms 85, 88, etc. It moves along the XY plane to a position facing the mounting part 140.

  At this time, the gripping portion 13a rotates around the rotation center axis 13c by the operation of the rotation mechanism 88. However, since the rotation center axis 13c is located in a region where the fork portion 106 is disposed in the y direction, that is, Since the semiconductor substrate 1 is located in the region where the semiconductor substrate 1 is supported, for example, the rotation center axis 13c is compared with the case where the rotation center axis 13c is located in the gripping region 13d formed by the sandwiching plate 112 and the support plate 105. The distance from the outer edge of the semiconductor substrate 1 is shortened. That is, the radius of rotation when the semiconductor substrate 1 rotates is reduced, and as a result, the centrifugal force acting on the semiconductor substrate 1 is reduced.

Similarly, when the gripping portion 13a is rotated around the rotation center axis 13c, the rotation center axis 13c is disposed at the approximate center of the gripping region 13d in the x direction, and therefore the outer edge of the semiconductor substrate 1 from the rotation center axis 13c. The distance to the portion is shortened, and the radius of rotation when the semiconductor substrate 1 is rotationally moved is reduced. As a result, the centrifugal force acting on the semiconductor substrate 1 is reduced.
That is, with the rotation of the gripping portion 13a and the semiconductor substrate 1, it is possible to avoid an increase in the size of the apparatus by reducing the separation distance of peripheral devices in order to avoid interference with the semiconductor substrate 1, and by centrifugal force. The semiconductor substrate 1 can be prevented from being displaced with respect to the grip portion 13a, and stable conveyance can be performed. In addition, since the gripping force (clamping force) with respect to the semiconductor substrate 1 can be reduced, the driving force of the elevating unit 111 can also be reduced, and further miniaturization can be achieved.

  The transport unit 13 that transports the semiconductor substrate 1 to a position facing the predetermined mounting unit 140 lowers the gripping unit 13 a by driving the lifting device 87, and as shown in FIG. The semiconductor substrate 1 is delivered to the surface. At this time, since the groove portion 141 is formed in the placement portion 140 at a position and size corresponding to the fork portion 106, the fork portion 106 enters the groove portion 141 when the semiconductor substrate 1 is delivered, Interference is avoided.

  The semiconductor substrate 1 delivered to the surface of the mounting part 140 is subjected to a predetermined process (for example, a cooling process) while being sucked and held on the surface of the mounting part 140 by the suction part 142, or a coating process. Or is transported to a stage where pre-processing is performed.

  The semiconductor substrate 1 transported by the transport unit 13 described above is subjected to pretreatment of the semiconductor substrate 1 (surface modification treatment in a heated state) in the pretreatment step S2, and after cooling in the cooling step S3, printing is performed. In step S4, various marks are printed on the semiconductor device 3. The semiconductor substrate 1 on which the various mark printing processing has been performed is subjected to post-processing in the post-processing step S 5, then stored in the storage container 18 in the storage step S 6, and unloaded via the storage container 18.

  As described above, in this embodiment, since the semiconductor substrate 1 is pushed out and moved by the linear motion extrusion device 23, a complicated device is not necessary, which can contribute to the downsizing and cost reduction of the device and the semiconductor. After the detection unit 90 detects that the substrate 1 has been positioned at the delivery position CH1, the gripping unit 13a grips the semiconductor substrate 1, so that the semiconductor substrate 1 cannot be received or the semiconductor substrate 1 is damaged. It can be delivered smoothly without causing it. In the present embodiment, since the detection unit 90 is disposed below the delivery position CH1, information regarding the position of the semiconductor substrate 1 can be smoothly obtained without hindering the delivery of the semiconductor substrate 1 by the transport unit 13. It becomes possible to detect.

  In the present embodiment, the grip portion 13a includes the first grip portion H1 and the second grip portion H2, and the first grip region 13d of the first grip portion H1 and the second grip of the second grip portion H2. Since the region 13e extends in a different direction, the optimum position can be held and stably conveyed according to the size and outer shape of the semiconductor substrate 1. In particular, in this embodiment, since the length of the second gripping region 13e is shorter than the length of the first gripping region 13d, the grippable region of the semiconductor substrate 1 at the delivery position CH1 is narrow, and the first gripping portion H1 grips the gripping region. Even if this is not possible, the semiconductor substrate 1 is gripped by the second gripping part H2 and transported to the switching position CH2 that can be gripped by the first gripping part H1, and the first gripping part H1 having a long gripping area at the switching position CH2 is used for semiconductor By gripping the substrate 1, stable conveyance to each processing apparatus is possible.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above-described embodiment, the configuration in which the first gripping region 13d and the second gripping region extend in directions orthogonal to each other is illustrated, but the present invention is not limited to this. For example, the outer shape of the semiconductor substrate 1 is curved. In the case of an oblique line, a configuration may be adopted in which either the first grip region or the second grip region is extended in the curve direction or the oblique line direction.

  Moreover, in the said embodiment, although the detection part 90 was provided below the delivery position CH1 and illustrated the structure which detects the positional information on the semiconductor substrate 1 using a detection light or the change of an electrostatic capacitance, For example, an imaging device may be provided above the delivery position CH1, and the position information of the semiconductor substrate 1 may be detected using the result of imaging the semiconductor substrate 1 with the imaging device.

Further, at least one of the support plate 105 and the sandwiching plate 112 shown in the above embodiment may be formed of a conductive material.
In this case, adverse effects of static electricity on the semiconductor substrate 1 can be eliminated, and damage to the semiconductor device 3 and the like due to static electricity can be avoided. As for the support plate 105 and the sandwiching plate 112, at least one of them may be made of metal, may be formed of a conductive film on the surface, or may be made of conductive rubber. Moreover, you may perform an electroconductive process with a predetermined material.

In the above embodiment, the ultraviolet curable ink is used as the UV ink. However, the present invention is not limited to this, and various active light curable inks that can use visible light and infrared light as the curable light are used. be able to.
Similarly, various active light sources that emit active light such as visible light can be used as the light source, that is, an active light irradiation unit can be used.

  Here, in the present invention, the “actinic ray” is not particularly limited as long as it can impart energy capable of generating a starting species in the ink by the irradiation, and is broadly divided into α rays, γ rays, X-rays, ultraviolet rays, visible rays, electron beams and the like are included. Among these, from the viewpoints of curing sensitivity and device availability, ultraviolet rays and electron beams are preferable, and ultraviolet rays are particularly preferable. Therefore, as the actinic ray curable ink, it is preferable to use an ultraviolet curable ink that can be cured by irradiating ultraviolet rays as in the present embodiment.

  The semiconductor substrate 1 as a base material in the above embodiment is the substrate 2 on which the semiconductor device 3 is mounted, but may be a substrate formed of a semiconductor such as silicon. The semiconductor device 3 as a recording medium may be a semiconductor device molded with resin, or may be a semiconductor device itself.

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor substrate (base material), 3 ... Semiconductor device, 7 ... Printing apparatus, 9 ... Pre-processing part, 10 ... Application | coating part (printing part, discharge device), 13c ... Center axis of rotation (axis line), 13d ... 1st Gripping area 13e 2nd grasping area 14 Post-processing section 18 Storage container (storage section) 23 Extruding device (extruding section) 45 Carriage (moving means) 48 Curing unit (irradiating section) 49: Droplet ejection head (ejection head), 52 ... Nozzle, 54 ... Functional liquid (liquid), 57 ... Droplet, 88 ... Rotation mechanism (drive unit), 90 ... Housing, 90a ... Opening, 92 ... Cover Numeral 93: Holding device 96: Fixing member 97: Fastening member 97b: Head part (gripping part) 104 ... Connection plate (connection part) 105 ... Support plate (support part) 105a ... Support surface 106 ... fork, 1 07: Groove portion, 112: Nipping plate (clipping portion), 140: Placement portion, 141: Groove portion, CONT ... Control portion, CH1: Delivery position, CH2: Switching position, H1: First gripping portion, H2: Second gripping Part

Claims (7)

An extrusion unit for extruding the base material stored in the storage unit toward the delivery position;
A transport unit for transporting the base material pushed to the delivery position;
A detection unit for detecting information related to the position of the base material pushed toward the delivery position;
Based on the detection result of the detection unit, a control unit that controls the operation of the extrusion unit and the transport unit,
The transport unit includes a first gripping unit that grips the base material when transporting the base material to a processing apparatus that performs processing related to printing;
A printing apparatus comprising: a second grip portion that grips the base material when the base material is transported to a switching position where the base material is gripped by the first grip portion from the delivery position . The printing apparatus according to claim 1.
The printing apparatus, wherein the pushing portion pushes an end face located on a side opposite to an end face facing the delivery position in the base material. The printing apparatus according to claim 1 or 2,
The printing apparatus, wherein the detection unit is disposed below the delivery position. The printing apparatus according to any one of claims 1 to 3 ,
The first grip portion has a first grip region extending in a first direction and gripping the base material,
The second gripping portion is disposed on one end side of the first gripping region, and has a second gripping region that extends in a second direction intersecting the first direction and grips the base material. Printing device. The printing apparatus according to claim 4 .
The length of the said 2nd holding | grip area | region is shorter than the length of the said 1st holding | grip area, The printing apparatus characterized by the above-mentioned. The printing apparatus according to any one of claims 1 to 5 ,
The printing process includes a discharge process for discharging liquid droplets that are cured with actinic rays on the substrate transported by the transport unit. The printing apparatus according to claim 6 .
A printing apparatus, wherein the droplets are applied to a semiconductor device provided on a surface of the substrate.

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