JP5279554B2 - Substrate processing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet type substrate conveyance apparatus whose structure can be made simple and which is reducible in occupation area. <P>SOLUTION: The sheet type substrate conveyance apparatus 5 includes a first sheet band 45, a second sheet band 46, a first moving-forward/backward mechanism, a second moving-forward/backward mechanism, an integral moving mechanism, a relative moving mechanism, and a sheet band moving mechanism. The first moving-forward/backward mechanism can move the first sheet band 45 forward and backward in a first horizontal direction D1. The second moving-forward/backward mechanism can move the second sheet band 46 forward and backward in a second horizontal direction D2 in direct opposition to the first horizontal direction D1. The integral moving mechanism can move the first and second sheet bands 45 and 46 in one body in a perpendicular direction. The relative moving mechanism can move the first and second sheet bands 45 and 46 relatively in the perpendicular direction. The sheet band moving mechanism can move the first and second sheet bands 45 and 46 in one body in an X direction. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a single-wafer type substrate transfer apparatus for transferring a single substrate. Examples of substrates to be transported include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photo A mask substrate is included.

2. Description of the Related Art A substrate processing apparatus that performs processing using a chemical solution on a substrate such as a semiconductor wafer includes a batch type that performs processing on a plurality of substrates at once. An example of a batch type substrate processing apparatus is shown in Patent Document 1 below. This substrate processing apparatus includes a carrier mounting unit, a horizontal transfer robot, a posture changing mechanism, a pusher, a main transfer mechanism, and a substrate processing unit.
The carrier placement unit places a carrier (container) that holds a plurality of substrates in a horizontal posture and stacked in a vertical direction.

  The horizontal transfer robot is composed of a vertical articulated arm type transfer robot, and is configured to expand and contract the articulated arm and turn it around a vertical axis. As a result, the horizontal transfer robot points the articulated arm toward the carrier, puts and removes a plurality of substrates stacked vertically in the horizontal posture with respect to the carrier, and further converts the articulated arm into a posture changing mechanism. For this, a plurality of substrates stacked in the vertical direction in a horizontal posture are transferred to the posture changing mechanism.

The posture changing mechanism is for changing the posture of a plurality of stacked substrates at once between a horizontal posture and a vertical posture.
The pusher is equipped with a holder that can move up and down and move horizontally, and delivers a plurality of substrates in a vertical posture to and from the posture changing mechanism at once, and a plurality of substrates in a vertical posture to and from the main transport mechanism. Deliver in bulk.

The main transport mechanism has a substrate chuck that holds a plurality of (for example, 50) substrates forming a batch in a vertical posture, and a plurality of substrates constituting the batch by moving the substrate chuck in the horizontal direction. Are carried into / out of the substrate processing unit.
The substrate processing unit has a plurality of processing tanks arranged along the moving direction of the main transport mechanism. The treatment tank includes a chemical tank, a water washing tank, and a drying tank. In the chemical tank, a plurality of substrates in a vertical posture are immersed in a chemical stored in the tank, and the plurality of substrates are collectively subjected to a chemical treatment. A water rinsing tank immerses a plurality of substrates in a vertical position in pure water (deionized water) stored in the tank and performs a rinsing process on the plurality of substrates at once. is there. The drying tank collectively performs a process of supplying an organic solvent (for example, isopropyl alcohol) or shaking off a liquid component on a plurality of substrates.

  In the apparatus of Patent Document 1, the horizontal transfer robot includes a batch hand and a single-wafer hand that are attached to and detached from the articulated arm. The batch hand is used to transfer a plurality of substrates at once, and the single-wafer hand is used to transfer substrates one by one. The hand exchange is performed by the horizontal transfer robot accessing the hand exchange unit. The hand exchange unit includes three hand holders for holding a batch hand, a single-wafer hand for an unprocessed substrate, and a single-wafer hand for a processed substrate. For example, when removing a batch hand and mounting a single-wafer hand, the horizontal transfer robot stores the batch hand in the batch-hand hand holder and mounts the single-wafer hand stored in the single-wafer hand holder. To work. As a result, the hands can be automatically exchanged without requiring human intervention.

JP-A-11-354604

  In the above-described prior art, when a single substrate is transported (single-wafer transport) by the horizontal transfer robot, a multi-joint with a single-wafer hand for an unprocessed substrate or a processed substrate mounted. The arm is extended and retracted and swiveled. That is, a vertical articulated arm type transfer robot is applied as a part of the configuration for carrying single wafers. However, the vertical articulated arm type robot is expensive because of its complicated structure, and has a substantial occupation area because it turns in transporting the substrate. Furthermore, in order to move the substrate in the horizontal direction by the vertical articulated arm type robot, it is necessary to drive a plurality of drive shafts synchronously, so when trying to transport the substrate at a high speed, vibration occurs in the hand, There is a risk of poor conveyance.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a single-wafer type substrate transfer apparatus that can be simplified in structure and can occupy a small area.

The invention described in claim 1 for achieving the above object includes : a container holding unit that holds a plurality of substrates in a state of being stacked in a vertical posture in a horizontal posture; and a container holding unit that holds the container. A batch hand that collectively carries out a plurality of substrates from the container that is held, a hand advance / retreat mechanism that moves the batch hand on a movement path including a position where the container is disposed, and the movement path A single-wafer type substrate transport apparatus that unloads one arbitrary substrate from a plurality of substrates held in the container at the transport position provided in the container, the transport position, and a standby position outside the movement path; And a single wafer hand moving mechanism for moving the substrate transfer device between them.
2. The substrate transport apparatus according to claim 1, wherein the substrate transport apparatus moves a first single-wafer hand holding one substrate, a second single-wafer hand holding one substrate, and the first single-wafer hand in a first horizontal direction. A first advancing / retreating mechanism for moving forward and backward between a forward position and a backward position toward the front, and a forward position in the container toward the second horizontal direction opposite to the first horizontal direction. A second advancing / retreating mechanism that moves forward and backward between the retracted position outside the container, an integral moving mechanism that integrally moves the first and second single-wafer hands in a vertical direction, and between the first and second single-wafer hands A relative movement mechanism for relatively moving the first and second single-wafer hands in a vertical direction.
The invention according to claim 2 is a container holding unit for holding a container for holding a plurality of substrates in a state of being stacked in a vertical posture in a horizontal posture, and the container held in the container holding unit. A batch hand that collectively loads a plurality of substrates into a container, a hand advance / retreat mechanism that moves the batch hand on a movement path including a position where the container is disposed, and a transport provided in the movement path In the position, the substrate transport between the single-wafer type substrate transport device for unloading an arbitrary substrate from the plurality of substrates held in the batch hand, and the standby position outside the movement path A substrate processing apparatus including a single wafer hand moving mechanism for moving the apparatus.
3. The substrate transport device according to claim 2, wherein the substrate transport device includes a first single-wafer hand that holds one substrate, a second single-wafer hand that holds one substrate, and the first single-wafer hand in a first horizontal direction. A first advancing / retracting mechanism for moving the second sheet hand forward and backward between a forward position in the batch hand and a retracted position outside the batch hand, and a second horizontal direction opposite to the first horizontal direction. A second advancing / retreating mechanism that moves forward and backward between a forward position and a retreating position, an integral moving mechanism that integrally moves the first and second single-wafer hands in a vertical direction, and the first and second single-wafer hands A relative movement mechanism for relatively moving the first and second single-wafer hands in a vertical direction .

  According to this configuration, the first advancing / retreating mechanism can move the first single-wafer hand forward and backward between the forward movement position and the backward movement position in the first horizontal direction, and the second horizontal movement mechanism can move the first horizontal direction. The second single-wafer hand can be moved back and forth between the forward movement position and the backward movement position in the second horizontal direction opposite to the above. Further, the first and second single-wafer hands can be moved along the vertical direction by the integral movement mechanism, and the first and second single-wafer hands can be relatively moved in the vertical direction by the relative movement mechanism. . Substrate conveyance by the substrate conveyance device is performed by combining these operations.

  Specifically, for example, the first single-wafer hand is moved in the first horizontal direction by the first advancing / retreating mechanism in a state where the first single-wafer hand holding one substrate is opposed to a predetermined transfer target place. Advance along. As a result, the first single-wafer hand enters the transfer target place while holding one substrate. Then, the first and second single-wafer hands are moved along the vertical direction by the integral moving mechanism in a state where the first single-wafer hand has entered the transfer target place. Thereby, one board | substrate is carried in with respect to a conveyance object place. The same is true for substrate conveyance using the second single-wafer hand.

  Thus, in the substrate transfer apparatus according to the present invention, one substrate can be transferred by moving at least one of the first and second single-wafer hands along the horizontal direction and the vertical direction. That is, since a single substrate can be transported by a relatively simple operation, a vertically articulated arm type robot having a complicated structure as in the prior art is not required. Therefore, the structure can be simplified and the number of parts can be reduced as compared with a single-wafer type substrate transfer apparatus to which a vertical articulated arm type robot is applied. Thereby, the cost of a board | substrate conveyance apparatus can be reduced significantly. In addition, since it is not necessary to turn the first and second single-wafer hands during substrate transport, the area occupied by the substrate transport apparatus can be reduced. Further, unlike the case of the vertical articulated arm type robot, it is not necessary to synchronously drive a plurality of drive shafts, so that the vibration of the single-wafer hand during substrate transfer can be reduced. Thereby, a board | substrate can be hold | maintained stably.

  Furthermore, according to this configuration, the first and second horizontal directions are opposite to each other, and the first and second single-wafer hands are moved relative to each other in the vertical direction by the relative movement mechanism. Since the board can be transferred between the second single-wafer hands, the board transport distance by each single-wafer hand (the horizontal distance between the advance position and the retreat position of each single-wafer hand) must not be increased. In addition, by transporting the substrate in cooperation with the first and second single-wafer hands, a sufficient substrate transport distance can be ensured as a whole. Thereby, a sufficient substrate transport distance can be secured while suppressing or preventing an increase in the size of the substrate transport apparatus. In addition, it is possible to reduce the size of the substrate transfer device while ensuring a substrate transfer distance of a certain value or more, and to reduce the area occupied by the substrate transfer device.

Third aspect of the present invention, the first and second sheet-fed hand, when in the retracted position, is formed in a shape to mesh with each other so as not to overlap when viewed from the vertical direction, according to claim 1 or 2. The substrate processing apparatus according to 2 .
According to this configuration, when the first and second single-wafer hands are in the retracted positions, the first and second single-wafer hands are shaped so as not to overlap each other when viewed from the vertical direction. Can be relatively moved in the vertical direction by the relative movement mechanism without causing the first and second single-wafer hands to collide with each other. Thereby, when the 1st and 2nd single wafer hand exists in each retreat position, the up-and-down relation of the 1st and 2nd single wafer hand can be reversed. Accordingly, if the substrate is held by the upper single-wafer hand before the relative movement, the held substrate is removed from one of the single-wafer hands in the process of reversing the vertical relationship of the first and second single-wafer hands. It can be moved to the other single-wafer hand. Thus, the substrate can be transferred between the first and second single-wafer hands by a simple operation of relative movement in the vertical direction. That is, a mechanism having a simple structure can be used as the relative movement mechanism, and the structure of the substrate transfer apparatus can be simplified. Thereby, the cost of a board | substrate conveyance apparatus can be reduced.

  In addition, according to this configuration, the positions where the first and second single-wafer hands are engaged with each other so that they do not overlap when viewed from the vertical direction are set as the retracted positions of the single-wafer hands. The two-leaf hand advances from the position where the two-piece hand is engaged to the advance position in the opposite direction. Accordingly, by transporting the substrate in cooperation with the first and second single-wafer hands, the substrate can be transported between the advance position of the first single-wafer hand and the advance position of the second single-wafer hand. . Thereby, even if the board | substrate conveyance distance by each single wafer hand is not taken large, the board | substrate conveyance distance sufficient as a whole can be ensured.

According to a fourth aspect of the present invention, each of the first and second single-wafer hands has a first support member for holding the substrate at the first holding position, and the first holding position when viewed from the vertical direction. And a second support member for holding the substrate at a second holding position that overlaps, the first support member being provided so as not to contact the substrate held at the second holding position, the support member is provided so as not to contact the substrate held by the first holding position, a substrate processing apparatus according to any one of claims 1-3.

  According to this configuration, two substrate holding positions (a first holding position and a second holding position) that are partially overlapped when viewed from the vertical direction are set for each single-wafer hand. Further, in each single wafer hand, the first support member is provided so as not to contact the substrate held at the second holding position, and the second support member contacts the substrate held at the first holding position. It is provided not to. Therefore, the space on each single-wafer hand is used effectively, and even when a plurality of substrate holding positions are set on one single-wafer hand, it is possible to suppress or prevent the single-wafer hand from becoming large. In addition, the first and second support members can be properly used, and thereby, for example, individual support members can be assigned to the unprocessed substrate and the processed substrate.

The invention according to claim 5 is a first detection means for detecting the presence or absence of a substrate on the first single-wafer hand, and a second for detecting the presence or absence of a substrate on the second single-wafer hand. further comprising a detection means, a substrate processing apparatus according to any one of claims 1-4.
According to this configuration, it is possible to detect the presence / absence of a substrate on the first and second single-wafer hands by the first and second detection means, respectively. Thereby, it is possible to reliably detect whether or not the substrate has moved when the substrate is carried in and out by each single-wafer hand or when the substrate is delivered between the first and second single-wafer hands.
According to a sixth aspect of the present invention, the substrate transfer device guides the first single-wafer hand in the first horizontal direction and guides the second single-wafer hand in the second horizontal direction. A linear guide shared by the first and second advance / retreat mechanisms may be further included.
According to a seventh aspect of the present invention, the substrate transfer device may further include a base plate that is disposed along a vertical plane and to which the first and second advance / retreat mechanisms are attached.
According to an eighth aspect of the present invention, the substrate transfer apparatus may further include a first arm that supports the first single-wafer hand and a second arm that supports the second single-wafer hand. . The first arm is opposed to the second sheet hand in the second horizontal direction in a state where the second sheet hand is in the retracted position, and has a size that allows the second sheet hand to enter. The 1st notch part of this may be formed. The second arm is opposed to the first single-wafer hand in a first horizontal direction in a state where the first single-wafer hand is in the retracted position, and is large enough to allow the first single-wafer hand to enter. The 2nd notch part of this may be formed.
According to a ninth aspect of the present invention, the advance position of the first single-wafer hand is such that the first single-wafer hand enters the second notch and the first single-wafer hand and the second arm are It may be a position overlapping vertically. The advance position of the second single-wafer hand may be a position where the second single-wafer hand enters the first notch and the second single-wafer hand and the first arm overlap vertically.

1 is a schematic plan view for explaining an overall configuration of a substrate processing apparatus according to an embodiment of the present invention. It is a perspective view which expands and shows the structure relevant to the board | substrate conveyance between a hoop and the main conveyance mechanism. It is an illustrative perspective view for explaining a first advance / retreat mechanism, a second advance / retreat mechanism, and a relative movement mechanism. FIG. 3 is a schematic external view for explaining an integral moving mechanism and a single-wafer hand moving mechanism. It is an illustrative perspective view showing a part of the first and second single-wafer hands and the first and second arms. It is an illustration top view of a part of the 1st single wafer hand and the 1st arm. It is an illustration enlarged view of the tip part of the 1st sheet hand. It is an illustration top view of a part of the 2nd single wafer hand and the 2nd arm. It is an illustrative perspective view for demonstrating operation | movement when moving a 1st single wafer hand along a 1st horizontal direction. It is an illustrative perspective view for demonstrating operation | movement when moving a 2nd single wafer hand along a 2nd horizontal direction. It is an illustrative perspective view for explaining an operation when the first and second single-wafer hands are relatively moved in the vertical direction. FIG. 10 is an illustrative perspective view for explaining the operation of the second carry-in / out mechanism accompanying the substrate conveyance by the second carry-in / out mechanism. FIG. 10 is an illustrative perspective view for explaining the operation of the second carry-in / out mechanism accompanying the substrate conveyance by the second carry-in / out mechanism. FIG. 10 is an illustrative perspective view for explaining the operation of the second carry-in / out mechanism accompanying the substrate conveyance by the second carry-in / out mechanism. FIG. 10 is an illustrative perspective view for explaining the operation of the second carry-in / out mechanism accompanying the substrate conveyance by the second carry-in / out mechanism.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an illustrative plan view for explaining the overall configuration of a substrate processing apparatus 10 according to an embodiment of the present invention.
The substrate processing apparatus 10 is a batch type apparatus that can process a plurality of substrates W at a time. The substrate processing apparatus 10 includes a FOUP holding unit 1, a substrate processing unit 2, a main transfer mechanism 3, a first carry-in / out mechanism 4, a second carry-in / out mechanism 5, a transfer mechanism 6, a horizontal transfer mechanism 7, and chuck cleaning. A unit 8 and a controller 9 are provided. In this embodiment, the substrate W is a circular substrate such as a semiconductor wafer.

  The hoop holding unit 1 is disposed at one corner of the substrate processing apparatus 10 formed in a substantially rectangular shape in plan view. The hoop holding unit 1 is a container holding unit that can hold a hoop F as a container. In the hoop holding unit 1, an opener 12 for opening and closing a lid that closes the front surface of the hoop F is disposed. After the lid of the hoop F is opened by the opener 12, the number and position of the substrates W accommodated therein are confirmed by a sensor (not shown).

  The hoop F has, for example, a plurality of substrate holding shelves (not shown) for supporting the substrate W. The plurality of substrate holding shelves are arranged at regular intervals in the Z direction (vertical direction, vertical direction). The FOUP F holds a plurality of substrates W in a horizontal posture and stacked in the Z direction by aligning the surface (device forming surface) direction with a plurality of substrate holding shelves. In this embodiment, the maximum number of accommodated hoops F is 25.

  Moreover, the automatic hoop conveyance apparatus 11 shown with a dashed-two dotted line is arrange | positioned so as to oppose the front surface 10a (corresponding to one short side in planar view) of the substrate processing apparatus 10. The automatic hoop transport device 11 serves to supply the hoop F containing the unprocessed substrate W to the hoop holding unit 1, and the hoop F (empty hoop F) that should contain the processed substrate W to the hoop holding unit 1. And the function of retracting the hoop F held in the hoop holding part 1 in order to replace the hoop F held in the hoop holding part 1.

  The substrate processing unit 2 includes a plurality of processing units 13 arranged along the Y direction (horizontal direction) along the side surface (corresponding to one long side in plan view) 10b of the substrate processing apparatus 10. The plurality of processing units 13 include a first chemical liquid tank 14, a first rinse liquid tank 15, a second chemical liquid tank 16, a second rinse liquid tank 17, and a drying processing unit 18. The first chemical solution tank 14 and the second chemical solution tank 16 store the same type or different types of chemical solutions, respectively, and perform chemical treatment by immersing a plurality of substrates W in the chemical solutions all at once. The first rinsing liquid tank 15 and the second rinsing liquid tank 17 each store a rinsing liquid (for example, pure water), and immerse a plurality of substrates W in the rinsing liquid at a time, thereby rinsing the surface. Is to be applied.

  In this embodiment, the first chemical liquid tank 14 and the first rinse liquid tank 15 adjacent thereto are paired, and the second chemical liquid tank 16 and the second rinse liquid tank 17 adjacent thereto are paired. It has become. Then, the first lifter 19 as a dedicated transport mechanism for transferring the substrate W treated with the chemical solution in the first chemical solution tank 14 to the first rinse solution tank 15, and the substrate W treated with the chemical solution in the second chemical solution tank 16 are the first. A second lifter 20 is provided as a dedicated transport mechanism for transferring to the 2-rinse liquid tank 17.

  The first and second lifters 19 and 20 include a substrate support unit that supports a plurality of (for example, 52) substrates W in a vertical posture stacked in the X direction (horizontal direction), and the substrate support unit. An elevating drive mechanism (not shown) that moves up and down and a traverse drive mechanism (not shown) that traverses the substrate support portion along the Y direction are provided. The X direction is a horizontal direction along the front surface 10a of the substrate processing apparatus 10 and is a direction orthogonal to the Y direction.

  With this configuration, the first lifter 19 collectively receives a plurality of substrates W stacked in the X direction in a vertical posture from the main transport mechanism 3, and lowers the plurality of substrates W into the first chemical tank 14. And soak in the chemical. Further, after being immersed for a predetermined chemical solution processing time, the first lifter 19 raises the substrate support portion to pull up a plurality of substrates W from the chemical solution, and causes the substrate support portion to traverse to the first rinse liquid tank 15. Further, the substrate support portion is lowered into the first rinsing liquid tank 15 and immersed in the rinsing liquid. After being immersed for a predetermined rinsing time, the first lifter 19 raises the substrate support portion and pulls up the substrate W from the rinsing liquid. Thereafter, a plurality of substrates W are collectively delivered from the first lifter 19 to the main transport mechanism 3.

  Similarly, the second lifter 20 collectively receives a plurality of substrates W stacked vertically in the X direction from the main transport mechanism 3, and lowers the plurality of substrates W into the second chemical tank 16. Immerse in the chemical. Further, after being immersed for a predetermined chemical solution processing time, the second lifter 20 raises the substrate support portion to pull up a plurality of substrates W from the chemical solution, and causes the substrate support portion to traverse to the second rinse liquid tank 17. Further, the substrate support portion is lowered into the second rinsing liquid tank 17 and immersed in the rinsing liquid. After being immersed for a predetermined rinsing time, the second lifter 20 raises the substrate support portion and raises the substrate W from the rinse liquid. Thereafter, a plurality of substrates W are collectively delivered from the second lifter 20 to the main transport mechanism 3.

  The drying processing unit 18 includes a substrate holding mechanism (not shown) that holds a plurality of (for example, 52) substrates W stacked in the X direction in a vertical posture. The substrate W is dried by supplying isopropyl alcohol or the like to the substrate W or shaking off the liquid component on the substrate surface by centrifugal force. The drying processing unit 18 can transfer the substrate W to and from the main transport mechanism 3.

  The main transport mechanism 3 includes a pair of substrate chucks 21 serving as a substrate batch holding unit that can collectively hold a plurality of (for example, 52) substrates W in a vertical posture stacked in the X direction, and the substrate chuck 21. A chuck driving mechanism (not shown) for operating the substrate chuck, a transverse driving mechanism (not shown) for horizontally moving (traversing) the substrate chuck 21 along the Y direction, and raising and lowering the substrate chuck 21 along the Z direction. And an elevating drive mechanism (not shown).

  Each of the pair of substrate chucks 21 includes a pair of shaft-like support guides 22 extending in the X direction, and a plurality of substrates W in a vertical posture are received on opposite sides of each support guide 22 from below. A plurality of substrate support grooves for supporting are formed at intervals in the axial direction. The chuck drive mechanism expands or contracts the distance between the pair of support guides 22 by rotating the pair of substrate chucks 21 in the direction of the arrow. Accordingly, the substrate chuck 21 performs an opening / closing operation for switching between a holding state in which the substrate W is held and held and a release state in which the holding of the substrate W is released. The substrate W is exchanged between the first and second lifters 19 and 20 and the substrate chuck 21 by the opening / closing operation and the vertical movement of the first and second lifters 19 and 20. The main transport mechanism 3 further delivers a plurality of substrates W to and from the drying processing unit 18 in a state of being stacked in the X direction in a vertical posture.

The main transport mechanism 3 receives a plurality of unprocessed substrates W stacked in the X direction in the vertical posture at the substrate transfer position P1, and receives a plurality of processed substrates W stacked in the X direction in the vertical posture at the substrate transfer position. It operates to pay out at P1.
The chuck cleaning unit 8 is disposed below the substrate delivery position P1. The chuck cleaning unit 8 has a pair of cleaning tanks 23 into which a pair of substrate chucks 21 are respectively inserted. In the pair of cleaning tanks 23, the substrate chuck 21 (particularly the support guide 22) is cleaned using a cleaning liquid. The main transport mechanism 3 lowers the substrate chuck 21 at the substrate transfer position P1 and inserts it into the cleaning tank 23 of the chuck cleaning unit 8 before transporting the processed substrate W that has been dried by the drying processing unit 18. . Then, after the substrate chuck 21 is cleaned in the cleaning tank 23, the main transport mechanism 3 operates so as to collectively receive the processed substrates W from the drying processing unit 18.

FIG. 2 is an enlarged perspective view showing a configuration related to substrate conveyance between the FOUP F and the main conveyance mechanism 3. Please refer to FIG. 2 together with FIG.
The transport of the substrate W between the FOUP F held by the FOUP holding unit 1 and the substrate processing unit 2 is performed by a first carry-in / out mechanism 4, a second carry-in / out mechanism 5, a transfer mechanism 6, and a horizontal transport mechanism 7. It is done in cooperation with. Below, the structure of the 1st carrying in / out mechanism 4, the transfer mechanism 6, and the horizontal conveyance mechanism 7 is demonstrated, and then the specific example of the board | substrate conveyance by these mechanisms is demonstrated.
[First carry-in / out mechanism]
The first carry-in / out mechanism 4 is a batch-type substrate transport apparatus capable of transporting a plurality of substrates W in a stacked state, and is disposed so as to face the hoop holding unit 1 in the Y direction. The first carry-in / out mechanism 4 includes a batch hand 24 that can hold a plurality of (for example, 26) substrates W in a stacked state, a hand support portion 25 that supports the batch hand 24, and a rotation drive mechanism (not shown). 2), a turning drive mechanism (not shown), and a hand advance / retreat mechanism 26.

  The rotation drive mechanism is composed of an actuator such as a motor, for example, and rotates the batch hand 24 and the hand support portion 25 relative to the turning block 27 around the central axis A1 of the batch hand 24 within a range of 360 degrees. The turning drive mechanism is composed of an actuator such as a motor, for example, and turns the batch hand 24, the hand support portion 25 and the turning block 27 around a turning axis 28 parallel to the X direction. The hand advance / retreat mechanism 26 includes, for example, a belt drive mechanism, and horizontally moves the batch hand 24, the hand support portion 25, and the turning block 27 along the Y direction together with the advance / retreat block 29.

  The batch hand 24 includes a plurality of (for example, 52) hand elements 30, and these hand elements 30 collectively hold a plurality of substrates W in a stacked state. Each hand element 30 is a plate-like member formed in a substantially wedge shape in plan view, and is cantilevered by a hand support portion 25. The central axis A1 of the batch hand 24 is defined by an imaginary straight line that passes through the center of gravity of all the hand elements 30 and extends in a direction parallel to the hand elements 30.

  The plurality of hand elements 30 are stacked with an interval in the hand element alignment direction D3 orthogonal to the facing direction, with two hand elements 30 facing each other with a predetermined distance therebetween. The distance between the hand elements 30 adjacent to each other in the hand element alignment direction D3 is the same as the distance between the substrates W in the hoop F. The batch hand 24 is relatively moved along the hand element alignment direction D3 with respect to the hand support 25 by a moving mechanism (not shown) built in the hand support 25. Therefore, when each hand element 30 is in a horizontal posture, the batch hand 24 is moved in the Z direction (vertical direction) by the moving mechanism.

The batch hand 24 holds one substrate W in a horizontal posture by supporting the lower surface of the substrate W on two opposing hand elements 30 in a state where each hand element 30 is in a horizontal posture. Therefore, the batch hand 24 collectively holds the 26 substrates W in a horizontal posture at a pitch equal to the substrate holding pitch in the hoop F by the 26 pairs of hand elements 30.
Each hand element 30 includes a first support surface and a second support surface (in FIG. 2, the upper surface and the lower surface of each hand element 30) that are opposite to each other, and two opposing hand elements 30. By supporting the lower surface of the substrate W on the first support surface or the second support surface, one substrate W is held in a horizontal posture. Although not shown, at the base end portion (end portion on the hand support portion 25 side) of each hand element 30, a first support protrusion is provided on the first support surface side so as to come into contact with the peripheral portion of the lower surface of the substrate W. On the second support surface side, a second support protrusion that abuts on the peripheral edge of the lower surface of the substrate W is provided. Also, although not shown in the figure, at the front end portion of each hand element 30, on the first support surface side, there are provided first guide protrusions that come into contact with the peripheral end surface and the lower surface peripheral portion of the substrate W, so that the second support On the surface side, second guide protrusions that contact the peripheral end surface and the lower surface peripheral portion of the substrate W are provided.

  When the first support surface is the upper surface, the substrate W is supported by the first support protrusion and the first guide protrusion, and when the second support surface is the upper surface, the substrate is supported by the second support protrusion and the second guide protrusion. The substrate W is supported. For example, when the unprocessed substrate W is to be held by the batch hand 24, the first support surface is the upper surface, and when the processed substrate W is to be held by the batch hand 24, the second support surface is the upper surface. Specifically, the above-described rotation drive mechanism is controlled so that the first support surface or the second support surface becomes the upper surface. Thereby, it can suppress or prevent that the foreign material adhering to the unprocessed substrate W transfers to the processed substrate W via the batch hand 24.

  The batch hand 24 holds the peripheral end surface of the substrate W in cooperation with the three shaft-like support guides 31 attached to the hand support unit 25. The three support guides 31 are arranged in parallel to the hand element alignment direction D3, and two of the support guides 31 are arranged so as to be adjacent to the hand element 30 with the batch hand 24 interposed therebetween, and the rest. One support guide 31 is disposed at an intermediate position between two opposing hand elements 30.

  The three support guides 31 are moved relative to the hand support unit 25 along the hand element alignment direction D3 together with the batch hand 24 by the aforementioned moving mechanism (not shown) built in the hand support unit 25. The The three support guides 31 are moved relative to the hand support unit 25 along the central axis A1 of the batch hand 24 by a guide advance / retreat mechanism (not shown) built in the hand support unit 25. . Accordingly, the guide advancing / retreating mechanism is controlled so that the three support guides 31 are advanced toward the front end side of the hand element 30 while the substrate W is held in a horizontal posture on the two opposing hand elements 30. Thus, the peripheral end surface of the substrate W is sandwiched between the three support guides 31 and the first or second guide protrusions.

  The first carry-in / out mechanism 4 collectively holds a plurality of substrates W in a horizontal posture by the batch hand 24, and further, the batch hand 24 is moved along the YZ plane around the turning shaft 28 by the turning drive mechanism described above. By turning 90 degrees, the posture of the plurality of substrates W held by the batch hand 24 is converted between a horizontal posture and a vertical posture. When the orientation of the substrate W is changed, the peripheral end surface of the substrate W is sandwiched between the three support guides 31 and the first or second guide protrusion. Thereby, the substrate W can be stably held during posture change, and the fall of the substrate W can be suppressed or prevented.

  The first carry-in / out mechanism 4 carries in and out a plurality of substrates W stacked in the Z direction in a horizontal posture with respect to the hoop F held in the hoop holding unit 1 by the batch hand 24, and further Then, a plurality of substrates W stacked in the Y direction in a vertical posture are collectively transferred to and from the transfer mechanism 6. When the substrate W is carried into and out of the FOUP F by the first carry-in / out mechanism 4, the rotation drive mechanism and the swivel drive mechanism are controlled so that each hand element 30 is in a horizontal posture in a batch. The hand 24 is disposed to face the hoop F held in the hoop holding unit 1 in the Y direction. Further, when the substrate W is transferred between the first loading / unloading mechanism 4 and the transfer mechanism 6, the batch driving mechanism 24 is controlled so that the batch hand 24 has the YZ plane centered on the swing axis 28. Each hand element 30 is brought into a vertical posture.

  The first loading / unloading mechanism 4 is located on the moving path of the loading / unloading position P2 where the batch hand 24 enters the FOUP F and the first loading / unloading mechanism 4 by the action of the hand advance / retreat mechanism 26, and the position in the Y direction is The batch hand 24 is moved along the Y direction between the substrate transfer position P1 and the substrate transfer position P3 that coincides with the substrate transfer position P1. On the movement path of the first loading / unloading mechanism 4, the batch hand 24 is spaced in the Y direction between the loading / unloading position P <b> 2 and the substrate transfer position P <b> 3 with respect to the FOUP F held by the FOUP holding unit 1. A facing position P4 that is opposed to each other is set.

In this embodiment, the batch advancing / retracting mechanism 26 that can horizontally move the batch hand 24 along the Y direction and the aforementioned moving mechanism (not shown) that can move the batch hand 24 in the Z direction can A batch type loading / unloading mechanism is configured in which the hand 24 is moved to load and unload a plurality of substrates W at a time with respect to the FOUP F (container).
[Transfer mechanism]
The transfer mechanism 6 is disposed at the substrate transfer position P3. The transfer mechanism 6 is configured to collectively hold a plurality of (for example, 26) substrates W in a vertical posture while being stacked in the Y direction, and to transport the held plurality of substrates W in the Z direction. . Specifically, the transfer mechanism 6 includes a pair of support guide shafts 32 extending in the Y direction, a guide support portion 33 that supports the pair of support guide shafts 32 so as to be rotatable about each axis, and guide rotation. A mechanism 34, a guide horizontal movement mechanism 35, and a vertical drive mechanism (not shown) are provided. A part of the guide rotation mechanism 34 is built in the guide support portion 33, and the vertical drive mechanism is accommodated in the casing C 1 of the substrate processing apparatus 10. The guide support portion 33 is attached to the upper end of the main body portion 36 so as to be movable along the Y direction.

  The guide rotation mechanism 34 is composed of, for example, a belt drive mechanism, and rotates the pair of support guide shafts 32 around each axis. The guide horizontal movement mechanism 35 is composed of an actuator such as a motor, for example, and reciprocates the guide support portion 33 with respect to the main body portion 36 by a small distance in the Y direction. The guide support part 33 moves on the main body part 36 in the Y direction while being guided by the linear guide G1. The vertical drive mechanism is composed of, for example, a ball screw mechanism, and moves the main body portion 36 together with the pair of support guide shafts 32 and the guide support portion 33.

  Each support guide shaft 32 includes a first abutting portion 37 and a second abutting portion 38 at different positions in the circumferential direction (positions that differ by 180 degrees in this embodiment), and two places between them are retracted. Has become a department. Each of the first and second contact portions 37 and 38 is configured by arranging a plurality of (for example, 26) tooth-like projections 39 protruding in a direction perpendicular to the axial direction of the support guide shaft 32 in the axial direction. Has been. The interval between the tooth-like protrusions 39 adjacent in the axial direction is the same as the interval between the substrates W in the hoop F. A support groove for receiving and supporting the peripheral edge of the substrate W is formed at the tip of each tooth-like protrusion 39. By rotating the support guide shaft 32 by the guide rotation mechanism 34, the first contact state in which the first contact portions 37 of the pair of support guide shafts 32 are opposed to each other, and the second contact portions 38 are opposed to each other. The second support state, or the retracted state in which the retracting portions are opposed to each other.

  In the first support state, the distance between the first contact portions 37 of the pair of support guide shafts 32 is narrower than the diameter of the substrate W. Therefore, a plurality of substrates W in a vertical posture can be collectively held by the pair of support guide shafts 32. Similarly, in the second support state, the distance between the second contact portions 38 of the pair of support guide shafts 32 is narrower than the diameter of the substrate W. Therefore, a plurality of substrates W in a vertical posture can be collectively held by the pair of support guide shafts 32. For example, by controlling the guide rotation mechanism 34 so as to be in the first support state when holding the unprocessed substrate W and in the second support state when holding the processed substrate W, the unprocessed substrate W and the process are processed. The finished substrate W is switched and held by the first and second contact portions 37 and 38.

On the other hand, in the retracted state, the distance between the pair of support guide shafts 32 is longer than the diameter of the substrate W. Therefore, the substrate W in the vertical posture passes between the pair of support guide shafts 32.
The transfer mechanism 6 transfers a plurality of substrates W stacked in the Y direction in a vertical posture to and from the first carry-in / out mechanism 4 at the substrate transfer position P3. Further, the transfer mechanism 6 transfers a plurality of substrates W stacked in the Y direction in a vertical posture at the substrate transfer position P3 to and from the horizontal transport mechanism 7.
[Horizontal transport mechanism]
The horizontal transport mechanism 7 is configured to collectively hold a plurality of substrates W in a vertical posture while being stacked in the horizontal direction, and to transport the held plurality of substrates W along the X direction. The horizontal transfer mechanism 7 is disposed between the substrate transfer position P1 and the substrate transfer position P3 in plan view, and extends between the substrate transfer position P1 and the substrate transfer position P3 along the X direction. Is configured to move. Specifically, the horizontal transport mechanism 7 includes a horizontal transport holding unit 40 that can collectively hold a plurality of (for example, 52) substrates W in a vertical posture and stacked in a horizontal direction, and the horizontal transport holding unit 40 in the X direction. And a horizontal rotation mechanism (not shown) that horizontally rotates the horizontal conveyance holding unit 40 around the vertical axis.

  The horizontal drive mechanism is composed of, for example, a belt drive mechanism, and horizontally moves the horizontal conveyance holding unit 40 along the X direction between the substrate transfer position P1 and the substrate transfer position P3. The horizontal rotation mechanism is composed of an actuator such as a motor, for example, and rotates the horizontal conveyance holding unit 40 in the range of 360 degrees around the vertical axis. Accordingly, in a state where a plurality of substrates W are held by the horizontal transfer holding unit 40, the horizontal transfer holding unit 40 is horizontally rotated by a horizontal rotation mechanism, whereby a plurality of substrates W held by the horizontal transfer holding unit 40 is obtained. Convert the alignment direction of all at once. Specifically, for example, the horizontal conveyance holding unit 40 is horizontally rotated 90 degrees around the vertical axis to change the alignment direction of the plurality of substrates W between the X direction and the Y direction, or the horizontal conveyance holding unit. The alignment direction of the plurality of substrates W is reversed by rotating the plate 40 horizontally about the vertical axis by 180 degrees.

  The horizontal conveyance holding unit 40 includes a first guide 41 and a second guide 42, and is configured to use these separately for holding the unprocessed substrate W and holding the processed substrate W. The first guide 41 has three first support members 43 arranged in parallel along the horizontal direction, and the second guide 42 has three second support members arranged in parallel in the horizontal direction. A member 44 is provided. A plurality of (for example, 52) substrate holding grooves are formed on each upper surface of the support members 43 and 44 at a half pitch (half pitch) of the substrate holding pitch in the FOUP F.

  The three first support members 43 are moved up and down by a minute distance with respect to the three second support members 44 by a vertical drive mechanism (not shown). By moving the three first support members 43 up and down relative to the three second support members 44, the substrate support height of the first guide 41 is made higher than the substrate support height of the second guide 42, Conversely, the substrate support height of the first guide 41 is made lower than the substrate support height of the second guide 42. Thus, the higher one of the first and second guides 41 and 42 with the higher substrate support height can be used for supporting the substrate W. Therefore, for example, the first guide 41 can be used for holding the unprocessed substrate W, and the second guide 42 can be used for holding the processed substrate W.

The horizontal transport mechanism 7 transfers a plurality of substrates W stacked in the Y direction in a vertical posture at the substrate transfer position P3, and further transfers X to the substrate transfer position P1 in the vertical posture at the substrate transfer position P1. A plurality of substrates W stacked in the direction are transferred to and from the main transport mechanism 3.
[Substrate transport]
Next, specific examples of substrate conveyance by the main conveyance mechanism 3, the first carry-in / out mechanism 4, the transfer mechanism 6, and the horizontal conveyance mechanism 7 will be described. The substrate 9 is transferred by the controller 9 such as the substrate processing unit 2, the main transfer mechanism 3, the first carry-in / out mechanism 4, the second carry-in / out mechanism 5, the transfer mechanism 6, the horizontal transfer mechanism 7, and the chuck cleaning unit 8. This is realized by controlling the operation of each part.
[Unloading multiple unprocessed substrates from the hoop by the first loading / unloading mechanism]
When the plurality of unprocessed substrates W are unloaded from the FOUP F by the first unloading / unloading mechanism 4, each hand element 30 is placed in a horizontal posture so that the first support surface is upward, and the batch hand 24 is Oppositely arranged in the Y direction with respect to the hoop F held by the hoop holding portion 1 (see FIG. 2). Then, the hand advance / retreat mechanism 26 is controlled, and the batch hand 24 is moved in the Y direction toward the hoop F. Accordingly, the batch hand 24 enters the hoop F, and the plurality of hand elements 30 enter between the substrates W, respectively. Then, by controlling a moving mechanism (not shown) built in the hand support portion 25, the batch hand 24 is slightly changed along the hand element alignment direction D3 (in this state, it matches the Z direction). The distance is increased by a distance (for example, a distance equal to the substrate holding pitch in the hoop F). Thereby, a plurality of substrates W are scooped up simultaneously by the batch hand 24. Then, the batch hand 24 is withdrawn from the FOUP F, and a plurality of unprocessed substrates W in the FOUP F are unloaded at once.
[Loading multiple processed substrates into the hoop by the first loading / unloading mechanism]
When a plurality of processed substrates W are carried into the FOUP F by the first carry-in / out mechanism 4, the automatic hoop transport device 11 previously removes the empty FOUP F that should accommodate the substrate W into the FOUP holding unit 1. To place. And each hand element 30 is made into a horizontal attitude | position, and the batch hand 24 is opposingly arranged by the Y direction with respect to the hoop F hold | maintained at the hoop holding | maintenance part 1 (The batch hand 24 is made into the state shown in FIG. ). Accordingly, the plurality of processed substrates W held by the batch hand 24 are disposed to face the FOUP F in a horizontal posture.

Next, the hand advance / retreat mechanism 26 is controlled, and the batch hand 24 is moved toward the hoop F in the Y direction. As a result, the batch hand 24 holding a plurality of processed substrates W enters the FOUP F. Then, by controlling a moving mechanism (not shown) built in the hand support portion 25, the batch hand 24 is slightly changed along the hand element alignment direction D3 (in this state, it matches the Z direction). The distance is lowered by a distance (for example, a distance equal to the substrate holding pitch in the hoop F). As a result, the substrates W are respectively placed on the plurality of substrate holding shelves formed in the FOUP F, and the plurality of substrates W are collectively loaded into the FOUP F. Thereafter, the batch hand 24 is withdrawn from the hoop F.
[Reception of multiple unprocessed substrates from the first loading / unloading mechanism by the transfer mechanism]
When the transfer mechanism 6 collectively receives a plurality of unprocessed substrates W from the first carry-in / out mechanism 4, the batch hand 24 is moved to the substrate transfer position P3 with each hand element 30 in the vertical posture. Be placed. Therefore, the batch hand 24 is raised so that the tip of each hand element 30 faces upward, and the support guide 31 is disposed below the batch hand 24. At this time, the plurality of unprocessed substrates W held by the batch hand 24 are changed in posture from the horizontal posture to the vertical posture, and placed in the substrate transfer position P3 in the vertical posture. The plurality of unprocessed substrates W held by the batch hand 24 are arranged at the substrate transfer position P3 in a state of being sandwiched between the three support guides 31 and the corresponding first or second guide protrusions. The

On the other hand, the transfer mechanism 6 keeps the support guide shaft 32 at a lower position below the hand support portion 25 until the batch hand 24 is arranged at the substrate transfer position P3. At this time, the guide rotation mechanism 34 controls the rotation position of the support guide shaft 32 so that the first contact portions 37 of the pair of support guide shafts 32 face each other.
After the batch hand 24 is arranged at the substrate transfer position P3, the three support guides 31 are moved backward by a minute distance behind the hand element 30, and the holding of the substrate W is released. Thereby, the substrate W in a vertical posture is supported from below by the support guide 31. At this time, since the substrate W is pressed against the support guide 31 by gravity, the alignment of the substrates W is achieved at the same time.

After the holding of the substrate W is released, the transfer mechanism 6 receives a plurality of substrates W from the first carry-in / out mechanism 4 at a time. Specifically, the support guide shaft 32 that has been waiting at a lower position below the hand support portion 25 is raised to an upper position (position shown in FIG. 2) above the batch hand 24. In the ascending process, the plurality of substrates W are collectively transferred from the batch hand 24 to the support guide shaft 32. Since the width in the X direction of the hand support portion 25 is smaller than the distance between the pair of support guide shafts 32, there is no possibility of interference between the support guide shaft 32 and the hand support portion 25 when the support guide shaft 32 is raised.
[Reception of a plurality of processed substrates from the transfer mechanism by the first carry-in / out mechanism]
When the first carry-in / out mechanism 4 collectively receives a plurality of processed substrates W from the transfer mechanism 6, the batch hand 24 is moved to the substrate transfer position P3 with each hand element 30 in the vertical posture. Be placed. Therefore, the batch hand 24 is raised so that the tip of each hand element 30 faces upward, and the support guide 31 is disposed below the batch hand 24. At this time, the batch hand 24 is controlled in advance so that the second support surface is upward when in the horizontal posture.

In this state, the transfer mechanism 6 lowers the support guide shaft 32 from the upper position to the lower position below the hand support portion 25. In this process, a plurality of substrates W are collectively delivered from the support guide shaft 32 to the support guide 31.
Next, the first carry-in / out mechanism 4 advances the support guide 31 by a guide advance / retreat mechanism (not shown). As a result, the substrate W is sandwiched between the three support guides 31 and the second guide protrusion which is a guide protrusion for the processed substrate W. In this state, the batch hand 24 is turned from a vertical posture to a horizontal posture by a turning drive mechanism (not shown). In this way, the plurality of substrates W are changed in posture from the vertical posture to the horizontal posture. After the end of the posture conversion, the guide advance / retreat mechanism retracts the support guide 31 to the rear of the hand element 30 by a small distance to release the substrate W.
[Transfer of unprocessed substrate onto horizontal transfer mechanism by transfer mechanism]
When the transfer mechanism 6 transfers a plurality of (for example, 25) unprocessed substrates W to the horizontal transport mechanism 7 at once, the transfer mechanism 6 moves the pair of support guide shafts 32 to the upper position (see FIG. 2). The horizontal transport mechanism 7 moves the horizontal transport holding unit 40 to the substrate transfer position P3 in a state where the horizontal transport mechanism 7 is positioned at the position shown in FIG. At this time, the horizontal transport mechanism 7 turns the horizontal transport holding unit 40 around the vertical axis to bring the first and second support members 43 and 44 into a posture along the Y direction. Further, the horizontal transport mechanism 7 places the horizontal transport holding unit 40 in the first support state in which the first guide 41 is positioned above the second guide 42. Accordingly, the horizontal conveyance holding unit 40 is in a state in which a plurality of substrates W stacked in the Y direction in a vertical posture can be held.

  In this state, the transfer mechanism 6 moves the support guide shaft 32 to the lower position. In this process, the plurality of substrates W held in the vertical posture on the support guide shaft 32 are collectively transferred to the horizontal transport holding unit 40. Since the width of the horizontal conveyance holding unit 40 is smaller than the interval between the pair of support guide shafts 32, there is no possibility of interference with the horizontal conveyance holding unit 40 when the support guide shaft 32 is lowered.

  After the transfer, the guide rotation mechanism 34 of the transfer mechanism 6 rotates the pair of support guide shafts 32 so that the retracting portions face each other. In this state, the transfer mechanism 6 raises the support guide shaft 32 to the upper position and retracts it. Since the distance between the retracting portions of the pair of support guide shafts 32 is longer than the diameter of the substrate W, the support guide shaft 32 moves to the upper position without interfering with the substrate W held by the horizontal transport holding portion 40. Can be evacuated.

After the support guide shaft 32 is retracted, the horizontal transport mechanism 7 rotates the horizontal transport holding portion 40 around the vertical axis to retract from the substrate transfer position P3. Then, after the horizontal conveyance holding unit 40 is retracted, the transfer mechanism 6 lowers the support guide shaft 32 to the lower position and waits. Moreover, the transfer mechanism 6 makes the first contact portions 37 face each other by the guide rotation mechanism 34.
[Transfer of unprocessed substrates to horizontal transfer mechanism by transfer mechanism (batch assembly operation)]
The horizontal transport mechanism 7 holds 25 substrates W in every other substrate holding groove of the first guide 41. From this state, a batch of 50 substrates W can be formed by receiving another 25 substrate Ws in every other unused substrate holding groove. This is called batch assembly.

The first unloading / unloading mechanism 4 unloads 25 unprocessed substrates W at a time from another FOUP F arranged in the FOUP holding unit 1 by the function of the automatic FOUP transport device 11. Then, the first carry-in / out mechanism 4 changes the posture of the 25 substrates W from the horizontal posture to the vertical posture in the same manner as described above, and supports these substrates W at the substrate transfer position P3 by the support guide 31. Let
In this state, the first carry-in / out mechanism 4 moves the support guide 31 along the Y direction by a distance (half pitch) half the holding interval of the substrate W. Accordingly, the 25 substrates W supported by the support guide 31 move along the Y direction by a half pitch. On the other hand, the transfer mechanism 6 moves the support guide shaft 32 by a half pitch in the same direction (Y direction) as the movement direction of the support guide 31 by the guide horizontal movement mechanism 35. As a result, the substrate holding positions of the support guide 31 and the support guide shaft 32 are aligned in the vertical direction, and are shifted by a half pitch along the Y direction as compared to when the first 25 substrates W are held.

  From this state, the transfer mechanism 6 raises the support guide shaft 32 and guides it to the upper position. In this process, the support guide shaft 32 scoops a plurality of substrates W on the support guide 31 together. Next, the first carry-in / out mechanism 4 retracts the batch hand 24 from the substrate transfer position P3. Then, the horizontal transport mechanism 7 again moves the horizontal transport holding unit 40 to the substrate transfer position P3. At this time, the 25 substrates W (first 25 substrates W) held by the horizontal transport holding unit 40 are brought into an orientation in which the alignment direction is in the Y direction by the turning of the horizontal transport holding unit 40. Specifically, the alignment direction of the 25 held substrates W is in the same direction as when transferred to the horizontal transfer holding unit 40 or in the opposite direction when transferred to the horizontal transfer holding unit 40. Is done.

After the horizontal conveyance holding unit 40 is moved to the substrate transfer position P3, the transfer mechanism 6 lowers the pair of support guide shafts 32 to the lower position. In the process, the 25 substrates W held by the pair of support guide shafts 32 are collectively delivered onto the first guide 41 of the horizontal transport holding unit 40.
As described above, since the substrate holding position of the support guide shaft 32 is shifted by a half pitch along the Y direction as compared with the case where the first 25 substrates W are held, the 25 substrates W transferred later are transferred. Enters between the 25 substrates W already held by the horizontal conveyance holding unit 40. Accordingly, 50 substrates W are held by the horizontal conveyance holding unit 40 in a state where they are stacked in the Y direction at a half pitch.

At this time, when the alignment direction of the 25 substrates W already held in the horizontal conveyance holding unit 40 is the same as that when the substrate is transferred to the horizontal conveyance holding unit 40, each substrate W This is opposite to the case where 50 substrates W are held on the horizontal transfer holding unit 40 and transferred to the horizontal transfer holding unit 40 with the front surface of the substrate facing the back surface of the adjacent substrate W (face-to-back). When the front and back surfaces of adjacent substrates W face each other (face-to-face), 50 substrates W are held on the horizontal transport holding unit 40. .
[Reception of multiple processed substrates from the horizontal transfer mechanism by the transfer mechanism]
When the transfer mechanism 6 receives a plurality of (for example, 25) processed substrates W from the horizontal transport mechanism 7 at a time, the horizontal transport holding section 40 rotates the horizontal transport holding section 40 around the vertical axis to horizontally The alignment direction of a plurality of (for example, 50) substrates W held by the conveyance holding unit 40 is aligned with the holding direction (Y direction) of the substrates W in the transfer mechanism 6. And the horizontal conveyance holding | maintenance part 40 of the attitude | position is moved to the board | substrate transfer position P3.

Prior to this, the transfer mechanism 6 waits for the support guide shaft 32 at a lower position below the horizontal conveyance holding unit 40. At this time, the guide rotation mechanism 34 controls the rotation position of the support guide shaft 32 so that the second contact portions 38 of the pair of support guide shafts 32 face each other.
After the horizontal conveyance holding unit 40 reaches the substrate transfer position P3, the transfer mechanism 6 raises the support guide shaft 32 to an upper position above the horizontal conveyance holding unit 40 by a vertical drive mechanism (not shown). Let In the ascending process, the plurality of processed substrates W held by the horizontal conveyance holding unit 40 are collectively transferred to the support guide shaft 32. The horizontal conveyance holding unit 40 holds 50 substrates W stacked in the Y direction at a half pitch. At this time, the substrates W to be collectively transferred to the support guide shaft 32 include: It is 25 sheets every other sheet. In this way, a batch composed of 50 substrates W is released into a group of 25 substrates W each. This is called batch cancellation.

After the batch release operation, the horizontal transport mechanism 7 temporarily retracts the horizontal transport holding unit 40 in the X direction (substrate delivery position P1 side). Then, the 25 substrates W held by the transfer mechanism 6 are transferred to the first carry-in / out mechanism 4 at the substrate transfer position P3. Further, the first carry-in / out mechanism 4 retreats from the substrate transfer position P3. Thereafter, the support guide shaft 32 stands by at a lower position below the horizontal conveyance holding unit 40. Then, the above-described operation (reception operation of the substrate W from the horizontal transport mechanism 7 by the transfer mechanism 6) is performed again, and the remaining 25 processed substrates W held by the horizontal transport holding unit 40 are supported. It is collectively transferred to the guide shaft 32.
[Reception of multiple unprocessed substrates from the horizontal transport mechanism by the main transport mechanism]
When the main transport mechanism 3 receives a plurality of unprocessed substrates W from the horizontal transport mechanism 7 at a time, the horizontal transport mechanism 7 causes the horizontal transport holding unit 40 to wait at the substrate delivery position P1. At this time, the horizontal transport holding unit 40 turns the horizontal transport holding unit 40 about the vertical axis to change the alignment direction of the plurality of substrates W held by the horizontal transport holding unit 40 in the main transport mechanism 3. 2 in the holding direction (X direction) (state shown in FIG. 2).

In this state, the main transport mechanism 3 moves the pair of substrate chucks 21 to the substrate delivery position P1 in a released state (moves to the position shown in FIG. 2). Then, the main transport mechanism 3 switches the pair of substrate chucks 21 from the released state to the held state, and collectively receives a plurality of unprocessed substrates W held by the horizontal transport holding unit 40.
[Reception of multiple processed substrates from the main transport mechanism by the horizontal transport mechanism]
When the horizontal transport mechanism 7 collectively receives a plurality of (for example, 50) processed substrates W from the main transport mechanism 3, the horizontal transport mechanism 7 causes the horizontal transport holding unit 40 to wait at the substrate delivery position P1. At this time, in the horizontal conveyance holding unit 40, the support members of the first and second guides 41 and 42 are in the posture along the X direction, and the second guide is positioned above the first guide. State.

In this state, the main transport mechanism 3 moves the pair of substrate chucks 21 to the substrate delivery position P1 in the holding state, and switches the pair of substrate chucks 21 from the holding state to the released state. As a result, a plurality of processed substrates W held by the pair of substrate chucks 21 are collectively delivered to the horizontal transport mechanism 7.
[Substrate transport between hoop and substrate processing unit]
The transport of the substrate W between the FOUP F held by the FOUP holding unit 1 and the substrate processing unit 2 by the first carry-in / out mechanism 4, the transfer mechanism 6, and the horizontal transport mechanism 7 is performed, for example, by the above-described operation. Realized by combining.

  Specifically, a plurality of (for example, 25) unprocessed substrates W held in the FOUP F are unloaded by the first loading / unloading mechanism 4 and transferred from the first loading / unloading mechanism 4. It is delivered to the mechanism 6 at once. Then, the transfer of the substrates W to the horizontal transport mechanism 7 is performed a plurality of times (batch assembly operation is performed), and 50 substrates W are collectively delivered from the horizontal transport mechanism 7 to the main transport mechanism 3. In this way, a plurality of unprocessed substrates W are transferred from the FOUP F held by the FOUP holding unit 1 to the substrate processing unit 2. In this example of substrate transport, a plurality of unprocessed substrates W held in the FOUP F are transported to the substrate processing unit 2 in a state where the arrangement order in the FOUP F is maintained.

  In addition, a plurality of (for example, 50) processed substrates W processed in the substrate processing unit 2 are collectively delivered from the main transport mechanism 3 to the horizontal transport mechanism 7, and further, 25 sheets each from the horizontal transport mechanism 7. The batch is transferred to the transfer mechanism 6 (cancel batch). Then, the 25 substrates W transferred to the transfer mechanism 6 are collectively transferred from the transfer mechanism 6 to the first carry-in / out mechanism 4 and further held in the hoop holding unit 1 by the first carry-in / out mechanism 4. It is carried into the hoop F (empty hoop F) in a lump. In this way, a plurality of processed substrates W are transferred from the substrate processing unit 2 to the FOUP F held by the FOUP holding unit 1. In this example of substrate transport, a plurality of processed substrates W are transported from the substrate processing unit 2 to the FOUP F in a state where the arrangement order is maintained.

  As described above, in the substrate transport by the first carry-in / out mechanism 4, the transfer mechanism 6, and the horizontal transport mechanism 7, the arrangement order of the substrates W is maintained. Therefore, when the substrates W are transported by these mechanisms, for example, the plurality of substrates W cannot be collectively processed by rearranging the substrates W in an order different from the order in which the substrates W are arranged in the FOUP F. Further, when less than 25 (for example, several) substrates W are held at unequal intervals in the FOUP F, these substrates W cannot be rearranged at equal intervals to be collectively processed. Further, when several substrates W are held at the middle stage position of the hoop F, these substrates W are processed at the positions in the processing tanks 14 to 17 corresponding to the middle stage position. These substrates W cannot be collectively processed at any position within 14-17. Furthermore, a test dummy substrate W is added to the plurality of substrates W taken out from the predetermined hoop F, and these substrates W cannot be collectively processed.

Therefore, in the substrate processing apparatus 10 according to the present embodiment, the second carry-in / out mechanism 5 which is a single-wafer type substrate transport apparatus that transports the substrates W one by one in order to change the arrangement order of the substrates W or the like. Is provided. Below, the 2nd carrying in / out mechanism 5 is demonstrated, and the board | substrate conveyance by the 2nd carrying in / out mechanism 5 is demonstrated.
[Configuration of second carry-in / out mechanism]
Initially, with reference to FIG. 1 and FIG. 2, schematic structure of the 2nd carrying in / out mechanism 5 is demonstrated.

  The second carry-in / out mechanism 5 is a single-wafer type substrate carrying apparatus that carries the substrates W one by one, and is located closer to the side surface 10b of the substrate processing apparatus 10 than the first carry-in / out mechanism 4 in the X direction. . The second carry-in / out mechanism 5 includes a first single-wafer hand 45 that can hold one substrate W, a second single-wafer hand 46 that can similarly hold one substrate W, a first advance / retreat mechanism, and a second advance / retreat mechanism. A mechanism, an integral moving mechanism, a relative moving mechanism, and a single-wafer hand moving mechanism. The first advance / retreat mechanism, the second advance / retreat mechanism, the integral movement mechanism, and the relative movement mechanism are accommodated in the casing C2 of the second carry-in / out mechanism 5, and the single-wafer hand movement mechanism is disposed in the casing C1 of the substrate processing apparatus 10. Contained.

  The first advancing / retracting mechanism is constituted by, for example, a belt driving mechanism, and moves the first single-wafer hand 45 forward and backward between a forward movement position and a backward movement position in a first horizontal direction D1 parallel to the Y direction. The second advancing / retracting mechanism is, for example, a belt driving mechanism, and the second single-wafer hand 46 is moved forwardly in a second horizontal direction D2 parallel to the Y direction and opposite to the first horizontal direction D1. And move back and forth between the retracted position. In FIGS. 1 and 2, the first and second single-wafer hands 45 and 46 are in their retracted positions, and the substrate holding positions of the first and second single-wafer hands 45 and 46 are arranged at a height that is substantially equal. Shows the state. In this embodiment, the positions shown in FIGS. 1 and 2 are set to the origin positions of the first and second single-wafer hands 45 and 46.

  As shown in FIG. 1, the first and second single-wafer hands 45 and 46 are configured to mesh with each other so as not to overlap each other when viewed from the Z direction. When the first and second single-wafer hands 45 and 46 are in the retracted positions, the first and second single-wafer hands 45 and 46 are engaged with each other when viewed from the Z direction. That is, in this embodiment, the positions where the first and second single-wafer hands 45 and 46 are engaged with each other so that they do not overlap when viewed from the Z direction are the retracted positions of the first and second single-wafer hands 45 and 46. Is set. As described above, since the directions of the first and second horizontal directions D1 and D2 are opposite to each other, the first and second single-wafer hands 45 and 46 are opposite from the positions where they are engaged with each other when viewed from the Z direction. Move forward in the direction of.

  The integral moving mechanism is composed of, for example, a ball screw mechanism, and integrally moves the first and second single-wafer hands 45 and 46 in the Z direction. The relative movement mechanism is composed of an actuator such as an air cylinder, for example, and relatively moves the first and second single-wafer hands 45 and 46 in the Z direction. The single-wafer hand moving mechanism is composed of, for example, a ball screw mechanism, and integrally moves the first and second single-wafer hands 45 and 46 in the X direction.

  Specifically, the single-wafer hand moving mechanism is separated from the transport position P5 (see FIG. 1) provided between the facing position P4 of the batch hand 24 and the hoop holding unit 1, and the transport position P5. Between the standby position P6 (the position of the first and second single-wafer hands 45 and 46 shown in FIGS. 1 and 2) provided outside the movement path of the batch hand 24 moved by the first carry-in / out mechanism 4 The first and second single-wafer hands 45 and 46 are moved along the X direction. When substrate transport by the second carry-in / out mechanism 5 is performed, the first and second single-wafer hands 45 and 46 are moved to the transport position P5.

  In this embodiment, the first and second single-wafer hands 45, 46 are moved from between the batch hand 24 and the hoop holding unit 1 by moving the first and second single-wafer hands 45, 46 to the standby position P6. Since the evacuation is performed, the first and second single-wafer hands 45 and 46 are prevented from getting in the way when the substrate W is carried in and out by the batch hand 24 with respect to the hoop F held in the hoop holding unit 1. be able to. Thereby, carrying in and carrying out of the substrate W by the batch hand 24 with respect to the hoop F can be performed smoothly.

Further, since the standby position P6 is set outside the movement path of the batch hand 24, the first and second single-wafer hands 45 and 46 are moved when the batch hand 24 moves along the movement path (Y direction). Can be prevented. Thereby, the batch hand 24 can be smoothly moved along the movement route.
The first single-wafer hand 45 includes one first hand element 52, and the first hand element 52 holds one substrate W in a substantially horizontal posture. The first hand element 52 is a plate-like member having a substantially rectangular shape in plan view, and is cantilevered by the first arm 53. The first hand element 52 is supported by the first arm 53 in a horizontal posture, and extends from the first arm 53 along the first horizontal direction D1.

  Further, the second single-wafer hand 46 includes two second hand elements 54 having substantially the same shape, and the two second hand elements 54 hold one substrate W in a substantially horizontal posture. Each second hand element 54 is a plate-like member having a substantially rectangular shape in plan view, and is cantilevered by a second arm 55. The width (length in the X direction) of each second hand element 54 is shorter than the width (length in the X direction) of the first hand element 52. Each second hand element 54 is supported by the second arm 55 in a horizontal posture, and extends from the second arm 55 along the second horizontal direction D2. The two second hand elements 54 are arranged in parallel at a distance in the X direction.

  As shown in FIG. 1, when the first and second single-wafer hands 45, 46 are in their retracted positions, the first hand element 52 enters between the two second hand elements 54 in plan view, and The tip of the second arm 55 does not overlap. Further, when the first and second single-wafer hands 45 and 46 are in the retracted positions, the tips of the second hand elements 54 do not overlap the first arm 53 in plan view.

  That is, the interval between the two second hand elements 54 in the X direction is larger than the width of the first hand element 52, and the length of the first hand element 52 (the length along the Y direction) is In a state where the first and second single-wafer hands 45 and 46 are arranged at the respective retracted positions, the tip of the first hand element 52 is set to a size that does not overlap the second arm 55 in plan view. Similarly, the length (length along the Y direction) of each second hand element 54 is the same as each second hand element 54 in a state in which the first and second single-wafer hands 45 and 46 are disposed at the respective retracted positions. Is set to a size that does not overlap the first arm 53 in plan view.

  The second unloading / unloading mechanism 5 loads and unloads one substrate W with respect to the batch hand 24 located at the facing position P4 with each hand element 30 in the horizontal posture by the first single-wafer hand 45. To do. Further, the second carry-in / out mechanism 5 carries in and out a single substrate W with respect to the FOUP F held by the FOUP holding unit 1 by the second single-wafer hand 46. Furthermore, the second carry-in / out mechanism 5 transfers one substrate W between the first and second single-wafer hands 45 and 46.

  In this embodiment, the first advancing / retreating mechanism capable of horizontally moving the first single-wafer hand 45 along the Y direction, and the first and second single-wafer hands 45 and 46 are integrally moved along the Z direction. The first single-wafer loading / unloading mechanism that moves the first single-wafer hand 45 and loads and unloads the substrates W one by one with respect to the batch hand 24 is configured by the integrated moving mechanism that can perform the above. Further, the second single-wafer hand 46 is moved by the second advancing / retreating mechanism capable of horizontally moving the second single-wafer hand 46 along the Y direction and the integral moving mechanism to move the second single-wafer hand 46 with respect to the hoop F (container). Thus, a second single-wafer type loading / unloading mechanism for loading and unloading the substrates W one by one is configured.

FIG. 3 is a schematic perspective view for explaining the first advance / retreat mechanism 47, the second advance / retreat mechanism 48, and the relative movement mechanism 50. In FIG. 3, the casing C2 of the second carry-in / out mechanism 5 is not shown.
The casing C2 of the second carry-in / out mechanism 5 accommodates a flat base plate 56 disposed along the YZ plane. As will be described below, the first advance / retreat mechanism 47, the second advance / retreat mechanism 48, and the relative movement mechanism 50 are attached to the base plate 56. That is, the first advance / retreat mechanism 47, the second advance / retreat mechanism 48, and the relative movement mechanism 50 are held by the common base plate 56.

  The first advance / retreat mechanism 47 includes a pair of linear guides G2 arranged along the Y direction, a first driven pulley 57 (toothed pulley) arranged below the pair of linear guides G2, and a first driven pulley 57. A first drive pulley 58 (toothed pulley) disposed at a distance in the Y direction, and a first belt 59 (toothed belt) stretched between these pulleys 57 and 58 along the Y direction. ) And a first advance / retreat motor 60 (see FIG. 4) having a rotation shaft coupled to the first drive pulley 58. The first advancing / retracting motor 60 is disposed on one surface side (the back surface side in FIG. 3) of the base plate 56.

  The pair of linear guides G2 is fixed to the other surface (front surface in FIG. 3) of the base plate 56, and is arranged in parallel with a gap in the Z direction. The first arm 53 is located on the other surface side of the base plate 56, and is attached to the pair of linear guides G2 so as to be movable in the Y direction. The first driven pulley 57 and the first drive pulley 58 are rotatably held by the base plate 56 below the pair of linear guides G2, respectively. The first belt 59 is coupled to the first arm 53 by a first belt presser 61.

  The first arm 53 moves linearly along the Y direction while being guided by the pair of linear guides G2 as the first advance / retreat motor 60 rotates the first drive pulley 58 and rotates the first belt 59. Therefore, by rotating the first forward / backward motor 60 forward / reversely, the first single-wafer hand 45 can be moved forward and backward between the forward movement position and the backward movement position in the first horizontal direction D1 together with the first arm 53. it can. FIG. 3 shows a state where the first single-wafer hand 45 is disposed at the origin position (retracted position).

  Further, the second advancing / retracting mechanism 48 has a pair of linear guides G <b> 2, a second driven pulley 62 (toothed pulley) disposed below the pair of linear guides G <b> 2, and the second driven pulley 62. A second drive pulley 63 (toothed pulley) that is spaced apart in the direction, a second belt 64 (toothed belt) spanned between these pulleys 62 and 63 along the Y direction, The second drive pulley 63 is provided with a second advance / retreat motor 65 (see FIG. 4) having a rotation shaft coupled thereto. Similar to the first advance / retreat motor 60, the second advance / retreat motor 65 is disposed on the other surface side of the base plate 56. The second arm 55 is located on the other surface side of the base plate 56, and is attached to the pair of linear guides G2 via a plurality of members so as to be movable in the Y direction. In this embodiment, the first and second advancing / retracting mechanisms 47, 48 share a pair of linear guides G2, thereby reducing the number of parts of the second carry-in / out mechanism 5.

  The second driven pulley 62 and the second driving pulley 63 are rotatably held by the base plate 56, respectively. The second driven pulley 62 and the second driving pulley 63 are disposed below the first driven pulley 57 and the first driving pulley 58, respectively. The second belt 64 is connected to the second arm 55 via a second belt presser 66 and a bracket 67. That is, the second belt 64 is coupled to the bracket 67 by the second belt presser 66, and the second arm 55 is coupled to the bracket 67.

  The bracket 67 is composed of a plurality of plate-like portions, and is attached to the pair of linear guides G2 so as to be movable in the Y direction. A pair of linear guides G <b> 3 arranged along the Z direction is fixed to one surface (front surface in FIG. 3) of the plate-like portion 67 a located on the second arm 55 side in the bracket 67. As for the 2nd arm 55, the flat base end part 55a (end part by the side of the bracket 67) is attached to the plate-shaped part 67a via a pair of linear guide G3.

  An actuator 69 such as an air cylinder is attached to one surface of the plate-like portion 67a via an L-shaped attachment stay 68. The actuator 69 has a columnar main body 69a and a rod 69b protruding from the main body 69a, and the rod 69b advances and retreats along the central axis of the main body 69a. The actuator 69 is attached to the plate-like portion 67a so that the center axis of the main body 69a is along the Z direction with the rod 69b facing the main body 69a. Therefore, the rod 69b is advanced and retracted in the Z direction. The rod 69b is connected to the lower end of the base end portion 55a via a plate-like mounting stay 70.

  The bracket 67 moves linearly along the Y direction while being guided by the pair of linear guides G <b> 2 as the second advance / retreat motor 65 rotates the second drive pulley 63 and rotates the second belt 64. The second arm 55 moves linearly along the Y direction together with the bracket 67. Therefore, by rotating the second forward / backward motor 65 forward / reversely, the second arm 55 and the bracket 67 together with the second arm 55 and the bracket 67 are moved forward and backward between the forward movement position and the backward movement position in the second horizontal direction D2. Let FIG. 3 shows a state in which the second single-wafer hand 46 is disposed at the origin position (retracted position).

  Further, the second arm 55 linearly moves along the Z direction while being guided by the pair of linear guides G3 as the rod 69b moves forward and backward with respect to the main body 69a. Accordingly, the second arm 55 and the second single-wafer hand 46 are moved along the Z direction with respect to the bracket 67 by moving the rod 69b back and forth in the Z direction. As a result, the second single-wafer hand 46 is moved relative to the first single-wafer hand 45 in the Z direction. That is, in this embodiment, the relative movement mechanism 50 is configured by a plurality of members such as the actuator 69. As will be described later, the relative movement mechanism 50 functions as a substrate movement mechanism that moves the substrate W from one single-wafer hand to the other single-wafer hand by relatively moving the first and second single-wafer hands 46 and 46. .

  The relative movement mechanism 50 includes an upper position where the substrate holding position of the second single-wafer hand 46 is above the substrate holding position of the first single-wafer hand 45, and a lower position than the substrate holding position of the first single-wafer hand 45. The second single-wafer hand 46 is moved between the lower position. Further, an intermediate position is set between the upper position and the lower position of the second single-wafer hand 46 so that the substrate holding positions of the first and second single-wafer hands 45 and 46 are substantially equal.

FIG. 4 is an illustrative external view for explaining the integral moving mechanism 49 and the single-wafer hand moving mechanism 51. FIG. 4 shows the second carry-in / out mechanism 5 as viewed from the second arm 55 side along the Y direction. In FIG. 4, the casing C1 of the substrate processing apparatus 10 and the casing C2 of the second carry-in / out mechanism 5 are not shown.
The integral moving mechanism 49 is composed of a linear actuator incorporating a ball screw mechanism and a linear guide, and is arranged along the Z direction. The integral movement mechanism 49 can move the operating member 72 along the Z direction by obtaining a driving force from the motor 71 disposed at the upper end thereof. The operating member 72 is connected to the base plate 56 so as to be integrally movable, and the base plate 56 is moved in the Z direction by moving the operating member 72 along the Z direction. Therefore, by moving the operating member 72 along the Z direction by the integral moving mechanism 49, the first sheet hand 45, the second sheet hand 46, the first advance / retreat mechanism 47, and the second advance / retreat mechanism 48 together with the base plate 56. , And the relative movement mechanism 50 is moved integrally in the Z direction.

  The integral movement mechanism 49 moves the first single-wafer hand 45 in the Z direction within a range in which the substrates W can be loaded into and unloaded from all the substrate holding positions of the batch hand 24 in which each hand element 30 is in a horizontal posture. Let The integral moving mechanism 49 moves the second single-wafer hand 46 in the Z direction within a range in which the substrate W can be carried in and out of all the substrate holding positions of the FOUP F held by the FOUP holding unit 1. .

  On the other hand, the single-wafer hand moving mechanism 51 includes a linear actuator incorporating a ball screw mechanism and a linear guide, and is arranged along the X direction. The single-wafer hand moving mechanism 51 can obtain the driving force from the motor 73 disposed at one end (the left end in FIG. 4) and move the operating member 74 along the X direction. The actuating member 74 is coupled to a support frame 75 extending in the Z direction so as to be integrally movable, and the integral moving mechanism 49 is coupled to the support frame 75 so as to be integrally movable.

  The support frame 75 includes a flat plate-like lower plate 75a disposed along a horizontal plane, and two flat plate-like vertical plates 75b and 75c extending in the Z direction from the upper surface of the lower plate 75a. The two vertical plates 75b and 75c are connected so as to form a T shape in plan view. The operating member 74 is connected to the lower surface of the lower plate 75a, and the integral moving mechanism 49 is connected to one surface (the right surface in FIG. 4) of one vertical plate 75b.

  When the single-wafer hand moving mechanism 51 moves the operation member 74 along the X direction, the support frame 75 moves along the X direction. As the support frame 75 moves, the integral moving mechanism 49 moves along the X direction. Further, as the integrated moving mechanism 49 moves, the base plate 56 moves along the X direction. Therefore, by moving the operation member 74 along the X direction by the single-wafer hand moving mechanism 51, the first single-wafer hand 45, the second single-wafer hand 46, the first advance / retreat mechanism 47, the second advance / retreat mechanism, together with the base plate 56, are obtained. The mechanism 48 and the relative movement mechanism 50 are integrally moved in the X direction.

  FIG. 5 is a schematic perspective view showing a part of the first and second single-wafer hands 45 and 46 and the first and second arms 53 and 55. In FIG. 5, the first and second single-wafer hands 45 and 46 are at the origin position (the first and second single-wafer hands 45 and 46 are in their retracted positions, and the first and second single-wafer hands 45 46, the substrate holding positions are substantially equal in height). 6 is a schematic plan view of a part of the first single-wafer hand 45 and the first arm 53, and FIG. 7 is a schematic enlarged view of the distal end portion of the first single-wafer hand 45. . FIG. 8 is a schematic plan view of a part of the second single-wafer hand 46 and the second arm 55.

Hereinafter, the first single-wafer hand 45 and the first bracket 67 will be described with reference to FIGS. 5 to 7, and then the second single-wafer hand 46 and the second bracket 67 will be described with reference to FIGS. 5 and 8. explain.
[First sheet hand]
The first single-wafer hand 45 has first support members 76 and 77 for holding the substrate W at the first holding position P11 and second support members 78 and 79 for holding the substrate W at the second holding position P12. And have. Two first support members 76 and 77 are provided at the base end portion (end portion on the first arm 53 side) and the tip end portion of the first hand element 52, respectively. Similarly, two second support members 78 and 79 are provided at each of the proximal end portion and the distal end portion of the first hand element 52.

  The first single-wafer hand 45 supports the substrate W by the four first support members 76 and 77 and holds the single substrate W in a substantially horizontal posture. The first single-wafer hand 45 supports the substrate W by the four second support members 78 and 79 and holds the single substrate W in a substantially horizontal posture. When the unprocessed substrate W is to be held by the first single-wafer hand 45, for example, four first support members 76 and 77 are used, and when the processed substrate W is to be held by the first single-wafer hand 45, For example, four second support members 78 and 79 are used. Thereby, it can suppress or prevent that the foreign material adhering to the unprocessed substrate W transfers to the processed substrate W via the 1st single wafer hand 45.

  As shown in FIG. 6, the four first support members 76 and 77 are arranged along a predetermined circumference corresponding to the outer peripheral shape of the substrate W (on the circumference indicated by the alternate long and short dash line). Similarly, the four second support members 78 and 79 are arranged along a predetermined circumference corresponding to the outer peripheral shape of the substrate W (on the circumference indicated by a two-dot chain line). In FIG. 6, the range surrounded by the one-dot chain line is the first holding position P11, and the range surrounded by the two-dot chain line is the second holding position P12. The first and second holding positions P11 and P12 are set so that most of the first and second holding positions P11 and P12 overlap each other in plan view (viewed from the vertical direction). Further, the center positions of the first and second holding positions P11 and P12 are shifted in the Y direction in plan view.

  As shown in FIG. 6, the two first support members 76 arranged at the proximal end portion of the first hand element 52 are arranged symmetrically with respect to the symmetry axis A <b> 2 of the first hand element 52 parallel to the Y direction. . In addition, the two second support members 78 arranged at the proximal end portion of the first hand element 52 are arranged symmetrically with respect to the symmetry axis A2. The two first support members 76 are disposed between the two second support members 78, and are disposed closer to the distal end side of the first hand element 52 than the second support member 78. The two first support members 76 are arranged at a position overlapping the second holding position P12 in plan view.

  On the other hand, the two first support members 77 arranged at the tip of the first hand element 52 are arranged symmetrically with respect to the symmetry axis A2. In addition, the two second support members 79 disposed at the distal end portion of the first hand element 52 are disposed symmetrically with respect to the symmetry axis A2. The two second support members 79 are disposed between the two first support members 77, and are disposed closer to the proximal end side of the first hand element 52 than the first support member 77. The two second support members 79 are arranged at a position overlapping the first holding position P11 in plan view.

  Each of the support members 76 to 79 is formed in a circular shape in plan view, and as shown in FIG. 7, a columnar protrusion 80 is formed at the center. The periphery of the protrusion 80 is a conical inclined surface 81 that becomes lower as it goes outward. The peripheral edge of the substrate W is in point contact with the inclined surface 81. The horizontal movement of the substrate W is regulated by the peripheral surface of the protruding portion 80.

  As shown in FIG. 5, the two first support members 76 disposed at the proximal end portion of the first hand element 52 are more than the two first support members 77 disposed at the distal end portion of the first hand element 52. It is formed low overall. Therefore, the four first support members 76 and 77 support the substrate W obliquely so that the substrate W slightly rises from the proximal end of the first hand element 52 toward the distal end.

  Further, the two second support members 78 arranged at the base end portion of the first hand element 52 are opposite to the first support members 76 and 77, and the two second support members 78 arranged at the distal end portion of the first hand element 52 are two. The overall height is higher than that of the second support member 79. Accordingly, the four second support members 78 and 79 are configured to support the substrate W obliquely so that the substrate W slightly falls from the proximal end of the first hand element 52 toward the distal end.

  Further, the first support member 77 disposed at the distal end portion of the first hand element 52 is generally formed higher than the second support member 79 disposed at the distal end portion of the first hand element 52 (see FIG. 7), the second support member 78 disposed at the proximal end portion of the first hand element 52 is generally formed higher than the first support member 76 disposed at the proximal end portion of the first hand element 52. ing. That is, in this embodiment, the height relationship between the first support member and the second support member is reversed between the distal end portion and the proximal end portion of the first hand element 52. The 2nd support member 79 arrange | positioned at the front-end | tip part of the 1st hand element 52 is formed in the height which does not contact the board | substrate W hold | maintained in the 1st holding position P11 (refer FIG. 7), and the 1st hand element The first support member 76 disposed at the base end portion 52 is formed at a height that does not contact the substrate W held at the second holding position P12.

Therefore, in this embodiment, the second support member 79 disposed at the tip of the first hand element 52 is disposed at a position overlapping the first holding position P11 in plan view (see FIG. 6). Even if the substrate W is held at the holding position P11, the held substrate W does not interfere with the second support member 79 (see FIG. 7). Similarly, although the first support member 76 disposed at the proximal end portion of the first hand element 52 is disposed at a position overlapping the second holding position P12 in plan view, the substrate W is held at the second holding position P12. Even so, the held substrate W does not interfere with the first support member 76. Thereby, the space on the 1st single wafer hand 45 can be used effectively. Therefore, even when a plurality of substrate holding positions are set on the first single-wafer hand 45 as in the present embodiment, the increase in size of the first single-wafer hand 45 can be suppressed or prevented. Thereby, the enlargement as the 2nd carrying in / out mechanism 5 whole can be controlled or prevented.
[First arm]
The first arm 53 is provided with a pair of first sensor holding portions 82 and a plurality of (for example, three) first cutout portions 83. Each first sensor holding portion 82 extends horizontally in the same direction as the first hand element 52 from the first main body portion 84 of the first arm 53 on which the first hand element 52 is supported. One first sensor holding portion 82 is provided at the distal end portion of the first main body portion 84, and the other first sensor holding portion 82 is provided at the proximal end portion of the first main body portion 84. The first hand element 52 is supported by a first support portion 84 a provided between the distal end portion and the proximal end portion of the first main body portion 84. The pair of first sensor holding portions 82 are disposed with the proximal end portion of the first hand element 52 interposed therebetween.

  A pair of light receiving device 85 and light emitting device 86 are attached to the pair of first sensor holding portions 82, respectively. In the present embodiment, the light receiving device 85 and the light emitting device 86 constitute first detection means for detecting the presence or absence of the substrate W on the first single-wafer hand 45. That is, the light receiving device 85 and the light emitting device 86 are attached to the corresponding first sensor holding portions 82 so that the light path (see the broken line in FIG. 6) passes through the first holding position P11 and the second holding position P12. It has been. Therefore, when the substrate W is held at the first holding position P11 or the second holding position P12, light emitted from the light emitting device 86 is blocked by the substrate W, and light reception by the light receiving device 85 is prevented. Thereby, the presence or absence of the substrate W on the first single-wafer hand 45 is detected. Therefore, whether or not the substrate W has moved when the substrate W is carried in and out of the batch hand 24 by the first single-wafer hand 45 or when the substrate W is transferred between the first and second single-wafer hands 45 and 46. Can be reliably detected.

  The three first cutout portions 83 are respectively provided between the first sensor holding portion 82 and the first support portion 84a on the distal end side, and between the first sensor holding portion 82 and the first support portion 84a on the proximal end side. , And the first sensor holding part 82 on the base end side, is further arranged on the base end side. Each first notch 83 is a recess that is recessed from the upper end to the lower end of the first main body 84. As shown in FIG. 5, the two first cutout portions 83 arranged between each first sensor holding portion 82 and the first support portion 84 a are respectively the second hand elements of the second single-wafer hand 46. 54 is formed in a size that allows entry. Further, the first notch portion 83 disposed further on the base end side than the first sensor holding portion 82 on the base end side is large enough to allow a second sensor holding portion 91 (described later) provided on the second arm 55 to enter. Is formed.

Subsequently, the second single-wafer hand 46 and the second bracket 67 will be described with reference to FIGS. 5 and 8.
[Second sheet hand]
The second single-wafer hand 46 has first support members 87 and 88 for holding the substrate W at the first holding position P21, and second support members 89 and 90 for holding the substrate W at the second holding position P22. And have. The first support members 87 and 88 are respectively provided at the base end portion (end portion on the second arm 55 side) and the distal end portion of each second hand element 54. Similarly, one second support member 89 and 90 is provided at each of the proximal end portion and the distal end portion of each second hand element 54.

  The second single-wafer hand 46 supports the substrate W by the four first support members 87 and 88 and holds the single substrate W in a substantially horizontal posture. The second single-wafer hand 46 supports the substrate W by the four second support members 89 and 90, and holds the single substrate W in a substantially horizontal posture. When the unprocessed substrate W is to be held by the second single-wafer hand 46, for example, four first support members 87 and 88 are used, and when the processed substrate W is to be held by the second single-wafer hand 46. For example, four second support members 89 and 90 are used. Thereby, it is possible to suppress or prevent the foreign matter adhering to the unprocessed substrate W from being transferred to the processed substrate W via the second single-wafer hand 46.

  As shown in FIG. 8, the four first support members 87 and 88 are arranged along a predetermined circumference corresponding to the outer peripheral shape of the substrate W (on the circumference indicated by the alternate long and short dash line). Similarly, the four second support members 89 and 90 are arranged along a predetermined circumference corresponding to the outer peripheral shape of the substrate W (on the circumference indicated by a two-dot chain line). In FIG. 8, the range surrounded by the alternate long and short dash line is the first holding position P21, and the range surrounded by the alternate long and two short dashes line is the second holding position P22. The first and second holding positions P21 and P22 are set so that most of them overlap each other in plan view (viewed from the vertical direction). Further, the center positions of the first and second holding positions P21 and P22 are shifted in the Y direction in plan view.

  As shown in FIG. 8, a total of two first support members 87 arranged at the base end portion of each second hand element 54 are arranged so as to face each other in the X direction. Further, a total of two second support members 89 arranged at the base end portion of each second hand element 54 are arranged so as to face each other in the X direction. The two second support members 89 are disposed between the two first support members 87, and are disposed closer to the proximal end side of the second hand element 54 than the first support member 87. As shown in FIG. 8, the two second support members 89 are arranged at positions that overlap the first holding position P <b> 21 in plan view.

  On the other hand, a total of two first support members 88 disposed at the tip of each second hand element 54 are disposed so as to face each other in the X direction. In addition, a total of two second support members 90 arranged at the tip of each second hand element 54 are arranged so as to face each other in the X direction. The two first support members 88 are disposed between the two second support members 90, and are disposed closer to the distal end side of the second hand element 54 than the second support member 90. The two first support members 88 are arranged at a position overlapping the second holding position P22 in plan view.

  Each of the support members 87 to 90 has the same configuration as the above-described support members 76 to 79 provided in the first single-wafer hand 45. That is, each of the support members 87 to 90 is formed in a circular shape in plan view, and a cylindrical protrusion is formed at the center. The periphery of this protrusion is a conical inclined surface that becomes lower toward the outside. The peripheral edge of the substrate W is in point contact with the inclined surface. And the horizontal movement of the board | substrate W is controlled by the surrounding surface of a protrusion part.

  As shown in FIG. 5, a total of two first support members 87 arranged at the proximal end portion of each second hand element 54 are a total of two first support members arranged at the distal end portion of each second hand element 54. It is formed higher than the member 88 as a whole. Therefore, the four first support members 87 and 88 are configured to support the substrate W obliquely so that the substrate W slightly falls from the proximal end of the second hand element 54 toward the distal end.

  Further, a total of two second support members 89 disposed at the base end portion of each second hand element 54 are disposed at the distal end portion of the second hand element 54, contrary to the first support members 87 and 88. The total is formed lower than the two second support members 90. Accordingly, the four second support members 89 and 90 are configured to support the substrate W at an angle so that the substrate W slightly rises from the proximal end of the second hand element 54 toward the distal end.

  Further, the second support member 90 disposed at the distal end portion of each second hand element 54 is formed generally higher than the first support member 88 disposed at the distal end portion of each second hand element 54. The first support member 87 disposed at the base end portion of each second hand element 54 is generally formed higher than the second support member 89 disposed at the base end portion of each second hand element 54. Yes. That is, the height relationship between the first support member and the second support member is reversed between the distal end portion and the proximal end side of the second hand element 54. The first support member 88 disposed at the tip of each second hand element 54 is formed at a height that does not contact the substrate W held at the second holding position P22. The second support member 89 disposed at the end is formed at a height that does not contact the substrate W held at the first holding position P21.

Therefore, in this embodiment, although the first support member 88 disposed at the tip of each second hand element 54 is disposed at a position overlapping the second holding position P22 in plan view (see FIG. 8), Even if the substrate W is held at the second holding position P <b> 22, the held substrate W does not interfere with the first support member 88. Similarly, although the second support member 89 arranged at the base end portion of each second hand element 54 is arranged at a position overlapping the first holding position P21 in plan view (see FIG. 8), the first holding position Even if the substrate W is held at P 21, the held substrate W does not interfere with the second support member 89. Thereby, the space on the 2nd sheet | seat hand 46 can be utilized effectively. Therefore, even when a plurality of substrate holding positions are set on the second single-wafer hand 46 as in the present embodiment, it is possible to suppress or prevent the second single-wafer hand 46 from becoming large. Thereby, the enlargement as the 2nd carrying in / out mechanism 5 whole can be controlled or prevented.
[Second arm]
The second arm 55 is provided with a pair of second sensor holding portions 91 and a plurality of (for example, three) second notch portions 92. Each second sensor holding portion 91 extends horizontally in the same direction as each second hand element 54 from the second main body portion 93 of the second arm 55 on which the pair of second hand elements 54 are supported. One second sensor holding portion 91 is provided at the distal end portion of the second main body portion 93, and the other second sensor holding portion 91 is provided at the proximal end portion of the second main body portion 93. The pair of second hand elements 54 are respectively supported by a pair of second support portions 93 a provided between the distal end portion and the proximal end portion of the second main body portion 93. The pair of second sensor holding portions 91 are disposed with the proximal end portions of the second hand elements 54 interposed therebetween.

  A pair of light receiving device 94 and light emitting device 95 are attached to the pair of second sensor holding portions 91, respectively. In the present embodiment, the light receiving device 94 and the light emitting device 95 constitute second detection means for detecting the presence or absence of the substrate W on the second single-wafer hand 46. That is, the light receiving device 94 and the light emitting device 95 are attached to the corresponding second sensor holding portions 91 so that the light path (see the broken line in FIG. 8) passes through the first holding position P21 and the second holding position P22. It has been. Accordingly, when the substrate W is held at the first holding position P21 or the second holding position P22, light emitted from the light emitting device 95 is blocked by the substrate W, and light reception by the light receiving device 94 is prevented. Thereby, the presence or absence of the substrate W on the second single-wafer hand 46 is detected. Accordingly, whether or not the substrate W has moved when the substrate W is carried in and out of the hoop F by the second single-wafer hand 46, or when the substrate W is transferred between the first and second single-wafer hands 45 and 46. Can be reliably detected.

  The three second cutout portions 92 are respectively provided between the second sensor holding portion 91 on the distal end side and the second support portion 93a on the distal end side, between the pair of second support portions 93a, and on the proximal end side. 2 between the sensor holding part 91 and the second support part 93a on the base end side. Each second notch 92 is a recess that is recessed from the upper end to the lower end of the second main body 93. As shown in FIG. 5, the second notch portion 92 disposed between the pair of second support portions 93 a is formed to a size that allows the first hand element 52 of the first single-wafer hand 45 to enter. Yes. Further, between the second sensor holding portion 91 on the distal end side and the second support portion 93a on the distal end side, and between the second sensor holding portion 91 on the proximal end side and the second support portion 93a on the proximal end side, respectively. The two arranged second notches 92 are formed in such a size that the first sensor holding part 82 can enter.

  As shown in FIG. 5, when the first and second single-wafer hands 45 and 46 are at the origin position, the first hand element 52 and the pair of first sensor holding portions 82 are attached to the second arm 55 in the Y direction. It faces one of the formed second notches 92. In addition, when the first and second single-wafer hands 45 and 46 are at the origin position, the pair of second hand elements 54 and the second sensor holding portion 91 on the base end side are formed on the first arm 53 in the Y direction. It faces one of the first cutouts 83 formed. On the other hand, the second sensor holding portion 91 on the distal end side is located outside the first arm 53 with respect to the X direction and does not face the first arm 53 with respect to the Y direction.

FIG. 9 is an illustrative perspective view for explaining the operation when the first single-wafer hand 45 is moved along the first horizontal direction D1.
The first advance / retreat mechanism 47 advances and retracts the first single-wafer hand 45 between the forward movement position and the backward movement position in the first horizontal direction D1. Specifically, the first advancing / retracting mechanism 47 (see FIG. 3) moves from the retracted position of the first single-wafer hand 45 indicated by a two-dot chain line in FIG. 9 to the advanced position of the first single-wafer hand 45 indicated by a solid line. The first single-wafer hand 45 is moved forward along the Y direction, and the first single-wafer hand 45 is moved back along the Y direction from the advanced position to the retracted position. The first advance / retreat mechanism 47 advances the first sheet hand 45 to the advance position when the second sheet hand 46 is in the retracted position. The first horizontal direction D1 is a direction parallel to the Y direction from the retracted position of the first single-wafer hand 45 toward the advanced position.

  When the first single-wafer hand 45 is in the forward position and the second single-wafer hand 46 is in the retracted position, the first hand element 52 has a distal end portion that is more first than the proximal end portion of each second hand element 54. It protrudes in the horizontal direction D <b> 1, and its base end part enters the second notch part 92 and three-dimensionally intersects with the second arm 55. Further, the pair of first sensor holding portions 82 enter the corresponding second notch portions 92. The three second notches 92 formed in the second arm 55 are configured so that the first hand element 52 and the pair of first sensor holding portions 82 are the first even when the second single-wafer hand 46 is in the upper position. It is formed to a depth that does not interfere with the two arms 55. Therefore, if the second single-wafer hand 46 is in the retracted position, the first single-wafer hand 45 and the first arm 53 can be located at any position between the upper position and the lower position. Can be smoothly advanced to the advance position without colliding with the second single-wafer hand 46 or the like.

FIG. 10 is an illustrative perspective view for explaining an operation when the second single-wafer hand 46 is moved along the second horizontal direction D2.
The second advance / retreat mechanism 48 (see FIG. 3) moves the second single-wafer hand 46 forward and backward between the forward movement position and the backward movement position in the second horizontal direction D2. Specifically, the second advancing / retracting mechanism 48 moves from the retracted position of the second single-wafer hand 46 indicated by a two-dot chain line in FIG. 10 to the advanced position of the second single-wafer hand 46 indicated by a solid line. 46 is advanced along the Y direction, and the second single-wafer hand 46 is retracted along the Y direction from the advanced position to the retracted position. The second advancing / retracting mechanism 48 advances the second single-wafer hand 46 to the advanced position when the first single-wafer hand 45 is in the retracted position. The second horizontal direction D2 is a direction parallel to the Y direction from the retracted position of the second single-wafer hand 46 toward the advanced position.

  When the first single-wafer hand 45 is in the retracted position and the second single-wafer hand 46 is in the advanced position, each of the second hand elements 54 has a distal end portion that is second than the proximal end portion of the first hand element 52. It protrudes in the horizontal direction D <b> 2, and its base end part enters the first cutout part 83 and three-dimensionally intersects with the first arm 53. Further, the second sensor holding portion 91 on the base end side enters the corresponding first cutout portion 83. The three first cutouts 83 formed in the first arm 53 respectively hold the pair of second hand elements 54 and the proximal-side second sensor even when the second single-wafer hand 46 is in the lower position. The portion 91 is formed to a depth that does not interfere with the first arm 53. Further, when the first single-wafer hand 45 is in the retracted position and the second single-wafer hand 46 is in the advanced position, the second sensor holding portion 91 on the distal end side does not interfere with the first arm 53 and does not interfere with the first arm 53. 53 is wrong. Accordingly, if the first single-wafer hand 45 is in the retracted position, the second single-wafer hand 46 and the second arm 55 can be located at any position between the upper position and the lower position. Can be smoothly advanced to the advanced position without colliding with the first single-wafer hand 45 or the like.

FIG. 11 is an illustrative perspective view for explaining an operation when the first and second single-wafer hands 45 and 46 are relatively moved in the vertical direction. FIG. 11 shows a state in which the first and second single-wafer hands 45 and 46 are arranged at the retracted positions, and the second single-wafer hand 46 is at the lower position.
The relative movement mechanism 50 (see FIG. 3) relatively moves the first and second single-wafer hands 45 and 46 in the Z direction. Specifically, when the first and second single-wafer hands 45 and 46 are in the retracted positions, the second single-wafer hand 46 is positioned between the upper position and the lower position with respect to the first single-wafer hand 45. To move along the Z direction.

As described above, when the first and second single-wafer hands 45 and 46 are in the respective retracted positions, the first and second single-wafer hands 45 and 46 are configured to mesh with each other so as not to overlap each other when viewed from the Z direction. When the first and second single-wafer hands 45 and 46 are in the retracted positions, the first and second hand elements 52 and 54 are respectively viewed from the first and second arms 53 and 55 in the Z direction. Do not overlap. Therefore, when the first and second single-wafer hands 45 and 46 are in the retracted positions, the first and second single-wafer hands 45 and 46 can be relatively moved in the Z direction without colliding. As a result, the first and second single-wafer hands 45, 46 can be moved relative to each other in the Z direction at each retracted position, and the vertical relationship between the first and second single-wafer hands 45, 46 can be reversed.
[Substrate transport by the second loading / unloading mechanism]
FIG. 12A to FIG. 12D are schematic perspective views for explaining the operation of the second carry-in / out mechanism 5 accompanying the substrate carrying by the second carry-in / out mechanism 5. Below, the board | substrate conveyance by the 2nd carrying in / out mechanism 5 is demonstrated. Substrate conveyance by the second carry-in / out mechanism 5 is performed by the controller 9 in each part of the second carry-in / out mechanism 5, particularly, the first advance / retreat mechanism 47, the second advance / retreat mechanism 48, the relative movement mechanism 50, the integral movement mechanism 49, and the sheet. This is realized by controlling the leaf hand moving mechanism 51.
[Carrying out substrate from hoop by second carry-in / out mechanism]
The unloading of the substrate W from the FOUP F by the second unloading / unloading mechanism 5 is performed after the first and second single wafer hands 45 and 46 are disposed at the transport position P5. Therefore, when the substrate W is unloaded from the FOUP F by the second unloading / unloading mechanism 5, as shown in FIG. 12 (a), the first and second single-wafer hands 45 and 46 are moved by the single-wafer hand. The mechanism 51 is moved along the X direction from the standby position P6 toward the transport position P5. At this time, the batch hand 24 is arranged at a position where it does not collide with the first and second single-wafer hands 45 and 46 such as the facing position P4.

  The first and second single-wafer hands 45, 46 are raised or lowered by the action of the integral moving mechanism 49 in the process of being arranged at the transport position P 5, and the substrate holding position (first holding position) of the second single-wafer hand 46. The position P21 or the second holding position P22) is moved to a predetermined height that is lower than the substrate holding position of the transfer target substrate W in the FOUP F by a minute distance (a distance shorter than the substrate holding pitch in the FOUP F). Alternatively, after being arranged at the transport position P5, it may be moved to the predetermined height.

  Next, the second single-wafer hand 46 is advanced to the forward movement position by the action of the second advance / retreat mechanism 48, and the first single-wafer hand 45 is in the backward movement position, as shown in FIG. It is arranged below the target substrate W. Then, the first and second single-wafer hands 45 and 46 are raised by a small distance (for example, a distance equal to the substrate holding pitch in the hoop F) along the Z direction by the action of the integral moving mechanism 49. As a result, one transport target substrate W in the FOUP F is scooped by the second single-wafer hand 46.

  At this time, if the substrate W picked up by the second single-wafer hand 46 is an unprocessed substrate W, the substrate W is provided with four first support members 87 and 88 provided in the second single-wafer hand 46. It is supported by (support member for unprocessed substrate W). Further, if the substrate W has been processed, it is supported by four second support members 89 and 90 (support members for the processed substrate W) provided in the second single-wafer hand 46. Specifically, the second advance / retreat mechanism 48 is controlled, and the position of the second single-wafer hand 46 is finely adjusted in the second horizontal direction D2.

  After one substrate W is held by the second sheet hand 46, the second sheet hand 46 is retracted to the retracted position. Thereby, one board | substrate W hold | maintained in the FOUP F is carried out. When the second single-wafer hand 46 is retracted to the retracted position, the second single-wafer hand 46 is moved to the first single-wafer hand 45 by the action of the relative movement mechanism 50. It is raised in advance to an upper position above the substrate holding position. Accordingly, when the second single-wafer hand 46 is retracted to the retracted position, the substrate W held by the second single-wafer hand 46 does not collide with the first single-wafer hand 45.

After the substrate W is unloaded from the FOUP F by the second unloading / unloading mechanism 5, the substrate W may be transferred between the first and second single-wafer hands 45 and 46, or the second sheet The substrate W held by the leaf hand 46 may be carried into the same hoop F again. Specifically, for example, the substrates W may be loaded into a substrate holding position having a height different from the position where the substrate W is taken out in the FOUP F, and the substrates W may be rearranged in the FOUP F.
[Carrying substrate into hoop by second carry-in / out mechanism]
Loading of the substrate W into the FOUP F by the second loading / unloading mechanism 5 is achieved by executing the above-described series of substrate unloading operations in the reverse order. Specifically, the height of the first and second single-wafer hands 45 and 46 is changed as necessary by the action of the integral moving mechanism 49, and then the second single-wafer hand 46 is moved forward at the transport position P5. The second single-wafer hand 46 is moved into the hoop F. Then, the first and second single-wafer hands 45 and 46 are lowered by a minute distance (for example, a distance equal to the substrate holding pitch in the hoop F). As a result, the substrate W is placed on one of the substrate holding shelves in the FOUP F, and one substrate W is carried into the FOUP F. Thereafter, the second single-wafer hand 46 is retracted to the retracted position, and the second single-wafer hand 46 is retracted from the hoop F.
[Transfer of substrate between first and second sheet-fed hands]
[Delivery of the substrate from the second single-wafer hand to the first single-wafer hand]
The delivery of the substrate W from the second single-wafer hand 46 to the first single-wafer hand 45 is performed, for example, in a state where the first and second single-wafer hands 45 and 46 are arranged at the transport position P5. The second single-wafer hand 46 is in an upper position where the substrate holding position of the second single-wafer hand 46 is higher than the substrate holding position of the first single-wafer hand 45 in a state where one substrate W is held. Wait. Therefore, the substrate W held by the second single-wafer hand 46 is positioned vertically above the first single-wafer hand 45.

Next, the second single-wafer hand 46 is moved in the Z direction to the lower position where the substrate holding position of the second single-wafer hand 46 is below the substrate holding position of the first single-wafer hand 45 by the action of the relative movement mechanism 50. Descent along. The substrate W held by the second single-wafer hand 46 moves to the first single-wafer hand 45 as the second single-wafer hand 46 descends. Thereby, as shown in FIG. 12C, one substrate W is delivered from the second single-wafer hand 46 to the first single-wafer hand 45. If the substrate W delivered to the first single-wafer hand 45 is an unprocessed substrate W, the substrate W includes four first support members 76 and 77 (unprocessed) provided on the first single-wafer hand 45. Supported by a support member for the substrate W). If the substrate W has been processed, it is supported by four second support members 78 and 79 (support members for the processed substrate W) provided in the first single-wafer hand 45. Specifically, the first advance / retreat mechanism 47 is controlled, and the position of the first single-wafer hand 45 is finely adjusted in the first horizontal direction D1.
[Transfer of substrate from the first single-wafer hand to the second single-wafer hand]
The transfer of the substrate W from the first single-wafer hand 45 to the second single-wafer hand 46 is performed in a state where the first and second single-wafer hands 45 and 46 are arranged at the transport position P5. The second single-wafer hand 46 stands by at a lower position where the substrate holding position of the second single-wafer hand 46 is lower than the substrate holding position of the first single-wafer hand 45. Accordingly, the substrate W held by the first single-wafer hand 45 is positioned vertically above the second single-wafer hand 46.

Next, the second single-wafer hand 46 is moved in the Z direction to the upper position where the substrate holding position of the second single-wafer hand 46 is above the substrate holding position of the first single-wafer hand 45 by the action of the relative movement mechanism 50. Is raised along. The substrate W held by the first single-wafer hand 45 moves to the second single-wafer hand 46 as the second single-wafer hand 46 moves up. As a result, one substrate W is delivered from the first single-wafer hand 45 to the second single-wafer hand 46. If the substrate W delivered to the second single-wafer hand 46 is an unprocessed substrate W, the substrate W includes four first support members 87 and 88 (unprocessed) provided on the second single-wafer hand 46. Supported by a support member for the substrate W). Further, if the substrate W has been processed, it is supported by four second support members 89 and 90 (support members for the processed substrate W) provided in the second single-wafer hand 46.
[Substrate unloading from batch hand by second unloading mechanism]
The substrate W is unloaded from the batch hand 24 by the second unloading / unloading mechanism 5 after the first and second single-wafer hands 45 and 46 are arranged at the transport position P5. Specifically, after the heights of the first and second single-wafer hands 45 and 46 are changed as necessary by the action of the integral moving mechanism 49 (see FIG. 4), the first advance / retreat mechanism 47 (see FIG. 3). 12), the first single-wafer hand 45 is advanced to the advanced position while the second single-wafer hand 46 is in the retracted position, and the conveyance held by the batch hand 24 as shown in FIG. A first single-wafer hand 45 is disposed below the target substrate W. Then, by the action of the integral moving mechanism 49, the first and second single-wafer hands 45 and 46 are raised by a minute distance (for example, a distance equal to the substrate holding pitch in the hoop F) along the Z direction. As a result, the transfer target substrate W is scooped by the first single-wafer hand 45. At this time, if the substrate W scooped by the first single-wafer hand 45 is an unprocessed substrate W, the substrate W is provided with four first support members 76 and 77 provided in the first single-wafer hand 45. It is supported by (support member for unprocessed substrate W). If the substrate W has been processed, it is supported by four second support members 78 and 79 (support members for the processed substrate W) provided in the first single-wafer hand 45.

  After one substrate W is held by the first single-wafer hand 45, the first single-wafer hand 45 is retracted to the retracted position. Thereby, one board | substrate W hold | maintained at the batch hand 24 is carried out. When the first single-wafer hand 45 is retracted to the retracted position, the second single-wafer hand 46 is lowered to the lower position in advance by the action of the relative movement mechanism 50 (see FIG. 3). Therefore, when the first single-wafer hand 45 is retracted to the retracted position, the substrate W held by the first single-wafer hand 45 does not collide with the second single-wafer hand 46.

After the substrate W is unloaded from the batch hand 24 by the second unloading / unloading mechanism 5, the substrate W may be transferred between the first and second single wafer hands 45 and 46, or the first The substrate W held by the single wafer hand 45 may be carried into the batch hand 24 again. Specifically, for example, the substrate W is loaded into the hand element 30 arranged at a position different from the position where the substrate W is taken out in the batch hand 24, and the substrates W are rearranged in the batch hand 24. You may go.
[Substrate loading into batch hand by second loading / unloading mechanism]
Loading of the substrate W into the batch hand 24 by the second loading / unloading mechanism 5 is achieved by executing a series of operations for unloading the substrate from the batch hand 24 in the reverse order. Specifically, the height of the first and second single-wafer hands 45 and 46 is changed as necessary by the action of the integral moving mechanism 49 (see FIG. 4), and then the first single-wafer at the transport position P5. The hand 45 is advanced to the advanced position, and the first single-wafer hand 45 enters the batch hand 24. Then, the first and second single-wafer hands 45 and 46 are lowered by a minute distance (for example, a distance equal to the substrate holding pitch in the batch hand 24). As a result, the substrate W is placed on any one of the hand elements 30 in the batch hand 24, and one substrate W is carried into the batch hand 24. Thereafter, the first single-wafer hand 45 is retracted to the retracted position, and the first single-wafer hand 45 is retracted from the batch hand 24.
[Substrate transport from hoop to batch hand by second transport mechanism]
Substrate conveyance from the hoop F to the batch hand 24 by the second carry-in / out mechanism 5 is achieved by combining the aforementioned operations. Specifically, first, one substrate W is unloaded from the hoop F by the second single-wafer hand 46. Then, a single substrate W is transferred between the first and second single-wafer hands 45 and 46. Next, one substrate W is carried into the batch hand 24 by the first single-wafer hand 45. The second carry-in / out mechanism 5 raises the heights of the first and second single-wafer hands 45 and 46 by the action of the integral moving mechanism 49 (see FIG. 4) when carrying one substrate W into the batch hand 24. The substrate W held at an arbitrary substrate holding position in the FOUP F is transferred to the hand element 30 at an arbitrary height of the batch hand 24.

The second carry-in / out mechanism 5 transports the plurality of substrates W from the FOUP F to the batch hand 24 by transporting the substrates W one by one. Further, as described above, the second carry-in / out mechanism 5 transports the substrate W held at an arbitrary substrate holding position in the FOUP F to the hand element 30 at an arbitrary height of the batch hand 24. The substrates W can be held by the batch hand 24 in an order different from the order in which the substrates W in F are arranged. Further, when less than 25 (for example, several) substrates W are held at unequal intervals in the FOUP F, these substrates W can be held by the batch hand 24 at equal intervals. Further, when several substrates W are held at the middle position in the FOUP F, these substrates W can be fixed and arranged at the upper position or the lower position of the batch hand 24. Furthermore, one test dummy substrate W can be taken out from another hoop F, and a plurality of substrates W including the dummy substrate W can be held in the batch hand 24.
[Substrate transport from batch hand to hoop by second transport mechanism]
Substrate conveyance from the batch hand 24 to the FOUP F by the second carry-in / out mechanism 5 is achieved by combining the aforementioned operations. Specifically, first, one substrate W is unloaded from the batch hand 24 by the first single-wafer hand 45. Then, a single substrate W is transferred between the first and second single-wafer hands 45 and 46. Next, a single substrate W is carried into the FOUP F by the second single-wafer hand 46. The second carry-in / out mechanism 5 changes the heights of the first and second single-wafer hands 45 and 46 by the action of the integral moving mechanism 49 (see FIG. 4) when carrying one substrate W into the FOUP F. Then, the substrate W held by the hand element 30 at an arbitrary height of the batch hand 24 is transported to an arbitrary substrate holding position in the FOUP F.

  The second carry-in / out mechanism 5 transports the plurality of substrates W from the batch hand 24 to the FOUP F by transporting the substrates W one by one. Further, as described above, the second carry-in / out mechanism 5 transports the substrate W held by the hand element 30 at an arbitrary height of the batch hand 24 to an arbitrary substrate holding position in the FOUP F. The substrates W can be accommodated in the FOUP F in an order different from the arrangement order of the substrates W in the hand 24. For example, when a plurality of unprocessed substrates W are conveyed to the batch hand 24 while changing the arrangement of the substrates W in the FOUP F, after the processing for the substrates W is performed in the substrate processing unit 2, these The processed substrate W can be returned to the hoop F in the original arrangement state.

  Thus, in this embodiment, by moving at least one of the first and second single-wafer hands 45 and 46 in the horizontal direction and the vertical direction, the hoop F held in the batch hand 24 or the hoop holding unit 1 is used. On the other hand, a single substrate W can be carried in and out, and a single substrate W can be transported between the batch hand 24 and the FOUP F. That is, one substrate W can be transported by a relatively simple operation. Accordingly, the second carry-in / out mechanism 5 does not require a vertical articulated arm type robot having a complicated structure. Therefore, the second carry-in / out mechanism 5 can have a simple structure as compared with the single-wafer type substrate transfer apparatus to which the vertical articulated arm type robot is applied, and the number of parts of the second carry-in / out mechanism 5 is reduced. be able to. Thereby, the cost of the 2nd carrying in / out mechanism 5 can be reduced significantly.

  In addition, since the first and second single-wafer hands 45 and 46 are not turned in transporting the substrate W, the occupied area (footprint) of the second carry-in / out mechanism 5 is reduced. Further, unlike the case of the vertical articulated arm type robot, it is not necessary to synchronously drive a plurality of drive shafts, so that the vibration of the single-wafer hands 45 and 46 during the substrate transfer can be reduced. Thereby, the substrate W can be stably held.

  Furthermore, by transferring the substrate W between the first and second single-wafer hands 45, 46, 1 is set between the advance position of the first single-wafer hand 45 and the advance position of the second single-wafer hand 46. A single substrate W can be transported. As a result, a sufficient substrate transport distance can be obtained as a whole without taking a large substrate transport distance (horizontal distance between the advance position and the retract position of each sheet hand 45, 46) by each sheet hand 45, 46. Can be secured. Therefore, while suppressing or preventing an increase in the size of the second carry-in / out mechanism 5, a sufficient substrate transfer distance is secured, or the second carry-in / out mechanism 5 is reduced in size while securing a substrate carry distance of a certain value or more. The area occupied by the second carry-in / out mechanism 5 can be reduced.

Furthermore, since the substrate W can be transferred between the first and second single-wafer hands 45 and 46 by a simple operation of relative movement in the Z direction, a relatively simple structure such as an air cylinder. The relative movement mechanism 50 can be configured by these parts. Thereby, the structure of the relative movement mechanism 50 can be simplified, and as a result, the structure of the second carry-in / out mechanism 5 can be simplified. Therefore, the cost of the 2nd carrying in / out mechanism 5 can be reduced.
[Substrate transport by cooperation of second carry-in / out mechanism and other mechanisms]
Next, an operation example when a plurality of substrates W are transported in cooperation with the second carry-in / out mechanism 5, the first carry-in / out mechanism 4, the transfer mechanism 6, and the horizontal transport mechanism 7 will be described. Specifically, a plurality of unprocessed substrates W accommodated in the FOUP F are transported to the batch hand 24 while being rearranged in an order different from the order of the substrates W in the FOUP F, and processed in the substrate processing unit 2. Then, an example of the operation when the substrates W are transferred from the substrate processing unit 2 to the FOUP F will be described.

  A plurality of (for example, 25) unprocessed substrates W accommodated in the FOUP F are carried out by the second carry-in / out mechanism 5. Specifically, a single substrate W is carried out of the FOUP F by the second single-wafer hand 46, and the substrate W is transferred between the first and second single-wafer hands 45 and 46. Then, in a state where each hand element 30 is in a horizontal posture, one substrate W is carried into the batch hand 24 disposed at the facing position P4 by the first single-wafer hand 45. At this time, the first and second single-wafer hands 45 and 46 are moved up and down as necessary by the action of the integral moving mechanism 49, and a single substrate W is carried into the hand element 30 at an arbitrary height of the batch hand 24. Is done.

In this way, the second carry-in / out mechanism 5 transports the substrates W one by one, and transports a plurality of substrates W from the FOUP F to the batch hand 24. As a result, the plurality of unprocessed substrates W accommodated in the FOUP F are transported to the batch hand 24 while being rearranged in an order different from the order of the substrates W in the FOUP F.
Next, the 25 unprocessed substrates W transferred to the batch hand 24 by the second carry-in / out mechanism 5 are collectively delivered from the first carry-in / out mechanism 4 to the transfer mechanism 6. Then, after batch assembly is performed in the horizontal transport holding unit 40, 50 unprocessed substrates W are collectively delivered from the horizontal transport mechanism 7 to the main transport mechanism 3.

  The 50 substrates W transferred to the main transport mechanism 3 are processed by the substrate processing unit 2 and then transferred from the main transport mechanism 3 to the horizontal transport mechanism 7 at a time. 7 is transferred to the transfer mechanism 6 (cancel batch). Then, the 25 processed substrates W transferred to the transfer mechanism 6 are collectively transferred from the transfer mechanism 6 to the batch hand 24.

  After 25 processed substrates W are delivered to the batch hand 24, these substrates W are transferred to the FOUP F (empty FOUP F) held in the FOUP holding unit 1 by the first carry-in / out mechanism 4. The substrates W may be directly carried in, or the substrates W may be carried one by one from the batch hand 24 to the FOUP F by the second carry-in / out mechanism 5. When the second loading / unloading mechanism 5 loads the substrates W one by one into the FOUP F, the substrates W are rearranged in an order different from the order of the substrates W in the batch hand 24, and the arrangement order of the substrates W is changed. You may return to the original arrangement state.

  As described above, in this embodiment, by using the second carry-in / out mechanism 5 that is a single-wafer type substrate transfer apparatus, the substrates W are rearranged in an order different from the order in which the substrates W are arranged in the FOUP F. A plurality of processing methods such as batch processing of a plurality of substrates W or addition of a test dummy substrate W to the plurality of substrates W and batch processing of these substrates W The substrates W can be collectively processed.

  In addition, switching between batch conveyance of a plurality of substrates W and single-wafer conveyance of one substrate is achieved by selecting which of the first carry-in / out mechanism 4 and the second carry-in / out mechanism 5 is driven. Therefore, it is not necessary to exchange hands as in the prior art. Therefore, it does not take a long time to switch between batch conveyance and single wafer conveyance, and substrate conveyance can be performed efficiently. In addition, since the hand exchange unit is unnecessary, the area occupied by the substrate processing apparatus 10 can be reduced.

Further, since it is not necessary to replace the hand, the vertical articulated arm type robot such as the first carry-in / out mechanism 4 and the second carry-in / out mechanism 5 does not need a complex articulated vertical articulated arm type robot as in the prior art. A mechanism having a simpler structure than the type robot can be used as the substrate transport mechanism. Thereby, the cost can be greatly reduced as compared with the prior art. In addition, the first loading / unloading mechanism 4 and the second loading / unloading mechanism 5 according to this embodiment do not require synchronous driving of a plurality of drive shafts as in the case of the vertical articulated arm type robot. It is possible to increase the conveyance speed.
[Other Embodiments]
As mentioned above, although one Embodiment of this invention was described, this invention can also be implemented with another form. For example, in the above-described embodiment, the example in which the present invention is applied to the second carry-in / out mechanism 5 that transports the substrates W one by one between the FOUP F and the batch hand 24 has been described. You may apply this invention to the board | substrate conveyance between places.

  In the above-described embodiment, the first and second single-wafer hands 45 and 46 are each provided with the first support member for the unprocessed substrate W and the second support member for the processed substrate W. In the case where the processed substrate W is carried into the FOUP F, for example, the first carry-in / out mechanism 4 is always used, and the second carry-in / out mechanism 5 is not used. 45 and 46 do not need to be provided with the second support member.

  In the above-described embodiment, the case where the first and second advancing / retracting mechanisms 47 and 48 share a pair of linear guides G2 has been described. However, the first and second advancing and retracting mechanisms 47 and 48 share the pair of linear guides G2. A dedicated linear guide may be provided for each of the two-retreat mechanisms 47 and 48. In the case where a dedicated linear guide is provided, the linear guide for the first advance / retreat mechanism 47 and the linear guide for the second advance / retreat mechanism 48 are arranged so as to overlap each other so as to reduce the occupied area thereof. It is preferable.

  In addition, various design changes can be made within the scope of matters described in the claims.

DESCRIPTION OF SYMBOLS 1 Hoop holding | maintenance part 5 2nd carrying in / out mechanism 10 Substrate processing apparatus 24 Batch hand 26 Hand advance / retreat mechanism 45 1st sheet hand 46 2nd sheet hand 47 1st advance / retreat mechanism 48 2nd advance / retreat mechanism 49 Integrated movement mechanism 50 Relative movement Mechanism 51 single-wafer hand moving mechanism 76 first support member 77 first support member 78 second support member 79 second support member 85 light receiving device 86 light emitting device 87 first support member 88 first support member 89 second support member 90 first 2 support member 94 light-receiving device 95 light-emitting device D1 first horizontal direction D2 second horizontal direction F hoop P5 transport position P6 standby position P11 first holding position P12 (for the first sheet hand) first position (for the first sheet hand) 2 holding position P21 1st holding position P22 (of the 2nd sheet hand) 2nd holding position W board (of the 2nd sheet hand)

Claims (9)

A container holding unit for holding a container for holding a plurality of substrates in a state of being stacked in a vertical orientation in a horizontal posture;
A batch hand for unloading a plurality of substrates from the container held in the container holding unit;
A hand advance / retreat mechanism for moving the batch hand on a movement path including a position where the container is disposed;
A single-wafer type substrate transport apparatus that unloads one arbitrary substrate from a plurality of substrates held in the container at a transport position provided in the movement path;
A single-wafer hand moving mechanism for moving the substrate transfer device between the transfer position and a standby position outside the moving path;
The substrate transfer device includes :
A first single-wafer hand holding one substrate;
A second single-wafer hand holding one substrate;
A first advancing and retracting mechanism for advancing and retracting the first single-wafer hand between a forward movement position and a backward movement position in the first horizontal direction;
A second advancing / retreating mechanism for advancing and retracting the second single-wafer hand between a forward position in the container and a retracted position outside the container in a second horizontal direction opposite to the first horizontal direction;
An integral movement mechanism for integrally moving the first and second single-wafer hands in a vertical direction;
A substrate processing apparatus , comprising: a relative movement mechanism that relatively moves the first and second single-wafer hands in a vertical direction in order to transfer the substrate between the first and second single-wafer hands.   A container holding unit for holding a container for holding a plurality of substrates in a state of being stacked in a vertical orientation in a horizontal posture;
  A batch hand that collectively loads a plurality of substrates into the container held by the container holding unit;
  A hand advance / retreat mechanism for moving the batch hand on a movement path including a position where the container is disposed;
  A single-wafer type substrate transport apparatus that unloads one arbitrary substrate from a plurality of substrates held by the batch hand at a transport position provided in the movement path;
  A single-wafer hand moving mechanism for moving the substrate transfer device between the transfer position and a standby position outside the moving path;
  The substrate transfer device includes:
  A first single-wafer hand holding one substrate;
  A second single-wafer hand holding one substrate;
  A first advancing / retreating mechanism for advancing and retracting the first single-wafer hand between a forward position in the batch hand and a retracted position outside the batch hand in a first horizontal direction;
  A second advancing / retreating mechanism for advancing and retracting the second single-wafer hand between a forward movement position and a backward movement position in a second horizontal direction opposite to the first horizontal direction;
  An integral movement mechanism for integrally moving the first and second single-wafer hands in a vertical direction;
  A substrate processing apparatus, comprising: a relative movement mechanism that relatively moves the first and second single-wafer hands in a vertical direction in order to transfer the substrate between the first and second single-wafer hands. 3. The substrate processing apparatus according to claim 1, wherein the first and second single-wafer hands are formed in a shape that meshes with each other so as not to overlap each other when viewed in the vertical direction when in each retracted position. The first and second single-wafer hands each have a first support member for holding the substrate at a first holding position, and a substrate at a second holding position that partially overlaps the first holding position when viewed from the vertical direction. A second support member for holding
The first support member is provided so as not to contact the substrate held at the second holding position, and the second support member is provided so as not to contact the substrate held at the first holding position. The substrate processing apparatus as described in any one of Claims 1-3. First detection means for detecting the presence or absence of a substrate on the first single-wafer hand;
Further comprising a second detecting means for detecting the presence or absence of a substrate on said second sheet-fed hand, the substrate processing apparatus according to any one of claims 1-4.   The substrate transfer apparatus is shared by the first and second advancing and retracting mechanisms for guiding the first single-wafer hand in the first horizontal direction and guiding the second single-wafer hand in the second horizontal direction. The substrate processing apparatus according to claim 1, further comprising a linear guide.   The substrate processing apparatus according to claim 1, further comprising a base plate that is disposed along a vertical plane and to which the first and second advance / retreat mechanisms are attached. .   The substrate transfer device further includes a first arm that supports the first single-wafer hand, and a second arm that supports the second single-wafer hand,
  The first arm is opposed to the second sheet hand in the second horizontal direction in a state where the second sheet hand is in the retracted position, and has a size that allows the second sheet hand to enter. 1st notch is formed,
  The second arm is opposed to the first single-wafer hand in a first horizontal direction in a state where the first single-wafer hand is in the retracted position, and is large enough to allow the first single-wafer hand to enter. The substrate processing apparatus of any one of Claims 1-7 in which the 2nd notch part of this is formed.   The forward position of the first single-wafer hand is a position where the first single-wafer hand enters the second notch and the first single-wafer hand and the second arm overlap vertically.
  The advance position of the second single-wafer hand is a position where the second single-wafer hand enters the first notch and the second single-wafer hand and the first arm overlap vertically. 2. The substrate processing apparatus according to 1.

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