JP5290890B2 - Substrate processing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accelerate a substrate processing speed while suppressing an occupied area of an apparatus. <P>SOLUTION: The substrate processing apparatus 10 includes a substrate processing unit, a discharge mechanism 70, a carry-in mechanism 71, a pusher 6, and a main carrying mechanism 3. The substrate processing unit collectively processes a plurality of substrates W. The discharge mechanism 70 laterally moves a discharge chuck 73 between a substrate transfer position S and a substrate delivery position P along a first lateral movement route 101. The carry-in mechanism 71 laterally moves a carry-in chuck 74 between the substrate transfer position S and the substrate delivery position P along a second lateral movement route 102 lower than the first lateral movement route 101. The pusher 6 moves up/down an elevation holding unit 105 on the substrate transfer position S. The main carrying mechanism 3 collectively carries the plurality of substrates between the substrate delivery position P and the substrate processing unit. Each of the discharge chuck 73, the carry-in chuck 74 and the elevation holding unit 105 can collectively hold the plurality of substrates W. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a substrate processing apparatus that collectively processes a plurality of substrates. Examples of substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photo A mask substrate is included.

2. Description of the Related Art A substrate processing apparatus that performs processing using a chemical solution on a substrate such as a semiconductor wafer includes a batch type that performs processing on a plurality of substrates at once. An example of a batch type substrate processing apparatus is shown in Patent Document 1 below. This substrate processing apparatus includes a carrier mounting unit, a horizontal transfer robot, a posture changing mechanism, a pusher, a main transfer mechanism, and a substrate processing unit.
The carrier placement unit places a carrier (container) that holds a plurality of substrates in a horizontal posture and stacked in a vertical direction.

  The horizontal transfer robot is composed of an articulated arm type transfer robot, and is configured to expand and contract the articulated arm and turn it around a vertical axis. As a result, the horizontal transfer robot points the articulated arm toward the carrier, puts and removes a plurality of substrates stacked vertically in the horizontal posture with respect to the carrier, and further converts the articulated arm into a posture changing mechanism. For this, a plurality of substrates stacked in the vertical direction in a horizontal posture are transferred to the posture changing mechanism.

The posture changing mechanism is for changing the posture of a plurality of stacked substrates at once between a horizontal posture and a vertical posture.
The pusher is equipped with a holder that can move up and down and move horizontally, and delivers a plurality of substrates in a vertical posture to and from the posture changing mechanism at once, and a plurality of substrates in a vertical posture to and from the main transport mechanism. Deliver in bulk. The holder holds the substrate at a pitch that is half the pitch of the plurality of substrates held by the posture changing mechanism. For example, after 25 substrates are transferred from the posture changing mechanism to the holder, the holder is moved by a minute distance in the horizontal direction along the substrate stacking direction. In that state, another 25 substrates are transferred from the posture changing mechanism to the holder. Twenty-five substrates delivered later enter between the previously delivered 25 substrates, and a batch consisting of a total of 50 substrates is formed on the holder. Forming a batch by combining a plurality of substrate groups in this way is called batch assembly. When the substrate is transferred from the pusher to the posture changing mechanism, 25 of the 50 substrates held by the holder are transferred to the posture changing mechanism, and after the 25 substrates are changed in posture to the horizontal posture, Passed to the transfer robot. Thereafter, the remaining 25 substrates on the holder are transferred to the posture changing mechanism, converted into a horizontal posture, and then discharged by the horizontal transfer robot. In this way, 50 substrates are separated into two groups of 25 substrates each. In this way, separating a plurality of substrates forming a batch into a plurality of substrate groups is called batch release.

  The main transport mechanism has a substrate chuck for holding a plurality of substrates forming a batch in a vertical posture, and moving the substrate chuck in the horizontal direction allows the plurality of substrates constituting the batch to be transferred to the substrate processing unit. On the other hand, it carries in / out. In order to clean the substrate chuck, for example, a chuck cleaning unit is provided below the substrate transfer position between the pusher and the main transport mechanism.

  The substrate processing unit has a plurality of processing units arranged along the moving direction of the main transport mechanism. The processing unit includes a chemical solution tank, a water washing tank, and a drying unit. In the chemical tank, a plurality of substrates in a vertical posture are immersed in a chemical stored in the tank, and the plurality of substrates are collectively subjected to a chemical treatment. A water rinsing tank immerses a plurality of substrates in a vertical position in pure water (deionized water) stored in the tank and performs a rinsing process on the plurality of substrates at once. is there. The drying unit collectively performs a process of supplying an organic solvent (for example, isopropyl alcohol) or shaking off a liquid component on a plurality of substrates.

JP-A-11-354604

  In the substrate processing apparatus according to the above-described prior art, since the substrate transfer path from the pusher to the main transfer mechanism is one system, when the unprocessed substrate is sent to the main transfer mechanism, the processed substrate is transferred from the main transfer mechanism to the pusher. In addition, when a processed substrate is paid out, an unprocessed substrate cannot be fed. Moreover, when unprocessed substrates are sent to the main transport mechanism, batch assembly operations on the pusher holder are required, so the main transport mechanism is forced to wait for a long time before dispensing the processed substrates. There is.

It is conceivable that a pusher is added and one pusher is used for the forward transfer from the posture changing mechanism to the main transfer mechanism, and the other pusher is used for the backward transfer from the main transfer mechanism to the posture changing mechanism. However, with such a configuration, an increase in the occupation area (footprint) of the apparatus is inevitable.
SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus capable of improving the substrate processing speed while suppressing the area occupied by the apparatus.

  In order to achieve the above object, the invention described in claim 1 is a substrate processing unit that collectively processes a plurality of substrates in a vertical posture, and holds the plurality of substrates in a vertical posture in a lump. A first traversing mechanism that traverses the first traversing holding section between the substrate transfer position and the substrate transfer position along the first traversing path; and a second that collectively holds a plurality of substrates in a vertical posture. A second traversing mechanism that traverses the traverse holding portion along the second traversing path below the first traversing path between the substrate transfer position and the substrate transfer position; and a plurality of vertical postures A plurality of substrates in a vertical posture are collectively transported between a lifting mechanism that lifts and lowers the substrate holding unit collectively at the substrate transfer position, and the substrate transfer position and the substrate processing unit. A substrate processing apparatus including a main transport mechanism.

  According to this configuration, the transport of the substrate between the substrate transfer position and the substrate transfer position passes through the first and second traversing paths arranged vertically by the first traversing mechanism and the second traversing mechanism. Done. In other words, the substrate transfer between the substrate transfer position and the substrate transfer position can be performed by two transfer paths. Thus, the substrate transfer from the substrate transfer position to the substrate transfer position is performed by one of the first and second traversing mechanisms, and the substrate is transferred from the substrate transfer position to the substrate transfer position by the first and second. This can be done by the other side of the traversing mechanism.

  For example, the processed substrate processed by the substrate processing unit is transferred to the substrate transfer position by the main transfer mechanism, and transferred to the first traverse holding unit at the substrate transfer position. The first traverse holding unit traverses to the substrate transfer position through the first traverse path. At this substrate transfer position, the lifting / lowering holding part of the lifting / lowering mechanism moves up and down, whereby the substrate held by the first traverse holding part is transferred to the lifting / lowering holding part.

  On the other hand, when the unprocessed substrate is carried in, the second traverse holding unit is moved to the substrate transfer position. Then, the unprocessed substrate previously held in the lift holding unit is transferred to the second traverse holding unit by the lifting and lowering of the lift holding unit. Thereafter, the second traverse holding unit traverses from the transfer position to the substrate transfer position. At this substrate transfer position, the substrate held by the second traverse holding unit is transferred to the main transfer mechanism, and the main transfer mechanism transfers the substrate to the substrate processing unit.

Therefore, the main transport mechanism can operate to receive the unprocessed substrate from the second traverse holding unit after the processed substrate is discharged to the first traverse holding unit, and the unprocessed substrate is carried into the substrate transfer position. The processed substrate can be dispensed without waiting for completion. As a result, the retention of the substrate transport can be suppressed, and the substrate processing speed can be improved.
In addition, since the first and second traversing mechanisms traverse the first and second traversing holding portions through the first and second traversing paths set up and down, the two transport paths are provided. Therefore, the occupied area of the apparatus can be suppressed.

Preferably, the first traversing mechanism is dedicated to carrying out processed substrates, and the second traversing mechanism is dedicated to carrying in unprocessed substrates. As a result, the processed substrate can be conveyed through the upper path, so that the processed substrate can be maintained in a clean state.
According to a second aspect of the present invention, a plurality of substrates in a horizontal posture are collectively converted from a horizontal posture to a vertical posture and transferred to the lifting mechanism at the substrate transfer position, and the substrate transfer position The substrate processing apparatus according to claim 1, further comprising a posture conversion mechanism that collectively receives a plurality of substrates held in a vertical posture by the lifting mechanism and changes the posture from a vertical posture to a horizontal posture.

  In this configuration, as described in claim 3, the substrate processing apparatus is held by a container holding unit that holds a container that holds a plurality of substrates in a horizontal posture, and the container holding unit. And a loading / unloading mechanism for collectively loading / unloading a plurality of substrates in a horizontal posture with respect to the container and transferring the plurality of substrates in a horizontal posture to / from the posture changing mechanism. Is preferred.

With this configuration, a plurality of substrates can be taken out from a container that accommodates a plurality of substrates in a horizontal posture and processed. Further, a plurality of substrates after processing can be accommodated in the container.
According to a fourth aspect of the present invention, a first substrate transport path between the carry-in / out mechanism and the lift mechanism and a second substrate transport path between the lift mechanism and the substrate delivery position are at a predetermined angle. The substrate processing apparatus according to claim 3, wherein the elevating mechanism is disposed at an intersection of the first and second substrate transfer paths.

  With this configuration, it is easier to secure the installation space for the carry-in / out mechanism as compared with the case where the first substrate conveyance path and the second substrate conveyance path are linearly connected. As a result, the area occupied by the apparatus can be reduced. Furthermore, alignment of the carry-in / out mechanism, the posture changing mechanism, the lifting mechanism, and the substrate delivery position is facilitated. That is, when aligning them, the carry-in / out mechanism and the posture changing mechanism are aligned along the first substrate transfer path, the elevating mechanism and the substrate delivery mechanism are aligned along the second substrate transfer path, and the elevating mechanism is What is necessary is just to arrange | position at the intersection of 1 and a 2nd board | substrate conveyance path | route. Such alignment is much easier than in the case where the carry-in / out mechanism, the posture changing mechanism, the lifting mechanism and the substrate delivery position are aligned on the same straight line.

  According to a fifth aspect of the present invention, the carry-in / out mechanism includes a batch hand that holds a plurality of substrates in a horizontal posture, a hand advance / retreat mechanism that moves the batch hand forward and backward, and a vertical movement of the batch hand. A turning drive mechanism for turning around the axis may be included. In this case, the hand advance / retreat direction when the batch hand accesses the container held by the container holding part may be a horizontal direction perpendicular to the second substrate transfer path.

  In this configuration, the batch hand can be moved forward and backward to take out a plurality of substrates in a horizontal posture from the container, and thereafter, the batch hand can be turned to pass the substrates to the posture changing mechanism. In addition, a batch hand receives a plurality of substrates in a horizontal posture from the posture changing mechanism in a batch, and then turns the batch hand and further advances and retreats the batch hand so that the substrates are batched in the container. Can be accommodated. Since the first and second substrate transport paths intersect at a predetermined angle, it is possible to easily secure the installation space for the carry-in / out mechanism while securing the stroke when the batch hand accesses the container. Therefore, it is advantageous for reducing the occupied area of the apparatus.

  According to a sixth aspect of the present invention, the elevating mechanism has a first posture that holds a plurality of substrates in a vertical posture along the first substrate transfer path and a vertical posture along the second substrate transfer route. It is preferable to include a rotation drive mechanism for rotating the lifting and lowering holding portion around the vertical axis between the second posture for holding the plurality of substrates. Thereby, the raising / lowering holding | maintenance part can deliver a board | substrate between a 1st and 2nd traversing mechanism and an attitude | position change mechanism.

  According to a seventh aspect of the present invention, the elevating mechanism moves a plurality of substrates in a vertical posture from the elevating holding unit to the second traversing holding unit by elevating the elevating holding unit in the vertical direction. It is preferable that a plurality of substrates in a vertical posture held by the first traverse holding part are collectively received by the elevating / holding part by collectively transferring and raising / lowering the elevating / lowering part in the vertical direction. As a result, the second traverse holding unit can be used for carrying in the substrate, and the first traverse holding unit can be used for carrying out the substrate. By using the first row holding unit disposed above the second row holding unit for carrying out the processed substrate, it is possible to prevent the foreign matter from dropping from the unprocessed substrate to the processed substrate.

The invention according to claim 8 further includes an intermediary mechanism that raises and lowers an intermediary holding portion that collectively holds a plurality of substrates at the substrate transfer position. It is a processing device.
According to this configuration, the substrate can be delivered to and from the first and / or second traversing holding unit by raising and lowering the mediation holding unit.

For example, as described in claim 9, the intermediary mechanism moves the intermediary holding part up and down at the substrate transfer position, thereby collectively bringing a plurality of substrates into and out of the second traverse holding part. It is preferable that it is handed over.
Accordingly, for example, the second traverse holding unit can transfer the unprocessed substrate to the mediation holding unit after the unprocessed substrate is transferred from the substrate transfer position to the substrate transfer position. Accordingly, the second traverse holding unit can operate to receive the next unprocessed substrate from the lifting mechanism. Therefore, since the unprocessed substrate can be waited in the mediation holding unit until it is received by the main transport mechanism, the waiting time until the second traverse holding unit operates to carry in the next unprocessed substrate is shortened. can do. Thereby, the substrate processing speed can be further improved.

In this case, as described in claim 10, the main transport mechanism batches a plurality of substrates between the first traverse holding unit and the mediation holding unit at the substrate delivery position. It is preferable to deliver.
Thereby, for example, the main transport mechanism can operate so as to pay out the processed substrate to the first traverse holding unit and receive the unprocessed substrate from the mediation holding unit. In this case, the mediation holding unit functions as a buffer (standby place) from when the unprocessed substrate is carried into the substrate delivery position by the second traversing holding unit until the unprocessed substrate is delivered to the main transport mechanism. be able to. As a result, for example, when there is a change in the time interval for carrying in the substrate due to a change in substrate processing conditions, the change in the time interval can be absorbed by the mediation holding unit. Thereby, since stagnation of substrate loading can be suppressed, the substrate processing speed can be further improved.

The invention according to claim 11 further includes a substrate direction alignment mechanism that is provided below the second traversing path at the substrate transfer position and aligns the directions of the plurality of substrates. The substrate processing apparatus according to one item.
According to this configuration, since the substrate direction alignment mechanism is disposed at the substrate delivery position, the substrate direction alignment mechanism can be provided without increasing the occupied area.

  According to a twelfth aspect of the present invention, the substrate direction alignment mechanism may perform a substrate direction alignment process on the substrate held by the second traverse holding unit at the substrate transfer position. . The substrate direction aligning process refers to a process of aligning the notch part when a notch part (notch or orientation flat) representing a crystal direction or the like is formed on a circular substrate such as a semiconductor wafer.

  In addition, as described in claim 13, the first traverse holding portion includes a pair of substrate guides parallel to each other, an open state in which an interval between the pair of substrate guides is wider than a width of the substrate, It is preferable to include a guide opening / closing means that changes between a closed state narrower than a width of the lift holding portion and wider than a width of the lift holding portion. In a state where the pair of substrate guides in the closed state hold the substrate, when the lifting / lowering holding unit is raised so as to pass between the pair of substrate guides, the substrate can be transferred from the substrate guide to the lifting / lowering holding unit. When the pair of substrate guides are opened after the substrate is transferred to the elevation holding unit, the elevation holding unit and the substrate held thereby can be lowered through the pair of substrate guides. In this way, the substrate can be passed from the first traverse holding unit to the lifting / lowering holding unit.

1 is a schematic plan view for explaining an overall configuration of a substrate processing apparatus according to an embodiment of the present invention. It is an enlarged plan view for demonstrating the structure relevant to the board | substrate conveyance between a hoop and the main conveyance mechanism. It is an elevation view seen from arrow A1 of FIG. 2A. It is a top view of a posture conversion mechanism. It is a see-through | perspective elevation for demonstrating the internal structure of an attitude | position conversion mechanism. It is an elevation for demonstrating the structure of a pusher. It is a figure for demonstrating the structure relevant to a delivery mechanism, and is the elevation view seen from the arrow A2 direction of FIG. 2A. It is a see-through | perspective side view for demonstrating the structure of the traversing mechanism of a payout mechanism. It is a figure for demonstrating the structure of a discharge chuck | zipper. It is a figure for demonstrating the structure of a carrying-in chuck | zipper. It is a figure for demonstrating the structure of a mediation chuck | zipper. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an illustration explanatory drawing for demonstrating the flow of board | substrate carrying-in operation | movement. It is an explanatory explanatory view for explaining a flow of substrate carrying-out operation. It is an explanatory explanatory view for explaining a flow of substrate carrying-out operation. It is an explanatory explanatory view for explaining a flow of substrate carrying-out operation. It is an explanatory explanatory view for explaining a flow of substrate carrying-out operation. It is an explanatory explanatory view for explaining a flow of substrate carrying-out operation. It is an explanatory explanatory view for explaining a flow of substrate carrying-out operation. It is an explanatory explanatory view for explaining a flow of substrate carrying-out operation. It is an explanatory explanatory view for explaining a flow of substrate carrying-out operation. It is an explanatory explanatory view for explaining a flow of substrate carrying-out operation. It is an explanatory explanatory view for explaining a flow of substrate carrying-out operation. It is an explanatory explanatory view for explaining a flow of substrate carrying-out operation.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an illustrative plan view for explaining the overall configuration of a substrate processing apparatus according to an embodiment of the present invention. The substrate processing apparatus 10 includes a FOUP holding unit 1, a substrate processing unit 2, a main transport mechanism 3, a carry-in / out mechanism 4, a posture changing mechanism 5, a pusher 6, a delivery mechanism 7, a chuck cleaning unit 8, and a controller 9. (Control unit).

  The hoop holding unit 1 is disposed at one corner of the substrate processing apparatus 10 formed in a substantially rectangular shape in plan view. The hoop holding unit 1 is a container holding unit that holds a hoop F as a container that holds a plurality of (for example, 25) substrates W in a horizontal posture in a stacked state in the Z direction (vertical direction, vertical direction). It is. An automatic hoop conveyance device 11 indicated by a two-dot chain line is arranged so as to face the front surface 10a of the substrate processing apparatus 10 (corresponding to one short side in a plan view). The automatic hoop conveyance device 11 serves to supply the hoop F containing the unprocessed substrate W to the hoop holding unit 1 and the hoop F (empty hoop) to store the processed substrate W to the hoop holding unit 1. It has a function of supplying and a function of retracting the hoop F held in the hoop holding unit 1 in order to exchange the hoop held in the hoop holding unit 1. In this embodiment, the substrate W is a circular substrate such as a semiconductor wafer. For example, a semiconductor wafer has a notch for expressing the crystal direction at the peripheral edge.

  The substrate processing unit 2 includes a plurality of processing units 20 (processing units) arranged along the Y direction (horizontal direction) along the side surface (corresponding to one long side in plan view) 10b of the substrate processing apparatus 10. . The plurality of processing units 20 include a first chemical liquid tank 21, a first rinse liquid tank 22, a second chemical liquid tank 23, a second rinse liquid tank 24, and a drying processing section 25. The first chemical solution tank 21 and the second chemical solution tank 23 store chemical solutions of the same type or different types, respectively, and immerse a plurality of substrates W in the chemical solutions in a lump. The first rinsing liquid tank 22 and the second rinsing liquid tank 24 each store a rinsing liquid (for example, pure water), and immerse a plurality of (for example, 52 sheets) of substrates W in the rinsing liquid. The surface is rinsed.

  In this embodiment, the first chemical liquid tank 21 and the first rinse liquid tank 22 adjacent thereto are paired, and the second chemical liquid tank 23 and the second rinse liquid tank 24 adjacent thereto are paired. It has become. Then, the first lifter 27 as a dedicated transport mechanism for transferring the substrate W treated with the chemical solution in the first chemical solution tank 21 to the first rinse solution tank 22 and the substrate W treated with the chemical solution in the second chemical solution tank 23 A second lifter 28 is provided as a dedicated transport mechanism for transfer to the 2-rinse liquid tank 24. The first and second lifters 27 and 28 each have a substrate support portion that supports a plurality of (for example, 52) substrates W in a vertical posture stacked in the X direction (horizontal direction), and the substrate support portions. An elevating drive mechanism that moves up and down and a traverse drive mechanism that traverses the substrate support portion along the Y direction are provided. The X direction is a horizontal direction along the front surface 10a of the substrate processing apparatus 10 and is a direction orthogonal to the Y direction.

  With this configuration, the first lifter 27 collectively receives a plurality of substrates W stacked in the X direction in a vertical posture from the main transport mechanism 3, and lowers the plurality of substrates W into the first chemical tank 21. And soak in the chemical. Further, after waiting for a predetermined chemical solution processing time, the first lifter 27 raises the substrate support portion to pull up the plurality of substrates W from the chemical solution, and causes the substrate support portion to traverse to the first rinse liquid tank 22. Further, the substrate support portion is lowered into the first rinsing liquid tank 22 and immersed in the rinsing liquid. After waiting for a predetermined rinsing time, the first lifter 27 raises the substrate support portion and pulls up the substrate W from the rinse liquid. Thereafter, a plurality of substrates W are collectively delivered from the first lifter 27 to the main transport mechanism 3. Similarly, the second lifter 28 collectively receives a plurality of substrates W stacked in the X direction in a vertical posture from the main transport mechanism 3, and lowers the plurality of substrates W into the second chemical tank 23. Immerse in the chemical. Further, after waiting for a predetermined chemical solution processing time, the second lifter 28 raises the substrate support portion to pull up the plurality of substrates W from the chemical solution, and causes the substrate support portion to traverse to the second rinse liquid tank 24. Further, the substrate support portion is lowered into the second rinse liquid tank 24 and immersed in the rinse liquid. After waiting for a predetermined rinsing time, the second lifter 28 raises the substrate support portion and pulls up the substrate W from the rinse liquid. Thereafter, a plurality of substrates W are collectively delivered from the second lifter 28 to the main transport mechanism 3.

  The drying processing unit 25 has a substrate holding mechanism that holds a plurality of (for example, 52) substrates W stacked in the X direction in a vertical posture. An organic solvent (such as isopropyl alcohol) is used in a reduced pressure atmosphere. The substrate W is dried by supplying it to the substrate W or by shaking off the liquid component on the surface of the substrate W by centrifugal force. The drying processing unit 25 can deliver the substrate W to and from the main transport mechanism 3.

  The main transport mechanism 3 includes a pair of substrate chucks (clamping mechanisms) 30 serving as a substrate batch holding unit that collectively holds a plurality of (for example, 52) substrates W in a vertical posture while being stacked in the X direction, and the substrate chuck. 30, a chuck driving mechanism for operating the substrate chuck 30, a horizontal driving mechanism for moving the substrate chuck 30 horizontally (transverse) along the Y direction, and a lift driving mechanism for moving the substrate chuck 30 up and down along the Z direction. . Each of the pair of substrate chucks 30 includes a pair of shaft-like support guides 31 extending in the X direction, and a plurality of substrates W in a vertical posture are received on opposite sides of each support guide 31 from below. A plurality of substrate support grooves for supporting are formed at intervals in the axial direction. The chuck drive mechanism expands or contracts the distance between the pair of support guides 31 by rotating the pair of substrate chucks 30 in the direction of the arrow 33. Thereby, the substrate chuck 30 performs an opening / closing operation for switching between a holding state in which the substrate W is held and held and a release state in which the holding of the substrate W is released. The substrate W can be transferred between the first and second lifters 27 and 28 and the substrate chuck 30 by the opening / closing operation and the vertical movement of the first and second lifters 27 and 28. The main transport mechanism 3 further delivers a plurality of substrates W to and from the drying processing unit 25 in a state of being stacked in the X direction in a vertical posture.

The main transport mechanism 3 receives a plurality of unprocessed substrates W stacked in the X direction in a vertical posture at the substrate transfer position P, and receives a plurality of processed substrates W stacked in the X direction in a vertical posture at the substrate transfer position. Works like paying out with P.
The chuck cleaning unit 8 is disposed between the substrate delivery position P and the processing unit 20. The chuck cleaning unit 8 has a cleaning tank 35 in which a pair of openings into which a pair of substrate chucks 30 are respectively inserted are formed on the upper surface. In the cleaning tank 35, the substrate chuck 30 (particularly the support guide 31) is cleaned using a cleaning liquid. The main transport mechanism 3 inserts the substrate chuck 30 into the cleaning tank 35 of the chuck cleaning unit 8 before transporting the processed substrate W after the drying processing in the drying processing unit 25 is completed. Then, after the substrate chuck 30 is cleaned in the cleaning tank 35, the main transport mechanism 3 operates so as to collectively receive the processed substrates W from the drying processing unit 25. The main transport mechanism 3 can narrow the distance between the pair of support guides 31 provided at the lower end of the substrate chuck 30. Therefore, if the cleaning process in the cleaning tank 35 is performed in a state where the interval between the support guides 31 is narrowed, the cleaning tank 35 can be reduced in size, so that the area occupied by the substrate processing apparatus 10 can be suppressed.

  A shutter 15 is provided between the chuck cleaning unit 8 and the substrate delivery position P. The shutter 15 is opened when the main transport mechanism 3 moves from the substrate delivery position P to the processing unit 20 side and when the main transport mechanism 3 moves from the processing unit 20 side to the substrate delivery position P. The period is kept closed. As a result, leakage of the chemical atmosphere on the processing unit 20 side is suppressed or prevented.

FIG. 2A is an enlarged plan view for explaining a configuration related to substrate conveyance between the FOUP F and the main conveyance mechanism 3. The carry-in / out mechanism 4 faces the hoop holding unit 1. An opener 12 for opening and closing a lid closing the front surface of the hoop F is disposed on the side of the carry-in / out mechanism 4 of the hoop holding unit 1.
On the substrate delivery position P side of the carry-in / out mechanism 4, the attitude changing mechanism 5 is arranged. A pusher 6 is disposed on the substrate transfer position P side of the posture conversion mechanism 5. A delivery mechanism 7 is disposed at the substrate delivery position P. The delivery mechanism 7 operates to transport the substrate W between the substrate transfer position S that is the position of the pusher 6 and the substrate delivery position P.

  The transport path TP1 between the carry-in / out mechanism 4 and the pusher 6 and the transport path TP2 between the pusher 6 and the substrate delivery position P intersect at a predetermined angle (for example, 170 degrees to 185 degrees). ing. That is, the transport path TP2 is parallel to the X direction, while the transport path TP1 forms a skew path that is skewed away from the front surface 10a as it goes from the pusher 6 toward the transporting mechanism 4. A carry-in / out mechanism 4, an attitude changing mechanism 5, and a pusher 6 are arranged along the transport path TP1. A substrate transfer position S and a substrate delivery position P where the pushers 6 are arranged are arranged along the transport path TP2. Therefore, the pusher 6 is disposed at the intersection of the transport paths TP1 and TP2.

  Such an arrangement is useful for reducing the occupation area (footprint) of the substrate processing apparatus 10 while securing a hand stroke when the carry-in / out mechanism 4 accesses the FOUP F along the Y direction. Further, if the conveyance path from the carry-in / out mechanism 4 to the substrate delivery position P is a straight line, the carry-in / out mechanism 4, the posture changing mechanism 5, the pusher 6 and the substrate delivery position P must be arranged on a straight line, and the accuracy thereof Adjustment to ensure the is a difficult task. On the other hand, in this embodiment, since the transport paths TP1 and TP2 intersect each other at a predetermined angle, the carry-in / out mechanism 4 and the attitude conversion mechanism 5 are aligned along the transport path TP1, Since the pusher 6 and the substrate transfer position P are aligned along the transport path TP2, and the pusher 6 has only to be arranged at the intersection of the transport paths TP1 and TP2, the adjustment becomes easy.

  FIG. 2B is an elevation view seen from the arrow A1 in FIG. 2A. However, the chuck cleaning unit 8 is not shown. The carry-in / out mechanism 4 includes a single-wafer hand 39 that can hold a single substrate W, and a batch hand 40 that is a multiple-sheet holding hand that can hold a plurality of substrates W in a stacked state. The hand support portion 41 that supports these hands 39, 40, the turning block 42, the lifting block 43 that supports the turning block 42 so as to be rotatable around the vertical axis, and the lifting block 43 can be raised and lowered freely. And a base portion 44 to be supported. The hand support 41 has a built-in hand advance / retreat mechanism 41 </ b> A for independently moving the single-wafer hand 39 and the batch hand 40 in the horizontal direction. The turning block 42 supports the hand support portion 41 and turns around the vertical axis by the action of the built-in turning drive mechanism 42A, thereby turning the hands 39 and 40 around the vertical axis together with the hand support portion 41. By this turning, the hands 39 and 40 can be made to face the hoop F or the posture changing mechanism 5. The base unit 44 incorporates an elevating drive mechanism (not shown) for elevating the elevating block 43 along the Z direction. The hands 39 and 40 can be moved up and down by the action of the lifting drive mechanism. By this vertical movement and the advance / retreat operation by the hand advance / retreat mechanism, the hands 39, 40 can carry the substrate W into and out of the hoop F and transfer the substrate W to / from the posture changing mechanism 5.

  The batch hand 40 includes a plurality of (for example, 25) hand elements stacked at the same interval as the substrate holding interval in the hoop F, and, for example, 25 substrates W are collectively collected by the plurality of hand elements. Can be held. Therefore, by using the batch hand 40, for example, 25 substrates W are collectively loaded into / unloaded from the FOUP F, and 25 substrates W are collectively transferred to and from the attitude changing mechanism 5. .

  The single-wafer hand 39 holds one substrate W. For example, in addition to 25 substrates W, a dummy substrate for testing is added and processed simultaneously, or the substrates W in the FOUP F are arranged. It is used to rearrange and process the substrates W in an order different from the order. By using this single wafer hand 39, one substrate W is carried in / out with respect to the FOUP F, and one substrate W is transferred to and from the posture changing mechanism 5.

  The posture conversion mechanism 5 changes the posture of the substrate W between a horizontal posture and a vertical posture. More specifically, the posture conversion mechanism 5 collectively receives a plurality of substrates W stacked in the vertical direction in the horizontal posture from the loading / unloading mechanism 4, and these substrates W are stacked in the horizontal direction in the vertical posture. The posture is changed to a different posture. The plurality of substrates W in the vertical posture are transferred to the pusher 6. Further, the posture conversion mechanism 5 collectively receives a plurality of substrates W stacked in the vertical direction in the vertical posture from the pusher 6, and converts the postures of these substrates W into the posture stacked in the vertical direction in the horizontal posture. To do. The plurality of substrates W in the horizontal posture are delivered to the carry-in / out mechanism 4.

  The pusher 6 is an elevating mechanism having an elevating / holding unit 105 that collectively receives a plurality of substrates W stacked in a horizontal direction in a vertical posture from the posture changing mechanism 5. At the substrate transfer position S, the pusher 6 can move the lifting / lowering holding unit 105 up and down in the Z direction, rotate it around the vertical axis, and linearly move along a small distance (for example, 5 mm) along the X direction. Can be moved. More specifically, the elevation holding unit 105 includes an origin height H10, a first transfer height H11 that is higher than the origin height, and a second transfer height H12 that is higher than the first transfer height H11. Change the height to

  The pusher 6 can deliver a plurality of substrates W to and from the posture changing mechanism 5 by the vertical movement of the lifting and lowering holding unit 105. The lifting / lowering holding unit 105 transfers the number of substrates W (for example, 52) twice as many as the number of postures (for example, 26) to which the posture changing mechanism 5 changes the posture at a time (for example, 52) within the substrate holding pitch (in the FOUP F). Is held at a half pitch (half pitch).

  For example, after 25 substrates W are transferred from the posture changing mechanism 5 to the lifting / lowering holding unit 105, the lifting / lowering holding unit 105 is rotated 180 degrees. The turning center axis of the lifting / lowering holding unit 105 is eccentric in the substrate alignment direction by half of the half pitch with respect to the center of the plurality of substrate holding positions. Therefore, the held 25 substrates W are moved by a half pitch by the rotation of 180 degrees. In this state, another 25 substrates W are transferred from the posture changing mechanism 5 to the lift holding unit 105. As a result, the 25 substrates W passed later enter between the previously delivered 25 substrates W, and a batch consisting of a total of 50 substrates is formed on the lift holding unit 105. In this way, batch assembly is performed in which a plurality of substrate groups are combined to form a batch. At this time, the pair of adjacent substrates W are in a state (face-to-face) in which the front surfaces (or the back surfaces) face each other.

There may be a case where processing is desired in a state (face-to-back) where the surfaces of all the substrates W are directed in the same direction and the surface of each substrate W faces the back surface of the adjacent substrate W. In this case, instead of the 180-degree turning operation described above, the lifting / lowering holding unit 105 is horizontally moved by a minute distance corresponding to a half pitch. This allows face-to-back batch assembly.
When the substrate W is transferred from the pusher 6 to the posture changing mechanism 5, for example, 25 of the 50 substrates W held by the lift holding unit 105 are transferred to the posture changing mechanism 5, and the 25 substrates W are transferred. Is transferred to the loading / unloading mechanism 4 after being converted into a horizontal posture. Thereafter, the elevation holding unit 105 is rotated 180 degrees or horizontally moved by a half pitch. In this state, the remaining 25 substrates W on the lifting and lowering holding unit 105 are transferred to the posture changing mechanism 5, changed in posture to a horizontal posture, and then discharged by the carry-in / out mechanism 4. In this way, 50 substrates W are separated into two groups of 25 substrates each.

The delivery mechanism 7 includes a payout mechanism 70, a carry-in mechanism 71, and an intermediary mechanism 72, which collectively hold a plurality of substrates W stacked in the horizontal direction (X direction) in a vertical posture. Chucks 73, 74, and 75 are provided, respectively.
A chuck 73 (hereinafter referred to as “delivery chuck 73”) of the delivery mechanism 70 is disposed above a chuck 74 (hereinafter referred to as “delivery chuck 74”) of the carry-in mechanism 71. The payout mechanism 70 traverses (horizontal movement) the payout chuck 73 as the first traverse holding portion along the X direction along the first traverse path 101 set at the payout height H0, thereby moving the substrate W. This is a first traversing mechanism that transports from the substrate transfer position P to the substrate transfer position S (the position of the pusher 6). That is, the delivery chuck 73 receives the processed substrate W from the main transport mechanism 3 at the delivery height H0 at the substrate delivery position P, and delivers the substrates W to the substrate transfer position S at the delivery height H0. The pusher 6 raises the lifting / lowering holding unit 105 to the second transfer height H <b> 12 to receive the substrate W from the dispensing chuck 73.

  The carry-in mechanism 71 traverses along the X direction (transverse movement) the carry-in chuck 74 as the second traverse holding portion along the second traverse path 102 set to the carry-in height H1 lower than the payout height H0. This is a second traversing mechanism that transports the substrate W from the substrate transfer position S to the substrate transfer position P. That is, the carry-in chuck 74 transfers unprocessed substrates W from the lifting / lowering holding unit 105 of the pusher 6, transports the substrates W to the substrate transfer position P, and holds them at the carry-in height H <b> 1.

  The mediation mechanism 72 receives the substrate W from the carry-in chuck 74 by moving up and down a chuck 75 (hereinafter referred to as “mediation chuck 75”) as an intermediary holding portion in a region below the payout height H0. It is an intermediary mechanism that raises W to a transfer height H2 that is between the payout height H0 and the carry-in height H1. The substrate W held by the transfer chuck 75 at the transfer height H2 is received by the main transport mechanism 3.

  When the mediation mechanism 72 receives the substrate W from the carry-in chuck 74, the carry-in chuck 74 can receive the next batch of substrates W from the pusher 6 without waiting for the operation of the main transfer mechanism 3. That is, since the mediation chuck 75 provides a buffer position, it absorbs a timing shift between the operations of the carry-in / out mechanism 4, the posture changing mechanism 5, the pusher 6, and the like and the operation of the main transport mechanism 3. Thereby, the board | substrate carrying-in operation by the carrying-in chuck | zipper 74 can be performed smoothly. In particular, when the substrate processing conditions (so-called recipe) are changed, a waiting time may occur at the substrate transfer position P. However, since the substrate W can be kept on standby at the intermediate chuck 75, the loading / unloading mechanism 4, It is possible to eliminate or shorten the waiting time that occurs in the posture conversion mechanism 5 and the operation of the pusher 6 and the like.

  At the substrate delivery position P, a substrate direction alignment mechanism 13 is disposed below the carry-in height H1 as necessary. The substrate direction alignment mechanism 13 aligns the direction of the substrate W (for example, the direction of the notch of the semiconductor wafer) constituting the batch held by the carry-in chuck 74 at the carry-in height H1 at the substrate transfer position P. The substrate W that has been subjected to the substrate alignment process by the substrate direction alignment mechanism 13 is carried to the transfer height H2 by the mediation chuck 75.

  The substrate direction alignment mechanism 13 includes an alignment processing head 16 and an elevating mechanism 17 that raises and lowers the alignment processing head 16 (see also FIG. 5). The alignment processing head 16 includes a pair of substrate guides 18 arranged to face each other with an interval in the Y direction, and a roller mechanism 19 disposed between the pair of substrate guides 18. Although detailed illustration is omitted, the roller mechanism 19 is formed on a roller that contacts each of a plurality of lower peripheral edges stacked in the horizontal direction and rotates each substrate W around the center, and on the peripheral edge of the substrate W. And an engaging member that engages with the notch to regulate the rotation of the substrate W.

  When performing the substrate alignment processing, the alignment processing head 16 is raised to the vicinity of the carry-in height H1, and the substrate W held by the carry-in chuck 74 is supported on the roller of the roller mechanism 19, and only a small distance from the carry-in chuck 74. lift. When the roller mechanism 19 is operated in this state, the substrate W rotates while being guided by the substrate guide 18. When the roller mechanism 19 is operated for a time required for one rotation of the substrate W, the notches of all the substrates W are engaged with the engaging members, and the notches are aligned linearly. Thereby, the direction of the substrate W (the crystal direction in the case of a semiconductor wafer) is aligned. Thus, after the substrate alignment processing is performed, the alignment processing head 16 is lowered by the elevating mechanism 17, and the substrate W after the alignment processing is transferred to the carry-in chuck 74.

  3A is a plan view of the posture changing mechanism 5, and FIG. 3B is a perspective elevation view for explaining the internal structure. The posture changing mechanism 5 includes a base 49 fixed to the frame of the substrate processing apparatus, a rotating block 50, a pair of first holding mechanisms 51 attached to the rotating block 50, and the rotating block 50. A pair of attached second holding mechanisms 52 and a board regulating mechanism 53 are provided.

  The rotation block 50 is attached to the base 49 so as to be rotatable around the rotation shaft 50a. The axis of the rotation shaft 50a is along the horizontal direction, and this axis is in a plane orthogonal to the transport path TP1. A motor 55 for rotating the rotation block 50 around the rotation shaft 50 a is attached to the base 49 via a gear head 54. Therefore, by driving the motor 55, the postures of the first and second holding mechanisms 51 and 52 can be changed.

  The pair of first holding mechanisms 51 includes a pair of rod-like horizontal holding members 56 arranged at intervals in the horizontal direction perpendicular to the transport path TP1, and support rods 57 fitted into the horizontal holding members 56. doing. A pair of holding groove groups 58 and 59 are formed on the circumferential surface of the horizontal holding member 56 at positions facing each other across the central axis. Each holding groove group 58, 59 includes a plurality of holding grooves 58a, 59a. Each holding groove 58 a, 59 a is formed along a direction perpendicular to the longitudinal direction of the horizontal holding member 56. The plurality of holding grooves 58 a and 59 a are arranged at a predetermined pitch in the longitudinal direction of the horizontal holding member 56. This pitch is equal to the pitch at which the batch hand 40 of the carry-in / out mechanism 4 holds the plurality of substrates W, that is, the substrate holding pitch in the FOUP F.

  The pair of horizontal holding members 56 are attached to the rotation block 50 in a posture parallel to each other. When the pair of horizontal holding members 56 are in the posture along the vertical direction (Z direction), the plurality of horizontal substrates W can be supported from below by either of the holding groove groups 58 and 59. One of the pair of holding groove groups 58 and 59 (for example, the holding groove group 58) is used to hold the unprocessed substrate W, and the other (for example, the holding groove group 59) holds the processed substrate W. Used for. For example, when holding an unprocessed substrate W delivered from the carry-in / out mechanism 4, the holding groove groups 58 of the pair of horizontal holding members 56 are opposed to each other. Further, when the processed substrate W passed from the pusher 6 is held, the holding groove groups 59 of the pair of horizontal holding members 56 are opposed to each other.

  The pair of second holding mechanisms 52 includes a pair of rod-like vertical holding members 60 that are spaced apart in the horizontal direction perpendicular to the transport path TP1. These vertical holding members 60 are attached to the rotation block 50 in a posture parallel to the horizontal holding member 56. Each vertical holding member 60 includes a support bar 61 and a plurality of holding groove members 62 attached to the support bar 61. The plurality of holding groove members 62 are made of a plate-like body fixed at a predetermined pitch in the longitudinal direction of the support rod 61. This pitch is equal to the substrate holding pitch in the batch hand 40 of the carry-in / out mechanism 4. Each holding groove member 62 has a pair of holding grooves 63 and 64 on end faces facing each other with the support rod 61 interposed therebetween. The plurality of holding groove members 62 are arranged so that the holding grooves 63 and 64 are aligned along the longitudinal direction of the support rod 61. Each holding groove 63, 64 is formed along a plane orthogonal to the longitudinal direction of the support bar 61.

  The pair of vertical holding members 60 are attached to the rotation block 50 in a posture parallel to each other. When the pair of vertical holding members 60 are in the posture along the horizontal direction, the plurality of substrates W in the vertical posture are supported from below by any of the holding grooves 63 and 64. One of the pair of holding grooves 63, 64 (for example, holding groove 63) is used to hold an unprocessed substrate W, and the other (for example, holding groove 64) is used to hold a processed substrate W. It is done. For example, when holding an unprocessed substrate W delivered from the carry-in / out mechanism 4, the holding grooves 63 of the holding groove members 62 held by the pair of support rods 61 are opposed to each other. Further, when the processed substrate W passed from the pusher 6 is held, the holding grooves 64 of the holding groove member 62 held by the pair of support rods 61 are opposed to each other.

  The rotation block 50 includes a first holding mechanism 51, a first holding mechanism 51, 52 and a substrate holding mechanism 53 in a horizontal holding attitude (the attitude shown in FIGS. 3A and 3B), and a first and second holding mechanism. 51 and 52 and the board | substrate control mechanism 53 are rotated between the vertical holding | maintenance attitude | positions (attitude | position represented with the dashed-two dotted line in FIG. 2A and FIG. 2B) used as a horizontal attitude | position. Hereinafter, the postures of the first and second holding mechanisms 51 and 52 and the board regulating mechanism 53 when the rotating block 50 is in the horizontal holding posture are also referred to as horizontal holding postures, and when the rotating block 50 is in the vertical holding posture. The postures of the first and second holding mechanisms 51 and 52 and the substrate regulating mechanism 53 are also referred to as a vertical holding posture. When the rotating block 50 is in the horizontal holding posture, the peripheral edge portion of the substrate W in the horizontal posture is supported from below by the horizontal holding member 56 of the first holding mechanism 51 from the two opposite positions. In the vertical holding posture, the peripheral edge portion of the substrate W in the vertical posture is supported by the holding groove member 62 of the second holding mechanism 52 at two lower positions.

  The second holding mechanism 52 is positioned below the first holding mechanism 51 when the rotating block 50 is in the vertical holding posture. The holding groove member 62 provided in the second holding mechanism 52 is attached to the support bar 61 with a gap 65 wider than the thickness of the substrate W. Further, the distance between the pair of support bars 61 is larger than the width of the substrate W (diameter in the case of a circular substrate). Further, the distance between the bottom portions of the holding grooves 58a and 59a facing each other of the pair of horizontal holding members 56 is larger than the width of the substrate W (diameter in the case of a circular substrate). Therefore, when the substrate W is transferred to and from the pusher 6 with the first and second holding mechanisms 51 and 52 in the vertical holding posture, the substrate W held at the position corresponding to the gap 65 is the first. And passes between the second holding mechanisms 51 and 52.

  The substrate regulating mechanism 53 is made of a round bar-like member provided in parallel with the first and second holding mechanisms 51 and 52. The substrate restricting mechanism 53 is attached to the rotating block 50 so as to be positioned closer to the pusher 6 than the second holding mechanism 52 in the horizontal holding posture. The board restricting mechanism 53 is movable along the facing direction of the pair of second holding mechanisms 52. That is, the substrate restricting mechanism 53 has a restricting position (a position indicated by a solid line in FIG. 3A) that makes contact with the peripheral end surface of the substrate W in the vicinity of an intermediate position between the pair of second holding mechanisms 52 and a retracted position that does not interfere with the substrate W ( The position can be moved between the two-dot chain line in FIG. 3A. When in the retracted position, the substrate regulating mechanism 53 does not interfere with the substrate W when the substrate W moves along the arrangement direction of the first and second holding mechanisms 51 and 52 (the direction along the transport path TP1). It is like that.

The rotation block 50 accommodates a driving mechanism for driving the first and second holding mechanisms 51 and 52 and the substrate regulating mechanism 53.
The drive mechanism 81 for the first holding mechanism 51 includes a bearing 82 that supports the support rod 57 in a state in which the support rod 57 can rotate around the axis, a motor 83 that applies a rotational force around the axis to the support rod 57, and a motor And a cylinder 85 that slides a support plate 84 that supports 83 at a predetermined stroke along the longitudinal direction of the support rod 57. By driving the motor 83, one of the holding groove groups 58 and 59 can be made to face each other and can be selected for holding the substrate W. In addition, by driving the cylinder 85, the positions of the holding grooves 58a and 59a can be moved by a minute distance along the longitudinal direction of the support rod 57, so that the rotating block 50 is in the vertical holding posture. The wall surfaces of the holding grooves 58a and 59a can be retracted from the substrate W.

  The drive mechanism 87 for the second holding mechanism 52 includes a rail 89 fixed on the support plate 88, a moving base 90 that moves along the rail 89, and a bearing 91 attached to the moving base 90. Yes. The bearing 91 supports the support rod 61 of the second holding mechanism 52 in a state in which the support rod 61 can rotate around its axis. The drive mechanism 87 further includes a motor 92 that applies a rotational force to the support rod 61, and the motor 92 is attached to the surface of the moving base 90 opposite to the bearing 91. By driving the motor 92, one of the holding grooves 63 and 64 of the holding groove member 62 can be selected for holding the substrate W.

  The rail 89 is disposed along the alignment direction of the first and second holding mechanisms 51 and 52 (direction parallel to the transport path TP1). The moving base 90 moving on the rail 89 is coupled to the drive rod of the cylinder 94 via a connecting member 93. Therefore, the second holding mechanism 52 moves along the rail 89 by driving the cylinder 94. Thereby, when the rotation block 50 is in the horizontal holding posture, the second holding mechanism 52 can be moved closer to or away from the substrate W held in the horizontal posture by the first holding mechanism 51. it can.

  The drive mechanism 96 for the board restricting mechanism 53 includes a rail 97 arranged in parallel with the opposing direction of the pair of second holding mechanisms 52, a moving base 98 that moves along the rail 97, and the moving base 98 as a rail. The actuator 100 (for example, consisting of a ball screw mechanism) for moving along the axis 97 is provided. A base end portion of the substrate regulating mechanism 53 is coupled to the moving base 98. The moving base 98 is coupled to the operating portion of the actuator 100 via a connecting member 99. By driving the actuator 100, the substrate restricting mechanism 53 is moved between the restricting position and the retracted position.

  FIG. 4 is an elevation view for explaining the configuration of the pusher 6. The pusher 6 includes an elevating and holding unit 105 that holds a plurality of substrates W in a vertical posture and stacked and arranged in a horizontal direction at a half pitch. The lifting / lowering holding unit 105 is coupled to the upper end of the rotating shaft unit 106 that rotates about the vertical axis. The rotating shaft part 106 is rotatably supported by the transverse base 107. The transverse base 107 is supported by the elevating base 108. The elevating base 108 is coupled to the actuating member 110 a of the linear actuator 110 via the connecting member 109. The linear actuator 110 incorporates a ball screw mechanism and a linear guide, and obtains a driving force from a motor 111 coupled to the upper end to drive the operating member 110a up and down. Thereby, the elevating base 108 is moved up and down.

As the elevating base 108 is moved up and down, the elevating holding unit 105 is raised and lowered between the origin height H10, the first transfer height H11, and the second transfer height H12.
The traversing base 107 has a built-in rotation drive mechanism 112 that rotates the rotary shaft 106 around the vertical axis. Thereby, the raising / lowering holding | maintenance part 105 can be made into the attitude | position along the conveyance path | route TP1 (posture shown with a dashed-two dotted line in FIG. 2A), or the attitude | position along the conveyance path TP2 (posture shown as a continuous line in FIG. 2A). Further, in order to form a face-to-face batch or cancel the batch, the direction of the lifting and lowering holding unit 105 (referred to as a stacking direction of a plurality of substrates W) can be reversed by 180 degrees. .

  The elevating base 108 is provided with a pair of rails 113. The rail 113 is disposed along the stacking direction (horizontal direction) of the plurality of substrates W held by the lift holding unit 105. The traversing base 107 is movable on the rail 113. The elevating base 108 is provided with a slide drive mechanism 114 for moving the traversing base 107 along the rail 113 by a minute distance (half pitch). The slide drive mechanism 114 includes, for example, a ball screw mechanism having a screw shaft and a ball nut screwed to the screw shaft, and the traversing base 107 is coupled to the ball nut via a connecting member. With this configuration, in order to form a face-to-back batch or release the batch, the lifting and lowering holding unit 105 can be horizontally moved by a distance corresponding to a half pitch.

  The elevating / lowering holding unit 105 includes a first guide 116 and a second guide 117, and is configured to use these separately for holding the unprocessed substrate W and holding the processed substrate W. The first guide 116 has three support members 118 arranged in parallel along the horizontal direction. The second guide 117 has three support members 119 arranged in parallel to the horizontal direction. A plurality of (for example, 52) substrate holding grooves are formed on each upper surface of the support members 118 and 119 at a half pitch.

  While the second guide 117 is fixed to the upper end of the rotating shaft portion 106, the first guide 116 is supported by the lifting shaft 120. The lift shaft 120 is moved up and down by a minute distance by a vertical drive mechanism (not shown) built in the moving base 107. Accordingly, the substrate support height of the first guide 116 is made higher than the substrate support height of the second guide 117, and conversely, the substrate support height of the first guide 116 is made higher than the substrate support height of the second guide 117. Or lower. Thus, the higher one of the first and second guides 116 and 117 that has a higher substrate support height can be used for supporting the substrate W. Therefore, for example, the first guide 116 can be used for holding the unprocessed substrate W received from the attitude changing mechanism 5, and can be used for holding the processed substrate W received from the delivery mechanism 7.

  FIG. 5 is a view for explaining a configuration related to the delivery mechanism 7, and is an elevation view seen from the direction of the arrow A2 in FIG. 2A. The payout mechanism 70 includes a payout chuck 73 and a traversing mechanism 76 for traversing the payout chuck 73 along the X direction. The carry-in mechanism 71 includes a carry-in chuck 74 and a traverse mechanism 77 that traverses the carry-in chuck 74 along the X direction. The mediation mechanism 72 includes a mediation chuck 75 and an elevating drive mechanism 78 that moves the mediation chuck 75 up and down. The elevating drive mechanism 78 includes a linear actuator 125 that incorporates a ball screw and a linear guide, and a motor 126 that applies a driving force to the linear actuator 125. The linear actuator 125 obtains a driving force from the motor 126 and moves the actuator 125a up and down. A mediating chuck 75 is coupled to the actuator 125a via a connection bracket 127.

6 is a perspective side view for explaining the configuration of the traversing mechanism 76 of the payout mechanism 70, and schematically illustrates the configuration viewed in the direction of the arrow A3 in FIG. Hereinafter, FIG. 5 is also referred to.
The traversing mechanism 76 includes a ball screw mechanism 131 built in a plate-like support block 130 attached in a vertical posture to a frame on the front surface 10 a side of the substrate processing apparatus 10, and a support block 130 at a position above the ball screw mechanism 131. A moving plate 133 that horizontally moves in the X direction in the working space 132 (see FIG. 5) formed by drilling from the payout chuck 73 side, and a fixing fixed to the support block 130 so as to cover the work space 132 from the payout chuck 73 side. The plate 134 includes a pair of upper and lower rails 135 provided along the X direction (the direction along the transport path TP2) on the surface of the fixed plate 134 that faces the working space 132.

The moving plate 133 is coupled to a rail 135, and can move horizontally along the rail 135 in the X direction. The moving plate 133 is coupled to the ball nut 136 of the ball screw mechanism 131. Further, the moving plate 133 is coupled to the payout chuck 73 via a connecting member 137.
A cutout 139 is formed in the fixed plate 134 along the movement path of the connecting member 137 in the X direction. Therefore, if the ball nut 136 is moved in the X direction by driving the motor 138 of the ball screw mechanism 131, the payout chuck 73 can be moved in the X direction together with the moving plate 133.

Since the structure of the traversing mechanism 77 of the carry-in chuck 74 is the same, the corresponding parts of the traversing mechanism 77 in FIG.
FIG. 7 is a view for explaining the configuration of the payout chuck 73. 7A is a plan view, FIG. 7B is a side view seen in the −Y direction, and FIG. 7B is a rear view seen in the −X direction.
The payout chuck 73 includes a pair of cantilevered substrate guides 140 extending in parallel to each other along the X direction, and a base portion 141 that cantilever-supports these substrate guides 140. On the upper surface of the substrate guide 140, a plurality of holding grooves for supporting the lower edge portions of the plurality of substrates W stacked in the vertical direction in the horizontal direction are formed. The interval between the holding grooves is a half pitch. The base portion 141 is a long body having a C-shaped cross section extending in the Y direction. The base portion 141 holds a pair of cylinders 142 in a state where the operation rods face each other. A linear guide 143 is fixed along the Y direction on the side surface of the base portion 141 on the substrate guide 140 side. A pair of substrate guides 140 are attached to the linear guides 143 via connecting members 144. Accordingly, the pair of substrate guides 140 are opposed to each other in the Y direction at the same height position, and are movable along the Y direction.

  The connecting member 144 is coupled to the base end portion of the substrate guide 140, the rising wall portion 145 rising from the base end portion is connected to the linear guide 143, and the upper end of the inner edge of the rising wall portion 145 is further connected. A horizontal portion 146 extending horizontally from the through hole 147 of the base portion 141 is coupled to the operating rod of the cylinder 142. The through hole 147 is a long hole extending along the longitudinal direction of the base portion 141.

  The pair of cylinders 142 are driven in synchronization. When the operating rods of these cylinders 142 are expanded and contracted, the pair of substrate guides 140 has a closed position (position indicated by a solid line) in which the distance between each other is narrowed and an open position (indicated by a two-dot chain line) in which the distance between each pair is increased. The position shown) can be taken. By setting the substrate guide 140 to the closed position, the substrate W can be supported from below. Thus, the pair of cylinders 142 constitute guide opening / closing means for changing the pair of substrate guides between the closed position and the open position.

  When the pair of substrate guides 140 are in the closed position and the payout chuck 73 is in the closed state, the distance between the substrate guides 140 is wider than the width of the lift holding portion 105 of the pusher 6. Therefore, at the substrate transfer position S (see FIG. 2A), the second transfer is performed through the lift holding portion 105 of the pusher 6 between the pair of substrate guides 140 with the discharge chuck 73 closed and holding the substrate W. The height can be increased to H12. As a result, the substrate W can be transferred from the dispensing chuck 73 to the lifting / lowering holding part 105 of the pusher 6.

  When the pair of substrate guides 140 are in the open position and the payout chuck 73 is in the open state, the distance between the substrate guides 140 is wider than the width of the substrate W (diameter in the case of a circular substrate). The substrate W can pass through 140. Accordingly, at the substrate transfer position S, after the substrate W is transferred from the discharge chuck 73 to the lifting / lowering holding portion 105 of the pusher 6, when the discharge chuck 73 is opened, the pusher passes between the pair of substrate guides 140. 6 and the substrate W held thereon can be lowered.

FIG. 8 is a view for explaining the configuration of the carry-in chuck 74. 8A is a plan view, FIG. 8B is a side view seen in the −Y direction, and FIG. 8B is a rear view seen in the −X direction.
The carry-in chuck 74 has a pair of cantilever substrate guides 148 extending in parallel in the X direction at the same height position, and a base portion 149 coupled to the base end portions of the pair of substrate guides 148. doing. On the upper surface of the substrate guide 148, a plurality of holding grooves for supporting the lower edges of the plurality of substrates W stacked in the vertical direction in the horizontal direction are formed. The interval between the holding grooves is a half pitch. The distance between the pair of substrate guides 148 is fixed, and this distance is wider than the width of the lifting / lowering holding part 105 of the pusher 6.

  When the substrate W is transferred from the lifting / lowering holding unit 105 of the pusher 6 to the carry-in chuck 74 at the substrate transfer position S, the lifting / lowering holding unit 105 holding the substrate W is disposed at the first transfer height H11, and below that The carry-in chuck 74 is guided to the position. When the elevation holding unit 105 is lowered from between the pair of substrate guides 148 from this state, the substrate W is transferred from the elevation holding unit 105 to the carry-in chuck 74.

FIG. 9 is a view for explaining the configuration of the mediation chuck 75. 9A is a plan view, FIG. 9B is a side view seen in the −Y direction, and FIG. 9B is a rear view seen in the −X direction.
The intermediary chuck 75 includes a pair of cantilevered substrate guides 150 extending in parallel with each other along the X direction, and a base portion 151 for cantilevering the substrate guides 150. On the upper surface of the substrate guide 150, a plurality of holding grooves for supporting the lower edge portions of the plurality of substrates W stacked in the vertical direction in the horizontal direction are formed. The interval between the holding grooves is a half pitch. The base portion 151 is a long body having a C-shaped cross section extending in the Y direction. The base portion 151 holds a pair of cylinders 152 in a state where the operation rods face each other. A linear guide 153 is fixed along the Y direction on the side surface of the base portion 151 on the substrate guide 150 side. A pair of substrate guides 150 are attached to the linear guides 153 via connecting members 154. As a result, the pair of substrate guides 150 are opposed to each other in the Y direction at the same height, and are movable along the Y direction.

  The connecting member 154 is coupled to the base end portion of the substrate guide 150, the rising wall portion 155 rising from the base end portion is connected to the linear guide 153, and further, the upper end of the inner edge of the rising wall portion 155. A horizontal portion 156 extending horizontally from the through hole 157 of the base portion 151 is coupled to the operating rod of the cylinder 152. The through hole 157 is a long hole extending along the longitudinal direction of the base portion 151.

  The pair of cylinders 152 are driven in synchronization. When the operation rods of these cylinders 152 are expanded and contracted, the pair of substrate guides 150 has a closed position (position indicated by a solid line) in which the distance between each other is narrowed and an open position (indicated by a two-dot chain line) in which the distance between each pair is increased. The position shown) can be taken. By setting the substrate guide 150 to the closed position, the substrate W can be supported from below.

  When the intermediary chuck 75 is in the open state with the pair of substrate guides 150 in the open position, the distance between the substrate guides 150 becomes wider than the width of the substrate W (diameter in the case of a circular substrate). The substrate W can pass through 150. Accordingly, at the substrate transfer position P, when the carry-in chuck 74 holds the substrate W at the carry-in height H1, when the intermediate chuck 75 is lowered and lowered, the substrate guide 150 is held by the carry-in chuck 74. It is possible to move downward of the carry-in chuck 74 without interfering with the substrate W.

  When the intermediate chuck 75 is in the closed state with the pair of substrate guides 150 in the closed position, the distance between the pair of substrate guides 150 is narrower than the distance between the pair of substrate guides 148 of the carry-in chuck 74. Therefore, when the carry-in chuck 74 holds the substrate W at the carry-in height H1 at the substrate transfer position P (see FIG. 2A), the intermediate chuck 75 is closed to the transfer height H2 from below the carry-in chuck 74. When raised, the substrate W can be transferred from the carry-in chuck 74 to the intermediate chuck 75.

10A to 10Q are schematic explanatory views for explaining the flow of the substrate carry-in operation. This substrate carry-in operation is achieved by the controller 9 (see FIG. 1) controlling each part of the main transport mechanism 3, the carry-in / out mechanism 4, the posture changing mechanism 5, the pusher 6, and the delivery mechanism 7.
As shown in FIG. 10A, the carry-in / out mechanism 4 takes out a plurality of (for example, 25) unprocessed substrates W from the FOUP F held by the FOUP holding unit 1 by the batch hand 40 and directs it toward the attitude changing mechanism 5. Transport. At this time, the posture changing mechanism 5 is controlled to a horizontal holding posture, and the pair of first holding mechanisms 51 are controlled to a posture in which holding groove groups for unprocessed substrates (for example, holding groove group 58) are opposed to each other. The pair of second holding mechanisms 52 are controlled so that holding grooves for unprocessed substrates (for example, holding grooves 63) face each other. Further, the pair of second holding mechanisms 52 are disposed at a retracted position (a position indicated by a two-dot chain line in FIG. 3A) so as not to contact the substrate W and retracted to the opposite side to the carry-in / out mechanism 4. Furthermore, the board | substrate control mechanism 53 is arrange | positioned in the retracted position (position shown with a dashed-two dotted line in FIG. 3A). On the other hand, the payout chuck 73 is disposed above the lift holding part 105 of the pusher 6 (the carry-out height H0 at the substrate transfer position S). This is to prevent the substrate delivery between the main transport mechanism 3 and the mediation mechanism 72 from being hindered. The lifting / lowering holding unit 105 of the pusher 6 is rotated to the origin position (the rotational position at which the first half of the batch is received), and moved to the origin height H10 below the second holding mechanism 52 in the vertical support posture. Be made.

In this state, as shown in FIG. 10B, a plurality of substrates W constituting the first half of the batch are collectively delivered from the loading / unloading mechanism 4 to the attitude changing mechanism 5. At this time, the first holding mechanism 51 of the posture changing mechanism 5 inserts each substrate W into a pair of holding grooves 58a facing in the horizontal direction, and supports a pair of peripheral edge portions of the substrate W facing each other from below.
Next, in the posture changing mechanism 5, the second holding mechanism 52 is caused to traverse so as to approach the first holding mechanism 51. As a result, the state shown in FIG. 10C is obtained. At this time, the second holding mechanism 52 is in the forward position (the position indicated by the solid line in FIG. 3A), and the substrate W is inserted into the holding groove 63 for the unprocessed substrate of the holding groove member 62.

  From this state, the rotation block 50 of the attitude conversion mechanism 5 is rotated to assume a vertical support attitude as shown in FIG. 10D. Thereby, the plurality of substrates W are changed in posture from the horizontal posture to the vertical posture, and the lower peripheral edge portion is held by the second holding mechanism 52. In this state, the first holding mechanism 51 is moved along the axial direction toward the rotation block 50, and each holding groove 58 a is separated from the substrate W.

  Next, as shown in FIG. 10E, the raising / lowering holding part 105 of the pusher 6 is raised to the first transfer height H11 (unprocessed substrate receiving height). At this time, the lifting and lowering holding unit 105 moves up between the first and second holding mechanisms 51 and 52 to receive a plurality of substrates W from the second holding mechanism 52 at a time. As a result, half the number of substrates W in one batch are held in the vertical holding unit 105 in a vertical posture. At this time, the elevation holding unit 105 holds the substrate W with the first guide 116 for the unprocessed substrate.

  Next, as shown in FIG. 10F, the turning block 50 of the posture changing mechanism 5 is turned to the horizontal holding posture. Further, the first holding mechanism 51 is moved in the direction away from the rotation block 50 along its axial direction, and returned to the origin position. Further, the second holding mechanism 52 is returned to the retracted position (position indicated by a two-dot chain line in FIG. 3A). After the posture conversion mechanism 5 is returned to the horizontal holding posture, the pusher 6 rotates the lifting / lowering holding unit 105 by 180 degrees around the vertical axis. Thereafter, the elevation holding unit 105 is lowered to the origin height H10.

  Next, as shown in FIGS. 10G to 10J, the same operation as that of FIGS. 10A to 10D is performed on another plurality of unprocessed substrates W constituting the remaining part of the batch. Thus, for example, 25 substrates W are held in the vertical posture by the second holding mechanism 52 of the posture changing mechanism 5, and another, for example, 25 substrates W are held in the vertical posture by the lifting and lowering holding unit 105 below the second holding mechanism 52. It becomes a state. At this time, the pitch of the plurality of substrates W held by the attitude changing mechanism 5 is equal to the pitch of the plurality of substrates W held by the lift holding unit 105, and these substrates W are parallel to each other. ing. In plan view, the two substrate groups have the same horizontal position parallel to the substrate surface, and the horizontal position perpendicular to the substrate surface is shifted by a half pitch.

  From this state, as shown in FIG. 10K, when the lifting / lowering holding portion 105 of the pusher 6 is raised to the first transfer height H11, the substrate W is transferred from the second holding mechanism 52 of the posture changing mechanism 5 to the lifting / lowering holding portion 105. Then, for example, 50 substrates W are held on the lift holding unit 105 at a half pitch. Thus, the batch assembly is completed. When the lifting / lowering holding unit 105 moves up, the plurality of substrates W held by the lifting / lowering holding unit 105 passes through the gap 65 (see FIG. 3B) between the holding groove members 62 of the second holding mechanism 52 and moves up. To do. Therefore, these substrates W do not interfere with the second holding mechanism 52.

Thereafter, as shown in FIG. 10L, the turning block 50 of the posture changing mechanism 5 is turned to the horizontal holding posture. Further, the first holding mechanism 51 is moved to the distal end side along the axial direction and returned to the original position, and the second holding mechanism 52 is returned to the retracted position (position indicated by a two-dot chain line in FIG. 3A).
Next, as shown in FIG. 10M, the carry-in chuck 74 traverses (horizontally moves) along the second traversing path 102 (see FIG. 2B) having the carry-in height H1, and from the substrate transfer position P to the substrate transfer position. In S, it moves forward to a position below the lifting and lowering holding unit 105. Further, the lifting and lowering holding unit 105 is rotated around the vertical axis so that the alignment direction of the substrates W is aligned with the transport path TP2. The carry-in height H <b> 1 is higher than the origin height H <b> 10 of the lifting / lowering holding unit 105 and lower than the first transfer height H <b> 11.

  From this state, as shown in FIG. 10N, the pusher 6 lowers the lifting / lowering holding unit 105 from the first transfer height H11 to the origin height H10. The distance between the pair of substrate guides 148 of the carry-in chuck 74 is narrower than the width of the substrate W and wider than the width of the lifting and lowering holding unit 105. Accordingly, the lifting / lowering holding unit 105 moves down between the pair of substrate guides 140 of the carry-in chuck 74, and in the process, a plurality of (for example, 50) unprocessed substrates from the lift / holding unit 105 to the carry-in chuck 74. W is delivered at once.

  Next, as shown in FIG. 10O, the carry-in chuck 74 traverses at the carry-in height H1 and moves from the substrate transfer position S to the substrate transfer position P. Next, the intermediate chuck 75 moves below the carry-in height H <b> 1, that is, to a position below the carry-in chuck 74. Prior to this downward movement, the mediation chuck 75 is controlled to be in an open state in which the gap between the pair of substrate guides 150 is opened. Thereby, the distance between the substrate guides 150 becomes wider than the diameter of the substrate W. Therefore, the mediation chuck 75 can move below the carry-in chuck 74 without interfering with the substrate W held by the carry-in chuck 74.

Thus, as shown in FIG. 10P, when the intermediate chuck 75 moves to below the carry-in chuck 74, the intermediate chuck 75 is brought into a closed state in which the distance between the pair of substrate guides 150 is reduced. At this time, the pair of substrate guides 150 are positioned inside the pair of substrate guides 148 of the carry-in chuck 74.
From this state, as shown in FIG. 10Q, the intermediate chuck 75 is raised to the transfer height H2. In the ascending process, a plurality of (for example, 50) substrates W held by the carry-in chuck 74 are collectively delivered to the mediation chuck 75. Then, the plurality of substrates W held by the mediation chuck 75 are received by the main transport mechanism 3 and transported to the substrate processing unit 2.

  When the alignment operation for aligning the substrate W direction by the substrate direction alignment mechanism 13 is performed, the alignment processing head 16 of the substrate direction alignment mechanism 13 is raised from the state of FIG. Then, an alignment process for aligning the direction of the substrate W in a state where the substrate W held by the carry-in chuck 74 is lifted by a minute distance is performed. Thereafter, the alignment processing head 16 is lowered, whereby the substrate W after the alignment processing is transferred to the carry-in chuck 74 again.

  If the transfer chuck 74 is advanced to the position of the pusher 6 (substrate transfer position S) and the intermediate chuck 75 is not holding the substrate W, the intermediate chuck 75 is lowered in advance from the state of FIG. After that, the carry-in chuck 74 may be retracted to the substrate delivery position P. In this way, since the intermediate chuck 75 can be lowered while being closed, the operation can be simplified.

11A to 11K are schematic explanatory diagrams for explaining the flow of the substrate carry-out operation. This substrate carry-out operation is achieved by the controller 9 (see FIG. 1) controlling each part of the main transport mechanism 3, the carry-in / out mechanism 4, the posture changing mechanism 5, the pusher 6 and the delivery mechanism 7.
The substrate W that has been processed by the substrate processing unit 2 is transported by the main transport mechanism 3 and delivered to the dispensing chuck 73. The payout chuck 73 is normally positioned above the lifting / lowering holding part 105 of the pusher 6 (substrate transfer position S) so as not to prevent access to the mediation chuck 75 of the main transport mechanism 3. Therefore, when the processed substrate W is delivered by the main transport mechanism 3, the delivery chuck 73 traverses (horizontally moves) along the first traversing path 101 (see FIG. 2B) with the delivery height H0, and the substrate delivery position. Move to P. After this movement, the processed substrate W is transferred from the main transport mechanism 3 to the delivery chuck 73, whereby the state shown in FIG.

  At this time, the posture conversion mechanism 5 is controlled to a horizontal holding posture. The pair of first holding mechanisms 51 are controlled so that the processing substrate holding groove groups (for example, the holding groove group 59) face each other, and the pair of second holding mechanisms 52 are processed substrate holding grooves (for example, The holding groove 64) is controlled to face each other. Further, the pair of first holding mechanisms 51 are controlled to positions close to the rotation block 50 along the axial direction (positions in which a space can be secured between the substrate W held by the second holding mechanism 52 in a vertical posture). Is done. Further, the pair of second holding mechanisms 52 are disposed at a forward position approaching the first holding mechanism 51 (a position indicated by a solid line in FIG. 3A). And the board | substrate control mechanism 53 is arrange | positioned in a retracted position. The raising / lowering holding unit 105 of the pusher 6 is controlled so that the substrate holding position of the second guide 117 for holding the processed substrate is higher than the substrate holding position of the first guide 116 for holding the unprocessed substrate.

  From this state, as shown in FIG. 11B, the payout chuck 73 traverses at the payout height H0 and moves above the lifting / lowering holding portion 105 of the pusher 6 (substrate transfer position S). Thereafter, the lifting and lowering holding unit 105 moves up to the position of the delivery chuck 73 (second transfer height H12), and receives a plurality of processed substrates W from the delivery chuck 73 at a time. Until the reception of the substrate W is completed, the dispensing chuck 73 is in a closed state, that is, a state in which the distance between the pair of substrate guides 140 is narrowed. In this closed state, the distance between the pair of substrate guides 140 is wider than the width of the lift holding unit 105 and narrower than the width (diameter) of the substrate W. Accordingly, the lifting and lowering holding unit 105 rises to the second transfer height H <b> 12 through the pair of substrate guides 140 and receives the substrate W from the dispensing chuck 73.

After the lifting / lowering holding unit 105 receives the processed substrate W from the discharge chuck 73, the discharge chuck 73 is controlled to be in an open state, and the interval between the pair of substrate guides 140 is made wider than the width (diameter) of the substrate W. As a result, the lift holding unit 105 can be lowered while avoiding interference between the held substrate W and the payout chuck 73.
From this state, as shown in FIG. 11C, the turning block 50 of the posture changing mechanism 5 is turned to the vertical holding posture. Then, as shown in FIG. 11D, the lifting / lowering holding part 105 of the pusher 6 is lowered to the origin height H <b> 10 through the pair of first holding mechanisms 51 and the pair of second holding mechanisms 52. In this process, half of the batches of substrates W are transferred from the lift holding unit 105 to the second holding mechanism 52. At this time, the remaining half of the substrate W of the batch passes through the gap 65 between the holding groove members 62 of the second holding mechanism 52 and remains held by the lift holding unit 105. In this way, batch cancellation is performed. When the substrate W comes to be positioned below the dispensing chuck 73, the lift holding unit 105 is rotated around the vertical axis before the substrate W reaches the first holding mechanism 51, and the lift holding unit 105. The alignment direction of the substrate W held on the substrate is aligned with the transport path TP1.

  Next, the first holding mechanism 51 is moved to the tip side along the axial direction, and preparations for supporting the substrate W in a horizontal posture are made. Then, as shown in FIG. 11E, the turning block 50 of the posture changing mechanism 5 is turned to the horizontal holding posture. As a result, the substrate W is held in a horizontal posture by the first holding mechanism 51. Further, the substrate restriction mechanism 53 is moved to a restriction position where the substrate W is restricted. In this state, the second holding mechanism 52 is retracted to the retracted position (the position indicated by the two-dot chain line in FIG. 3A). At this time, if there is a substrate W trying to follow the second holding mechanism 52, such movement of the substrate W is regulated by the substrate regulating mechanism 53. Accordingly, the substrate W is held in the state held by the first holding mechanism 51.

Next, as shown in FIG. 11F, the batch hand 40 of the loading / unloading mechanism 4 collectively unloads the plurality of substrates W held by the first holding mechanism 51 and holds the hoop held by the hoop holding unit 1. F.
Next, as shown in FIG. 11G, when the pair of first holding mechanisms 51 is moved toward the base end side along the axial direction, and the substrate W is held in a vertical posture by the second holding mechanism 52, An interval from the substrate W can be secured. In addition, the pair of second holding mechanisms 52 are disposed at a forward position (position indicated by a solid line in FIG. 3A) close to the first holding mechanism 51. The board regulating mechanism 53 is disposed at the retracted position. Further, the pusher 6 raises the lifting / lowering holding unit 105.

  From this state, as shown in FIG. 11H, the posture changing mechanism 5 turns the turning block 50 to the vertical holding posture. Thereafter, the pusher 6 rotates the lifting / lowering holding unit 105 180 degrees around the vertical axis above the first and second holding mechanisms 51 and 52. As a result, the positions of the plurality of substrates W held by the lift holding unit 105 are aligned with the substrate holding positions of the second holding mechanism 52.

  Then, as shown in FIG. 11I, the pusher 6 lowers the lifting / lowering holding unit 105 to the origin height H10. In this process, the plurality of substrates W held by the lift holding unit 105 are delivered to the second holding mechanism 52 at a time. After the substrate W is transferred to the second holding mechanism 52, the first holding mechanism 51 is moved to the tip side along the axial direction so as to come into contact with the surface of the substrate W, and the horizontal position of the substrate W is increased. Provided for holding.

  Next, as shown in FIG. 11J, the turning block 50 of the posture changing mechanism 5 is turned to the horizontal holding posture. As a result, the substrate W is held in a horizontal posture by the first holding mechanism 51. Further, the substrate restriction mechanism 53 is moved to a restriction position where the substrate W is restricted. In this state, the second holding mechanism 52 is retracted to the retracted position (the position indicated by the two-dot chain line in FIG. 3A). At this time, if there is a substrate W trying to follow the second holding mechanism 52, such movement of the substrate W is regulated by the substrate regulating mechanism 53. Accordingly, the substrate W is held in the state held by the first holding mechanism 51.

Next, as shown in FIG. 11K, the batch hand 40 of the carry-in / out mechanism 4 collectively unloads the plurality of substrates W held by the first holding mechanism 51 and holds the hoop held in the hoop holding unit 1. F. This FOUP F is different from the FOUP F that accommodates the first half of the substrates W constituting the batch.
As described above, according to this embodiment, the processed substrate W is transported from the substrate transfer position P to the substrate transfer position S by the discharge chuck 73 that traverses along the first traverse path 101, and the first traverse path 101. The unprocessed substrate W is transported from the substrate transfer position S to the substrate transfer position P by the carry-in chuck 74 that traverses along the second traverse path 102 below the substrate. Thereby, since the substrate transfer between the substrate transfer position S and the substrate transfer position P can be performed in two systems, the main transfer is also performed during the period when the unprocessed substrate W is transferred to the substrate transfer position P. The mechanism 3 can dispense the processed substrate W. Thereby, the substrate processing speed can be improved. In addition, since the first and second traversing paths 101 and 102 overlap in the vertical direction, it is possible to provide two transport paths while suppressing the occupied area of the substrate processing apparatus 10.

  A pair of pushers is provided in order to make the conveyance path between the substrate transfer position S and the substrate transfer position P two systems, and the pair of pushers is traversed between the substrate transfer position S and the substrate transfer position P. It is possible to make it. However, with such a configuration, the occupation area of the substrate processing apparatus 10 is greatly increased, and a pair of pushers having a complicated configuration is provided, which causes a significant increase in cost.

  On the other hand, in the case of the configuration of this embodiment, as described above, since the first and second traversing paths 101 and 102 are arranged, the occupied area can be suppressed. In addition, since the payout chuck 73 and the carry-in chuck 74 only need to be able to traverse, the configuration for driving them is not so complicated, and the cost increases accordingly. Therefore, the substrate processing speed can be improved by securing two transport routes with a low-cost configuration.

  Furthermore, in this embodiment, an intermediary chuck 75 that moves up and down at the substrate transfer position P is provided, so that a so-called buffer position is secured. With this configuration, retention of substrate conveyance can be suppressed, which can contribute to an increase in substrate processing speed. In addition, since it is sufficient that the mediation chuck 75 can move up and down and does not need to traverse, the structure of the drive mechanism is not complicated. Therefore, it is possible to secure the buffer position with a low-cost configuration and improve the substrate processing speed.

  As mentioned above, although one Embodiment of this invention was described, this invention can also be implemented with another form. For example, although the mediation mechanism 72 is provided in the above-described embodiment, the mediation mechanism 72 may be omitted. In this case, the unprocessed substrate W transported to the substrate delivery position P by the carry-in chuck 74 is directly delivered from the carry-in chuck 74 to the main transport mechanism 3.

In the above-described embodiment, the payout chuck 73 is disposed above the carry-in chuck 74. However, the vertical relationship may be reversed.
In addition, various design changes can be made within the scope of matters described in the claims.

DESCRIPTION OF SYMBOLS 1 Hoop holding | maintenance part 2 Substrate processing part 3 Main conveyance mechanism 4 Carry-in / out mechanism 5 Posture change mechanism 6 Pusher 7 Delivery mechanism 8 Chuck cleaning unit 9 Controller 10 Substrate processing apparatus 13 Substrate direction alignment mechanism 20 Processing part 40 Batch hand 41A Hand advance / retreat mechanism 42A Rotation Drive Mechanism 50 Rotation Block 51 First Holding Mechanism 52 Second Holding Mechanism 53 Substrate Restriction Mechanism 70 Discharge Mechanism 71 Loading Mechanism 72 Mediation Mechanism 73 Discharge Chuck 74 Loading Chuck 75 Mediating Chuck 76 Traverse Mechanism 77 Traverse Mechanism 78 Lifting Drive Mechanism 101 First traversing path 102 Second traversing path 105 Elevating holding section 106 Rotating shaft section 107 Traverse base 108 Elevating base 116 First guide 117 Second guide 125 Linear actuator 126 Motor 140 Substrate guide 141 Base section 142 148 Substrate guide 149 Base portion 150 Substrate guide 151 Base portion 152 Cylinder F Hoop H0 Discharge height H1 Loading height H2 Transfer height H10 Origin height H11 First transfer height H12 Second transfer height P Substrate Delivery position S Substrate transfer position W Substrate

Claims (13)

A substrate processing unit that collectively processes a plurality of vertical substrates;
A first traversing mechanism for traversing a first traversing holding unit that collectively holds a plurality of substrates in a vertical posture along a first traversing path between a substrate transfer position and a substrate transfer position;
A second traverse holding unit that collectively holds a plurality of substrates in a vertical posture is disposed along a second traverse path below the first traverse path between the substrate transfer position and the substrate transfer position. A second traversing mechanism that traverses and
An elevating mechanism for elevating and lowering an elevating holding unit that collectively holds a plurality of substrates in a vertical posture at the substrate transfer position;
A substrate processing apparatus, comprising: a main transfer mechanism that transfers a plurality of substrates in a vertical posture at a time between the substrate transfer position and the substrate processing unit.   A plurality of substrates in a horizontal posture are collectively converted from a horizontal posture to a vertical posture, transferred to the lifting mechanism at the substrate transfer position, and vertically moved to the lifting mechanism at the substrate transfer position The substrate processing apparatus according to claim 1, further comprising a posture conversion mechanism that collectively receives a plurality of substrates held by the step and changes the posture from a vertical posture to a horizontal posture. A container holder for holding a container for storing a plurality of substrates in a horizontal position;
A plurality of substrates in a horizontal posture are collectively carried in and out of the container held in the container holding unit, and a plurality of substrates in a horizontal posture are collectively transferred to and from the posture changing mechanism. The substrate processing apparatus according to claim 2, further comprising a carry-in / out mechanism.   The first substrate transport path between the carry-in / out mechanism and the lift mechanism and the second substrate transport path between the lift mechanism and the substrate delivery position intersect at a predetermined angle, The substrate processing apparatus according to claim 3, wherein the elevating mechanism is disposed at an intersection of the first and second substrate transfer paths.   The carry-in / out mechanism includes a batch hand that holds a plurality of substrates in a horizontal posture, a hand advance / retreat mechanism that advances and retracts the batch hand in a horizontal direction, and a turning drive mechanism that turns the batch hand around a vertical axis. The substrate processing apparatus according to claim 4, wherein a hand advance / retreat direction when the batch hand accesses the container held by the container holding unit is a horizontal direction perpendicular to the second substrate transfer path.   The elevating mechanism has a first posture that holds a plurality of substrates in a vertical posture along the first substrate transfer path and a second posture that holds a plurality of substrates in a vertical posture along the second substrate transfer route. The substrate processing apparatus according to claim 5, further comprising: a rotary drive mechanism that rotates the lift holding unit around a vertical axis.   The elevating mechanism moves a plurality of substrates in a vertical posture from the elevating holding unit to the second traversing holding unit in a lump by moving the elevating holding unit up and down in the vertical direction, and moves the elevating holding unit up and down The substrate processing apparatus according to claim 1, wherein a plurality of substrates in a vertical posture held by the first traverse holding unit are collectively received by the raising / lowering holding unit by moving up and down in a direction. .   The substrate processing apparatus according to claim 1, further comprising a mediation mechanism that raises and lowers a mediation holding unit that collectively holds a plurality of substrates at the substrate delivery position.   9. The substrate according to claim 8, wherein the mediation mechanism delivers a plurality of substrates at a time to and from the second traverse holding unit by raising and lowering the mediation holding unit at the substrate delivery position. Processing equipment.   The substrate processing apparatus according to claim 9, wherein the main transport mechanism collectively transfers a plurality of substrates between the first traverse holding unit and the mediation holding unit at the substrate transfer position.   The substrate processing apparatus according to claim 1, further comprising a substrate direction alignment mechanism that is provided below the second traversing path at the substrate transfer position and aligns the directions of a plurality of substrates. .   The substrate processing apparatus according to claim 11, wherein the substrate direction alignment mechanism performs a substrate direction alignment process on a substrate held by the second traverse holding unit at the substrate transfer position. The first traverse holding unit is
A pair of substrate guides parallel to each other;
And a guide opening / closing means for changing an interval between the pair of substrate guides between an open state wider than the width of the substrate and a closed state narrower than the width of the substrate and wider than the width of the lifting and lowering holding unit. Item 13. The substrate processing apparatus according to any one of Items 1 to 12.

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