JPH11274270A - Substrate transferring device and substrate treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify configuration, to reduce weight and installation space, and to achieve high positioning accuracy. SOLUTION: Only by performing rotation treatment of first and second carrier placement rests 5 and 8 due to first and second carrier rotation means 7 and 10 without performing horizontal movement treatment of a carrier 53 due to a former carrier horizontal movement means, the first and second carrier placement rests 5 and 8 can be positioned in substrate thrust-up positions 4a and 4b while being shifted by a half substrate pitch (half substrate arrangement pitch) each other, thus eliminating the need for a former carrier horizontal movement means, and hence simplifying a configuration, reducing the weight and installation space, and increasing operation speed and positioning accuracy for a substrate transfer device 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer apparatus for transferring a plurality of substrates from a plurality of carriers accommodating thin substrates such as a semiconductor wafer and a glass substrate for a liquid crystal display panel to substrate transport means. The present invention also relates to a substrate processing apparatus using such a substrate transfer device, wherein a plurality of substrates transferred from the substrate transfer device are transferred by a substrate transfer means and perform a predetermined process.

[0002]

2. Description of the Related Art Conventionally, in a manufacturing process of a precision electronic substrate using a semiconductor wafer, a glass substrate for a liquid crystal display panel, or the like, a predetermined number of substrates accommodated in a carrier are processed into a number of substrates to be processed at once. 2. Description of the Related Art A substrate processing apparatus is used in which a plurality of substrates are transported to respective processing units while being held by a transporting unit, and a predetermined surface treatment such as cleaning or etching is performed on a plurality of substrates in each processing unit. A substrate processing apparatus that performs such a predetermined substrate processing will be described below.

FIG. 7 is a perspective view showing a schematic structure of a main part of a conventional substrate processing apparatus.

[0004] In FIG. 7, a substrate processing apparatus 51 is an apparatus for processing a plurality of substrates 52 such as wafers at a time.
2 and a loading / unloading unit 54 for receiving and receiving the unprocessed substrate 52 from the loading / unloading unit 54, transporting the unprocessed substrate 52 to each processing unit, and sequentially performing a predetermined process on the plurality of substrates 52 in each processing unit. A substrate processing unit 55 that transports the plurality of substrates 52 and transfers the substrates 52 to the loading / unloading unit 54.

The loading / unloading section 54 includes a carrier mounting table 56
, A transfer robot 58, a substrate transfer device 60, and a carrier cleaning unit 61. The carrier mounting table 56 is
Carriers 53 containing a plurality of substrates 52 are temporarily arranged and placed. The transfer robot 58 has two cantilevered carrier holding arms 57 that receive and hold the upper end brim portions 53 a of the carrier 53 from below, respectively, and are arranged side by side with the carriers 53 on the carrier mounting table 56. The carrier 53 is movable in the direction in which the
The carrier 3 is configured to be movable up and down in a vertical direction so as to be placed thereon, and to be rotatable around an axis parallel to the vertical direction (a support shaft for supporting a mounting member of the carrier holding arm 57). The substrate transfer device 60 pushes up only a plurality of substrates 52 in the carrier 53 placed from the carrier mounting table 56 by the transfer robot 58 through the bottom opening thereof, and a pair of holding plates 59a of the substrate transfer means 59. Hand over to
The carrier cleaning unit 61 cleans an empty carrier 53 that has been placed from the substrate transfer device 60 by the transfer robot 58 and from which the plurality of substrates 52 have been removed.

The transfer robot 58 transports the carrier 53 from the carrier mounting table 56 to a predetermined position of the substrate transfer device 60 and mounts the carrier 53 thereon.
The empty carrier 53 after the delivery is transferred to the carrier cleaning unit 6.
1 and again on a predetermined position of the substrate transfer device 60 in order to collect a plurality of processed substrates 52 from the substrate processing unit 55 into the empty carrier 53 cleaned by the carrier cleaning unit 61. Transfer and wait.

Further, the pair of holding plates 5 of the substrate transfer means 59 is reduced to a number (for example, 50) for processing a plurality of (for example, 50) substrates 52 in which a predetermined number (for example, 25) of carriers 52 are accommodated in the carrier 53.
In the process of switching at 9a, a pair of upper holding plates (not shown) is provided at a position above the pair of holding plates 59a of the substrate transfer means 59. The process of switching the number of the substrates 52 in the carrier 53 to twice the number of the substrates 52 in the carrier 53 with the pair of holding plates 59a of the substrate transporting means 59 will be described in detail below.

[0008] That is, they are placed on predetermined positions of respective rotary tables (not shown) of the substrate transfer device 60,
The two carriers 53 accommodating the two substrates 52 are each rotated by an angle of 90 degrees in a horizontal plane by carrier rotating means (not shown) such as an arm and a cylinder, so that the substrate direction is transferred to the substrate. And the direction is changed to the direction of substrate processing. Further, with respect to one carrier 53 of the two carriers 53, 25 substrates 52 in the carrier 53 are pushed up in the direction of the arrow A (vertical direction) and sandwiched from both sides by the pair of upper holding plates. By doing so, it is once held. Further, the two carriers 53 are subjected to horizontal movement processing by carrier horizontal movement means (not shown) such as a cylinder, a ball screw and a motor in the direction of arrow B together with each rotary table (not shown). It has become so. The moving distance by this horizontal moving process is set to a distance shifted by a half pitch of the holding pitch dimension of the 25 substrates 52 pushed up before. In this state, as described above, 25
The two substrates 52 are also pushed up in the direction of the arrow A (vertical direction), and are formed between the substrates held by the pair of upper holding plates at a predetermined pitch similar to the substrate holding pitch. Each of the 25 substrates 52 already passed through the through-grooves (not shown), which are slightly larger than the dimensions and the thickness of the substrate, penetrate in the vertical direction, and are already held in the previous process.
Is inserted within each interval. In this way, the 25 substrates 52 already held in the previous step are pushed up in the direction of arrow A (vertical direction) together with the 25 substrates 52 inserted in the respective substrate intervals. It has become. At this time, a total of 50 substrates 52 being pushed up and held have a half pitch of the initial pitch dimension and a narrower substrate interval. Thereafter, the pair of upper holding plates are both set in the vertical direction to release the holding position with respect to the substrate 52, and a total of 50
By lowering the two substrates 52 and holding the 50 substrates 52 by a pair of holding plates 59a of the substrate transporting means 59 below the pair of upper holding plates at a half pitch from both sides, the substrate holding When the replacement process is completed, the substrate transfer means 59
, A total of 50 (the number of batch-processed substrates) substrates 52 are transported to the substrate processing unit 55.

Further, in the substrate processing unit 55, two sets of a chemical tank 62 for storing a chemical such as an etching liquid and a washing tank 63 for storing pure water as a rinsing liquid are arranged in series. The substrate 52 is transported by the substrate transporting means 59 and transferred to a lifter device (not shown) provided for each of the two sets of the chemical solution tank 62 and the washing tank 63. Hand over and soak sequentially
After performing a chemical treatment on the substrate 52 in the chemical solution tank 62, a rinsing process of washing out the chemical solution and particles attached to the substrate 52 in the washing tank 63 is repeated, and the drying process is performed by the drying tank 64 as a final processing unit. Is applied to the substrate 52.

[0010]

However, in the above-mentioned conventional configuration, when the transfer robot 58 transfers the substrate 52 from the carrier mounting table 56 onto the rotary table of the substrate transfer device 60, the direction of the substrate and the transfer of the substrate are reduced. Since the direction in which the substrate is processed is different by 90 degrees, each rotation process for the two carriers 53 is required. In addition, in order to sequentially move the two carriers 53 to the push-up position, horizontal movement processing for the two carriers 53 is required. As described above, in the substrate transfer device 60, each rotation process by the carrier rotation unit (not shown) and the horizontal movement process by the carrier horizontal movement unit (not shown) must be performed, and the number of parts is also reduced. In many cases, this goes against demands for further simplification of the configuration, weight saving and installation space, and high positioning accuracy.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and a substrate transfer apparatus capable of further simplifying the structure, saving weight and space, and realizing high positioning accuracy, and using the same. It is an object to provide a substrate processing apparatus.

[0012]

According to the present invention, there is provided a substrate transfer apparatus for transferring a plurality of substrates from a carrier accommodating a plurality of substrates to a substrate transfer means. A first carrier mounting table having a position corresponding to the bottom opening of the first carrier opened when the first carrier is mounted, and a second carrier capable of mounting the second carrier; A second carrier mounting table having an opening at a position corresponding to the bottom opening of the second carrier when the carrier is mounted; and a second carrier mounting table for transferring the substrate from the first carrier and the second carrier to the substrate transfer means. The plurality of substrates accommodated in one carrier are moved from the bottom of the first carrier mounting table to the first
Push-up means for pushing up and holding through the bottom opening of the carrier, and pushing up and holding a plurality of substrates accommodated in the second carrier from below the second carrier mounting table through the bottom opening of the second carrier; Between the upper position and the standby position of the first carrier mounting table,
First rotating means for rotating the first carrier mounting table, and second rotating means for rotating the second carrier mounting table between a position above the push-up means and a standby position of the second carrier mounting table. A position of the first carrier mounted on the first carrier mounting table with respect to a thrusting means for thrusting a substrate accommodated in the first carrier and a thrusting means for thrusting the substrate accommodated in the second carrier The position of the second carrier mounted on the second carrier mounting table with respect to is shifted by a half pitch with respect to the substrate arrangement pitch of the plurality of substrates.

With this configuration, the carrier horizontal movement processing by the conventional carrier horizontal movement means is not performed,
A state in which the position of the first carrier and the position of the second carrier are shifted from each other by a half pitch with respect to the substrate arrangement pitch only by the rotation processing of the carrier mounting table by the first carrier rotation means and the second carrier rotation means. , The number of parts is reduced by the amount that the conventional carrier horizontal moving means is not required, which not only simplifies the configuration, saves weight and saves space, but also improves the delivery operation And high positioning accuracy can be realized.

The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus transfers a plurality of substrates from a carrier accommodating the plurality of substrates to the substrate transport means in order to perform the substrate processing on the plurality of substrates. A transfer apparatus and a substrate processing unit that transfers a plurality of substrates transferred to the substrate transfer unit by the substrate transfer apparatus to a substrate processing unit and performs a predetermined process. .

With this configuration, not only the structure can be further simplified by reducing the number of components and the weight and installation space can be reduced, but also the substrate transfer device that achieves high-speed positioning and high-speed transfer of the substrate by the substrate transfer device. However, it is easily adaptable to this substrate processing apparatus.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the substrate processing apparatus according to the present invention will be described with reference to the drawings, but the present invention is not limited to the embodiments described below.

FIG. 1 is a plan view showing a schematic configuration of a main part of a substrate transfer apparatus according to an embodiment of the present invention. FIG. 2 is a schematic view showing a substrate push-up means and a substrate transfer means in a state where a substrate is delivered from a first carrier. FIG. 3 is a side view showing a schematic configuration of a main part of a substrate push-up unit and a substrate transfer unit in a state of being pushed up including a substrate from the next carrier;
Members having the same functions and effects as those of the components of the conventional substrate processing apparatus shown in FIG. 7 are denoted by the same reference numerals, and description thereof will be omitted.

1 to 3, a substrate transfer apparatus 1 includes:
A substrate push-up means 4, a first carrier mounting table 5,
The carrier rotating means 7, the second carrier mounting table 8, and the second
And carrier rotating means 10. The substrate push-up means 4 pushes up the plurality of substrates 52 housed in the carrier 53 from the opening at the bottom of the carrier 53 to the plurality of grooves 2 a of the substrate holding member 2, and lowers the lower ends of the plurality of substrates 52. The portions are fitted and held, and the plurality of boards 52 pushed up are sandwiched from both sides to a pair of holding plates 3a of the board transfer means 3 and delivered. The first carrier mounting table 5 is capable of mounting the carrier 53, and has an opening 5b at a carrier mounting position corresponding to the bottom of the carrier 53. The first carrier rotating means 7 moves the first carrier mounting table 5 to a substrate push-up position by the substrate push-up means 4 (a position in a direction perpendicular to the paper surface of FIG. 2). Position to be pushed up) 4
a between the first carrier mounting table 5 and a first carrier standby position 5a by a bearing member (not shown) such as a bearing.
The carrier 53 is transferred by rotatably supporting the supporting member 6 of FIG. An opening 8b is formed in the second carrier mounting table 8 at a carrier mounting position corresponding to the bottom of the carrier 53 on which the carrier 53 can be mounted. Second carrier rotating means 1
0 means that the second carrier mounting table 8 is
(A position in a direction perpendicular to the plane of FIG. 3 where the plurality of substrates 52 in the carrier 53 are pushed up) 4b and a second carrier standby position 8a. The carrier 53 is transferred by rotatably supporting the support member 9 of the second carrier mounting table 8 with a material (not shown). It should be noted that the substrate push-up position 4a with respect to the first carrier mounting table 5 and the substrate push-up position 4b with respect to the second carrier mounting table 8 are defined by a half substrate pitch in the direction in which the plurality of substrates 52 are arranged (direction perpendicular to the surface of the substrate 52). It is configured to shift. That is, the first carrier standby position 5a which is the center position of the first carrier mounting table 5
The substrate pushing-up position 4a is rotated counterclockwise and the second
The substrate push-up position 4b obtained by rotating the second carrier standby position 8a, which is the center position of the carrier mounting table 8, clockwise is a position shifted by a half pitch with respect to the substrate arrangement pitch in the carrier 53. Here, c indicates a center position with respect to the substrate pushing-up positions 4a and 4b, the first carrier standby position 5a, and the second carrier standby position 8a.

The substrate transfer means 3 holds a plurality of substrates 52 pushed up by the substrate holding member 2 of the substrate push-up means 4 by sandwiching and holding the substrates 52 from both sides (in both directions orthogonal to the direction in which the substrates 52 are arranged). Between the plate 3a, the pushed-up substrate holding member 2 and each lifter device (not shown) provided for each substrate processing section (chemical solution tank 62, washing tank 63, etc.);
Alternatively, a pair of holding plates 3a may be provided between each lifter device (not shown).
And a horizontal drive member (not shown) for transferring the
The plurality of processed substrates 52 are collected in an empty carrier 53 that has been cleaned.

Each of the pair of holding plates 3a is rotated in opposite directions about the axis of a rotation shaft fixed to the central portion thereof, so that the holding front ends of the pair of holding plates 3a are rotated. The position is a substrate holding position to be approached, or a substrate holding release position in which a pair of holding plates 3a are vertically oriented by separating the holding front end side. That is, the plurality of substrates 52 are received and held from both sides in the approaching process on the holding tip side of the pair of holding plates 3a, or the pair of holding plates 3a are held in the separating process on the holding tip side.
Is set in the vertical direction, the holding of the plurality of substrates 52 is released. As shown in FIG. 5 which is a partial cross-sectional view taken along the line EE in FIG. 3, one end 1 of the pair of holding plates 3a is formed.
2, grooves 12a capable of holding, for example, 50 substrates 52 are sequentially formed at the half substrate pitch in the direction in which the substrates 52 are arranged. Further, as shown in FIG. 6 which is a partial sectional view taken along the line FF in FIG. 2, each of the other ends 13 has a groove 1 capable of receiving and holding, for example, 25 substrates 52 from both sides.
3a are sequentially formed at the substrate pitch in the direction in which the substrates 52 are arranged, and the substrate 52 is located at an intermediate position between the grooves 13a.
Each of the large through holes 13b through which the holes can pass is formed.

As a horizontal driving member (not shown) of the substrate transfer means 3, for example, a pair of holding plates 3 is attached to a wire or a belt.
a may be configured by a pulley around which these wires or belts are wound and a motor for rotating the pulley, or may be configured by a ball screw and a motor, or a rack and a pinion and a motor. .

The substrate push-up means 4 includes a carrier 5
A plurality of substrate holding grooves 2a are formed at the same pitch as the substrate arrangement pitch (substrate pitch) in the direction in which the plurality of substrates 52 housed in the substrate 3 are arranged and receive and hold the lower end portions of the plurality of substrates 52. A substrate holding member 2 provided on the upper surface, a vertically extending supporting member 11 having a front end fixed to a central portion of the lower surface of the substrate holding member 2, and a vertical drive capable of vertically moving the lower end of the supporting member 11; (Not shown). The vertical drive member (not shown) may be, for example, a cylinder, a ball screw and a motor, or a rack and a pinion and a motor.

Further, the first carrier rotating means 7 is provided in
As shown in the figure, each of the L-shaped carrier positioning members 1 formed with a taper for guiding the square of the carrier 53 respectively.
4 are carrier mounting portions 15 respectively disposed on the upper surface thereof
A first carrier mounting table 5 having: a columnar support member 6 having an upper end fixed to a lower surface of a distal end of an arm 16 connected to the carrier mounting portion 15; Arm member 17 having an end face fixed to one end
And a rotation drive member 18 such as a cylinder having a rod end connected to the other end of the arm member 17. Arm member 1 due to expansion and contraction of the rod end of the cylinder
7, the first axis about the center axis of the support member 6 as the center of rotation.
The carrier mounting table 5 is rotated in a horizontal plane by an angle of 90 degrees. Also, the second carrier rotating means 10
Is the same as that of the first carrier rotating means 7, and each carrier positioning member 14 having a taper for guiding a square of the carrier 53 has a carrier mounting portion 15 provided on the upper surface thereof. The carrier mounting table 8 and the arm 1 connected to the carrier mounting section 15
6, a columnar support member 9 having a top surface fixed to the top surface, an arm member 17 having a bottom surface fixed to one end, and an arm member 17 having the bottom surface fixed to one end. A rotation drive member 18 such as a cylinder to which the rod tip is connected. By the extension and contraction of the rod tip of this cylinder, the second carrier mounting table 8 is angled to the side opposite to the rotation direction of the first carrier mounting table 5 about the center axis of the support member 9 via the arm member 17 as the rotation center. It is designed to rotate by 90 degrees in a horizontal plane. As described above, since the rotation directions of the first carrier mounting table 5 and the second carrier mounting table 8 are opposite to each other, the front surface of the substrate 52 is cleaner than the back surface thereof, so that the back surface moves from the back surface to the front surface. In order to prevent the transfer of the particles, the front surface and the back surface of the substrate 52 are arranged to face each other.

With the above configuration, first, the carrier mounting table 5
Each carrier 53 containing the unprocessed substrate 52 placed thereon is transferred from the carrier mounting table 56 to the first carrier standby position 5 a of the substrate transfer device 60 by the transfer robot 58.
And, they are sequentially conveyed and placed on the first carrier mounting table 5 and the second carrier mounting table 8 at the second carrier standby position 8a.

Next, the first carrier mounting table 5, together with the carrier 53 thereon, is rotated counterclockwise by an angle of 90 degrees by the rotation driving member 18 and transferred to the substrate push-up position 4a. Further, at the substrate pushing-up position 4a, the 25 substrates 52 accommodated in the first carrier 53 are pushed up from the bottom opening portion of the carrier 53 into the plurality of grooves 2a of the substrate holding member 2. Substrate 52
Is fitted and held. The twenty-five substrates 52 are received from both sides by the grooves 13a on the other end 13 side of the pair of holding plates 3a of the substrate transporting means 3 and held, thereby holding the twenty-five substrates 52 from within the carrier 53. The substrate is transferred to a pair of holding plates 3a of the substrate transfer means 3 via the holding member 2. This state is shown in FIG.

Thereafter, the substrate holding member 2 is lowered, and the first
In a state where the empty carrier 53 is mounted on the carrier mounting table 5, the rotation driving member 18 is rotated clockwise by 90 degrees.
To transfer to the original first carrier standby position 5a. Next, the second carrier mounting table 8 is placed on the carrier 5 thereon.
3 and the rotation driving member 18 by 90 degrees clockwise.
To transfer the substrate to the substrate push-up position 4b which is shifted from the substrate push-up position 4a by a half substrate pitch.

Further, at the substrate pushing-up position 4b, the 25 substrates 52 accommodated in the next carrier 53 are pushed up from the bottom opening of the carrier 53 by the substrate holding member 2, and the plurality of grooves 2a of the substrate holding member 2 are moved. The lower end portions of the plurality of substrates 52 are fitted and held therein. Then, the raised 25 substrates 52 are allowed to pass upward through the through holes 13b between the grooves 13a on the other end 13 side of the pair of holding plates 3a of the substrate transporting means 3, and the respective grooves 13
The 25 substrates 52 held by a are also pushed up together and into each groove 2a of the substrate holding member 2, a total of 50
The two substrates 52 are held. This state is shown in FIG.

Next, a pair of holding plates 3a of the substrate transfer means 3
Are rotated by 180 degrees to form a pair of holding plates 3a.
Of the substrate holding member 2 holding a total of 50 substrates 52 is lowered, and a total of 50 substrates 52 are transferred from the plurality of grooves 2a of the substrate holding member 2 to the substrate transfer means. 3. Each groove 12 in the pair of holding plates 3a
hand over to a. At this time, the front surface and the back surface of the substrate 52 are arranged so as to sequentially face each other.

Further, the substrate holding member 2 is lowered, and the second
The carrier mounting table 8 is rotated counterclockwise by an angle of 90 degrees by the rotation drive member 18 while the empty carrier 53 is mounted thereon, and transferred to the original second carrier standby position 8a. Thereafter, the empty carriers 53 after the transfer of the plurality of substrates 52 are sequentially transferred to the carrier cleaning unit 61 by the transfer robot 58, and the carrier cleaning unit 61
In each of the empty carriers 53 that have been subjected to the cleaning process, a total of 50 substrates 52 transported by the substrate transporting unit 3 and processed from the substrate processing unit 55 are divided into 25 substrates 52 and collected again. Each carrier 53 is transferred to the first carrier standby position 5a and the second carrier standby position 8a of the loading device 60, respectively, and made to stand by. in this way,
To collect and collect a total of 50 processed substrates 52 into 25 substrates 52, the above operation may be repeated in reverse.

Therefore, the first carrier rotating means 7 and the second carrier rotating means 10 are not required to perform the horizontal moving process of the carrier 53 by the conventional carrier horizontal moving means.
The first carrier mounting table 5 and the second carrier mounting table 8 are only rotated by the first carrier mounting table 5 and the second carrier mounting table 8 to move the first carrier mounting table 5 and the second carrier mounting table 8 to the substrate pushing-up positions 4a and 4b. Since it is possible to position the substrate transfer apparatus in a manner shifted by (array pitch), the structure of the substrate transfer apparatus 1 can be further simplified and the weight and installation space can be further reduced by the amount that the conventional carrier horizontal moving means is unnecessary. Can realize high operation speed and high positioning accuracy. Further, such a substrate transfer apparatus 1 can be easily adapted to the above-described substrate processing apparatus.

[0031]

As described above, according to the first aspect of the present invention, the first carrier rotating means and the second carrier rotating means can be used without performing the carrier horizontal movement processing by the conventional carrier horizontal moving means. It is possible to position the first carrier mounting table and the second carrier mounting table in a state shifted by a half pitch with respect to the substrate arrangement pitch only by the rotation processing of the carrier mounting table by the means, so that the carrier is horizontally moved. Since the means is not required, further simplification of the configuration, weight saving and installation space, and high positioning accuracy can be realized.

According to the second aspect of the present invention, a substrate transfer apparatus having a further simplified structure, a reduced weight and a reduced installation space, and a high positioning accuracy can be easily and efficiently applied to the substrate processing apparatus. Can be adapted.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating a schematic main configuration of a substrate transfer apparatus according to an embodiment of the present invention.

FIG. 2 is a side view showing a schematic configuration of a main part of a substrate push-up unit and a substrate transfer unit in a state where a substrate is delivered from a first carrier in the substrate transfer device of FIG. 1;

FIG. 3 is a side view showing a schematic configuration of a main part of a substrate push-up unit and a substrate transfer unit in a state where a substrate including a substrate from a next carrier is pushed up in the substrate transfer device of FIG. 1;

FIG. 4 is a front view showing a schematic configuration of a main part of a first carrier rotating unit of FIG. 1;

FIG. 5 is a partial sectional view taken along the line EE of FIG. 3;

FIG. 6 is a partial sectional view taken along line FF of FIG. 2;

FIG. 7 is a perspective view illustrating a schematic main configuration of a conventional substrate processing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate transfer apparatus 53 Carrier 52 Substrate 2 Substrate holding member 2a Groove 3 Substrate conveying means 3a Holding plate 4 Substrate pushing-up means 4a, 4b Substrate pushing-up position 5b, 8b Opening 5 First carrier mounting table 5a First carrier standby position 6 Supporting member 7 First carrier rotating means 8 Second carrier mounting table 8a Second carrier standby position 8b Opening 9,11 Supporting member 10 Second carrier rotating means 12 One end 12a, 13a Groove 13 Other end 13b Through hole 14 Carrier positioning member 15 Carrier mounting part 16 Arm part 17 Arm member 18 Rotation drive member

Claims (2)

[Claims] 1. A substrate transfer apparatus for transferring a plurality of substrates from a carrier accommodating a plurality of substrates to a substrate transfer means, wherein a first carrier can be placed, and the first carrier is placed on the first carrier. A first carrier mounting table having an opening at a position corresponding to the bottom opening of the first carrier, and a second carrier capable of being mounted, wherein the second carrier is mounted when the second carrier is mounted. A second carrier mounting table having an opening at a position corresponding to the bottom opening of the two carriers; and a second carrier mounting table accommodated in the first carrier for transferring a substrate from the first carrier and the second carrier to the substrate transport means. The plurality of substrates are pushed up from below the first carrier mounting table through the bottom opening of the first carrier and held, and the plurality of substrates accommodated in the second carrier are mounted on the second carrier mounting table. A push-up means for pushing up and holding the bottom of the second carrier through a bottom opening of the second carrier; and a first carrier mounting table between a position above the push-up means and a standby position of the first carrier mounting table. First rotating means for rotating, and second rotating means for rotating the second carrier mounting table between a position above the push-up means and a standby position of the second carrier mounting table. The position of the first carrier placed on the first carrier mounting table with respect to the pushing means when pushing up the substrate accommodated in the first carrier and the time of pushing up the substrate accommodated in the second carrier A position of the second carrier mounted on the second carrier mounting table with respect to the push-up means is shifted by a half pitch with respect to a substrate arrangement pitch of a plurality of substrates. The substrate transfer apparatus. 2. A substrate transfer apparatus according to claim 1, wherein said substrate transfer device transfers the plurality of substrates from a carrier accommodating the plurality of substrates to a substrate transfer means in order to perform the substrate processing on the plurality of substrates. A substrate processing unit for transporting the plurality of substrates transferred to the substrate transporting means by the mounting device to a substrate processing unit and performing a predetermined process.