JP2006179757A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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JP2006179757A
JP2006179757A JP2004372882A JP2004372882A JP2006179757A JP 2006179757 A JP2006179757 A JP 2006179757A JP 2004372882 A JP2004372882 A JP 2004372882A JP 2004372882 A JP2004372882 A JP 2004372882A JP 2006179757 A JP2006179757 A JP 2006179757A
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substrate
processing unit
processing
substrates
unit
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JP4401285B2 (en
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Kenichi Sano
謙一 佐野
Sozo Nagami
宗三 永見
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Dainippon Screen Manufacturing Co Ltd
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Dainippon Screen Manufacturing Co Ltd
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Priority to JP2004372882A priority Critical patent/JP4401285B2/en
Priority to KR1020050126839A priority patent/KR100761576B1/en
Priority to TW094145445A priority patent/TWI277461B/en
Priority to US11/316,238 priority patent/US20060137726A1/en
Priority to CNB2005101370825A priority patent/CN100452340C/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus comprising a first processing part for collectively processing a plurality of substrates and a second processing for processing substrates one by one, and capable of processing the substrate in either processing. <P>SOLUTION: This substrate processing apparatus comprises a collective processing part 27 for collectively processing a plurality of substrates W, and an individual processing part 43 for treating the substrates W one by one. A transfer mechanism 13 can transfer the substrates among a cassette C, the collective processing part 27 and the individual processing part 43. A control unit controls the transfer operation of the transfer mechanism 13 based on the processing condition for the substrates W, so that the substrates W can be processed by selecting either of the collective processing part 27 and the individual processing part 43. Further, the substrates W can be treated by a suitably combined use of them, e.g. by using the individual processing part 43 following the collective processing part 27, etc. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、半導体ウエハや液晶表示用のガラス基板(以下、単に基板と称する)等の基板に対して処理を施す基板処理装置に関する。   The present invention relates to a substrate processing apparatus for processing a substrate such as a semiconductor wafer or a glass substrate for liquid crystal display (hereinafter simply referred to as a substrate).

従来、基板処理装置においては、複数枚(例えば、25枚)の基板を一括して処理する方式が主流であったが、近年、基板を1枚ずつ処理する方式も採用され始めている。   Conventionally, in a substrate processing apparatus, a method of processing a plurality of (for example, 25) substrates at once has been mainstream, but recently, a method of processing substrates one by one has begun to be adopted.

両方式は、処理内容に応じて適・不適があり、例えばレジスト剥離処理は一括して処理する方式が採用され、現像処理は1枚ずつ処理する方式が採用されている。ただし、洗浄処理のように、いずれの方式であっても適切に行える処理もある。   Both types are appropriate / inappropriate depending on the contents of processing. For example, a method of batch processing is used for resist stripping, and a mode of processing one by one is used for development processing. However, there is a process that can be appropriately performed by any method such as a cleaning process.

一括して処理する方式の基板処理装置(以下、単に「一括処理装置」という)は、通常、処理液を貯留可能な処理槽を備え、複数枚の基板を一括して処理槽内に浸漬して処理を施す。このため、一括して処理する方式によれば、基板処理の量産性に優れることのほか、基板間の処理品質を均一にすることができる(例えば、特許文献1参照)。   A substrate processing apparatus that performs batch processing (hereinafter simply referred to as “collective processing apparatus”) usually includes a processing tank capable of storing a processing solution, and immerses a plurality of substrates in the processing tank at once. Process. For this reason, according to the system which processes collectively, the process quality between board | substrates can be made uniform besides being excellent in the mass-productivity of a substrate process (for example, refer patent document 1).

これに対し、基板を1枚ずつ処理する方式の基板処理装置(以下、単に「個別処理装置」という)は、1枚の基板を回転可能に水平姿勢で保持する保持部を備え、基板の上方に配置されたノズル等から処理液を供給して基板を処理する。これによれば、基板の処理精度が比較的高い(例えば、特許文献2参照)。   On the other hand, a substrate processing apparatus that processes substrates one by one (hereinafter simply referred to as “individual processing apparatus”) includes a holding unit that holds a single substrate in a horizontal posture so that the substrate can be rotated. The substrate is processed by supplying a processing liquid from a nozzle or the like disposed in the substrate. According to this, the processing accuracy of the substrate is relatively high (see, for example, Patent Document 2).

特開2001−196342号公報JP 2001-196342 A 特開2000−070873号公報JP 2000-070873 A

しかしながら、このような構成を有する従来例の場合には次のような問題がある。
基板を一括して処理する方式によれば、基板同士で互いに汚染してしまう。たとえ、一括して処理するのに適した処理内容であっても、処理の最後がリンス等で洗浄する工程である場合は、仕上がりが十分でない場合がある。
However, the conventional example having such a configuration has the following problems.
According to the system in which substrates are processed at once, the substrates are contaminated with each other. Even if the processing content is suitable for batch processing, the finish may not be sufficient when the last of the processing is a step of washing with rinse or the like.

そのような場合は、一括処理装置によって処理を施した後に、さらに、個別処理装置に搬送して処理精度を高める必要がある。しかし、その処理内容について、両方式の基板処理装置を備える必要があり高コスト化する不都合がある。また、それら基板処理装置の間で基板を搬送する必要がありロスが大きい。   In such a case, after processing is performed by the batch processing apparatus, it is necessary to further transport to an individual processing apparatus to improve processing accuracy. However, it is necessary to provide both types of substrate processing apparatuses for the processing contents, which disadvantageously increases costs. In addition, it is necessary to transport the substrate between these substrate processing apparatuses, resulting in a large loss.

この発明は、このような事情に鑑みてなされたものであって、複数枚の基板を一括して処理する第1処理部と、基板を1枚ずつ処理する第2処理部とを備えて、基板をいずれの処理部でも処理することができる基板処理装置を提供することを目的とする。   The present invention has been made in view of such circumstances, and includes a first processing unit that collectively processes a plurality of substrates, and a second processing unit that processes the substrates one by one, It is an object of the present invention to provide a substrate processing apparatus capable of processing a substrate in any processing unit.

この発明は、このような目的を達成するために、次のような構成をとる。
すなわち、請求項1に記載の発明は、基板に処理を行う基板処理装置において、複数枚の基板を収納する収納器を載置する載置部と、複数枚の基板を一括して処理する第1処理部及び基板を1枚ずつ処理する第2処理部を有する基板処理部と、前記載置部と前記第1処理部と前記第2処理部との間で基板を搬送する搬送機構と、基板の処理条件に基づいて、前記載置部と前記第1処理部と前記第2処理部との間における前記搬送機構の搬送動作を制御する制御部と、を備えることを特徴とするものである。
In order to achieve such an object, the present invention has the following configuration.
That is, according to the first aspect of the present invention, in the substrate processing apparatus for processing a substrate, a mounting unit for mounting a container for storing a plurality of substrates and a plurality of substrates processed in a lump. A substrate processing unit having a first processing unit and a second processing unit that processes the substrates one by one; a transport mechanism that transports the substrate between the placement unit, the first processing unit, and the second processing unit; And a control unit that controls the transfer operation of the transfer mechanism between the placement unit, the first processing unit, and the second processing unit based on the processing conditions of the substrate. is there.

[作用・効果]請求項1に記載の発明によれば、基板処理部は、複数枚の基板を一括して処理する第1処理部及び基板を1枚ずつ処理する第2処理部を有し、制御部の制御により搬送機構は、基板収容器から第1処理部または第2処理部のいずれかに基板を搬送する。これにより、1つの基板処理装置で、複数枚の基板を一括して処理する方式および基板を1枚ずつ処理する方式で基板に対する洗浄、エッチング、剥離、乾燥等の処理が施せるので、基板に対する精度のよい処理が施せる。   [Operation / Effect] According to the first aspect of the present invention, the substrate processing unit has a first processing unit that processes a plurality of substrates at once and a second processing unit that processes the substrates one by one. Under the control of the control unit, the transport mechanism transports the substrate from the substrate container to either the first processing unit or the second processing unit. As a result, a single substrate processing apparatus can perform processing such as cleaning, etching, peeling, drying, etc. on a substrate by a method of processing a plurality of substrates at once and a method of processing a substrate one by one. Can be processed.

また、請求項2に記載の発明は、請求項1に記載の基板処理装置において、前記基板処理部は2つの領域に区分され、前記第1処理部と前記第2処理部とを対向させて一方の領域に第1処理部を配置し、他方の領域に第2処理部を配置させることを特徴とするものである。   According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, the substrate processing unit is divided into two regions, and the first processing unit and the second processing unit are opposed to each other. The first processing unit is arranged in one area, and the second processing unit is arranged in the other area.

[作用・効果]請求項2に記載の発明によれば、基板処理部を2つの領域に区分し、各領域に第1処理部または第2処理部を互いに対向するようにそれぞれ配置する。これにより基板処理部の配置効率が向上し、フットプリントを抑えることができる。また、搬送機構の搬送動作に伴う移動量を低減でき、搬送効率がよい。   [Operation and Effect] According to the invention described in claim 2, the substrate processing unit is divided into two regions, and the first processing unit or the second processing unit is arranged in each region so as to face each other. Thereby, the arrangement efficiency of the substrate processing unit is improved, and the footprint can be suppressed. In addition, the amount of movement associated with the transport operation of the transport mechanism can be reduced, and transport efficiency is good.

また、請求項3に記載の発明は、請求項2に記載の基板処理装置において、前記2つの領域の間に隔壁をさらに備えることを特徴とするものである。   The invention according to claim 3 is the substrate processing apparatus according to claim 2, further comprising a partition between the two regions.

[作用・効果]請求項3に記載の発明によれば、各領域内の雰囲気が隔壁によって互いに分断されて、他方の領域に雰囲気が拡散することを防止することができる。よって、各領域に配置される第1処理部または第2処理部において基板を好適に処理することができる。   [Operation / Effect] According to the invention described in claim 3, it is possible to prevent the atmosphere in each region from being separated from each other by the partition walls and the atmosphere from diffusing to the other region. Therefore, the substrate can be suitably processed in the first processing unit or the second processing unit arranged in each region.

また、請求項4に記載の発明は、請求項1から請求項3のいずれかに記載の基板処理装置において、前記第1処理部は、垂直姿勢である複数枚の基板に対して処理液による処理を行う処理液処理部と、前記処理液処理部で処理された垂直姿勢である複数枚の基板を乾燥する乾燥処理部と、前記搬送機構との間で基板の受け渡しが可能であり、複数枚の基板について水平姿勢と垂直姿勢との間で一括して姿勢の変換を行う姿勢変換機構と、前記姿勢変換機構との間で複数枚の基板の受け渡しが可能であり、前記処理液処理部と前記乾燥処理部との間で基板の搬送を行う第1処理部用搬送機構とを備えることを特徴とするものである。   According to a fourth aspect of the present invention, in the substrate processing apparatus according to any one of the first to third aspects, the first processing unit uses a processing liquid for a plurality of substrates in a vertical posture. The substrate can be transferred between a processing liquid processing unit that performs processing, a drying processing unit that dries a plurality of substrates in a vertical posture processed by the processing liquid processing unit, and the transport mechanism. A plurality of substrates can be transferred between the posture conversion mechanism that performs batch posture conversion between a horizontal posture and a vertical posture with respect to a single substrate; and the processing liquid processing unit And a drying mechanism for transporting a substrate between the first processing unit and the drying processing unit.

[作用・効果]請求項4に記載の発明によれば、第1処理部と搬送機構との間で基板を搬送する過程で、姿勢変換機構により複数枚の基板の姿勢を一括して変換する。よって、垂直姿勢である複数枚の基板を処理する処理液処理部や乾燥処理部に対して好適に基板を搬送することができる。また、この際、第1処理部用搬送機構が姿勢変換機構との間で基板の受け渡しをしつつ、処理液処理部や乾燥処理部との間で基板の搬送を行うので、第1処理部内の搬送効率をさらに向上させることができる。   [Operation and Effect] According to the invention described in claim 4, in the process of transporting the substrate between the first processing unit and the transport mechanism, the postures of the plurality of substrates are collectively converted by the posture conversion mechanism. . Therefore, the substrate can be suitably transported to the processing liquid processing unit and the drying processing unit that process a plurality of substrates in a vertical posture. At this time, the first processing unit transport mechanism transfers the substrate to and from the processing liquid processing unit and the drying processing unit while delivering the substrate to and from the posture changing mechanism. The conveyance efficiency can be further improved.

また、請求項5に記載の発明は、請求項1から請求項4のいずれかに記載の基板処理装置において、前記第2処理部は、基板を1枚ずつ処理する枚葉処理部と、前記搬送機構と前記枚葉処理部との間で基板の搬送を行う第2処理部用搬送機構とを備えることを特徴とするものである。   Further, the invention according to claim 5 is the substrate processing apparatus according to any one of claims 1 to 4, wherein the second processing unit is a single wafer processing unit that processes the substrates one by one; A second processing unit transport mechanism that transports the substrate between the transport mechanism and the single wafer processing unit is provided.

[作用・効果]請求項5に記載の発明によれば、第2処理部用搬送機構が、枚葉処理部と搬送機構との間で基板の搬送を行うので、第2処理部内の基板の搬送効率を向上させることができる。   [Operation / Effect] According to the invention described in claim 5, since the transport mechanism for the second processing unit transports the substrate between the single wafer processing unit and the transport mechanism, the substrate in the second processing unit The conveyance efficiency can be improved.

また、請求項6に記載の発明は、請求項4に記載の基板処理装置において、前記第1処理部が備える前記姿勢変換機構は、第1姿勢変換機構であり、前記基板処理部を挟んで前記搬送機構側とは反対側に配置され、前記第1処理部と前記第2処理部との間で基板の搬送を行い、かつ複数枚の基板について水平姿勢と垂直姿勢との間で一括して姿勢の変換を行う第2姿勢変換機構をさらに備えることを特徴とするものである。   According to a sixth aspect of the present invention, in the substrate processing apparatus of the fourth aspect, the posture changing mechanism provided in the first processing unit is a first posture changing mechanism, and the substrate processing unit is sandwiched therebetween. The substrate is disposed on the side opposite to the transport mechanism side, transports substrates between the first processing unit and the second processing unit, and batches a plurality of substrates between a horizontal posture and a vertical posture. And a second posture changing mechanism for changing the posture.

[作用・効果]請求項6に記載の発明によれば、第1処理部と第2処理部との間で基板を搬送する過程で、第2姿勢変換機構により複数枚の基板の姿勢を一括して変換する。よって、第1処理部と第2処理部との間を好適に基板の搬送を行うことができる。また、基板処理部を挟んで搬送機構とは反対側に第2姿勢変換手段を配置するこで、第2姿勢変換手段が搬送機構と緩衝することがない。よって、搬送機構と第2姿勢変換手段との搬送動作を互いに独立して制御することができる。   [Operation / Effect] According to the invention described in claim 6, in the process of transporting the substrate between the first processing unit and the second processing unit, the postures of the plurality of substrates are collectively controlled by the second posture changing mechanism. And convert. Therefore, the substrate can be suitably transported between the first processing unit and the second processing unit. In addition, the second attitude conversion unit is not buffered with the transfer mechanism by disposing the second attitude conversion unit on the opposite side of the transfer mechanism with the substrate processing unit interposed therebetween. Therefore, the transport operations of the transport mechanism and the second posture changing means can be controlled independently of each other.

また、請求項7に記載の発明は、請求項1から請求項6のいずれかに記載の基板処理装置において、前記搬送機構は、前記第1処理部で処理された基板を前記第2処理部へ搬送することを特徴とするものである。   The invention according to claim 7 is the substrate processing apparatus according to any one of claims 1 to 6, wherein the transport mechanism is configured to transfer the substrate processed by the first processing unit to the second processing unit. It is characterized by being conveyed to.

[作用・効果]請求項7に記載の発明によれば、複数枚の基板を一括して処理する方式で処理を行った基板に対し、続けて基板を1枚ずつ処理する方式で処理を行うことができる。   [Operation / Effect] According to the invention described in claim 7, for a substrate processed by a method of processing a plurality of substrates at once, processing is performed by a method of successively processing the substrates one by one. be able to.

また、請求項8に記載の発明は、請求項1から請求項7のいずれかに記載の基板処理装置において、前記搬送機構は、前記第2処理部で処理された基板を前記第1処理部へ搬送することを特徴とするものである。   The invention according to claim 8 is the substrate processing apparatus according to any one of claims 1 to 7, wherein the transport mechanism is configured to transfer the substrate processed by the second processing unit to the first processing unit. It is characterized by being conveyed to.

[作用・効果]請求項8に記載の発明によれば、基板を1枚ずつ処理する方式で処理を行った基板に対し、続けて複数枚の基板を一括して処理する方式で処理を行うことができる。   [Operation / Effect] According to the invention described in claim 8, the substrate processed by the method of processing the substrates one by one is processed by the method of successively processing a plurality of substrates. be able to.

この発明に係る基板処理装置によれば、基板処理部は、複数枚の基板を一括して処理する第1処理部及び基板を1枚ずつ処理する第2処理部を有し、制御部による制御により搬送機構は、基板収容器から第1処理部または第2処理部のいずれかに基板を搬送する。これにより、1つの基板処理装置で、複数枚の基板を一括して処理する方式および基板を1枚ずつ処理する方式で基板に対する洗浄、エッチング、剥離、乾燥等の処理が施せるので、基板に対する精度のよい処理が施せる。   According to the substrate processing apparatus of the present invention, the substrate processing unit includes the first processing unit that processes a plurality of substrates at once and the second processing unit that processes the substrates one by one, and is controlled by the control unit. Thus, the transport mechanism transports the substrate from the substrate container to either the first processing unit or the second processing unit. As a result, a single substrate processing apparatus can perform processing such as cleaning, etching, peeling, drying, etc. on a substrate by a method of processing a plurality of substrates at once and a method of processing a substrate one by one. Can be processed.

以下、図面を参照してこの発明の実施例1を説明する。
図1は、実施例1に係る基板処理装置の概略構成を示した平面図である。
Embodiment 1 of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view illustrating a schematic configuration of the substrate processing apparatus according to the first embodiment.

基板処理装置は、基板W(例えば、半導体ウエハ)について所定の処理(例えば、レジスト剥離処理)を施す装置であり、基板Wを収納するカセットCを載置するカセット載置部1と、基板に所定の処理を行う基板処理領域3と、カセットCと基板処理領域3との間に配置され、双方に対して基板Wを搬送する搬送領域5とに大きく分けられる。基板処理領域3は、さらに、複数枚の基板Wを一括して処理する一括処理領域(第1処理部)3aと、基板を1枚ずつ処理する個別処理領域(第2処理部)3bとに区分されている。   The substrate processing apparatus is an apparatus that performs a predetermined process (for example, a resist stripping process) on a substrate W (for example, a semiconductor wafer), a cassette mounting unit 1 for mounting a cassette C for storing the substrate W, and a substrate. The substrate processing area 3 for performing a predetermined process and the transfer area 5 for transferring the substrate W to both the cassette C and the substrate processing area 3 are roughly divided. The substrate processing region 3 is further divided into a batch processing region (first processing unit) 3a for processing a plurality of substrates W at once and an individual processing region (second processing unit) 3b for processing substrates one by one. It is divided.

カセット載置部1に載置されるカセットCは、複数枚(例えば25枚)の基板W(以下、適宜「基板W群」と略記する)を水平姿勢で多段に収納する。   The cassette C placed on the cassette placement unit 1 accommodates a plurality of (for example, 25) substrates W (hereinafter abbreviated as “substrate W group” as appropriate) in multiple stages in a horizontal posture.

搬送領域5は、カセット載置部1に沿って形成される搬送路11と、搬送路11上に配備され、基板Wを搬送する搬送機構13とを有する。搬送機構13は、螺子送り機構によって搬送路11上を水平方向(図1において「X方向」)に駆動される。また、その搬送機構13の上部には、「U」の字状の形状を有する2個の保持アーム13a1、13a2(以下、特に区別しないときは保持アーム13aと総称する)を備えて、それぞれ基板Wを1枚ずつ水平姿勢で保持する。搬送機構13自体も、図示省略の駆動機構により、2個の保持アーム13aを旋回移動、昇降移動、水平方向の出退移動を可能に駆動する。そして、カセットCと一括処理領域3aと個別処理領域3bとに対して基板Wを1枚づつ搬送する。 The transport area 5 includes a transport path 11 formed along the cassette mounting unit 1 and a transport mechanism 13 that is disposed on the transport path 11 and transports the substrate W. The transport mechanism 13 is driven in the horizontal direction (“X direction” in FIG. 1) on the transport path 11 by a screw feed mechanism. The upper part of the transport mechanism 13 includes two holding arms 13a 1 and 13a 2 (hereinafter collectively referred to as holding arms 13a unless otherwise distinguished) having a “U” -shaped shape, Each substrate W is held in a horizontal posture. The transport mechanism 13 itself also drives the two holding arms 13a by a drive mechanism (not shown) so as to be capable of turning, moving up and down, and moving in and out in the horizontal direction. Then, the substrates W are transferred one by one to the cassette C, the batch processing region 3a, and the individual processing region 3b.

基板処理領域3は、搬送路11に対して略直角方向に区分されて、一方を一括処理領域3aとし、他方を個別処理領域3bとしている。これにより、各領域3a、3bを搬送領域5に隣接させるとともに、一括処理領域3aと個別処理領域3bとを対向させている。さらに、両領域3a、3bの間には、雰囲気を遮断する隔壁7が設けられている。   The substrate processing area 3 is divided in a direction substantially perpendicular to the transport path 11, and one is a batch processing area 3 a and the other is an individual processing area 3 b. Thereby, each area | region 3a, 3b is made to adjoin to the conveyance area | region 5, and the collective process area | region 3a and the individual process area | region 3b are made to oppose. Further, a partition wall 7 is provided between the regions 3a and 3b to block the atmosphere.

一括処理領域3aには、搬送機構13との間で基板Wの受け渡しをするとともに、水平姿勢と垂直姿勢との間で基板W群の姿勢を一括して変換する第1姿勢変換部21と、第1姿勢変換部21との間で基板W群を一括して受け渡しする第1プッシャー23と、この第1プッシャー23との間で基板W群の受け渡しをする一括用搬送機構25と、一括用搬送機構25との間で基板W群の受け渡しをするとともに、垂直姿勢の基板W群を一括して処理する一括処理部27とを有する。   In the collective processing area 3a, a first attitude conversion unit 21 that transfers the substrate W to and from the transport mechanism 13 and collectively converts the attitude of the group of substrates W between the horizontal attitude and the vertical attitude; A first pusher 23 that collectively transfers the substrate W group to and from the first posture changing unit 21; a batch transfer mechanism 25 that transfers the substrate W group to and from the first pusher 23; A batch processing unit 27 is provided for transferring the substrate W group to and from the transport mechanism 25 and processing the substrate W group in a vertical posture at once.

図2を参照して第1姿勢変換部21を説明する。図2(a)は、支持台21aが水平姿勢であるときの第1姿勢変換部21の平面図(上段)と側面図(下段)であり、(b)は支持台21aが垂直姿勢であるときの第1姿勢変換部21の平面図(上段)と側面図(下段)である。第1姿勢変換部21は、支持台21aと、この支持台21aに設けられて、基板Wを多段に保持する複数個(例えば、4個)の保持具21bとを備える。支持台21aは、図示省略の駆動機構によって支持台21aの基端部の水平軸芯P周りに回動駆動される。これにより、支持台21aは、図2(a)に示すような水平姿勢と、図2(b)に示すような垂直姿勢とをとる。このとき、各保持具21bも支持台21aと連動して回動することで、これらに保持される基板W群も水平姿勢と垂直姿勢との間で姿勢変換する。   The 1st attitude | position conversion part 21 is demonstrated with reference to FIG. 2A is a plan view (upper stage) and a side view (lower stage) of the first attitude conversion unit 21 when the support base 21a is in a horizontal attitude, and FIG. 2B is a vertical attitude of the support base 21a. It is the top view (upper stage) and side view (lower stage) of the 1st attitude | position conversion part 21 at the time. The first attitude conversion unit 21 includes a support base 21a and a plurality of (for example, four) holders 21b that are provided on the support base 21a and hold the substrate W in multiple stages. The support base 21a is rotationally driven around the horizontal axis P at the base end portion of the support base 21a by a drive mechanism (not shown). Thereby, the support base 21a takes a horizontal posture as shown in FIG. 2 (a) and a vertical posture as shown in FIG. 2 (b). At this time, each holder 21b also rotates in conjunction with the support base 21a, so that the substrate W group held by these holders is also changed in posture between the horizontal posture and the vertical posture.

かかる第1姿勢変換部21は、その支持台21aが水平姿勢の状態において搬送機構13との間で基板Wの受け渡しができるように、搬送路11に対面して配置される。   The first posture changing unit 21 is arranged facing the transfer path 11 so that the substrate W can be transferred to and from the transfer mechanism 13 when the support base 21a is in a horizontal posture.

第1姿勢変換部21の傍らに第1プッシャー23がある。図示省略の駆動機構により、第1プッシャー23は、旋回移動と昇降移動(図1においてZ方向)と水平方向(同X方向)の移動とが可能に構成されている。また、第1プッシャー23の上端部は、複数の溝が互いに平行に形成され、各溝に基板Wを当接させることで一括して保持することができる。   There is a first pusher 23 beside the first posture conversion unit 21. The first pusher 23 is configured to be capable of turning, moving up and down (Z direction in FIG. 1), and moving in the horizontal direction (X direction) by a drive mechanism (not shown). Further, the upper end portion of the first pusher 23 has a plurality of grooves formed in parallel to each other, and can be held together by bringing the substrate W into contact with each groove.

図3を参照する。図3は第1プッシャー23と第1姿勢変換部21との正面図であり、(a)、(b)は基板の受け渡しの様子を示している。第1プッシャー23と第1姿勢変換部21との間で基板W群の受け渡しを行うとき、図3(a)、(b)に示すように、第1姿勢変換部21の支持台21aは垂直姿勢である。第1プッシャー23が第1姿勢変換部21から基板W群を受け取る際、図3(a)に示すように、第1プッシャー23は第1姿勢変換部21の下方に位置している。そして、図3(b)に示すように、第1プッシャー23が上昇して、第1姿勢変換部21から基板W群を一括して受け取る。   Please refer to FIG. FIG. 3 is a front view of the first pusher 23 and the first posture changing unit 21, and (a) and (b) show how the substrate is transferred. When the substrate W group is transferred between the first pusher 23 and the first posture changing unit 21, as shown in FIGS. 3A and 3B, the support 21a of the first posture changing unit 21 is vertical. It is posture. When the first pusher 23 receives the group of substrates W from the first attitude conversion unit 21, the first pusher 23 is positioned below the first attitude conversion unit 21 as shown in FIG. Then, as shown in FIG. 3B, the first pusher 23 moves up and receives the substrate W group from the first attitude conversion unit 21 at a time.

一括用搬送機構25は、図示省略の駆動機構により、一括処理部27に沿って水平方向(図1においてY方向)に移動可能に構成される。また、一括用搬送機構25は、水平に延び出た開閉自在の一対の挟持機構25aを備えて、基板W群を一括して狭持機構25aに支持する。   The collective transport mechanism 25 is configured to be movable in the horizontal direction (Y direction in FIG. 1) along the collective processing unit 27 by a drive mechanism (not shown). The collective transport mechanism 25 includes a pair of openable and closable clamping mechanisms 25a extending horizontally, and collectively supports the substrate W group on the clamping mechanism 25a.

第1プッシャー23との基板W群の受け渡しは、一括処理部27と対向しない待機位置で行う。図4(a)、(b)に示すように、第1プッシャー23が昇降するとともに、狭持機構25aが開閉することで、第1プッシャー23と一括用搬送機構25との間で基板W群の受け渡しを行う。   The transfer of the substrate W group to the first pusher 23 is performed at a standby position that does not face the collective processing unit 27. As shown in FIGS. 4A and 4B, the first pusher 23 is moved up and down, and the holding mechanism 25a is opened and closed, whereby the substrate W group is disposed between the first pusher 23 and the collective transport mechanism 25. Delivery of.

一括処理部27は、乾燥処理部29と洗浄処理部31と薬液処理部33とを有する。なお、本実施例では一括処理部27において、基板Wからレジストを除去する、いわゆるレジスト剥離処理を行うものとして説明する。なお、レジスト(有機物)は一例に過ぎず、これに限るものではない。   The batch processing unit 27 includes a drying processing unit 29, a cleaning processing unit 31, and a chemical solution processing unit 33. In the present embodiment, the batch processing unit 27 will be described as performing a so-called resist stripping process in which the resist is removed from the substrate W. Note that the resist (organic material) is merely an example, and the present invention is not limited to this.

図5を参照する。乾燥処理部29は、スピンドライヤーであり、上部に基板W群を搬送できる程度の開口が形成された乾燥容器29aと、スライド移動によりこの開口を開閉するスライド蓋29bとを有する。乾燥容器29a内には、基板W群を回転可能に垂直姿勢で保持する回転保持部29cと、基板W群を昇降可能に保持する乾燥用プッシャー29dとが設けられている。また、乾燥容器29aの側壁には、窒素ガスやリンス液を供給するためのノズル29eが設けられている。さらに、乾燥容器29a内を減圧するための真空吸引源と、乾燥容器29aから排出される排液を処理する排液処理部とに連通している。   Please refer to FIG. The drying processing unit 29 is a spin dryer, and includes a drying container 29a having an opening formed at an upper part thereof that can transport the substrate W group, and a slide lid 29b that opens and closes the opening by sliding movement. In the drying container 29a, there are provided a rotation holding portion 29c that holds the substrate W group in a vertical posture so that the substrate W group can rotate, and a drying pusher 29d that holds the substrate W group in a vertically movable manner. Further, a nozzle 29e for supplying nitrogen gas and a rinsing liquid is provided on the side wall of the drying container 29a. Furthermore, it communicates with a vacuum suction source for depressurizing the inside of the drying container 29a and a drainage processing unit for processing the drainage discharged from the drying container 29a.

一括用搬送機構25との基板W群の受け渡しは、乾燥用プッシャー29dが上昇して、乾燥容器29aの上方において行う(図5において、一括用搬送機構25との間で基板W群を受け渡すときの乾燥用プッシャー29dを点線で示す)。さらに、乾燥用プッシャー29dは、乾燥容器29a内において、回転保持部29cとの間で基板W群の受け渡しを行う。なお、乾燥処理を施すときは、回転する回転保持部29c等と緩衝しないように、乾燥容器29aの底部まで下降する(図5において、一括用搬送機構25との間で基板W群を受け渡すときの乾燥用プッシャー29dを実線で示す)。   The transfer of the substrate W group to and from the collective transport mechanism 25 is performed above the drying container 29a when the drying pusher 29d is raised (in FIG. 5, the substrate W group is transferred to and from the collective transport mechanism 25). The drying pusher 29d is shown by a dotted line). Further, the drying pusher 29d transfers the substrate W group to and from the rotation holding unit 29c in the drying container 29a. When the drying process is performed, the substrate W is lowered to the bottom of the drying container 29a so as not to be buffered with the rotating rotation holding unit 29c and the like (in FIG. 5, the substrate W group is transferred to and from the collective transport mechanism 25). The drying pusher 29d is shown by a solid line).

図6を参照する。洗浄処理部31は、洗浄液を貯留する洗浄槽31aと、この洗浄槽31a底部に設けられ、洗浄液を供給する注入管31bと、洗浄槽31aの上部開口の周囲に設けられ、溢れ出た洗浄液を回収する外槽31cとを有している。また、基板W群を一括して洗浄槽31aに浸漬させるリフター35を有している。リフター35は、水平方向に延び出た複数本の保持棒35aを備えて、基板W群を垂直姿勢で一括して保持することができる。また、図示省略の駆動機構により昇降移動および水平移動可能である。   Please refer to FIG. The cleaning processing unit 31 is provided at the bottom of the cleaning tank 31a for storing the cleaning liquid, the injection pipe 31b for supplying the cleaning liquid, and the upper opening of the cleaning tank 31a. And an outer tank 31c to be recovered. Moreover, it has the lifter 35 which immerses the board | substrate W group collectively in the washing tank 31a. The lifter 35 includes a plurality of holding rods 35a extending in the horizontal direction, and can hold the substrate W group in a batch in a vertical posture. Further, it can be moved up and down and horizontally by a driving mechanism (not shown).

薬液処理部33は、洗浄処理部31と似た構成であるので図示は省略するが、薬液であるレジスト剥離液を貯留する薬液槽と、この薬液槽の底部に設けられてレジスト剥離液を供給する注入管と、処理液を回収する外槽とを有している。この薬液槽に基板W群を一括して浸漬させるため、上述したリフター35を用いる。すなわち、リフター35は洗浄処理部31と共用される。   Although the chemical solution processing unit 33 has a configuration similar to that of the cleaning processing unit 31, illustration thereof is omitted, but a chemical solution tank that stores a resist stripping solution that is a chemical solution and a resist stripping solution that is provided at the bottom of the chemical solution tank are supplied. And an outer tank for collecting the processing liquid. The above-described lifter 35 is used to immerse the substrate W group in the chemical bath together. That is, the lifter 35 is shared with the cleaning processing unit 31.

洗浄処理部31及び薬液処理部33と、一括用搬送機構25との基板W群の受け渡しは、図6(b)に示すようにリフター35が洗浄槽31aの上方まで上昇して行う。   The transfer of the substrate W group between the cleaning processing unit 31 and the chemical processing unit 33 and the collective transport mechanism 25 is performed with the lifter 35 ascending above the cleaning tank 31a as shown in FIG.

続いて個別処理領域3b内について説明する。個別処理領域3bには、隔壁7に沿って形成される個別用搬送路41と、この個別用搬送路41の片側に配置され、基板Wを水平姿勢で処理する個別処理部43と、この個別処理部43と搬送機構13との間で基板Wを1枚づつ搬送する個別用搬送機構45とを有する。   Next, the inside of the individual processing area 3b will be described. In the individual processing region 3b, an individual transport path 41 formed along the partition wall 7, an individual processing unit 43 disposed on one side of the individual transport path 41 and processing the substrate W in a horizontal posture, An individual transport mechanism 45 that transports the substrates W one by one between the processing unit 43 and the transport mechanism 13 is provided.

個別用搬送機構45は、螺子送り機構によって、個別用搬送路41上を水平(図1において「Y方向」)移動可能に構成される。また、その上端部には、「U」の字状の形状を有して、基板Wを1枚ずつ保持可能な個別用アーム45a1、45a2(以下、特に区別しないときは個別用アーム45aと総称する)を2個備える。また、2個の個別用アーム45aも、図示省略の駆動機構により旋回移動と昇降移動と水平方向の出退移動とを可能に構成される。そして、搬送路11に対向する位置まで個別用搬送路41上を移動して、搬送機構13と基板Wを1枚ずつ受け渡しする。 The individual transport mechanism 45 is configured to be movable horizontally (“Y direction” in FIG. 1) on the individual transport path 41 by a screw feed mechanism. Further, at the upper end portion thereof, there are individual arms 45a 1 and 45a 2 having an “U” shape and capable of holding the substrates W one by one (hereinafter, individual arms 45a unless otherwise distinguished). 2). In addition, the two individual arms 45a are also configured to be capable of turning, moving up and down, and moving in and out in the horizontal direction by a drive mechanism (not shown). And it moves on the conveyance path 41 for individual to the position which opposes the conveyance path 11, and delivers the conveyance mechanism 13 and the board | substrate W one sheet at a time.

本実施例では、個別処理部43は、複数個(例えば、4個)の洗浄乾燥処理部(枚葉処理部)51a、51b、51c、51d(以下、各洗浄乾燥処理部51a、51b、……を区別する必要がないときは、「洗浄乾燥処理部51」と総称する)を有する。各洗乾燥浄処理部51は、その搬入口がそれぞれ個別用搬送路41に対向するように配置される。   In this embodiment, the individual processing unit 43 includes a plurality of (for example, four) cleaning / drying processing units (single-wafer processing units) 51a, 51b, 51c, 51d (hereinafter, each cleaning / drying processing unit 51a, 51b,...). .. Are collectively referred to as “cleaning / drying processing unit 51”. Each washing / drying / cleaning processing unit 51 is arranged such that its carry-in entrance faces the individual conveyance path 41.

図7を参照する。洗浄乾燥処理部51は、基板Wを水平姿勢で保持する基板保持部51aと、基板保持部51aを回転駆動するモータ51bと、基板Wの上方に変位可能に配置され洗浄液を吐出するノズル51cと、基板Wの周囲を囲むように配置されて洗浄液の飛散を防止するカップ51dとを有する。また、基板Wの上方には図示省略の吹き出しユニットが設けられ、清浄な気体を基板面に流下させることができる。   Please refer to FIG. The cleaning / drying processing unit 51 includes a substrate holding unit 51a that holds the substrate W in a horizontal position, a motor 51b that rotationally drives the substrate holding unit 51a, and a nozzle 51c that is displaceably disposed above the substrate W and that discharges cleaning liquid. And a cup 51d which is arranged so as to surround the periphery of the substrate W and prevents the cleaning liquid from scattering. Further, a blowing unit (not shown) is provided above the substrate W, and clean gas can flow down to the substrate surface.

個別用搬送機構45は、各洗浄乾燥処理部51に対向する位置まで水平移動し、2個の個別用アーム45aを適宜移動させて、各洗浄乾燥処理部51に対しても基板を搬送する。   The individual transport mechanism 45 moves horizontally to a position facing each cleaning / drying processing unit 51, and appropriately moves the two individual arms 45 a to transport the substrate also to each cleaning / drying processing unit 51.

上記のように構成される基板処理装置には、さらに所定の基板の処理条件に基づいて基板W(または基板W群)の搬送を制御する制御部(図示省略)を備えている。制御部は、搬送機構13、第1姿勢変換部21、第1プッシャー23、一括用搬送機構25、個別用搬送機構45等(以下では、これら基板を搬送するものを「搬送系」と総称する)を操作対象とする。制御部は、基板処理のための各種演算処理を実行する中央演算処理装置(CPU)や、所定の基板の処理条件や基板処理に必要な各種情報を記憶する記憶媒体等により構成される。   The substrate processing apparatus configured as described above further includes a control unit (not shown) that controls the transfer of the substrate W (or the substrate W group) based on a predetermined substrate processing condition. The control unit includes a transport mechanism 13, a first attitude conversion unit 21, a first pusher 23, a collective transport mechanism 25, an individual transport mechanism 45, and the like (hereinafter, those that transport these substrates are collectively referred to as a “transport system”. ) Is the operation target. The control unit includes a central processing unit (CPU) that executes various arithmetic processes for substrate processing, a storage medium that stores processing conditions for a predetermined substrate and various information necessary for the substrate processing, and the like.

以上のように構成された基板処理装置の動作例を、図8を参照して説明する。   An example of the operation of the substrate processing apparatus configured as described above will be described with reference to FIG.

<ステップS1> 基板WをカセットCから一括処理部27に搬入する
未処理の基板Wを水平姿勢で多段に収納したカセットCがカセット載置部1に載置されると、搬送機構13がカセットCに前進移動して、カセットC内の基板Wを1枚ずつ取り出す。
<Step S1> Loading the substrate W from the cassette C into the batch processing unit 27 When the cassette C storing the unprocessed substrates W in multiple stages in a horizontal posture is mounted on the cassette mounting unit 1, the transport mechanism 13 is moved to the cassette. Moving forward to C, the substrates W in the cassette C are taken out one by one.

搬送機構13は、旋回移動等を行い、一括処理領域3a内の第1姿勢変換部21に対向する位置に移動する。このとき、第1姿勢変換部21の支持台21aは水平姿勢にある。搬送機構13が水平姿勢の基板Wを1枚ずつ第1姿勢変換部21に渡す。   The transport mechanism 13 performs a turning movement or the like, and moves to a position facing the first posture conversion unit 21 in the collective processing region 3a. At this time, the support base 21a of the first posture conversion unit 21 is in a horizontal posture. The transport mechanism 13 passes the substrates W in a horizontal posture to the first posture conversion unit 21 one by one.

この動作を繰り返して、第1姿勢変換部21に25枚の基板Wが挿入されると、第1姿勢変換部21の支持台21aが軸P周りに回動し、垂直姿勢をとる。この動作に伴い、保持具21bに保持された25枚の基板W(以下の動作説明において、単に「基板W群」という)も一体に回転し、水平姿勢から垂直姿勢に変換される。   When this operation is repeated and 25 substrates W are inserted into the first posture changing unit 21, the support 21a of the first posture changing unit 21 rotates around the axis P and takes a vertical posture. Along with this operation, the 25 substrates W held in the holder 21b (in the following description of operation, simply referred to as “substrate W group”) also rotate together, and are converted from a horizontal posture to a vertical posture.

第1プッシャー23が第1姿勢変換部21の下方から上昇移動し、第1姿勢変換部21から基板W群を一括して受け取る。そして、水平移動と旋回移動を行って、一括用搬送機構25との受け渡し位置まで移動する。このとき、第1プッシャー23の上方には一括用搬送機構25が待機しており、その狭持機構25aは「開」状態になっている。   The first pusher 23 moves upward from below the first posture converting unit 21 and receives the substrate W group from the first posture converting unit 21 at a time. Then, horizontal movement and swivel movement are performed to move to the delivery position with the collective transport mechanism 25. At this time, the collective transport mechanism 25 is waiting above the first pusher 23, and the holding mechanism 25a is in the “open” state.

第1プッシャー23が受け渡し位置まで上昇移動すると、狭持機構25aを閉じて、基板W群を一括して当接支持する。続いて第1プッシャー23が下降することで、一括用搬送機構25は基板W群を一括して受け取る。   When the first pusher 23 moves upward to the delivery position, the holding mechanism 25a is closed to collectively abut and support the substrate W group. Subsequently, when the first pusher 23 is lowered, the collective transport mechanism 25 receives the substrate W group at a time.

基板W群を保持する一括用搬送機構25は、リフター35が待機する薬液処理部33の上方まで水平移動する。   The collective transport mechanism 25 that holds the substrate W group moves horizontally above the chemical solution processing unit 33 on which the lifter 35 stands by.

リフター35が上昇し、基板W群をその保持棒35aに当接支持する。その後、狭持機構25aが開くと、リフター35が下降し、一括用搬送機構25から基板W群を一括して受け取る。   The lifter 35 rises and abuts and supports the substrate W group on the holding rod 35a. Thereafter, when the holding mechanism 25a is opened, the lifter 35 is lowered, and the substrate W group is collectively received from the collective transport mechanism 25.

なお、制御部は、搬送機構13等の搬送系を操作して、上述のような基板Wの搬送を制御する。   Note that the control unit operates the transport system such as the transport mechanism 13 to control the transport of the substrate W as described above.

<ステップS2> 基板W群に対して一括してレジスト剥離処理を施す
リフター35は、基板W群を保持したまま、レジスト剥離液が貯留された薬液槽内まで下降し、基板W群を一括して浸漬してレジスト剥離処理を施す。
<Step S2> Performing the resist stripping process on the substrate W group collectively The lifter 35 descends into the chemical bath in which the resist stripping solution is stored while holding the substrate W group, and collects the substrate W group all together. Soak and resist stripping treatment.

所定のレジスト剥離処理が終了すると、リフター35が上昇して基板W群をレジスト剥離液から引き上げる。続いて、リフター35が洗浄槽31aまで水平移動して下降し、基板W群を一括して洗浄槽31a内に浸漬し、洗浄処理を施す。   When the predetermined resist stripping process is completed, the lifter 35 is lifted to lift the substrate W group from the resist stripping solution. Subsequently, the lifter 35 moves horizontally to the cleaning tank 31a and descends, and the substrate W group is collectively immersed in the cleaning tank 31a to perform a cleaning process.

洗浄処理が終了すると、リフター35が上昇し基板W群を一括して洗浄液から引き上げる。このとき、洗浄処理部31の上方に一括用搬送機構25が、狭持機構25aを開いた状態で待機している。   When the cleaning process is completed, the lifter 35 is raised and the substrate W group is pulled up from the cleaning liquid all at once. At this time, the batch transport mechanism 25 is waiting above the cleaning processing unit 31 with the holding mechanism 25a opened.

リフター35が一括用搬送機構25の位置まで上昇すると、狭持機構25aが閉じて、基板W群を一括して当接支持する。ふたたび、リフター35が下降することで、一括用搬送機構25が基板W群を一括して受け取る。   When the lifter 35 is raised to the position of the collective transport mechanism 25, the holding mechanism 25a is closed, and the substrate W group is collectively abutted and supported. When the lifter 35 is lowered again, the collective transport mechanism 25 receives the group of substrates W in a batch.

一括用搬送機構25は、乾燥処理部29の上方まで水平移動する。乾燥処理部29のスライド蓋29bがスライド移動し、乾燥容器29a内から乾燥用プッシャー29dが上昇する。乾燥用プッシャー29dが基板W群を一括して保持すると、一括用搬送機構25の狭持機構25aが開く。再び、乾燥用プッシャー29dが下降して、回転保持部29cに、基板W群を渡す。乾燥用プッシャー29dが乾燥容器29aまで退避するとともに、スライド蓋29bがスライド移動して乾燥容器29aの開口を塞ぐ。その後、基板W群を垂直姿勢で回転させつつ所定の乾燥処理を施す。   The collective transport mechanism 25 moves horizontally to above the drying processing unit 29. The slide lid 29b of the drying processing unit 29 slides and the drying pusher 29d moves up from the drying container 29a. When the drying pusher 29d collectively holds the substrate W group, the holding mechanism 25a of the batch transport mechanism 25 is opened. The drying pusher 29d is lowered again, and the substrate W group is transferred to the rotation holding unit 29c. The drying pusher 29d retracts to the drying container 29a, and the slide lid 29b slides to close the opening of the drying container 29a. Thereafter, a predetermined drying process is performed while rotating the substrate W group in a vertical posture.

乾燥処理が終了すると、スライド蓋29bが開けられる。そして、乾燥用プッシャー29dが回転保持部29cから基板W群を一括して受け取ると、そのまま上昇して一括用搬送機構25に渡す。   When the drying process is completed, the slide lid 29b is opened. When the drying pusher 29d receives the substrate W group from the rotation holding unit 29c at once, the drying pusher 29d rises as it is and transfers it to the collective transport mechanism 25.

<ステップS3> 基板Wを一括処理部27から個別処理部43に搬送する
一括用搬送機構25は基板W群を保持して待機位置まで移動する。そして、基板W群は、一括用搬送機構25から第1プッシャー23に渡され、第1プッシャー23から第1姿勢変換部21に渡される。この第1姿勢変換部21において、基板W群の姿勢は一括して垂直姿勢から水平姿勢に変換される。搬送機構13は、第1姿勢変換部21に対向する位置で出退移動を行い、第1姿勢変換部21から基板Wを1枚ずつ搬出する。基板Wをその保持アーム13aに保持して個別処理領域3bまで水平移動し、個別用搬送機構45に基板Wを1枚ずつ渡す。ふたたび、第1姿勢変換部21に対向する位置まで戻って、同様に基板Wの搬送動作を繰り返す。
<Step S3> The substrate W is transported from the batch processing unit 27 to the individual processing unit 43. The batch transport mechanism 25 holds the substrate W group and moves to the standby position. Then, the substrate W group is transferred from the batch transport mechanism 25 to the first pusher 23, and is transferred from the first pusher 23 to the first posture converting unit 21. In the first posture conversion unit 21, the postures of the substrate W group are collectively converted from a vertical posture to a horizontal posture. The transport mechanism 13 moves in and out at a position facing the first posture conversion unit 21 and unloads the substrates W one by one from the first posture conversion unit 21. The substrate W is held by the holding arm 13a and horizontally moved to the individual processing region 3b, and the substrates W are transferred to the individual transport mechanism 45 one by one. Again, the position returns to the position facing the first posture changing unit 21 and the substrate W transfer operation is repeated in the same manner.

個別用搬送機構45は、基板Wを受け取るごとに所定の洗浄乾燥処理部51と対向する位置まで水平移動して、受け取った基板Wを洗浄乾燥処理部51内に搬入し、基板保持部51a上に載置する。すると、個別用搬送機構45も、ふたたび、搬送機構13と対向する位置まで戻って同様の基板Wの搬送動作を繰り返し、その他の洗浄乾燥処理部51内に搬入していく。   Each time the individual transport mechanism 45 receives the substrate W, the individual transport mechanism 45 moves horizontally to a position facing the predetermined cleaning / drying processing unit 51, and carries the received substrate W into the cleaning / drying processing unit 51. Placed on. Then, the individual transport mechanism 45 again returns to the position facing the transport mechanism 13, repeats the same transport operation of the substrate W, and carries it into the other cleaning / drying processing section 51.

なお、制御部は、搬送機構13等の搬送系を操作して、ステップS3で示したような基板Wの搬送を制御する。   Note that the control unit operates the transport system such as the transport mechanism 13 to control the transport of the substrate W as shown in step S3.

<ステップS4> 基板Wに対して1枚ずつ洗浄乾燥処理を施す
モータ51bにより基板Wを回転させつつ、ノズル51cから洗浄液を基板Wに吐出して、所定の洗浄処理を施す。洗浄処理が終了すると、基板Wをさらに高速回転させつつ、図示省略の吹出ユニットから清浄な気体を基板Wに流下させて、基板W表面の水分を振り切って乾燥させる振切乾燥処理を施す。本実施例では、個別処理部43は4個の洗浄乾燥処理部51を有しているので、4枚の基板を並行して洗浄・乾燥処理することができる。
<Step S <b>4> Performing a cleaning and drying process one by one on the substrate W While rotating the substrate W by the motor 51 b, the cleaning liquid is discharged from the nozzle 51 c onto the substrate W to perform a predetermined cleaning process. When the cleaning process is completed, while the substrate W is rotated at a higher speed, a clean gas is caused to flow down from the blow-out unit (not shown) to the substrate W, and the moisture on the surface of the substrate W is shaken off and dried. In the present embodiment, the individual processing unit 43 includes four cleaning / drying processing units 51, so that four substrates can be cleaned and dried in parallel.

<ステップS5> 基板Wを個別処理部43からカセットCに搬送する
一連の洗浄・乾燥処理が終了すると、搬入時とは逆の手順で、洗浄乾燥処理部51内から個別用搬送機構45に取り出され、個別用搬送機構45から搬送機構13に渡され、搬送機構13によってカセットC内に搬入する。
<Step S5> Transporting the substrate W from the individual processing unit 43 to the cassette C When a series of cleaning / drying processing is completed, the substrate W is taken out from the cleaning / drying processing unit 51 to the individual transporting mechanism 45 in the reverse procedure of loading. Then, it is transferred from the individual transport mechanism 45 to the transport mechanism 13 and carried into the cassette C by the transport mechanism 13.

なお、制御部は、搬送機構13等の搬送系を操作して、ステップS5で示したような基板Wの搬送を制御する。   The control unit operates the transport system such as the transport mechanism 13 to control the transport of the substrate W as shown in step S5.

このように、実施例1に係る基板処理装置によれば、一括処理部27と個別処理部43とを有し、制御部が搬送機構13等の搬送系を操作することで、一括処理部27または個別処理部43のいずれかに選択的に基板Wを搬送することができる。よって、基板Wに施す処理は、一括処理部27または個別処理部43のいずれにおいても行うことができる。   As described above, the substrate processing apparatus according to the first embodiment includes the batch processing unit 27 and the individual processing unit 43, and the batch processing unit 27 is operated by the control unit operating the transport system such as the transport mechanism 13. Alternatively, the substrate W can be selectively transferred to any one of the individual processing units 43. Therefore, the processing applied to the substrate W can be performed in either the batch processing unit 27 or the individual processing unit 43.

また、一括処理部27を一括処理領域3aに集合して配置し、個別処理部43を個別処理領域3bに集合して配置する。また、いずれの領域も搬送機構13に対面するように形成される。よって、フットプリントを抑えつつ、基板搬送の効率を向上させることができる。   Also, the collective processing unit 27 is assembled and arranged in the collective processing region 3a, and the individual processing unit 43 is arranged and arranged in the individual processing region 3b. Further, any region is formed so as to face the transport mechanism 13. Therefore, the efficiency of substrate conveyance can be improved while suppressing the footprint.

また、一括処理領域3aと個別処理領域3bとの間に隔壁7を設けて、一括処理領域3a内または個別処理領域3b内の雰囲気が隔壁7によって互いに分断されて、他方の領域に雰囲気が拡散することを防止することができる。よって、各領域3a、3bにおいて基板Wを好適に処理することができる。   In addition, a partition wall 7 is provided between the batch processing region 3a and the individual processing region 3b, and the atmosphere in the batch processing region 3a or the individual processing region 3b is separated from each other by the partition wall 7, and the atmosphere diffuses in the other region. Can be prevented. Therefore, the substrate W can be suitably processed in each of the regions 3a and 3b.

また、搬送機構13と一括処理部27との間で基板Wを搬送する過程で、第1姿勢変換部21が基板W群を一括して姿勢変換する。これにより、基板W群を垂直姿勢で処理する一括処理部27に対して、水平姿勢で収容/処理するカセットCまたは個別処理部43から好適に基板Wを搬送することができる。   Further, in the process of transporting the substrate W between the transport mechanism 13 and the collective processing unit 27, the first posture converting unit 21 collectively changes the posture of the substrate W group. Accordingly, the substrate W can be suitably transported from the cassette C or the individual processing unit 43 that accommodates / processes the substrate W group in the horizontal posture with respect to the batch processing unit 27 that processes the substrate W group in the vertical posture.

また、一括処理部27に対して基板W群を一括して搬入・搬出する一括用搬送機構25を備え、第1プッシャー23を介して第1姿勢変換部21との間で基板W群を一括して受け渡す。これにより、一括処理部27に対する搬送効率をさらに向上させることができる。   The batch processing unit 27 is provided with a batch transport mechanism 25 for batch loading / unloading of the substrate W group, and the substrate W group is batched with the first posture changing unit 21 via the first pusher 23. And hand it over. Thereby, the conveyance efficiency with respect to the batch processing unit 27 can be further improved.

同様に、個別処理部43に対して基板Wを1枚ずつ搬入・搬出する個別用搬送機構45を備え、搬送機構13との間で基板Wを1枚ずつ受け渡す。これにより、個別処理部43に対する搬送効率もさらに向上させることができる。   Similarly, an individual transport mechanism 45 for loading / unloading the substrates W one by one to / from the individual processing unit 43 is provided, and the substrates W are transferred to and from the transport mechanism 13 one by one. Thereby, the conveyance efficiency with respect to the individual process part 43 can further be improved.

さらに、ステップS1、ステップS3、ステップS5で説明したように、制御部が、カセットCから未処理の基板Wを取り出して一括処理部27に搬入し、一括処理部27で処理が施された基板Wを一括処理部27から個別処理部43に搬送し、かつ、個別処理部43で処理が施された基板Wを個別処理部43からカセットCに搬送するように搬送系を操作する。これにより、一括処理部27においてレジストを除去する処理を基板W群に対して行った後に、個別処理部43において基板Wを洗浄することができる。したがって、基板Wからレジストを除去するとともに、基板Wを精度よく洗浄して仕上げることができる。   Further, as described in step S1, step S3, and step S5, the control unit takes out the unprocessed substrate W from the cassette C, carries it into the batch processing unit 27, and has been processed by the batch processing unit 27. The transport system is operated so that W is transported from the batch processing unit 27 to the individual processing unit 43 and the substrate W processed by the individual processing unit 43 is transported from the individual processing unit 43 to the cassette C. Accordingly, the substrate W can be cleaned in the individual processing unit 43 after the batch processing unit 27 performs the process of removing the resist on the substrate W group. Therefore, the resist can be removed from the substrate W, and the substrate W can be accurately cleaned and finished.

また、個別処理部43は洗浄乾燥処理部51を複数個有することで、複数枚の基板Wに対して並行して処理を施すことができる。よって、個別処理部43の処理能力を向上させ、基板処理装置のスループットを向上させることができる。   In addition, the individual processing unit 43 includes a plurality of cleaning / drying processing units 51, so that a plurality of substrates W can be processed in parallel. Therefore, the processing capability of the individual processing unit 43 can be improved, and the throughput of the substrate processing apparatus can be improved.

また、一括処理部27は、種類の異なる複数個の処理部(乾燥処理部29と洗浄処理部31と薬液処理部33)を有することで、基板W群に対して乾燥処理を施しているときに、他の基板W群に対して薬液処理や洗浄処理を施すことができる。よって、基板処理装置のスループットをさらに向上させることができる。   The batch processing unit 27 includes a plurality of different types of processing units (the drying processing unit 29, the cleaning processing unit 31, and the chemical processing unit 33), so that the substrate W group is subjected to a drying process. In addition, a chemical solution process or a cleaning process can be performed on another substrate W group. Therefore, the throughput of the substrate processing apparatus can be further improved.

次に、この発明の実施例2を説明する。
図9は、実施例2に係る基板処理装置の概略構成を示した平面図である。なお、実施例1と同じ構成については同符号をふすことで詳細な説明を省略する。
Next, Embodiment 2 of the present invention will be described.
FIG. 9 is a plan view illustrating a schematic configuration of the substrate processing apparatus according to the second embodiment. In addition, about the same structure as Example 1, detailed description is abbreviate | omitted by giving the same code | symbol.

実施例2に係る基板処理装置は、カセット載置部1と、基板処理領域3と、搬送領域5と、副搬送領域9とに分けられる。副搬送領域9は、基板処理領域3を挟んで、搬送領域5と反対側に設けられる。   The substrate processing apparatus according to the second embodiment is divided into a cassette placing unit 1, a substrate processing region 3, a transport region 5, and a sub transport region 9. The sub-transport area 9 is provided on the opposite side of the transport area 5 with the substrate processing area 3 interposed therebetween.

副搬送領域9内には、個別用搬送機構45との間で基板の受け渡しをするとともに、水平姿勢と垂直姿勢との間で基板W群の姿勢を一括して変換する第2姿勢変換部61と、第2姿勢変換部61と、一対の狭持機構26aを備える一括用搬送機構26との間で基板W群の受け渡しを行う第2プッシャー63とを有する。   In the sub-transport area 9, the substrate is transferred to and from the individual transport mechanism 45, and the second posture conversion unit 61 that collectively converts the posture of the substrate W group between the horizontal posture and the vertical posture. And a second pusher 63 that transfers the group of substrates W between the second posture converting unit 61 and the collective transport mechanism 26 including the pair of holding mechanisms 26a.

第2姿勢変換部61は、第1姿勢変換部21と同様に、支持台と複数個の保持具(図示省略)を備えている。さらに、第2姿勢変換部61の支持台が水平姿勢の状態において、個別用搬送機構45と基板Wの受け渡しをするために、鉛直軸芯周りに旋回移動して個別用搬送路41に対面できるように構成されている。   Similar to the first posture conversion unit 21, the second posture conversion unit 61 includes a support base and a plurality of holders (not shown). Further, in the state where the support stand of the second posture changing unit 61 is in the horizontal posture, it can turn around the vertical axis to face the individual conveyance path 41 in order to transfer the individual conveyance mechanism 45 and the substrate W. It is configured as follows.

第2プッシャー63は、第2姿勢変換部61の傍らに配置され、図示省略の駆動機構により水平(図9において「X方向」)移動可能に構成される。   The second pusher 63 is arranged beside the second posture changing unit 61 and is configured to be movable horizontally (“X direction” in FIG. 9) by a driving mechanism (not shown).

また、実施例2における一括用搬送機構26は、第2プッシャー63と基板W群の受け渡しを行うため、副搬送領域9まで水平(図9において「Y方向」)移動可能に構成される。   Further, the collective transport mechanism 26 according to the second embodiment is configured to be movable horizontally (“Y direction” in FIG. 9) to the sub transport region 9 in order to transfer the second pusher 63 and the substrate W group.

実施例2における制御部はさらに、第2姿勢変換部61、第2プッシャー63、一括用搬送機構26を含めた搬送系を操作する。   The control unit according to the second embodiment further operates a conveyance system including the second posture conversion unit 61, the second pusher 63, and the collective conveyance mechanism 26.

以上のように構成された実施例2に係る基板処理装置の動作例を、図8を参照して説明する。なお、ステップ3以外は、一括用搬送機構25を一括用搬送機構26と読み替えるほかは異なるところがないので、以下ではステップS3のみを説明する。   An operation example of the substrate processing apparatus according to the second embodiment configured as described above will be described with reference to FIG. Since there is no difference except that the collective transport mechanism 25 is replaced with the collective transport mechanism 26 except for step 3, only step S3 will be described below.

<ステップS3> 基板Wを一括処理部27から個別処理部43に搬送する
一括用搬送機構26は基板W群を保持して副搬送領域9まで移動する。第2プッシャー63は、一括用搬送機構26の下方から上昇して基板W群を当接支持すると、一括用搬送機構26が備える狭持機構が開き、再び第2プッシャー63が下降する。これによって、基板W群は一括して第2プッシャー63に渡される。
<Step S <b>3> The substrate W is transported from the batch processing unit 27 to the individual processing unit 43. The batch transport mechanism 26 holds the substrate W group and moves to the sub-transport region 9. When the second pusher 63 rises from below the collective transport mechanism 26 and abuts and supports the group of substrates W, the holding mechanism included in the collective transport mechanism 26 opens, and the second pusher 63 descends again. As a result, the substrate W group is collectively transferred to the second pusher 63.

第2プッシャー63は、垂直姿勢で待機する第2姿勢変換部61の上方まで移動する。続いて、第2プッシャー63が下降することで、第2姿勢変換部61に基板W群が一括して渡される。   The second pusher 63 moves to above the second posture conversion unit 61 that stands by in a vertical posture. Subsequently, when the second pusher 63 is lowered, the substrate W group is collectively delivered to the second posture conversion unit 61.

第2姿勢変換部61は、基板W群を保持したまま回動し、水平姿勢をとる。そして、個別用搬送路41に対面する方向に旋回移動する。   The second attitude conversion unit 61 rotates while holding the substrate W group and takes a horizontal attitude. Then, it turns in the direction facing the individual conveyance path 41.

個別用搬送機構45は、第2姿勢変換部61に対向する位置で出退移動を行い、第2姿勢変換部61から基板Wを1枚ずつ搬出する。基板Wをその個別用アーム45aに保持すると、そのたびに所定の洗浄乾燥処理部51と対向する位置まで水平移動して、基板Wを洗浄乾燥処理部51内に搬入し、基板保持部51a上に載置する。そして、ふたたび、第2姿勢変換部61と対向する位置まで戻って同様の基板Wの搬送動作を繰り返し、その他の洗浄乾燥処理部51内に搬入していく。   The individual transport mechanism 45 moves in and out at a position facing the second posture converting unit 61, and unloads the substrates W one by one from the second posture converting unit 61. When the substrate W is held on the individual arm 45a, the substrate W is moved horizontally to a position facing the predetermined cleaning / drying processing unit 51 each time, and the substrate W is carried into the cleaning / drying processing unit 51, and then on the substrate holding unit 51a. Placed on. Then, it returns to the position facing the second posture changing unit 61 and repeats the same substrate W transfer operation, and carries it into the other cleaning / drying processing unit 51.

なお、制御部は、第2姿勢変換部61等の搬送系を操作して、ステップS3で示したような基板Wの搬送を制御する。   Note that the control unit operates the transport system such as the second attitude conversion unit 61 to control the transport of the substrate W as shown in step S3.

このように、実施例2に係る基板処理装置によれば、個別用搬送機構45と一括用搬送機構26との間で基板Wを搬送する過程で、第2姿勢変換部61が基板W群を一括して姿勢変換する。これにより、基板Wを垂直姿勢で処理する一括処理部27と水平姿勢で処理する個別処理部43との間で、基板Wを好適に搬送することができる。   As described above, according to the substrate processing apparatus according to the second embodiment, in the process of transporting the substrate W between the individual transport mechanism 45 and the collective transport mechanism 26, the second attitude conversion unit 61 changes the substrate W group. Change posture at once. Accordingly, the substrate W can be suitably transported between the batch processing unit 27 that processes the substrate W in a vertical posture and the individual processing unit 43 that processes the substrate W in a horizontal posture.

また、この第2姿勢変換部61と搬送機構13とは緩衝することがないので、制御部はそれぞれを互いに独立して操作することができる。また、第2姿勢変換部61は、一括処理領域3a及び個別処理領域3bに対面する副搬送領域9内に配置されるので、容易に基板を搬送させることができる。   Moreover, since this 2nd attitude | position conversion part 61 and the conveyance mechanism 13 do not buffer, the control part can operate each independently. Moreover, since the 2nd attitude | position conversion part 61 is arrange | positioned in the sub conveyance area | region 9 which faces the batch processing area | region 3a and the separate process area | region 3b, it can convey a board | substrate easily.

この発明は、上記実施形態に限られることはなく、下記のように変形実施することができる。   The present invention is not limited to the above-described embodiment, and can be modified as follows.

(1)上述した各実施例では、一括処理部27ではレジスト剥離処理を行い、個別処理部43では洗浄・乾燥処理を行うように構成したが、これに限らず、基板Wに施す処理の内容に応じて各処理部27、43は適宜に設計変更してよい。   (1) In each of the above-described embodiments, the batch processing unit 27 performs the resist stripping process, and the individual processing unit 43 performs the cleaning / drying process. Depending on the design, the processing units 27 and 43 may be appropriately modified.

(2)上述した各実施例では、搬送機構13は、基板Wを1枚ずつ保持する保持アーム13aを2本備えるものであったが、保持アームを多段に設けて、カセットCに対して基板W群を一括して搬送するように構成してもよい。   (2) In each of the embodiments described above, the transport mechanism 13 includes the two holding arms 13a that hold the substrates W one by one. However, the holding arms are provided in multiple stages, and the substrate is relative to the cassette C. You may comprise so that W group may be conveyed collectively.

(3)上述した各実施例では、一括処理部27、個別処理部43は、それぞれ複数個の処理部を有するものであったが、単一の処理部を備えるものであってもよい。   (3) In each of the above-described embodiments, the batch processing unit 27 and the individual processing unit 43 each have a plurality of processing units, but may include a single processing unit.

(4)上述した各実施例では、基板Wの処理条件に基づいて、基板Wを一括処理部27で処理した後、個別処理部43にて処理を施すように制御部が制御しているが、基板Wの処理条件に応じて適宜に変更されるものである。たとえば、先に個別処理部43に基板Wを搬送し、その後に一括処理部27へ搬送するようにしてもよい。また、一括処理部27と個別処理部43のうちいずれか一方のみに基板を搬送するようにしてもよい。   (4) In each of the above-described embodiments, the control unit controls the substrate W to be processed by the individual processing unit 43 after processing the substrate W by the batch processing unit 27 based on the processing conditions of the substrate W. These are appropriately changed according to the processing conditions of the substrate W. For example, the substrate W may be first transported to the individual processing unit 43 and then transported to the batch processing unit 27. Further, the substrate may be transferred to only one of the batch processing unit 27 and the individual processing unit 43.

(5)上述した各実施例では、カセットCをカセット載置部1に載置するものであったが、基板Wを密閉可能なポッドを利用してもよい。   (5) In each of the above-described embodiments, the cassette C is placed on the cassette placing portion 1, but a pod capable of sealing the substrate W may be used.

(6)上述した各実施例では、乾燥処理部29としてスピンドライヤーを用いたが、処理槽に貯留された純水から基板Wを引き上げてIPA(イソプロピルアルコール)及び窒素ガスを供給して基板Wに対する乾燥処理を行う装置であってもよい。   (6) In each of the above-described embodiments, a spin dryer is used as the drying processing unit 29. However, the substrate W is pulled up from the pure water stored in the processing tank, and IPA (isopropyl alcohol) and nitrogen gas are supplied to the substrate W. The apparatus which performs the drying process with respect to may be sufficient.

実施例1に係る基板処理装置の概略構成を示した平面図である。1 is a plan view showing a schematic configuration of a substrate processing apparatus according to Embodiment 1. FIG. (a)は、支持台が水平姿勢であるときの第1姿勢変換部の平面図(上段)と側面図(下段)であり、(b)は支持台が垂直姿勢であるときの第1姿勢変換部の平面図(上段)と側面図(下段)である。(A) is the top view (upper stage) and side view (lower stage) of a 1st attitude | position conversion part when a support stand is a horizontal attitude | position, (b) is the 1st attitude | position when a support stand is a vertical attitude | position. It is the top view (upper stage) and side view (lower stage) of a conversion part. 第1プッシャーと第1姿勢変換部との正面図であり、(a)、(b)は基板の受け渡しの様子を示す正面図である。It is a front view of a 1st pusher and a 1st attitude | position conversion part, (a), (b) is a front view which shows the mode of the delivery of a board | substrate. 第1プッシャーと一括用搬送機構との基板群の受け渡しの様子を示す正面図である。It is a front view which shows the mode of delivery of the board | substrate group with a 1st pusher and a batch conveyance mechanism. 乾燥処理部の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of a drying process part. (a)は洗浄処理部の概略図であり、(b)はリフターと一括用搬送機構との基板群の受け渡しの様子を示す概略図である。(A) is the schematic of a washing process part, (b) is the schematic which shows the mode of delivery of the board | substrate group with a lifter and the conveyance mechanism for package. 洗浄乾燥処理部の概略図である。It is the schematic of a washing-drying process part. 基板処理装置の動作の一例を示すフローチャートである。It is a flowchart which shows an example of operation | movement of a substrate processing apparatus. 実施例2に係る基板処理装置の概略構成を示した平面図である。6 is a plan view illustrating a schematic configuration of a substrate processing apparatus according to Embodiment 2. FIG.

符号の説明Explanation of symbols

1 …カセット載置部
3a …一括処理領域(第1処理部)
3b …個別処理領域(第2処理部)
7 …隔壁
11 …搬送路
13 …搬送機構
21 …第1姿勢変換部
25 …一括用搬送機構
27 …一括処理部
29 …乾燥処理部
31 …洗浄処理部
33 …薬液処理部
43 …個別処理部
45 …個別用搬送機構
51 …洗浄乾燥処理部(枚葉処理部)
61 …第2姿勢変換部
W …基板
C …カセット

DESCRIPTION OF SYMBOLS 1 ... Cassette mounting part 3a ... Batch processing area (1st processing part)
3b ... Individual processing area (second processing unit)
DESCRIPTION OF SYMBOLS 7 ... Bulkhead 11 ... Conveyance path 13 ... Conveyance mechanism 21 ... 1st attitude | position conversion part 25 ... Collective conveyance mechanism 27 ... Collective processing part 29 ... Drying processing part 31 ... Cleaning process part 33 ... Chemical solution processing part 43 ... Individual processing part 45 ... Individual transport mechanism 51 ... Washing and drying processing section (single wafer processing section)
61 ... 2nd attitude | position conversion part W ... Board | substrate C ... Cassette

Claims (8)

基板に処理を行う基板処理装置において、
複数枚の基板を収納する収納器を載置する載置部と、
複数枚の基板を一括して処理する第1処理部及び基板を1枚ずつ処理する第2処理部を有する基板処理部と、
前記載置部と前記第1処理部と前記第2処理部との間で基板を搬送する搬送機構と、
基板の処理条件に基づいて、前記載置部と前記第1処理部と前記第2処理部との間における前記搬送機構の搬送動作を制御する制御部と、
を備えることを特徴とする基板処理装置。
In a substrate processing apparatus for processing a substrate,
A mounting section for mounting a container for storing a plurality of substrates;
A substrate processing unit having a first processing unit that processes a plurality of substrates at once and a second processing unit that processes the substrates one by one;
A transport mechanism for transporting a substrate between the placing section, the first processing section, and the second processing section;
Based on the processing conditions of the substrate, a control unit that controls the transport operation of the transport mechanism between the placement unit, the first processing unit, and the second processing unit;
A substrate processing apparatus comprising:
請求項1に記載の基板処理装置において、
前記基板処理部は2つの領域に区分され、前記第1処理部と前記第2処理部とを対向させて一方の領域に第1処理部を配置し、他方の領域に第2処理部を配置させることを特徴とする基板処理装置。
The substrate processing apparatus according to claim 1,
The substrate processing unit is divided into two regions, the first processing unit and the second processing unit are opposed to each other, the first processing unit is disposed in one region, and the second processing unit is disposed in the other region. A substrate processing apparatus.
請求項2に記載の基板処理装置において、
前記2つの領域の間に隔壁をさらに備えることを特徴とする基板処理装置。
The substrate processing apparatus according to claim 2,
A substrate processing apparatus, further comprising a partition wall between the two regions.
請求項1から請求項3のいずれかに記載の基板処理装置において、
前記第1処理部は、垂直姿勢である複数枚の基板に対して処理液による処理を行う処理液処理部と、前記処理液処理部で処理された垂直姿勢である複数枚の基板を乾燥する乾燥処理部と、前記搬送機構との間で基板の受け渡しが可能であり、複数枚の基板について水平姿勢と垂直姿勢との間で一括して姿勢の変換を行う姿勢変換機構と、前記姿勢変換機構との間で複数枚の基板の受け渡しが可能であり、前記処理液処理部と前記乾燥処理部との間で基板の搬送を行う第1処理部用搬送機構とを備えることを特徴とする基板処理装置。
In the substrate processing apparatus in any one of Claims 1-3,
The first processing unit dries a processing liquid processing unit that performs processing with a processing liquid on a plurality of substrates in a vertical posture and a plurality of substrates in a vertical posture processed by the processing liquid processing unit. A posture conversion mechanism capable of transferring a substrate between a drying processing unit and the transport mechanism, and performing posture conversion between a horizontal posture and a vertical posture with respect to a plurality of substrates, and the posture conversion A plurality of substrates can be transferred to and from the mechanism, and includes a first processing unit transport mechanism that transports the substrate between the processing liquid processing unit and the drying processing unit. Substrate processing equipment.
請求項1から請求項4のいずれかに記載の基板処理装置において、
前記第2処理部は、基板を1枚ずつ処理する枚葉処理部と、前記搬送機構と前記枚葉処理部との間で基板の搬送を行う第2処理部用搬送機構とを備えることを特徴とする基板処理装置。
In the substrate processing apparatus in any one of Claims 1-4,
The second processing unit includes a single wafer processing unit that processes the substrates one by one, and a second processing unit transport mechanism that transports the substrate between the transport mechanism and the single wafer processing unit. A substrate processing apparatus.
請求項4に記載の基板処理装置において、
前記第1処理部が備える前記姿勢変換機構は、第1姿勢変換機構であり、
前記基板処理部を挟んで前記搬送機構側とは反対側に配置され、前記第1処理部と前記第2処理部との間で基板の搬送を行い、かつ複数枚の基板について水平姿勢と垂直姿勢との間で一括して姿勢の変換を行う第2姿勢変換機構をさらに備えることを特徴とする基板処理装置。
The substrate processing apparatus according to claim 4,
The posture changing mechanism included in the first processing unit is a first posture changing mechanism,
The substrate processing unit is disposed on the opposite side to the transfer mechanism side, the substrate is transferred between the first processing unit and the second processing unit, and a plurality of substrates are perpendicular to a horizontal posture. A substrate processing apparatus, further comprising: a second posture conversion mechanism that collectively converts postures between postures.
請求項1から請求項6のいずれかに記載の基板処理装置において、
前記搬送機構は、前記第1処理部で処理された基板を前記第2処理部へ搬送することを特徴とする基板処理装置。
In the substrate processing apparatus in any one of Claims 1-6,
The substrate processing apparatus, wherein the transport mechanism transports a substrate processed by the first processing unit to the second processing unit.
請求項1から請求項7のいずれかに記載の基板処理装置において、
前記搬送機構は、前記第2処理部で処理された基板を前記第1処理部へ搬送することを特徴とする基板処理装置。
In the substrate processing apparatus in any one of Claims 1-7,
The substrate processing apparatus, wherein the transport mechanism transports a substrate processed by the second processing unit to the first processing unit.
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258570A (en) * 2007-03-09 2008-10-23 Dainippon Screen Mfg Co Ltd Substrate processor
US8033288B2 (en) 2007-03-09 2011-10-11 Dainippon Screen Mfg. Co., Ltd. Substrate treatment apparatus
KR101088289B1 (en) 2007-11-06 2011-11-30 도쿄엘렉트론가부시키가이샤 Loading table, processing apparatus and processing system
JP2020017604A (en) * 2018-07-25 2020-01-30 株式会社Screenホールディングス Device and method for substrate processing
US20210111054A1 (en) * 2019-10-10 2021-04-15 Tokyo Electron Limited Substrate processing system and substrate processing method
JP2021064652A (en) * 2019-10-10 2021-04-22 東京エレクトロン株式会社 Substrate processing system, and substrate processing method
JP2021530859A (en) * 2018-06-07 2021-11-11 エーシーエム リサーチ (シャンハイ) インコーポレーテッド Semiconductor wafer cleaning equipment and cleaning method
JP2022087065A (en) * 2020-11-30 2022-06-09 セメス カンパニー,リミテッド Apparatus for treating substrates
WO2024042815A1 (en) * 2022-08-23 2024-02-29 株式会社Screenホールディングス Substrate processing apparatus
WO2024062683A1 (en) * 2022-09-22 2024-03-28 株式会社Screenホールディングス Substrate processing apparatus
WO2024062762A1 (en) * 2022-09-22 2024-03-28 株式会社Screenホールディングス Substrate processing apparatus
WO2024062695A1 (en) * 2022-09-21 2024-03-28 株式会社Screenホールディングス Substrate processing apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101181560B1 (en) * 2008-09-12 2012-09-10 다이닛뽕스크린 세이조오 가부시키가이샤 Substrate processing apparatus and substrate conveying apparatus for use in the same
JP5875901B2 (en) * 2012-03-09 2016-03-02 株式会社Screenホールディングス Substrate processing equipment
KR101736855B1 (en) 2015-05-29 2017-05-18 세메스 주식회사 Apparatus for Processing Substrate
CN109127587B (en) * 2018-10-22 2021-03-19 安徽深泽电子股份有限公司 PCB cleaning tool
CN110775608B (en) * 2019-09-24 2022-01-28 南京康尼精密机械有限公司 Press workpiece conveying manipulator system and rotary conveying method
CN111069169A (en) * 2019-12-30 2020-04-28 荆门微田智能科技有限公司 Track type wafer cleaning and drying complete machine assembly line
CN115367464B (en) * 2022-10-25 2023-02-03 泉意光罩光电科技(济南)有限公司 One-stop multi-function mask and substrate transfer apparatus and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359225A (en) * 2001-06-01 2002-12-13 Smt:Kk Substrate-cleaning apparatus and system
JP2004281580A (en) * 2003-03-13 2004-10-07 Seiko Epson Corp Apparatus and method for conveying
JP2005051089A (en) * 2003-07-30 2005-02-24 Tokyo Electron Ltd Substrate treatment apparatus and method therefor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2920584B2 (en) * 1992-09-25 1999-07-19 大日本スクリーン製造株式会社 Substrate cleaning device
JP3118681B2 (en) * 1993-10-29 2000-12-18 東京エレクトロン株式会社 Processing device and processing method
JPH10163292A (en) * 1996-12-03 1998-06-19 Canon Sales Co Inc Treating device
US6368040B1 (en) * 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
US6488778B1 (en) * 2000-03-16 2002-12-03 International Business Machines Corporation Apparatus and method for controlling wafer environment between thermal clean and thermal processing
JP4342147B2 (en) * 2002-05-01 2009-10-14 大日本スクリーン製造株式会社 Substrate processing equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359225A (en) * 2001-06-01 2002-12-13 Smt:Kk Substrate-cleaning apparatus and system
JP2004281580A (en) * 2003-03-13 2004-10-07 Seiko Epson Corp Apparatus and method for conveying
JP2005051089A (en) * 2003-07-30 2005-02-24 Tokyo Electron Ltd Substrate treatment apparatus and method therefor

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8033288B2 (en) 2007-03-09 2011-10-11 Dainippon Screen Mfg. Co., Ltd. Substrate treatment apparatus
JP2008258570A (en) * 2007-03-09 2008-10-23 Dainippon Screen Mfg Co Ltd Substrate processor
KR101088289B1 (en) 2007-11-06 2011-11-30 도쿄엘렉트론가부시키가이샤 Loading table, processing apparatus and processing system
JP2021530859A (en) * 2018-06-07 2021-11-11 エーシーエム リサーチ (シャンハイ) インコーポレーテッド Semiconductor wafer cleaning equipment and cleaning method
JP7165754B2 (en) 2018-06-07 2022-11-04 エーシーエム リサーチ (シャンハイ) インコーポレーテッド Semiconductor wafer cleaning device and cleaning method
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US20210111054A1 (en) * 2019-10-10 2021-04-15 Tokyo Electron Limited Substrate processing system and substrate processing method
JP7336955B2 (en) 2019-10-10 2023-09-01 東京エレクトロン株式会社 Substrate processing system and substrate processing method
JP2022087065A (en) * 2020-11-30 2022-06-09 セメス カンパニー,リミテッド Apparatus for treating substrates
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WO2024042815A1 (en) * 2022-08-23 2024-02-29 株式会社Screenホールディングス Substrate processing apparatus
WO2024062695A1 (en) * 2022-09-21 2024-03-28 株式会社Screenホールディングス Substrate processing apparatus
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WO2024062762A1 (en) * 2022-09-22 2024-03-28 株式会社Screenホールディングス Substrate processing apparatus

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