JP2006179757A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus comprising a first processing part for collectively processing a plurality of substrates and a second processing for processing substrates one by one, and capable of processing the substrate in either processing. <P>SOLUTION: This substrate processing apparatus comprises a collective processing part 27 for collectively processing a plurality of substrates W, and an individual processing part 43 for treating the substrates W one by one. A transfer mechanism 13 can transfer the substrates among a cassette C, the collective processing part 27 and the individual processing part 43. A control unit controls the transfer operation of the transfer mechanism 13 based on the processing condition for the substrates W, so that the substrates W can be processed by selecting either of the collective processing part 27 and the individual processing part 43. Further, the substrates W can be treated by a suitably combined use of them, e.g. by using the individual processing part 43 following the collective processing part 27, etc. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus for processing a substrate such as a semiconductor wafer or a glass substrate for liquid crystal display (hereinafter simply referred to as a substrate).

  Conventionally, in a substrate processing apparatus, a method of processing a plurality of (for example, 25) substrates at once has been mainstream, but recently, a method of processing substrates one by one has begun to be adopted.

  Both types are appropriate / inappropriate depending on the contents of processing. For example, a method of batch processing is used for resist stripping, and a mode of processing one by one is used for development processing. However, there is a process that can be appropriately performed by any method such as a cleaning process.

  A substrate processing apparatus that performs batch processing (hereinafter simply referred to as “collective processing apparatus”) usually includes a processing tank capable of storing a processing solution, and immerses a plurality of substrates in the processing tank at once. Process. For this reason, according to the system which processes collectively, the process quality between board | substrates can be made uniform besides being excellent in the mass-productivity of a substrate process (for example, refer patent document 1).

  On the other hand, a substrate processing apparatus that processes substrates one by one (hereinafter simply referred to as “individual processing apparatus”) includes a holding unit that holds a single substrate in a horizontal posture so that the substrate can be rotated. The substrate is processed by supplying a processing liquid from a nozzle or the like disposed in the substrate. According to this, the processing accuracy of the substrate is relatively high (see, for example, Patent Document 2).

JP 2001-196342 A JP 2000-070873 A

However, the conventional example having such a configuration has the following problems.
According to the system in which substrates are processed at once, the substrates are contaminated with each other. Even if the processing content is suitable for batch processing, the finish may not be sufficient when the last of the processing is a step of washing with rinse or the like.

  In such a case, after processing is performed by the batch processing apparatus, it is necessary to further transport to an individual processing apparatus to improve processing accuracy. However, it is necessary to provide both types of substrate processing apparatuses for the processing contents, which disadvantageously increases costs. In addition, it is necessary to transport the substrate between these substrate processing apparatuses, resulting in a large loss.

  The present invention has been made in view of such circumstances, and includes a first processing unit that collectively processes a plurality of substrates, and a second processing unit that processes the substrates one by one, It is an object of the present invention to provide a substrate processing apparatus capable of processing a substrate in any processing unit.

In order to achieve such an object, the present invention has the following configuration.
That is, according to the first aspect of the present invention, in the substrate processing apparatus for processing a substrate, a mounting unit for mounting a container for storing a plurality of substrates and a plurality of substrates processed in a lump. A substrate processing unit having a first processing unit and a second processing unit that processes the substrates one by one; a transport mechanism that transports the substrate between the placement unit, the first processing unit, and the second processing unit; And a control unit that controls the transfer operation of the transfer mechanism between the placement unit, the first processing unit, and the second processing unit based on the processing conditions of the substrate. is there.

  [Operation / Effect] According to the first aspect of the present invention, the substrate processing unit has a first processing unit that processes a plurality of substrates at once and a second processing unit that processes the substrates one by one. Under the control of the control unit, the transport mechanism transports the substrate from the substrate container to either the first processing unit or the second processing unit. As a result, a single substrate processing apparatus can perform processing such as cleaning, etching, peeling, drying, etc. on a substrate by a method of processing a plurality of substrates at once and a method of processing a substrate one by one. Can be processed.

  According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, the substrate processing unit is divided into two regions, and the first processing unit and the second processing unit are opposed to each other. The first processing unit is arranged in one area, and the second processing unit is arranged in the other area.

  [Operation and Effect] According to the invention described in claim 2, the substrate processing unit is divided into two regions, and the first processing unit or the second processing unit is arranged in each region so as to face each other. Thereby, the arrangement efficiency of the substrate processing unit is improved, and the footprint can be suppressed. In addition, the amount of movement associated with the transport operation of the transport mechanism can be reduced, and transport efficiency is good.

  The invention according to claim 3 is the substrate processing apparatus according to claim 2, further comprising a partition between the two regions.

  [Operation / Effect] According to the invention described in claim 3, it is possible to prevent the atmosphere in each region from being separated from each other by the partition walls and the atmosphere from diffusing to the other region. Therefore, the substrate can be suitably processed in the first processing unit or the second processing unit arranged in each region.

  According to a fourth aspect of the present invention, in the substrate processing apparatus according to any one of the first to third aspects, the first processing unit uses a processing liquid for a plurality of substrates in a vertical posture. The substrate can be transferred between a processing liquid processing unit that performs processing, a drying processing unit that dries a plurality of substrates in a vertical posture processed by the processing liquid processing unit, and the transport mechanism. A plurality of substrates can be transferred between the posture conversion mechanism that performs batch posture conversion between a horizontal posture and a vertical posture with respect to a single substrate; and the processing liquid processing unit And a drying mechanism for transporting a substrate between the first processing unit and the drying processing unit.

  [Operation and Effect] According to the invention described in claim 4, in the process of transporting the substrate between the first processing unit and the transport mechanism, the postures of the plurality of substrates are collectively converted by the posture conversion mechanism. . Therefore, the substrate can be suitably transported to the processing liquid processing unit and the drying processing unit that process a plurality of substrates in a vertical posture. At this time, the first processing unit transport mechanism transfers the substrate to and from the processing liquid processing unit and the drying processing unit while delivering the substrate to and from the posture changing mechanism. The conveyance efficiency can be further improved.

  Further, the invention according to claim 5 is the substrate processing apparatus according to any one of claims 1 to 4, wherein the second processing unit is a single wafer processing unit that processes the substrates one by one; A second processing unit transport mechanism that transports the substrate between the transport mechanism and the single wafer processing unit is provided.

  [Operation / Effect] According to the invention described in claim 5, since the transport mechanism for the second processing unit transports the substrate between the single wafer processing unit and the transport mechanism, the substrate in the second processing unit The conveyance efficiency can be improved.

  According to a sixth aspect of the present invention, in the substrate processing apparatus of the fourth aspect, the posture changing mechanism provided in the first processing unit is a first posture changing mechanism, and the substrate processing unit is sandwiched therebetween. The substrate is disposed on the side opposite to the transport mechanism side, transports substrates between the first processing unit and the second processing unit, and batches a plurality of substrates between a horizontal posture and a vertical posture. And a second posture changing mechanism for changing the posture.

  [Operation / Effect] According to the invention described in claim 6, in the process of transporting the substrate between the first processing unit and the second processing unit, the postures of the plurality of substrates are collectively controlled by the second posture changing mechanism. And convert. Therefore, the substrate can be suitably transported between the first processing unit and the second processing unit. In addition, the second attitude conversion unit is not buffered with the transfer mechanism by disposing the second attitude conversion unit on the opposite side of the transfer mechanism with the substrate processing unit interposed therebetween. Therefore, the transport operations of the transport mechanism and the second posture changing means can be controlled independently of each other.

  The invention according to claim 7 is the substrate processing apparatus according to any one of claims 1 to 6, wherein the transport mechanism is configured to transfer the substrate processed by the first processing unit to the second processing unit. It is characterized by being conveyed to.

  [Operation / Effect] According to the invention described in claim 7, for a substrate processed by a method of processing a plurality of substrates at once, processing is performed by a method of successively processing the substrates one by one. be able to.

  The invention according to claim 8 is the substrate processing apparatus according to any one of claims 1 to 7, wherein the transport mechanism is configured to transfer the substrate processed by the second processing unit to the first processing unit. It is characterized by being conveyed to.

  [Operation / Effect] According to the invention described in claim 8, the substrate processed by the method of processing the substrates one by one is processed by the method of successively processing a plurality of substrates. be able to.

  According to the substrate processing apparatus of the present invention, the substrate processing unit includes the first processing unit that processes a plurality of substrates at once and the second processing unit that processes the substrates one by one, and is controlled by the control unit. Thus, the transport mechanism transports the substrate from the substrate container to either the first processing unit or the second processing unit. As a result, a single substrate processing apparatus can perform processing such as cleaning, etching, peeling, drying, etc. on a substrate by a method of processing a plurality of substrates at once and a method of processing a substrate one by one. Can be processed.

Embodiment 1 of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view illustrating a schematic configuration of the substrate processing apparatus according to the first embodiment.

  The substrate processing apparatus is an apparatus that performs a predetermined process (for example, a resist stripping process) on a substrate W (for example, a semiconductor wafer), a cassette mounting unit 1 for mounting a cassette C for storing the substrate W, and a substrate. The substrate processing area 3 for performing a predetermined process and the transfer area 5 for transferring the substrate W to both the cassette C and the substrate processing area 3 are roughly divided. The substrate processing region 3 is further divided into a batch processing region (first processing unit) 3a for processing a plurality of substrates W at once and an individual processing region (second processing unit) 3b for processing substrates one by one. It is divided.

  The cassette C placed on the cassette placement unit 1 accommodates a plurality of (for example, 25) substrates W (hereinafter abbreviated as “substrate W group” as appropriate) in multiple stages in a horizontal posture.

The transport area 5 includes a transport path 11 formed along the cassette mounting unit 1 and a transport mechanism 13 that is disposed on the transport path 11 and transports the substrate W. The transport mechanism 13 is driven in the horizontal direction (“X direction” in FIG. 1) on the transport path 11 by a screw feed mechanism. The upper part of the transport mechanism 13 includes two holding arms 13a ₁ and 13a ₂ (hereinafter collectively referred to as holding arms 13a unless otherwise distinguished) having a “U” -shaped shape, Each substrate W is held in a horizontal posture. The transport mechanism 13 itself also drives the two holding arms 13a by a drive mechanism (not shown) so as to be capable of turning, moving up and down, and moving in and out in the horizontal direction. Then, the substrates W are transferred one by one to the cassette C, the batch processing region 3a, and the individual processing region 3b.

  The substrate processing area 3 is divided in a direction substantially perpendicular to the transport path 11, and one is a batch processing area 3 a and the other is an individual processing area 3 b. Thereby, each area | region 3a, 3b is made to adjoin to the conveyance area | region 5, and the collective process area | region 3a and the individual process area | region 3b are made to oppose. Further, a partition wall 7 is provided between the regions 3a and 3b to block the atmosphere.

  In the collective processing area 3a, a first attitude conversion unit 21 that transfers the substrate W to and from the transport mechanism 13 and collectively converts the attitude of the group of substrates W between the horizontal attitude and the vertical attitude; A first pusher 23 that collectively transfers the substrate W group to and from the first posture changing unit 21; a batch transfer mechanism 25 that transfers the substrate W group to and from the first pusher 23; A batch processing unit 27 is provided for transferring the substrate W group to and from the transport mechanism 25 and processing the substrate W group in a vertical posture at once.

  The 1st attitude | position conversion part 21 is demonstrated with reference to FIG. 2A is a plan view (upper stage) and a side view (lower stage) of the first attitude conversion unit 21 when the support base 21a is in a horizontal attitude, and FIG. 2B is a vertical attitude of the support base 21a. It is the top view (upper stage) and side view (lower stage) of the 1st attitude | position conversion part 21 at the time. The first attitude conversion unit 21 includes a support base 21a and a plurality of (for example, four) holders 21b that are provided on the support base 21a and hold the substrate W in multiple stages. The support base 21a is rotationally driven around the horizontal axis P at the base end portion of the support base 21a by a drive mechanism (not shown). Thereby, the support base 21a takes a horizontal posture as shown in FIG. 2 (a) and a vertical posture as shown in FIG. 2 (b). At this time, each holder 21b also rotates in conjunction with the support base 21a, so that the substrate W group held by these holders is also changed in posture between the horizontal posture and the vertical posture.

  The first posture changing unit 21 is arranged facing the transfer path 11 so that the substrate W can be transferred to and from the transfer mechanism 13 when the support base 21a is in a horizontal posture.

  There is a first pusher 23 beside the first posture conversion unit 21. The first pusher 23 is configured to be capable of turning, moving up and down (Z direction in FIG. 1), and moving in the horizontal direction (X direction) by a drive mechanism (not shown). Further, the upper end portion of the first pusher 23 has a plurality of grooves formed in parallel to each other, and can be held together by bringing the substrate W into contact with each groove.

  Please refer to FIG. FIG. 3 is a front view of the first pusher 23 and the first posture changing unit 21, and (a) and (b) show how the substrate is transferred. When the substrate W group is transferred between the first pusher 23 and the first posture changing unit 21, as shown in FIGS. 3A and 3B, the support 21a of the first posture changing unit 21 is vertical. It is posture. When the first pusher 23 receives the group of substrates W from the first attitude conversion unit 21, the first pusher 23 is positioned below the first attitude conversion unit 21 as shown in FIG. Then, as shown in FIG. 3B, the first pusher 23 moves up and receives the substrate W group from the first attitude conversion unit 21 at a time.

  The collective transport mechanism 25 is configured to be movable in the horizontal direction (Y direction in FIG. 1) along the collective processing unit 27 by a drive mechanism (not shown). The collective transport mechanism 25 includes a pair of openable and closable clamping mechanisms 25a extending horizontally, and collectively supports the substrate W group on the clamping mechanism 25a.

  The transfer of the substrate W group to the first pusher 23 is performed at a standby position that does not face the collective processing unit 27. As shown in FIGS. 4A and 4B, the first pusher 23 is moved up and down, and the holding mechanism 25a is opened and closed, whereby the substrate W group is disposed between the first pusher 23 and the collective transport mechanism 25. Delivery of.

  The batch processing unit 27 includes a drying processing unit 29, a cleaning processing unit 31, and a chemical solution processing unit 33. In the present embodiment, the batch processing unit 27 will be described as performing a so-called resist stripping process in which the resist is removed from the substrate W. Note that the resist (organic material) is merely an example, and the present invention is not limited to this.

  Please refer to FIG. The drying processing unit 29 is a spin dryer, and includes a drying container 29a having an opening formed at an upper part thereof that can transport the substrate W group, and a slide lid 29b that opens and closes the opening by sliding movement. In the drying container 29a, there are provided a rotation holding portion 29c that holds the substrate W group in a vertical posture so that the substrate W group can rotate, and a drying pusher 29d that holds the substrate W group in a vertically movable manner. Further, a nozzle 29e for supplying nitrogen gas and a rinsing liquid is provided on the side wall of the drying container 29a. Furthermore, it communicates with a vacuum suction source for depressurizing the inside of the drying container 29a and a drainage processing unit for processing the drainage discharged from the drying container 29a.

  The transfer of the substrate W group to and from the collective transport mechanism 25 is performed above the drying container 29a when the drying pusher 29d is raised (in FIG. 5, the substrate W group is transferred to and from the collective transport mechanism 25). The drying pusher 29d is shown by a dotted line). Further, the drying pusher 29d transfers the substrate W group to and from the rotation holding unit 29c in the drying container 29a. When the drying process is performed, the substrate W is lowered to the bottom of the drying container 29a so as not to be buffered with the rotating rotation holding unit 29c and the like (in FIG. 5, the substrate W group is transferred to and from the collective transport mechanism 25). The drying pusher 29d is shown by a solid line).

  Please refer to FIG. The cleaning processing unit 31 is provided at the bottom of the cleaning tank 31a for storing the cleaning liquid, the injection pipe 31b for supplying the cleaning liquid, and the upper opening of the cleaning tank 31a. And an outer tank 31c to be recovered. Moreover, it has the lifter 35 which immerses the board | substrate W group collectively in the washing tank 31a. The lifter 35 includes a plurality of holding rods 35a extending in the horizontal direction, and can hold the substrate W group in a batch in a vertical posture. Further, it can be moved up and down and horizontally by a driving mechanism (not shown).

  Although the chemical solution processing unit 33 has a configuration similar to that of the cleaning processing unit 31, illustration thereof is omitted, but a chemical solution tank that stores a resist stripping solution that is a chemical solution and a resist stripping solution that is provided at the bottom of the chemical solution tank are supplied. And an outer tank for collecting the processing liquid. The above-described lifter 35 is used to immerse the substrate W group in the chemical bath together. That is, the lifter 35 is shared with the cleaning processing unit 31.

  The transfer of the substrate W group between the cleaning processing unit 31 and the chemical processing unit 33 and the collective transport mechanism 25 is performed with the lifter 35 ascending above the cleaning tank 31a as shown in FIG.

  Next, the inside of the individual processing area 3b will be described. In the individual processing region 3b, an individual transport path 41 formed along the partition wall 7, an individual processing unit 43 disposed on one side of the individual transport path 41 and processing the substrate W in a horizontal posture, An individual transport mechanism 45 that transports the substrates W one by one between the processing unit 43 and the transport mechanism 13 is provided.

The individual transport mechanism 45 is configured to be movable horizontally (“Y direction” in FIG. 1) on the individual transport path 41 by a screw feed mechanism. Further, at the upper end portion thereof, there are individual arms 45a ₁ and 45a ₂ having an “U” shape and capable of holding the substrates W one by one (hereinafter, individual arms 45a unless otherwise distinguished). 2). In addition, the two individual arms 45a are also configured to be capable of turning, moving up and down, and moving in and out in the horizontal direction by a drive mechanism (not shown). And it moves on the conveyance path 41 for individual to the position which opposes the conveyance path 11, and delivers the conveyance mechanism 13 and the board | substrate W one sheet at a time.

  In this embodiment, the individual processing unit 43 includes a plurality of (for example, four) cleaning / drying processing units (single-wafer processing units) 51a, 51b, 51c, 51d (hereinafter, each cleaning / drying processing unit 51a, 51b,...). .. Are collectively referred to as “cleaning / drying processing unit 51”. Each washing / drying / cleaning processing unit 51 is arranged such that its carry-in entrance faces the individual conveyance path 41.

  Please refer to FIG. The cleaning / drying processing unit 51 includes a substrate holding unit 51a that holds the substrate W in a horizontal position, a motor 51b that rotationally drives the substrate holding unit 51a, and a nozzle 51c that is displaceably disposed above the substrate W and that discharges cleaning liquid. And a cup 51d which is arranged so as to surround the periphery of the substrate W and prevents the cleaning liquid from scattering. Further, a blowing unit (not shown) is provided above the substrate W, and clean gas can flow down to the substrate surface.

  The individual transport mechanism 45 moves horizontally to a position facing each cleaning / drying processing unit 51, and appropriately moves the two individual arms 45 a to transport the substrate also to each cleaning / drying processing unit 51.

  The substrate processing apparatus configured as described above further includes a control unit (not shown) that controls the transfer of the substrate W (or the substrate W group) based on a predetermined substrate processing condition. The control unit includes a transport mechanism 13, a first attitude conversion unit 21, a first pusher 23, a collective transport mechanism 25, an individual transport mechanism 45, and the like (hereinafter, those that transport these substrates are collectively referred to as a “transport system”. ) Is the operation target. The control unit includes a central processing unit (CPU) that executes various arithmetic processes for substrate processing, a storage medium that stores processing conditions for a predetermined substrate and various information necessary for the substrate processing, and the like.

  An example of the operation of the substrate processing apparatus configured as described above will be described with reference to FIG.

<Step S1> Loading the substrate W from the cassette C into the batch processing unit 27 When the cassette C storing the unprocessed substrates W in multiple stages in a horizontal posture is mounted on the cassette mounting unit 1, the transport mechanism 13 is moved to the cassette. Moving forward to C, the substrates W in the cassette C are taken out one by one.

  The transport mechanism 13 performs a turning movement or the like, and moves to a position facing the first posture conversion unit 21 in the collective processing region 3a. At this time, the support base 21a of the first posture conversion unit 21 is in a horizontal posture. The transport mechanism 13 passes the substrates W in a horizontal posture to the first posture conversion unit 21 one by one.

  When this operation is repeated and 25 substrates W are inserted into the first posture changing unit 21, the support 21a of the first posture changing unit 21 rotates around the axis P and takes a vertical posture. Along with this operation, the 25 substrates W held in the holder 21b (in the following description of operation, simply referred to as “substrate W group”) also rotate together, and are converted from a horizontal posture to a vertical posture.

  The first pusher 23 moves upward from below the first posture converting unit 21 and receives the substrate W group from the first posture converting unit 21 at a time. Then, horizontal movement and swivel movement are performed to move to the delivery position with the collective transport mechanism 25. At this time, the collective transport mechanism 25 is waiting above the first pusher 23, and the holding mechanism 25a is in the “open” state.

  When the first pusher 23 moves upward to the delivery position, the holding mechanism 25a is closed to collectively abut and support the substrate W group. Subsequently, when the first pusher 23 is lowered, the collective transport mechanism 25 receives the substrate W group at a time.

  The collective transport mechanism 25 that holds the substrate W group moves horizontally above the chemical solution processing unit 33 on which the lifter 35 stands by.

  The lifter 35 rises and abuts and supports the substrate W group on the holding rod 35a. Thereafter, when the holding mechanism 25a is opened, the lifter 35 is lowered, and the substrate W group is collectively received from the collective transport mechanism 25.

  Note that the control unit operates the transport system such as the transport mechanism 13 to control the transport of the substrate W as described above.

<Step S2> Performing the resist stripping process on the substrate W group collectively The lifter 35 descends into the chemical bath in which the resist stripping solution is stored while holding the substrate W group, and collects the substrate W group all together. Soak and resist stripping treatment.

  When the predetermined resist stripping process is completed, the lifter 35 is lifted to lift the substrate W group from the resist stripping solution. Subsequently, the lifter 35 moves horizontally to the cleaning tank 31a and descends, and the substrate W group is collectively immersed in the cleaning tank 31a to perform a cleaning process.

  When the cleaning process is completed, the lifter 35 is raised and the substrate W group is pulled up from the cleaning liquid all at once. At this time, the batch transport mechanism 25 is waiting above the cleaning processing unit 31 with the holding mechanism 25a opened.

  When the lifter 35 is raised to the position of the collective transport mechanism 25, the holding mechanism 25a is closed, and the substrate W group is collectively abutted and supported. When the lifter 35 is lowered again, the collective transport mechanism 25 receives the group of substrates W in a batch.

  The collective transport mechanism 25 moves horizontally to above the drying processing unit 29. The slide lid 29b of the drying processing unit 29 slides and the drying pusher 29d moves up from the drying container 29a. When the drying pusher 29d collectively holds the substrate W group, the holding mechanism 25a of the batch transport mechanism 25 is opened. The drying pusher 29d is lowered again, and the substrate W group is transferred to the rotation holding unit 29c. The drying pusher 29d retracts to the drying container 29a, and the slide lid 29b slides to close the opening of the drying container 29a. Thereafter, a predetermined drying process is performed while rotating the substrate W group in a vertical posture.

  When the drying process is completed, the slide lid 29b is opened. When the drying pusher 29d receives the substrate W group from the rotation holding unit 29c at once, the drying pusher 29d rises as it is and transfers it to the collective transport mechanism 25.

<Step S3> The substrate W is transported from the batch processing unit 27 to the individual processing unit 43. The batch transport mechanism 25 holds the substrate W group and moves to the standby position. Then, the substrate W group is transferred from the batch transport mechanism 25 to the first pusher 23, and is transferred from the first pusher 23 to the first posture converting unit 21. In the first posture conversion unit 21, the postures of the substrate W group are collectively converted from a vertical posture to a horizontal posture. The transport mechanism 13 moves in and out at a position facing the first posture conversion unit 21 and unloads the substrates W one by one from the first posture conversion unit 21. The substrate W is held by the holding arm 13a and horizontally moved to the individual processing region 3b, and the substrates W are transferred to the individual transport mechanism 45 one by one. Again, the position returns to the position facing the first posture changing unit 21 and the substrate W transfer operation is repeated in the same manner.

  Each time the individual transport mechanism 45 receives the substrate W, the individual transport mechanism 45 moves horizontally to a position facing the predetermined cleaning / drying processing unit 51, and carries the received substrate W into the cleaning / drying processing unit 51. Placed on. Then, the individual transport mechanism 45 again returns to the position facing the transport mechanism 13, repeats the same transport operation of the substrate W, and carries it into the other cleaning / drying processing section 51.

  Note that the control unit operates the transport system such as the transport mechanism 13 to control the transport of the substrate W as shown in step S3.

<Step S <b>4> Performing a cleaning and drying process one by one on the substrate W While rotating the substrate W by the motor 51 b, the cleaning liquid is discharged from the nozzle 51 c onto the substrate W to perform a predetermined cleaning process. When the cleaning process is completed, while the substrate W is rotated at a higher speed, a clean gas is caused to flow down from the blow-out unit (not shown) to the substrate W, and the moisture on the surface of the substrate W is shaken off and dried. In the present embodiment, the individual processing unit 43 includes four cleaning / drying processing units 51, so that four substrates can be cleaned and dried in parallel.

<Step S5> Transporting the substrate W from the individual processing unit 43 to the cassette C When a series of cleaning / drying processing is completed, the substrate W is taken out from the cleaning / drying processing unit 51 to the individual transporting mechanism 45 in the reverse procedure of loading. Then, it is transferred from the individual transport mechanism 45 to the transport mechanism 13 and carried into the cassette C by the transport mechanism 13.

  The control unit operates the transport system such as the transport mechanism 13 to control the transport of the substrate W as shown in step S5.

  As described above, the substrate processing apparatus according to the first embodiment includes the batch processing unit 27 and the individual processing unit 43, and the batch processing unit 27 is operated by the control unit operating the transport system such as the transport mechanism 13. Alternatively, the substrate W can be selectively transferred to any one of the individual processing units 43. Therefore, the processing applied to the substrate W can be performed in either the batch processing unit 27 or the individual processing unit 43.

  Also, the collective processing unit 27 is assembled and arranged in the collective processing region 3a, and the individual processing unit 43 is arranged and arranged in the individual processing region 3b. Further, any region is formed so as to face the transport mechanism 13. Therefore, the efficiency of substrate conveyance can be improved while suppressing the footprint.

  In addition, a partition wall 7 is provided between the batch processing region 3a and the individual processing region 3b, and the atmosphere in the batch processing region 3a or the individual processing region 3b is separated from each other by the partition wall 7, and the atmosphere diffuses in the other region. Can be prevented. Therefore, the substrate W can be suitably processed in each of the regions 3a and 3b.

  Further, in the process of transporting the substrate W between the transport mechanism 13 and the collective processing unit 27, the first posture converting unit 21 collectively changes the posture of the substrate W group. Accordingly, the substrate W can be suitably transported from the cassette C or the individual processing unit 43 that accommodates / processes the substrate W group in the horizontal posture with respect to the batch processing unit 27 that processes the substrate W group in the vertical posture.

  The batch processing unit 27 is provided with a batch transport mechanism 25 for batch loading / unloading of the substrate W group, and the substrate W group is batched with the first posture changing unit 21 via the first pusher 23. And hand it over. Thereby, the conveyance efficiency with respect to the batch processing unit 27 can be further improved.

  Similarly, an individual transport mechanism 45 for loading / unloading the substrates W one by one to / from the individual processing unit 43 is provided, and the substrates W are transferred to and from the transport mechanism 13 one by one. Thereby, the conveyance efficiency with respect to the individual process part 43 can further be improved.

  Further, as described in step S1, step S3, and step S5, the control unit takes out the unprocessed substrate W from the cassette C, carries it into the batch processing unit 27, and has been processed by the batch processing unit 27. The transport system is operated so that W is transported from the batch processing unit 27 to the individual processing unit 43 and the substrate W processed by the individual processing unit 43 is transported from the individual processing unit 43 to the cassette C. Accordingly, the substrate W can be cleaned in the individual processing unit 43 after the batch processing unit 27 performs the process of removing the resist on the substrate W group. Therefore, the resist can be removed from the substrate W, and the substrate W can be accurately cleaned and finished.

  In addition, the individual processing unit 43 includes a plurality of cleaning / drying processing units 51, so that a plurality of substrates W can be processed in parallel. Therefore, the processing capability of the individual processing unit 43 can be improved, and the throughput of the substrate processing apparatus can be improved.

  The batch processing unit 27 includes a plurality of different types of processing units (the drying processing unit 29, the cleaning processing unit 31, and the chemical processing unit 33), so that the substrate W group is subjected to a drying process. In addition, a chemical solution process or a cleaning process can be performed on another substrate W group. Therefore, the throughput of the substrate processing apparatus can be further improved.

Next, Embodiment 2 of the present invention will be described.
FIG. 9 is a plan view illustrating a schematic configuration of the substrate processing apparatus according to the second embodiment. In addition, about the same structure as Example 1, detailed description is abbreviate | omitted by giving the same code | symbol.

  The substrate processing apparatus according to the second embodiment is divided into a cassette placing unit 1, a substrate processing region 3, a transport region 5, and a sub transport region 9. The sub-transport area 9 is provided on the opposite side of the transport area 5 with the substrate processing area 3 interposed therebetween.

  In the sub-transport area 9, the substrate is transferred to and from the individual transport mechanism 45, and the second posture conversion unit 61 that collectively converts the posture of the substrate W group between the horizontal posture and the vertical posture. And a second pusher 63 that transfers the group of substrates W between the second posture converting unit 61 and the collective transport mechanism 26 including the pair of holding mechanisms 26a.

  Similar to the first posture conversion unit 21, the second posture conversion unit 61 includes a support base and a plurality of holders (not shown). Further, in the state where the support stand of the second posture changing unit 61 is in the horizontal posture, it can turn around the vertical axis to face the individual conveyance path 41 in order to transfer the individual conveyance mechanism 45 and the substrate W. It is configured as follows.

  The second pusher 63 is arranged beside the second posture changing unit 61 and is configured to be movable horizontally (“X direction” in FIG. 9) by a driving mechanism (not shown).

  Further, the collective transport mechanism 26 according to the second embodiment is configured to be movable horizontally (“Y direction” in FIG. 9) to the sub transport region 9 in order to transfer the second pusher 63 and the substrate W group.

  The control unit according to the second embodiment further operates a conveyance system including the second posture conversion unit 61, the second pusher 63, and the collective conveyance mechanism 26.

  An operation example of the substrate processing apparatus according to the second embodiment configured as described above will be described with reference to FIG. Since there is no difference except that the collective transport mechanism 25 is replaced with the collective transport mechanism 26 except for step 3, only step S3 will be described below.

<Step S <b>3> The substrate W is transported from the batch processing unit 27 to the individual processing unit 43. The batch transport mechanism 26 holds the substrate W group and moves to the sub-transport region 9. When the second pusher 63 rises from below the collective transport mechanism 26 and abuts and supports the group of substrates W, the holding mechanism included in the collective transport mechanism 26 opens, and the second pusher 63 descends again. As a result, the substrate W group is collectively transferred to the second pusher 63.

  The second pusher 63 moves to above the second posture conversion unit 61 that stands by in a vertical posture. Subsequently, when the second pusher 63 is lowered, the substrate W group is collectively delivered to the second posture conversion unit 61.

  The second attitude conversion unit 61 rotates while holding the substrate W group and takes a horizontal attitude. Then, it turns in the direction facing the individual conveyance path 41.

  The individual transport mechanism 45 moves in and out at a position facing the second posture converting unit 61, and unloads the substrates W one by one from the second posture converting unit 61. When the substrate W is held on the individual arm 45a, the substrate W is moved horizontally to a position facing the predetermined cleaning / drying processing unit 51 each time, and the substrate W is carried into the cleaning / drying processing unit 51, and then on the substrate holding unit 51a. Placed on. Then, it returns to the position facing the second posture changing unit 61 and repeats the same substrate W transfer operation, and carries it into the other cleaning / drying processing unit 51.

  Note that the control unit operates the transport system such as the second attitude conversion unit 61 to control the transport of the substrate W as shown in step S3.

  As described above, according to the substrate processing apparatus according to the second embodiment, in the process of transporting the substrate W between the individual transport mechanism 45 and the collective transport mechanism 26, the second attitude conversion unit 61 changes the substrate W group. Change posture at once. Accordingly, the substrate W can be suitably transported between the batch processing unit 27 that processes the substrate W in a vertical posture and the individual processing unit 43 that processes the substrate W in a horizontal posture.

  Moreover, since this 2nd attitude | position conversion part 61 and the conveyance mechanism 13 do not buffer, the control part can operate each independently. Moreover, since the 2nd attitude | position conversion part 61 is arrange | positioned in the sub conveyance area | region 9 which faces the batch processing area | region 3a and the separate process area | region 3b, it can convey a board | substrate easily.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In each of the above-described embodiments, the batch processing unit 27 performs the resist stripping process, and the individual processing unit 43 performs the cleaning / drying process. Depending on the design, the processing units 27 and 43 may be appropriately modified.

  (2) In each of the embodiments described above, the transport mechanism 13 includes the two holding arms 13a that hold the substrates W one by one. However, the holding arms are provided in multiple stages, and the substrate is relative to the cassette C. You may comprise so that W group may be conveyed collectively.

  (3) In each of the above-described embodiments, the batch processing unit 27 and the individual processing unit 43 each have a plurality of processing units, but may include a single processing unit.

  (4) In each of the above-described embodiments, the control unit controls the substrate W to be processed by the individual processing unit 43 after processing the substrate W by the batch processing unit 27 based on the processing conditions of the substrate W. These are appropriately changed according to the processing conditions of the substrate W. For example, the substrate W may be first transported to the individual processing unit 43 and then transported to the batch processing unit 27. Further, the substrate may be transferred to only one of the batch processing unit 27 and the individual processing unit 43.

  (5) In each of the above-described embodiments, the cassette C is placed on the cassette placing portion 1, but a pod capable of sealing the substrate W may be used.

  (6) In each of the above-described embodiments, a spin dryer is used as the drying processing unit 29. However, the substrate W is pulled up from the pure water stored in the processing tank, and IPA (isopropyl alcohol) and nitrogen gas are supplied to the substrate W. The apparatus which performs the drying process with respect to may be sufficient.

1 is a plan view showing a schematic configuration of a substrate processing apparatus according to Embodiment 1. FIG. (A) is the top view (upper stage) and side view (lower stage) of a 1st attitude | position conversion part when a support stand is a horizontal attitude | position, (b) is the 1st attitude | position when a support stand is a vertical attitude | position. It is the top view (upper stage) and side view (lower stage) of a conversion part. It is a front view of a 1st pusher and a 1st attitude | position conversion part, (a), (b) is a front view which shows the mode of the delivery of a board | substrate. It is a front view which shows the mode of delivery of the board | substrate group with a 1st pusher and a batch conveyance mechanism. It is sectional drawing which shows schematic structure of a drying process part. (A) is the schematic of a washing process part, (b) is the schematic which shows the mode of delivery of the board | substrate group with a lifter and the conveyance mechanism for package. It is the schematic of a washing-drying process part. It is a flowchart which shows an example of operation | movement of a substrate processing apparatus. 6 is a plan view illustrating a schematic configuration of a substrate processing apparatus according to Embodiment 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Cassette mounting part 3a ... Batch processing area (1st processing part)
3b ... Individual processing area (second processing unit)
DESCRIPTION OF SYMBOLS 7 ... Bulkhead 11 ... Conveyance path 13 ... Conveyance mechanism 21 ... 1st attitude | position conversion part 25 ... Collective conveyance mechanism 27 ... Collective processing part 29 ... Drying processing part 31 ... Cleaning process part 33 ... Chemical solution processing part 43 ... Individual processing part 45 ... Individual transport mechanism 51 ... Washing and drying processing section (single wafer processing section)
61 ... 2nd attitude | position conversion part W ... Board | substrate C ... Cassette

Claims (8)

In a substrate processing apparatus for processing a substrate,
A mounting section for mounting a container for storing a plurality of substrates;
A substrate processing unit having a first processing unit that processes a plurality of substrates at once and a second processing unit that processes the substrates one by one;
A transport mechanism for transporting a substrate between the placing section, the first processing section, and the second processing section;
Based on the processing conditions of the substrate, a control unit that controls the transport operation of the transport mechanism between the placement unit, the first processing unit, and the second processing unit;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The substrate processing unit is divided into two regions, the first processing unit and the second processing unit are opposed to each other, the first processing unit is disposed in one region, and the second processing unit is disposed in the other region. A substrate processing apparatus. The substrate processing apparatus according to claim 2,
A substrate processing apparatus, further comprising a partition wall between the two regions. In the substrate processing apparatus in any one of Claims 1-3,
The first processing unit dries a processing liquid processing unit that performs processing with a processing liquid on a plurality of substrates in a vertical posture and a plurality of substrates in a vertical posture processed by the processing liquid processing unit. A posture conversion mechanism capable of transferring a substrate between a drying processing unit and the transport mechanism, and performing posture conversion between a horizontal posture and a vertical posture with respect to a plurality of substrates, and the posture conversion A plurality of substrates can be transferred to and from the mechanism, and includes a first processing unit transport mechanism that transports the substrate between the processing liquid processing unit and the drying processing unit. Substrate processing equipment. In the substrate processing apparatus in any one of Claims 1-4,
The second processing unit includes a single wafer processing unit that processes the substrates one by one, and a second processing unit transport mechanism that transports the substrate between the transport mechanism and the single wafer processing unit. A substrate processing apparatus. The substrate processing apparatus according to claim 4,
The posture changing mechanism included in the first processing unit is a first posture changing mechanism,
The substrate processing unit is disposed on the opposite side to the transfer mechanism side, the substrate is transferred between the first processing unit and the second processing unit, and a plurality of substrates are perpendicular to a horizontal posture. A substrate processing apparatus, further comprising: a second posture conversion mechanism that collectively converts postures between postures. In the substrate processing apparatus in any one of Claims 1-6,
The substrate processing apparatus, wherein the transport mechanism transports a substrate processed by the first processing unit to the second processing unit. In the substrate processing apparatus in any one of Claims 1-7,
The substrate processing apparatus, wherein the transport mechanism transports a substrate processed by the second processing unit to the first processing unit.

Images