JPH10163292A - Treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a treating device which performs a series of treatment consisting of the application, exposure, and development of a photosensitive agent on a semiconductor substrate used for the manufacture of a semiconductor element, while the substrate is automatically transported and requires a small space factor in a clean room. SOLUTION: Substrate containers 5 each of which houses a plurality of semiconductor devices are placed in a line in a substrate housing section 1 which is elongated in one direction, and a first transportation path 6 is extended in a straight line along the section 1. A first transporting device 8, an application and development treating device 2, and an exposure treating device 3 are respectively provided on the first transporting path 6, adjacently to the side of the path 6 on the opposite side of the substrate housing section 1, and adjacently to one end of the path 6. The first transporting device 8 takes out the semiconductor substrates from the containers 5, and transports the substrates between the substrate housing section 1 and the application and development treating device 2, between the section 1 and the exposure treating device 3, and between the treating devices 2 and 3 in accordance with the progress of treatment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for performing a series of processes of applying a photosensitive agent, exposing and developing a semiconductor substrate used for manufacturing a semiconductor device by automatically transporting the semiconductor substrate.

[0002]

2. Description of the Related Art In general, photolithography is applied as a method for simultaneously forming a large number of semiconductor elements on a semiconductor substrate. In this photolithography, for example, a transparent portion (positive portion) that transmits light according to the pattern of an integrated circuit
After a mask made by photographic operation of an opaque part (negative part) that does not allow light to pass through, the mask is brought into close contact with the semiconductor substrate coated with the photosensitizer, or after a slight distance alignment, the ultraviolet light is applied to the semiconductor substrate. Is exposed through a mask. In addition, the photosensitive agent has a property of being insoluble in a developer when exposed to light. Therefore, when the photosensitive agent on the semiconductor substrate exposed through the mask is applied to the developer, only the photosensitive agent corresponding to the transparent portion (positive portion) of the mask remains on the semiconductor substrate, and the photosensitive agent similar to the pattern of the integrated circuit is exposed. A film of the agent is formed on the semiconductor substrate. The remaining photosensitive agent film is dried and cured (so-called baking treatment), and the adhesion and strength of the photosensitive agent film are increased so as to withstand the processing of the next step. Since the dimensional accuracy of a semiconductor element pattern formed on a semiconductor substrate depends on the transfer accuracy by photolithography, photolithography is a very important step in the manufacture of semiconductor elements.

The photolithography process for manufacturing the above-described semiconductor device is performed by a processing apparatus using an automatic transfer device. An example of a conventional processing apparatus is shown in FIG. In the conventional processing apparatus, as shown in FIG. 2, a plurality of substrate storage containers 105 storing a plurality of semiconductor substrates are arranged in a line in a longitudinal direction of the substrate storage unit 101 on a substrate storage unit 101 extending in one direction. The first transport path 106 extends in a straight line along the substrate storage unit 101. Further, a substrate transport path 118 extends in a straight line along the side of the substrate storage unit 101 opposite to the first transport path 106 side. An automatic transfer device (not shown) is disposed on the substrate transfer path 118, and transfers the substrate storage container 105 between the substrate storage unit 101 and another device or another storage unit (not shown). A first transfer device 108 is disposed on the first transfer path 106, moves to a target substrate storage container 105 by a command, and takes out the semiconductor substrate in the substrate storage container 105. A coating and developing processing apparatus 102, which is a first processing apparatus, is provided adjacent to a side of the first transport path 106 opposite to the substrate storage unit 101 side.

[0004] Further, the inside of the coating and developing apparatus 102 will be described.
The second transport path 107 extends straight in a direction orthogonal to the first transport path 106 so as to divide the inside of the printer 2 into two areas. In one area, a plurality of spin processing units 110 are arranged in a row in a direction parallel to the second transport path 107, and in the other area, a plurality of heat treatment units 111 are provided. Are arranged in a row in a direction parallel to On the second transport path 107, a second transport apparatus 109 is disposed, and the second transport apparatus 109 is configured to include the second transport path 107 and the first transport path 1
The semiconductor substrate is exchanged with the first transfer device 108 at a position where the reference numeral 06 is orthogonal, and the semiconductor substrate is transferred within the coating and developing treatment device 102 by moving along the second transfer path 107.

[0005] At the end of the second transport path 107 opposite to the first transport path 106, a fourth transport device 12 is provided.
An exposure processing apparatus 103, which is a second processing apparatus, is disposed via a delivery stage 120 provided with the first processing apparatus 1.

The exposure processing apparatus 103 will be described.
A substrate delivery port (not shown) is provided on a side surface of the exposure processing apparatus 103 that is in contact with the delivery stage 120, and a side surface of the exposure processing apparatus 103 having the substrate delivery port is orthogonal to the front face 116 of the exposure processing apparatus. The front face of the exposure processing apparatus 116 is an operation surface having operation switches and the like. The front face of the exposure processing apparatus 116 has a mask delivery port (not shown). A mask delivery unit 117 is provided inside the exposure processing apparatus 103. Conventionally, a mask is carried into or out of the mask delivery unit 117 through a mask delivery port by manual operation. A substrate receiving unit 112 and a substrate unloading unit 113 are arranged at a position near the substrate transfer port inside the exposure processing apparatus 103,
An exposure stage 1 is provided at a substantially central position of the exposure processing apparatus 103.
15 are installed. The third transfer device 114 for transferring the semiconductor substrate from the substrate receiving unit 112 to the exposure stage 115 and for transferring the semiconductor substrate from the exposure stage 115 to the substrate unloading unit 113 includes the exposure processing apparatus 10.
3 are arranged inside.

As a method of transferring a semiconductor substrate between transfer devices of a processing apparatus according to the prior art, a temporary placing table for semiconductor substrates is previously arranged at a transfer place between transfer devices, and a transfer device on the transfer side is used. Temporarily places the semiconductor substrate on the temporary storage table, and the transfer device on the receiving side takes the semiconductor substrate on the temporary storage table.

Here, the vertical movement range of each of the first to fourth transfer devices will be described. For example, 25 silicon substrates each having a diameter of 200 mm are stored in the substrate storage container 105 so as to overlap with each other, and the vertical difference between the top substrate and the 25th substrate from the top is 152.4 mm, and the second substrate is the second.
In order to transfer the substrate to and from the transfer device 109, the vertical movement range of the first transfer device 108 was set to 200 mm or less. In the second transfer device 109, the positions of the spin processing unit 110 and the heat treatment unit 111 are higher than the transfer positions of the substrates between the first transfer device 108 and the second transfer device 109. In addition, in order to transfer a substrate to and from the heat treatment unit 111 configured by arranging a plurality of heat treatment plates in a stacked manner, the vertical moving range of the second transfer device 109 is the first movement range.
50 upward from the substrate transfer position with the transfer device 108
0-700 mm is required. The second transfer device 109 is located at the lowermost position of the vertical movement range,
The substrate is placed on the transfer stage 20 and the substrate placed on the delivery stage 120 is received. The substrate receiving unit 112 and the substrate unloading unit 113 located at the same height as the exposure stage 115
00mm lower than the delivery stage 120
The fourth transfer device 121 for transferring from the substrate to the substrate receiving unit 112 and transferring from the substrate unloading unit 113 to the delivery stage 120 has a vertical movement range of 400
５００500 mm.

Next, the operation of the conventional processing apparatus configured as described above will be described. The substrate storage container 105 storing a plurality of semiconductor substrates is transferred by a substrate storage container transfer device (not shown) moving on the substrate transfer path 118 and is placed on the substrate storage unit 101. The first transfer device 108 takes out the semiconductor substrate from the substrate storage container 105 of the substrate storage unit 101 according to a preset condition, and transports the semiconductor substrate to the coating and developing processing device 102 to apply the photosensitive resin. The semiconductor substrate is transferred to the second transfer device 109 inside the development processing device 102. The second transfer device 109 that has received the semiconductor substrate transfers the semiconductor substrate to the spin processing unit 110. The semiconductor substrate that has been subjected to the photosensitive agent application processing in the spin processing unit 110 is transferred to the second transport device 1
In step 09, the semiconductor substrate is transported from the spin processing unit 110 to the heat treatment unit 111, where the pre-exposure baking of the semiconductor substrate is performed in the heat treatment unit 111, thereby stabilizing the photosensitive agent film on the semiconductor substrate. The semiconductor substrate that has been subjected to the pre-exposure baking is transported from the heat treatment section 111 to the delivery stage 120 by the second transport device 109, and is placed on the delivery stage 120. The semiconductor substrate on the transfer stage 120 is transferred by the fourth transfer device 121 to the substrate receiving portion 112 inside the exposure processing device 103 and is placed on the substrate receiving portion 112. The semiconductor substrate on the substrate receiving unit 112 is transported to the exposure stage 115 by the third transport unit 114 inside the exposure processing apparatus 103, and is exposed on the exposure stage 115 using a mask. The exposed semiconductor substrate is transported from the exposure stage 115 to the substrate discharging unit 113 by the third transfer device 114 and placed on the substrate discharging unit 113. The semiconductor substrate on the substrate payout unit 113 is
The semiconductor substrate on the transfer stage 120 is transferred to the heat treatment unit 111 by the second transfer device 109. In the heat treatment section 111, post-exposure baking of the semiconductor substrate is performed, and the photosensitizer after exposure is stabilized. The semiconductor substrate that has been subjected to the post-exposure baking is subjected to the heat treatment section 11 by the second transfer device 109.
1 to the spin processing unit 110,
Developed at 10. The developed semiconductor substrate is transported from the spin processing unit 110 to the first transport device 108 by the second transport device 109, and is transferred to the first transport device 108. The first transfer device 108 returns the transferred semiconductor substrate to the inside of the substrate storage container 105 in the substrate storage unit 101.

[0010]

However, in a conventional processing apparatus in which a semiconductor device is manufactured using a plurality of transfer devices, the size of a semiconductor substrate used for manufacturing the semiconductor device is increased. Each transfer device becomes larger in size for mounting the semiconductor substrate, and accordingly, the occupied area of each transfer path through which the semiconductor substrate is transferred is increased. As a result, the occupied area of the processing device is increased in the clean room, and the processing device is increased. However, there is a problem that the cost increases.

In a conventional processing apparatus, a mask used in an exposure stage is transferred by a mask transfer unit by manual operation or mechanical operation. In the future, automatic transfer of a mask will be considered. A mask transport path (see reference numeral 119 in FIG. 2) extending straight along the front of the exposure processing apparatus is provided in front of a certain front of the exposure processing apparatus. However, since the transfer path of the mask transfer path is orthogonal to the transfer path of the substrate transfer path, in order to share the transfer apparatus for the mask and the transfer apparatus for the substrate storage container with one transfer apparatus, the transfer path that moves linearly The transport path cannot be shared by the apparatus alone. If a transfer path for moving the transfer apparatus at a right angle according to the layout of each processing apparatus is formed, the cost of the semiconductor substrate transfer means increases, and the occupied area of the transfer path in a factory may increase.

An object of the present invention is to provide a processing apparatus that occupies a smaller area in a clean room when a semiconductor substrate used for manufacturing a semiconductor device is increased in size in view of the above-mentioned problems in the prior art. is there.

Another object of the present invention is to provide a processing apparatus having a smaller occupied area in a clean room in the automatic conveyance of a mask used for exposure, which will be studied in the processing apparatus in the future.

[0014]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a substrate accommodating portion accommodating a plurality of semiconductor substrates and extending in one direction, and a first linear extending along the substrate accommodating portion. A transport path, a first transport device that moves on the first transport path, and a first transport path that is disposed adjacent to a side of the first transport path opposite to the substrate storage unit side; That performs processing on semiconductor substrates transported by a transport device
And a substrate transfer port which is disposed adjacent to an end of the first transfer path and has a height different from a position at which the first processing apparatus transfers the semiconductor substrate with the first transfer apparatus. And a second processing device for performing processing on the semiconductor substrate transferred by the first transfer device, wherein the first transfer device includes the substrate storage unit and the first processing device. Transfer of the semiconductor substrate between the first and second processing units, transfer of the semiconductor substrate between the substrate storage unit and the second processing unit, and transfer of the semiconductor substrate between the first and second processing units. It is characterized by.

Further, the first processing apparatus has a second transfer apparatus for transferring a substrate to and from the first transfer apparatus and for automatically transferring a semiconductor substrate in the first processing apparatus. A process of applying a photosensitive agent, a process of developing the exposed semiconductor substrate, and a heat treatment of the semiconductor substrate, wherein the second processing apparatus performs exposure of the semiconductor substrate using a mask. Is preferred.

Further, the first transfer device transfers the semiconductor substrate between the substrate storage unit and the second processing device, if necessary, independently of the operation of the second transfer device. Is preferred.

Further, the first transporting device is provided with the first transporting device.
Alternatively, the processing function for the semiconductor substrate is lost when one of the second processing devices performs a human or automated recovery process for maintaining the function, and when a failure occurs in the function. It is preferable that the semiconductor substrate is transported between one of the devices that has not been moved and the substrate storage unit.

Further, since the semiconductor substrate is transported to and from the processing apparatus in another process, the substrate storage section is provided on a side of the substrate storage section opposite to the first transfer path. The second processing apparatus includes a mask transfer port, and the mask transfer port extends linearly along a side surface of the second processing apparatus provided with the mask transfer port. It is preferable that the substrate transport path and the mask transport path are configured to be parallel or co-linear with each other.

In the invention as described above, the first and the second
Each of the processing apparatuses is disposed adjacent to a first transfer path extending straight along the substrate storage section, and the first storage apparatus moves on the first transfer path and the substrate storage section and the first processing apparatus are respectively disposed.
The transfer of the semiconductor substrate is performed between the first processing device, the substrate storage section and the second processing device, and between the first and second processing devices. Therefore, even if the transfer position of the semiconductor substrate between the first transfer device and the first processing device is different from the height of the substrate transfer port of the second transfer device, the semiconductor device is vertically transferred to the first transfer device. By providing the function of moving the substrate, the semiconductor substrate can be transferred between the first and second processing apparatuses.

The first processing device performs a process of applying a photosensitive agent, a process of developing the exposed semiconductor substrate, and a heat treatment of the semiconductor. In addition, the second processing device is provided in the first processing device. A transport device is disposed, and the second transport device is the first transport device.
The first processing apparatus is configured to transfer the semiconductor substrate within the first processing apparatus by exchanging the semiconductor substrate with the transfer apparatus. Further, since the second processing apparatus performs processing for exposing a semiconductor substrate through a mask, a series of processing for manufacturing a semiconductor element described below is performed. The semiconductor substrate accommodated in the substrate accommodating section is transported by the first transport device to the first processing device, where a photosensitive agent is applied in the first processing device and subjected to heat treatment. The semiconductor substrate coated with the photosensitive agent in the first processing device is transported from the first processing device to the second processing device by the first transport device,
Exposure is performed through a mask in a second processing apparatus. The semiconductor substrate exposed by the second processing device is transported again from the second processing device to the first processing device by the first transport device,
It is developed in a second processing device and subjected to a heat treatment. The semiconductor substrate developed by the first processing device is transported from the first processing device to the substrate storage by the first transfer device, and stored again in the substrate storage. Through this series of processes, a film of a photosensitive agent similar to the pattern of the integrated circuit is formed on the semiconductor substrate.

Furthermore, the first transfer device transfers the semiconductor substrate between the substrate storage unit and the second processing device as necessary, regardless of the operation of the second transfer device. A plurality of semiconductor substrates that have been processed before the processing performed by the processing apparatus are stored in the substrate storage unit in advance, and only the semiconductor substrate is moved by the first transfer device between the substrate storage unit and the second storage unit. Transfer of the semiconductor substrate to and from the processing apparatus.
Therefore, aside from the second transfer device transferring the semiconductor substrate in the first processing device and performing the processing for manufacturing the semiconductor device in the first processing device, the semiconductor device is processed in the second processing device. Processing for manufacturing an element can be performed, and a processing apparatus with high flexibility in apparatus operation can be realized.

Further, when performing a human or automated recovery process for maintenance of functions such as maintenance and inspection in one of the first and second processing units, and
When a failure occurs in a function, when a semiconductor substrate that can be processed by another apparatus having a processing function is present in the substrate storage unit, the semiconductor substrate that can be processed is transferred to the substrate storage unit by the first transfer device. Can be transported to and from another device having a processing function.

Further, the substrate storage section has a substrate transfer path extending straight along a side of the substrate storage section opposite to the first transfer path side, and the second processing apparatus includes a mask transfer port. A mask transfer path extending straight along the side surface of the second processing apparatus provided with a mask transfer port, and the substrate transfer path and the mask transfer path are parallel or co-linear. A processing device is configured. Therefore, the semiconductor substrate and the mask are transported from another apparatus or another storage location on the substrate transport path and the mask transport path, which are transport paths parallel to each other, or the semiconductor substrate and the mask are transported on the same transport path. Transported from equipment or other storage locations. At this time,
When the substrate transport path and the mask transport path are parallel to each other, the layout of the processing apparatus in the factory becomes easy so that the two transport paths of the substrate transport path and the mask transport path do not interfere with each other. When the substrate transport path and the mask transport path are on the same straight line, a processing apparatus having a small occupied area can be configured.

[0024]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic structural view showing one embodiment of the processing apparatus of the present invention. The coating and developing processing apparatus used in this embodiment and the exposure processing apparatus used in the conventional processing apparatus are used. The equivalent is used.

As shown in FIG. 1, in the processing apparatus of this embodiment, substrate storage containers 5 storing a plurality of semiconductor substrates are arranged in a row in the longitudinal direction of the substrate storage portion 1 in a substrate storage portion 1 extending in one direction. The first transport path 6 extends in a straight line along the substrate storage unit 1. A first transfer device 8 is arranged on the first transfer path 6, and the first transfer device 8 linearly moves on the first transfer path 6 to reach the target substrate storage container 5. Then, the semiconductor substrate contained in the substrate container 5 is taken out. On the side of the first transport path 6 opposite to the substrate mounting section 1 side, a coating and developing processing apparatus 2 which is a first processing apparatus is disposed adjacent to the first transport path 6. Exposure processing apparatus 3 as a second processing apparatus is disposed adjacent to the end of. A substrate transport path 18 extends in a straight line along a side of the substrate storage unit 1 opposite to the first transport path 6 and is illustrated by an automatic transport device (not shown) moving on the substrate transport path 18. The substrate storage container 5 is transported between the substrate storage unit 1 and another storage unit or another processing device that is not present.

Further, the inside of the coating and developing treatment apparatus 2 will be described. The second transporting path 7 is moved relative to the first transporting path 6 so as to divide the inside of the coating and developing processing apparatus 2 into two areas. It extends in a straight line in a direction orthogonal to the direction. In one area, a plurality of spin processing units 10 are arranged in a row in a direction parallel to the second transport path 7, and in the other area, a plurality of heat treatment units 11 are provided in the second transport path 7. Are arranged in a row in a direction parallel to A second transfer device 9 is arranged on the second transfer path 7, and the second transfer device 9 is located at a position where the second transfer path 7 and the first transfer path 6 are orthogonal to each other. The transfer of the semiconductor substrate to and from the first transfer device 8 is performed, and the semiconductor substrate is transferred in the coating and developing treatment device 2 by moving along the second transfer path 7.

The exposure processing apparatus 3 will be described.
A substrate delivery port (not shown) is provided on a side surface of the exposure processing apparatus 3 which is in contact with the transfer path 6 of the exposure processing apparatus 3. The side face of the exposure processing apparatus 3 having the substrate delivery port is orthogonal to the front face 16 of the exposure processing apparatus. I have. The front face 16 of the exposure processing apparatus is an operation surface having operation switches and the like, and the front face 16 of the exposure processing apparatus has a mask delivery port (not shown). A mask delivery unit 17 is provided inside the exposure processing apparatus 3, and conventionally,
The mask is manually carried into the mask delivery unit 17 through the mask delivery port, or the mask delivery unit 17
Has been carried out from. A substrate receiving unit 12 and a substrate unloading unit 1 are located inside the exposure processing apparatus 3 near the substrate delivery port.
And an exposure stage 15 is installed at a substantially central position of the exposure processing apparatus 3. A third transfer device 14 for transferring the semiconductor substrate from the substrate receiving unit 12 to the exposure stage 15 and transferring the semiconductor substrate from the exposure stage 15 to the substrate unloading unit 13 is disposed inside the exposure processing apparatus 3. I have.

As a method of transferring a semiconductor substrate between the transfer devices used in the processing apparatus of the present embodiment, a temporary placing table of the semiconductor substrate is previously arranged at a transfer place between the transfer devices, and a transfer side of the transfer side is used. The transfer device temporarily places the semiconductor substrate on the temporary placing table, and the receiving transfer device takes the semiconductor substrate on the temporary placing table.

In this embodiment, as described above, the same coating and developing processing apparatus 2 and exposure processing apparatus 3 as those used in the conventional processing apparatus are used.
The vertical moving range and the heights of the substrate receiving portion 12 and the substrate discharging portion 13 are the same as those of the corresponding conventional devices, and the vertical moving range of the second transfer device 9 is 500 to 700 mm. The substrate receiving unit 12 and the substrate unloading unit 13 are located at a height lower by 400 to 500 mm from the lowermost position of the vertical movement range of the second transfer device 9.
Accordingly, the first transfer device 8 transfers the semiconductor substrate to and from the second transfer device 9 and transfers the semiconductor substrate at the substrate receiving unit 12 and the substrate unloading unit 13. 500 mm. In this manner, the coating and developing treatment apparatus 2 and the exposure processing apparatus 3 are not adjacent to each other, and the transfer of the semiconductor substrate between the coating and developing processing apparatus 2 and the exposure processing apparatus 3 is performed via the first transfer device 8. This eliminates the need for an automatic transport device disposed between the coating and developing processing apparatus of the conventional processing apparatus and the exposure processing apparatus, and the processing apparatus of the present embodiment is more efficient than the conventional processing apparatus. In this case, the number of the automatic transfer devices is reduced by one. In the substrate storage container 5, 25 semiconductor substrates are stored side by side in a vertical direction in parallel with each other.
It suffices that the 25th semiconductor substrate from the top located at a position lower by 152.4 mm from the uppermost semiconductor substrate is within the range of 400 to 500 mm, which is the vertical movement range of the first transfer device 8.

Next, the operation of the processing apparatus of this embodiment configured as described above will be described. The substrate storage container 5 containing a plurality of semiconductor substrates is transferred by a substrate storage container transfer device (not shown) moving on the substrate transfer path 18 and placed on the substrate mounting portion 1. The first transfer device 8 takes out the semiconductor substrate from the substrate storage container 5 of the substrate mounting portion 1 according to a preset condition, transfers the semiconductor substrate, and applies the photosensitive resin to the inside of the coating and developing treatment device 2 to apply the photosensitive resin. The semiconductor substrate is transferred to the second transfer device 9. The second transfer device 9 that has received the semiconductor substrate transfers the semiconductor substrate to the spin processing unit 10. The semiconductor substrate is HMDS to improve the adhesion between the semiconductor substrate and the photosensitive agent in the spin processing unit 10.
After being treated with (hexamethylenedisilane) vapor, a photosensitive agent is applied to the semiconductor substrate. The semiconductor substrate that has been subjected to the photosensitive agent coating process is transported from the spin processing unit 10 to the heat treatment unit 11 by the second transport device 9, where the semiconductor substrate is baked before exposure in the heat treatment unit 11, and the photosensitive agent on the semiconductor substrate is exposed. Is appropriately cured and stabilized. The semiconductor substrate that has been subjected to the pre-exposure baking is transferred from the heat treatment section 11 to the first transfer device 8 by the second transfer device 9 and transferred to the first transfer device 8. The first transfer device 8 transfers the received semiconductor substrate to the substrate receiving unit 12, and places the semiconductor substrate on the substrate receiving unit 12. Substrate receiving part 12
The upper semiconductor substrate is transferred from the substrate receiving section 12 to the exposure stage 15 by the third transfer device 14 inside the exposure processing apparatus 3, and the semiconductor substrate is exposed on the exposure stage 15 using a mask. The exposed semiconductor substrate is transferred from the exposure stage 15 to the substrate delivery unit 13 by the third transfer device 14.
And is placed on the substrate payout unit 13. The semiconductor substrate on the substrate unloading section 13 is transported by the first transport device 8 to the second transport device 9 and delivered to the second transport device 9. The second transfer device 9 transfers the received semiconductor substrate to the heat treatment unit 11 where the semiconductor substrate is subjected to post-exposure baking. The semiconductor substrate that has been subjected to the post-exposure baking is transferred from the heat treatment unit 11 to the spin processing unit 10 by the second transfer device 2 and developed by the spin processing unit 10. The developed semiconductor substrate is transferred to the second transfer device 2
Then, the semiconductor substrate is transported from the spin processing unit 10 to the heat treatment unit 11 again, and the semiconductor substrate is baked after development in the heat treatment unit 11 to stabilize the pattern of the photosensitive agent formed on the semiconductor substrate after development. The semiconductor substrate that has been completely processed by this processing apparatus is transferred from the heat treatment section 11 to the first transfer apparatus 8 by the second transfer apparatus 9, and the first transfer apparatus 8 receives the semiconductor substrate from the second transfer apparatus 9. The returned semiconductor substrate is returned to the inside of the substrate storage container 5 on the substrate storage unit 1.

As described above, a photosensitive agent film having a pattern corresponding to an integrated circuit is formed on a semiconductor substrate by using the processing apparatus of the present embodiment. In the embodiment, the number of transfer devices is one less, and the occupation area of the processing device in the clean room is smaller than that of the conventional processing device. In addition, since the number of the transfer devices is one, even if the size of the semiconductor substrate is increased, the increase in the occupation area of the processing device due to the increase in the size of the transfer device accompanying the increase in the size of the semiconductor substrate is suppressed.

In the above description of the operation of the processing apparatus, a series of steps up to the end of processing of one semiconductor substrate has been described. In the present embodiment, however, the first step extending along the substrate storage 1 is described.
Since the coating and developing processing apparatus 2 and the exposure processing apparatus 3 are adjacent to the transfer path 6, the semiconductor substrate is stored before the semiconductor substrate is transferred to the exposure processing apparatus 3 after completing the coating and pre-exposure baking processing. The semiconductor substrate can be temporarily returned to the substrate storage container 5 of the part 1. Alternatively, the semiconductor substrate can be temporarily returned to the substrate storage container 5 of the substrate storage unit 1 even before the semiconductor substrate is exposed inside the exposure processing apparatus 3 and transported to the coating and developing processing apparatus 2. For example, after the coating and pre-exposure baking processes have been completed, the first transfer device 8 transfers the plurality of semiconductor substrates previously stored in the substrate storage unit 1 to the exposure processing device 3 irrespective of the operation of the second transfer device 9. Only the transfer may be performed, and a processing apparatus with high flexibility in the operation of the apparatus can be realized.

When one of the coating and developing processing apparatus 2 and the exposure processing apparatus 3 performs a human or automated recovery processing for maintaining functions, such as maintenance and inspection, and The function of the device may be lost, for example, when some trouble occurs in the function. In this case, the semiconductor substrate which is ready to be processed by the other device having the function is transferred between the substrate storage unit 1 and the other device having the function by the first transfer device 8. And a device having a function is operated, thereby enabling a processing device with high production efficiency.

In the processing apparatus of the present embodiment, the transport of the mask used in the exposure stage 15 is not automated,
This is performed by a human operation or a human operation. In mask replacement, a mask storage container (not shown) storing a plurality of masks is transported to the mask delivery unit 17. However, in the future, automatic transfer of a mask will be considered, and a mask transfer path 19 for moving a mask transfer device (not shown) for transferring a mask storage container is provided with an exposure process provided with a mask transfer unit 17. It will extend straight along the apparatus front 16. In this case, the mask transport path 19 is
, The mask transport path 19 does not easily interfere with the substrate transport path 18, and the mask transport path 19 is easily assembled. In addition, in order to share the transfer device for the mask and the transfer device for the substrate storage container with one transfer device, it is also possible to consider sharing the substrate transfer path 18 and the mask transfer path 19 as one. Increased layout flexibility within.

In the processing apparatus according to the present embodiment, the coating and developing processing apparatus 2 and the exposure processing apparatus 3 are adjacent to the first transport path 6 extending along the substrate storage section 1, and Since the substrate is directly transported to the coating and developing processing apparatus 2 and the exposure processing apparatus 3, the mask is stored in the substrate storing section 1 and the mask is transported along the same transport path as the semiconductor substrate during automatic transport of the mask. Automatic transfer from the substrate storage unit 1 to the exposure processing apparatus 3 is possible.

Further, in the processing apparatus of the present embodiment, the first
Although the exposure processing apparatus 3 is adjacent to the end of the transfer apparatus 6, the exposure processing apparatus 3 may be adjacent to either end of the first transfer apparatus 6. Alternatively, the coating and developing processing apparatus 2 may be adjacent to an end of the first transport path 6 and the exposure processing apparatus 3 may be adjacent to the other end of the first transport path. What is necessary is just to configure the processing device according to the shape and size of each device so that the devices can be efficiently arranged.

[0038]

As described above, according to the present invention, in a processing apparatus used for manufacturing a semiconductor device and in which a semiconductor substrate is automatically transferred, a coating and developing processing apparatus as a first processing apparatus, An exposure apparatus and a processing apparatus, which are processing apparatuses, are respectively disposed adjacent to a first transport path extending linearly along the substrate storage section, and the substrate storage section is moved by the first transport apparatus moving on the first transport path. And the first processing device, between the substrate storage unit and the second processing device, the first and second processing devices.
The transfer of the semiconductor substrate is performed between the processing apparatuses. Thereby, even if the transfer position of the substrate between the first transfer device and the first processing device is different from the substrate transfer port which is the transfer position of the substrate of the second processing device, the first and the second transfer positions are different. In the vertical direction between the substrate transfer positions of the second processing apparatus, the first
The transfer device for transferring the semiconductor substrate does not require a dedicated transfer device for transferring the semiconductor substrate from the first processing device to the second processing device as in the conventional processing device.
Therefore, the present invention has an effect of realizing a processing apparatus in which the occupation area of the processing apparatus in the clean room is small and the cost is reduced as compared with the conventional processing apparatuses.

Further, since the processing apparatus is arranged as described above, not only is a series of processing performed for each semiconductor substrate, but also the semiconductor substrate, which has been processed by the first or second processing apparatus, is processed. After being stored in the storage section, the first transport device
Alternatively, the semiconductor substrate can be transferred to only one of the second processing apparatuses and only one processing can be performed, which has an effect of increasing the flexibility of apparatus operation.

Further, there is provided a mask transfer path extending in a straight line along the exposure processing apparatus, and a substrate transfer path for transferring the semiconductor substrate between the processing apparatus in another process and the substrate storage container;
By configuring the processing apparatus so that the mask transport path is parallel to the mask transport path, the substrate transport path and the mask transport path are less likely to interfere. In addition, in order to combine and share the substrate transfer device and the mask transfer device into one, it is also possible to consider sharing and sharing the substrate transfer path and the mask transfer path into one transfer path. This has the effect of improving the flexibility of the layout of the transport path.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a processing apparatus showing an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of a processing apparatus according to a conventional technique.

DESCRIPTION OF SYMBOLS 1, 101 Substrate storage unit 2, 102 Coating and development processing device 3, 103 Exposure processing device 5, 105 Substrate storage container 6, 106 First transport path 7, 107 Second transport path 8, 108 First transfer device 9, 109 Second transfer device 10, 110 Spin processing unit 11, 111 Heat treatment unit 12, 112 Substrate receiving unit 13, 113 Substrate unloading unit 14, 114 Third transfer device 15, 115 Exposure stage 16 , 116 Exposure processing apparatus front face 17, 117 Mask transfer section 18, 118 Substrate transfer path 19, 119 Mask transfer path 120 Transfer stage 121 Fourth transfer apparatus

Claims (5)

[Claims] 1. A substrate accommodating portion, in which a plurality of semiconductor substrates are accommodated and extending in one direction, a first transport path extending straight along the substrate accommodating portion, and a first moving path moving on the first transport path. And a semiconductor device transported by the first transport device and disposed adjacent to a side of the first transport path opposite to the substrate storage unit side. A first processing device, which is disposed adjacent to an end of the first transport path;
A processing apparatus provided with a substrate transfer port at a height different from a position where the semiconductor substrate is transferred between the first transfer apparatus and the second transfer apparatus for performing processing on the semiconductor substrate transferred by the first transfer apparatus. A processing device, wherein the first transfer device transfers a semiconductor substrate between the substrate storage unit and the first processing device, and a semiconductor substrate between the substrate storage unit and the second processing device. And a transfer of the semiconductor substrate between the first and second processing apparatuses. 2. The first processing device includes a second transfer device that exchanges a substrate with the first transfer device and that automatically transfers a semiconductor substrate within the first processing device. A process of applying a photosensitive agent, a process of developing the exposed semiconductor substrate, and a heat treatment of the semiconductor substrate, wherein the second processing apparatus performs exposure of the semiconductor substrate using a mask, The processing device according to claim 1. 3. The first transfer device transfers a semiconductor substrate between the substrate storage unit and the second processing device as necessary, irrespective of the operation of the second transfer device. The processing device according to claim 2. 4. The first transfer device is configured to perform a human or automated recovery process for maintaining a function in one of the first and second processing devices, and to perform some function on the function. 4. The process according to claim 1, wherein when a failure occurs, the semiconductor substrate is transported between the one device in which the processing function for the semiconductor substrate is not lost and the substrate storage unit. apparatus. 5. The substrate storage section is provided on a side of the substrate storage section opposite to the first transfer path, since the semiconductor substrate is transferred to and from a processing apparatus in another process. The second processing apparatus includes a mask transfer port, and the mask transfer port extends linearly along a side surface of the second processing apparatus provided with the mask transfer port. A path, wherein the substrate transport path and the mask transport path are parallel or
5. The method of claim 2, 3 or 4, wherein the lines are arranged so as to be on the same straight line.
A processing device according to claim 1.