CN114068365A - Wet method equipment for supercritical cleaning and working method thereof - Google Patents

Wet method equipment for supercritical cleaning and working method thereof Download PDF

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Publication number
CN114068365A
CN114068365A CN202111301066.0A CN202111301066A CN114068365A CN 114068365 A CN114068365 A CN 114068365A CN 202111301066 A CN202111301066 A CN 202111301066A CN 114068365 A CN114068365 A CN 114068365A
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wafer
module
cleaning
wet method
mounting bracket
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CN202111301066.0A
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Chinese (zh)
Inventor
陈新来
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Shanghai Zhilin Semiconductor Technology Co ltd
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Shanghai Zhilin Semiconductor Technology Co ltd
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Priority to CN202111301066.0A priority Critical patent/CN114068365A/en
Publication of CN114068365A publication Critical patent/CN114068365A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses wet equipment for supercritical cleaning and a working method thereof, wherein the wet equipment comprises: a storage mechanism in which the wafer is placed; the first transmission mechanism is arranged on one side of the storage mechanism; the cleaning module is arranged on one side of the first transmission mechanism, which is far away from the storage mechanism; the drying module is arranged on one side, away from the storage mechanism, of the first transmission mechanism, and the drying module and the cleaning module are arranged oppositely; and the second transmission mechanism is arranged between the cleaning module and the drying module, and one end of the second transmission mechanism is close to the first transmission mechanism. By applying the equipment provided by the invention, the wafer can be stably and efficiently cleaned and dried, the equipment can be combined with a wet process for cleaning the wafer, the stability and the high efficiency of the wafer in a transfer process are ensured, the production efficiency of the wafer is further improved, and the cleaning and drying quality of the wafer is ensured.

Description

Wet method equipment for supercritical cleaning and working method thereof
Technical Field
The invention relates to the technical field of wafer cleaning equipment, in particular to wet equipment for supercritical cleaning and a working method thereof.
Background
With the continuous progress of wafer technology, the cleaning and drying work on the surface of the wafer is very important, and especially for protecting the patterned structure on the surface of the wafer in the whole cleaning and drying process, the wet process is commonly adopted to perform the corresponding cleaning and drying work on the surface of the wafer, and in this regard, the design layout of the corresponding cleaning and drying equipment relates to how to further ensure the cleaning and drying quality of the wafer. For the existing cleaning and drying equipment, reasonable placement of the wafer before cleaning is often lacked, and rapid and efficient transfer of the wafer between the cleaning equipment and the drying equipment is also lacked, so that the production efficiency of the wafer is further reduced, and the cleaning and drying quality of the wafer is also influenced.
Disclosure of Invention
In view of the above, in order to solve the above problems, the present invention provides a wet method apparatus for supercritical cleaning, comprising:
the storage mechanism is used for placing the wafer;
the first transmission mechanism is arranged on one side of the storage mechanism;
the cleaning module is arranged on one side, away from the storage mechanism, of the first transmission mechanism;
the drying module is arranged on one side, away from the storage mechanism, of the first transmission mechanism, and the drying module and the cleaning module are arranged oppositely;
the second transmission mechanism is arranged between the cleaning module and the drying module, and one end of the second transmission mechanism is close to the first transmission mechanism.
In another preferred embodiment, the method further comprises: a buffer stage disposed between the first transport mechanism and the second transport mechanism, the buffer stage having the wafer operably disposed thereon.
In another preferred embodiment, the storage mechanism and the first conveying mechanism are arranged to extend along a first direction, and the cleaning module, the drying module and the second conveying mechanism are arranged to extend along a second direction, and the first direction is perpendicular to the second direction.
In another preferred embodiment, the storage mechanism comprises: first mounting bracket, holding storehouse, wafer box and door subassembly, first mounting bracket is followed first direction extends the setting, and is a plurality of the holding storehouse is followed first direction install in proper order in on the first mounting bracket, each a wafer box has all been placed in the holding storehouse, each a plurality of have all been placed in the wafer box wafer, each the holding storehouse is close to one side of first transmission device all installs one the door subassembly, the door subassembly is used for opening or closing the holding storehouse.
In another preferred embodiment, the first transmission mechanism includes: second mounting bracket, first horizontal carriage, first crane, first installation department and first centre gripping robot, the second mounting bracket is followed first direction extends the setting, first horizontal carriage can be followed first direction movably install in on the second mounting bracket, first crane liftable install in on the first horizontal carriage, first installation department install in on the first crane, first centre gripping robot install in on the first installation department, first centre gripping robot is used for pressing from both sides and gets the wafer.
In another preferred embodiment, the second transfer mechanism includes: third mounting bracket, second horizontal carriage, second crane, second installation department and second centre gripping robot, the third mounting bracket is followed the second direction extends the setting, the horizontal carriage of second can follow the second direction install with removing on the second mounting bracket, the second crane install with liftable in on the horizontal carriage of second, the second installation department install in on the second crane, second centre gripping robot install in on the second installation department, second centre gripping robot is used for pressing from both sides and gets the wafer.
In another preferred embodiment, the second transfer mechanism further comprises: the movable base is installed at the bottom of the third installation frame and used for driving the third installation frame to move along the second direction.
In another preferred embodiment, the first and second gripping robots each include: the mobile module is installed on the first installation portion or the second installation portion, the first mobile portion and the second mobile portion are movably installed on the mobile module, the moving direction of the first mobile portion is parallel to the moving direction of the second mobile portion, the first clamping mechanism is installed on the first mobile portion, and the second clamping mechanism is installed on the second mobile portion.
In another preferred embodiment, the method further comprises: the first rotating mechanism is installed at the lower end of the mobile module and connected with the first installation part or the second installation part, the first rotating mechanism is used for driving the mobile module to rotate, and the rotating shaft of the mobile module is arranged along the vertical direction.
The invention also aims to provide a working method of the wet equipment for supercritical cleaning, which comprises the wet equipment for supercritical cleaning, and comprises the following steps:
step S1, placing a plurality of wafers into the storage mechanism;
step S2, closing the storage mechanism and blowing nitrogen into the storage mechanism;
step S3, opening the storage mechanism;
step S4, taking out the wafers in the storage mechanism by the first transport mechanism;
step S5, the wafer taken out by the first conveying mechanism is sent to a position between the cleaning module and the drying module by the second conveying mechanism;
step S6, the wafer is sent into the cleaning module through the second transmission mechanism for cleaning;
step S7, the cleaned wafer is sent into the drying module through the second transmission mechanism to be dried;
in step S8, the wafer that has been dried is taken out by the second transfer mechanism.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following positive effects: by applying the equipment provided by the invention, the wafer can be stably and efficiently cleaned and dried, the equipment can be combined with a wet process for cleaning the wafer, the stability and the high efficiency of the wafer in a transfer process are ensured, the production efficiency of the wafer is further improved, and the cleaning and drying quality of the wafer is ensured.
Drawings
FIG. 1 is a schematic overall view of a wet method apparatus for supercritical cleaning according to the present invention;
FIG. 2 is a schematic layout of a wet equipment for supercritical cleaning according to the present invention;
FIG. 3 is a schematic view of a storage mechanism of a wet method apparatus for supercritical cleaning according to the present invention;
FIG. 4 is a schematic view of a first holding robot of the wet method apparatus for supercritical cleaning according to the present invention;
FIG. 5 is a schematic diagram of the arrangement of a second conveying mechanism of the wet method equipment for supercritical cleaning of the invention;
FIG. 6 is a schematic diagram of the second conveying mechanism of the wet equipment for supercritical cleaning of the present invention being fitted between the cleaning module and the drying module;
FIG. 7 is a schematic view of a cleaning unit of a wet method apparatus for supercritical cleaning according to the present invention;
fig. 8 is a schematic view of a drying unit of a wet process apparatus for supercritical cleaning according to the present invention.
In the drawings:
1. a storage mechanism; 2. a wafer; 3. a first transmission mechanism; 4. cleaning the module; 5. a drying module; 6. a second transport mechanism; 7. a buffer table; 11. a first mounting bracket; 12. a storage bin; 13. a wafer cassette; 14. a door assembly; 31. a second mounting bracket; 32. a first horizontal carriage; 33. a first lifting frame; 34. a first mounting portion; 35. a first holding robot; 61. a third mounting bracket; 62. a second horizontal carriage; 63. a second lifting frame; 64. a second mounting portion; 65. a second holding robot; 81. a moving module; 82. a first gripper mechanism; 83. a second gripper mechanism; 84. a first rotating mechanism; 85. a second rotating mechanism; 41. a fourth mounting bracket; 42. a cleaning unit; 43. a cleaning table; 44. cleaning the tube; 45. cleaning the exhaust device; 46. an exhaust pipe; 47. a guard plate; 51. a fifth mounting bracket; 52. a drying unit; 53. a support frame; 54. an upper cavity; 55. a lower cavity; 56. a fluid line; 9. a chemical supply device.
Detailed Description
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
As shown in fig. 1 to 8, there is shown a wet method apparatus for supercritical cleaning of a preferred embodiment, including: a storage mechanism 1, wherein a wafer 2 is placed in the storage mechanism 1; the first transmission mechanism 3, the first transmission mechanism 3 is arranged at one side of the storage mechanism 1; the cleaning module 4 is arranged on one side, far away from the storage mechanism 1, of the first transmission mechanism 3; the drying module 5 is arranged on one side, away from the storage mechanism 1, of the first transmission mechanism 3, and the drying module 5 and the cleaning module 4 are arranged oppositely; and the second transmission mechanism 6 is arranged between the cleaning module 4 and the drying module 5, and one end of the second transmission mechanism 6 is arranged close to the first transmission mechanism 3. Furthermore, the first transmission mechanism 3 and the second transmission mechanism 6 form the connection with the whole wet equipment, so that the wafer 2 can be quickly and stably transferred among all components, and the cleaning efficiency and quality of the wafer are improved.
Further, as a preferred embodiment, the method further comprises: a buffer table 7, the buffer table 7 being disposed between the first transfer mechanism 3 and the second transfer mechanism 6, the buffer table 7 being operable to place the wafer 2 thereon.
Further, as a preferred embodiment, the buffer table 7 may be provided with a support structure for supporting the wafer to be placed; in another embodiment, the buffer stage 7 may also be provided with a plurality of air holes through which the air flow is ejected to form a suspended temporary support for the wafer 2.
Further, as a preferred embodiment, the storage mechanism 1 and the first conveying mechanism 3 are both disposed to extend along a first direction, the cleaning module 4, the drying module 5 and the second conveying mechanism are all disposed to extend along a second direction, and the first direction is perpendicular to the second direction.
Further, as a preferred embodiment, the storage mechanism 1 includes: first mounting bracket 11, holding storehouse 12, wafer box 13 and door subassembly 14, first mounting bracket 11 extends the setting along the first direction, and a plurality of holding storehouses 12 are installed in proper order on first mounting bracket 11 along the first direction, and a wafer box 13 has all been placed in each holding storehouse 12, has all placed a plurality of wafers 2 in each wafer box 13, and a door subassembly 14 is all installed to one side that each holding storehouse 12 is close to first transmission device 3, and door subassembly 14 is used for opening or closing holding storehouse 12.
Further, as a preferred embodiment, the door assembly 14 is a power door that slides up and down to open and close.
Further, as a preferred embodiment, the first transmission mechanism 3 includes: the wafer clamping device comprises a second mounting frame 31, a first horizontal sliding frame 32, a first lifting frame 33, a first mounting portion 34 and a first clamping robot 35, wherein the second mounting frame 31 extends along a first direction, the first horizontal sliding frame 32 can be movably mounted on the second mounting frame 31 along the first direction, the first lifting frame 33 can be arranged on the first horizontal sliding frame 32 in a lifting mode, the first mounting portion 34 is mounted on the first lifting frame 33, the first clamping robot 35 is mounted on the first mounting portion 34, and the first clamping robot 35 is used for clamping a wafer 2.
Further, as a preferred embodiment, the second transmission mechanism 6 includes: the wafer clamping device comprises a third mounting rack 61, a second horizontal sliding frame 62, a second lifting frame 63, a second mounting part 64 and a second clamping robot 65, wherein the third mounting rack 61 extends along the second direction, the second horizontal sliding frame 62 can be movably mounted on the second mounting rack 31 along the second direction, the second lifting frame 63 can be arranged on the second horizontal sliding frame 62 in a lifting mode, the second mounting part 64 is mounted on the second lifting frame 63, the second clamping robot 65 is mounted on the second mounting part 64, and the second clamping robot 65 is used for clamping the wafer 2.
Further, as a preferred embodiment, the second transmission mechanism 6 further includes: and the moving base is installed at the bottom of the third mounting frame 61 and is used for driving the third mounting frame 61 to move along the second direction.
Further, as a preferred embodiment, each of the first holding robot 35 and the second holding robot 65 includes: the moving module 81 is mounted on the first mounting portion 34 or the second mounting portion 64, the first moving portion and the second moving portion are movably mounted on the moving module 81, the moving direction of the first moving portion is parallel to the moving direction of the second moving portion, the first clamping mechanism 82 is mounted on the first moving portion, and the second clamping mechanism 83 is mounted on the second moving portion.
Further, as a preferred embodiment, each of the first holding robot 35 and the second holding robot 65 further includes: the first rotating mechanism 84 is mounted at the lower end of the moving module 81, the first rotating mechanism 84 is connected with the first mounting portion 34 or the second mounting portion 64, the first rotating mechanism 84 is used for driving the moving module 81 to rotate, and a rotating shaft of the moving module 81 is arranged along the vertical direction.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope and the implementation manner of the present invention.
The present invention also has the following embodiments in addition to the above:
in a further embodiment of the present invention, the first clamping mechanism 82 and the second clamping mechanism 83 are respectively provided with air power holes which are arranged vertically and symmetrically, and the air power holes eject airflow with appropriate strength to clamp the wafer 2, so that the first clamping mechanism 82 or the second clamping mechanism 83 can bear the wafer 2 without contact.
In a further embodiment of the invention, the first gripper robot 35 and the second gripper robot 65 each further comprise: two second rotary mechanisms 85, two second rotary mechanisms 85 are respectively installed on the first moving portion and the second moving portion, two second rotary mechanisms 85 are respectively connected with the first clamping mechanism 82 and the second clamping mechanism 83, two second rotary mechanisms 85 are respectively used for driving the first clamping mechanism 82 and the second clamping mechanism 83 to rotate, and a rotary shaft of the first clamping mechanism 82 and a rotary shaft of the second clamping mechanism 83 are both arranged along the vertical direction.
In a further embodiment of the present invention, the cleaning module 4 comprises: fourth mounting bracket 41 and cleaning unit 42, a plurality of fourth mounting brackets 41 set gradually along the second direction, and each fourth mounting bracket 41 is installed with at least one cleaning unit 42.
In a further embodiment of the present invention, two cleaning units 42 are mounted on each fourth mounting frame 41 from bottom to top.
In a further embodiment of the present invention, the washing unit 42 includes: cleaning bench 43, backplate 47 and purge tube 44, operatively placed wafer 2 on the cleaning bench 43, the output of purge tube 44 is just to the upper surface setting of cleaning bench 43, and backplate 47 sets up in one side of cleaning bench 43, and backplate 47 is connected with fourth mounting bracket 41, is provided with a through-hole on the backplate 47, and the through-hole is used for second centre gripping robot 65 to send into wafer 2.
In a further embodiment of the present invention, the cleaning module 4 further includes: wash exhaust apparatus 45 and blast pipe 46, wash exhaust apparatus 45 and set up in the upper end of fourth mounting bracket 41, blast pipe 46 sets up along vertical direction and from lower to upper in proper order through the next cleaning unit 42 and the last cleaning unit 42 of a fourth mounting bracket 41, and the one end of blast pipe 46 is connected with the input that washs exhaust apparatus 45, is provided with a plurality of suction holes on the blast pipe 46.
In a further embodiment of the present invention, the drying module 5 includes: the drying device comprises a fifth mounting rack 51 and a drying unit 52, wherein a plurality of fifth mounting racks 51 are sequentially arranged along the second direction, and each fifth mounting rack 51 is provided with at least one drying unit 52.
In a further embodiment of the present invention, two drying units 52 are mounted on each fifth mounting frame 51 from bottom to top.
In a further embodiment of the present invention, the drying unit 52 includes: the support frame 53, the upper cavity 54 and the lower cavity 55, and the fluid pipeline 56, wherein the support frame 53 is mounted on the fifth mounting frame 51, the upper cavity 54 and the lower cavity 55 are operatively closed up and down, the upper cavity 54 and the lower cavity 55 are mounted on the support frame 53 together, and the upper cavity 54 is connected with the fluid pipeline 56.
In a further embodiment of the present invention, the storage mechanism 1 further comprises: the pressure release valve and the nitrogen blowing mechanism are both installed on the storage mechanism 1.
In a further embodiment of the present invention, the method further comprises: a plurality of chemical supply devices 9 arranged around the outside of the drying module 5 and the cleaning module 4, each of the chemical supply devices being connected with the drying module 5 or the cleaning module 4
In a further embodiment of the present invention, the method further comprises: and the first clamping robot 35 and the second clamping robot 65 are provided with photoelectric switches for ensuring that the first clamping robot 35 and the second clamping robot 65 move to the appointed positions.
As a preferred embodiment of the operation method of the wet method equipment for supercritical cleaning, the wet method equipment for supercritical cleaning including any one of the above-mentioned wet method equipment comprises the following steps:
step S1, placing a plurality of wafers 2 into the storage mechanism 1; further, after the wafer finishes the preliminary production process, a plurality of wafers are placed in the wafer box 13 from top to bottom, a separation type frame body structure is arranged in the wafer box 13, so that a certain gap is formed between adjacent paillette wafers, and the wafer box 13 which is filled is placed in the accommodating bin 12 and the accommodating bin 12 is closed through the door assembly 14 to form a relatively closed space.
Step S2, closing the storage mechanism 1 and blowing nitrogen gas into the storage mechanism 1; furthermore, the nitrogen blowing mechanism injects nitrogen into the accommodating bin 12 from the outside to the inside, so that a basic nanoscale gas film is formed on the surface of the wafer, dust on the surface of the wafer is blown off in a large range, and isolation is formed through the gas film.
Step S3, opening the storage mechanism 1; further, still be provided with micronic dust monitoring sensor in the holding storehouse 12, guarantee according to micronic dust monitoring sensor's reading that the granule concentration in the holding storehouse 12 falls to a standard value after, carry out the pressure release through the relief valve, then open door subassembly 14.
Step S4, taking out the wafers 2 stored in the storage mechanism 1 by the first transfer mechanism 3; further, the wafer 2 stored in the storage mechanism 1 is held by the gripper mechanism of the first transfer mechanism and then placed on the buffer table 7, and the buffer table 7 is used for temporarily placing the wafer 2.
Step S5, the wafer 2 taken out by the first conveying mechanism 3 is sent between the cleaning module 4 and the drying module 5 by the second conveying mechanism 6;
step S6, the wafer 2 is sent into the cleaning module 4 through the second transmission mechanism 6 for cleaning; further, the second transport mechanism transports the wafer 2 to a cleaning unit 42 of the cleaning module 4 in an inactive state, and places the wafer 2 and moves the gripper mechanism out. Further, for the cleaning process, the cleaning platform 43 is a rotatable structure to rotate the wafer 2, and simultaneously starts to spray the corresponding chemical solution to clean the surface of the wafer.
Step S7, the cleaned wafer 2 is sent to the drying module 5 through the second transmission mechanism 6 for drying; further, the second transport mechanism transports the wafer 2 to a drying unit 52 of the drying module 5 in an inactive state, and places the wafer 2 and moves the gripper mechanism out. Furthermore, the temperature and pressure in the drying unit 52 of the drying module 5 are adjusted, then the gaseous isopropanol is injected to cover the wafer, then the supercritical fluid carbon dioxide is injected to completely cover the inside of the drying unit 52, and simultaneously the upper cavity 54 and the lower cavity 55 of the drying unit 52 are in a completely closed state, the supercritical carbon dioxide and the isopropanol are partially fused, water molecules are removed from the surface of the wafer by virtue of the tension, and then the isopropanol, the water molecules and the carbon dioxide are discharged together through a discharge pipeline communicated with the cavity.
In step S8, the wafer 2 having been dried is taken out by the second transfer mechanism 6.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.

Claims (10)

1. A wet method apparatus for supercritical cleaning, comprising:
the storage mechanism is used for placing the wafer;
the first transmission mechanism is arranged on one side of the storage mechanism;
the cleaning module is arranged on one side, away from the storage mechanism, of the first transmission mechanism;
the drying module is arranged on one side, away from the storage mechanism, of the first transmission mechanism, and the drying module and the cleaning module are arranged oppositely;
the second transmission mechanism is arranged between the cleaning module and the drying module, and one end of the second transmission mechanism is close to the first transmission mechanism.
2. The wet method apparatus for supercritical cleaning according to claim 1, further comprising: a buffer stage disposed between the first transport mechanism and the second transport mechanism, the buffer stage having the wafer operably disposed thereon.
3. The wet method apparatus for supercritical cleaning according to claim 1 wherein the storage mechanism and the first transport mechanism are each provided extending in a first direction, the cleaning module, the drying module and the second transport mechanism are each provided extending in a second direction, and the first direction is perpendicular to the second direction.
4. The wet method apparatus for supercritical cleaning according to claim 3 wherein the storage mechanism comprises: first mounting bracket, holding storehouse, wafer box and door subassembly, first mounting bracket is followed first direction extends the setting, and is a plurality of the holding storehouse is followed first direction install in proper order in on the first mounting bracket, each a wafer box has all been placed in the holding storehouse, each a plurality of have all been placed in the wafer box wafer, each the holding storehouse is close to one side of first transmission device all installs one the door subassembly, the door subassembly is used for opening or closing the holding storehouse.
5. The wet method apparatus for supercritical cleaning according to claim 3 is characterized in that the first transfer mechanism comprises: second mounting bracket, first horizontal carriage, first crane, first installation department and first centre gripping robot, the second mounting bracket is followed first direction extends the setting, first horizontal carriage can be followed first direction movably install in on the second mounting bracket, first crane liftable install in on the first horizontal carriage, first installation department install in on the first crane, first centre gripping robot install in on the first installation department, first centre gripping robot is used for pressing from both sides and gets the wafer.
6. The wet method apparatus for supercritical cleaning according to claim 3 is characterized in that the second transport mechanism comprises: third mounting bracket, second horizontal carriage, second crane, second installation department and second centre gripping robot, the third mounting bracket is followed the second direction extends the setting, the horizontal carriage of second can follow the second direction install with removing on the second mounting bracket, the second crane install with liftable in on the horizontal carriage of second, the second installation department install in on the second crane, second centre gripping robot install in on the second installation department, second centre gripping robot is used for pressing from both sides and gets the wafer.
7. The wet method apparatus for supercritical cleaning according to claim 6 wherein the second transport mechanism further comprises: the movable base is installed at the bottom of the third installation frame and used for driving the third installation frame to move along the second direction.
8. The wet method apparatus for supercritical cleaning according to claim 5 or 6 is characterized in that the first holding robot and the second holding robot each comprise: the mobile module is installed on the first installation portion or the second installation portion, the first mobile portion and the second mobile portion are movably installed on the mobile module, the moving direction of the first mobile portion is parallel to the moving direction of the second mobile portion, the first clamping mechanism is installed on the first mobile portion, and the second clamping mechanism is installed on the second mobile portion.
9. The wet method apparatus for supercritical cleaning according to claim 8 wherein the first and second holding robots each further comprise: the first rotating mechanism is installed at the lower end of the mobile module and connected with the first installation part or the second installation part, the first rotating mechanism is used for driving the mobile module to rotate, and the rotating shaft of the mobile module is arranged along the vertical direction.
10. A method of operating a wet method apparatus for supercritical cleaning comprising the wet method apparatus for supercritical cleaning according to any one of claims 1 to 9, characterized by comprising the steps of:
step S1, placing a plurality of wafers into the storage mechanism;
step S2, closing the storage mechanism and blowing nitrogen into the storage mechanism;
step S3, opening the storage mechanism;
step S4, taking out the wafers in the storage mechanism by the first transport mechanism;
step S5, the wafer taken out by the first conveying mechanism is sent to a position between the cleaning module and the drying module by the second conveying mechanism;
step S6, the wafer is sent into the cleaning module through the second transmission mechanism for cleaning;
step S7, the cleaned wafer is sent into the drying module through the second transmission mechanism to be dried;
in step S8, the wafer that has been dried is taken out by the second transfer mechanism.
CN202111301066.0A 2021-11-04 2021-11-04 Wet method equipment for supercritical cleaning and working method thereof Pending CN114068365A (en)

Priority Applications (1)

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CN202111301066.0A CN114068365A (en) 2021-11-04 2021-11-04 Wet method equipment for supercritical cleaning and working method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111301066.0A CN114068365A (en) 2021-11-04 2021-11-04 Wet method equipment for supercritical cleaning and working method thereof

Publications (1)

Publication Number Publication Date
CN114068365A true CN114068365A (en) 2022-02-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111301066.0A Pending CN114068365A (en) 2021-11-04 2021-11-04 Wet method equipment for supercritical cleaning and working method thereof

Country Status (1)

Country Link
CN (1) CN114068365A (en)

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