CN113411986A - Method for improving false exposure of spider feet of PCB (printed circuit board) - Google Patents
Method for improving false exposure of spider feet of PCB (printed circuit board) Download PDFInfo
- Publication number
- CN113411986A CN113411986A CN202110541859.3A CN202110541859A CN113411986A CN 113411986 A CN113411986 A CN 113411986A CN 202110541859 A CN202110541859 A CN 202110541859A CN 113411986 A CN113411986 A CN 113411986A
- Authority
- CN
- China
- Prior art keywords
- spider
- printing
- feet
- ink
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 241000239290 Araneae Species 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000007639 printing Methods 0.000 claims abstract description 34
- 239000003292 glue Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Abstract
The invention discloses a method for improving false exposure of spider feet of a PCB (printed circuit board), which comprises the following steps of: step one, determining the position of a spider foot; printing oil only on the positions of the spider feet to ensure that the ink in the spider feet is filled without false exposure; step three, pre-baking the printed spider feet to enable the ink to be in a semi-dry state, so that the ink in the spider feet is prevented from being taken away during second printing; and step four, normally printing once to finish printing of the PCB printing ink. The invention thoroughly solves the problem of false exposure of spider feet, has simple operation mode and stable quality, avoids the quality problem caused by multiple times of printing and realizes the improvement of efficiency and quality.
Description
Technical Field
The invention belongs to the field of PCB manufacturing, and particularly relates to a method for improving false exposure of spider feet of a PCB.
Background
Spider feet are irregular patterns etched on the copper surface according to customer requirements (fig. 1).
In the solder mask process in the production of Printed Circuit Boards (PCB), a layer of printing ink is printed on the surface of the circuit board by using a screen printing plate, so that the circuit is protected.
The customer designs different circuit trend and figure according to the demand of PCB function, can form the copper-free area of different size, shape difference at big copper face or pad edge after the preparation, and this kind of figure is all less generally 4-6mil, the cross connection point (figure 2) of gauze and gauze just coincides with the spider foot during solder mask printing, will cause the spider foot to send red not oily down, serious can expose copper and go up tin, at present for solving this problem, generally use twice printing, the production flow is long, low efficiency, and the quality is unstable.
Disclosure of Invention
In order to solve the problems, the invention provides a method for improving the false exposure of spider feet of a PCB.
The invention thoroughly solves the problem of false exposure of spider feet, has simple operation mode and stable quality, avoids the quality problem caused by multiple times of printing and realizes the improvement of efficiency and quality.
In order to achieve the technical effects, the technical scheme of the invention is as follows:
a method for improving false exposure of spider feet of a PCB comprises the following steps:
step one, determining the position of a spider foot;
printing oil only on the positions of the spider feet to ensure that the ink in the spider feet is filled without false exposure;
step three, pre-baking the printed spider feet to enable the ink to be in a semi-dry state, so that the ink in the spider feet is prevented from being taken away during second printing;
and step four, normally printing once to finish printing of the PCB printing ink.
In a further improvement, in the second step, the hardness of the frictioning of the printing spider foot is 70 degrees.
In the second step, the viscosity of the ink is controlled to be 60-80dpa.s when the ink is printed at the position of the spider foot.
The further improvement is that in the third step, the pre-baking time is 6min, and the pre-baking temperature is 73 ℃.
The invention has the advantages that:
the invention thoroughly solves the problem of false exposure of spider feet, has simple operation mode and stable quality, avoids the quality problem caused by multiple times of printing and realizes the improvement of efficiency and quality.
Drawings
FIG. 1 is a schematic view of a spider foot;
fig. 2 is a schematic view of the cross-over points of the screen of the printing screen.
Detailed Description
The technical solution of the present invention is described in detail below by means of specific embodiments and with reference to the attached drawings, and the components or devices in the following embodiments are all general standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experiments.
Example 1
A method for improving PCB board spider foot false exposure as shown in FIG. 1 comprises the following steps:
1. making data aiming at the position of the spider foot independently, and printing oil only aiming at the position of the spider foot;
2. the spider foot position is printed by using a 300-mesh screen plate, so that the influence on customer welding caused by partial thick ink of a finished product is avoided;
3. the viscosity of the printing ink for printing the spider feet is controlled to be 60-80dpa.s, so that the spider feet are filled with the printing ink without false dew;
4. the scraping glue of the printing spider foot has the hardness of 70 degrees, and the printing spider foot is filled with ink after printing without false dew;
5. the spider feet are pre-baked at 73 ℃ for 6min after being printed, so that the ink is in a semi-dry state, and the ink in the spider feet is prevented from being taken away during the second printing.
6. After the above steps are finished, normal printing is carried out once again.
By adopting the technical scheme, the problem of false exposure of the spider feet is thoroughly solved, the operation mode is simple, the quality is stable, the quality problem caused by multiple times of printing is avoided, and the efficiency and the quality are improved.
The above description is only one specific guiding embodiment of the present invention, but the design concept of the present invention is not limited thereto, and any insubstantial modification of the present invention using this concept shall fall within the scope of the invention.
Claims (4)
1. A method for improving false exposure of spider feet of a PCB is characterized by comprising the following steps:
step one, determining the position of a spider foot;
printing oil only on the positions of the spider feet to ensure that the ink in the spider feet is filled without false exposure;
step three, pre-baking the printed spider feet to enable the ink to be in a semi-dry state, so that the ink in the spider feet is prevented from being taken away during second printing;
and step four, normally printing once to finish printing of the PCB printing ink.
2. The method for improving the false exposure of the PCB spider feet, as claimed in claim 1, wherein in the second step, the scratch glue hardness of the printing spider feet is 70 degrees.
3. The method for improving PCB spider foot false exposure as claimed in claim 1, wherein in the second step, the ink viscosity is controlled to 60-80dpa.s when the spider foot position is inked.
4. The method for improving PCB board spider foot false dew as claimed in claim 1, wherein in the third step, the prebaking temperature is 73 ℃ and the prebaking time is 6 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110541859.3A CN113411986A (en) | 2021-05-18 | 2021-05-18 | Method for improving false exposure of spider feet of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110541859.3A CN113411986A (en) | 2021-05-18 | 2021-05-18 | Method for improving false exposure of spider feet of PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113411986A true CN113411986A (en) | 2021-09-17 |
Family
ID=77678750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110541859.3A Pending CN113411986A (en) | 2021-05-18 | 2021-05-18 | Method for improving false exposure of spider feet of PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113411986A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102285260A (en) * | 2011-07-15 | 2011-12-21 | 孟祥祯 | Anti-counterfeiting silk-screen printed image-word works and printing method |
| CN102523696A (en) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of thick copper plate |
| CN107072063A (en) * | 2017-05-26 | 2017-08-18 | 江门崇达电路技术有限公司 | A kind of PCB solder-resisting manufacturing methods |
-
2021
- 2021-05-18 CN CN202110541859.3A patent/CN113411986A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102285260A (en) * | 2011-07-15 | 2011-12-21 | 孟祥祯 | Anti-counterfeiting silk-screen printed image-word works and printing method |
| CN102523696A (en) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of thick copper plate |
| CN107072063A (en) * | 2017-05-26 | 2017-08-18 | 江门崇达电路技术有限公司 | A kind of PCB solder-resisting manufacturing methods |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210917 |
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| RJ01 | Rejection of invention patent application after publication |