CN102036506A - Manufacturing method of golden fingers - Google Patents
Manufacturing method of golden fingers Download PDFInfo
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- CN102036506A CN102036506A CN 201010542413 CN201010542413A CN102036506A CN 102036506 A CN102036506 A CN 102036506A CN 201010542413 CN201010542413 CN 201010542413 CN 201010542413 A CN201010542413 A CN 201010542413A CN 102036506 A CN102036506 A CN 102036506A
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Abstract
The invention provides a manufacturing method of golden fingers, which comprises the following steps: (1) forming one or more golden finger substrates on and perpendicular to a side edge of a circuit board, wherein each golden finger substrate is provided with a first end connected to the circuit board and a second end connected with an electroplating lead; and forming false golden fingers on the electroplating lead, wherein the false golden fingers extend along a direction far away from the golden finger substrates so that the false golden fingers are in contact with electroplating current before the golden finger substrates during subsequent electroplating, each false golden finger is provided with a beginning end and an opposite free end, and the beginning end is connected with the electroplating lead; (2) electroplating the golden finger substrates and the false golden fingers; and (3) removing the electroplating lead and the false golden fingers. The method can thoroughly solve the problem that the false golden fingers can not be arranged due to lack of space of a printed circuit board, and can effectively avoid the adverse effects generated by momentary contact current on the golden fingers during electroplating.
Description
Technical field
The invention belongs to the printed circuit board technology field.Be specifically related to the manufacture method of " golden finger " on a kind of printed circuit board.
Background technology
" golden finger " (Gold Finger) is used for relevant device and the contacted positions of other substrate such as computer display card, memory bar, USB interface, has good wear resistance and low contact resistance, can satisfy repeatedly the requirement of (about 500 times) plug.In the manufacturing process of printed circuit board, all clamps all need to electroplate " golden finger ".
In electroplating the process of " golden finger ",,, very easily cause immediate current excessive and quality problem such as golden finger burns, degold occur making owing to " golden finger " moment pick-up current when " golden finger " when contacting with electroplate liquid.The way of improving this problem at present in the printed circuit board industry adds " false golden finger " at the golden finger two ends exactly, and " false golden finger " is identical with the shape of " golden finger ", and be arranged in parallel with " golden finger ".When electroplating " golden finger ", make " false golden finger " first pick-up current, thereby can play the effect of protection " golden finger ".
As shown in Figure 1, " false golden finger " 2 is arranged on " golden finger " 1 two ends, length direction setting in parallel along " golden finger " 1, when electroplating " golden finger " 1, substrate enters coating bath by left and right directions among Fig. 1 (from left to right or from right to left), " false golden finger " 2 contacts with electroplate liquid earlier, and " golden finger " 1 enters in the electroplate liquid subsequently.Like this, moment pick-up current act on " the false golden finger " 2, reduced to occur on " golden finger " 1 possibility of super-high-current, thereby can improve the quality of " golden finger " 1.
But, above-mentioned this kind manufacture method need take the pattern space (being the wiring figure zone of circuit board) in the printed circuit board (pcb board), and pcb board is tending towards to weak point at present, little, gently, thin direction develops, its integrated level is very high, after the design of finishing printed circuit board (PCB), often can not reserve the interior space (pattern space) of enough plates " false golden finger " is set, and processing factory also can't change the design of client to pcb board, thereby for the pcb board of this inner space deficiency, add " false golden finger " can't be set man-hour, thereby can't solve " golden finger " when electroplating and burn or the problem of degold, thereby bring great risk for the making of electroplating " golden finger ".
In addition; can be for the pcb board of reserving " false golden finger " in the circuit board figure for those; because the position of " false golden finger " be arranged in parallel with " golden finger "; the time of " false golden finger " moment pick-up current is little with the time phase difference of " golden finger " pick-up current in the production process; from the worthwhile width that has only shifted to an earlier date " false golden finger " of time than time of " golden finger " pick-up current; moment, pick-up current still may affact on " golden finger "; cause " golden finger " to be burnt or degold, thereby this class " false golden finger " is also very limited to the protective effect of " golden finger ".
Summary of the invention
Technical problem to be solved by this invention is at above shortcomings in the prior art, the manufacture method of a kind of " golden finger " is provided, this method can thoroughly solve the problem that " false golden finger " can't be set because of insufficient space in the printed circuit board plate, and moment pick-up current harmful effect that " golden finger " produced can effectively avoid electroplating the time.
The technical scheme that solution the technology of the present invention problem is adopted is the manufacture method of described " golden finger ", may further comprise the steps:
1) form one or more " golden finger " matrix perpendicular to this side at the side of circuit board, described " golden finger " matrix has first end that is connected to described circuit board and second end that is connected with electroplate lead wire; On described electroplate lead wire, form " false golden finger ", described " false golden finger " make along extending away from the direction of described " golden finger " matrix described " false golden finger " when follow-up platings prior to " golden finger " matrix and the contact plating electric current, described " false golden finger " has and continuous initiating terminal of described electroplate lead wire and opposite free end;
2) described " golden finger " matrix and " false golden finger " are electroplated;
3) remove electroplate lead wire and " false golden finger ".
Among the present invention, the operation in step 1), other operations can be identical with operation of the prior art.
Preferably, described " false golden finger " can be parallel to described circuit board side and extend, and be perhaps vertical or favour described circuit board side and extend away from described circuit board side.Further preferred " false golden finger " is parallel to described circuit board side and extends, so that the processing of printed circuit board.
Preferably, the initiating terminal of described " false golden finger " is positioned at the lateral outer side of described " golden finger " matrix.Like this, all after the contact plating electric current, " golden finger " just contacts with electroplating current in the whole length of " false golden finger ".
Preferably, described " false golden finger " forming away from the widened section on the side of described " golden finger " matrix by described electroplate lead wire.Like this, when removing the electroplate lead wire operation, " false golden finger " on the electroplate lead wire can be removed fully.
Preferably, described " false golden finger " adopts two, and these two " false golden finger " is parallel to described circuit board side and extends in opposite direction respectively.Like this, no matter substrate enters coating bath from left to right or from right to left when electroplating, and can both guarantee that " false golden finger " contacts with electroplating current earlier.
Preferably, the distance between second end of the initiating terminal of described " false golden finger " and described " golden finger " matrix is 1-4mm.For electric current can stably be acted on " golden finger ", thereby can avoid the moment pick-up current fully to the influence of " golden finger ", also in order to remove false golden finger at last easily, preferred range is 1-2.2mm simultaneously, and further preferred distance is 2mm.
In the preferred embodiments of the present invention, the length of single " false golden finger " is 1-2 times of single " golden finger " matrix length, is preferably 1 times or 1.5 times or 2 times; And/or, the width of single described " false golden finger " be single described " golden finger " matrix width 1-2 doubly, be preferably 1 times or 1.5 times or 2 times.
Preferably, step 2) in, it is nickel or gold that " golden finger " matrix is electroplated the material that plates with " false golden finger ".
Preferably, step 2) in, described " golden finger " matrix and " false golden finger " enter the plating area along the direction opposite with the bearing of trend of described " false golden finger " to begin to electroplate.
Preferably, in step 1), make synchronously at least two kinds on described " golden finger " matrix, described " false golden finger ", the described circuit board in the All other routes figure.
Preferably, in the step 1), the operation of All other routes graphic making is followed successively by on formed " golden finger " matrix, " false golden finger ", the described circuit board: cover copper-pad pasting-exposure-development-etching-striping.
Compare with the manufacture method of tradition " golden finger ", the inventive method has following advantage:
The first, " false golden finger " do not take the pattern space of printed circuit board, and do not increase extra production cost;
The second, " false golden finger " contact plating electric current has in advance in process of production shifted to an earlier date the length of one " false golden finger " in time than time of " golden finger " matrix contact plating electric current, can more effectively delay electric current.
The 3rd, this method is applicable to the printed circuit board of any kind, and the circuit board of any difformity, different size all can according to said method be made " golden finger ".
The present invention is provided with " false golden finger " on the electroplate lead wire that is used for plating " golden finger ", and electroplate lead wire only is used for electroplating " golden finger " operation, can be after the printed circuit board making finishes with it removal, thereby " false golden finger " among the present invention do not take the inner space of circuit board, even the inner space deficiency of circuit board still can be provided with in the manufacturing process of " golden finger " " false golden finger " like this.Owing to be provided with " false golden finger ", in the process of electroplating " golden finger ", " false golden finger " at first contacts with electroplate liquid, moment, pick-up current affacted on " false golden finger ", thereby can avoid the moment pick-up current to act on " golden finger " and go up and cause " golden finger " to be burnt or the quality problem of degold, and then improve the quality of printed circuit board.
Description of drawings
Fig. 1 is provided with schematic diagram for " golden finger " and " false golden finger " in the prior art on circuit board;
Fig. 2 is that the present invention's " golden finger " and " false golden finger " are provided with schematic diagram on circuit board.
Among the figure: the 1-golden finger; The false golden finger of 2-; The 3-electroplate lead wire; The 4-circuit board
Embodiment
According to the present invention, the manufacture method of a kind of " golden finger " is provided, may further comprise the steps:
1) form one or more " golden finger " matrix perpendicular to this side at the side of circuit board, described " golden finger " matrix has first end that is connected to described circuit board and second end that is connected with electroplate lead wire; On described electroplate lead wire, form " false golden finger ", described " false golden finger " make along extending away from the direction of described " golden finger " matrix described " false golden finger " when follow-up platings prior to " golden finger " matrix and the contact plating electric current, described " false golden finger " has and continuous initiating terminal of described electroplate lead wire and opposite free end;
2) described " golden finger " matrix and " false golden finger " are electroplated;
3) remove electroplate lead wire and " false golden finger ".
Preferably, in various embodiments of the present invention, described " false golden finger " is parallel to described circuit board side and extends, and be perhaps vertical or favour described circuit board side and extend away from described circuit board side.
Preferably, in various embodiments of the present invention, the initiating terminal of described " false golden finger " is positioned at the lateral outer side of described " golden finger " matrix.Like this, be convenient to realize that " false golden finger " is prior to " golden finger " matrix and the contact plating electric current.
Preferably, in various embodiments of the present invention, described " false golden finger " forming away from the widened section on the side of described " golden finger " matrix by described electroplate lead wire.
Preferably, in various embodiments of the present invention, described " false golden finger " adopts two, and these two " false golden finger " is parallel to described circuit board side and extends in opposite direction respectively.Like this, no matter still advance from right to left from left to right, all can carry out current buffering by " false golden finger ".
Preferably, in various embodiments of the present invention, the distance between second end of the initiating terminal of described " false golden finger " and described " golden finger " matrix is 1-4mm, and preferred range is 1-2.2mm, more preferably 2mm.Thus, not only can guarantee to utilize " false golden finger " to carry out current buffering, and after plating, be easy to removal " false golden finger ".
Preferably, in various embodiments of the present invention, the length of single described " false golden finger " be single described " golden finger " matrix length 1-2 doubly, be preferably 1.5 times; And/or, the width of single described " false golden finger " be single described " golden finger " matrix width 1-2 doubly, be preferably 1.5 times.Like this, can guarantee to utilize " false golden finger " fully to carry out current buffering.
Preferably, in various embodiments of the present invention, step 2) in, it is nickel or gold that " golden finger " matrix is electroplated the material that plates with " false golden finger ".
Preferably, in various embodiments of the present invention, described " golden finger " matrix and " false golden finger " enter the plating area along the direction opposite with the bearing of trend of described " false golden finger " to begin to electroplate.Like this, can realize that " false golden finger " is prior to " golden finger " matrix and the contact plating electric current.
Preferably, in various embodiments of the present invention, in the step 1), make synchronously at least two kinds on described " golden finger " matrix, described " false golden finger ", the described circuit board in the All other routes figure.
Preferably, in various embodiments of the present invention, in the step 1), the operation of All other routes graphic making is followed successively by on formed " golden finger " matrix, " false golden finger ", the described circuit board: cover copper-pad pasting-exposure-development-etching-striping.
For making those skilled in the art understand technical scheme of the present invention better, the present invention is described in further detail below in conjunction with the drawings and specific embodiments.
In the present embodiment, the method for making " golden finger " may further comprise the steps:
At first, commercially available dry film is attached to carries out pad pasting on the circuit substrate that is covered with copper film, pass through mask, exposure and developing process then successively, to need the copper film in the zone of making " golden finger " and " false golden finger " to block with dry film, and the copper film in the zone that does not need making " golden finger " and " false golden finger " is exposed, through chemical etching process the copper film beyond " golden finger " and " false golden finger " zone is removed, the dry film that will cover at last on " golden finger " and " false golden finger " is removed (striping) again.Wherein, in the line pattern of egative film, just " false golden finger " designed on electroplate lead wire.The concrete steps that " false golden finger " is arranged on the electroplate lead wire 3 are: with described " false golden finger " make along extending away from the direction of described " golden finger " matrix described " false golden finger " when the follow-up plating prior to " golden finger " matrix and the contact plating electric current.In the present embodiment, on electroplate lead wire 3, the electroplate lead wire that " golden finger " both sides, matrix region, close outermost single " golden finger " (" golden finger " can be a plurality of) are located is widened, make it to become " false golden finger " 2, promptly " false golden finger " position that is provided with on electroplate lead wire is the both sides that place " golden finger " matrix region.And " golden finger " matrix region is positioned at the side of circuit board, and vertical with this side.In the present embodiment, " false golden finger " adopts two, is arranged at the both sides of " golden finger " matrix region respectively.Each " golden finger " matrix all has first end that is connected with circuit board and second end that is connected with electroplate lead wire, and second end of " golden finger " is connected with electroplate lead wire between two " false golden fingers " being located at " golden finger " both sides, matrix region respectively.In the present embodiment, the bearing of trend of " false golden finger " is along the length direction of electroplate lead wire, and the side that promptly is parallel to described circuit board extends, and vertical with the bearing of trend of " golden finger " matrix.The end that " false golden finger " is connected with described electroplate lead wire is an initiating terminal, and the other end opposite with initiating terminal is free end.Wherein, the short lines distance of second end of the initiating terminal of " false golden finger " and " golden finger " matrix can be 2mm or 1.5mm or 1.0mm, the length of single " false golden finger " is 1.5 times of single " golden finger " length, and the width of single " false golden finger " is 1.5 times of single " golden finger " width.
Secondly, paste blue adhesive tape again, window, moulding band, plating technologies such as " golden fingers ".Utilize blue adhesive tape with " golden finger " and " false golden finger " regional occlusion in addition; is gold layer (also can be nickel dam) with electroplating technology at the material of the surperficial institute plating of " golden finger " and " false golden finger "; with the resistance to wear of raising " golden finger ", and reduce contact resistance.
Remove blue glue again.
At last, electroplate lead wire is removed, because " false golden finger " is the part of electroplate lead wire, therefore, " false golden finger " also is removed when removing electroplate lead wire.
In above-mentioned electroplating process, because " false golden finger " contacts with electroplate liquid earlier, i.e. " false golden finger " contact plating electric current that takes the lead in, moment, pick-up current at first acted on " false golden finger ", and, in the electroplating process on the moving direction of circuit board, because the length of " false golden finger " is longer, thereby have time enough to stablize pick-up current, and treat " golden finger " when contacting with electroplate liquid, stable pick-up current can avoid golden finger to burn or quality problem such as degold.
Be example only below, the method for circuit board manufacturing provided by the invention is described to make single layer board.In the method, other line pattern all is to make synchronously to form on " golden finger ", " false golden finger " and the circuit board.
In one embodiment, this method may further comprise the steps:
(A) commercially available dry film is attached on the circuit substrate that is covered with copper film, make egative film simultaneously, promptly make line pattern, on egative film, on near the electroplate lead wire " golden finger " zone, form " false golden finger ", described " false golden finger " extends along the direction away from " golden finger " matrix, and its initiating terminal is positioned at the lateral outer side of outermost single " golden finger " matrix, and " false golden finger " forms by described electroplate lead wire is widened on the side away from " golden finger " matrix.Described " false golden finger " adopts two, is arranged at " golden finger " regional both sides respectively.Second end on " golden finger " be located at two electroplate lead wires between " false golden finger " and be connected.
(B) egative film is covered the dry film surface, this step is identical with existing masking process;
(C) use the ultraviolet irradiation substrate, the dry film in the zone that needs making All other routes figure, " golden finger " matrix and " false golden finger " is solidified, and uncured dry film is removed.This step is identical with existing developing process;
(D) adopt existing chemical etching process with the removal of the copper film outside conducting wire, " golden finger " matrix and " false golden finger " zone, thereby on substrate, form All other routes figure, " golden finger " matrix and " false golden finger ";
(E) dry film that will solidify by the mode of present removal dry film is removed (this technology needs to check whether made " false golden finger " meets design requirement after finishing);
(F) make solder mask on the substrate that is manufactured with conducting wire, " golden finger " matrix and " false golden finger ", solder mask does not cover " golden finger " matrix and " false golden finger ".After solder mask completes, check that whether " golden finger " matrix and " false golden finger " are covered by solder mask, if the overlay area is arranged, should remove it.Here the manufacture craft of solder mask is identical with the manufacture craft of existing solder mask.
(G) paste again blue adhesive tape, window, moulding band, plating technologies such as " golden fingers "; utilize blue adhesive tape with " golden finger " matrix and " false golden finger " regional occlusion in addition; adopt electroplating technology at " golden finger " matrix and " false golden finger " electroplating gold on surface layer, so that " golden finger " and " false golden finger " protected then.At last blue adhesive tape is removed.The gold layer here also can replace by nickel dam.The blue glue of the subsides adopted in this step, window, moulding band, plating " golden finger " and to remove the technology of blue adhesive tape same as the prior art.
(H) with edge milling machines electroplate lead wire 3 is removed (mill off), because " false golden finger " is the part of electroplate lead wire, therefore, " false golden finger " also is removed when removing electroplate lead wire.
The method of above-mentioned circuit board manufacturing is to widen with as " false golden finger " near electroplate lead wire of " golden finger " part, electroplate lead wire is the necessary part in the circuit board processing, but the circuit board completion of processing needs later on it removal, thereby is arranged on usually beyond the inner space of circuit board.Therefore,, do not influence the setting of " false golden finger " even the inner space of circuit board is limited yet.In other words, it is not enough and the problem of " false golden finger " can't be set that the method for circuit board manufacturing of the present invention has solved the inner space of the circuit board that may exist.
Be understandable that above execution mode only is the illustrative embodiments that adopts for principle of the present invention is described, yet the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement also are considered as protection scope of the present invention.
Claims (11)
1. the manufacture method of a kind " golden finger " may further comprise the steps:
1) form one or more " golden finger " matrix perpendicular to this side at the side of circuit board, described " golden finger " matrix has first end that is connected to described circuit board and second end that is connected with electroplate lead wire; On described electroplate lead wire, form " false golden finger ", described " false golden finger " make along extending away from the direction of described " golden finger " matrix described " false golden finger " when follow-up platings prior to " golden finger " matrix and the contact plating electric current, described " false golden finger " has and continuous initiating terminal of described electroplate lead wire and opposite free end;
2) described " golden finger " matrix and " false golden finger " are electroplated;
3) remove electroplate lead wire and " false golden finger ".
2. the manufacture method of " golden finger " according to claim 1 is characterized in that, described " false golden finger " is parallel to described circuit board side and extends, and is perhaps vertical or favour described circuit board side and extend away from described circuit board side.
3. the manufacture method of " golden finger " according to claim 1 and 2 is characterized in that, the initiating terminal of described " false golden finger " is positioned at the lateral outer side of described " golden finger " matrix.
4. according to the manufacture method of each described " golden finger " in the aforementioned claim, it is characterized in that described " false golden finger " forming away from the widened section on the side of described " golden finger " matrix by described electroplate lead wire.
5. according to the manufacture method of each described " golden finger " in the aforementioned claim, it is characterized in that described " false golden finger " adopts two, these two " false golden finger " is parallel to described circuit board side and extends in opposite direction respectively.
6. according to the manufacture method of each described " golden finger " in the aforementioned claim, it is characterized in that, distance between second end of the initiating terminal of described " false golden finger " and described " golden finger " matrix is 1-4mm, and preferred range is 1-2.2mm, more preferably 2mm.
7. according to the manufacture method of each described " golden finger " in the aforementioned claim, it is characterized in that, the length of single described " false golden finger " be single described " golden finger " matrix length 1-2 doubly, be preferably 1.5 times; And/or, the width of single described " false golden finger " be single described " golden finger " matrix width 1-2 doubly, be preferably 1.5 times.
8. according to the manufacture method of each described " golden finger " in the aforementioned claim, it is characterized in that step 2) in, it is nickel or gold that " golden finger " matrix is electroplated the material that plates with " false golden finger ".
9. according to the manufacture method of each described " golden finger " in the aforementioned claim, it is characterized in that step 2) in, described " golden finger " matrix and " false golden finger " enter the plating area along the direction opposite with the bearing of trend of described " false golden finger " to begin to electroplate.
10. according to the manufacture method of each described " golden finger " in the aforementioned claim, it is characterized in that in the step 1), make synchronously at least two kinds on described " golden finger " matrix, described " false golden finger ", the described circuit board in the All other routes figure.
11. manufacture method according to each described " golden finger " in the aforementioned claim, it is characterized in that in the step 1) that the operation of All other routes graphic making is followed successively by on formed " golden finger " matrix, " false golden finger " and the described circuit board: cover copper-pad pasting-exposure-development-etching one striping.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105424134A CN102036506B (en) | 2010-11-12 | 2010-11-12 | Manufacturing method of golden fingers |
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| CN2010105424134A CN102036506B (en) | 2010-11-12 | 2010-11-12 | Manufacturing method of golden fingers |
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| CN102036506B CN102036506B (en) | 2012-11-28 |
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| CN2010105424134A Active CN102036506B (en) | 2010-11-12 | 2010-11-12 | Manufacturing method of golden fingers |
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| CN105188261A (en) * | 2015-09-28 | 2015-12-23 | 江门崇达电路技术有限公司 | Method for preventing golden finger lead on printed circuit board (PCB) from generating burrs and tilting |
| CN105682348A (en) * | 2016-03-08 | 2016-06-15 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
| CN105992464A (en) * | 2015-02-06 | 2016-10-05 | 常熟精元电脑有限公司 | Electroplating circuit board and manufacturing method thereof |
| CN109548319A (en) * | 2018-12-28 | 2019-03-29 | 广州兴森快捷电路科技有限公司 | Fingerprint recognition support plate and the production method for improving fingerprint recognition support plate flatness |
| CN111031674A (en) * | 2019-11-21 | 2020-04-17 | 惠州美锐电子科技有限公司 | Method for removing selective plating edge at specific position on PCB |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105992464A (en) * | 2015-02-06 | 2016-10-05 | 常熟精元电脑有限公司 | Electroplating circuit board and manufacturing method thereof |
| CN105188261A (en) * | 2015-09-28 | 2015-12-23 | 江门崇达电路技术有限公司 | Method for preventing golden finger lead on printed circuit board (PCB) from generating burrs and tilting |
| CN105682348A (en) * | 2016-03-08 | 2016-06-15 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
| CN109548319A (en) * | 2018-12-28 | 2019-03-29 | 广州兴森快捷电路科技有限公司 | Fingerprint recognition support plate and the production method for improving fingerprint recognition support plate flatness |
| CN111031674A (en) * | 2019-11-21 | 2020-04-17 | 惠州美锐电子科技有限公司 | Method for removing selective plating edge at specific position on PCB |
| CN111031674B (en) * | 2019-11-21 | 2023-04-21 | 惠州美锐电子科技有限公司 | Method for removing selective electroplating edge at specific position on PCB |
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| Publication number | Publication date |
|---|---|
| CN102036506B (en) | 2012-11-28 |
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Effective date of registration: 20220623 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. |