CN103436097B - A kind of mixing solder mask preventing PCB lateral erosion - Google Patents
A kind of mixing solder mask preventing PCB lateral erosion Download PDFInfo
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- CN103436097B CN103436097B CN201310412590.4A CN201310412590A CN103436097B CN 103436097 B CN103436097 B CN 103436097B CN 201310412590 A CN201310412590 A CN 201310412590A CN 103436097 B CN103436097 B CN 103436097B
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Abstract
The invention provides a kind of mixing solder mask preventing PCB lateral erosion, by making black ink and green ink, and make the green ink that obtains and black ink according to mass ratio 3:10, in humidity 50% ~ 60%, when temperature 17 ~ 23 DEG C, stir mixing in 15 minutes by stirrer.The mixing solder mask that the present invention obtains employs the good low-resistance photosensitiveness of green ink to improve the high resistant photosensitiveness of dirty oil, and thoroughly solve due to black ink resistance light and cause development lateral erosion excessive, what occur oozes golden problem, ensure that the quality printing dirty oil PCB.
Description
Technical field
The present invention relates to solder mask, what be specifically related to is a kind of mixing solder mask preventing PCB lateral erosion.
Background technology
Welding resistance is the very important procedure of PCB making processes, its Main Function is covered by solder mask on the line pattern that etched, to the position of carrying out element welding do not needed all to hide, with prevent in element welding process because of on tin and cause electrical communication to form the problem of short circuit.
The color of solder mask has multiple, wherein green ink is conventional, its performance is best, resistance backscatter extinction logarithmic ratio is minimum, other variegated ink as: comparatively green ink is poor for the performances such as black ink, red ink, white ink, especially the resistance backscatter extinction logarithmic ratio of black ink is maximum, and when welding resistance makes, quality problem is also outstanding.But under some specifically uses region or client's particular cases, just must use these variegated ink.
Due to the exclusive light-blocking property of black ink, when carrying out exposure and making, light source cannot penetrate ink completely, easily cause bottom ink cannot complete exposure to make, during development, the unexposed black ink of circuit or PAD edge can fall under the flushing of salt of wormwood liquid medicine in strip off, form space, there is the excessive problem of side etching quantity in it, liquid medicine can be entered when subsequent handling carries out surface treatment, line edges will form coating, thus cause plating problem, for the situation more easily forming short circuit between the figure that spacing is less, cause serious quality problem most probably.
Summary of the invention
For this reason, the object of the present invention is to provide a kind of mixing solder mask preventing PCB lateral erosion, solving when using black ink to carry out welding resistance making, there is side etching quantity excessive, causing the problem of plating.
The object of the invention is to be achieved through the following technical solutions.
Prevent a mixing solder mask for PCB lateral erosion, comprise green ink and black ink that mass ratio is 3:10, in humidity 50% ~ 60%, when temperature 17 ~ 23 DEG C, stirred by stirrer and be mixed for 15 minutes, wherein:
Described black ink comprises mass percent: the o-cresol formaldehyde epoxy modified acrylic resin of 48%, the isopropyl thioxanthone of 1%, 5% isobutyl-phenoxy ethyl (DBE), 1% carbon black, 31% barium sulfate, 1.5% polydimethylsiloxane, 1.4% silicon-dioxide, 1.8% trimeric cyanamide, the dipropylene glycol monomethyl ether (DPM) of 2%, the durene of 3.3% and 4% 2-methyl isophthalic acid-(4-methylthio group phenyl)-2-morpholinyl-1-acetone;
Described green ink comprises mass percent: the o-cresol formaldehyde epoxy modified acrylic resin of 43.9%, the barium sulfate of 30%, 1% PHTHALOCYANINE GREEN 7,9% ethyl carbitol acid esters, 5% sherwood oil, 3.3% durene, the trimeric cyanamide of 1.8%, the dipropylene glycol monomethyl ether (DPM) of 2% and 4% 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl) phenyl]-1-butanone.
Preferably, described black ink is according to following mass percent: the o-cresol formaldehyde epoxy modified acrylic resin of 48%, the isopropyl thioxanthone of 1%, the isobutyl-phenoxy ethyl (DBE) of 5%, the carbon black of 1%, the barium sulfate of 31%, the polydimethylsiloxane of 1.5%, the silicon-dioxide of 1.4%, the trimeric cyanamide of 1.8%, the dipropylene glycol monomethyl ether (DPM) of 2%, the durene of 3.3% and the 2-methyl isophthalic acid of 4%-(4-methylthio group phenyl)-2-morpholinyl-1-acetone, in humidity 50% ~ 60%, the situation that temperature is 17 ~ 23 DEG C, stir fully to be uniformly mixed for 15 minutes by stirrer and make.
Preferably, described green ink is according to following mass percent: the o-cresol formaldehyde epoxy modified acrylic resin of 43.9%, the barium sulfate of 30%, 1% PHTHALOCYANINE GREEN 7,9% ethyl carbitol acid esters, 5% sherwood oil, 3.3% durene, the trimeric cyanamide of 1.8%, the dipropylene glycol monomethyl ether (DPM) of 2% and 4% 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl) phenyl]-1-butanone, in humidity 50% ~ 60%, the situation that temperature is 17 ~ 23 DEG C, stirs fully to be uniformly mixed for 15 minutes by stirrer and makes.
Preferably, be add the green ink that mass fraction is 3 in the black ink of 10 to mass fraction, stir 15 minutes by stirrer, make the two fully mixing.
The present invention compared with prior art, beneficial effect is: the mixing solder mask preventing PCB lateral erosion provided by the invention, by making black ink and green ink, and make the green ink that obtains and black ink according to mass ratio 3:10, in humidity 50% ~ 60%, when temperature 17 ~ 23 DEG C, stir mixing in 15 minutes by stirrer.The mixing solder mask that the present invention obtains employs the good low-resistance photosensitiveness of green ink to improve the high resistant photosensitiveness of dirty oil, and thoroughly solve due to black ink resistance light and cause development lateral erosion excessive, what occur oozes golden problem, ensure that the quality printing dirty oil PCB.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The present invention is to provide a kind of mixing solder mask preventing PCB lateral erosion, this mixing solder mask mainly includes black ink and green ink, when needs use black ink to carry out welding resistance making, mixing solder mask of the present invention can be utilized to carry out welding resistance making, its green ink due to employing has good low-resistance photosensitiveness, therefore the high resistant photosensitiveness of black ink can be improved, thus avoid when carrying out welding resistance and making, cause development lateral erosion excessive because of black ink resistance optical issue, there is the problem of oozing gold, effectively ensure that the quality of PCB.
Wherein the present invention's mixing solder mask is formed according to the ratio mixing manufacture of mass ratio 3:10 green ink and black ink.Be specially: in humidity 50% ~ 60%, when temperature 17 ~ 23 DEG C, be add the green ink that mass fraction is 3 in the black ink of 10 to mass fraction, stir 15 minutes by stirrer, make the two fully mixing, form mixing solder mask.
It should be noted that, embodiment of the present invention Green printing ink to manufacture mode is as follows: in humidity 50% ~ 60%, the situation that temperature is 17 ~ 23 DEG C, by mass percent be: the o-cresol formaldehyde epoxy modified acrylic resin of 43.9%, the barium sulfate of 30%, the PHTHALOCYANINE GREEN 7 of 1%, the ethyl carbitol acid esters of 9%, the sherwood oil of 5%, the durene of 3.3%, the trimeric cyanamide of 1.8%, the dipropylene glycol monomethyl ether (DPM) of 2% and 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl) the phenyl]-1-butanone Homogeneous phase mixing of 4%, 15 minutes are stirred by stirrer, fully be uniformly mixed and make.
In the embodiment of the present invention, black ink production method is as follows: in humidity 50% ~ 60%, the situation that temperature is 17 ~ 23 DEG C, by mass percent be: the o-cresol formaldehyde epoxy modified acrylic resin of 48%, the isopropyl thioxanthone of 1%, the isobutyl-phenoxy ethyl (DBE) of 5%, the carbon black of 1%, the barium sulfate of 31%, the polydimethylsiloxane of 1.5%, the silicon-dioxide of 1.4%, the trimeric cyanamide of 1.8%, the dipropylene glycol monomethyl ether (DPM) of 2%, the durene of 3.3% and the 2-methyl isophthalic acid of 4%-(4-methylthio group phenyl)-2-morpholinyl-1-acetone, in humidity 50% ~ 60%, the situation that temperature is 17 ~ 23 DEG C, stir fully to be uniformly mixed for 15 minutes by stirrer and make.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. prevent a mixing solder mask for PCB lateral erosion, it is characterized in that, comprise green ink and black ink that mass ratio is 3: 10, in humidity 50% ~ 60%, when temperature 17 ~ 23 DEG C, stirred by stirrer and be mixed for 15 minutes, wherein:
Described black ink comprises mass percent: the o-cresol formaldehyde epoxy modified acrylic resin of 48%, the isopropyl thioxanthone of 1%, 5% isobutyl-phenoxy ethyl (DBE), 1% carbon black, 31% barium sulfate, 1.5% polydimethylsiloxane, 1.4% silicon-dioxide, 1.8% trimeric cyanamide, the dipropylene glycol monomethyl ether (DPM) of 2%, the durene of 3.3% and 4% 2-methyl isophthalic acid-(4-methylthio group phenyl)-2-morpholinyl-1-acetone;
Described green ink comprises mass percent: the o-cresol formaldehyde epoxy modified acrylic resin of 43.9%, the barium sulfate of 30%, 1% PHTHALOCYANINE GREEN 7,9% ethyl carbitol acid esters, 5% sherwood oil, 3.3% durene, the trimeric cyanamide of 1.8%, the dipropylene glycol monomethyl ether (DPM) of 2% and 4% 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl) phenyl]-1-butanone.
2. the mixing solder mask preventing PCB lateral erosion according to claim 1, it is characterized in that, described black ink is according to following mass percent: the o-cresol formaldehyde epoxy modified acrylic resin of 48%, the isopropyl thioxanthone of 1%, the isobutyl-phenoxy ethyl (DBE) of 5%, the carbon black of 1%, the barium sulfate of 31%, the polydimethylsiloxane of 1.5%, the silicon-dioxide of 1.4%, the trimeric cyanamide of 1.8%, the dipropylene glycol monomethyl ether (DPM) of 2%, the durene of 3.3% and the 2-methyl isophthalic acid of 4%-(4-methylthio group phenyl)-2-morpholinyl-1-acetone, in humidity 50% ~ 60%, the situation that temperature is 17 ~ 23 DEG C, stir fully to be uniformly mixed for 15 minutes by stirrer and make.
3. the mixing solder mask preventing PCB lateral erosion according to claim 1, it is characterized in that, described green ink is according to following mass percent: the o-cresol formaldehyde epoxy modified acrylic resin of 43.9%, the barium sulfate of 30%, the PHTHALOCYANINE GREEN 7 of 1%, the ethyl carbitol acid esters of 9%, the sherwood oil of 5%, the durene of 3.3%, the trimeric cyanamide of 1.8%, the dipropylene glycol monomethyl ether (DPM) of 2% and 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl) the phenyl]-1-butanone of 4%, in humidity 50% ~ 60%, the situation that temperature is 17 ~ 23 DEG C, stir fully to be uniformly mixed for 15 minutes by stirrer and make.
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| CN201310412590.4A CN103436097B (en) | 2013-09-06 | 2013-09-06 | A kind of mixing solder mask preventing PCB lateral erosion |
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| CN201310412590.4A CN103436097B (en) | 2013-09-06 | 2013-09-06 | A kind of mixing solder mask preventing PCB lateral erosion |
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| CN103436097B true CN103436097B (en) | 2015-11-25 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107128091A (en) * | 2017-05-26 | 2017-09-05 | 东莞翔国光电科技有限公司 | One kind improves wet film dirty oil plate and falls oily technique |
| CN109575675B (en) * | 2018-12-07 | 2021-12-14 | 常熟东南相互电子有限公司 | Special ink for anti-welding LDI (laser direct immersion) and preparation method thereof |
| CN110911067A (en) * | 2019-11-08 | 2020-03-24 | 广东风华高新科技股份有限公司 | Current sensing resistor and manufacturing method thereof |
| TWI751506B (en) | 2020-03-06 | 2022-01-01 | 欣興電子股份有限公司 | Wiring board and manufacturing method thereof |
| CN111800956B (en) * | 2020-07-21 | 2021-12-17 | 博敏电子股份有限公司 | Processing method of circuit board solder resist black oil |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0663411A1 (en) * | 1994-01-17 | 1995-07-19 | Nippon Kayaku Kabushiki Kaisha | Photo-imaging resist ink and cured product thereof |
| US5821031A (en) * | 1994-10-05 | 1998-10-13 | Goo Chemical Co., Ltd. | Photosensitive solder resist ink, printed circuit board and production thereof |
| CN1784432A (en) * | 2003-05-09 | 2006-06-07 | 太阳油墨制造株式会社 | Photocuring/thermosetting inkjet composition and printed wiring board using same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0820742A (en) * | 1994-07-05 | 1996-01-23 | Nippon Kayaku Co Ltd | Resist ink composition and its cured item |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0663411A1 (en) * | 1994-01-17 | 1995-07-19 | Nippon Kayaku Kabushiki Kaisha | Photo-imaging resist ink and cured product thereof |
| US5821031A (en) * | 1994-10-05 | 1998-10-13 | Goo Chemical Co., Ltd. | Photosensitive solder resist ink, printed circuit board and production thereof |
| CN1784432A (en) * | 2003-05-09 | 2006-06-07 | 太阳油墨制造株式会社 | Photocuring/thermosetting inkjet composition and printed wiring board using same |
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| CN103436097A (en) | 2013-12-11 |
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Inventor after: An Guoyi Inventor after: Li Changsheng Inventor after: Wen Chenglin Inventor before: Yan Lailiang Inventor before: Wen Zesheng Inventor before: Li Changsheng Inventor before: He Shengping |
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