CN107148158A - The preparation method and device of a kind of printed circuit board - Google Patents
The preparation method and device of a kind of printed circuit board Download PDFInfo
- Publication number
- CN107148158A CN107148158A CN201710516395.4A CN201710516395A CN107148158A CN 107148158 A CN107148158 A CN 107148158A CN 201710516395 A CN201710516395 A CN 201710516395A CN 107148158 A CN107148158 A CN 107148158A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- ink
- carried out
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/105—Using an electrical field; Special methods of applying an electric potential
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of preparation method of printed circuit board and device, it this method provide the design of first time exposure film, it is based on this design, the present invention is using electrostatic painting process and can avoid the blocked up problem of substrate location solder mask, and technology can not solve the blocked up problem of substrate location solder mask using electrostatic painting process and the design of original egative film now, and the technology of the present invention method solves and is not avoided that circuit is rubescent using screen printer silk screen printing process, the problems such as bubble and welding resistance enter hole between line.
Description
Technical field
The application be related to printed circuit board manufacture field, more particularly to a kind of printed circuit board preparation method and device.
Background technology
PCB industries meet the particular/special requirement of high current, thick copper coin circuit and base material position using thick copper coin more and more
Put that drop is very big, especially base copper thickness is 3OZ and more than 3OZ circuit, causes thick copper coin in welding resistance process, holds very much
Easily occur that circuit is rubescent, bubble, welding resistance enter hole, a series of quality problems of disconnected welding resistance bridge and welding resistance crackle etc., therefore printing between line
It is to compare urgent problem to be solved in industry that circuit thickness of slab copper makes in welding resistance.
The current industry of way in to(for) printed circuit thickness of slab copper mainly has two kinds, and one kind is to use screen printer printer
Skill, this technique does flow twice, and first time flow is all covered circuit, copper face and substrate location using ink, second
Flow reuses ink and circuit, copper face and substrate location is repeated into covering once, is opened a window when welding resistance exposes using increasing welding resistance
Egative film is produced.Another is to use spraying coating process, and this technique does flow twice, and first time flow all covers substrate location
Lid, exposes copper face and circuit, and second of flow reuses ink and cover circuit, copper face and substrate location once.Spraying coating process
Be substrate location ink have twice covering cause base material curing ink it is blocked up can produce welding after there are the quality problems such as welding resistance crackle.
The content of the invention
The embodiments of the invention provide a kind of preparation method of printed circuit board and device, to solve to print in the prior art
The problem of circuit thickness of slab copper processed has that circuit is rubescent, bubble, welding resistance enter hole, disconnected welding resistance bridge and welding resistance crackle between line.
Its specific technical scheme is as follows：
A kind of preparation method of printed circuit board, methods described includes：
Nog plate before welding resistance is carried out to the printed circuit board for having completed outer-layer circuit making to handle；
First time ink coating is carried out to the printed circuit board that nog plate before welding resistance is handled；
The solder resisting exposure substrate of the printed circuit board is designated designated identification；
First time ink exposure is carried out to the printed circuit board；
The printed circuit board that first time ink exposes is post-processed；
Second of ink coating is carried out to the printed circuit board of post processing；
Second of ink exposure is carried out to the printed circuit board of second of ink coating；
Printed circuit board post processing is carried out to the printed circuit board that the second ink exposes.
Optionally, first time ink coating is carried out to the printed circuit board, including：
According to the parameter that base copper is first thickness, the coating of first time ink is carried out obtaining to the printed circuit board；
Toasted by tunnel and the printed circuit board that coating is completed is toasted.
Optionally, the solder resisting exposure substrate of the printed circuit board is designated designated identification, including：
It is transmission region by the area identification that line width on printed circuit board is less than or equal to the first value；
Printed circuit board is reached the standard grade and is wider than the line width or copper face of the first value and is designated transmission region.
Optionally, first time ink exposure is carried out to the printed circuit board, including：
Aligned using the solder resisting exposure substrate with designated identification；
Red is fixed on a printed circuit board by the adhesive tape on the window position on the exposure film；
The film layer on the egative film is opened, and first time ink exposure is carried out to the printed circuit board.
Optionally, second of ink coating is carried out to the printed circuit board of post processing, including：
According to the parameter that base copper is second thickness, second of ink coating is carried out obtaining to the printed circuit board；
Toasted by tunnel and the printed circuit board that coating is completed is toasted.
A kind of preparation facilities of printed circuit board, including：
Processing module, is handled for carrying out nog plate before welding resistance to the printed circuit board for having completed outer-layer circuit making；
Module is prepared, the printed circuit board for handling nog plate before welding resistance carries out first time ink coating；By the print
The solder resisting exposure substrate of circuit board processed is designated designated identification；First time ink exposure is carried out to the printed circuit board；To
The printed circuit board of ink exposure is post-processed；Second of ink painting is carried out to the printed circuit board of post processing
Cover；Second of ink exposure is carried out to the printed circuit board of second of ink coating；The printed circuit board exposed to the second ink
Carry out printed circuit board post processing.
Optionally, the preparation module, for according to the parameter that base copper is first thickness, being carried out to the printed circuit board
Obtain the coating of first time ink；Toasted by tunnel and the printed circuit board that coating is completed is toasted.
Optionally, the preparation module, be for the area identification by line width on printed circuit board less than or equal to the first value
Transmission region；Printed circuit board is reached the standard grade and is wider than the line width or copper face of the first value and is designated transmission region.
Optionally, the preparation module, for being aligned using the solder resisting exposure substrate with designated identification；By institute
The adhesive tape stated on the window position on exposure film fixes red on a printed circuit board；The film layer on the egative film is opened,
And first time ink exposure is carried out to the printed circuit board.
Optionally, the preparation module, for according to the parameter that base copper is second thickness, being carried out to the printed circuit board
Obtain second of ink coating；Toasted by tunnel and the printed circuit board that coating is completed is toasted.
There is the design of first time exposure film in method provided by the present invention, be based on this design, this hair
Bright use electrostatic painting process and the blocked up problem of substrate location solder mask can be avoided, and technology uses electrostatic spraying now
Technique and original egative film design can not solve the blocked up problem of substrate location solder mask, and the technology of the present invention method is solved
It is not avoided that circuit is rubescent using screen printer silk screen printing process, the problems such as bubble and welding resistance enter hole between line.
Brief description of the drawings
Fig. 1 is a kind of flow chart of the preparation method of printed circuit board in the embodiment of the present invention；
Fig. 2 is a kind of structural representation of the preparation facilities of printed circuit board in the embodiment of the present invention.
Embodiment
Technical solution of the present invention is described in detail below by accompanying drawing and specific embodiment, it will be appreciated that this hair
Particular technique feature in bright embodiment and embodiment is the explanation to technical solution of the present invention, rather than is limited, not
In the case of conflict, the particular technique feature in the embodiment of the present invention and embodiment can be mutually combined.
It is a kind of flow chart of the preparation method of printed circuit board in the embodiment of the present invention as shown in Figure 1, this method includes：
S101, carries out nog plate before welding resistance to the printed circuit board for having completed outer-layer circuit making and handles；
The printed circuit thickness of slab copper for having completed outer-layer circuit making is passed through into welding resistance pre-treatment nog plate, it is ensured that copper face is clean,
Dry and no-sundries.
S102, first time ink coating is carried out to the printed circuit board that nog plate before welding resistance is handled；
According to the parameter that base copper is first thickness, the coating of first time ink is carried out obtaining to the printed circuit board；Pass through tunnel
The printed circuit board that road baking is completed to coating is toasted.
Specifically, sprayed after consent press mold using electrostatic painting process, spray parameters are according to base copper thickness 35um
Program is produced (wet-film thickness 90-100um), and continuous tunnel furnace is carried out after the completion of spraying and toasts production to be exposed.
S103, designated identification is designated by the solder resisting exposure substrate of the printed circuit board；
It is transmission region by the area identification that line width on printed circuit board is less than or equal to the first value；Printed circuit board is reached the standard grade
The line width or copper face for being wider than the first value are designated transmission region.
Specifically, solder resisting exposure substrate designated identification is MC (TYH)/MS (TYH), and the exposure film is：For line width
Substrate location beside all transmission regions of≤20mil circuit way place on line, circuit promotes the 5-10mil to be to outside circuit
Transmission region.
It is transmission region, circuit or copper face for line width ＞ 20mil circuits or copper face way place on line line side 3-5mil
The substrate location on side promotes 5-10mil to be transmission region to outside circuit；Remaining position is normal with welding resistance again after light
Exposure film data layer is superimposed.
S104, first time ink exposure is carried out to the printed circuit board；
Aligned using the solder resisting exposure substrate with designated identification；By on the window position on the exposure film
Adhesive tape fixes red on a printed circuit board；Open the film layer on the egative film, and the is carried out to the printed circuit board
Ink exposure.
Specifically, aligned using designated identification for MC (TYH)/MS (TYH) solder resisting exposure substrate, contraposition is completed
Afterwards with fixing red onboard using the adhesive tape on egative film " window " position after the completion of 5 times of spectroscopies, film (Mylar) is opened
Frame, is placed into appropriate location by the wiring board for having completed contraposition and is exposed, by framework door-lock opening film frame after the completion of exposure,
The wiring board for having completed exposure is taken out.
S105, is post-processed to the printed circuit board that first time ink exposes；
The plate for completing exposure is developed, it is roasting after low temperature and according to standard test, then by welding resistance pre-treatment nog plate, really
Guarantor's copper face is clean, dry and no-sundries.
S106, second of ink coating is carried out to the printed circuit board of post processing；
According to the parameter that base copper is second thickness, second of ink coating is carried out obtaining to the printed circuit board；Pass through tunnel
The printed circuit board that road baking is completed to coating is toasted.
Specifically, sprayed using electrostatic painting process, spray parameters are given birth to according to base copper thickness 35um programs
Produce (wet-film thickness 90-100um), continuous tunnel furnace is carried out after the completion of spraying and toasts production to be exposed.
S107, second of ink exposure is carried out to the printed circuit board of second of ink coating；
Aligned using designated identification for MC/MS solder resisting exposure substrate, with sharp after 5 times of spectroscopy OK after the completion of contraposition
Red is fixed onboard with the adhesive tape on egative film " window " position, film (Mylar) frame is opened, the wiring board of contraposition will have been completed
It is placed into appropriate location to be exposed, by framework door-lock opening film (Mylar) frame after the completion of exposure, the line of exposure will have been completed
Road plate takes out.
S108, printed circuit board post processing is carried out to the printed circuit board that the second ink exposes.
The plate for completing exposure is developed, it is roasting after low temperature and according to standard test.
In the embodiment of the present invention, there is the design of first time exposure film in this method, be based on this design, this
Invention is using electrostatic painting process and can avoid the blocked up problem of substrate location solder mask, and technology uses electrostatic now
Apply technique and original egative film design can not solve the blocked up problem of substrate location solder mask, and the technology of the present invention method is solved
It is not avoided that circuit is rubescent using screen printer silk screen printing process, the problems such as bubble and welding resistance enter hole between line.
In addition, the invention provides printed circuit thickness of slab copper in the preparation method of welding resistance, use product produced by the invention
Be not in that circuit is rubescent, bubble and welding resistance enter the quality problems such as hole between line, product quality is significantly improved, printed circuit thickness of slab copper
Outward appearance first-time qualification rate is from 70% lifting to 90%, and scrappage is reduced to 0.3% from 1.2%.
A kind of preparation facilities of printed circuit board is additionally provided in the embodiment of the present invention, the present invention is illustrated in figure 2 excessively real
A kind of structural representation of the preparation facilities of printed circuit board in example is applied, including：
Processing module 201, is handled for carrying out nog plate before welding resistance to the printed circuit board for having completed outer-layer circuit making；
Module 202 is prepared, the printed circuit board for handling nog plate before welding resistance carries out first time ink coating；Will be described
The solder resisting exposure substrate of printed circuit board is designated designated identification；First time ink exposure is carried out to the printed circuit board；It is right
The printed circuit board of first time ink exposure is post-processed；Second of ink painting is carried out to the printed circuit board of post processing
Cover；Second of ink exposure is carried out to the printed circuit board of second of ink coating；The printed circuit board exposed to the second ink
Carry out printed circuit board post processing.
Further, in embodiments of the present invention, it is described preparation module 202, for according to base copper be first thickness parameter,
The coating of first time ink is carried out obtaining to the printed circuit board；Toasted by tunnel and the printed circuit board that coating is completed is dried
It is roasting.
Further, in embodiments of the present invention, it is described preparation module 202, for by line width on printed circuit board be less than etc.
In first value area identification be transmission region；Printed circuit board is reached the standard grade and is wider than the line width or copper face of the first value and is designated
Transmission region.
Further, in embodiments of the present invention, the preparation module 202, for being exposed using the welding resistance with designated identification
Exograph X is aligned；Red is fixed on a printed circuit board by the adhesive tape on the window position on the exposure film；Take off
The film layer on the egative film is opened, and first time ink exposure is carried out to the printed circuit board.
Further, in embodiments of the present invention, for according to the parameter that base copper is second thickness, to the printed circuit board
Carry out obtaining second of ink coating；Toasted by tunnel and the printed circuit board that coating is completed is toasted.
Although having been described for the preferred embodiment of the application, one of ordinary skilled in the art once knows substantially
Creative concept, then can make other change and modification to these embodiments.So, appended claims are intended to be construed to bag
Include preferred embodiment and fall into having altered and changing for the application scope.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the application to the application
God and scope.So, if these modifications and variations of the application belong to the scope of the application claim and its equivalent technologies
Within, then the application is also intended to comprising including these changes and modification.
Claims (10)
1. a kind of preparation method of printed circuit board, it is characterised in that methods described includes：
Nog plate before welding resistance is carried out to the printed circuit board for having completed outer-layer circuit making to handle；
First time ink coating is carried out to the printed circuit board that nog plate before welding resistance is handled；
The solder resisting exposure substrate of the printed circuit board is designated designated identification；
First time ink exposure is carried out to the printed circuit board；
The printed circuit board that first time ink exposes is post-processed；
Second of ink coating is carried out to the printed circuit board of post processing；
Second of ink exposure is carried out to the printed circuit board of second of ink coating；
Printed circuit board post processing is carried out to the printed circuit board that the second ink exposes.
2. the method as described in claim 1, it is characterised in that first time ink coating, bag are carried out to the printed circuit board
Include：
According to the parameter that base copper is first thickness, the coating of first time ink is carried out obtaining to the printed circuit board；
Toasted by tunnel and the printed circuit board that coating is completed is toasted.
3. the method as described in claim 1, it is characterised in that the solder resisting exposure substrate of the printed circuit board is designated finger
Calibration is known, including：
It is transmission region by the area identification that line width on printed circuit board is less than or equal to the first value；
Printed circuit board is reached the standard grade and is wider than the line width or copper face of the first value and is designated transmission region.
4. the method as described in claim 1, it is characterised in that first time ink exposure, bag are carried out to the printed circuit board
Include：
Aligned using the solder resisting exposure substrate with designated identification；
Red is fixed on a printed circuit board by the adhesive tape on the window position on the exposure film；
The film layer on the egative film is opened, and first time ink exposure is carried out to the printed circuit board.
5. the method as described in claim 1, it is characterised in that second of ink is carried out to the printed circuit board of post processing
Coating, including：
According to the parameter that base copper is second thickness, second of ink coating is carried out obtaining to the printed circuit board；
Toasted by tunnel and the printed circuit board that coating is completed is toasted.
6. a kind of preparation facilities of printed circuit board, it is characterised in that including：
Processing module, is handled for carrying out nog plate before welding resistance to the printed circuit board for having completed outer-layer circuit making；
Module is prepared, the printed circuit board for handling nog plate before welding resistance carries out first time ink coating；By the printing electricity
The solder resisting exposure substrate of road plate is designated designated identification；First time ink exposure is carried out to the printed circuit board；To for the first time
The printed circuit board of ink exposure is post-processed；Second of ink coating is carried out to the printed circuit board of post processing；It is right
The printed circuit board of second of ink coating carries out second of ink exposure；The printed circuit board that second ink exposes is printed
Circuit board post processing processed.
7. device as claimed in claim 6, it is characterised in that the preparation module, for being first thickness according to base copper
Parameter, carries out obtaining the coating of first time ink to the printed circuit board；The printed circuit board completed to coating is toasted by tunnel
Toasted.
8. device as claimed in claim 6, it is characterised in that the preparation module, for line width on printed circuit board is small
In equal to first value area identification be transmission region；Printed circuit board is reached the standard grade and is wider than the line width or copper face mark of the first value
Know for transmission region.
9. device as claimed in claim 6, it is characterised in that the preparation module, for using the resistance with designated identification
Weldering exposure film is aligned；Printed circuit board is fixed on by red by the adhesive tape on the window position on the exposure film
On；The film layer on the egative film is opened, and first time ink exposure is carried out to the printed circuit board.
10. device as claimed in claim 6, it is characterised in that the preparation module, for being second thickness according to base copper
Parameter, carries out obtaining second of ink coating to the printed circuit board；The printed circuit board completed to coating is toasted by tunnel
Toasted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710516395.4A CN107148158A (en) | 2017-06-29 | 2017-06-29 | The preparation method and device of a kind of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710516395.4A CN107148158A (en) | 2017-06-29 | 2017-06-29 | The preparation method and device of a kind of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107148158A true CN107148158A (en) | 2017-09-08 |
Family
ID=59785211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710516395.4A Pending CN107148158A (en) | 2017-06-29 | 2017-06-29 | The preparation method and device of a kind of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107148158A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484349A (en) * | 2017-10-17 | 2017-12-15 | 珠海杰赛科技有限公司 | A kind of method for preventing printed circuit board welding resistance crackle |
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|---|---|---|---|---|
| CN101534612A (en) * | 2009-04-10 | 2009-09-16 | 深圳市博敏电子有限公司 | Resistance welding superposition technology for PCB thick copper lines |
| CN101959372A (en) * | 2010-05-24 | 2011-01-26 | 大连太平洋多层线路板有限公司 | Super-thick copper circuit board solder resisting processing method |
| CN102523696A (en) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of thick copper plate |
| CN103079355A (en) * | 2012-12-28 | 2013-05-01 | 胜宏科技（惠州）股份有限公司 | PCB (printed circuit board) thick copper board ink printing method |
| CN103152992A (en) * | 2012-12-27 | 2013-06-12 | 胜宏科技（惠州）股份有限公司 | Solder mask printing method of thick copper plate |
| CN103458621A (en) * | 2012-05-28 | 2013-12-18 | 深南电路有限公司 | Spraying method for thick copper circuit board |
-
2017
- 2017-06-29 CN CN201710516395.4A patent/CN107148158A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101534612A (en) * | 2009-04-10 | 2009-09-16 | 深圳市博敏电子有限公司 | Resistance welding superposition technology for PCB thick copper lines |
| CN101959372A (en) * | 2010-05-24 | 2011-01-26 | 大连太平洋多层线路板有限公司 | Super-thick copper circuit board solder resisting processing method |
| CN102523696A (en) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of thick copper plate |
| CN103458621A (en) * | 2012-05-28 | 2013-12-18 | 深南电路有限公司 | Spraying method for thick copper circuit board |
| CN103152992A (en) * | 2012-12-27 | 2013-06-12 | 胜宏科技（惠州）股份有限公司 | Solder mask printing method of thick copper plate |
| CN103079355A (en) * | 2012-12-28 | 2013-05-01 | 胜宏科技（惠州）股份有限公司 | PCB (printed circuit board) thick copper board ink printing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484349A (en) * | 2017-10-17 | 2017-12-15 | 珠海杰赛科技有限公司 | A kind of method for preventing printed circuit board welding resistance crackle |
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Application publication date: 20170908 |