CN103458621B - The spraying method of thick copper circuit board - Google Patents
The spraying method of thick copper circuit board Download PDFInfo
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- CN103458621B CN103458621B CN201210168904.6A CN201210168904A CN103458621B CN 103458621 B CN103458621 B CN 103458621B CN 201210168904 A CN201210168904 A CN 201210168904A CN 103458621 B CN103458621 B CN 103458621B
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Abstract
The embodiment of the invention discloses a kind of spraying method of thick copper circuit board and spraying equipment.Wherein, a kind of spraying method of thick copper circuit board, it may include：If the current number of times that welding resistance spraying is carried out to the thick copper circuit board is also not up to n times, welding resistance spraying then is carried out to thick copper circuit board, and the thick copper circuit board after being sprayed using first kind egative film to welding resistance is exposed development treatment, the circuit in surface patch and surface patch surrounding specified range opened a window with welding resistance on the thick copper circuit board；If current reach n times to the number of times that the thick copper circuit board carries out welding resistance spraying, welding resistance spraying then is carried out to thick copper circuit board, and the thick copper circuit board after being sprayed using Equations of The Second Kind egative film to welding resistance is exposed development treatment, the surface patch opened a window with welding resistance on the thick copper circuit board, the wherein thick copper circuit board need to carry out m welding resistance spraying altogether.The scheme of the embodiment of the present invention is conducive to improving thick copper circuit board upper surface patch and the solderability and assembleability of component.
Description
Technical field
The present invention relates to printed circuit board (PCB) manufacture field, and in particular to the spraying method of thick copper circuit board.
Background technology
At present, printed circuit board (PCB) (PCB, Printed Circuit Board) is made in processing, for thick copper circuit board,
During especially greater than more than 6OZ super thick copper coin processing welding resistance, welding resistance bubble is generally solved using the method for electrostatic spraying
Problem.
Prior art generally carries out spraying welding resistance, exposure, development and solidification flow by repeatedly circulating, until figure circuit
Untill the resist thickness of shoulder reaches requirement.Practice finds that the welding resistance so normally resulted on figure copper face or circuit surface is thick
Spend thickness, particularly copper it is thicker when, it is necessary to spraying number of times it is more, the resist thickness on figure copper face is thicker, works as spray
After number of times is applied more than 3 times, the resist thickness on copper face is generally very thick, and this is just easy to cause due to beside the patch of surface
Resist thickness is too high, and then the welding for influenceing component to be pasted with surface, causes the defect of failure welding (rosin joint)；Meanwhile, copper face
Upper solder mask is also easily caused plate thickness when blocked up is overproof and influence assembling.
The content of the invention
The embodiment of the present invention provides the spraying method and spraying equipment of thick copper circuit board, to improve thick copper circuit board upper table
Paste the solderability and assembleability with component in face.
On the one hand the embodiment of the present invention provides a kind of spraying method of thick copper circuit board, it may include：
Welding resistance spraying is carried out to thick copper circuit board, and using first kind egative film to carrying out the thick copper cash after welding resistance spraying
Road plate is exposed development treatment, the surface patch and surface patch surrounding specified range opened a window with welding resistance on the thick copper circuit board
Interior circuit；If the current number of times that welding resistance spraying is carried out to the thick copper circuit board is also not up to n times, to the thick copper circuit
Plate carries out welding resistance spraying, and is exposed development treatment to the thick copper circuit board after welding resistance spraying using the first kind egative film,
The circuit in surface patch and surface patch surrounding specified range opened a window with welding resistance on the thick copper circuit board；If currently to described
The number of times that thick copper circuit board carries out welding resistance spraying reaches n times, then carries out welding resistance spraying to the thick copper circuit board, and utilize second
Thick copper circuit board after class egative film is sprayed to welding resistance is exposed development treatment, with the table on the welding resistance windowing thick copper circuit board
Face is pasted, wherein, the thick copper circuit board needs to carry out m welding resistance spraying altogether, and the n is less than the m.
Optionally, the m is thick based on the welding resistance that single welding resistance sprays logicalnot circuit region on the obtained thick copper circuit board
Degree, and the thick value of copper of the thick copper circuit board are determined.
Optionally, the m and n difference is 1 or 2 or 3.
Optionally, the copper thickness of the thick copper circuit board is more than or equal to 6 ounces, and less than or equal to 21 ounces.
Optionally, in the surface patch and surface patch surrounding specified range that the welding resistance opens a window on the thick copper circuit board
Circuit includes：Paste and all circuits on the surface that welding resistance opens a window on the thick copper circuit board.
Optionally, the thick copper circuit board after being sprayed to welding resistance, which is exposed after development treatment, also to be included：To the thick copper
Wiring board carries out welding resistance curing process.
On the other hand the embodiment of the present invention also provides the spraying method of another thick copper circuit board, it may include：
Detect the current resist thickness in logicalnot circuit region on thick copper circuit board；If non-on the thick copper circuit board detected
The current resist thickness in land is less than the thick copper number of the thick copper circuit board, and the logicalnot circuit region on the thick copper circuit board
Current resist thickness and the difference of the copper thickness value of the thick copper circuit board are more than first threshold, then the thick copper circuit board are carried out
Welding resistance is sprayed, and is exposed development treatment to the thick copper circuit board after welding resistance spraying using first kind egative film, is opened a window with welding resistance
The circuit in surface patch and surface patch surrounding specified range on the thick copper circuit board；If the thick copper circuit detected
The current resist thickness in logicalnot circuit region is less than the thick copper number of the thick copper circuit board on plate, and non-on the thick copper circuit board
The current resist thickness in land and the difference of the copper thickness value of the thick copper circuit board are less than or equal to first threshold, then to institute
State thick copper circuit board and carry out welding resistance spraying, and development is exposed to the thick copper circuit board after welding resistance spraying using Equations of The Second Kind egative film
Processing, is pasted with the surface that welding resistance opens a window on the thick copper circuit board.
Optionally, the first threshold is less than or equal to 2 ounces.
Optionally, in the surface patch and surface patch surrounding specified range that the welding resistance opens a window on the thick copper circuit board
Circuit includes：Paste and all circuits on the surface that welding resistance opens a window on the thick copper circuit board.
Optionally, the thick copper circuit board after being sprayed to welding resistance, which is exposed after development treatment, also to be included：To the thick copper
Wiring board carries out welding resistance curing process.
On the other hand the embodiment of the present invention also provides a kind of spraying equipment, can include：
First spray equipment, judgment means and the second spray equipment,
Wherein, the first spray equipment, for carrying out welding resistance spraying to thick copper circuit board, and using first kind egative film to carrying out
The thick copper circuit board after welding resistance spraying is exposed development treatment, and the surface opened a window with welding resistance on the thick copper circuit board is pasted and should
Circuit in the patch surrounding specified range of surface；
Judgment means, for judging currently whether reached n times to the number of times that the thick copper circuit board carries out welding resistance spraying；
Second spray equipment, if judging for the judgment means current to the progress welding resistance spraying of above-mentioned thick copper circuit board
Number of times reach n times, to the thick copper circuit board carry out welding resistance spraying, and using Equations of The Second Kind egative film to welding resistance spray after the thick copper
Wiring board is exposed development treatment, is pasted with the surface that welding resistance opens a window on the thick copper circuit board.
Optionally, the m is thick based on the welding resistance that single welding resistance sprays logicalnot circuit region on the obtained thick copper circuit board
Degree, and the thick value of copper of the thick copper circuit board are determined.
Optionally, the m and n difference is 1 or 2 or 3.
Optionally, the copper thickness of the thick copper circuit board is more than or equal to 6 ounces, and less than or equal to 21 ounces.
Optionally, in the surface patch and surface patch surrounding specified range that the welding resistance opens a window on the thick copper circuit board
Circuit includes：Paste and all circuits on the surface that welding resistance opens a window on the thick copper circuit board.
Optionally, second spray equipment is additionally operable to, and the thick copper circuit board after being sprayed to welding resistance is exposed development
After processing, welding resistance curing process is carried out to the thick copper circuit board.
Optionally, first spray equipment is additionally operable to, and the thick copper circuit board after being sprayed to welding resistance is exposed development
After processing, welding resistance curing process is carried out to the thick copper circuit board.
On the other hand the embodiment of the present invention also provides another spraying equipment, can include：
Detection means, the second judgment means, the 3rd spray equipment and the 4th spray equipment；
Wherein, the current resist thickness in logicalnot circuit region on detection means, detection thick copper circuit board；
Judgment means, for judging the current welding resistance in logicalnot circuit region on the thick copper circuit board that the detection means is detected
Whether the difference of thickness and thick copper number, which is more than the current resist thickness in logicalnot circuit region in first threshold, and thick copper circuit board, is less than
Thick copper number；
3rd spray equipment, if judging the current welding resistance in logicalnot circuit region on thick copper circuit board for the judgment means
Thickness is less than the thick copper number of the thick copper circuit board, and the current resist thickness in logicalnot circuit region and the thick copper on the thick copper circuit board
The difference of the thick copper number of wiring board is more than first threshold, then welding resistance spraying is carried out to the thick copper circuit board, and utilize first kind bottom
The thick copper circuit board after piece is sprayed to welding resistance is exposed development treatment, is pasted with the surface that welding resistance opens a window on the thick copper circuit board
And the circuit in the patch surrounding specified range of the surface；
4th spray equipment, if judging the current welding resistance in logicalnot circuit region on thick copper circuit board for the judgment means
Thickness is less than the thick copper number of the thick copper circuit board, and the current resist thickness in logicalnot circuit region and the thick copper cash on thick copper circuit board
The difference of the thick copper number of road plate is less than or equal to first threshold, then welding resistance spraying is carried out to the thick copper circuit board, and utilize the
Thick copper circuit board after two class egative films are sprayed to welding resistance is exposed development treatment, is opened a window the table on the thick copper circuit board with welding resistance
Paste in face.
Optionally, the first threshold is less than or equal to 2 ounces.
Optionally, in the surface patch and surface patch surrounding specified range that the welding resistance opens a window on the thick copper circuit board
Circuit includes：Paste and all circuits on the surface that welding resistance opens a window on the thick copper circuit board.
Optionally, the 3rd spray equipment is additionally operable to, and the thick copper circuit board after being sprayed to welding resistance is exposed development
After processing, welding resistance curing process is carried out to the thick copper circuit board.
Optionally, the 3rd spray equipment is additionally operable to, and the thick copper circuit board after being sprayed to welding resistance is exposed development
After processing, welding resistance curing process is carried out to the thick copper circuit board.
Therefore, in a kind of scheme provided in an embodiment of the present invention, carry out multiple welding resistance in thick copper circuit board spray coated
Cheng Zhong, after preceding n progress welding resistance spraying, is exposed using first kind egative film to carrying out the thick copper circuit board after welding resistance spraying
Development treatment, the circuit in surface patch and surface patch surrounding specified range opened a window with welding resistance on the thick copper circuit board, then
Carry out after welding resistance spraying, the thick copper circuit board after being sprayed using Equations of The Second Kind egative film to welding resistance is exposed development treatment, with
Welding resistance open a window on the thick copper circuit board surface patch, in this way, be conducive to reduce surface patch and around it circuit resist thickness it is poor,
The resist thickness of control circuit, and then improve thick copper circuit board upper surface patch and the solderability and assembleability of component.
In another scheme provided in an embodiment of the present invention, in multiple welding resistance spraying process is carried out to thick copper circuit board,
The current resist thickness in logicalnot circuit region on thick copper circuit board is detected, if logicalnot circuit region is current on the thick copper circuit board detected
Resist thickness and the difference of copper thickness be more than first threshold, then welding resistance spraying is carried out to the thick copper circuit board, and utilizes first
Thick copper circuit board after class egative film is sprayed to welding resistance is exposed development treatment, is opened a window the surface on the thick copper circuit board with welding resistance
Circuit in patch and surface patch surrounding specified range；If the current welding resistance in logicalnot circuit region on the thick copper circuit board detected
The difference of thickness and copper thickness is less than or equal to first threshold, then carries out welding resistance spraying to the thick copper circuit board, and utilize second
Thick copper circuit board after class egative film is sprayed to welding resistance is exposed development treatment, is opened a window the surface on the thick copper circuit board with welding resistance
Patch, in this way, be then conducive to reduce surface patch and around it circuit resist thickness it is poor, the resist thickness of control circuit, Jin Erti
High thick copper circuit board upper surface patch and the solderability and assembleability of component.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 a are a kind of schematic flow sheets of the spraying method of thick copper circuit board provided in an embodiment of the present invention；
Fig. 1 b are a kind of spraying process schematic diagrames of thick copper circuit board provided in an embodiment of the present invention；
Fig. 2 is the schematic flow sheet of the spraying method of another thick copper circuit board provided in an embodiment of the present invention；
Fig. 3 is a kind of schematic diagram of spraying equipment provided in an embodiment of the present invention；
Fig. 4 is another spraying equipment schematic diagram provided in an embodiment of the present invention.
Embodiment
The embodiment of the present invention provides the spraying method of thick copper circuit board, to improve thick copper circuit board upper surface patch and first device
The solderability and assembleability of part.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
It is described in detail respectively by the following examples.
One embodiment of the spraying method of thick copper circuit board of the present invention, can include：Welding resistance is carried out to thick copper circuit board
Spraying, and development treatment is exposed to carrying out the thick copper circuit board after welding resistance spraying using first kind egative film, opened with welding resistance
The circuit in surface patch and surface patch surrounding specified range on the window thick copper circuit board；If currently entering to the thick copper circuit board
The number of times of row welding resistance spraying is also not up to n times, then welding resistance spraying is carried out to the thick copper circuit board, and using first kind egative film to resistance
The thick copper circuit board after weldering spraying is exposed development treatment, surface patch and the table opened a window with welding resistance on the thick copper circuit board
Circuit in the patch surrounding specified range of face；If current reach n times to the number of times that thick copper circuit board carries out welding resistance spraying, to the thickness
Copper circuit board carries out welding resistance spraying, and the thick copper circuit board after welding resistance spraying is exposed at development using Equations of The Second Kind egative film
Reason, is pasted with the surface that welding resistance opens a window on the thick copper circuit board, wherein, the thick copper circuit board needs to carry out m welding resistance spraying altogether, should
N is less than m.
Referring to Fig. 1 a, a kind of spraying method of thick copper circuit board provided in an embodiment of the present invention can include herein below：
101st, welding resistance spraying is carried out to thick copper circuit board, and using first kind egative film to carrying out the thick copper after welding resistance spraying
Wiring board is exposed development treatment, the surface patch and surface patch surrounding specified range opened a window with welding resistance on the thick copper circuit board
Interior circuit.
102nd, judge whether the current number of times to the progress welding resistance spraying of above-mentioned thick copper circuit board reaches n times.
If so, then return to step 101；
If it is not, then performing step 103.
Wherein, thick copper circuit board for example needs to carry out m welding resistance spraying altogether, and m is more than n.In some embodiments of the invention,
The m can for example spray the resist thickness and the thick copper circuit board in logicalnot circuit region on obtained thick copper circuit board based on single welding resistance
Copper thick value determine.For example, spraying the resist thickness phase in the thick copper circuit board logicalnot circuit region that thick copper circuit board is obtained every time
Together, it is assumed that the resist thickness in the thick copper circuit board logicalnot circuit region that spraying thick copper circuit board is obtained is 0.5 ounce every time, and thick copper
The copper thickness value of wiring board is 4 ounces, then can estimate m equal to 8 (0.5/4=8).Certainly, in some other embodiment of the invention
In, m size can be also determined otherwise, for example, can be moved according to rotating speed of shower nozzle, thick copper circuit board transfer rate, spray gun
Speed, ink spray the parameters such as the copper thickness of air pressure and thick copper circuit board to determine m size.
For example, m and n difference is 1 or 2 or 3 or other value.
103rd, welding resistance spraying is carried out to the thick copper circuit board, and using Equations of The Second Kind egative film to the thick copper cash after welding resistance spraying
Road plate is exposed development treatment, is pasted with the surface that welding resistance opens a window on the thick copper circuit board.
If current reach m times to the number of times that above-mentioned thick copper circuit board carries out welding resistance spraying, now non-thread on thick copper circuit board
The current resist thickness in road region is equal or substantially equal to the thick copper number of the thick copper circuit board, now stops welding resistance spraying.
It is appreciated that first kind egative film is two kinds of different egative films with Equations of The Second Kind egative film, the windowing effect different to realize
Really.
In some embodiments of the invention, model is specified around the surface patch and surface patch on welding resistance windowing thick copper circuit board
The step of enclosing interior circuit for example may include：Surface patch and all circuits on welding resistance windowing thick copper circuit board；Or welding resistance windowing
The line in surface patch and 5 millimeters, 10 millimeters or 15 millimeters of surface patch surrounding or other specified ranges on the thick copper circuit board
Road.
In some embodiments of the invention, the windowing value of the surface patch on welding resistance windowing thick copper circuit board is, for example, surface patch
Size+6mil (or other values), welding resistance windowing thick copper circuit board on circuit windowing value be, for example, wire sizes+6mil (or
Other values).
In some embodiments of the invention, the thick copper circuit board after being sprayed to welding resistance be exposed development treatment it
Afterwards, welding resistance curing process can be also further carried out to the thick copper circuit board (such as at welding resistance heat cure processing or other solidifications
Reason), for example, the thick copper circuit board after being sprayed every time to welding resistance is exposed after development treatment, further to the thick copper cash
Road plate carries out welding resistance curing process, then (if desired) carries out welding resistance spraying to the thick copper circuit board again.In some realities of the invention
Apply in example, every time before welding resistance spraying is carried out to thick copper circuit board, also welding resistance pre-treatment first can be carried out to the thick copper circuit board
(such as surface cleaning processing and surface coarsening processing are used to strengthen the processing of adhesive force).
In the present embodiment, the mode of welding resistance spraying can be electrostatic spraying or other existing spraying methods.
In the present embodiment, the copper thickness of thick copper circuit board is greater than or equal to 6 ounces, and less than or equal to 21 ounces, when
The copper thickness of right thick copper circuit board can also be the value in other scopes.
Referring to Fig. 1 b, a kind of exemplified spraying process of thick copper circuit board of Fig. 1 b altogether need to carry out 4 welding resistances sprayings,
Wherein, first kind egative film is 3 times used in Fig. 1 b in spraying process, Equations of The Second Kind egative film is used last 1 time.Certainly, in other realities
The access times of first kind egative film and Equations of The Second Kind egative film can also be adjusted as needed by applying in mode.
Therefore, in the present embodiment in thick copper circuit board carries out multiple welding resistance spraying process, preceding n progress welding resistance spray
After painting, development treatment is exposed to carrying out the thick copper circuit board after welding resistance spraying using first kind egative film, is opened a window with welding resistance
The circuit in surface patch and surface patch surrounding specified range on the thick copper circuit board, after then progress welding resistance spraying, profit
The thick copper circuit board after being sprayed with Equations of The Second Kind egative film to welding resistance is exposed development treatment, is opened a window the thick copper circuit board with welding resistance
On surface patch, in this way, be conducive to reduce surface patch and around it circuit resist thickness it is poor, the resist thickness of control circuit,
And then improve thick copper circuit board upper surface patch and the solderability and assembleability of component.
One embodiment of the spraying method of thick copper circuit board of the present invention, it may include：Detect logicalnot circuit on thick copper circuit board
The current resist thickness in region；If the difference of the current resist thickness in logicalnot circuit region and copper thickness on the thick copper circuit board detected
Value is more than first threshold, then welding resistance spraying is carried out to the thick copper circuit board, and using first kind egative film to the thickness after welding resistance spraying
Copper circuit board is exposed development treatment, and model is specified around opened a window with welding resistance surface patch and surface patch on the thick copper circuit board
Enclose interior circuit；If on the thick copper circuit board detected the difference of the current resist thickness in logicalnot circuit region and copper thickness be less than or
Equal to first threshold, then welding resistance spraying is carried out to the thick copper circuit board, and using Equations of The Second Kind egative film to the thick copper after welding resistance spraying
Wiring board is exposed development treatment, is pasted with the surface that welding resistance opens a window on the thick copper circuit board.
Referring to Fig. 2, the spraying method of another thick copper circuit board provided in an embodiment of the present invention can include in following
Hold：
201st, the current resist thickness in logicalnot circuit region on detection thick copper circuit board.
202nd, judging the difference of the current resist thickness in logicalnot circuit region and thick copper number on the thick copper circuit board detected is
The no resist thickness current more than logicalnot circuit region in first threshold, and thick copper circuit board is less than thick copper number.
Wherein, if the current resist thickness in logicalnot circuit region is less than the thick copper number of the thick copper circuit board on thick copper circuit board,
And the difference of the current resist thickness in logicalnot circuit region and the thick copper number of the thick copper circuit board is more than the first threshold on thick copper circuit board
Value, then perform step 203；
If judging, the current resist thickness in logicalnot circuit region on thick copper circuit board is less than the thick copper number of the thick copper circuit board,
And the difference of the current resist thickness in logicalnot circuit region and the thick copper number of the thick copper circuit board is less than or equal on thick copper circuit board
First threshold, then perform step 204.
If judging, the current resist thickness in logicalnot circuit region is more than or equal to the thick copper circuit board on thick copper circuit board
Thick copper number, then stop welding resistance spraying.
In some embodiments of the invention, e.g., less than or equal to 1 ounce of first threshold, 2 ounces, 3 ounces or other thickness
Angle value.For example, first threshold is less than or equal to once or twice or three welding resistances are sprayed on thick copper circuit board logicalnot circuit region
The getable resist thickness of institute.
203rd, welding resistance spraying is carried out to the thick copper circuit board, and using first kind egative film to the thick copper circuit after welding resistance spraying
Plate is exposed development treatment, in the surface patch and surface patch surrounding specified range opened a window with welding resistance on the thick copper circuit board
Circuit, return to step 201.
204th, welding resistance spraying is carried out to above-mentioned thick copper circuit board, and using Equations of The Second Kind egative film to the thick copper cash after welding resistance spraying
Road plate is exposed development treatment, is pasted with the surface that welding resistance opens a window on the thick copper circuit board, return to step 201.
It is appreciated that first kind egative film is two kinds of different egative films with Equations of The Second Kind egative film, the windowing effect different to realize
Really.
In some embodiments of the invention, model is specified around the surface patch and surface patch on welding resistance windowing thick copper circuit board
The step of enclosing interior circuit for example may include：Surface patch and all circuits on welding resistance windowing thick copper circuit board；Or welding resistance is opened
In surface patch and 5 millimeters, 10 millimeters or 15 millimeters of surface patch surrounding or other specified ranges on the window thick copper circuit board
Circuit.
In some embodiments of the invention, the windowing value of the surface patch on welding resistance windowing thick copper circuit board is, for example, surface patch
Size+6mil (or other values), welding resistance windowing thick copper circuit board on circuit windowing value be, for example, wire sizes+6mil (or
Other values).
In some embodiments of the invention, the thick copper circuit board after being sprayed to welding resistance be exposed development treatment it
Afterwards, welding resistance curing process can be also further carried out to the thick copper circuit board (such as at welding resistance heat cure processing or other solidifications
Reason), for example, the thick copper circuit board after being sprayed every time to welding resistance is exposed after development treatment, further to the thick copper cash
Road plate carries out welding resistance curing process, then (if desired) carries out welding resistance spraying to the thick copper circuit board again.In some realities of the invention
Apply in example, every time before welding resistance spraying is carried out to thick copper circuit board, also welding resistance pre-treatment first can be carried out to the thick copper circuit board
(such as surface cleaning processing, the processing of surface coarsening processing enhancing adhesive force).
In the present embodiment, the mode of welding resistance spraying can be electrostatic spraying or other existing spraying methods.
In the present embodiment, the copper thickness of thick copper circuit board is greater than or equal to 6 ounces, and less than or equal to 21 ounces, when
The copper thickness of right thick copper circuit board can also be the value in other scopes.
Therefore, in the present embodiment in thick copper circuit board carries out multiple welding resistance spraying process, detect thick copper circuit board
The current resist thickness in upper logicalnot circuit region, if logicalnot circuit region current resist thickness and copper on the thick copper circuit board detected
The difference of thickness is more than first threshold, then welding resistance spraying is carried out to the thick copper circuit board, and welding resistance is sprayed using first kind egative film
Thick copper circuit board after painting is exposed development treatment, surface patch and the surface patch week opened a window with welding resistance on the thick copper circuit board
Enclose the circuit in specified range；If the difference of the current resist thickness in logicalnot circuit region and copper thickness on the thick copper circuit board detected
Value is less than or equal to first threshold, then welding resistance spraying is carried out to the thick copper circuit board, and welding resistance is sprayed using Equations of The Second Kind egative film
Thick copper circuit board afterwards is exposed development treatment, is pasted with the surface that welding resistance opens a window on the thick copper circuit board, is so conducive to subtracting
Small surface patch and around it circuit resist thickness it is poor, the resist thickness of control circuit, and then raising thick copper circuit board upper surface
Patch and the solderability and assembleability of component.
For ease of preferably implementing the such scheme of the embodiment of the present invention, the phase for implementing the above method is also provided below
Close equipment.
Referring to Fig. 3, a kind of spraying equipment 300 provided in an embodiment of the present invention can include：
First spray equipment 310, the spray equipment 330 of judgment means 320 and second.
Wherein, the first spray equipment 310, for carrying out welding resistance spraying to thick copper circuit board, and utilizes first kind egative film pair
Carry out the thick copper circuit board after welding resistance spraying and be exposed development treatment, pasted with the surface that welding resistance opens a window on the thick copper circuit board
And the circuit in the patch surrounding specified range of the surface；
Judgment means 320, for judging currently whether reach n to the number of times that above-mentioned thick copper circuit board carries out welding resistance spraying
It is secondary；
Wherein, thick copper circuit board for example needs to carry out m welding resistance spraying altogether, and m is more than n.In some embodiments of the invention,
The m can for example spray the resist thickness and the thick copper circuit board in logicalnot circuit region on obtained thick copper circuit board based on single welding resistance
Copper thick value determine.For example, spraying the resist thickness phase in the thick copper circuit board logicalnot circuit region that thick copper circuit board is obtained every time
Together, it is assumed that the resist thickness in the thick copper circuit board logicalnot circuit region that spraying thick copper circuit board is obtained is 0.5 ounce every time, and thick copper
The copper thickness value of wiring board is 4 ounces, then can estimate m equal to 8 (0.5/4=8).Certainly, in some other embodiment of the invention
In, m size can be also determined otherwise, for example, can be moved according to rotating speed of shower nozzle, thick copper circuit board transfer rate, spray gun
Speed, ink spray the parameters such as the copper thickness of air pressure and thick copper circuit board to determine m size.
For example, m and n difference is 1 or 2 or 3 or other value.
Second spray equipment 330, if judging for judgment means 320 current to the progress welding resistance spray of above-mentioned thick copper circuit board
The number of times of painting is reached n times, and welding resistance spraying is carried out to the thick copper circuit board, and using Equations of The Second Kind egative film to the thickness after welding resistance spraying
Copper circuit board is exposed development treatment, is pasted with the surface that welding resistance opens a window on the thick copper circuit board.
If current reach m times to the number of times that above-mentioned thick copper circuit board carries out welding resistance spraying, now non-thread on thick copper circuit board
The current resist thickness in road region is equal or substantially equal to the thick copper number of the thick copper circuit board, and now the second spray equipment 330 stops
Only welding resistance is sprayed.
First spray equipment 310 is additionally operable to, if judgment means 320 are judged currently to carry out welding resistance to above-mentioned thick copper circuit board
The number of times of spraying is not up to n times, and welding resistance spraying is carried out to thick copper circuit board, and using first kind egative film to carrying out after welding resistance spraying
The thick copper circuit board be exposed development treatment, with welding resistance open a window on the thick copper circuit board surface patch and the surface patch around
Circuit in specified range.
It is appreciated that first kind egative film is two kinds of different egative films with Equations of The Second Kind egative film, the windowing effect different to realize
Really.
In some embodiments of the invention, the first spray equipment 310 can welding resistance windowing thick copper circuit board on surface patch and
All circuits；Or first spray equipment 310 can welding resistance open a window on the thick copper circuit board surface patch and the surface patch around 5 milli
Circuit in rice, 10 millimeters or 15 millimeters or other specified ranges.
In some embodiments of the invention, what the surface on the welding resistance of the first spray equipment 310 windowing thick copper circuit board was pasted opens
Window values are, for example, that the windowing value of the circuit on surface patch size+6mil (or other values), welding resistance windowing thick copper circuit board is, for example,
Wire sizes+6mil (or other values).The windowing value example of surface patch on the welding resistance of second spray equipment 330 windowing thick copper circuit board
Size+6mil (or other values) is pasted on surface in this way.
In some embodiments of the invention, the first spray equipment 310 can be additionally used in, the thick copper cash after being sprayed to welding resistance
Road plate is exposed after development treatment, further carries out welding resistance curing process (such as welding resistance heat cure to the thick copper circuit board
Processing or other curing process), for example, thick copper circuit board of first spray equipment 310 after being sprayed every time to welding resistance exposes
After photodevelopment processing, welding resistance curing process further is carried out to the thick copper circuit board, then (if desired) again to the thick copper cash
Road plate carries out welding resistance spraying.In some embodiments of the invention, the first spray equipment 310 can be additionally used in, every time to thick copper cash
Road plate is carried out before welding resistance spraying, and welding resistance pre-treatment (such as surface cleaning processing and surface coarsening are first carried out to the thick copper circuit board
Processing etc. is used to strengthen the processing of adhesive force).
In some embodiments of the invention, the second spray equipment 330 can be additionally used in, the thick copper cash after being sprayed to welding resistance
Road plate is exposed after development treatment, further carries out welding resistance curing process (such as welding resistance heat cure to the thick copper circuit board
Processing or other curing process), for example, thick copper circuit board of second spray equipment 330 after being sprayed every time to welding resistance exposes
After photodevelopment processing, welding resistance curing process further is carried out to the thick copper circuit board, then (if desired) again to the thick copper cash
Road plate carries out welding resistance spraying.In some embodiments of the invention, the second spray equipment 330 can be additionally used in, every time to thick copper cash
Road plate is carried out before welding resistance spraying, and welding resistance pre-treatment (such as surface cleaning processing and surface coarsening are first carried out to the thick copper circuit board
Processing etc. is used to strengthen the processing of adhesive force).
In the present embodiment, the mode of the first spray equipment 310 and the spraying of the welding resistance of the second spray equipment 330 can be electrostatic spraying
Or other existing spraying methods.
In the present embodiment, the copper thickness of thick copper circuit board is greater than or equal to 6 ounces, and less than or equal to 21 ounces, when
The copper thickness of right thick copper circuit board can also be the value in other scopes.
It is understood that the function of each functional module of the spraying equipment 300 of the present embodiment can be according to above-mentioned side
The method of method embodiment introduction is implemented, and it implements process and may refer to associated description in above-described embodiment, wherein
It can also include being used for electronic equipment of assistance execution above method embodiment etc., will not be repeated here.
Therefore, spraying equipment 300 is in thick copper circuit board carries out multiple welding resistance spraying process in the present embodiment, preceding n
After secondary progress welding resistance spraying, it is exposed using first kind egative film to carrying out the thick copper circuit board after welding resistance spraying at development
Reason, the circuit in surface patch and surface patch surrounding specified range opened a window with welding resistance on the thick copper circuit board, is then hindered
After weldering spraying, the thick copper circuit board after being sprayed using Equations of The Second Kind egative film to welding resistance is exposed development treatment, is opened with welding resistance
On the window thick copper circuit board surface patch, so then be conducive to reduce surface patch and around it circuit resist thickness it is poor, control
The resist thickness of circuit, and then improve thick copper circuit board upper surface patch and the solderability and assembleability of component.
Referring to Fig. 4, the embodiment of the present invention also provides another spraying equipment 400, can include：Detection means 410, second
Judgment means 420, the 3rd spray equipment 430 and the 4th spray equipment 440.
Wherein, the current resist thickness in logicalnot circuit region on detection means 410, detection thick copper circuit board.
Judgment means 420, for judging the resistance of logicalnot circuit region currently on the thick copper circuit board that detection means 410 is detected
Weld the thickness resist thickness whether current more than logicalnot circuit region in first threshold, and thick copper circuit board with the difference of thick copper number small
In thick copper number.
3rd spray equipment 430, if judging the resistance of logicalnot circuit region currently on thick copper circuit board for judgment means 420
Weld the thick copper number that thickness is less than the thick copper circuit board, and the current resist thickness in logicalnot circuit region and the thickness on the thick copper circuit board
The difference of the thick copper number of copper circuit board is more than first threshold, then carries out welding resistance spraying to the thick copper circuit board, and utilize the first kind
The thick copper circuit board after egative film is sprayed to welding resistance is exposed development treatment, is opened a window the surface on the thick copper circuit board with welding resistance
Circuit in patch and surface patch surrounding specified range.
4th spray equipment 440, if judging the resistance of logicalnot circuit region currently on thick copper circuit board for judgment means 420
Weld the thick copper number that thickness is less than the thick copper circuit board, and the current resist thickness in logicalnot circuit region and the thick copper on thick copper circuit board
The difference of the thick copper number of wiring board is less than or equal to first threshold, then carries out welding resistance spraying to above-mentioned thick copper circuit board, and utilize
Thick copper circuit board after Equations of The Second Kind egative film is sprayed to welding resistance is exposed development treatment, is opened a window with welding resistance on the thick copper circuit board
Paste on surface.
If in addition, judgment means 420 judge that the current resist thickness in logicalnot circuit region is more than or waited on thick copper circuit board
In the thick copper number of the thick copper circuit board, then stop welding resistance spraying.
In some embodiments of the invention, e.g., less than or equal to 1 ounce of first threshold, 2 ounces, 3 ounces or other thickness
Angle value.For example, first threshold is less than or equal to once or twice or three welding resistances are sprayed on thick copper circuit board logicalnot circuit region
The getable resist thickness of institute.
It is appreciated that first kind egative film is two kinds of different egative films with Equations of The Second Kind egative film, the windowing effect different to realize
Really.
In some embodiments of the invention, what the surface on the welding resistance of the 3rd spray equipment 430 windowing thick copper circuit board was pasted opens
Window values are, for example, that the windowing value of the circuit on surface patch size+6mil (or other values), welding resistance windowing thick copper circuit board is, for example,
Wire sizes+6mil (or other values).The windowing value example of surface patch on the welding resistance of 4th spray equipment 440 windowing thick copper circuit board
Size+6mil (or other values) is pasted on surface in this way.
In some embodiments of the invention, the 3rd spray equipment 430 can be additionally used in, the thick copper cash after being sprayed to welding resistance
Road plate is exposed after development treatment, further carries out welding resistance curing process (such as welding resistance heat cure to the thick copper circuit board
Processing or other curing process), for example, thick copper circuit board of the 3rd spray equipment 430 after being sprayed every time to welding resistance exposes
After photodevelopment processing, welding resistance curing process further is carried out to the thick copper circuit board, then (if desired) again to the thick copper cash
Road plate carries out welding resistance spraying.In some embodiments of the invention, the 3rd spray equipment 430 can be additionally used in, every time to thick copper cash
Road plate is carried out before welding resistance spraying, and welding resistance pre-treatment (such as surface cleaning processing and surface coarsening are first carried out to the thick copper circuit board
Processing etc. is used to strengthen the processing of adhesive force).
In some embodiments of the invention, the 4th spray equipment 440 can be additionally used in, the thick copper cash after being sprayed to welding resistance
Road plate is exposed after development treatment, further carries out welding resistance curing process (such as welding resistance heat cure to the thick copper circuit board
Processing or other curing process), for example, thick copper circuit board of the 4th spray equipment 440 after being sprayed every time to welding resistance exposes
After photodevelopment processing, welding resistance curing process further is carried out to the thick copper circuit board, then (if desired) again to the thick copper cash
Road plate carries out welding resistance spraying.In some embodiments of the invention, the 4th spray equipment 440 can be additionally used in, every time to thick copper cash
Road plate is carried out before welding resistance spraying, and welding resistance pre-treatment (such as surface cleaning processing and surface coarsening are first carried out to the thick copper circuit board
Processing etc. is used to strengthen the processing of adhesive force).
In the present embodiment, the mode of the 3rd spray equipment 430 and the spraying of the welding resistance of the 4th spray equipment 440 can be electrostatic spraying
Or other existing spraying methods.
In the present embodiment, the copper thickness of thick copper circuit board is greater than or equal to 6 ounces, and less than or equal to 21 ounces, when
The copper thickness of right thick copper circuit board can also be the value in other scopes.
It is understood that the function of each functional module of the spraying equipment 400 of the present embodiment can be according to above-mentioned side
The method of method embodiment introduction is implemented, and it implements process and may refer to associated description in above-described embodiment, wherein
It can also include being used for electronic equipment of assistance execution above method embodiment etc., will not be repeated here.
Therefore, in the present embodiment, spraying equipment 400 is carried out in thick copper circuit board in multiple welding resistance spraying process, inspection
The current resist thickness in logicalnot circuit region on thickness measuring copper circuit board, if logicalnot circuit region is current on the thick copper circuit board detected
The difference of resist thickness and copper thickness is more than first threshold, then carries out welding resistance spraying to the thick copper circuit board, and utilize the first kind
Thick copper circuit board after egative film is sprayed to welding resistance is exposed development treatment, is pasted with the surface that welding resistance opens a window on the thick copper circuit board
And the circuit in the patch surrounding specified range of the surface；If the current resist thickness in logicalnot circuit region on the thick copper circuit board detected
It is less than or equal to first threshold with the difference of copper thickness, then welding resistance spraying is carried out to the thick copper circuit board, and utilize Equations of The Second Kind bottom
Thick copper circuit board after piece is sprayed to welding resistance is exposed development treatment, is pasted with the surface that welding resistance opens a window on the thick copper circuit board,
So be advantageous for reduce surface patch and around it circuit resist thickness it is poor, the resist thickness of effective control circuit, Jin Erti
High thick copper circuit board upper surface patch and the solderability and assembleability of component.
It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement because
According to the present invention, some steps can be carried out sequentially or simultaneously using other.Secondly, those skilled in the art should also know
Know, embodiment described in this description belongs to preferred embodiment, involved action and module is not necessarily of the invention
It is necessary.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and does not have the portion being described in detail in some embodiment
Point, it may refer to the associated description of other embodiment.
To sum up, in a kind of technical scheme provided in an embodiment of the present invention, multiple welding resistance is carried out in thick copper circuit board spray coated
Cheng Zhong, after preceding n progress welding resistance spraying, is exposed using first kind egative film to carrying out the thick copper circuit board after welding resistance spraying
Development treatment, the circuit in surface patch and surface patch surrounding specified range opened a window with welding resistance on the thick copper circuit board, then
Carry out after welding resistance spraying, the thick copper circuit board after being sprayed using Equations of The Second Kind egative film to welding resistance is exposed development treatment, with
Welding resistance open a window on the thick copper circuit board surface patch, in this way, be conducive to reduce surface patch and around it circuit resist thickness it is poor,
The resist thickness of control circuit, and then improve thick copper circuit board upper surface patch and the solderability and assembleability of component.
In another scheme provided in an embodiment of the present invention, in multiple welding resistance spraying process is carried out to thick copper circuit board,
The current resist thickness in logicalnot circuit region on thick copper circuit board is detected, if logicalnot circuit region is current on the thick copper circuit board detected
Resist thickness and the difference of copper thickness be more than first threshold, then welding resistance spraying is carried out to the thick copper circuit board, and utilizes first
Thick copper circuit board after class egative film is sprayed to welding resistance is exposed development treatment, is opened a window the surface on the thick copper circuit board with welding resistance
Circuit in patch and surface patch surrounding specified range；If the current welding resistance in logicalnot circuit region on the thick copper circuit board detected
The difference of thickness and copper thickness is less than or equal to first threshold, then carries out welding resistance spraying to the thick copper circuit board, and utilize second
Thick copper circuit board after class egative film is sprayed to welding resistance is exposed development treatment, is opened a window the surface on the thick copper circuit board with welding resistance
Patch, in this way, be then conducive to reduce surface patch and around it circuit resist thickness it is poor, the resist thickness of control circuit, Jin Erti
High thick copper circuit board upper surface patch and the solderability and assembleability of component.
The spraying method and relevant device of the thick copper circuit board provided above the embodiment of the present invention have carried out detailed Jie
Continue, specific case used herein is set forth to the principle and embodiment of the present invention, the explanation of above example is only
It is the method and its core concept for being used to help understand the present invention；Simultaneously for those of ordinary skill in the art, according to this hair
Bright thought, will change in specific embodiments and applications, to sum up, and this specification content should not be construed as
Limitation of the present invention.
Claims (10)
1. a kind of spraying method of thick copper circuit board, it is characterised in that including：
Welding resistance spraying is carried out to thick copper circuit board, and using first kind egative film to carrying out the thick copper circuit board after welding resistance spraying
Development treatment is exposed, in the surface patch and surface patch surrounding specified range opened a window with welding resistance on the thick copper circuit board
Circuit；
Judge whether the current number of times to thick copper circuit board progress welding resistance spraying reaches n times；
If the current number of times that welding resistance spraying is carried out to the thick copper circuit board is also not up to n times, the thick copper circuit board is entered
Row welding resistance is sprayed, and is exposed development treatment to the thick copper circuit board after welding resistance spraying using the first kind egative film, to hinder
The circuit in surface patch and surface patch surrounding specified range on the weldering windowing thick copper circuit board；If currently to the thick copper
The number of times that wiring board carries out welding resistance spraying reaches n times, then welding resistance spraying is carried out to the thick copper circuit board, and utilize Equations of The Second Kind bottom
Thick copper circuit board after piece is sprayed to welding resistance is exposed development treatment, with the surface on the welding resistance windowing thick copper circuit board
Patch, wherein, the thick copper circuit board needs to carry out m welding resistance spraying altogether, and the n is less than the m.
2. according to the method described in claim 1, it is characterised in that the m sprays the obtained thick copper based on single welding resistance
The resist thickness in logicalnot circuit region on wiring board, and the thick value of copper of the thick copper circuit board are determined.
3. method according to claim 2, it is characterised in that
The m and n difference is 1 or 2 or 3.
4. the method according to any one of claims 1 to 3, it is characterised in that the copper thickness of the thick copper circuit board be more than or
Equal to 6 ounces, and less than or equal to 21 ounces.
5. the method according to any one of claims 1 to 3, it is characterised in that the welding resistance windowing thick copper circuit board
On surface patch and the surface patch surrounding specified range in circuit include：Paste on the surface that welding resistance opens a window on the thick copper circuit board
With all circuits.
6. the method according to any one of claims 1 to 3, it is characterised in that the thick copper circuit after the spraying to welding resistance
Plate also includes after being exposed development treatment：Welding resistance curing process is carried out to the thick copper circuit board.
7. a kind of spraying method of thick copper circuit board, it is characterised in that including：
Detect the current resist thickness in logicalnot circuit region on thick copper circuit board；
If the current resist thickness in logicalnot circuit region is less than the thick copper of the thick copper circuit board on the thick copper circuit board detected
It is worth, and the difference of the copper thickness value of the current resist thickness in the logicalnot circuit region on the thick copper circuit board and the thick copper circuit board is big
In first threshold, then welding resistance spraying is carried out to the thick copper circuit board, and using first kind egative film to the thick copper after welding resistance spraying
Wiring board is exposed development treatment, and model is specified around opened a window with welding resistance surface patch and surface patch on the thick copper circuit board
Enclose interior circuit；
If the current resist thickness in logicalnot circuit region is less than the thickness of the thick copper circuit board on the thick copper circuit board detected
The current resist thickness in logicalnot circuit region on copper number, and the thick copper circuit board and the difference of the copper thickness value of the thick copper circuit board
Value is less than or equal to first threshold, then welding resistance spraying is carried out to the thick copper circuit board, and welding resistance is sprayed using Equations of The Second Kind egative film
Thick copper circuit board after painting is exposed development treatment, is pasted with the surface that welding resistance opens a window on the thick copper circuit board.
8. method according to claim 7, it is characterised in that
The first threshold is less than or equal to 2 ounces.
9. the method according to any one of claim 7 to 8, it is characterised in that the welding resistance windowing thick copper circuit board
On surface patch and the surface patch surrounding specified range in circuit include：Paste on the surface that welding resistance opens a window on the thick copper circuit board
With all circuits.
10. the method according to any one of claim 7 to 8, it is characterised in that the thick copper circuit after the spraying to welding resistance
Plate also includes after being exposed development treatment：Welding resistance curing process is carried out to the thick copper circuit board.
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| CN201210168904.6A CN103458621B (en) | 2012-05-28 | 2012-05-28 | The spraying method of thick copper circuit board |
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| CN201210168904.6A CN103458621B (en) | 2012-05-28 | 2012-05-28 | The spraying method of thick copper circuit board |
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| CN104742547B (en) * | 2015-04-03 | 2018-04-24 | 昆山万源通电子科技有限公司 | Two ounces of pcb board typographies |
| CN107027244B (en) * | 2016-01-29 | 2019-06-28 | 无锡深南电路有限公司 | A kind of production method of super thick copper circuit board |
| CN106304665A (en) * | 2016-08-30 | 2017-01-04 | 江门全合精密电子有限公司 | The manufacture method of 10 ounce's copper printed circuit board (PCB)s |
| WO2018105000A1 (en) * | 2016-12-05 | 2018-06-14 | 三菱電機株式会社 | Printed wiring board, air conditioner, and method for manufacturing printed wiring board |
| CN107072063A (en) * | 2017-05-26 | 2017-08-18 | 江门崇达电路技术有限公司 | A kind of PCB solder-resisting manufacturing methods |
| CN107148158A (en) * | 2017-06-29 | 2017-09-08 | 珠海杰赛科技有限公司 | The preparation method and device of a kind of printed circuit board |
| CN109413868A (en) * | 2018-12-12 | 2019-03-01 | 东莞市若美电子科技有限公司 | Power panel low pressure spray manufacture craft |
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| CN102076176A (en) * | 2009-11-25 | 2011-05-25 | 北大方正集团有限公司 | A solder mask ink coating method |
| CN102196669A (en) * | 2010-03-17 | 2011-09-21 | 山荣化学有限公司 | Printed circuit board and manufacturing method thereof |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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