CN102458039A - Thick copper circuit board - Google Patents
Thick copper circuit board Download PDFInfo
- Publication number
- CN102458039A CN102458039A CN2010105104935A CN201010510493A CN102458039A CN 102458039 A CN102458039 A CN 102458039A CN 2010105104935 A CN2010105104935 A CN 2010105104935A CN 201010510493 A CN201010510493 A CN 201010510493A CN 102458039 A CN102458039 A CN 102458039A
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- CN
- China
- Prior art keywords
- line
- resistance welding
- soldering
- resistance layer
- welding film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention provides a thick copper circuit board which comprises a first resistance welding film, a second resistance welding film, a line and a base material zone. The line is provided on an insulating layer of the base material zone. Specification of the first resistance welding film is compatible with specification of the line. The first resistance welding film covers the line and is connected with the base material zone. The second resistance welding film is connected with the first resistance welding film and covers line gap and surface which are not covered by the first resistance welding film. Compared with the prior art, in the invention, the two resistance welding films cover the line, and defects of small bubble resistance welding crinkling, line reddening and the like generated at line edge of the printed board can be avoided well. According to the invention, production efficiency and production quality are raised, a production progress is accelerated, and production cost is reduced.
Description
Technical field
The present invention relates to a kind of wiring board, especially relate to a kind of thick copper circuit board.
Background technology
At present along with the electronics industry develop rapidly; Demand in fields such as automobile, industrial equipment, electronic communications to the wiring board of high voltage, big electric current is more and more, generally all requires greater than more than the 140um and the copper of this type of wiring board is thick, when producing this type of wiring board; Because copper thickness is thicker; In resistance weldering manufacturing process, occur quality problems such as line limit resistance weldering lack of fill, foaming, line be rubescent easily, influence manufacturing schedule, cause the cost rising.
Summary of the invention
The object of the invention is exactly for the defective that overcomes above-mentioned prior art existence a kind of thick copper circuit board of avoiding circuit printed line limit resistance weldering lack of fill to be provided.
The object of the invention can be realized through following technical scheme:
A kind of thick copper circuit board; Comprise first soldering-resistance layer, second soldering-resistance layer, circuit, substrate area; Said circuit is arranged on the insulating barrier of substrate area; The specification of said first soldering-resistance layer and circuit specification are complementary, and first soldering-resistance layer covers and to be connected on the line and with substrate area, and said second soldering-resistance layer is connected with first soldering-resistance layer and covers first soldering-resistance layer unlapped circuit space and surface.
Compared with prior art, the present invention utilizes two-layer weldering film will cover on the line, can better avoid producing at the circuit edge of printed board the generation that defectives such as Zou, line be rubescent have been welded in the minute bubbles resistance.Improved production efficiency and production quality, accelerated manufacturing schedule, reduced production costs.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Wherein, 1-first soldering-resistance layer, 2-second soldering-resistance layer, 3-circuit, 4-substrate area.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the present invention is elaborated.
As shown in the figure; A kind of thick copper circuit board; Comprise first soldering-resistance layer 1, second soldering-resistance layer 2, circuit 3, substrate area 4, said circuit 3 is arranged on the insulating barrier of substrate area 4, and the specification of first soldering-resistance layer 1 and circuit 3 specifications are complementary; First soldering-resistance layer 2 covers on the circuit 3 and with substrate area 4 and is connected, and second soldering-resistance layer 2 is connected with first soldering-resistance layer 1 and covers first soldering-resistance layer, 1 unlapped circuit 3 spaces and surface.
With 1 processing of first soldering-resistance layer, curing, polishing, 2 processing of second soldering-resistance layer, curing.First soldering-resistance layer 1 is covered on the substrate area 4 of thick copper circuit board, and second soldering-resistance layer 2 covers first soldering-resistance layer, 1 surface and circuit 3 surfaces.What the contraposition film of soldering-resistance layer 1 processing for the first time adopted is the figure after circuit 3 figures are made amendment; Second soldering-resistance layer 2 fills up not space, line limit and the circuit surface of complete filling of first soldering-resistance layer 1, thereby problems such as Zou, foaming, line be rubescent have been welded in the resistance that effectively solves thick copper circuit board.
Claims (1)
1. thick copper circuit board; It is characterized in that; Comprise first soldering-resistance layer, second soldering-resistance layer, circuit, substrate area, said circuit is arranged on the insulating barrier of substrate area, and the specification of said first soldering-resistance layer and circuit specification are complementary; First soldering-resistance layer covers and to be connected on the line and with substrate area, and said second soldering-resistance layer is connected with first soldering-resistance layer and covers first soldering-resistance layer unlapped circuit space and surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105104935A CN102458039A (en) | 2010-10-18 | 2010-10-18 | Thick copper circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105104935A CN102458039A (en) | 2010-10-18 | 2010-10-18 | Thick copper circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102458039A true CN102458039A (en) | 2012-05-16 |
Family
ID=46040510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105104935A Pending CN102458039A (en) | 2010-10-18 | 2010-10-18 | Thick copper circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102458039A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103458621A (en) * | 2012-05-28 | 2013-12-18 | 深南电路有限公司 | Spraying method for thick copper circuit board |
| CN112770525A (en) * | 2020-12-18 | 2021-05-07 | 珠海杰赛科技有限公司 | Manufacturing method of printed circuit board |
| CN115226324A (en) * | 2022-09-20 | 2022-10-21 | 广东科翔电子科技股份有限公司 | Mini-LED small-spacing COB product gold manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0675532A2 (en) * | 1994-03-31 | 1995-10-04 | Du Pont Kabushiki Kaisha | Method for forming solder bump in IC mounting board |
| JPH10244206A (en) * | 1997-03-04 | 1998-09-14 | Kansai Paint Co Ltd | Method for formation of solder resist film |
| JP2000277898A (en) * | 1999-03-24 | 2000-10-06 | Nippon Avionics Co Ltd | Board for mounting of ball grid array package |
-
2010
- 2010-10-18 CN CN2010105104935A patent/CN102458039A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0675532A2 (en) * | 1994-03-31 | 1995-10-04 | Du Pont Kabushiki Kaisha | Method for forming solder bump in IC mounting board |
| JPH10244206A (en) * | 1997-03-04 | 1998-09-14 | Kansai Paint Co Ltd | Method for formation of solder resist film |
| JP2000277898A (en) * | 1999-03-24 | 2000-10-06 | Nippon Avionics Co Ltd | Board for mounting of ball grid array package |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103458621A (en) * | 2012-05-28 | 2013-12-18 | 深南电路有限公司 | Spraying method for thick copper circuit board |
| CN103458621B (en) * | 2012-05-28 | 2017-08-08 | 深南电路有限公司 | The spraying method of thick copper circuit board |
| CN112770525A (en) * | 2020-12-18 | 2021-05-07 | 珠海杰赛科技有限公司 | Manufacturing method of printed circuit board |
| CN115226324A (en) * | 2022-09-20 | 2022-10-21 | 广东科翔电子科技股份有限公司 | Mini-LED small-spacing COB product gold manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120516 |