CN104582275A - Preparation method of PCB (printed circuit board) made of high-frequency material and PCB made of high-frequency material - Google Patents
Preparation method of PCB (printed circuit board) made of high-frequency material and PCB made of high-frequency material Download PDFInfo
- Publication number
- CN104582275A CN104582275A CN201310487644.3A CN201310487644A CN104582275A CN 104582275 A CN104582275 A CN 104582275A CN 201310487644 A CN201310487644 A CN 201310487644A CN 104582275 A CN104582275 A CN 104582275A
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- CN
- China
- Prior art keywords
- pcb board
- pcb
- frequency material
- cover plate
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a preparation method of a PCB (printed circuit board) made of a high-frequency material and the PCB made of the high-frequency material. The preparation method mainly comprises the following steps: a processing flow of the high-frequency material is optimized; after electroplating, a circuit graph is not printed on the PCB made of the high-frequency material, so that when an upper cover plate and a lower cover plate of the PCB made of the high-frequency material are subjected to forming processing, the upper cover plate and the lower cover plate are tightly combined with the PCB made of the high-frequency material, a gap is not generated, and burrs or rough edges are not generated during forming processing, after the forming processing, the PCB made of the high-frequency material is subjected to secondary forming, and the PCB made of the high-frequency material is prepared. Therefore, when the cover plates are covered again, connecting positions and the circuit graph can be tightly connected with the cover plates, the gaps are avoided, and the burrs or rough edges are not generated during forming processing.
Description
Technical field
The present invention relates to printed circuit board and manufacture field, particularly relate to a kind of preparation method of pcb board of high frequency material and the pcb board of high frequency material.
Background technology
In current PCB industry, processing method for the processing method of the pcb board of high frequency material and the pcb board of other conventional material is basically identical, comprising: blanking, inner figure, pressing, boring, PTH/ plating, outer graphics, anti-welding, surface treatment, shaping, repair (repairing burr manually), electrical measurement, visual examination, packaging shipment.Wherein, after plating completes, by etching pcb board, form outer graphics (namely print and form line pattern).Next, after surface treatment, add a cover cover plate pcb board is upper and lower, and adopt the molding mode of mechanical milling or punching press, pcb board is cut into the PCB daughter board of required size, shape.
As shown in Figure 1, for completing the pcb board of surface-treated high frequency material, wherein, the pcb board of high frequency material having the line pattern of etching, there is certain drop in described line pattern and pcb board plane.And then, formed shown in Fig. 2 add the pcb board of the high frequency material being stamped upper and lower cover plate time, space as shown in Figure 2 can be produced, and this space is determined by the thickness of the line pattern on the pcb board of high frequency material (copper is thick), the thickness of line pattern is larger, and the space of the pcb board of upper cover plate and high frequency material is larger.
With polytetrafluoroethylene (PTFE, Poly tetra fluoro tehylene) pcb board of this high frequency material is example, because the material of PTFE material is very soft, cutting ability is poor, the waste material of the thread or sheet produced time shaping, owing to there is space because circuit supports mutually between cover plate and pcb board, therefore, the waste material of generation can be bonded at the surface of pcb board, thus produces a large amount of burrs or burr, need to use external force to remove, namely need the technique of repairing (repairing burr manually).
As can be seen here, spend a large amount of manpowers to go to repair removing once generation burr or burr with regard to needing, and easily cause scrapping of product in repair procedures, therefore, need the preparation method finding a kind of new pcb board badly, when preparing to avoid the pcb board for high frequency material, produce burr or burr.
Summary of the invention
The embodiment of the present invention provides a kind of preparation method of pcb board of high frequency material and the pcb board of high frequency material, produces the problem of burr or burr when there is forming processes in order to solve in prior art.
The embodiment of the present invention is by the following technical solutions:
A preparation method for the pcb board of high frequency material, described method comprises:
After plating completes, add a cover cover plate the upper and lower of pcb board, and according to the line pattern to be printed size with the pcb board preset, one-shot forming process is carried out to described pcb board;
Upper and lower cover plate is removed to the pcb board after carrying out one-shot forming process, and printing formation line pattern is carried out to the surface of this pcb board.
In embodiments of the present invention, by adjustment printed wiring figure and shaping order, first carry out forming processes, then printed wiring figure, thus can ensure that pcb board can not produce space when adding a cover cover plate, avoid producing burr or burr during one-shot forming.
Preferably, if described pcb board need cut obtain multiple PCB daughter board, then when described one-shot forming process, retain the connection bit for being linked together by each PCB daughter board in pcb board;
When printing formation line pattern is carried out to described pcb board, retaining described connection bit, making the height of this connection bit retained equal with printing the line levels formed;
After carrying out printing formation line pattern to the surface of this pcb board, described method also comprises:
Carrying out printing, the described pcb board forming surface lines figure is upper and lower adds a cover cover plate, carries out post forming process, remove described connection bit to this pcb board.
In embodiments of the present invention, remain connection bit when one-shot forming, make, when printing afterwards forms line pattern, the printing of line pattern to be carried out to whole pcb board.
Preferably, described connection bit is connected with the circuit in be connected each PCB daughter board.
In embodiments of the present invention, because the height of connection bit is equal with printing the line levels formed and connected with the circuit in be connected each PCB daughter board, therefore, when connection bit is removed in post forming, burr or burr can not be produced.
A kind of pcb board of the high frequency material utilizing the preparation method of the pcb board of high frequency material to obtain.
In embodiments of the present invention, remain connection bit when one-shot forming, make, when printing afterwards forms line pattern, the printing of line pattern to be carried out to whole pcb board.
Preferably, the pcb board of described high frequency material is the pcb board of PTFE material.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly introduced, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of the pcb board having completed surface-treated high frequency material in prior art;
Fig. 2 is the schematic diagram of the pcb board adding the high frequency material being stamped upper and lower cover plate in prior art;
Preparation method's flow chart of the pcb board of a kind of high frequency material that Fig. 3 provides for the embodiment of the present invention one;
Fig. 4 is the schematic diagram of pcb board of the high frequency material in the embodiment of the present invention one after plating;
Fig. 5 is the schematic diagram that the pcb board electroplating back shroud and high frequency material in the embodiment of the present invention one is combined closely;
Fig. 6 is the schematic diagram of the connection bit of the pcb board of the embodiment of the present invention one medium-high frequency material.
Embodiment
In order to make the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, the present invention is described in further detail, and obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
In order to avoid easily producing the problem of burr or burr when preparing for the pcb board of high frequency material, can by optimizing the work flow of high frequency material, after plating, due to the pcb board also non-printed wiring figure of high frequency material, therefore, pcb board upper and lower of high frequency material add a cover cover plate carry out forming processes time, the pcb board of upper and lower cover plate and high frequency material is combined closely, do not produce space, burr or burr can not be produced when forming processes; After forming processes after post forming is carried out to the pcb board of high frequency material, prepare the pcb board of high frequency material.
It should be noted that, for convenience, pcb board involved below and the material of PCB daughter board are high frequency material.
Be described in detail the present invention program below in conjunction with specific embodiment, need to illustrate all, the present invention is not limited to following examples.
Embodiment one:
The embodiment of the present invention one provides a kind of preparation method of pcb board of high frequency material, as shown in Figure 3, mainly comprises the following steps:
Step 101: after plating completes, adds a cover cover plate the upper and lower of pcb board, and according to the line pattern to be printed size with the pcb board preset, carries out one-shot forming process to described pcb board.
As shown in Figure 4, for the pcb board after plating, in this step 101, the upper and lower position of described pcb board is needed to add a cover cover plate, because pcb board does not also carry out the operation of printed wiring figure, therefore, when pcb board upper and lower adds a cover cover plate, upper and lower cover plate can be combined closely with pcb board, does not produce any space.As shown in Figure 5, be plating back shroud and the pcb board schematic diagram of combining closely.
Why can reach such effect, because step 101 does not follow traditional preparation flow for this reason, but add one-shot forming process after plating before printed wiring figure (mainly according to line pattern to be printed and the size of pcb board preset, pcb board is needed the position milling sky of mill off), avoid in traditional preparation technology, because first printed wiring figure causes described pcb board surface to there is drop, add a cover again when cover plate carries out forming processes and produce space, the problem of generation burr or burr when institute causes forming processes.
And in this step 101, after cover plate is added a cover to described pcb board, owing to being closely linked between cover plate and described pcb board, any space can not be produced, therefore, after one-shot forming process is carried out to described pcb board, the pcb board of pre-set dimension, shape can be obtained, and burr or burr can not be produced during one-shot forming process.
Described one-shot forming can include but not limited to the modes such as mechanical milling or punching press, and the embodiment of the present invention is not specifically limited at this.
Processing technology before it should be noted that step 101 comprises: the technological processes such as blanking, inner figure, pressing and boring, this several technique all belongs to prior art, therefore repeats no more.
Step 102: upper and lower cover plate is removed to the pcb board after carrying out one-shot forming process, and printing formation line pattern is carried out to the surface of this pcb board.
After one-shot forming process is completed to described pcb board, upper and lower cover plate is removed, and printing formation line pattern is carried out to this pcb board.
Afterwards, the flow processs such as outer graphics process, anti-welding, surface treatment, electrical measurement, visual examination, packaging shipment can just be carried out.
Owing to having carried out one-shot forming process to pcb board in a step 101, therefore, prepare after performing this step 102 in the technique of pcb board, molding process can not produce burr or burr, thus the cost of manual repair can be reduced, improving production efficiency, ensure that quality and the qualification rate of product simultaneously.
Preferably, if pcb board need cut obtain multiple PCB daughter board, then, when the one-shot forming process of step 101, can not directly cut pcb board, this is because, in a step 102, also need operation pcb board being carried out to printed wiring figure.In the case, when can carry out one-shot forming in a step 101, retain the connection bit for being linked together by each PCB daughter board in pcb board.
As shown in Figure 6, for the schematic diagram of the connection bit of the pcb board of high frequency material, suppose to have determined that line pattern to be printed is as shown in dash area in Fig. 6 before step 101, and pcb board need cut and obtains 4 identical PCB daughter boards, then described connection bit can be designed to the form be connected with the circuit in be connected each PCB daughter board, after the one-shot forming process of step 101, retain connection bit as shown in Figure 6.When carrying out in a step 102 printing the process forming line pattern, still retain connection bit, after making to print formation circuit, the height of connection bit is equal with printing the line levels formed, the benefit done like this is, after step 102, again through anti-welding, after process of surface treatment, also need to carry out post forming process, remove described connection bit, when removing described connection bit, need on pcb board, under add a cover cover plate, because connection bit is connected with the circuit in each PCB daughter board and highly equal with line levels, therefore, cover plate and connection bit, the circuit that this connection bit connects is combined closely, there is no space, when carrying out post forming process, also burr or burr can not be produced.
Still for Fig. 6, cover plate is combined closely with A point (circuit in PCB daughter board 1), C point (circuit in PCB daughter board 3) and B point (being connected the connection bit of A point and C point) in Fig. 6, when the connection bit of B point is removed in post forming, can not produce burr or burr.
Fig. 6 is a kind of feasible connection bit design, but the embodiment of the present invention does not limit the project organization of connection bit, such as, the structure of connection bit in Fig. 6 can be out of shape, and retains wherein three connection bits, still can realize the scheme of the embodiment of the present invention.
In embodiments of the present invention, by retaining connection bit on the pcb board of high frequency material, and make the height of this connection bit equal with the height of pre-printed line pattern, thus can when post forming, ensure that this connection bit and line pattern all can be combined closely with cover plate, avoid occurring space, and then burr or burr can not be produced when guaranteeing post forming process.
The preparation method of the pcb board of the high frequency material provided corresponding to the embodiment of the present invention one, present invention also offers a kind of pcb board of the high frequency material utilizing the method described in embodiment one to prepare, the pcb board of described high frequency material is the pcb board of PTFE material.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (5)
1. a preparation method for the pcb board of high frequency material, is characterized in that, described method comprises:
After plating completes, add a cover cover plate the upper and lower of pcb board, and according to the line pattern to be printed size with the pcb board preset, one-shot forming process is carried out to described pcb board;
Upper and lower cover plate is removed to the pcb board after carrying out one-shot forming process, and printing formation line pattern is carried out to the surface of this pcb board.
2. the method for claim 1, is characterized in that, if described pcb board need cut obtain multiple PCB daughter board, then when described one-shot forming process, retains the connection bit for being linked together by each PCB daughter board in pcb board;
When printing formation line pattern is carried out to described pcb board, retaining described connection bit, making the height of this connection bit retained equal with printing the line levels formed;
After carrying out printing formation line pattern to the surface of this pcb board, described method also comprises:
Carrying out printing, the described pcb board forming surface lines figure is upper and lower adds a cover cover plate, carries out post forming process, remove described connection bit to this pcb board.
3. method as claimed in claim 2, is characterized in that, described connection bit is connected with the circuit in be connected each PCB daughter board.
4. the pcb board of the high frequency material utilizing the arbitrary described method of claim 1-3 to prepare.
5. pcb board as claimed in claim 4, it is characterized in that, the pcb board of described high frequency material is the pcb board of PTFE material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310487644.3A CN104582275B (en) | 2013-10-17 | 2013-10-17 | The preparation method of the pcb board of high frequency material and the pcb board of high frequency material |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310487644.3A CN104582275B (en) | 2013-10-17 | 2013-10-17 | The preparation method of the pcb board of high frequency material and the pcb board of high frequency material |
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| CN104582275A true CN104582275A (en) | 2015-04-29 |
| CN104582275B CN104582275B (en) | 2017-12-05 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104869761A (en) * | 2015-05-08 | 2015-08-26 | 深圳崇达多层线路板有限公司 | Manufacture method of rigid-flexible printed circuit board with outer-layer flexible printed circuit board |
| CN107529277A (en) * | 2016-06-21 | 2017-12-29 | 北大方正集团有限公司 | Circuit board molding method |
| CN111954380A (en) * | 2020-08-27 | 2020-11-17 | 丰顺科威达电子有限公司 | High-frequency plate burr-free processing method |
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| CN102065644A (en) * | 2010-12-14 | 2011-05-18 | 广东大普通信技术有限公司 | Method for making and packaging printed circuit board (PCB) and crystal oscillator |
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| CN103298245A (en) * | 2013-06-14 | 2013-09-11 | 东莞生益电子有限公司 | Manufacture method for high-frequency circuit board and circuit board manufactured through method |
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| JPH11126965A (en) * | 1997-10-24 | 1999-05-11 | Victor Co Of Japan Ltd | Manufacture of printed board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104869761A (en) * | 2015-05-08 | 2015-08-26 | 深圳崇达多层线路板有限公司 | Manufacture method of rigid-flexible printed circuit board with outer-layer flexible printed circuit board |
| CN104869761B (en) * | 2015-05-08 | 2018-03-02 | 深圳崇达多层线路板有限公司 | A kind of preparation method of flex plate in the rigid-flexible combined circuit board of outer layer |
| CN107529277A (en) * | 2016-06-21 | 2017-12-29 | 北大方正集团有限公司 | Circuit board molding method |
| CN107529277B (en) * | 2016-06-21 | 2020-03-06 | 北大方正集团有限公司 | Circuit board forming method |
| CN111954380A (en) * | 2020-08-27 | 2020-11-17 | 丰顺科威达电子有限公司 | High-frequency plate burr-free processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104582275B (en) | 2017-12-05 |
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Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220919 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |
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