CN104551413A - Method for forming conductive films - Google Patents
Method for forming conductive films Download PDFInfo
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- CN104551413A CN104551413A CN201310504503.8A CN201310504503A CN104551413A CN 104551413 A CN104551413 A CN 104551413A CN 201310504503 A CN201310504503 A CN 201310504503A CN 104551413 A CN104551413 A CN 104551413A
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- laser boring
- laser
- conductive glue
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- depth
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Abstract
The invention discloses a method for forming conductive films. The method includes determining cutting paths by the aid of perforation laser machines according to the shapes of the to-be-formed conductive films; carrying out laser perforation by the aid of the perforation laser machines in a stepped manner according to the cutting paths and cutting and forming the conductive films. The method has the advantages that metal die manufacture implemented in a die stamping forming process is replaced by a mode for determining the cutting paths of the conductive films, the conductive films can be linearly cut by the aid of the perforation laser machines, accordingly, the production cycles of the conductive films can be effectively shortened, the production efficiency can be improved, and the production cost can be reduced.
Description
Technical field
The present invention relates to conductive glue slice manufacture technology field, particularly relate to a kind of method that conductive glue slice is shaping.
Background technology
At work, the heat produced can affect the function of power amplifier to high-frequency microwave power amplifier.In order to solve the heat dissipation problem of power tube, general employing Metal Substrate technique at present, be directly connected with Metal Substrate by power tube, the heat produced by power tube by heat conducting mode passes to Metal Substrate, thus reaches the object reducing power tube heat.
Metal current base technique generally adopts the main hot pressing of Post-Bonding() technique, i.e. PCB(PrintedCircuit Board, printed circuit board) machine after, by bonding sheet (herein for having the conductive glue slice of heat conduction and electric conductivity), PCB and Metal Substrate are linked together.
Wherein, the method that the shaping general employing mould punching of conductive glue slice is shaping, this method first will according to the contour structures of conductive glue slice, and design a metal die, then fast ram is shaping under gravity.But the making of metal die is higher to required precision, fabrication cycle is long, cost is high.
Summary of the invention
The invention provides a kind of method that conductive glue slice is shaping, in order to what solve that mould punching forming method causes, the problem higher to required precision, fabrication cycle is long, cost is high is made to metal die, thus shorten conductive glue slice production cycle, enhance productivity, reduce production cost.
The invention provides a kind of method that conductive glue slice is shaping, comprising:
Perforating type laser machine determines cutting path according to the shape of wanted shaping conductive glue slice;
Described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, by conductive glue slice excision forming.
Utilize described method, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, through K cutting by conductive glue slice excision forming, wherein K >=2.
Conductive glue slice excision forming is needed to adopt larger laser energy to cut, laser energy is larger, temperature when cutting conductive glue slice is higher, this will cause conductive glue slice edge to be carbonized, affect the reliability of conductive glue slice, adopt the mode of repeatedly cutting, can be good at avoiding this problem, thus improve the reliability of conductive glue slice.
Utilize described method, when described K value is 2, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, through 2 cuttings by conductive glue slice excision forming, can comprise the following steps:
According to described cutting path, adopt step-by-step system to carry out first time laser boring, wherein, the pulse width of the laser aperture that described first time laser boring uses is M, and the punching degree of depth of first time laser boring is less than the thickness of conductive glue slice;
According to described cutting path, step-by-step system is adopted to carry out second time laser boring, wherein, the pulse width of the laser aperture that described second time laser boring uses is N, the punching degree of depth of second time laser boring equals the thickness of conductive glue slice and the difference of the first time laser boring degree of depth, further, M > N.
Such first to cut the laser energy adopted just little than only once cutting the laser energy that will adopt, thus effectively avoid causing because laser energy is too large shaping after the problem of conductive glue slice edge carbonization.
Utilize described method, when the thickness of described conductive glue slice between 3.5 mils (mil) ~ 5 mil constantly, the span of described M is: 15us≤M≤40us, and the span of described N is: 10us≤N≤20us.
Utilize described method, when described K value is 3, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, through 3 cuttings by conductive glue slice excision forming, can comprise the following steps:
According to described cutting path, adopt step-by-step system to carry out first time laser boring, wherein, the pulse width of the laser aperture that described first time laser boring uses is A, and the punching degree of depth of first time laser boring is less than the thickness of conductive glue slice;
According to described cutting path, step-by-step system is adopted to carry out second time laser boring, wherein, the pulse width of the laser aperture that described second time laser boring uses is B, the punching degree of depth of second time laser boring is less than the thickness of conductive glue slice and the difference of the first time laser boring degree of depth, further, A > B;
According to described cutting path, step-by-step system is adopted to carry out third time laser boring, wherein, the pulse width of the laser aperture that described third time laser boring uses is C, the thickness that the punching degree of depth of third time laser boring equals conductive glue slice deducts the first time laser boring degree of depth and second time laser boring degree of depth sum, further, B > C.
Utilize described method, when described K value is 4, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, through 4 cuttings by conductive glue slice excision forming, can comprise the following steps:
According to described cutting path, adopt step-by-step system to carry out first time laser boring, wherein, the pulse width of the laser aperture that described first time laser boring uses is B, and the punching degree of depth of first time laser boring is less than the thickness of conductive glue slice;
According to described cutting path, step-by-step system is adopted to carry out second time laser boring, wherein, the pulse width of the laser aperture that described second time laser boring uses is B, and the punching degree of depth of second time laser boring is less than the thickness of conductive glue slice and the difference of the first time laser boring degree of depth;
According to described cutting path, step-by-step system is adopted to carry out third time laser boring, wherein, the pulse width of the laser aperture that described third time laser boring uses is C, the thickness that the punching degree of depth of third time laser boring is less than conductive glue slice deducts the first time laser boring degree of depth and second time laser boring degree of depth sum, further, B > C;
According to described cutting path, step-by-step system is adopted to carry out the 4th laser boring, wherein, the pulse width of the laser aperture that described 4th laser boring uses is C, and the thickness that the punching degree of depth of the 4th laser boring equals conductive glue slice deducts the first time laser boring degree of depth, the second time laser boring degree of depth and third time laser boring degree of depth sum.
The mode of this repeatedly excision forming, can ensure the quality that conductive glue slice laser cutting is shaping.
In described method, when the thickness of described conductive glue slice is between 3.5 mil ~ 5 mils, the span of described A is: 10us≤A≤15us, and the span of described B is: 5us≤B≤10us, and the span of described C is: 2us≤C≤5us.
In described method, the step-length of laser boring is each time identical, and the diameter of the laser aperture that laser boring each time uses is identical.
Preferably, in described method, the diameter of described laser aperture is 5 mils, and the step-length of laser boring is 3 mils.
Utilize the method that conductive glue slice provided by the invention is shaping, there is following beneficial effect: adopt and determine that the mode of the cutting path of conductive glue slice is to replace the making of metal die in mould punching forming method, and adopt perforating type laser machine to realize Linear cut, thus effectively shorten conductive glue slice production cycle, improve production efficiency, reduce production cost.
Accompanying drawing explanation
The method flow diagram that the conductive glue slice that Fig. 1 provides for the embodiment of the present invention is shaping;
Fig. 2 carries out the cutting drilling schematic diagram that laser boring formed for employing step-by-step system that the embodiment of the present invention provides;
Fig. 3 for the embodiment of the present invention provide through cutting twice by conductive glue slice excision forming flow chart;
What Fig. 4 provided for the embodiment of the present invention cuts conductive glue slice excision forming flow chart through three times;
What Fig. 5 provided for the embodiment of the present invention cuts conductive glue slice excision forming flow chart through four times.
Detailed description of the invention
The shaping method of the conductive glue slice proposed the present invention below in conjunction with drawings and Examples is described in detail.
Embodiments provide a kind of method that conductive glue slice is shaping, as shown in Figure 1, comprising:
Step 101, perforating type laser machine determines cutting path according to the shape of wanted shaping conductive glue slice.
Particularly, according to the supplied materials size of conductive glue slice, and need the shape of shaping conductive glue slice to determine cutting path, described perforating type laser machine can be CO
2laser machine also can be that other can realize the laser machine of punching functions.
Wherein, the cutting path determined just is equivalent to the design to mould in mould punching forming method, and the determination of cutting path just can replace the production of mould, thus shortens the production cycle, reduces production cost.
Step 102, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, by conductive glue slice excision forming.
As shown in Figure 2, adopting step-by-step system to carry out the cutting drilling that laser boring formed is that laser aperture is formed by connecting, and can be realize Linear cut like this, and the drilling of common laser drill is a laser aperture, can only realize the function of punching.
Preferably, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, through K cutting by conductive glue slice excision forming, wherein K >=2.
Conductive glue slice excision forming is needed to adopt larger laser energy to cut, laser energy is larger, temperature when cutting conductive glue slice is higher, this will cause conductive glue slice edge to be carbonized, affect the reliability of conductive glue slice, adopt the mode of repeatedly cutting, can be good at avoiding this problem, thus improve the reliability of conductive glue slice.The number of times of cutting is more, and the shaping quality of conductive glue slice is better, but production efficiency can be lower.
Further preferably, when described K value is 2, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, through 2 cuttings by conductive glue slice excision forming, as shown in Figure 3, comprising:
Step 201, according to described cutting path, adopt step-by-step system to carry out first time laser boring, wherein, the pulse width of the laser aperture that described first time laser boring uses is M, and the punching degree of depth of first time laser boring is less than the thickness of conductive glue slice.
Step 202, according to described cutting path, step-by-step system is adopted to carry out second time laser boring, wherein, the pulse width of the laser aperture that described second time laser boring uses is N, the punching degree of depth of second time laser boring equals the thickness of conductive glue slice and the difference of the first time laser boring degree of depth, and, M > N.
In concrete example, when the thickness of described conductive glue slice is between 3.5 mil ~ 5 mils, the span of described M is: 15us≤M≤40us, and the span of described N is: 10us≤N≤20us.
The uniformity coefficient mixed with metallic due to conductive glue slice epoxy resin is different, according to the method for cutting twice, adopts above-mentioned cutting parameter scope, can reduce the possibility of the edge carbonization of conductive glue slice as far as possible.
First time adopts the less laser aperture of pulse width to carry out second time cutting after cut, cuts process, thus complete shaping to repair the conductive glue slice after first time excision forming.
Thisly first adopt larger laser energy to cut, the less laser energy of rear employing repaiies the mode of cutting, and the cut marginal portion of conductive glue slice can be avoided to be carbonized, thus ensure the quality of conductive glue slice, improve the reliability of conductive glue slice.If only adopt the mode of a laser boring excision forming to cut with regard to needing larger laser energy, although can enhance productivity like this, but be easy to cause cut partially carbonized of conductive glue slice, and carbonized part is when pressing, resin glue is not easy flowing, when being used in realization heat radiation in power amplifier, will differing between PCB and Metal Substrate and produce cavity, affect reliability; If adopt the mode of large laser energy cutting after first adopting little laser energy to cut, after the cutting of so little laser energy, conductive glue slice residual thickness is thinner, then adopts large laser energy to cut, and large laser energy will scattering, thus cause the carbonization of conductive glue slice edge, affect gummosis.
Preferably, the step-length of laser boring is each time identical, and the diameter of the laser aperture that laser boring each time uses is identical.
Wherein, a laser boring refers to that perforating type laser machine punches a circle on the cutting path determined, that is, complete a laser boring and just equal through once cutting.The step-length of laser boring is each time identical, and the diameter of the laser aperture used is identical, and the step-length being just equivalent to the punching of adjacent cutting twice perforating type laser machine is identical, and the diameter cutting the laser aperture used each time is identical.
That is, after the step-length of perforating type laser machine laser boring and the diameter of laser aperture are set, setting value will be kept constant.
Preferably, the diameter of described laser aperture is 5mil, and the step-length of laser boring is 3mil, and the flatness at the conductive glue slice edge that the flatness at the conductive glue slice edge of institute's excision forming wants Billy to obtain with mould punching forming method is good.
Certainly, this be one preferred embodiment, as long as the flatness at the conductive glue slice edge utilizing the value of step-length of laser boring of setting and the combination cutting of the diameter of laser aperture to obtain can meet the requirement of practical application, wherein, the span of the diameter of laser aperture is for being more than or equal to 4mil and being less than or equal to 10mil, and the value of the step-length of laser boring will set according to the diameter of adopted laser aperture.
Alternatively embodiment, when described K value is 3, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, through 3 cuttings by conductive glue slice excision forming, as shown in Figure 4, comprising:
Step 301, according to described cutting path, adopt step-by-step system to carry out first time laser boring, wherein, the pulse width of the laser aperture that described first time laser boring uses is A, and the punching degree of depth of first time laser boring is less than the thickness of conductive glue slice.
Step 302, according to described cutting path, step-by-step system is adopted to carry out second time laser boring, wherein, the pulsed light width of the laser aperture that described second time laser boring uses is B, the punching degree of depth of second time laser boring is less than the thickness of conductive glue slice and the difference of the first time laser boring degree of depth, and, A > B.
Step 303, according to described cutting path, step-by-step system is adopted to carry out third time laser boring, wherein, the pulse width of the laser aperture that described third time laser boring uses is C, the thickness that the punching degree of depth of third time laser boring equals conductive glue slice deducts the first time laser boring degree of depth and second time laser boring degree of depth sum, and, B > C.
Concrete, when the thickness of described conductive glue slice is between 3.5 mil ~ 5 mils, the span of described A is: 10us≤A≤15us, and the span of described B is: 5us≤B≤10us, and the span of described C is: 2us≤C≤5us.
The beneficial effect that qualifications in other corresponding parameter, implementation process and this embodiment are brought can refer to embodiment when K value is 2, repeats no more here.
Alternatively embodiment, when described K value is 4, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, through 4 cuttings by conductive glue slice excision forming, as shown in Figure 5, comprising:
Step 401, according to described cutting path, adopt step-by-step system to carry out first time laser boring, wherein, the pulse width of the laser aperture that described first time laser boring uses is B, and the punching degree of depth of first time laser boring is less than the thickness of conductive glue slice.
Step 402, according to described cutting path, step-by-step system is adopted to carry out second time laser boring, wherein, the pulse width of the laser aperture that described second time laser boring uses is B, and the punching degree of depth of second time laser boring is less than the thickness of conductive glue slice and the difference of the first time laser boring degree of depth.
Step 403, according to described cutting path, step-by-step system is adopted to carry out third time laser boring, wherein, the pulse width of the laser aperture that described third time laser boring uses is C, the thickness that the punching degree of depth of third time laser boring is less than conductive glue slice deducts the first time laser boring degree of depth and second time laser boring degree of depth sum, and, B > C.
Step 404, according to described cutting path, step-by-step system is adopted to carry out the 4th laser boring, wherein, the pulse width of the laser aperture that described 4th laser boring uses is C, and the thickness that the punching degree of depth of the 4th laser boring equals conductive glue slice deducts the first time laser boring degree of depth, the second time laser boring degree of depth and third time laser boring degree of depth sum.
Concrete, when the thickness of described conductive glue slice is between 3.5 mil ~ 5 mils, the span of described B is: 5us≤B≤10us, and the span of described C is: 2us≤C≤5us.
The beneficial effect that qualifications in other corresponding parameter, implementation process and this embodiment are brought can refer to embodiment when K value is 2, repeats no more here.
The mode of this repeatedly excision forming, the quality that conductive glue slice laser cutting is shaping can be ensured, simultaneously, conductive glue slice edge out-of-flatness (zigzag) situation after shaping shown in Fig. 2 can be tending towards relaxing, in the pressing solidification process in later stage, be more tending towards smooth, but the efficiency of cutting conductive glue slice can reduce.In actual cutting process, can balance between efficiency and quality, select a cutting times of compromising to cut conductive glue slice and meet requirement to conductive glue slice and cutting efficiency with general formula, in actual cutting process, the general Method compare of 2 cuttings that adopts is many.
Utilize the method that conductive glue slice provided by the invention is shaping, there is following beneficial effect: adopt and determine that the mode of the cutting path of conductive glue slice is to replace the making of metal die in mould punching forming method, and adopt perforating type laser machine to realize Linear cut, thus effectively shorten conductive glue slice production cycle, improve production efficiency, reduce production cost.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (9)
1. the method that conductive glue slice is shaping, is characterized in that, comprising:
Perforating type laser machine determines cutting path according to the shape of wanted shaping conductive glue slice;
Described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, by conductive glue slice excision forming.
2. the method for claim 1, is characterized in that, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, by conductive glue slice excision forming, specifically comprises:
Described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, through K cutting by conductive glue slice excision forming, wherein K >=2.
3. method as claimed in claim 2, is characterized in that, when described K value is 2, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, through 2 cuttings by conductive glue slice excision forming, comprising:
According to described cutting path, adopt step-by-step system to carry out first time laser boring, wherein, the pulse width of the laser aperture that described first time laser boring uses is M, and the punching degree of depth of first time laser boring is less than the thickness of conductive glue slice;
According to described cutting path, step-by-step system is adopted to carry out second time laser boring, wherein, the pulse width of the laser aperture that described second time laser boring uses is N, the punching degree of depth of second time laser boring equals the thickness of conductive glue slice and the difference of the first time laser boring degree of depth, further, M > N.
4. method as claimed in claim 3, it is characterized in that, when the thickness of described conductive glue slice is between 3.5 mil ~ 5 mils, the span of described M is: 15us≤M≤40us, and the span of described N is: 10us≤N≤20us.
5. method as claimed in claim 2, is characterized in that, when described K value is 3, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, through 3 cuttings by conductive glue slice excision forming, comprising:
According to described cutting path, adopt step-by-step system to carry out first time laser boring, wherein, the pulse width of the laser aperture that described first time laser boring uses is A, and the punching degree of depth of first time laser boring is less than the thickness of conductive glue slice;
According to described cutting path, step-by-step system is adopted to carry out second time laser boring, wherein, the pulsed light width of the laser aperture that described second time laser boring uses is B, the punching degree of depth of second time laser boring is less than the thickness of conductive glue slice and the difference of the first time laser boring degree of depth, further, A > B;
According to described cutting path, step-by-step system is adopted to carry out third time laser boring, wherein, the pulse width of the laser aperture that described third time laser boring uses is C, the thickness that the punching degree of depth of third time laser boring equals conductive glue slice deducts the first time laser boring degree of depth and second time laser boring degree of depth sum, further, B > C.
6. method as claimed in claim 2, is characterized in that, when described K value is 4, described perforating type laser machine, according to described cutting path, adopts step-by-step system to carry out laser boring, through 4 cuttings by conductive glue slice excision forming, comprising:
According to described cutting path, adopt step-by-step system to carry out first time laser boring, wherein, the pulse width of the laser aperture that described first time laser boring uses is B, and the punching degree of depth of first time laser boring is less than the thickness of conductive glue slice;
According to described cutting path, step-by-step system is adopted to carry out second time laser boring, wherein, the pulse width of the laser aperture that described second time laser boring uses is B, and the punching degree of depth of second time laser boring is less than the thickness of conductive glue slice and the difference of the first time laser boring degree of depth;
According to described cutting path, step-by-step system is adopted to carry out third time laser boring, wherein, the pulse width of the laser aperture that described third time laser boring uses is C, the thickness that the punching degree of depth of third time laser boring is less than conductive glue slice deducts the first time laser boring degree of depth and second time laser boring degree of depth sum, further, B > C;
According to described cutting path, step-by-step system is adopted to carry out the 4th laser boring, wherein, the pulse width of the laser aperture that described 4th laser boring uses is C, and the thickness that the punching degree of depth of the 4th laser boring equals conductive glue slice deducts the first time laser boring degree of depth, the second time laser boring degree of depth and third time laser boring degree of depth sum.
7. the method as described in claim 5 or 6, it is characterized in that, when the thickness of described conductive glue slice is between 3.5 mil ~ 5 mils, the span of described A is: 10us≤A≤15us, the span of described B is: 5us≤B≤10us, and the span of described C is: 2us≤C≤5us.
8. the method as described in any one of claim 3-6, is characterized in that, the step-length of laser boring is each time identical, and the diameter of the laser aperture that laser boring each time uses is identical.
9. the method as described in any one of claim 3-6, is characterized in that, the diameter of described laser aperture is 5 mils, and the step-length of laser boring is 3 mils.
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| CN201310504503.8A CN104551413A (en) | 2013-10-23 | 2013-10-23 | Method for forming conductive films |
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| CN201310504503.8A CN104551413A (en) | 2013-10-23 | 2013-10-23 | Method for forming conductive films |
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| CN109483063A (en) * | 2018-11-16 | 2019-03-19 | 蓝思科技(东莞)有限公司 | The processing method of 3D cover board functional hole and the 3D cover board with functional hole and electronic equipment |
| CN111438447A (en) * | 2018-12-29 | 2020-07-24 | 东泰高科装备科技有限公司 | Film opening method, solar cell packaging film and opening method |
| CN114650656A (en) * | 2020-12-17 | 2022-06-21 | 北大方正集团有限公司 | Method for manufacturing printed circuit board with step groove |
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Application publication date: 20150429 |