CN109483063A - The processing method of 3D cover board functional hole and the 3D cover board with functional hole and electronic equipment - Google Patents
The processing method of 3D cover board functional hole and the 3D cover board with functional hole and electronic equipment Download PDFInfo
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- CN109483063A CN109483063A CN201811369369.4A CN201811369369A CN109483063A CN 109483063 A CN109483063 A CN 109483063A CN 201811369369 A CN201811369369 A CN 201811369369A CN 109483063 A CN109483063 A CN 109483063A
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- cover board
- functional hole
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
Abstract
The present invention provides a kind of processing method of 3D cover board functional hole and 3D cover board and electronic equipment with functional hole, it is related to cover board processing technique field, the processing method includes the following steps: to provide 3D cover board, 3D cover board is provided with function bore region, and the 3D cover board includes 3D substrate and the ink layer that is set on 3D substrate；Laser laser carving is carried out to function bore region, the ink layer of function bore region is made to gasify to get the 3D cover board with functional hole is arrived；When alleviating traditional silk-screen mode and preparing the 3D cover board with functional hole, product yield is low, and light transmittance is poor, it is unable to satisfy the requirement technical problem of client, the ink layer of function bore region is gasified by laser, obtains the 3D cover board with functional hole by the processing method of 3D cover board functional hole provided by the invention, precision is high, time-consuming short, the light transmittance of functional hole reaches 92% or more, and product yield is high, appearance is good, can effectively meet the requirement of client.
Description
Technical field
The present invention relates to cover board processing technique fields, a kind of processing method more particularly, to 3D cover board functional hole and have
The 3D cover board and electronic equipment of functional hole.
Background technique
With the development of science and technology, the update of electronic equipment is accelerated year by year, is got over using the electronic equipment of 3D cover board
It is pursued to get over by consumer.But due to 3D cover board each position uneven thickness, and surface is curved surface, is printed using traditional silk-screen
When brush mode prepares functional hole, product yield is low, and poor appearance is unable to satisfy customer requirement.
In view of this, the present invention is specifically proposed.
Summary of the invention
One of the objects of the present invention is to provide a kind of processing methods of 3D cover board functional hole, are adopted with improving existing 3D cover board
The technical issues of when preparing functional hole with traditional silk-screen mode of printing, product yield is low, poor appearance, is unable to satisfy customer requirement.
The processing method of 3D cover board functional hole provided by the invention includes the following steps: to provide 3D cover board, the 3D lid
Plate is provided with function bore region, wherein the 3D cover board includes 3D substrate and the ink layer that is set on 3D substrate；
Laser laser carving is carried out to the function bore region, so that the ink layer of the function bore region is gasified, obtains with function
The 3D cover board in energy hole.
Further, the wavelength of the laser of the laser laser carving be 340-370nm, preferably 350-360nm, more preferably
For 355nm.
Further, laser laser carving is carried out using laser engraving machine.
Further, laser engraving machine is provided with the first figure layer and the second figure layer, the laser carving parameter of first figure layer are as follows: mark
Speed is 1600-1800mm/s, and Q frequency is 35-55kHz, pulsewidth 5-15us, electric current 25-35A, and filling spacing is
0.005-0.015mm, filling angle are 0-180 °；
And/or the laser carving parameter of second figure layer are as follows: mark speed is 1600-1800mm/s, and Q frequency is 25-
45kHz, pulsewidth 5-15us, electric current 25-35A, filling spacing are 0.005-0.015mm, and filling angle is 0-180 °.
Further, the preparation method of the 3D cover board includes the following steps: to provide 3D substrate, and oil is arranged on 3D substrate
Ink forms ink layer, obtains 3D cover board.
Further, it after ink is set on 3D substrate, first carries out pre-baked, then is baked admittedly, so that ink is secured
It is attached on 3D substrate, forms ink layer.
Further, pre-baked temperature is 70-90 DEG C, preferably 75-85 DEG C, more preferably 80 DEG C；
And/or the roasting temperature admittedly is 140-180 DEG C, preferably 150-170 DEG C, more preferably 160 DEG C.
The second object of the present invention is to provide processing method the answering in the processing of 3D cover board of above-mentioned 3D cover board functional hole
With.
The third object of the present invention is to provide a kind of 3D cover board with functional hole, the 3D cover board provided according to the present invention
The processing method of functional hole is prepared.
The fourth object of the present invention is to provide a kind of electronic equipment, including the 3D lid provided by the invention with functional hole
Plate.
The processing method of 3D cover board functional hole provided by the invention, by laser by the ink layer gas of function bore region
Change, obtain the 3D cover board with functional hole, precision is high, and time-consuming short, the light transmittance of functional hole reaches 92% or more, product yield
Height, appearance is good, can effectively meet the requirement of client, improves processing efficiency.
The processing that 3D cover board is carried out by using the processing method of 3D cover board functional hole provided by the invention, can effectively mention
The machining accuracy of high 3D cover board shortens process time, to effectively improve the processing efficiency of 3D cover board, reduces processing cost.
3D cover board provided by the invention with functional hole, using laser laser carving machining function hole, the light transmittance of functional hole
Reach 92% or more, product yield is high, and appearance is good, can effectively meet the requirement of client.
Specific embodiment
Embodiment of the present invention is described in detail below in conjunction with embodiment, but those skilled in the art will
Understand, the following example is merely to illustrate the present invention, and is not construed as limiting the scope of the invention.It is not specified in embodiment specific
Condition person carries out according to conventional conditions or manufacturer's recommended conditions.Reagents or instruments used without specified manufacturer is
The conventional products that can be obtained by commercially available purchase.
2D cover board is generally printed on 2D glass baseplate by the way of traditional silk-screen printing, is obtained with functional hole
2D cover board, but due to 3D substrate each position uneven thickness, and surface is curved surface, when it is by the way of the printing of traditional silk-screen
When preparing functional hole, each position slurry coating of functional hole is uneven, and product yield is low, and functional hole light transmittance is poor, is unable to satisfy visitor
The requirement at family.
According to an aspect of the present invention, the present invention provides a kind of processing method of 3D cover board functional hole, including it is as follows
Step: providing 3D cover board, and the 3D cover board is provided with function bore region, wherein the 3D cover board includes 3D substrate and is set to
Ink layer on 3D substrate；
Laser laser carving is carried out to function bore region, the ink layer of function bore region is made to gasify to get arriving with functional hole
3D cover board.
In the present invention, functional hole includes but is not limited to camera hole and the hole IR；3D substrate includes but is not limited to 3D glass base
Material.
In the present invention, function bore region is arranged according to the preset function hole site of 3D cover board.
In the present invention, what the gasification of function bore region ink layer referred to generates high-temperature high-frequency for function using laser laser carving moment
The ink layer of bore region is gasified totally, while not damaging 3D substrate.
The processing method of 3D cover board functional hole provided by the invention, by laser by the ink layer gas of function bore region
Change, obtain the 3D cover board with functional hole, precision is high, and time-consuming short, the light transmittance of functional hole reaches 92% or more, product yield
Height, appearance is good, can effectively meet the requirement of client, improves processing efficiency.
In the preferred embodiment of the present invention, the wavelength for carrying out the laser of laser laser carving is 340-370nm, excellent
It is selected as 350-360nm, more preferably 355nm.
In a preferred embodiment of the invention, the typical but non-limiting wavelength of the laser of laser laser carving is carried out for example
340,345,350,355,360,365 or 370nm.
Laser carving is carried out by using the laser that wavelength is 340-370nm, can be improved laser carving speed, so that ink layer is faster
Gasification.
In a kind of preferred embodiment of the present embodiment, laser laser carving is carried out using laser engraving machine.
In a preferred embodiment of the invention, laser engraving machine, which is purchased, equips the limited public affairs of share in Shenzhen sea mesh star intelligent laser
Department, model HYM-VM5-LSHYM-UV350.
In the present invention, laser laser carving technological principle is that function bore region uses laser laser carving to generate physics on 3D cover board
High-temperature high-frequency gasifies ink layer, to obtain functional hole, during laser laser carving, generating that physics elevated temperature strength is excessively high can be to 3D
Substrate surface causes damage or even fragmentation, and energy and power of laser intensity, which not enough will cause 3D substrate surface, has ink residual to lead
Its bad order and transmitance is caused not to reach requirement.
The present invention passes through the laser carving parameter of setting the first figure layer of laser engraving machine and the second figure layer, so that after laser laser carving, function
The ink layer of energy bore region all gasifies, while will not have damage on 3D substrate.
In the preferred embodiment of the present invention, laser engraving machine is provided with the first figure layer and the second figure layer, and described first
The laser carving parameter of figure layer are as follows: mark speed is 1600-1800mm/s, and Q frequency is 35-55kHz, pulsewidth 5-15us, and electric current is
25-35A, filling spacing are 0.01mm, and filling angle is 0-180 °.
In a preferred embodiment of the invention, mark is repeated by using the first figure layer and the second figure layer, with better
Mark effect, the clean noresidue of ink gasification of assurance function bore region are controlled, while can also ensure that laser action in 3D base
When material surface, 3D substrate will not be damaged and influence its transmitance.
In a preferred embodiment of the invention, the first figure layer and the second figure layer are Marking parameters.It is somebody's turn to do in of the invention
In preferred embodiment, when carrying out laser carving using laser laser engraving machine, the typical but non-limiting mark speed of the first figure layer is such as
For 1600,1650,1700,1750 or 1800mm/s；The typical but non-limiting Q frequency for example 35 of first figure layer, 38,40,
42,45,48,50,52 or 55kHz；Typical but non-limiting pulsewidth for example 5,6,7,8,9,10,11,12,13,14 or
15us；For example 25,26,27,28,29,30,31,32,33,34 or 35A of typical but non-limiting electric current；It is typical but unrestricted
The filling spacing for example 0.005,0.006,0.007,0.008,0.009,0.01,0.011,0.012,0.013,0.014 of property or
0.015mm；For example 0 °, 45 °, 90 ° or 180 ° of typical but non-limiting angle
In the preferred embodiment of the present invention, the laser carving parameter of the second figure layer are as follows: mark speed is 1600-
1800mm/s, Q frequency are 25-45kHz, pulsewidth 5-15us, electric current 25-35A, and filling spacing is 0.005-0.015mm,
Filling angle is 0-180 °.
In a preferred embodiment of the invention, in the second figure layer, typical but non-limiting speed up to standard for example 1600,
1650,1700,1750 or 1800mm/s；The typical but non-limiting Q frequency for example 25 of first figure layer, 28,30,32,35,
38,40,42 or 45kHz；For example 5,6,7,8,9,10,11,12,13,14 or 15us of typical but non-limiting pulsewidth；It is typical
But unrestricted filling spacing for example 0.005,0.006,0.007,0.008,0.009,0.01,0.011,0.012,
0.013,0.014 or 0.015mm；For example 0 °, 45 °, 90 ° or 180 ° of typical but non-limiting angle
In the preferred embodiment of the present invention, the preparation method of 3D cover board includes the following steps: to provide 3D substrate,
Ink is set on 3D substrate, forms ink layer, obtains 3D cover board.
In a preferred embodiment of this invention, by spraying on 3D substrate or coating printing ink, after ink solidification, oil is formed
Layer of ink.
In present invention further optimization embodiment, after ink is set on 3D substrate, first carries out pre-baked, then carry out
Gu it is roasting, so that ink is firmly attached on 3D substrate, form ink layer.
In a preferred embodiment of the invention, pre-baked to refer to preheating in ink, so that ink is formed, Gu roasting refer to
Be to continue to heat by the ink after preheating so that ink is fully cured, form ink layer.
In the preferred embodiment of the present invention, pre-baked temperature is 70-90 DEG C.
In a preferred embodiment of the invention, the typical but non-limiting temperature for example 70 of preexamination, 72,74,75,
76,78,80,82,84,85,86,88 or 90 DEG C.
In the preferred embodiment of the present invention, admittedly roasting temperature is 140-180 DEG C.
In the preferred embodiment of the present invention, admittedly roasting typical but non-limiting temperature for example 140,142,
145,148,150,152,155,158,160,162,165,168,170,1172,175,178 or 180 DEG C.
In the preferred embodiment of the present invention, before ink is arranged in 3D substrate, first 3D substrate is cleaned.
In a preferred embodiment of the invention, the cleaning that 3D substrate is carried out using ultrasound, 3D substrate surface is adhered to
Impurity all remove, to ensure the cleanliness of 3D substrate, avoid the impurity such as dust from having an impact laser, cause laser carving
Cover the generation of the bad phenomenons such as shape, stain and black surround.
In the preferred embodiment of the present invention, first by 3D substrate using cleaning solution clean, then again using go from
Sub- water cleaning, is finally dehydrated and dries again.
In the preferred embodiment of the present invention, ink layer with a thickness of 8-12 μm.
In a preferred embodiment of the invention, the typical but non-limiting thickness for example 8 of ink layer, 8.2,8.5,
8.8,9,9.5,10,10.5,11,11.5 or 12 μm.
By controlling the thickness of ink layer, to guarantee the aesthetics of 3D hand-set lid.
In the preferred embodiment of the present invention, 3D substrate is first subjected to plasma treatment, then carries out ink spraying,
To improve the adherency fastness of 3D substrate and ink.
In the preferred embodiment of the present invention, ink spraying is carried out in spray booth, adopts elder generation after the completion of ink spraying
Pre-baked sizing, then high temperature is baked admittedly again, so that ink layer is securely connect with 3D substrate.
In the preferred embodiment of the present invention, further include pad process between pre-baked and admittedly roasting, pass through pad
Process removes the ink for spraying to the other places of 3D substrate clean.
In a preferred embodiment of the invention, pad is carried out using carbon cloth, the ink in the other places of 3D substrate is clear
Except clean.
In the preferred embodiment of the present invention, it is electroplated in the plate face of the 3D cover board with functional hole, with
To the 3D cover board finished product with functional hole.
In the preferred embodiment of the present invention, by being electroplated in the plate face of the 3D cover board with functional hole,
To form plating film layer on the 3D cover board with functional hole, to obtain 3D cover board finished product.
In a preferred embodiment of the invention, plated material is selected from titanium dioxide, silica, oxygenation efficiency, magnesium fluoride
One or more of with chromium oxide.
In a preferred embodiment of the invention, be electroplated film layer with a thickness of 300-500nm.
In the preferred embodiment of the present invention, be electroplated film layer typical but non-limiting thickness for example 300,
320,350,380,400,420,450,480 or 500nm.
In the preferred embodiment of the present invention, before being electroplated, first the 3D cover board with functional hole is carried out
Cleaning, then puts it into the electroplating chamber in electroplating machine, vacuumizes, so that electroplating chamber is in vacuum condition, be electroplated, make to be electroplated
Material is deposited in the plate face of the 3D cover board with functional hole, the 3D cover board finished product with functional hole is obtained, finally to electroplating chamber
Interior qi of chong channel ascending adversely, then the 3D cover board finished product with functional hole is taken out.
According to the second aspect of the invention, the present invention provides the processing methods of above-mentioned 3D cover board functional hole in 3D cover board
Application in processing.
The processing that 3D cover board is carried out by using the processing method of 3D cover board functional hole provided by the invention, can effectively mention
The machining accuracy of high 3D cover board shortens process time, to effectively improve the processing efficiency of 3D cover board, reduces processing cost.
The processing method of 3D cover board functional hole provided by the invention is used not only for machining function hole, additionally it is possible to for adding
Work is to bit line and date code.
According to the third aspect of the present invention, the present invention provides a kind of 3D cover board with functional hole, according to this hair
The processing method of the 3D cover board functional hole of bright offer is prepared.
3D cover board provided by the invention with functional hole, using laser laser carving machining function hole, the light transmittance of functional hole
Reach 92% or more, product yield is high, and appearance is good, can effectively meet the requirement of client.
According to the fourth aspect of the present invention, the present invention provides a kind of electronic equipment, including provided by the invention have
The 3D cover board of functional hole.
In the present invention, electronic equipment includes but is not limited to mobile phone and tablet computer.
3D cover board with functional hole includes the front shroud and back shroud of electronic equipment.
Electronic equipment provided by the invention uses the 3D cover board provided by the invention with functional hole for front shroud and rear cover
Plate, it is more attractive, more it is able to satisfy the requirement of client.
In order to facilitate the understanding of those skilled in the art, doing technical solution provided by the invention into one below with reference to embodiment
The description of step.
Embodiment 1
Present embodiments providing a kind of 3D hand-set lid with functional hole, functional hole includes camera hole and the hole IR,
It is process according to following technique:
(1) 3D glass baseplate is provided, ultrasonic cleaning is carried out, and after dewatered drying, ink is sprayed on 3D substrate, oil
Ink is formed by curing ink layer, obtains 3D cover board；Wherein, ink layer with a thickness of 10 μm, spray ink after it is first pre-baked at 70 DEG C
Then 10min bakes 5min at 170 DEG C again, so that ink solidification is at ink layer admittedly；
(2) the function bore region on 3D cover board ink layer uses wavelength to make ink layer gas for the laser of 355nm
Change, and clean to get the 3D cover board with functional hole is arrived, wherein laser, laser laser engraving machine are carried out using laser laser engraving machine
It is provided with the first figure layer and the second figure layer, the laser carving parameter of the first figure layer are as follows: mark speed is 1600mm/s, and Q frequency is
55kHz, pulsewidth 5us, electric current 35A, filling spacing are 0.005mm, and filling angle is 45 °；The laser carving parameter of second figure layer
Are as follows: mark speed is 1800mm/s, and Q frequency is 25kHz, pulsewidth 15us, electric current 25A, and filling spacing is 0.015mm, is filled out
Filling angle is 45 °
Embodiment 2
Present embodiments provide a kind of 3D hand-set lid with functional hole, processing technology it is different from embodiment 1 it
It is in in step (1), first in 90 DEG C of pre-baked 10min after spraying ink, then again in 150 DEG C of admittedly roasting 5min, so that oily
Ink is solidified into ink layer；In step (2), the laser carving parameter of the first figure layer are as follows: mark speed is 1800mm/s, and Q frequency is
35kHz, pulsewidth 15us, electric current 25A, filling spacing are 0.015mm；The laser carving parameter of second figure layer are as follows: mark speed is
1600mm/s, Q frequency are 45kHz, pulsewidth 5us, electric current 35A, and filling spacing is 0.005mm.
Embodiment 3
Present embodiments provide a kind of 3D hand-set lid with functional hole, processing technology it is different from embodiment 1 it
It is in in step (1), first in 85 DEG C of pre-baked 10min after spraying ink, then again in 155 DEG C of admittedly roasting 5min, so that oily
Ink is solidified into ink layer；In step (2), the laser carving parameter of the first figure layer are as follows: mark speed is 1750mm/s, and Q frequency is
42kHz, pulsewidth 12us, electric current 32A, filling spacing are 0.008mm；The laser carving parameter of second figure layer are as follows: mark speed is
1650mm/s, Q frequency are 32kHz, pulsewidth 8us, electric current 28A, and filling spacing is 0.012mm.
Embodiment 4
Present embodiments provide a kind of 3D hand-set lid with functional hole, processing technology it is different from embodiment 1 it
It is in in step (1), first in 75 DEG C of pre-baked 10min after spraying ink, then again in 165 DEG C of admittedly roasting 5min, so that oily
Ink is solidified into ink layer；In step (2), the laser carving parameter of the first figure layer are as follows: mark speed is 1650mm/s, and Q frequency is
48kHz, pulsewidth 8us, electric current 28A, filling spacing are 0.012mm；The laser carving parameter of second figure layer are as follows: mark speed is
1750mm/s, Q frequency are 38kHz, pulsewidth 12us, electric current 32A, and filling spacing is 0.008mm.
Embodiment 5
Present embodiments provide a kind of 3D hand-set lid with functional hole, processing technology it is different from embodiment 1 it
It is in in step (1), first in 80 DEG C of pre-baked 10min after spraying ink, then again in 160 DEG C of admittedly roasting 5min, so that oily
Ink is solidified into ink layer；In step (2), the laser carving parameter of the first figure layer are as follows: mark speed is 1700mm/s, and Q frequency is
45kHz, pulsewidth 10us, electric current 30A, filling spacing are 0.01mm；The laser carving parameter of second figure layer are as follows: mark speed is
1700mm/s, Q frequency are 35kHz, pulsewidth 10us, electric current 30A, and filling spacing is 0.01mm.
Embodiment 6
Present embodiments provide a kind of 3D hand-set lid with functional hole, processing technology it is different from embodiment 5 it
Be in, in step (2), the laser carving parameter of the first figure layer are as follows: mark speed 1200mm/s, Q frequency is 25kHz, and pulsewidth is
20us, electric current 50A.
Embodiment 7
Present embodiments provide a kind of 3D hand-set lid with functional hole, processing technology it is different from embodiment 5 it
Be in, in step (2), the laser carving parameter of the second figure layer are as follows: mark speed be 2000mm/s, Q frequency be 60kHz, pulsewidth
For 3us, electric current 15A.
1 comparative example of comparative example provides a kind of 3D hand-set lid with functional hole, according to traditional silk-screen printing side
Formula is prepared.
Test example 1
The hand-set lid with functional hole that embodiment 1-7 and comparative example 1 are provided is subjected to functional hole light transmittance, outer respectively
It sees and dimensional tolerance is tested, the results are shown in Table 1.
Table 1 has the hand-set lid performance data table of functional hole
As it can be seen from table 1 the light transmittance for the hand-set lid bore region with functional hole that embodiment 1-7 is provided
85% or more, appearance looks elegant, the bad phenomenons such as no illiteracy shape stain and black surround, dimensional tolerance is within ± 0.06mm, significantly
Higher than the hand-set lid that comparative example 1 provides, this illustrates that the hand-set lid with functional hole that 1-7 of the embodiment of the present invention is provided passes through
Laser laser carving makes the ink layer of function bore region gasify, and functional hole machining accuracy is high, and appearance is beautiful, and light transmittance is high.
The comparison of embodiment 1-5 and embodiment 6-7 is as can be seen that embodiment 1-5 offer has functional hole from table 1
Hand-set lid function bore region light transmittance 92% or more, dimensional tolerance is within ± 0.05mm, light transmittance and size
Machining accuracy is above embodiment 6-7, this explanation is when carrying out laser laser carving, the laser carving parameter of the first figure layer are as follows: mark speed
For 1600-1800mm/s, Q frequency is 35-55kHz, pulsewidth 5-15us, electric current 25-35A, and the second figure layer laser carving parameter
Are as follows: mark speed is 1600-1800mm/s, and Q frequency is 25-45kHz, pulsewidth 5-15us, when electric current is 25-35A, processing
Light transmittance and the dimensional machining accuracy for obtaining hand-set lid function bore region are higher, and the high quality that can meet client is wanted
It asks.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of processing method of 3D cover board functional hole, which comprises the steps of:
3D cover board is provided, the 3D cover board is provided with function bore region, wherein the 3D cover board includes 3D substrate and is set to 3D
Ink layer on substrate；
Laser laser carving is carried out to the function bore region, so that the ink layer of the function bore region is gasified, obtains with functional hole
3D cover board.
2. the processing method of 3D cover board functional hole according to claim 1, which is characterized in that the laser of the laser laser carving
Wavelength be 340-370nm, preferably 350-360nm, more preferably 355nm.
3. the processing method of 3D cover board functional hole according to claim 1, which is characterized in that carry out laser using laser engraving machine
Laser carving.
4. the processing method of 3D cover board functional hole according to claim 3, which is characterized in that the laser engraving machine is provided with
One figure layer and the second figure layer, the laser carving parameter of first figure layer are as follows: mark speed is 1600-1800mm/s, and Q frequency is 35-
55kHz, pulsewidth 5-15us, electric current 25-35A, filling spacing are 0.005-0.015mm, and filling angle is 0-180 °；
And/or the laser carving parameter of second figure layer are as follows: mark speed is 1600-1800mm/s, and Q frequency is 25-45kHz, arteries and veins
Width is 5-15us, and electric current 25-35A, filling spacing is 0.005-0.015mm, and filling angle is 0-180 °.
5. the processing method of 3D cover board functional hole according to claim 1-4, which is characterized in that the 3D cover board
Preparation method include the following steps: to provide 3D substrate, ink is set on 3D substrate, forms ink layer, obtains 3D cover board.
6. the processing method of 3D cover board functional hole according to claim 5, which is characterized in that ink is arranged on 3D substrate
Afterwards, it first carries out pre-baked, then is baked admittedly, so that ink is firmly attached on 3D substrate, form ink layer.
7. the processing method of 3D cover board functional hole according to claim 6, which is characterized in that pre-baked temperature is 70-90
DEG C, preferably 75-85 DEG C, more preferably 80 DEG C；
And/or the roasting temperature admittedly is 140-180 DEG C, preferably 150-170 DEG C, more preferably 160 DEG C.
8. application of the processing method of 3D cover board functional hole according to claim 1-7 in the processing of 3D cover board.
9. a kind of 3D cover board with functional hole, which is characterized in that 3D cover board function according to claim 1-7
The processing method in hole is prepared.
10. a kind of electronic equipment, which is characterized in that including the 3D cover board as claimed in claim 9 with functional hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811369369.4A CN109483063A (en) | 2018-11-16 | 2018-11-16 | The processing method of 3D cover board functional hole and the 3D cover board with functional hole and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811369369.4A CN109483063A (en) | 2018-11-16 | 2018-11-16 | The processing method of 3D cover board functional hole and the 3D cover board with functional hole and electronic equipment |
Publications (1)
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| CN112171050A (en) * | 2019-07-05 | 2021-01-05 | 大族激光科技产业集团股份有限公司 | Method for detaching terminal display screen |
| CN113416004A (en) * | 2021-06-15 | 2021-09-21 | 维达力实业（赤壁）有限公司 | Method for preparing glass panel |
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Application publication date: 20190319 |