CN102065644B - Method for making and packaging printed circuit board (PCB) and crystal oscillator - Google Patents
Method for making and packaging printed circuit board (PCB) and crystal oscillator Download PDFInfo
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- CN102065644B CN102065644B CN201010587448XA CN201010587448A CN102065644B CN 102065644 B CN102065644 B CN 102065644B CN 201010587448X A CN201010587448X A CN 201010587448XA CN 201010587448 A CN201010587448 A CN 201010587448A CN 102065644 B CN102065644 B CN 102065644B
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Abstract
The invention discloses a method for making and packaging a printed circuit board (PCB). The method comprises the following steps of: providing the PCB, wherein, the PCB is provided with at least one circuit area, and a packaging area is closely arranged around the circuit area; milling the packaging area so as to form a groove between the packaging area and the circuit area; carrying out electroless copper plating in the circuit area and metallization treatment in the packaging area; etching the circuit area according to circuit layout, and arranging components on the circuit area; providing a metal cover body, arranging the lower end of the metal cover body in the groove formed between the packaging area and the circuit area, wherein the circuit area is in the metal cover body; and welding the lower end of the metal cover body with the groove. The invention further discloses a crystal oscillator with the PCB.
Description
Technical field
The present invention relates to the printed circuit board field, relate more specifically to a kind of manufacture method, method for packing of printed circuit board, and the crystal oscillator with this printed circuit board.
Background technology
In electronic product and related industry (for example crystal oscillator industry) thereof, need be electrical connected between each electronic component, with transmission power supply signal, data-signal etc., so be used for realizing that the manufacturing of circuit board of each electronic component conducting is most important with encapsulation.The device of and some high-frequency high stabilities less relatively based on some use amounts is difficult to realize wafer-level package.Usually the manufacturer of Related product can come the circuit of specific function on the printed circuit board (pcb board), through debugging, detect and be packaged into the individual devices sale after qualified.Now production technology is main with surface mount all, so be main with the surface-adhered type device after the formed product.The surface mount device that utilizes pcb board to make can directly use.If but do not make any other processed, would tentatively make the pcb board accomplished because outside the circuit on surface and components and parts were exposed to, the reliability of circuit board and antijamming capability variation also made the electronic product utmost point not attractive in appearance.Owing to the surface irregularity of device, the vacuum cup of machine can't hold product surface, is not suitable for the batch process of automation, also is not suitable for businessman and on product, stamps label in addition.
Some utilizes the surface-adhered type device that pcb board is made on the market; Detecting qualified back adopts plastic packaging glue housing that entire circuit is encapsulated; Form the integral body of a sealing, do like this, though protected pcb board from physical layer; But plastic packaging glue housing does not have shielding action, can not shield the interference of external electromagnetic ripple; And the plastic packaging glue housing that adopts needs particular manufacturing craft, and the cost of die sinking is high, the manufacturing cycle is long, and is inconvenient to behind the mould molding revise, and is unfavorable for existing product is improved.For optimal design, the crown cap packaged type is adopted in improved on the market pcb board encapsulation.Adopt the cost of crown cap encapsulation low, production technology is simple, but laser marking or decals, and have good air-tightness and shielding properties.But in the course of processing of pcb board; For example in the Reflow Soldering of surface-adhered type components and parts; The location of crown cap and fixed form become difficult problem of industry, and the fixing means of crown cap adopts direct welding on the market at present, and this method cost is high; And defect rate is high, is unfavorable for the pcb board manufacture craft that realizes that high efficiency is high-quality.
Therefore, demand a kind of manufacture method and method for packing of printed circuit board urgently,, overcome above-mentioned defective to realize raising production efficient, to improve the quality of products.
Summary of the invention
The object of the present invention is to provide a kind of can realize improving production efficient, the method for manufacturing printed circuit board that improves the quality of products and method for packing thereof; And the crystal oscillator with this printed circuit board, to realize flexible manufacturing, assembling and the repacking of crystal oscillator.
In order to achieve the above object; The invention provides a kind of manufacture method of printed circuit board, the concrete steps of this method comprise: step (1) provides a printed circuit board; Have at least one circuit region on the said printed circuit board, said circuit region around in connection with packaging area; Step (2), the said packaging area of milling makes between said packaging area and the said circuit region and forms groove; Step (3) is sunk copper at said circuit region and is handled, and the enterprising row metal processing of said packaging area; And step (4), according to the said circuit region of circuit layout etching.
Preferably, in the manufacture method of printed circuit board according to the invention, the degree of depth of said groove is the half the of said printed circuit plate thickness.
Preferably, in the manufacture method of printed circuit board according to the invention, the metalized that said packaging area carries out is handled for heavy copper.
Preferably, in the manufacture method of printed circuit board according to the invention, said printed circuit board has the surface-adhered type pad.
In order to achieve the above object; The present invention also provides a kind of method for packing of printed circuit board, and the concrete steps of its this method comprise: step (1) provides a printed circuit board; Have at least one circuit region on the said printed circuit board, said circuit region around in connection with packaging area; Step (2), the said packaging area of milling makes between said packaging area and the said circuit region and forms groove; Step (3) is sunk copper at said circuit region and is handled, and the enterprising row metal processing of said packaging area; Step (4), according to the said circuit region of circuit layout etching, and on said circuit region the layout components and parts; Step (5) provides a metal cap body, and the lower end of said metal cap body is arranged in the said groove that forms between said packaging area and the said circuit region, and said circuit region is arranged in the said metal cap body; And step (6), the lower end of said metal cap body is welded in the said groove.
Preferably, in the method for packing of printed circuit board according to the invention, the degree of depth of said groove is the half the of said printed circuit plate thickness.
Preferably, the method for packing of printed circuit board according to the invention, the thickness of the lower end of said metal cap body equates with the width of said packaging area.
Preferably, the method for packing of printed circuit board according to the invention, said printed circuit board has the surface-adhered type pad.
In order to achieve the above object; The present invention also provides a kind of crystal oscillator; This crystal oscillator comprises printed circuit board and metal cap body, and said printed circuit board comprises circuit region and packaging area, said circuit region around in connection with said packaging area; Form groove between said packaging area and the said circuit region; Layout has oscillating circuit on the said circuit region, and said packaging area is provided with through the metal level after the metalized, and said circuit region is arranged in the said metal cap body; The lower end of said metal cap body is arranged in the said groove that forms between said packaging area and the said circuit region, and the lower end of said metal cap body is welded on the said metal level.
Preferably, crystal oscillator of the present invention is a surface-mounting type crystal oscillator.When crystal oscillator is surface-mounting type crystal oscillator, groove be arranged so that crystal oscillator when Reflow Soldering, can not become flexible or be shifted between metal cap body and the printed circuit board, improve the quality of product.
Compared with prior art; In printed circuit board manufacture craft provided by the present invention; Form groove through milling process between circuit region and the packaging area in the printed circuit board; And carried out metalized at packaging area, make on packaging area, to have formed metal level, for the encapsulation of printed circuit board provides basis, location easily.When printed circuit board carries out encapsulation step; The groove that forms through milling process makes when the lower end of metal cap body is placed in the groove; Metal cap body Primary Location to a certain extent and is not easy in follow-up manufacturing procedure to produce unnecessary displacement with respect to printed circuit board on printed circuit board.The setting of chemical copper layer makes the lower end of metal cap body can pass through easy welding sequence, realizes that metal cap body firmly is installed on the printed circuit board securely.The crystal oscillator of this circuit board making of process for example of the present invention and packaging technology; Because the groove that forms between packaging area and the said circuit region; And the setting of chemical copper layer in the groove; The accurate location that greatly makes things convenient for metal shell in the crystal oscillator with install and fix, improve production efficient and improve the quality of products; Moreover because this encapsulating housing is a metal shell, its shielding properties is good; And when the components and parts on the printed circuit board need repairing or re-assembly; Need only melt this scolding tin, can open metal cap body, the components and parts of maintenance crystal oscillator or expand the function of this crystal oscillator.
Through following description and combine accompanying drawing, it is more clear that the present invention will become, and these accompanying drawings are used to explain embodiments of the invention.
Description of drawings
Fig. 1 is the flow chart of the manufacture method of printed circuit board of the present invention.
Fig. 2 is the flow chart of the method for packing of printed circuit board of the present invention.
Fig. 3 is the structural representation of crystal oscillator of the present invention.
Fig. 4 is the view during printed circuit board of the present invention is made.
Fig. 5 is the view in the printed circuit board encapsulation of the present invention.
Embodiment
With reference now to accompanying drawing, describe embodiments of the invention, the similar elements label is represented similar elements in the accompanying drawing.The invention provides a kind of can realize improving production efficient, the method for manufacturing printed circuit board that improves the quality of products and method for packing thereof; And the crystal oscillator with this printed circuit board, to realize flexible manufacturing, assembling and the repacking of crystal oscillator.
Be illustrated in figure 1 as the flow chart of method for manufacturing printed circuit board of the present invention; The step of said manufacture method is following: step S11; A printed circuit board is provided, has at least one circuit region on the said printed circuit board, said circuit region around in connection with packaging area; Step S12, the said packaging area of milling makes between said packaging area and the said circuit region and forms groove; Step S13 sinks copper at said circuit region and handles, and the enterprising row metal processing of said packaging area; And step S14, according to the said circuit region of circuit layout etching.
Be illustrated in figure 2 as the flow chart of printed circuit board method for packing of the present invention; The concrete steps of said method for packing are following: step S21; A printed circuit board is provided, has at least one circuit region on the said printed circuit board, said circuit region around in connection with packaging area; Step S22, the said packaging area of milling makes between said packaging area and the said circuit region and forms groove; Step S23 sinks copper at said circuit region and handles, and the enterprising row metal processing of said packaging area; Step S24, according to the said circuit region of circuit layout etching, and on said circuit region the layout components and parts; Step S25 provides a metal cap body, and the lower end of said metal cap body is arranged in the said groove that forms between said packaging area and the said circuit region, and said circuit region is arranged in the said metal cap body; And step S26, the lower end of said metal cap body is welded in the said groove.Need to prove that the sequence of steps of printed circuit board method for packing is not limited in the order in the foregoing description.
With reference to figure 1-5, the making of printed circuit board and method for packing detailed step implementation step are following.
Step S21; A printed circuit board is provided, in the present embodiment, has only a circuit region 11 on the said printed circuit board original plate; In connection with packaging area 12, that is to say that packaging area 12 is close to and is surrounded said circuit region 11 to be provided with around the said circuit region 11.Said circuit region 11 is used on this zone, laying the printed circuit cabling, and on the printed circuit cabling, lays various components and parts.Said packaging area 12 is the usefulness of the packaging process of printed circuit board 10.In the present embodiment, circuit region 11 is a rectangle, and correspondingly, packaging area 12 is the rectangle frame in mating circuit zone 11.In other embodiments of the invention, the shape of printed circuit board can be square, circle, ellipse or other polygon etc., other shape that is shaped as this circuit region of cooperation of packaging area.And, in other embodiments, can be provided with the combination of a plurality of circuit regions and packaging area on the printed circuit board original plate.
Step S22, said printed circuit board 10 can be aluminium sheet, phenolic resins plate, glass mat or epoxy resin board etc.In this step; Utilize the printed circuit board 10 of said packaging area 12 correspondences of device millings such as milling cutter or milling machine; Make script circuit region 11 and packaging area 12 at grade, through behind the milling process, packaging area 12 subsides downwards with respect to circuit region 11; Make between said packaging area 12 and the said circuit region 11 to form groove 13, and unnecessary part beyond the packaging area 12 milled remove.Preferably, the degree of depth of said groove 13 is the half the of said printed circuit board 10 integral thickness.
Step S23, in the present embodiment, the copper that on said circuit region 11 and said packaging area 12, sinks is handled, and makes to form one deck chemical copper layer on circuit region 11 and the said packaging area 12.In other embodiment, packaging area 12 can be done other metalized.
Step S24 through after heavy copper processing and other operation, has formed and has covered the copper layer on the circuit region 11 of printed circuit board 10; Then; Etch said circuit region 11 according to circuit layout on the copper layer covering, on circuit region 11, get out through hole, and plant and the layout components and parts in the through hole of circuit region 11; So far, the components and parts layout of said circuit region 11 is accomplished.
Step S25, with reference to figure 3, an embodiment for printed circuit board of the present invention shown in Figure 3 uses, that is: crystal oscillator 20.This crystal oscillator 20 comprises metal cap body 21 and printed circuit board 22, and printed circuit board 22 comprises circuit region 221 and packaging area 222.In this step (5), a metal cap body 21 is provided, and the lower end 211 of said metal cap body is arranged in the said groove 223 that forms between said packaging area 222 and the said circuit region 221.Particularly, the lower limb of the lower end 211 of the metal cap body said packaging area 222 of fitting is provided with, and alternatively, the thickness of metal cap body lower end 211 is identical with the width of said packaging area 222, and both coincide and fix.When metal cap body 21 is arranged on the said printed circuit board 22; Said circuit region 221 is arranged in the said metal cap body 21, and because the existence of groove 223, metal cap body 21 tentatively is fixed on the said printed circuit board 22; And in ensuing operation; Both are not easy to produce relative displacement, help improving production efficient, the rate of reducing the number of rejects and seconds.
Step S26 with reference to figure 3, is welded in the lower end 211 of said metal cap body in the said groove 223, and welds together with ground wire.Particularly; The packaging area 222 of printed circuit board 22 advanced heavy copper processing and had formed the chemical copper layer in aforementioned operation; In this step; The edge of the lower end 211 of metal cap body is arranged on the chemical copper layer of packaging area 222, and through welding sequence metal cap body 211 is welded on the printed circuit board 22.So far, the packaging process of printed circuit board is accomplished, and the packaging process of crystal oscillator is also accomplished in the present embodiment.
Shown in Figure 3 is a kind of crystal oscillator of the present invention, and the processing technology of this crystal oscillator has been used the making and the method for packing of above-mentioned printed circuit board.This crystal oscillator 20 comprises printed circuit board 22 and metal cap body 21; Said printed circuit board 22 comprises circuit region 221 and packaging area 222; In connection with said packaging area 222, form groove 223 between said packaging area 222 and the said circuit region 221 around the said circuit region 221.Layout has oscillating circuit on the said circuit region 221; Said packaging area 222 is provided with through the chemical copper layer after the heavy copper processing; Said circuit region 221 is arranged in the said metal cap body 21; The lower end 211 of said metal cap body is arranged in the said groove 223 that forms between said packaging area 222 and the said circuit region 221, and the lower end 211 of said metal cap body is welded on the said chemical copper layer.In the present embodiment; This crystal oscillator 20 is a surface-mounting type crystal oscillator; So it has surface-adhered type pad 23; This has surface-adhered type pad 23 to be installed in the bottom of printed circuit board 22, and the oscillating circuit of deciding in the circuit region 221 with being laid in printed circuit board 22 tops is electrically connected.Crystal oscillator 20 is welded in the electronic product through this surface-adhered type pad 23.Groove 223 be arranged so that surface-mounting type crystal oscillator can not become flexible or be shifted between metal cap body 21 and the printed circuit board 22 in the present embodiment when Reflow Soldering, improve the quality of product.In other embodiment, can be other metalized in the packaging area of printed circuit board, this metalized is the common practise of this area, just repeats no more at this.In addition, crystal oscillator is not limited to the surface-mounting type crystal oscillator in the present embodiment, can be the crystal oscillator of other type.
Need to prove that the making of printed circuit board of the present invention and method for packing are not limited to be applied to above-mentioned crystal oscillating circuit, need can be applicable to be determined on a case-by-case basis in other electronic product of printed circuit board.
In printed circuit board manufacture craft provided by the present invention; Form groove through milling process between circuit region and the packaging area in the printed circuit board; And carried out heavy copper at packaging area and handled; Make on packaging area, to have formed the chemical copper layer, for the encapsulation of printed circuit board provides basis, location easily.When printed circuit board carries out encapsulation step; The groove that forms through milling process makes when the lower end of metal cap body is placed in the groove; Metal cap body Primary Location to a certain extent and is not easy in follow-up manufacturing procedure to produce unnecessary displacement with respect to printed circuit board on printed circuit board.The setting of chemical copper layer makes the lower end of metal cap body can pass through easy welding sequence, realizes that metal cap body firmly is installed on the printed circuit board securely.The crystal oscillator of this circuit board making of process for example of the present invention and packaging technology; Because the groove that forms between packaging area and the said circuit region; And the setting of chemical copper layer in the groove; The accurate location that greatly makes things convenient for metal shell in the crystal oscillator with install and fix, improve production efficient and improve the quality of products; Moreover because this encapsulating housing is a metal shell, its shielding properties is good; And when the components and parts on the printed circuit board need repairing or re-assembly; Need only melt this scolding tin, can open metal cap body, the components and parts of maintenance crystal oscillator or expand the function of this crystal oscillator.
Invention has been described more than to combine most preferred embodiment, but the present invention is not limited to the embodiment of above announcement, and should contain various modification, equivalent combinations of carrying out according to essence of the present invention.
Claims (10)
1. the manufacture method of a printed circuit board is characterized in that, comprises step:
A printed circuit board is provided, has at least one circuit region on the said printed circuit board, said circuit region around in connection with packaging area;
The said packaging area of milling makes between said packaging area and the said circuit region and forms groove;
Sink copper at said circuit region and handle, and the enterprising row metal processing of said packaging area; And
According to the said circuit region of circuit layout etching.
2. the manufacture method of printed circuit board as claimed in claim 1 is characterized in that, the degree of depth of said groove is the half the of said printed circuit plate thickness.
3. the manufacture method of printed circuit board as claimed in claim 1 is characterized in that, the metalized that said packaging area carries out is handled for heavy copper.
4. like the manufacture method of each described printed circuit board of claim 1 to 3, it is characterized in that said printed circuit board has the surface-adhered type pad.
5. the method for packing of a printed circuit board is characterized in that, comprises step:
A printed circuit board is provided, has at least one circuit region on the said printed circuit board, said circuit region around in connection with packaging area;
The said packaging area of milling makes between said packaging area and the said circuit region and forms groove;
Sink copper at said circuit region and handle, and the enterprising row metal processing of said packaging area;
According to the said circuit region of circuit layout etching, and on said circuit region the layout components and parts;
A metal cap body is provided, and the lower end of said metal cap body is arranged in the said groove that forms between said packaging area and the said circuit region, said circuit region is arranged in the said metal cap body; And
The lower end of said metal cap body is welded in the said groove.
6. the method for packing of printed circuit board as claimed in claim 5 is characterized in that, the degree of depth of said groove is the half the of said printed circuit plate thickness.
7. the method for packing of printed circuit board as claimed in claim 5 is characterized in that, the thickness of the lower end of said metal cap body equates with the width of said packaging area.
8. like the method for packing of each described printed circuit board of claim 5 to 7, it is characterized in that said printed circuit board has the surface-adhered type pad.
9. a crystal oscillator is characterized in that, comprises printed circuit board and metal cap body; Said printed circuit board comprises circuit region and packaging area; In connection with said packaging area, form groove between said packaging area and the said circuit region around the said circuit region, layout has oscillating circuit on the said circuit region; Said packaging area is provided with through the metal level after the metalized; Said circuit region is arranged in the said metal cap body, and the lower end of said metal cap body is arranged in the said groove that forms between said packaging area and the said circuit region, and the lower end of said metal cap body is welded on the said metal level.
10. crystal oscillator as claimed in claim 9 is characterized in that, said crystal oscillator is a surface-mounting type crystal oscillator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010587448XA CN102065644B (en) | 2010-12-14 | 2010-12-14 | Method for making and packaging printed circuit board (PCB) and crystal oscillator |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010587448XA CN102065644B (en) | 2010-12-14 | 2010-12-14 | Method for making and packaging printed circuit board (PCB) and crystal oscillator |
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| CN102065644A CN102065644A (en) | 2011-05-18 |
| CN102065644B true CN102065644B (en) | 2012-08-15 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103188863B (en) * | 2011-12-30 | 2016-08-03 | 深南电路有限公司 | Printed circuit board (PCB) plate, manufacture method, printed circuit board (PCB) and method for packing thereof |
| CN104582275B (en) * | 2013-10-17 | 2017-12-05 | 北大方正集团有限公司 | The preparation method of the pcb board of high frequency material and the pcb board of high frequency material |
| CN104283524B (en) * | 2014-10-22 | 2017-07-14 | 应达利电子股份有限公司 | A kind of piezoelectric quartz crystal resonator and preparation method thereof |
| CN106899277A (en) * | 2017-02-16 | 2017-06-27 | 珠海迈科智能科技股份有限公司 | The preparation method and crystal oscillator element of a kind of crystal oscillator element |
| CN107332532A (en) * | 2017-06-27 | 2017-11-07 | 袁力翼 | A kind of encapsulation preparation method of crystal oscillator |
| CN107745167A (en) * | 2017-09-19 | 2018-03-02 | 安徽华东光电技术研究所 | A kind of preparation method of the oscillator module of multifrequency point |
| CN112242824A (en) * | 2019-07-19 | 2021-01-19 | 咸阳振峰电子有限公司 | Packaging process of micro-assembly patch crystal filter |
| CN111191762B (en) * | 2019-12-30 | 2023-03-10 | 神思电子技术股份有限公司 | Method for improving performance of dinner plate RFID electronic tag |
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| KR20060116054A (en) * | 2005-05-09 | 2006-11-14 | 삼성전기주식회사 | Ceramic package of crystal oscillator |
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| KR20060116054A (en) * | 2005-05-09 | 2006-11-14 | 삼성전기주식회사 | Ceramic package of crystal oscillator |
| CN101018423A (en) * | 2006-02-06 | 2007-08-15 | 菱生精密工业股份有限公司 | Microphone encapsulation structure |
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