CN104582323A - High-density interconnection circuit board and manufacturing method thereof - Google Patents
High-density interconnection circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN104582323A CN104582323A CN201410857301.6A CN201410857301A CN104582323A CN 104582323 A CN104582323 A CN 104582323A CN 201410857301 A CN201410857301 A CN 201410857301A CN 104582323 A CN104582323 A CN 104582323A
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- CN
- China
- Prior art keywords
- circuit board
- prepreg
- blind hole
- density interconnected
- interconnected circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a manufacturing method of a high-density interconnection circuit board. The manufacturing method includes the following steps that one surfaces of two conducting plates are drilled to form blind holes; the blind holes are filled with conducting materials, the surfaces, with the blind holes, of the two conducting plates are inner layers, and inner layer patterns are manufactured on the inner layers; the two conducting plates are pressed to two opposite surfaces of a first semi-cured piece, a circuit board is formed, and the inner layers of the conducting plates face the first semi-cured piece; the sides, away from the first semi-cured piece, of the two conducting plates serve as outer layers, and outer layer patterns are manufactured on the outer layers. The invention further provides the high-density interconnection circuit board. Compared with a high-density interconnection circuit board manufactured through a traditional method, the high-density interconnection circuit board is flatter in surface, and electronic components can be attached to the surface of the circuit board conveniently.
Description
Technical field
The present invention relates to printed circuit board (PCB), particularly relate to a kind of high-density interconnected circuit board and manufacture method thereof.
Background technology
Along with miniaturization, the lightweight development of electronic product, the application of high density interconnect (High DensityInterconnector, HDI) circuit board is more and more extensive.The feature of high-density interconnected circuit board is that circuit distribution density is higher, and between point, wiring lengths is shorter, and these features need to use high-density line configuration and micropore (usually adopting blind hole) technology to realize.
High-density interconnected circuit board, when making final products, it can be installed integrated circuit, electric crystal, diode, passive device (as resistance, electric capacity and connector etc.) and other various electronic components.When various electronic component is installed on high-density interconnected circuit board surface, on plate, the evenness of pasting area can produce significant impact to the effect of attachment.
The manufacturing process of traditional high-density interconnected circuit board is normally: first central layer sawing sheet, then makes inner figure, and then pressing prepreg and conductor, then hole, then filling perforation, finally makes outer graphics.As shown in Figure 1, when filling perforation, because the factor such as porefilling capability and working condition by pass, electroplating liquid medicine limits, there will be pit 4 at blind hole 3 top, the existence of pit 4 makes high-density interconnected circuit board surface irregularity, is unfavorable for the attachment of electronic devices and components.
Summary of the invention
Based on this, be necessary to provide high-density interconnected circuit board and manufacture method thereof that a kind of surface smoothness is higher.
A manufacture method for high-density interconnected circuit board, comprises the following steps: hole in the one side of two conductive plates respectively, forms blind hole; Use filled with conductive material blind hole, and with the one side being provided with blind hole of two conductive plates for internal layer, layer pattern in internal layer makes; Two conductive plates are pressed on the relative two sides of first prepreg, form circuit board, wherein the internal layer of conductive plate is towards the first prepreg; With with the side deviating from the first prepreg of two conductive plates for skin, skin makes outer patterns.
Wherein in an embodiment, holing in the one side of two conductive plates respectively, before forming the step of blind hole, the manufacture method of high-density interconnected circuit board also comprises the relative two sides two conductor layers being pressed on second prepreg, forms conductive plate.
Wherein in an embodiment, blind hole is produced by laser drill.
Wherein in an embodiment, electric conducting material is copper.
A kind of high-density interconnected circuit board, comprise the first prepreg and lay respectively at two conductive plates on relative two sides of the first prepreg, conductive plate comprises the second prepreg and lays respectively at the conductor layer on relative two sides of the second prepreg, conductive plate has towards the internal layer of the first prepreg and the skin deviating from the first prepreg, internal layer is provided with blind hole and interior layer pattern, skin is provided with outer patterns, is filled with electric conducting material in blind hole.
Wherein in an embodiment, the aperture of blind hole reduces to the direction away from the first prepreg gradually from connecting the first prepreg place.
Wherein in an embodiment, electric conducting material is copper.
Above-specified high density interconnection circuit plate and manufacture method thereof, after conductive plate has made interior layer pattern, then be pressed on the relative two sides of the first prepreg by conductive plate, form circuit board, wherein the internal layer of conductive plate is towards the first prepreg.Such design, be actually the inside that the blind hole after by filling perforation is arranged on circuit board, even if thus limit by factors such as the porefilling capability of pass, electroplating liquid medicine and working conditions when filling perforation, pit is there is at blind hole top, also can guarantee that the final circuit board surface formed is smooth, be conducive at pasted on surface of circuit board electronic devices and components.
Accompanying drawing explanation
In order to describe the mode that can obtain the above-mentioned of this theme and other advantage and feature, the specific embodiment by reference to this theme shown in accompanying drawing is presented the more specifically description of this theme of above concise and to the point description.Should be appreciated that, these drawings depict only each exemplary embodiments, and therefore it should not be considered to the restriction to scope, and each embodiment will describe by using accompanying drawing supplementary features and details and explain, in the accompanying drawings:
The high-density interconnected circuit board partial schematic diagram that Fig. 1 produces for high-density interconnected circuit board manufacture method that employing is traditional;
Fig. 2 is the flow chart of the manufacture method of the high-density interconnected circuit board of an embodiment;
Each manufacturing process that Fig. 3-7 is the manufacture method shown in Fig. 2 obtains the vertical section schematic diagram of wafer;
Fig. 8 is the vertical section schematic diagram of the high-density interconnected circuit board of an embodiment.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.First-selected embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, the object of these embodiments is provided to be make to disclosure of the present invention more thoroughly comprehensively.
As shown in Figure 2, the manufacture method of the high-density interconnected circuit board of an embodiment comprises the following steps:
Two conductor layers are pressed on the relative two sides of second prepreg by step S100, form conductive plate.
As shown in Figure 3, two conductor layers 22 are pressed on the relative two sides of second prepreg 21, form conductive plate 2.In the present embodiment, use two conductive plates 2.
Step S200, holes respectively in the one side of two conductive plates, forms blind hole.
As shown in Figure 4, hole in the one side of two conductive plates 2 respectively, form blind hole 3.In the present embodiment, blind hole 3 is produced by laser drill.In other embodiments, the usual ways such as machine drilling also can be adopted to form blind hole 3.
Step S300, uses filled with conductive material blind hole, and with the one side being provided with blind hole of two conductive plates for internal layer, layer pattern in internal layer makes.
As shown in Figure 5, fill blind hole 3, and with the one side being provided with blind hole 3 of conductive plate 2 for internal layer 23, layer pattern in internal layer 23 makes.In the present embodiment, copper is adopted to fill blind hole 3.In other embodiments, other filled with conductive material blind holes 3 can also be used, such as electrogilding or palladium-nickel alloy.
Two conductive plates are pressed on the relative two sides of first prepreg by step S400, and form circuit board, wherein the internal layer of conductive plate is towards the first prepreg.
As shown in Figure 6, two conductive plates 2 are pressed on the relative two sides of first prepreg 1, form circuit board, wherein the internal layer 23 of conductive plate 2 is towards the first prepreg 1, is also that the opening part of blind hole 3 is also towards the first prepreg 1.In the present embodiment, the material of the first prepreg 1 is identical with the material of the second prepreg 21.
Step S500, with the side deviating from the first prepreg of two conductive plates for skin, skin makes outer patterns.
As shown in Figure 7, with the side deviating from the first prepreg 1 of conductive plate 2 for outer 24, on outer 24, outer patterns is made.
As shown in Figure 8, the high-density interconnected circuit board of an embodiment comprises the first prepreg 1 and lays respectively at two conductive plates 2 on relative two sides of the first prepreg 1.Conductive plate 2 comprises the second prepreg 21 and lays respectively at the conductor layer 22 on relative two sides of the second prepreg 21.Conductive plate 2 has towards the internal layer 23 of the first prepreg 1 and the skin 24 deviating from the first prepreg 1, and internal layer 23 is provided with blind hole 3 and interior layer pattern, and outer 24 are provided with outer patterns.
Be filled with electric conducting material in blind hole 3, in the present embodiment, the electric conducting material be filled in blind hole 3 is copper.In other embodiments, other filled with conductive material blind holes 3 can also be used, such as electrogilding or palladium-nickel alloy.
In one embodiment, adopt the mode of laser drill to form blind hole 3, the aperture of blind hole 3 reduces to the direction away from the first prepreg 1 gradually from connecting the first prepreg 1 place, is convenient to fill electroplating liquid medicine.
Above-specified high density interconnection circuit plate and manufacture method thereof, after conductive plate 2 has made interior layer pattern, then be pressed on the relative two sides of the first prepreg 1 by conductive plate 2, form circuit board, wherein the internal layer 23 of conductive plate 2 is towards the first prepreg 1.Such design, be actually the inside that the blind hole after by filling perforation 3 is arranged on circuit board, even if thus limit by factors such as the porefilling capability of pass, electroplating liquid medicine and working conditions when filling perforation, pit is there is at blind hole 3 top, also can guarantee that the final circuit board surface formed is smooth, be conducive at pasted on surface of circuit board electronic devices and components.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (7)
1. a manufacture method for high-density interconnected circuit board, is characterized in that, comprises the following steps:
Hole in the one side of two conductive plates respectively, form blind hole;
Use blind hole described in filled with conductive material, and with the one side being provided with blind hole of described two conductive plates for internal layer, layer pattern in described internal layer makes;
Described two conductive plates are pressed on the relative two sides of first prepreg, form circuit board, the internal layer of wherein said conductive plate is towards described first prepreg; With
With the side deviating from described first prepreg of described two conductive plates for skin, described skin makes outer patterns.
2. the manufacture method of high-density interconnected circuit board according to claim 1, it is characterized in that, holing in the one side of two conductive plates respectively, before forming the step of blind hole, the manufacture method of described high-density interconnected circuit board also comprises the relative two sides two conductor layers being pressed on second prepreg, forms conductive plate.
3. the manufacture method of high-density interconnected circuit board according to claim 1, is characterized in that, described blind hole is produced by laser drill.
4. the manufacture method of high-density interconnected circuit board according to claim 1, is characterized in that, described electric conducting material is copper.
5. a high-density interconnected circuit board, it is characterized in that, comprise the first prepreg and lay respectively at two conductive plates on relative two sides of described first prepreg, described conductive plate comprises the second prepreg and lays respectively at the conductor layer on relative two sides of described second prepreg, described conductive plate has towards the internal layer of described first prepreg and the skin deviating from described first prepreg, described internal layer is provided with blind hole and interior layer pattern, described skin is provided with outer patterns, is filled with electric conducting material in described blind hole.
6. high-density interconnected circuit board according to claim 5, is characterized in that, the aperture of described blind hole reduces to the direction away from described first prepreg gradually from connecting described first prepreg place.
7. high-density interconnected circuit board according to claim 5, is characterized in that, described electric conducting material is copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410857301.6A CN104582323B (en) | 2014-12-31 | 2014-12-31 | High-density interconnected circuit board and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410857301.6A CN104582323B (en) | 2014-12-31 | 2014-12-31 | High-density interconnected circuit board and its manufacture method |
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| Publication Number | Publication Date |
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| CN104582323A true CN104582323A (en) | 2015-04-29 |
| CN104582323B CN104582323B (en) | 2017-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410857301.6A Active CN104582323B (en) | 2014-12-31 | 2014-12-31 | High-density interconnected circuit board and its manufacture method |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008124370A (en) * | 2006-11-15 | 2008-05-29 | Hitachi Chem Co Ltd | Method of manufacturing multilayer printed wiring board |
| CN201491366U (en) * | 2009-07-31 | 2010-05-26 | 深圳市金百泽电路板技术有限公司 | Multilayered extra-thick printed circuit board with blind hole structure |
| CN102065651A (en) * | 2011-01-12 | 2011-05-18 | 广州兴森快捷电路科技有限公司 | Production method of high-density laminated printed circuit board of high-frequency material |
| CN104244614A (en) * | 2013-06-21 | 2014-12-24 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
-
2014
- 2014-12-31 CN CN201410857301.6A patent/CN104582323B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008124370A (en) * | 2006-11-15 | 2008-05-29 | Hitachi Chem Co Ltd | Method of manufacturing multilayer printed wiring board |
| CN201491366U (en) * | 2009-07-31 | 2010-05-26 | 深圳市金百泽电路板技术有限公司 | Multilayered extra-thick printed circuit board with blind hole structure |
| CN102065651A (en) * | 2011-01-12 | 2011-05-18 | 广州兴森快捷电路科技有限公司 | Production method of high-density laminated printed circuit board of high-frequency material |
| CN104244614A (en) * | 2013-06-21 | 2014-12-24 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
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| Publication number | Publication date |
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| CN104582323B (en) | 2017-09-29 |
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