200819035 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種軟板製造方法及其軟板結構，尤指防腿的軟 板製造方法及其軟板結構。 【先前技術】 良好的接崎電磁場有賊的輕作用，而能槪設備機殼上累 積的大量储，從祕免纽靜電放電效應。換句話說，合理地 應用接地技術’就能大大提高系統的抗干擾能力，減少腿。一般 來既，在電子設射地線結構大致有^統地、機殼地（遮罩地）、 數位地（邏輯地）和類比地等。 對於大量賊耻各_子設财的紐電路板，线也必須考 =到防腿的設計。為了滿錄板對防ΕΜΙ的需求，已有薇商提 出中華民國專利公告號第3麵號「軟性電路板之謝防制方 ^」’其主要是在軟板中印刷導電膠(銀膠）而達到接地的目的。 ^讓軟板可以電性連接至其他電子元件(例如》封農的晶 ’這些接點均是設計在軟板的表面上，而非軟板的内部。狭而， rf板賴設物保護軟板内部的電路，而無法保護到曝 I在防謝的設計之相接點，故不論是上述的防ΕΜί手段或其 既有做法，均沒有將接點的部分納入防ΕΜί的設計之中，形成 200819035 = emi的死角。此外，為連接電子元件時在上述接點所填入的錫 貧或錫球’也和接點同樣曝露在防腿的設計之外，使得採用此 類軟板的電子裝置仍無法完全地防EMI。 此外，-般軟板_銅層太厚而不容易製作蚊夠細的線路，因 此，要使用多層板來滿足複雜線路的需求，但卻因為每層軟板中 大置使用了枯合膠’使得軟板不再錄，反而變得有點硬，失去 ^軟板縣㈣軟概。本發明的特色為使用無㈣銅，且線路 又十於第—層及第二層’仍保有薄銅的細線路能力及不被導通孔 的鑛銅製程所影響而增厚，因此也可減少多層板的使用層數。 【發明内容】 本發明之主要目的在提供—種本發明防腿的軟板製造方法及其 板、。構其藉著糊無膠_板的㈣、基板轉露出位在軟 反内部的線路’並定義這個線路為用來接受焊接的接點，使得接 Z再曝露在她料，而變得是絲油部，使縣板本身防 1的設計更能涵蓋到此接點、錫球。 目的，本發明防簡的軟板製造方法及其軟板結構，四 層的無膠銅騎壓合成的結構，線路集中在第二層及第三層，上 的第—層及細層為接地層。使用無膠的銅取具有兩種形 ^其—為在聚通_表面上賴—層薄金屬及鑛薄鋼， ......使用銅难並於表面塗佈—層聚亞醯胺)取代傳統的有膠钢 200819035 羯（將銅箱與聚亞酿胺以膠層枯合），線路集中在第二層及第三 層’第-層及第四層則設計為接地層並可分顺其它各層連接（以 雷射或沖孔或化學侧做出導通孔，可為盲孔或通孔），元件開D 品或則以化子方式分別賴崎及聚倾胺而露出第二層及第三 層輯蝴於树開口區域），讀路顯仍制地能著崎 —藉此帛來接文填入錫貧或錫球的線路，就能變成在軟 板内部’這使得軟板防EMI的設計更能涵蓋到所有的元件接點。 關於本發明之優點與精神可以藉由以下的發_述及所附圖式得 到進一步的瞭解。 ， 【實施方式】 ” 2第1A〜1H圖，第1A〜1H圖為本發明防咖的軟板製造方法 。圖如第1A〜:^圖所不之製程大致上仍和習知軟板製造方 法相仿’但如第1F〜1H圖所示之製程則屬本發明防腿的軟板製 造方法的主魏程，因此底下先朗如第丨㈣_示之製程， 再說明第1A〜1E圖所示之製程。 二而:本發明防聰的軟板製造方法及其軟板結構，其主要 二—第1F圖所不钱刻無膠銅箱板1〇的銅箱1此、基板他而曝 出位在軟板内视線路i 6，並定義這個線路16為用來接受填入 如1H圖所示之錫球28的接點，使得此接點不再曝露在軟板外部， 而變得是在軟板内部，使得軟板本身防咖的設計更能涵蓋到此 7 200819035 ♦ 接點、錫球28。錄無膠峨反10的形成方法，可大致分為兩種 形成方式4 ^在聚亞酿胺的基板1〇a的表面上澈鍵一層薄金 屬及鍍薄銅，其二為使用銅箱·、1〇c並於表面塗佈一層聚亞酿 胺的10a。 =第1F圖所不，本發明防EMI的軟板製造方法及其軟板結構，在 第-無膠銅箱板10(當然也可以是第二無膠銅箱板⑵的線路Μ 上，具有曝露出線路16(尤其是屬於接點者）的元件開口區域& 且線路16仍翻地被枯著物質10 ©定住。 ， 元件開，域_靴學方式分獅祕⑽及聚碰胺的基 而路出第—層及第二層的線路(屬於元件開口區域⑷，且 =16周圍仍穩固地被枯著物質固定住。具體來說，元件開口區 :的形成’則主要藉著钱刻第一無膠銅箱板叫當然也可以是 二=板12輸圖案化的銅㈣、以及侧 銅、泊板10基板l〇a。在蝕刻其 L能力的MW 土板10守，必須使用具有選擇性蝕刻 開口=’广而蝴時選擇地侧基板1Ga，而不會_元件 綱幹人=的線路16、枯著物f 1G。此藥劑可為熟知的Π 蝕刻樂液，含有已醇胺及Κ0Η。 〇财說’在實際進行餘刻前，先對準第— 也 可以是第二無膠銅羯板 白板10( “也 路16，妒射_ 周線路16 ’尤其是被定義成接點的線 箔l〇b、以及射,丨笛么 …、爲白板W中未被圖案化的銅 及侧第-無膠銅箱板1〇的基板恤，直到曝露出屬 8 200819035 於接點的線路16，而形成祕開Π區域24。 件開口區域24後，仍需要如第_ ，。或/和第二無膠銅_中未被圖 鋼 ::未如第1B圖所示進行圖案化出線路16 ， 圖所示於·區域”填入錫㈣至屬‘ 的線路16上，而可透過錫膏找電性連接至電子 接點 小見件_形成在弟—無谬銅· 10的表面上。 接點的線路16確實相， 用的銅： 屬於在軟板的内部，使得具有接地作 ，.° 對此接點具有更好的防ΕΜΙ效果。同時，锡 變成填入相對低於銅㈣b的接點之上，也會比習二 ^防®效㈣此本發刪Μί喊㈣造槪 ST账更随到此触、物娜釘，it =間早描述-下如何形成如第1Ε圖所示之習知軟板結構。 =圖所示，首先提供雙面上均具有銅落一、饳、12c 膠鋪板10、第二無膠銅雜12，以及雙面上均具有枯 貝4b、14c且含有基板14a的雙面枯著板14。 ^於第-無軸触1G、第二無_紐12 __質枯著並 =:請，。，、12。’而是利用表面處理後電鑛形 成銅錢、版、12卜1&，衫-鱗銅咖0、第二赌銅 9 200819035 箔板12上的銅箔10b、10c、12b、12c，可以輕易地控制成較薄。 基於厚度較薄的銅箔l〇b、10c、12b、12c，要製作出細線路會是 很容易的，也比較不需製作多層軟板。由於第一無膠銅箔板10、 第二無膠銅箔板12本身，根本沒有容易讓整體變硬的粘合膠，故 此種軟板也不會有變硬的問題。 在提供了上述第一無膠銅箔板10、第二無膠銅箔板12、雙面粘著 板14之後，如第1B圖所示僅在第一無膠銅箔板10、第二無膠銅 箔板12其中之一的銅箔上進行圖案化，亦即僅在銅箔10c、12c 進行圖案化，而形成線路16。 製作出線路16之後，則如第1C圖所示將具有線路16的第一無膠 銅箔板10、第二無膠銅箔板12分別面對雙面粘著板14的兩面， 並使第一無膠銅箔板10、第二無膠銅箔板12被粘合在一起，而使 得線路16的如細缝17中充滿粘著物質14b。 接著，如第ID圖所示貫通第一無膠銅箔板10、雙面粘著板14、 第二無膠銅箔板12而形成第一貫通孔20a、第二貫通孔20b，然 後如第1E圖所示在第一貫通孔20a、第二貫通孔20b的壁面上形 成金屬22a、22b，以電性連接在第一無膠銅箔板10、第二無膠銅 箔板12中未被圖案化的銅箔10b、12b(亦即未如第1B圖所示進行 圖案化出線路16)。 藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本發明 之特徵與精神，而並非以上述所揭露的較佳具體實施例來對本發 200819035 明之範嘴加以限制。相反地，其目的是希望能喊各種改變及具 相等性的安排於本發明所欲申請之專利範圍的範脅内。 /、 【圖式簡單說明】200819035 IX. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing a flexible board and a soft board structure thereof, and more particularly to a method for manufacturing a leg-resistant soft board and a soft board structure thereof. [Prior Art] A good Kisaki electromagnetic field has the light effect of a thief, and can accumulate a large amount of storage on the equipment casing, and the electrostatic discharge effect from the secret. In other words, the proper application of grounding technology can greatly improve the system's anti-interference ability and reduce the legs. In general, the electronic grounding structure is roughly structured, the casing (masked), the digitally (logically), and the analogous. For a large number of thieves, each line of the new circuit board, the line must also test = to the anti-leg design. In order to meet the demand for flood control of the full-recording board, Weishang has proposed the No. 3 No. 3 of the Republic of China Patent Bulletin No. "Software Board Thanks for Preventing the System ^", which mainly prints conductive adhesive (silver glue) in the soft board. And reach the purpose of grounding. ^Let the flexible board be electrically connected to other electronic components (such as the crystal of the seal). These contacts are designed on the surface of the soft board, not the inside of the soft board. Narrow, rf board protection soft The circuit inside the board can not protect the contact point of the design of the anti-examination, so neither the above-mentioned anti-smashing means nor its existing practice has incorporated the part of the contact into the design of the anti-smashing. Forming a dead angle of 200819035 = emi. In addition, the tin-poor or solder balls filled in at the above-mentioned contacts for connecting electronic components are also exposed to the design of the anti-legs, so that the electronic boards using such soft boards The device still can't completely prevent EMI. In addition, the soft board _ copper layer is too thick and it is not easy to make mosquitoes with fine lines. Therefore, multi-layer boards are needed to meet the needs of complex lines, but because each layer is in the soft board. The use of dead glue in the large position makes the soft board no longer recorded, but becomes a bit hard, and loses the soft board county (four) soft. The invention features the use of no (four) copper, and the line is tenth in the first layer and the first The second layer 'still retains the fine line capability of thin copper and is not guided The purpose of the invention is to reduce the number of layers used in the multi-layer board. The main object of the present invention is to provide a method for manufacturing a soft board for preventing leg according to the present invention, and a board and a structure thereof. It uses the glueless _ plate (four), the substrate to reveal the line in the soft anti-internal' and defines this line as the joint for receiving the welding, so that the Z is exposed to her material and becomes silk oil. For the design of the county board itself, the design of the anti-simplification soft board manufacturing method and the soft board structure thereof, the four-layer non-adhesive copper riding composite structure, The line is concentrated in the second layer and the third layer, and the first layer and the fine layer on the upper layer are the ground layer. The use of the glue-free copper takes two forms, which is a layer of thin metal and ore on the surface of the polymerization. Thin steel, ... using copper and coating on the surface - layer of polyamidamine) to replace the traditional rubber steel 200819035 羯 (copper box and poly-branched amine with glue layer), line concentration In the second and third layers, the 'th-layer and the fourth layer are designed as grounding layers and can be connected to other layers ( Shooting or punching or chemical side to make a through hole, which can be a blind hole or a through hole), the component is opened D or the chemical method is respectively Laisaki and polyamine to expose the second layer and the third layer. The opening area of the tree), the reading path can still be used to make the singularity - so that the line can be filled into the tin-poor or solder ball line, and it can become inside the soft board. This makes the soft board anti-EMI design more cover. To all component contacts. The advantages and spirit of the present invention can be further understood from the following description and the accompanying drawings. [Embodiment] ” 2 1A to 1H, and 1A to 1H are the method for manufacturing a soft board for preventing coffee in the present invention. The process of the first embodiment of the present invention is substantially the same as that of the conventional soft board manufacturing. The method is similar, but the process shown in Figures 1F to 1H belongs to the main process of the method for manufacturing the leg-proof soft board of the present invention. Therefore, the process is as follows: (4) _ shows the process, and then the description of the 1A to 1E The process shown is as follows: Secondly, the invention discloses a method for manufacturing a soft board and a soft board structure thereof, and the main one is the first copper box of the first copper plate without a plastic copper box. The exposed position is in the soft board internal line i 6, and the line 16 is defined as a contact for accepting the solder ball 28 as shown in FIG. 1H, so that the contact is no longer exposed outside the soft board. It is inside the soft board, so that the design of the soft board itself can be covered by this 7 200819035 ♦ contact, solder ball 28. The formation method of the non-adhesive anti-10 can be roughly divided into two formation methods 4 ^ On the surface of the substrate 1〇a of the poly-branched amine, a thin metal and a thin copper are bonded, and the second is a copper box, 1〇c, and a layer coated on the surface. 10a of the arsenic amine = 1F, the method for manufacturing the EMI-resistant flexible board of the present invention and the soft board structure thereof, in the first-non-adhesive copper box board 10 (of course, the second glueless copper box board (2) On the line Μ, there is a component opening area & that exposes the line 16 (especially belonging to the contact), and the line 16 is still turned over by the dead substance 10 ©. The component is opened, and the field _ boots are divided into lions. (10) and the base of the occidental amine and the line of the first layer and the second layer (belonging to the element opening area (4), and the periphery of =16 is still firmly fixed by the dead substance. Specifically, the opening area of the element: 'The main non-adhesive copper box plate by money, of course, can also be two = plate 12 transmission patterned copper (four), and side copper, parking board 10 substrate l〇a. In the MW soil etching its L capacity For the board 10, it is necessary to use the line 16 having the selective etching opening = 'widely selected from the side substrate 1Ga, and not the element 16 of the element = the dry matter f 1G. This agent can be a well-known Π etch Le liquid, which contains alkanolamine and Κ0Η. 〇财 says 'Before actually carrying out the moment, first align the first one - it can be the second no glue Copper enamel whiteboard 10 ("Yi Road 16, 妒射_周线16' is especially defined as the line foil l〇b of the joint, and the shot, the whistle... is the unpatterned copper in the whiteboard W And the side of the first - glueless copper box board 1 〇 substrate shirt, until exposed to the line 8 200819035 on the contact line, and form the secret opening area 24. After the opening area 24, still need to be the first _, or / and the second glueless copper _ is not in the steel:: not as shown in Figure 1B to pattern the outgoing line 16, the area shown in the "region" is filled with tin (four) to the line 16 of the genus, but Through the solder paste to find the electrical connection to the electronic contact small piece _ formed on the surface of the brother - no copper. The line 16 of the contact is indeed phase, the copper used: belongs to the inside of the soft board, so that it has a grounding effect, and the contact has a better anti-mite effect. At the same time, the tin becomes filled above the contact point of copper (four) b, and it will be more effective than the second one. (4) This is issued, and the 槪 Μ 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 账 账 账Early description - how to form a conventional soft board structure as shown in Fig. 1. = As shown in the figure, firstly, there are provided a double-sided copper, a ruthenium, a 12c rubber plate 10, a second rubber-free copper 12, and a double-sided double-sided scallop 4b, 14c and a substrate 14a. Board 14. ^ In the first - no axis touch 1G, the second no_New 12 __ quality is dry and =: please,. ,, 12. 'It is easy to use the surface treatment of the electric ore to form copper coins, plates, 12 Bu 1&, shirt-scale copper coffee 0, second bet copper 9 200819035 copper foil 10b, 10c, 12b, 12c on the foil board 12, can be easily Controlled to be thinner. Based on the thin copper foils lb, 10c, 12b, and 12c, it is easy to make a thin line, and it is not necessary to make a multilayer soft board. Since the first non-adhesive copper foil sheet 10 and the second non-adhesive copper foil sheet 12 themselves have no adhesive which is easy to make the whole hardened, there is no problem that the soft board does not become hard. After the first glueless copper foil board 10, the second glueless copper foil board 12, and the double-sided adhesive board 14 are provided, as shown in FIG. 1B, only the first glueless copper foil board 10, the second absence The copper foil of one of the copper foil sheets 12 is patterned on the copper foil, that is, only the copper foils 10c, 12c are patterned to form the wiring 16. After the line 16 is formed, the first glueless copper foil sheet 10 having the line 16 and the second glueless copper foil sheet 12 are respectively faced on both sides of the double-sided adhesive sheet 14 as shown in FIG. 1C. A glueless copper foil sheet 10 and a second glueless copper foil sheet 12 are bonded together such that the slits 17 of the line 16 are filled with the adhesive substance 14b. Next, the first through-hole copper foil board 10, the double-sided adhesive board 14, and the second glueless copper foil board 12 are penetrated as shown in the ID drawing to form the first through hole 20a and the second through hole 20b, and then The metal 22a, 22b is formed on the wall surfaces of the first through hole 20a and the second through hole 20b as shown in FIG. 1E, and is electrically connected to the first glueless copper foil plate 10 and the second glueless copper foil plate 12 without being electrically connected. The patterned copper foils 10b, 12b (i.e., the patterned exit lines 16 are not patterned as shown in Fig. 1B). The features and spirit of the present invention are intended to be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to arbitrarily recite various modifications and equivalents within the scope of the patent scope of the invention as claimed. /, [Simple diagram description]
1A〜1H圖為本發明防EMI的軟板製造方 法之示意圖。 【主要元件符號說明】 10第一無膠銅箔板 12第二無膠銅箔板 14雙面粘著板 10a ' 12a、1½ 基板 10b、10c、12b、12c 銅箔 14b、14c魅著物質 16線路 17細缝 20a第一貫通孔 20b第二貫通孔 22a、22b 金屬 24元件開口區域 26絕緣層 28錫球 200819035 30電子元件1A to 1H are schematic views showing a method of manufacturing an anti-EMI soft board according to the present invention. [Main component symbol description] 10 first glueless copper foil plate 12 second glueless copper foil plate 14 double-sided adhesive plate 10a '12a, 11⁄2 substrate 10b, 10c, 12b, 12c copper foil 14b, 14c charm substance 16 Line 17 slit 20a first through hole 20b second through hole 22a, 22b metal 24 element opening area 26 insulating layer 28 solder ball 200819035 30 electronic components