JPH02239695A - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPH02239695A JPH02239695A JP6045489A JP6045489A JPH02239695A JP H02239695 A JPH02239695 A JP H02239695A JP 6045489 A JP6045489 A JP 6045489A JP 6045489 A JP6045489 A JP 6045489A JP H02239695 A JPH02239695 A JP H02239695A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- printed wiring
- multilayer
- wiring board
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 abstract description 19
- 238000000059 patterning Methods 0.000 abstract description 4
- 239000011229 interlayer Substances 0.000 abstract description 3
- 238000005452 bending Methods 0.000 abstract description 2
- 230000007423 decrease Effects 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント配線板，特に多層のプリント配線板に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to printed wiring boards, particularly multilayer printed wiring boards.
従来，この種の多層プリント配線板は第４図に示すよう
に、各層のプリント基板１０に配線導体３をパターンニ
ングしたものを接着剤で接着した後、スルーホール９を
形成し，内部にメッキを施し、各層間の電気的接続を行
う構造のものであった。Conventionally, this type of multilayer printed wiring board is made by bonding a patterned wiring conductor 3 to a printed circuit board 10 of each layer with adhesive, forming through holes 9, and plating the inside as shown in FIG. It had a structure in which electrical connections were made between each layer.
また，２は部品パッドである．
〔発明が解決しようとする課題〕
上述した従来の多層プリント配線板は以下に示す欠点が
ある．すなわち，
■ ｎ層の多層基板を作製する際には導体のパターンニ
ングがｎ回必要となり、高価になる。Also, 2 is a component pad. [Problems to be solved by the invention] The conventional multilayer printed wiring board described above has the following drawbacks. That is, (1) When producing a multilayer board with n layers, conductor patterning is required n times, which increases the cost.
■ 隣接する層に電気的接続を取る場合でも、最上層か
ら最下層までの貫通スルーホール９が必要となるので、
導体パターンの配線が制限される領域が生じる。■ Even when making electrical connections to adjacent layers, a through hole 9 is required from the top layer to the bottom layer.
This results in areas where wiring of the conductor pattern is restricted.
等の欠点がある。There are drawbacks such as.
本発明の目的は前記課題を解決した多層プリント配線板
を提供することにある。An object of the present invention is to provide a multilayer printed wiring board that solves the above problems.
前記目的を達成するため、本発明に係る多層プリント配
線板は折り曲げ可能な両面フレキシブル基板を適当な位
置で折り重ね、かつ重なり合った導体露出部同士をはん
だ、あるいは導電性接着剤を用いて接続し，絶縁部同士
を絶縁性接着剤を用いて接着して多層構造としたもので
ある。In order to achieve the above object, the multilayer printed wiring board according to the present invention is made by folding bendable double-sided flexible substrates at appropriate positions and connecting the overlapping exposed conductor parts to each other using solder or conductive adhesive. , the insulating parts are bonded together using an insulating adhesive to create a multilayer structure.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図，第２図は本発明の一実施例を示す側面図、第３
図は第２図のＡ−Ａ’線断面図である。Figures 1 and 2 are side views showing one embodiment of the present invention, and Figure 3 is a side view showing an embodiment of the present invention.
The figure is a sectional view taken along the line AA' in FIG. 2.
図において、折り曲げ可能な両面フレキシブル基板１上
に導体３，部品パッド２，スルーホール４，絶縁皮膜さ
れない層間接続用露出導体５を形成し、この基板１を適
当な位置で折り曲げ、上下に対向する導体５相互間を導
電性接着剤７（又ははんだ）を用いて接続し、また上下
に対向する絶縁皮膜６相互間を絶縁性接着剤８を塗布し
て張り合せて多層構造化する。In the figure, a conductor 3, a component pad 2, a through hole 4, and an exposed conductor 5 for interlayer connection without an insulating film are formed on a bendable double-sided flexible substrate 1, and the substrate 1 is bent at an appropriate position to face each other vertically. The conductors 5 are connected to each other using a conductive adhesive 7 (or solder), and the vertically opposing insulating films 6 are coated with an insulating adhesive 8 and pasted together to form a multilayer structure.
上記作業をｎ回繰り返すことにより２（ｎ＋１）層の多
層構造を有する多層プリント配線板となる。By repeating the above operation n times, a multilayer printed wiring board having a multilayer structure of 2(n+1) layers is obtained.
また、本発明の構造ではフレキシブル基板１のスルーホ
ール４が折り曲がって内層のスルーホール４となった場
合、その上下の層においてはスルーホールが現われない
ため、配線領域が従来の貫通スルーホールに比べて広が
る。また、中間層のスルーホール１ｌは表層まで貫通す
ることはなく、ブラインドビアホールと同じ構造となる
。Furthermore, in the structure of the present invention, when the through hole 4 of the flexible substrate 1 is bent to become the through hole 4 in the inner layer, the through hole does not appear in the layers above and below it, so that the wiring area is changed from the conventional through hole. Compare and spread. Further, the through hole 1l in the intermediate layer does not penetrate to the surface layer, and has the same structure as a blind via hole.
以上説明したように本発明は一枚のフレキシブル基板を
折り曲げ、接着することにより、■ 一枚の両面基板の
パターンニングのみで，多層基板を製作でき、従来の製
造方法に比べてパターンニング回数が少なくなり価格が
安くなる。As explained above, by bending and gluing a single flexible substrate, the present invention can produce a multilayer substrate by simply patterning a single double-sided substrate, reducing the number of patterning times compared to conventional manufacturing methods. There will be less and the price will be cheaper.
■ 内層のスルーホールは、最上層から最下層までの貫
通スルーホールではないので，従来のスルーホールで配
線されない層に関しては導体パターンの配線に制限が生
じない。(2) Since the through-holes in the inner layer are not penetrating through-holes from the top layer to the bottom layer, there are no restrictions on the wiring of conductor patterns in layers that are not wired using conventional through-holes.
■ 各層間の接続がスルーホールだけでなく、折り曲げ
部分の配線による接続が可能である。■ Connections between each layer can be made not only through through-holes but also by wiring at bent portions.
等の効果を有する。It has the following effects.
第１図，第２図は本発明の一実施例を示す側面図、第３
図は第２図のＡ−Ａ’線断面図、第４図は従来の多層プ
リント配線板を示す図である。
１・・・フレキシブル基板 ２・・・部品パッド３・
・・導体 ４・・・スルーホール５・・
・層間接続用露出導体
７・・・導電性接着剤
１１・・・内層スルーホール
６・・・絶縁皮膜
８・・・絶縁性接着剤Figures 1 and 2 are side views showing one embodiment of the present invention, and Figure 3 is a side view showing an embodiment of the present invention.
The figure is a sectional view taken along the line AA' in FIG. 2, and FIG. 4 is a diagram showing a conventional multilayer printed wiring board. 1...Flexible board 2...Component pad 3.
...Conductor 4...Through hole 5...
- Exposed conductor for interlayer connection 7... Conductive adhesive 11... Inner layer through hole 6... Insulating film 8... Insulating adhesive
Claims (1)
置で折り重ね、かつ重なり合った導体露出部同士をはん
だ、あるいは導電性接着剤を用いて接続し、絶縁部同士
を絶縁性接着剤を用いて接着して多層構造としたことを
特徴とする多層プリント配線板。(1) Fold the bendable double-sided flexible substrates at appropriate positions, connect the overlapping exposed conductor parts using solder or conductive adhesive, and bond the insulating parts together using insulating adhesive. A multilayer printed wiring board characterized by having a multilayer structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6045489A JPH02239695A (en) | 1989-03-13 | 1989-03-13 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6045489A JPH02239695A (en) | 1989-03-13 | 1989-03-13 | Multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02239695A true JPH02239695A (en) | 1990-09-21 |
Family
ID=13142731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6045489A Pending JPH02239695A (en) | 1989-03-13 | 1989-03-13 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02239695A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5159751A (en) * | 1990-02-05 | 1992-11-03 | Motorola, Inc. | Method of manufacturing electronic module assembly |
| JPH05243741A (en) * | 1992-02-27 | 1993-09-21 | Sharp Corp | Multilayer flexible printed wiring board |
| US5265322A (en) * | 1990-02-05 | 1993-11-30 | Motorola, Inc. | Electronic module assembly and method of forming same |
| JPH0645479A (en) * | 1992-07-21 | 1994-02-18 | Mitsubishi Electric Corp | Semiconductor device |
| US5965848A (en) * | 1997-07-22 | 1999-10-12 | Randice-Lisa Altschul | Disposable portable electronic devices and method of making |
| US7211735B2 (en) | 2000-12-21 | 2007-05-01 | Sony Corporation | Processes for manufacturing multilayer flexible wiring boards |
| US7375421B2 (en) | 2004-06-15 | 2008-05-20 | Matsushita Electric Industrial Co., Ltd. | High density multilayer circuit module |
| US7757394B2 (en) | 2004-08-31 | 2010-07-20 | Sony Corporation | Multilayer wiring board |
-
1989
- 1989-03-13 JP JP6045489A patent/JPH02239695A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5159751A (en) * | 1990-02-05 | 1992-11-03 | Motorola, Inc. | Method of manufacturing electronic module assembly |
| US5265322A (en) * | 1990-02-05 | 1993-11-30 | Motorola, Inc. | Electronic module assembly and method of forming same |
| JPH05243741A (en) * | 1992-02-27 | 1993-09-21 | Sharp Corp | Multilayer flexible printed wiring board |
| JPH0645479A (en) * | 1992-07-21 | 1994-02-18 | Mitsubishi Electric Corp | Semiconductor device |
| US5965848A (en) * | 1997-07-22 | 1999-10-12 | Randice-Lisa Altschul | Disposable portable electronic devices and method of making |
| EP1023752A1 (en) * | 1997-07-22 | 2000-08-02 | Randice Lisa Altschul | Disposable portable electronic devices and method of making |
| EP1023752A4 (en) * | 1997-07-22 | 2001-02-28 | Randice Lisa Altschul | Disposable portable electronic devices and method of making |
| US7211735B2 (en) | 2000-12-21 | 2007-05-01 | Sony Corporation | Processes for manufacturing multilayer flexible wiring boards |
| US7375421B2 (en) | 2004-06-15 | 2008-05-20 | Matsushita Electric Industrial Co., Ltd. | High density multilayer circuit module |
| US7757394B2 (en) | 2004-08-31 | 2010-07-20 | Sony Corporation | Multilayer wiring board |
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