CN104661440A - Manufacturing method of printed circuit board and printed circuit board - Google Patents
Manufacturing method of printed circuit board and printed circuit board Download PDFInfo
- Publication number
- CN104661440A CN104661440A CN201510100184.3A CN201510100184A CN104661440A CN 104661440 A CN104661440 A CN 104661440A CN 201510100184 A CN201510100184 A CN 201510100184A CN 104661440 A CN104661440 A CN 104661440A
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- manufacture method
- conducting resinl
- printed wiring
- conductive particle
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- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a manufacturing method of printed circuit board and the printed circuit board. The manufacturing method comprises steps as follows: conducting resin is printed on a ceramic substrate and comprises resin matrix and first conductive particles mixed in the resin matrix, wherein the first conductive particles are tin powder particles; the conducting resin is subjected to drying and curing processing to form a printed circuit. The conducting resin comprises the tin powder particles which have the characteristics of low melting point and weldability, so that the formed conductive circuit can be firmly printed on the ceramic substrate, and an electronic device can be welded. Meanwhile, the conductive circuit is formed through silk-screen printing and curing processes, so that the printed circuit board has a simple process and low cost.
Description
Technical field
The present invention relates to printed wiring board field, in particular to a kind of manufacture method and printed wiring board of printed wiring board.
Background technology
At present, the manufacture method of conventional printed wiring board mainly comprises subtractive process and addition process two kinds.Wherein, subtractive process (also claiming etching method) assigns to obtain circuitous pattern by removing unwanted copper foil section selectively, and its technical process is roughly: first, form Copper Foil by heat pressing process on insulating substrate, to make copper-clad plate; Then, copper-clad plate applies photoresist, and carry out selectivity exposure under mask effect; Next, unexposed photoresist is washed off to expose the copper of below; Finally, corrosion treatment is carried out to the copper exposed, then remove remaining photoresist, namely obtain required circuitous pattern.And, after circuitous pattern prints out solder mask, electronic device can be welded on copper-foil conducting electricity.
Subtractive process is the maturation process preparing printed wiring board at present, adopting the method conducting wire of preparing to have, line width is even, conductivity good and can weld the advantages such as electronic device, but the method is big for environment pollution, and cost is high, complex process, and a large amount of copper resource can be wasted.And, chemical materials of different nature to be used in the explained hereafter of subtractive process, more need through a large amount of acid solutions to etch away unnecessary copper metal, thus constitute the waste water and waste liquid of different component, cause manufacturing enterprise that manpower and materials need be spent to carry out waste water treatment.In view of subtractive process has the shortcoming being much difficult to overcome, addition process is adopted to prepare the important development direction that printed wiring board becomes printed wiring board field gradually.
So-called addition process on the substrate of insulation, forms conductive pattern by silk-screen, plating or stickup etc. method, thus prepare wiring board.Traditional addition process generally adopts silver slurry or electrically conductive ink as the composition of conductive pattern, but the cost of silver slurry or electrically conductive ink silver slurry is high, makes the cost of addition process also higher.And, to be starched by silver or conductive pattern that electrically conductive ink is formed can not weld upper electronic device again, make the conducting wire adopting addition process to be formed have not solderability.Although electronic device can be welded in the conducting wire adopting electroless copper to be formed, the method can use a large amount of chemical plating fluids environment being had to pollution, and the technique of the method is more complicated.
Summary of the invention
Main purpose of the present invention is the manufacture method and the printed wiring board that provide a kind of printed wiring board, with solve adopt addition process to be formed the technique of printed wiring board is more complicated, cost is higher, and the problem of electronic device can not be welded in the conducting wire formed.
To achieve these goals, according to an aspect of the present invention, provide a kind of manufacture method of printed wiring board, this manufacture method comprises the following steps: on ceramic substrate, print conducting resinl, conducting resinl comprises resin matrix and is blended in the first conductive particle in resin matrix, and the first conductive particle is powder particles; And baking and curing process is carried out to conducting resinl, to form printed wiring.
Further, conducting resinl also comprises the second conductive particle be blended in resin matrix, the material forming the second conductive particle be selected from silver powder, copper powder, nickel powder, graphite one or more.
Further, the percentage by weight of the first conductive particle and the second conductive particle is 1:0.1 ~ 1.
Further, conducting resinl also comprises curing agent, and conducting resinl comprises the resin matrix of 7 ~ 10 parts according to parts by weight, the curing agent of 3 ~ 5 parts, first conductive particle of 50 ~ 90 parts and the second conductive particle.
Further, the step of printing conducting resinl comprises: adopt web plate that conducting resinl is printed 2 ~ 5 times back and forth; Printed panel is left standstill 5 ~ 15min in atmosphere.
Further, in the step of baking and curing process, carry out drying and processing to it, the processing time is 30 ~ 50min.
Further, this manufacture method also comprises the step of printed wiring being carried out to concora crush process.
Further, after the step of concora crush process, this manufacture method is also included in the step of printed wiring printing solder mask.
Further, before the step of printing conducting resinl, manufacture method is also included on ceramic substrate prints Magnetic reagent, and is cured the step of process to Magnetic reagent.
Further, adopt Reflow Soldering to be cured process, the processing time of Reflow Soldering is 2 ~ 8min, and the treatment temperature of Reflow Soldering is 110 ~ 140 DEG C.
Further, before the step of printing Magnetic reagent, this manufacture method also comprises carries out grinding process to ceramic substrate, on ceramic substrate, then beat the step of location hole.
According to a further aspect in the invention, provide a kind of printed wiring board, this printed wiring board is made by manufacture method provided by the invention.
Apply technical scheme of the present invention, the present invention by printing conducting resinl on ceramic substrate, and conducting resinl comprises resin matrix and is blended in the first conductive particle in resin matrix, the first conductive particle is powder particles, and carries out baking and curing process to form printed wiring to conducting resinl.Because adopted conducting resinl comprises powder particles, and powder particles has the characteristic of the low and weldability of fusing point, thus formed conducting wire can be printed on ceramic substrate securely, and can weld electronic device.Meanwhile, the present invention adopts silk screen printing and curing process to form conducting wire, makes the technique of printed wiring board simple, with low cost.
Accompanying drawing explanation
The Figure of description forming a application's part is used to provide a further understanding of the present invention, and schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 shows the schematic flow sheet of the manufacture method of the printed wiring board provided according to embodiment of the present invention.
Embodiment
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.Below with reference to the accompanying drawings and describe the application in detail in conjunction with the embodiments.
It should be noted that used term is only to describe embodiment here, and be not intended to the illustrative embodiments of restricted root according to the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative is also intended to comprise plural form, in addition, it is to be further understood that, " comprise " when using term in this manual and/or " comprising " time, it indicates existing characteristics, step, operation, device, assembly and/or their combination.
For convenience of description, here can usage space relative terms, as " ... on ", " in ... top ", " at ... upper surface ", " above " etc., be used for the spatial relation described as a device shown in the figure or feature and other devices or feature.Should be understood that, space relative terms is intended to comprise the different azimuth in use or operation except the described in the drawings orientation of device.Such as, " in other devices or structure below " or " under other devices or structure " will be positioned as after if the device in accompanying drawing is squeezed, being then described as the device of " above other devices or structure " or " on other devices or structure ".Thus, exemplary term " in ... top " can comprise " in ... top " and " in ... below " two kinds of orientation.This device also can other different modes location (90-degree rotation or be in other orientation), and relatively describe space used here and make respective explanations.
From background technology, the technique of existing addition process formation printed wiring board is more complicated, cost is higher, and the conducting wire formed can not.As shown in Figure 1, this manufacture method comprises the following steps: on ceramic substrate, print conducting resinl, and conducting resinl comprises resin matrix and is blended in the first conductive particle in resin matrix, and the first conductive particle is powder particles; And baking and curing process is carried out to conducting resinl, to form printed wiring.
Above-mentioned manufacture method by printing conducting resinl on ceramic substrate, and conducting resinl comprises resin matrix and is blended in the first conductive particle in resin matrix, first conductive particle is powder particles, and carries out baking and curing process to form printed wiring to conducting resinl.Because adopted conducting resinl comprises powder particles, and powder particles has the characteristic of the low and weldability of fusing point, thus formed conducting wire can be printed on ceramic substrate securely, and can weld electronic device.Meanwhile, the present invention adopts silk screen printing and curing process to form conducting wire, makes the technique of printed wiring board simple, with low cost.
In above-mentioned manufacture method, adopting the conducting resinl containing powder particles to form printed wiring board is emphasis of the present invention.Certainly, conducting resinl, except comprising powder particles, can also comprise other conductive particles.In the preferred embodiment of the present invention, in conducting resinl, conductive particle also comprises the second conductive particle, and the material forming this second conductive particle can be one or more in silver powder, copper powder, nickel powder, graphite.By adding the second conductive particle, making the second conductive particle and the first conductive particle form eutectic, the oxidation at high temperature of single conductive particle can be simplified.And, by both collaborative interpolations, effectively can improve the solderability of printed wiring, the wetting effect of circuit and tin cream can also be improved.
Wherein, the weight ratio of the first conductive particle and the second conductive particle can set according to the actual requirements.Preferably, the percentage by weight of the first conductive particle and the second conductive particle is 1:0.1 ~ 1.Two kinds of conductive particles are limited to above-mentioned scope makes conducting resinl have good heat resistance, the effect of solderability and good conduction.Certainly, the ratio of two kinds of conductive particles is not limited to above-mentioned scope.
Preferably, above-mentioned conducting resinl also comprises curing agent, and conducting resinl comprises the resin matrix of 7 ~ 10 parts according to parts by weight, the curing agent of 3 ~ 5 parts, first conductive particle of 50 ~ 90 parts and the second conductive particle.In above-mentioned conducting resinl, each raw material is not limited to above-mentioned weight range in the present invention, is limited in above-mentioned scope to have make conducting resinl energy rapid curing and have good shear strength and the effect of electric conductivity.
In above-mentioned conducting resinl, resin matrix can be epoxy resin-base, be preferably bisphenol A type epoxy resin, phenol aldehyde modified epoxy resin or polyfunctional epoxy resin one or more.Curing agent select in low molecular polyamides (molecular weight 600 ~ 1100), dicyandiamide, methylnadic anhydride, diamino-diphenyl sulfone (DDS) one or more.Preferably, also comprise in diluent, crosslinking agent, coupling agent, flexibilizer in above-mentioned conducting resinl one or more, and diluent, crosslinking agent, coupling agent and/or flexibilizer have reduction system viscosity, conductive particle and colloid are fully mixed and strengthens the beneficial effects such as system toughness simultaneously.
The illustrative embodiments of manufacture method will described in more detail according to printed wiring board provided by the invention below.But these illustrative embodiments can be implemented by multiple different form, and should not be interpreted as being only limited to execution mode set forth herein.Should be understood that, provide these execution modes be in order to make the application open thorough and complete, and the design of these illustrative embodiments is fully conveyed to those of ordinary skill in the art.
First, ceramic substrate prints conducting resinl, conducting resinl comprises resin matrix and is blended in the first conductive particle in resin matrix, and the first conductive particle is powder particles.In a preferred embodiment, the step of printing conducting resinl comprises employing web plate and conducting resinl is printed 2 ~ 5 times back and forth; Printed panel is left standstill 5 ~ 15min in atmosphere.Certainly, the technique of printing conducting resinl is not limited in above-mentioned preference.
In this step, before the step of printing conducting resinl, Magnetic reagent can also be printed on ceramic substrate, and process is cured to Magnetic reagent.The method of solidification process can be Reflow Soldering, and the technological parameter of Reflow Soldering can set according to actual process demand.Preferably, when adopting Reflow Soldering to be cured process, the processing time of Reflow Soldering is 2 ~ 8min, and the treatment temperature of Reflow Soldering is 110 ~ 140 DEG C.
Before the step of above-mentioned printing Magnetic reagent, grinding process can also be carried out to ceramic substrate, on ceramic substrate, then beat the step of location hole.Particularly, the step of grinding process comprises: kept flat by ceramic substrate on the table, carries out uniform grinding with mechanical grinding machine, makes ceramic substrate smooth and highly consistent.
After completing the step of printing conducting resinl on ceramic substrate, baking and curing process is carried out to conducting resinl, to form printed wiring.The technological parameter of baking and curing process can set according to actual process demand, and in a preferred embodiment, treatment temperature is 120 ~ 180 DEG C, and the processing time is 30 ~ 50min.
After the above-mentioned printed wiring of formation, manufacture method provided by the invention also comprises carries out concora crush process to printed wiring, and printed wiring prints solder mask, and the follow-up examination and test of products and packaging and other steps.Above-mentioned steps is the prior art in this area, does not repeat them here.
Meanwhile, present invention also offers a kind of printed wiring board, this printed wiring board is made by manufacture method provided by the invention.Due in the manufacturing process of this printed wiring board adopt conducting resinl to comprise powder particles, and powder particles has the characteristic of the low and weldability of fusing point, thus formed conducting wire can be printed on ceramic substrate securely, and electronic device can be welded.
The manufacture method of printed wiring board provided by the invention is further illustrated below in conjunction with embodiment.
Embodiment 1
Present embodiments provide a kind of manufacture method of printed wiring board, comprise the following steps:
First, adopt web plate on ceramic substrate, print conducting resinl and print 2 times back and forth, and printed panel is left standstill 15min in atmosphere, wherein, the powder particles that conducting resinl comprises phenol aldehyde modified epoxy resin and is blended in phenol aldehyde modified epoxy resin;
Then, carry out baking and curing process to form printed wiring to conducting resinl, wherein, treatment temperature is 180 DEG C, and the processing time is 30min.
Embodiment 2
Present embodiments provide a kind of manufacture method of printed wiring board, comprise the following steps:
First, grinding process is carried out to ceramic substrate, then on ceramic substrate, makes location hole;
Then, ceramic substrate prints Magnetic reagent, and adopt Reflow Soldering to be cured process to Magnetic reagent, wherein, the processing time of Reflow Soldering is 2min, and the treatment temperature of Reflow Soldering is 140 DEG C;
Next, adopt web plate on ceramic substrate, print conducting resinl and print 5 times back and forth, and printed panel is left standstill 5min in atmosphere, wherein, conducting resinl comprises the bisphenol A type epoxy resin of 7 parts, the powder particles of 90 parts and silver powder particles (wherein the mass ratio of powder particles and silver powder particles is 1:0.1), and 3 parts of curing agent (its material is diamino-diphenyl sulfone).
Next, carry out baking and curing process to form printed wiring to conducting resinl, wherein, treatment temperature is 120 DEG C, and the processing time is 50min.
Embodiment 3
Present embodiments provide a kind of manufacture method of printed wiring board, comprise the following steps:
First, grinding process is carried out to ceramic substrate, then on ceramic substrate, makes location hole;
Then, ceramic substrate prints Magnetic reagent, and adopt Reflow Soldering to be cured process to Magnetic reagent, wherein, the processing time of Reflow Soldering is 5min, and the treatment temperature of Reflow Soldering is 120 DEG C;
Next, adopt web plate on ceramic substrate, print conducting resinl and print 4 times back and forth, and printed panel is left standstill 10min in atmosphere, wherein, conducting resinl comprises the bisphenol A type epoxy resin of 10 parts, the powder particles of 85 parts and silver powder particles (wherein the mass ratio of powder particles and silver powder particles is 1:1), and 5 parts of curing agent (its material is diamino-diphenyl sulfone).
Next, carry out baking and curing process to form printed wiring to conducting resinl, wherein, treatment temperature is 150 DEG C, and the processing time is 40min.
Comparative example 1
First, grinding process is carried out to ceramic substrate, then on ceramic substrate, makes location hole;
Then, ceramic substrate prints Magnetic reagent, and adopt Reflow Soldering to be cured process to Magnetic reagent, wherein, the processing time of Reflow Soldering is 5min, and the treatment temperature of Reflow Soldering is 150 DEG C;
Next, adopt web plate on ceramic substrate, print silver slurry and print 7 times back and forth, and printed panel is left standstill 20min in atmosphere;
Next, carry out baking and curing process to form printed wiring to silver slurry, wherein, treatment temperature is 190 DEG C, and the processing time is 60min.
Test:
The conductivity of the printed wiring of the printed wiring board that testing example 1 to 3 and comparative example 1 obtain and peelable intensity, test result is in table 1.As can be seen from Table 1, the conductivity of the printed wiring of printed wiring board that embodiment 1 to 3 obtains is 1 × 10
-3~ 1.5 × 10
-3s/m, the conductivity of the printed wiring of the printed wiring board obtained much larger than comparative example 1 (is 5 × 10
-4s/m).The peelable intensity of the printed wiring of the printed wiring board that embodiment 1 to 3 obtains is 1.5 ~ 1.8N/mm, the peelable intensity (for 0.9N/mm) of the printed wiring of the printed wiring board obtained much larger than comparative example 1.
| Conductivity S/m | Peelable intensity N/mm | |
| Embodiment 1 | 1×10 -3 | 1.5 |
| Embodiment 2 | 1.2×10 -3 | 1.6 |
| Embodiment 3 | 1.5×10 -3 | 1.8 |
| Comparative example 1 | 5×10 -4 | 0.9 |
Meanwhile, after the printed wiring of the printed wiring board that the present invention also obtains in embodiment 1 to 3 and comparative example 1 prints solder mask, can the printed wiring of the printed wiring board that testing example 1 to 3 and comparative example 1 obtain weld electronic device.Result shows, the printed wiring of the printed wiring board that embodiment 1 to 3 obtains can weld electronic device, and the printed wiring of the printed wiring board that comparative example obtains can not weld electronic device.
As can be seen from the above embodiments, the example that the present invention is above-mentioned achieves following technique effect:
(1) the present invention by printing conducting resinl on ceramic substrate, and conducting resinl comprises resin matrix and is blended in the first conductive particle in resin matrix, first conductive particle is powder particles, and carries out baking and curing process to form printed wiring to conducting resinl.Because adopted conducting resinl comprises powder particles, and powder particles has the characteristic of the low and weldability of fusing point, thus formed conducting wire can be printed on ceramic substrate securely, and can weld electronic device.
(2) the present invention adopts silk screen printing and curing process to form conducting wire, makes the technique of printed wiring board simple, with low cost.
(3) without poisonous and harmful substance in the production process of printed wiring board provided by the invention, save ample resources, greatly reduce the pollution to environment compared with subtractive process.
These are only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (12)
1. a manufacture method for printed wiring board, is characterized in that, described manufacture method comprises the following steps:
Ceramic substrate prints conducting resinl, and described conducting resinl comprises resin matrix and is blended in the first conductive particle in described resin matrix, and described first conductive particle is powder particles; And
Baking and curing process is carried out to described conducting resinl, to form printed wiring.
2. manufacture method according to claim 1, it is characterized in that, described conducting resinl also comprises the second conductive particle be blended in described resin matrix, the material forming described second conductive particle be selected from silver powder, copper powder, nickel powder, graphite one or more.
3. manufacture method according to claim 2, is characterized in that, the percentage by weight of described first conductive particle and described second conductive particle is 1:0.1 ~ 1.
4. manufacture method according to claim 2, it is characterized in that, described conducting resinl also comprises curing agent, and described conducting resinl comprises the described resin matrix of 7 ~ 10 parts according to parts by weight, the described curing agent of 3 ~ 5 parts, described first conductive particle of 50 ~ 90 parts and described second conductive particle.
5. manufacture method according to any one of claim 1 to 4, is characterized in that, the step of printing described conducting resinl comprises:
Adopt web plate that described conducting resinl is printed 2 ~ 5 times back and forth;
Printed panel is left standstill 5 ~ 15min in atmosphere.
6. manufacture method according to claim 5, is characterized in that, in the step of described baking and curing process, treatment temperature is 120 ~ 180 DEG C, and the processing time is 30 ~ 50min.
7. manufacture method according to any one of claim 1 to 4, is characterized in that, described manufacture method also comprises the step of described printed wiring being carried out to concora crush process.
8. manufacture method according to claim 7, is characterized in that, after the step of described concora crush process, described manufacture method is also included in the step of described printed wiring printing solder mask.
9. manufacture method according to any one of claim 1 to 4, is characterized in that, before the step of the described conducting resinl of printing, described manufacture method is also included on described ceramic substrate prints Magnetic reagent, and is cured the step of process to described Magnetic reagent.
10. manufacture method according to claim 9, is characterized in that, adopt Reflow Soldering to carry out described solidification process, the processing time of described Reflow Soldering is 2 ~ 8min, and the treatment temperature of described Reflow Soldering is 110 ~ 140 DEG C.
11. manufacture methods according to claim 9, is characterized in that, before the step of the described Magnetic reagent of printing, described manufacture method also comprises carries out grinding process to described ceramic substrate, on described ceramic substrate, then beat the step of location hole.
12. 1 kinds of printed wiring boards, is characterized in that, the manufacture method of described printed wiring board according to any one of claim 1 to 11 is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510100184.3A CN104661440A (en) | 2015-03-06 | 2015-03-06 | Manufacturing method of printed circuit board and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510100184.3A CN104661440A (en) | 2015-03-06 | 2015-03-06 | Manufacturing method of printed circuit board and printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN104661440A true CN104661440A (en) | 2015-05-27 |
Family
ID=53251996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510100184.3A Pending CN104661440A (en) | 2015-03-06 | 2015-03-06 | Manufacturing method of printed circuit board and printed circuit board |
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| CN108546160A (en) * | 2018-06-15 | 2018-09-18 | 北京梦之墨科技有限公司 | A kind of ceramic base circuit and preparation method thereof |
| CN110391097A (en) * | 2018-04-20 | 2019-10-29 | 致伸科技股份有限公司 | Key board unit and its manufacturing method |
| CN112770546A (en) * | 2020-12-30 | 2021-05-07 | 深圳市合成快捷电子科技有限公司 | Manufacturing method of high-precision rigid-flexible circuit board |
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Application publication date: 20150527 |