CN101309554A - Predetermined pattern manufacturing method - Google Patents
Predetermined pattern manufacturing method Download PDFInfo
- Publication number
- CN101309554A CN101309554A CNA2007101075151A CN200710107515A CN101309554A CN 101309554 A CN101309554 A CN 101309554A CN A2007101075151 A CNA2007101075151 A CN A2007101075151A CN 200710107515 A CN200710107515 A CN 200710107515A CN 101309554 A CN101309554 A CN 101309554A
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- predetermined pattern
- manufacture method
- circuit board
- printed circuit
- pcb
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- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a fabrication method for a predetermined pattern, which is mainly used for fabricating the predetermined pattern on a printed circuit board. The method of the invention comprises that according to the design of the predetermined pattern, the predetermined pattern is etched in the insulating base plate of the provided printed circuit board by utilizing the non-chemical etched laser beam. If the predetermined pattern is a line, the metallization treatment further performed to the etched predetermined pattern, and the required line can be formed. By using the accurately controlled laser etching, not only the chemical pollution does not caused, simultaneously, the required pattern can be accurately etched, but also the uneven and inaccurate thickness phenomenon does not occur.
Description
Technical field
The invention relates to a kind of manufacture method of predetermined pattern, refer to the predetermined pattern of on printed circuit board (PCB), making especially.
Background technology
Printed circuit board (PCB) is according to circuit design, and the electric wiring of connecting circuit part is depicted as wiring figure, and then in modes such as the machining of designing institute appointment, surface treatments, makes electric conductor reappear the circuit board that is constituted on insulator.In the prior art, after sticking in copper foil layer on the insulated substrate earlier on the printed circuit board (PCB), utilize as development etching supervisor again, and form predetermined pattern (for example circuit, registration holes, mark etc.).
Yet; along with strictness day by day to environmental protection requirement; the technology that forms predetermined pattern in the prior art and adopt can be brought the chemical etching of high pollution, the sewage that means such as the sewage disposal of must arranging in pairs or groups are handled in manufacture process to be produced, thus caused extra cost burden.
In addition, adopt chemical etch technique, pH-value, temperature and the etching period of also necessary strict control etching solution could be produced required scheduled circuit accurately.Yet, nowadays more and more higher for the requirement on fine rule road, be difficult to the accurately chemical etching of control if continue to adopt, will be difficult to satisfy the demand on fine rule road.Simultaneously, because be difficult to accurately control chemical etching, make when the etching scheduled circuit, be easy to cause a little deviation (for example aspect in uneven thickness etc.), and when getting more and more along with the number of plies, whole deviation so easily causes the registration holes that forms not have the effect of accurate contraposition with increasing.
Summary of the invention
Main purpose of the present invention is to provide a kind of manufacture method of predetermined pattern, it utilizes laser-induced thermal etching to go out scheduled circuit, thus can solve environmental pollution that chemical etch technique that prior art adopts brings, form predetermined pattern inadequately accurately, problem such as even inadequately.
Based on above-mentioned purpose, the manufacture method of predetermined pattern of the present invention is to produce predetermined pattern on printed circuit board (PCB).This manufacture method comprises: on the insulated substrate of the printed circuit board (PCB) that is provided, according to the design of predetermined pattern, by etched laser beam non-chemically, etch predetermined pattern in insulated substrate.
If when predetermined pattern belongs to circuit, then further the predetermined pattern that is etched is being made metalized, and is forming required circuit.
Be specifically as follows: in this circuit groove, fill up a conducting resinl; And
Utilize this conducting resinl of ultraviolet light polymerization, and constitute a circuit of this printed circuit board (PCB).
Or, utilize sedimentation chemistry copper, direct copper facing or vacuum splashing and plating, and in this circuit groove, form a circuit.
But described predetermined pattern is a circuit groove and/or the mark on this printed circuit board (PCB) and/or the registration holes of filled conductive material.
Beneficial effect of the present invention be to utilize can accurate control laser-induced thermal etching, the problem that does not only have chemical contamination, only need decision intensity of laser beam, etching speed just can accurately etch the circuit groove simultaneously, thereby reach the requirement on fine rule road, can accurately etch required pattern, and not have problems such as uneven thickness, inaccuracy.
Description of drawings
Figure 1A～1C is the schematic diagram of the manufacture method of predetermined pattern of the present invention.
Wherein, description of reference numerals is as follows:
10 insulated substrates
12 circuit grooves
14 circuits
16 ultraviolet lights
Embodiment
See also Figure 1A～1C, Figure 1A～1C is the schematic diagram of the manufacture method of predetermined pattern of the present invention.Shown in Fig. 1 C, the manufacture method of predetermined pattern of the present invention mainly is to form predetermined pattern on the insulated substrate 10 of printed circuit board (PCB).This predetermined pattern also can be mark (for example title of the sequence number of product, manufacturer or the like) and registration holes except can be the circuit 14 shown in Fig. 1 C.
In simple terms, in the manufacture method of predetermined pattern of the present invention, at first need to provide the insulated substrate 10 of printed circuit board (PCB), and design according to predetermined pattern, by etched laser beam non-chemically, in insulated substrate, etch predetermined pattern (for example title of the sequence number of circuit, product, manufacturer or the like).To be that example elaborates below with the circuit of making shown in Fig. 1 C 14.
Shown in Figure 1A, in order to make circuit 14, can formerly described insulated substrate 10 on, utilize non-chemically etched laser beam, but etch the circuit groove 12 of filling electric conducting material, utilize method for metallising can produce circuit 14 then.Method for metallising roughly is divided into two big classes, and the one, utilize the coating conducting resinl, another is to utilize sedimentation chemistry copper, directly copper facing, vacuum splashing and plating method.
If adopt the coating conducting resinl, then can shown in Figure 1B, in circuit groove 12, fill up conducting resinl, and shown in Fig. 1 C, utilize ultraviolet light 16 curing conductive glue, and the circuit 14 of formation printed circuit board (PCB).
If adopt sedimentation chemistry copper, directly copper facing, vacuum splashing and plating method, then can similarly produce circuit 14 according to related art.
After completing, can continue to finish the making of assembly such as circuit on other aspect according to identical or similar method, thereby produce multi-layer sheet.
In sum, in the manufacture method of predetermined pattern of the present invention, owing to there is not to use method for chemially etching circuit etching groove 12 fully with high pollution, therefore adopt the inventive method just to need not to use means such as sewage disposal, also be unlikely to bring extra cost burden.
When adopting laser etching technology, only need decision intensity of laser beam, etching speed just can accurately etch circuit groove 12 easily, thereby reach the requirement on fine rule road.Simultaneously, also, make when the etching scheduled circuit, be difficult for causing deviation (for example aspect is in uneven thickness), and also be unlikely to make that along with the number of plies is more and more whole deviation is increasing because the laser-induced thermal etching process can be precisely controlled.
By the above detailed description of preferred embodiments, feature of the present utility model and protection range can be more clearly described in hope, and are not that intention comes protection range of the present utility model is limited with above-mentioned disclosed preferred embodiment.
Claims (4)
1. the manufacture method of a predetermined pattern, is characterized in that this manufacture method comprises in order to produce the predetermined pattern at a printed circuit board (PCB):
One insulated substrate of this printed circuit board (PCB) is provided; And
According to the design of this predetermined pattern, utilize non-chemically etched laser beam, in this insulated substrate, etch this predetermined pattern.
2. the manufacture method of predetermined pattern as claimed in claim 1 is characterized in that, but this predetermined pattern is a circuit groove and/or the mark on this printed circuit board (PCB) and/or the registration holes of filled conductive material.
3. the manufacture method of predetermined pattern as claimed in claim 2 is characterized in that, this manufacture method further comprises:
In this circuit groove, fill up a conducting resinl; And
Utilize this conducting resinl of ultraviolet light polymerization, and constitute a circuit of this printed circuit board (PCB).
4. the manufacture method of predetermined pattern as claimed in claim 2 is characterized in that, this manufacture method further comprises:
Utilize sedimentation chemistry copper, direct copper facing or vacuum splashing and plating, and in this circuit groove, form a circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101075151A CN101309554A (en) | 2007-05-17 | 2007-05-17 | Predetermined pattern manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101075151A CN101309554A (en) | 2007-05-17 | 2007-05-17 | Predetermined pattern manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101309554A true CN101309554A (en) | 2008-11-19 |
Family
ID=40125713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101075151A Pending CN101309554A (en) | 2007-05-17 | 2007-05-17 | Predetermined pattern manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101309554A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548228A (en) * | 2010-12-09 | 2012-07-04 | 何建汉 | Circuit forming method |
| CN102905473A (en) * | 2011-07-29 | 2013-01-30 | 富泰华工业（深圳）有限公司 | Circuit board and producing method thereof |
| CN103495806A (en) * | 2013-09-27 | 2014-01-08 | 东莞市盛雄激光设备有限公司 | Picosecond laser etching microcircuit process |
| CN104519670A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Production process of curved circuit board |
| CN104661440A (en) * | 2015-03-06 | 2015-05-27 | 廊坊市高瓷电子技术有限公司 | Manufacturing method of printed circuit board and printed circuit board |
| CN104717840A (en) * | 2013-12-13 | 2015-06-17 | 深南电路有限公司 | Circuit board manufacturing method and circuit board |
| CN106163124A (en) * | 2015-04-02 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | Circuit board manufacturing method |
| CN109546325A (en) * | 2018-12-13 | 2019-03-29 | 泉州萃思技术开发有限公司 | A kind of 5G antenna processing method |
| CN109546324A (en) * | 2018-12-13 | 2019-03-29 | 泉州萃思技术开发有限公司 | A kind of processing technology of antenna |
| CN109599664A (en) * | 2018-12-13 | 2019-04-09 | 泉州萃思技术开发有限公司 | A kind of network antenna production method |
| CN109659682A (en) * | 2018-12-13 | 2019-04-19 | 泉州萃思技术开发有限公司 | A kind of communication antenna production technology |
| CN110225666A (en) * | 2018-03-02 | 2019-09-10 | 李俊豪 | The production method of conducting wire |
| CN112689391A (en) * | 2020-10-21 | 2021-04-20 | 高绍兵 | Single-layer circuit board and manufacturing method of multi-layer circuit board |
-
2007
- 2007-05-17 CN CNA2007101075151A patent/CN101309554A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548228A (en) * | 2010-12-09 | 2012-07-04 | 何建汉 | Circuit forming method |
| CN102905473A (en) * | 2011-07-29 | 2013-01-30 | 富泰华工业（深圳）有限公司 | Circuit board and producing method thereof |
| CN103495806A (en) * | 2013-09-27 | 2014-01-08 | 东莞市盛雄激光设备有限公司 | Picosecond laser etching microcircuit process |
| CN103495806B (en) * | 2013-09-27 | 2015-07-15 | 东莞市盛雄激光设备有限公司 | Picosecond laser etching microcircuit process |
| CN104717840B (en) * | 2013-12-13 | 2018-11-02 | 深南电路有限公司 | Circuit board manufacturing method and circuit board |
| CN104717840A (en) * | 2013-12-13 | 2015-06-17 | 深南电路有限公司 | Circuit board manufacturing method and circuit board |
| CN104519670A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Production process of curved circuit board |
| CN104519670B (en) * | 2014-12-18 | 2019-11-29 | 深圳市五株科技股份有限公司 | Curved surface process for manufacturing circuit board |
| CN104661440A (en) * | 2015-03-06 | 2015-05-27 | 廊坊市高瓷电子技术有限公司 | Manufacturing method of printed circuit board and printed circuit board |
| CN106163124A (en) * | 2015-04-02 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | Circuit board manufacturing method |
| CN110225666A (en) * | 2018-03-02 | 2019-09-10 | 李俊豪 | The production method of conducting wire |
| CN109546325A (en) * | 2018-12-13 | 2019-03-29 | 泉州萃思技术开发有限公司 | A kind of 5G antenna processing method |
| CN109546324A (en) * | 2018-12-13 | 2019-03-29 | 泉州萃思技术开发有限公司 | A kind of processing technology of antenna |
| CN109599664A (en) * | 2018-12-13 | 2019-04-09 | 泉州萃思技术开发有限公司 | A kind of network antenna production method |
| CN109659682A (en) * | 2018-12-13 | 2019-04-19 | 泉州萃思技术开发有限公司 | A kind of communication antenna production technology |
| CN112689391A (en) * | 2020-10-21 | 2021-04-20 | 高绍兵 | Single-layer circuit board and manufacturing method of multi-layer circuit board |
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Open date: 20081119 |